JP2004062568A - Combination ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a combination IC card which hardly causes cracks, when an external stress is applied to the card substrate and is highly resistant to bending by adequately routing copper wires at the contact point of an IC module and antenna. <P>SOLUTION: In the combination IC card, the antenna 2, comprising the copper wires preliminarily embedded in an optional position of the card substrate 1 in a loop form, is connected to the IC module 3 embedded in a concave part 6 clipped in a prescribed depth at an optional position of the card substrate 1. In this case, a copper wire exposure connection part 4, which connects the antenna 2 with the IC module 3 is provided with antenna tip routing copper wires 5 for connecting the IC module, and the routing copper wires 5 are arranged so that they are not be parallel to a clipped tomographic surface 7, which is clipped to embed the IC module 3 in the card substrate 1. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an IC card used for a credit card, a cash card, a telephone card, a transportation card, and the like in the fields of finance, communication, and transportation. In a combination IC card having both functions of contact type, by devising the routing of the copper wire at the junction connecting the IC module and the antenna, even if external stress is applied to the card substrate, it is difficult for cracks to be formed, The present invention relates to a combination IC card having high folding strength.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in the field of credit cards, cash cards, and the like, as a card replacing a magnetic card, an IC card having a built-in IC module including a microprocessor (MPU) and an IC memory such as a data memory on a card substrate has an information storage capacity. Has been attracting attention because of its extremely large size and high security, and has been used little by little.
[0003]
In particular, in recent years, the use of IC cards has been rapidly studied or put into practical use in various fields such as the financial industry and the distribution industry due to the large amount of information and the security characteristics of IC cards. I have.
[0004]
For example, there has been an increasing problem that a magnetic card used in a credit card, a telephone card, or the like is forged and a consumer suffers a great deal of damage. Under such circumstances, the use of IC cards is rapidly advancing as a response to security needs.
[0005]
Also, for companies, emphasizing the merits of rationalization based on comprehensive judgment, and further improving the convenience of users, for reasons such as finance, distribution, transportation, transportation, manufacturing, logistics, etc. Usage in the administrative field is increasing.
[0006]
The types of IC cards have also been diversified. For example, the classification can be based on whether or not a CPU (Central Processing Unit) is built in the IC card, or the data can be classified by a method of transmitting and receiving data between an IC chip mounted on the IC card and an external device.
[0007]
The IC card has an IC chip embedded in a card made of a shape and material similar to a magnetic card.
[0008]
The basic configuration of the IC chip includes a CPU (central processing unit), a ROM (read only memory), a RAM (readable and writable memory), and an EEPROM (electrically rewritable and erasable memory). I have.
[0009]
The CPU (Central Processing Unit) is composed of an arithmetic unit that performs data arithmetic and a control unit that exchanges data with the outside.
[0010]
The ROM (read only memory) is a non-volatile storage device that retains data even when the power is turned off. In an IC card, a high-speed small program suitable for the IC card is stored in a ROM. The CPU operates according to this program.
[0011]
The ROM includes a mask ROM and a PROM. The mask ROM is a memory in which a manufacturer changes a mask pattern in a manufacturing process and writes stored contents. Therefore, it cannot be erased after manufacturing.
[0012]
The mask ROM is used for data storage, microprogram storage, decoder and code conversion, monitor programs, and the like.
[0013]
The PROM is a ROM in which a user can write data in a blank state. Since information can be written only once, when information is rewritten, all data that has been stored must be erased.
[0014]
The erasing method is broadly divided into EAROM and EPROM. The EAROM is electrically erased. EPROMs are erased with ultraviolet light.
[0015]
Actually, when the PROM is used for an IC card, information can be written only once when the card is issued, but once it is recorded, data cannot be changed or deleted like a normal ROM.
[0016]
When the EPROM is used for an IC card, the memory in the card cannot be irradiated with ultraviolet rays, so that the stored contents cannot be rewritten.
[0017]
The RAM is a readable and writable memory, but is a volatile memory in which data is lost when the power is turned off. The IC chip is used as a memory for data processing that is temporarily used when the CPU performs operations such as calculations.
[0018]
The EEPROM is a ROM that can be electrically rewritten and erased. This is a non-volatile storage device that retains data even when the power is turned off. In an IC card, it is used as a data storage memory.
[0019]
For example, there is a memory card which has only a data recording memory such as an EEPROM in an IC chip, does not have a CPU (central processing unit), and basically has only a function of storing data.
[0020]
The memory card was first developed as an IC card, and includes a memory such as a ROM (Read Only Memory) for storing data.
[0021]
The data storage capacity is remarkably large from 500 characters to 16,000 characters or more for 80 characters of the magnetic card. As the memory, a PROM, an EPROM, an EEPROM, or the like is used.
[0022]
Next, since a general IC card has a built-in CPU in an IC chip and has an arithmetic function, it is possible to judge whether or not access is correct at the time of reading and writing data, thereby achieving high security.
[0023]
In order to read or write data in the IC chip, an external interface is required. Further, since the IC card does not include a battery, it is necessary to externally supply power for operating the IC chip.
[0024]
For this reason, IC cards are classified into contact-type IC cards and non-contact-type IC cards due to differences in interfaces with external devices, in addition to classification based on the presence or absence of a CPU.
[0025]
A contact type IC card is used to receive power supply by directly contacting an external terminal exposed on the card surface with a terminal on a reader / writer side and to perform data communication with an external device. It is.
[0026]
Next, a non-contact type IC card is an IC card that has rapidly spread in recent years. There is no external terminal on the card surface, an IC chip and an antenna are built in the card, and information is exchanged with a reader / writer by radio waves.
[0027]
Recently, as an IC card having both functions of a contact type IC card and a non-contact type IC card, for example, a hybrid IC card equipped with two IC chips for a contact type and a non-contact type, and a contact type and a non-contact type A combination IC card having a one-chip two-interface mounted with an IC chip shared by a mold has been put to practical use.
[0028]
First, the contact type IC card has a metal connection terminal on the surface of the card, and when the IC card is inserted into the reader / writer, it comes into contact with the metal connection terminal in the reader / writer to stably supply power. Is done.
[0029]
As described above, the exchange of information between the reader / writer and the IC card is performed by electrical contacts. Therefore, the card has high security because it can perform many arithmetic processes. However, a trouble may occur due to a poor contact between the reader / writer and the card terminal.
[0030]
For example, if the external terminals are dirty or damaged by abrasion, electrical conductivity may be lost and reading may not be possible. In a dry environment, the surface of the card is easily charged with static electricity, which may cause a reading error.
[0031]
Next, the non-contact type IC card has a built-in antenna in the IC card and the reader / writer, and exchanges information using radio waves. An antenna made of copper wire is provided inside the card to exchange information and receive power.
[0032]
Non-contact type IC cards include a contact type, a proximity type, a proximity type, and a remote type, depending on the communication distance between the IC card and the reader / writer. For example, the communication distance is 2 mm for the contact type, about 10 cm for the proximity type, 1 m for the proximity type, and several meters for the remote type.
[0033]
Since the non-contact type IC card is a radio wave system, troubles caused by electric contacts such as a contact type are eliminated. In addition, the handling of the reader / writer is relatively easy, and the card can be easily handled because it is only necessary to place the card on the reader / writer or to hold it over without inserting the card.
[0034]
The mechanical structure of the reader / writer becomes simple and the size becomes compact. Further, maintenance becomes easy, but it is necessary to consider a communication failure because radio waves are used.
[0035]
Next, a hybrid IC card having both a contact type and a non-contact type function mounted on two IC chips and a combination IC card having a 1-chip 2 interface mounting a contact type and non-contact type IC chip are practically used. Has been
[0036]
As shown in FIG. 3A, a conventional combination IC card having a one-chip two-interface in which an IC chip shared by both a contact type and a non-contact type is mounted on a single card is provided at an arbitrary position on the card substrate 1 as shown in FIG. Antenna connection terminals 2a and 2b of an antenna 2 made of a copper wire embedded in a loop shape in advance, and an IC module embedded in the recess 6 cut to a predetermined depth at an arbitrary position on the card substrate 1. 3 is connected.
[0037]
That is, the combination IC card has a function of connecting an IC module 3 having a built-in IC chip shared by a contact type and a non-contact type and an antenna 2 performing communication in a non-contact manner. This is a point in manufacturing a durable IC card.
[0038]
As shown in FIGS. 4A and 4B, the IC module 3 is provided with an IC chip 3b on the back surface of the printed wiring board 3a and a connection terminal 8 near the IC chip 3b. ing. The connection terminal 8 has a role of connecting the antenna 2 and the IC chip portion 3b.
[0039]
Further, as shown in FIG. 3B, the antenna leading copper for connecting the IC module to the IC module at the copper wire exposed joint 4 for connecting the IC module 3 to the antenna connection terminal 2a and the antenna connection terminal 2b of the antenna 2 The arrangement of the lines 5 is parallel to the cutting tomographic plane 7 that is cut to embed the IC module 3 in the card substrate 1.
[0040]
As shown in FIG. 4 (a), when the copper wire exposed joint portion 4 was cut to bury the IC module 3 in the card substrate 1, the copper wire exposed joint portion 4 of the antenna 2 previously buried in the card substrate 1 was cut. This is a portion where the leading end copper wire 5 of the IC module bonding antenna is exposed.
[0041]
By joining the exposed copper wire portion and the connection terminal 8 which is a conductive pad provided on the back surface of the IC module 3 via a conductive adhesive or the like, the IC chip portion 3b built in the IC module 3 is joined. And an antenna 2 embedded in the card substrate 1 in advance.
[0042]
At the copper wire exposed joint portion 4, the IC module joining antenna tip leading copper wire 5 is completely different from the card substrate 1 such as PVC (vinyl chloride resin) or PETG (polyester resin). Are arranged in a state where they are not bonded.
[0043]
Therefore, the arrangement of the leading copper wire 5 of the antenna for joining the IC module is such that the first-stage cutting fault surface 7 a forming the concave portion 6 for embedding the IC module 3 at an arbitrary position on the card substrate 1 and the cutting fault surface of the copper wire. If it is parallel to the surface 7b and the second-stage cutting tomographic surface 7c, the tip of the IC module bonding antenna leading copper wire 5 is displaced and overlaps with the cut interface portion. Due to the stress from the back surface of the built-in central part of the card substrate 1, there is a defect that a crack is formed in the second-stage cut fault surface 7c and the card substrate 1 itself is broken.
[0044]
In addition, a normal non-contact IC card has a card thickness of 0.8 mm and a shaving depth of 0.2 mm in the first step and 0.6 mm in the second step from the top of the card. The fact that it is only 0.2 mm is a cause that is more easily broken.
[0045]
[Problems to be solved by the invention]
The present invention solves the problems of the related art, that is, in a combination IC card having both a contact type and a non-contact type function in one card, a copper wire of a portion for joining an IC module and an antenna is used. By devising the layout, even if external stress is applied to the card substrate, it is possible to provide a combination IC card which is hardly cracked and has high bending strength.
[0046]
[Means for Solving the Problems]
The present invention has been made to solve the above-described problems, and the invention according to claim 1 of the present invention comprises a copper wire embedded in a loop shape at an arbitrary position on a card substrate 1 in advance. In a combination IC card in which an antenna 2 and an IC module 3 embedded in a concave portion 6 cut to a predetermined depth at an arbitrary position on the card substrate 1 are connected, the antenna 2 and the IC module 3 are connected. The copper wire exposed joint portion 4 is provided with an IC module joining antenna tip leading copper wire 5, and the arrangement of the leading copper wire 5 is parallel to the cutting tomographic plane 7 cut for embedding the IC module 3 in the card substrate 1. A combination IC card, which is provided so as not to be inconsistent.
[0047]
According to a second aspect of the present invention, in the combination IC card according to the first aspect, the arrangement of the lead copper wires 5 is formed in a curved shape so as not to be parallel to the cutting tom surface 7. Is a combination IC card.
[0048]
According to a third aspect of the present invention, in the combination IC card according to the first aspect, the arrangement of the lead copper wires 5 is formed in an S shape so as not to be parallel to the cutting tom surface 7. A combination IC card.
[0049]
According to a fourth aspect of the present invention, in the combination IC card according to the first aspect, the arrangement of the lead copper wires 5 is formed in a coil shape and provided so as not to be parallel to the cutting tom surface 7. Is a combination IC card.
[0050]
According to a fifth aspect of the present invention, in the combination IC card according to the first aspect, the arrangement of the routing copper wires 5 is formed so as to have a saw blade shape, and is provided so as not to be parallel to the cutting tom surface 7. A combination IC card.
[0051]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described in detail with reference to FIGS. 1 (a), 1 (b), 2 (a), and 2 (b).
[0052]
According to the present invention, an antenna 2 composed of a copper wire previously embedded in a loop shape at an arbitrary position on a card substrate 1 and a concave portion 6 cut to a predetermined depth at an arbitrary position on the card substrate 1 In the combination IC card to which the IC module 3 is connected, as shown in FIG. 1A, a copper wire exposed connecting portion 4 for connecting the antenna 2 and the IC module 3 is provided with an IC module connecting antenna tip leading copper wire. 5 is provided so that the arrangement of the lead copper wires 5 is not parallel to the cut surface 7 cut for embedding the IC module 3 in the card substrate 1.
[0053]
The card substrate 1 is made of a resin such as PVC (vinyl chloride resin) or PETG (polyester resin), and the card thickness is generally 0.8 mm.
[0054]
When using the non-contact function, the combination IC card uses a radio wave to exchange information between the IC card and the reader / writer. And embedded.
[0055]
The antenna 2 can exchange information with an IC card reader / writer and receive power.
[0056]
The cutting recess 6 for embedding the IC module 3 in the card substrate 1 has substantially the same shape and outer dimensions as the IC module 3 composed of the printed wiring board 3a and the IC chip 3b.
[0057]
The cutting depth is 0.2 mm for the first step and 0.6 mm for the second step from the upper surface of the card, and the 0.14 mm antenna for IC module bonding is provided between the first step and the second step. The leading lead copper wire 5 is embedded.
[0058]
When embedding the copper wire 5 for leading the antenna for bonding the IC module, the arrangement of the copper wire 5 for leading the antenna for connecting the IC module at the copper wire exposed joint 4 connecting the IC module 3 and the antenna 2 is improved. Even when the lead wire of the antenna for IC module bonding at the copper wire exposed bonding portion 4 of the substrate 1 is displaced and overlaps with the cut interface, cracks due to external stress are unlikely to occur, and the bending strength is high. It can provide a combination IC card that is strong against
[0059]
That is, the first-stage cutting section 7a of the cutting section 7 for cutting the array of the IC module connecting antenna tip leading copper wires 5 to embed the IC module 3 in the card substrate 1 and the cutting layer surface of the copper wire exposed portion 7b and the second-stage cutting section 7c are provided so as not to be parallel to each other.
[0060]
The deformed shape may be a curved shape as shown in FIG. 1 (a), an S shape as shown in FIG. 1 (b), a coil shape as shown in FIG. As shown in FIG. 2 (b), it was provided in a sawtooth shape.
[0061]
In this manner, the first-stage cutting tomographic surface 7a of the cutting tomographic surface 7 and the copper wire exposed portion for cutting the arrangement of the IC module connecting antenna tip leading copper wire 5 to embed the IC module 3 in the card substrate 1 are cut. By being deformed in a curved shape or the like without being parallel to the cutting layer surface 7b and the second-stage cutting tom surface 7c, the card substrate 1 is exposed to a resin such as PVC (vinyl chloride resin) or PETG (polyester resin). Even if the IC module connecting antenna tip routing copper wire 5 is not completely adhered to the IC module, even if the central portion of the card substrate 1 in which the IC module 3 is built is bent so as to be pushed from the back surface of the card substrate 1. In addition, it is possible to provide a combination IC card in which a crack is less likely to be formed in the portion of the second-stage cut fault surface 7c, and which is extremely resistant to bending stress.
[0062]
【The invention's effect】
Advantageous Effects of Invention According to the present invention, in a combination IC card, there is provided a combination IC card in which a crack is unlikely to be formed even when a card substrate is bent at a joint portion between an IC module connecting antenna tip leading copper wire and an IC module and bending stress is extremely strong. it can.
[Brief description of the drawings]
FIG. 1 (a) is a schematic view showing one embodiment of a curved lead copper wire of the present invention. FIG. 1B is an enlarged partial view of the S-shaped lead copper wire.
FIG. 2 (a) is an enlarged partial view of a coiled lead copper wire. FIG. 2 (b) is an enlarged partial view of the saw-shaped leaded copper wire.
FIG. 3A is a schematic plan view of a combination IC card according to the related art. FIG. 3B is an enlarged view of an IC module section according to the related art.
FIG. 4A is an XX cross-sectional view of an enlarged view of an IC module section in a conventional technique. FIG. 4B is an enlarged plan view of an IC module part according to the related art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Card board 2 ... Antenna 2a ... Antenna connection terminal part 2b ... Antenna connection terminal part 3 ... IC module 3a ... Printed wiring board part 3b ... IC chip part 4. ..Copper wire exposed joint portion 5: Lead wire of antenna for IC module joining copper wire 6 ... Recess 7 ... Cutting tom surface 7a ... First stage cutting tom surface 7b ... Copper wire exposed Part cutting plane 7c: 2nd cutting plane 8: Connection terminal

Claims (5)

Combination IC in which an antenna made of a copper wire previously embedded in a loop shape at an arbitrary position on a card substrate and an IC module embedded in a concave portion cut to a predetermined depth at an arbitrary position on the card substrate In the card, a copper wire exposed joint portion connecting the antenna and the IC module is provided with an IC module joining antenna tip leading copper wire, and the arrangement of the leading copper wire is cut to embed the IC module in the card substrate. A combination IC card, which is provided so as not to be parallel to the cut plane. 2. The combination IC card according to claim 1, wherein the arrangement of the lead copper wires is formed in a curved shape so as not to be parallel to the cutting plane. 2. The combination IC card according to claim 1, wherein the arrangement of the routing copper wires is formed in an S-shape, and is provided so as not to be parallel to the cut plane. The combination IC card according to claim 1, wherein the arrangement of the lead copper wires is formed in a coil shape so as not to be parallel to the cut plane. 2. The combination IC card according to claim 1, wherein the arrangement of the lead copper wires is formed in a saw blade shape so as not to be parallel to the cut plane. 3.

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