JP2004064946A - Mold structure and high voltage switchgear - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce an end peeling phenomenon which occurs at an insulated portion of a conductor in a high voltage switchgear. <P>SOLUTION: A mold structure for conductor 10 is such that a conductor 10 is molded in a coating layer 11 containing glass material, metal, or ceramic component and a mold layer 12 containing rubber material. The mold layer 12 formed around the coating layer 11 is extended to form a terminal mold layer 121. The terminal mold layer 121 is so formed that its thickness is smaller than that of the mold layer 12 and it has substantially concave circumferential surface. The terminal mold layer 121 is molded so that the ratio of the extension length b and the height c of the terminal mold layer to the thickness a of the mold layer exceeds 5%. <P>COPYRIGHT: (C)2004,JPO

Description

【００２９】
表２は、試料部材３１の材料に前記セラミック素材を、試料部材３２の材料にウレタンゴムを採用した場合の評価試験結果を開示したものである。
【００３０】
【表２】

【００３１】
表３は、試料部材３１の材料に前記金属を、試料部材３２の材料にウレタンゴムを採用した場合の評価試験結果を開示したものである。
【００３２】
【表３】

【００３３】
表４は、試料部材３１の材料に前記ガラス素材を、試料部材３２にシリコーンゴムを採用した場合の評価試験結果を開示したものである。
【００３４】
【表４】

【００３５】
表５は、試料部材３１の材料に前記セラミック素材を、試料部材３２の材料にシリコーンゴムを採用した場合の評価試験結果を開示したものである。
【００３６】
【表５】

【００３７】
表６は、試料部材３１の材料に前記金属を、試料材料３２の材料にシリコーンゴムを採用した場合の評価試験結果を開示したものである。
【００３８】
【表６】

【００３９】
表１〜表６に示された評価結果から明らかなように、試料部材３１，３２の材料に依っては伸びの絶対値は異なるものの、モールド層の端末部に、端末モールド層を延設し、端末モールド層は、その層厚をモールド層のものよりも小さく設ける共に、その外周面を略凹状となるように成形することで、従来技術に係るモールド構造よりも、モールド端部の剥離に至る伸びが増加することが確認できる。そして、この作用効果は、端末モールド層を、モールド層の層厚に対する延設長さ及び端末モールド層の高さの比率が５％を超えるように、成型することで、より顕著なものとなることがわかる。このように、本発明に係るモールド構造によってモールド層剥離の危険性を低減できることが示された。
【００４０】
【発明の効果】
以上の説明から明らかなように、本発明によれば、モールド層の端末部に、端末モールド層を延設することで、従来技術に係るモールド構造よりも、モールド端部の剥離に至る伸びが増加するので、導体の絶縁部における端部剥離現象を低減できるモールド構造及び高電圧開閉装置を提供できる。特に、端末モールド層を、モールド層の層厚に対する延設長さ及び端末モールド層の高さの比率が５％を超えるように、成型することで、その効果はより顕著なものとなる。
【図面の簡単な説明】
【図１】本発明に係る導体のモールド構造の概略図で、（Ａ）は本発明に係る導体のモールド構造の概観を、（Ｂ）は当該モールド構造のＡ−Ａ断面の概略を示した図。
【図２】評価試験で検討したモールド構造端部の概略構成図で、（Ａ）は本発明に係るモールド構造端部の概略を、（Ｂ）は従来技術に係るモールド構造端部の概略を示した図。
【図３】評価試験の概略説明図。
【図４】従来技術に係るモールド構造の引張試験の結果を示した特性図。
【符号の説明】
１０…導体
１１…被服層
１２…モールド層、１２１…端末モールド層
３１，３２…試料部材[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a conductor mold structure in a high voltage switchgear, for example, an insulation switchgear of 3 kV to 300 kV, and a high voltage switchgear using the same.
[0002]
[Prior art]
Examples of a conductor insulation configuration in today's high-voltage switchgear include a conductor molding using a resin such as an epoxy resin or an arc extinguishing using an insulation gas such as a sulfur hexafluoride (SF ₆ ) gas. The former is maintenance-free and has high reliability in principle. However, if the mechanical properties (linear expansion coefficient and elastic modulus) of the molded conductor are not sufficiently considered due to its rigidity, cracks may occur and the protective structure A large-scale process such as providing a cushioning material layer that requires the above is required. On the other hand, the latter is an insulating medium excellent in both insulation and blocking, but is subject to total amount regulation from the viewpoint of prevention of global warming.
[0003]
[Problems to be solved by the invention]
As a countermeasure against cracking, which is a problem of molding with the epoxy resin, a mold configuration made of a rubber material having a low elastic modulus and a high elongation rate was examined. However, since the rubber material has a linear expansion coefficient of about 10 times that of a metal conductor, In the temperature range of formation and use environment, peeling of the end of the mold layer is concerned.
[0004]
When the end of the mold layer peels off, it becomes a triple junction of the conductor, the mold layer and the insulating gas, which becomes an electric field concentration portion, and becomes a discharge starting point in the case of a high voltage device. As a countermeasure, a semiconductive layer is provided between the conductor and the mold layer, and is integrated with the mold layer side, so that even if peeled off, the same potential as the conductor is adopted. As with the formation of the cushion layer, the production process becomes large. Further, even if an insulating member such as a glass material or ceramic is provided on the contact surface of the mold layer instead of the charging conductive member, the exfoliation of the end portion impairs the covering effect, which is not preferable.
[0005]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a conductor mold structure capable of reducing an end peeling phenomenon of an insulating portion of a conductor in a high-voltage switchgear and a high-voltage switchgear using the same. is there.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, the present invention is characterized by the following.
[0007]
The invention according to claim 1 is a conductor molding structure in which a conductor in a high-voltage switchgear is molded by a coating layer made of a glass material, a metal or ceramics, and a mold layer made of a rubber material.
At the end of the mold layer provided on the coating layer, the terminal mold layer is extended,
The terminal mold layer is characterized in that its thickness is smaller than that of the mold layer and the outer peripheral surface thereof is formed to be substantially concave.
[0008]
According to a second aspect of the present invention, in the conductor mold structure according to the first aspect,
The ratio of the extension length to the thickness of the mold layer is more than 5%. The ratio of the height of the terminal mold layer to the thickness of the mold layer is more than 5%. .
The invention according to claim 3 is the mold structure according to claim 1 or 2,
The glass material is selected from alumina silicate glass, soda zinc glass, borosilicate glass, silicate glass, potassium sodium lead glass, high lead glass, and quartz glass.The metals are iron, stainless steel, copper, aluminum, Rubber materials selected from metals for plating include urethane rubber, silicone rubber, natural rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, ethylene-propylene rubber, ethylene-propylene-diene terpolymer, butyl rubber, It is characterized by a material selected from nitrile rubber, chloroprene rubber, chlorosulfonated polyethylene, fluorine rubber, polysulfide rubber, epichlorohydrin rubber, hydrogenated nitrile rubber, and acrylic rubber.
[0009]
The invention according to claim 4 is a high-voltage switchgear in which a conductor is molded with a coating layer made of a glass material, a metal or ceramics, and further with a mold layer made of a rubber material.
The mold structure of the conductor is extended at the terminal of the mold layer provided on the coating layer, and the terminal mold layer is provided with a layer thickness smaller than that of the mold layer and the outer peripheral surface thereof is substantially formed. It is characterized by being formed into a concave shape.
[0010]
The invention according to claim 5 is the high-voltage switchgear according to claim 4,
The ratio of the extension length to the thickness of the mold layer is more than 5%. The ratio of the height of the terminal mold layer to the thickness of the mold layer is more than 5%.
[0011]
The invention according to claim 6 is the high-voltage switchgear according to claim 4 or 5,
The glass material is selected from alumina silicate glass, soda zinc glass, borosilicate glass, silicate glass, potassium sodium lead glass, high lead glass, and quartz glass.The metals are iron, stainless steel, copper, aluminum, Rubber materials selected from metals for plating include urethane rubber, silicone rubber, natural rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, ethylene-propylene rubber, ethylene-propylene-diene terpolymer, butyl rubber, It is characterized by a material selected from nitrile rubber, chloroprene rubber, chlorosulfonated polyethylene, fluorine rubber, polysulfide rubber, epichlorohydrin rubber, hydrogenated nitrile rubber, and acrylic rubber.
[0012]
As in the above invention, in the conductor, by extending the terminal mold layer to the terminal portion of the mold layer, the elongation leading to the separation of the mold end is increased as compared with the mold structure according to the related art. The edge peeling phenomenon in the insulating portion can be reduced.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
FIG. 1 is a schematic diagram showing a mold structure of a conductor according to the present invention. In particular, FIG. 1A shows an overview of a mold structure of a conductor according to the present invention, and FIG. Is shown.
[0015]
The mold structure of the conductor according to the present invention is a mold structure of the conductor 10 in which the conductor 10 is molded by the coating layer 11 and the mold layer 12. The layer 121 is extended (FIG. 1A).
[0016]
The terminal mold layer 121 has a thickness smaller than that of the mold layer 12 and is formed so that the outer peripheral surface thereof is substantially concave (FIG. 1B). At this time, the terminal mold layer 121 is formed such that the ratio of the extension length b to the layer thickness a of the mold layer is 5% or more, and the ratio of the height of the terminal mold layer c to the layer thickness a of the mold layer is 5%. It is good to provide so that it may become above.
[0017]
The coating layer 11 is made of a glass material, a metal, or a ceramic material.
[0018]
As the glass material, for example, a material selected from alumina silicate glass, soda zinc glass, borosilicate glass, silicate glass, potassium sodium lead glass, high lead glass, and quartz glass is used.
[0019]
As the metals, for example, those selected from iron, stainless steel, copper, aluminum, and metals for plating are adopted. The metal for plating is determined by the material of the conductor and the like.
[0020]
As the ceramics, any ceramics that are generally used as an insulating material for a high-voltage switchgear may be used. For example, alumina sintered body (Al ₂ O ₃ ), mullite sintered body (3Al ₂ O ₃ .2SiO ₂ ), talc sintered body (MgO.SiO ₂ ), spinel sintered body (MgO.Al ₂ O ₃ ) , beryllia sintered (BeO), thoria sintered body _(ThO 2), zircon sintered _{(ZrO 2} · SiO 2), and the like.
[0021]
The terminal mold layer 121 is made of a rubber material, and is desirably the same type as the mold layer 12. Examples of the rubber material include urethane rubber, silicone rubber, natural rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, ethylene-propylene rubber, ethylene-propylene-diene terpolymer, butyl rubber, nitrile rubber, chloroprene rubber, A material selected from chlorosulfonated polyethylene, fluorine rubber, polysulfide rubber, epichlorohydrin rubber, hydrogenated nitrile rubber, and acrylic rubber is employed. These rubber materials are appropriately blended with additives and fillers, and then polymer blends, and the properties are appropriately modified by copolymerization, chemical modification, halogen substitution and the like.
[0022]
The mold layer 12 and the terminal mold layer 121 may be obtained by any molding method (casting, extrusion, injection, or a combination thereof) regardless of a liquid state or a solid state. At this time, a chemical and physical interface treatment (for example, a primer treatment, a sand plaster treatment, etc.) is appropriately performed in bonding and joining of the coating layer 11, the mold layer 12, and the terminal mold layer 121.
[0023]
Tables 1 to 6 show evaluation test results of the mold structure of the conductor according to the present invention and the prior art. Here, the results in which the ratio of the extension length to the thickness of the mold layer and the ratio of the terminal mold layer thickness to the thickness of the mold layer in the configuration of the mold end are changed and the results are compared with the test results of the mold structure according to the related art are disclosed. FIG. 2 shows a schematic cross-sectional configuration of the end of the mold structure studied in this test. The mold structure shown in (A) is based on the configuration of the present invention, in which a sample member 21 made of a material for a coating layer is provided with a sample member 22 made of a material for a mold layer, and a terminal mold layer is provided at an end of this member. The sample member 221 made of the above material is extended. a indicates the layer thickness of the sample member 22, b indicates the extension length of the sample member 221, and c indicates the layer thickness of the sample member 221. (B) is based on the structure of the prior art, in which a sample member 21 made of a material of a mold layer is provided on a sample member 21 made of a material of a coating layer.
[0024]
FIG. 3 is a diagram illustrating an outline of the evaluation test.
[0025]
As shown in the figure, sample members 31 made of a material for a coating layer molded into a plate shape (100 mm × 150 mm × 10 mm) were adhered to each other by a sample member 32 made of a material for a mold layer and a terminal mold layer. At this time, they were formed and bonded so that the bonding cross section was as shown in FIGS. 2A and 2B (bonding film thickness: 10 mm, bonding area: 100 mm × 10 mm). Then, both the sample members 31 were pulled in the direction of the arrow, and the elongation (%) of the sample member 32 until the end of the sample member 32 was peeled was measured. At this time, when the elongation (%) of the sample member 32 molded into the mold structure according to the related art is larger than the value of the elongation (%), ○ (good); Poor).
[0026]
The materials used for the sample members 31 and 32 are shown below. FIG. 4 shows the results of a tensile test of a mold structure according to the prior art using these materials.
[0027]
Sample member 31 Pyrex (registered trademark) glass (quartz glass) as a typical example of glass material, alumina sintered body as a typical example of ceramic material, copper sample member 32 as a typical example of metals urethane rubber, silicone rubber It discloses an evaluation test result of a conductor mold structure using the glass material as the material of the sample member 31 and urethane rubber as the material of the sample member 32. In the table, S1 indicates a mold structure according to the related art (hereinafter, the same applies to S2 to S6 in Tables 2 to 6). P1 to P30 are mold structures in which the terminal mold layer is extended, and the ratio (b / a) of the extension length b to the layer thickness a of the mold layer (b / a) and the height of the terminal mold layer c to the layer thickness a of the mold layer. A ratio (c / a) of 0.05 to 2.0 is shown (the same applies to P31 to P180 in Tables 2 to 6 below).
[0028]
[Table 1]

[0029]
Table 2 discloses the evaluation test results when the ceramic material is used as the material of the sample member 31 and urethane rubber is used as the material of the sample member 32.
[0030]
[Table 2]

[0031]
Table 3 discloses the evaluation test results when the metal is used as the material of the sample member 31 and the urethane rubber is used as the material of the sample member 32.
[0032]
[Table 3]

[0033]
Table 4 discloses the evaluation test results when the glass material is used as the material of the sample member 31 and the silicone rubber is used as the sample member 32.
[0034]
[Table 4]

[0035]
Table 5 discloses the evaluation test results when the ceramic material is used as the material of the sample member 31 and the silicone rubber is used as the material of the sample member 32.
[0036]
[Table 5]

[0037]
Table 6 discloses the evaluation test results when the metal is used as the material of the sample member 31 and the silicone rubber is used as the material of the sample material 32.
[0038]
[Table 6]

[0039]
As is clear from the evaluation results shown in Tables 1 to 6, although the absolute value of the elongation differs depending on the material of the sample members 31 and 32, the terminal mold layer is extended at the terminal portion of the mold layer. The terminal mold layer is provided with a layer thickness smaller than that of the mold layer, and is formed so that the outer peripheral surface thereof is substantially concave. It can be seen that the ultimate elongation increases. This effect is more remarkable by molding the terminal mold layer such that the ratio of the extension length to the thickness of the mold layer and the height of the terminal mold layer exceeds 5%. You can see that. Thus, it has been shown that the risk of mold layer peeling can be reduced by the mold structure according to the present invention.
[0040]
【The invention's effect】
As is clear from the above description, according to the present invention, by extending the terminal mold layer to the terminal portion of the mold layer, the elongation leading to the separation of the mold end portion is larger than that of the mold structure according to the related art. Since it increases, it is possible to provide a mold structure and a high-voltage switchgear that can reduce the edge peeling phenomenon in the insulating portion of the conductor. In particular, by molding the terminal mold layer such that the ratio of the extension length and the height of the terminal mold layer to the thickness of the mold layer exceeds 5%, the effect becomes more remarkable.
[Brief description of the drawings]
FIG. 1 is a schematic view of a conductor mold structure according to the present invention, in which (A) shows an overview of a conductor mold structure according to the present invention, and (B) shows an outline of an AA cross section of the mold structure. FIG.
FIGS. 2A and 2B are schematic configuration diagrams of an end portion of a mold structure examined in an evaluation test. FIG. 2A is an outline of an end portion of a mold structure according to the present invention, and FIG. FIG.
FIG. 3 is a schematic explanatory diagram of an evaluation test.
FIG. 4 is a characteristic diagram showing a result of a tensile test of a mold structure according to the related art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Conductor 11 ... Coating layer 12 ... Mold layer, 121 ... Terminal mold layers 31, 32 ... Sample member

Claims (6)

A conductor mold structure in which a conductor in the high-voltage switchgear is molded by a glass material, a coating layer made of metal or ceramics, and a mold layer made of a rubber material,
At the end of the mold layer provided on the coating layer, the terminal mold layer is extended,
A mold structure for a conductor, characterized in that the terminal mold layer has a thickness smaller than that of the mold layer and is formed so that its outer peripheral surface is substantially concave. The terminal mold layer is
The ratio of the extension length to the thickness of the mold layer is more than 5%. The ratio of the height of the terminal mold layer to the thickness of the mold layer is more than 5%. The conductor mold structure according to claim 1. The glass material is selected from alumina silicate glass, soda zinc glass, borosilicate glass, silicate glass, potassium sodium lead glass, high lead glass, and quartz glass.The metals are iron, stainless steel, copper, aluminum, Rubber materials selected from metals for plating include urethane rubber, silicone rubber, natural rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, ethylene-propylene rubber, ethylene-propylene-diene terpolymer, butyl rubber, 3. The mold structure according to claim 1, wherein the mold structure is selected from nitrile rubber, chloroprene rubber, chlorosulfonated polyethylene, fluorine rubber, polysulfide rubber, epichlorohydrin rubber, hydrogenated nitrile rubber, and acrylic rubber. A high-voltage switchgear in which a conductor is molded by a glass material, a coating layer made of metals or ceramics, and a mold layer made of a rubber material,
The mold structure of the conductor is extended at the terminal of the mold layer provided on the coating layer, and the terminal mold layer is provided with a layer thickness smaller than that of the mold layer and the outer peripheral surface thereof is substantially formed. A high-voltage switchgear characterized by being formed into a concave shape. The terminal mold layer is
The ratio of the extension length to the thickness of the mold layer is more than 5%. The ratio of the height of the terminal mold layer to the thickness of the mold layer is more than 5%. The high-voltage switchgear according to claim 4. The glass material is selected from alumina silicate glass, soda zinc glass, borosilicate glass, silicate glass, potassium sodium lead glass, high lead glass, and quartz glass.The metals are iron, stainless steel, copper, aluminum, Rubber materials selected from metals for plating include urethane rubber, silicone rubber, natural rubber, isoprene rubber, styrene butadiene rubber, butadiene rubber, ethylene-propylene rubber, ethylene-propylene-diene terpolymer, butyl rubber, The high-voltage switchgear according to claim 4 or 5, wherein the high-voltage switchgear is selected from nitrile rubber, chloroprene rubber, chlorosulfonated polyethylene, fluorine rubber, polysulfide rubber, epichlorohydrin rubber, hydrogenated nitrile rubber, and acrylic rubber.

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