JP2004047751A - Cooling mechanism of information processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the size of an information processor and reduce noise from the processor by suppressing a temperature rise in a housing of the information processor and overheat of a power supply unit due to mounting a high-heat generation processor. <P>SOLUTION: The heat generation 32 of the processor is discharged outside, and also the heat 33 is discharged outside the housing by a fan 11b which is mounted on the power supply unit 11 to discharge the heat. In this case, since the generating heat 32 of the processor does not pass through a high-heat generating part 11c of the power supply unit, the overheat of the power supply unit can be suppressed. Since the fan 11b for discharging the heat can stop when the processor is hardly heated, the noise can be suppressed to the minimum. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a cooling structure inside an information processing apparatus in which the temperature rises due to heat generated by electronic components.
[0002]
[Prior art]
Conventionally, the ATX standard is known as a motherboard standard. In a cooling structure of a small-sized information processing device having a capacity of 10 L or less using an ATX standard motherboard, a processor is arranged at a position near a power supply with a cooling fan. Due to the cooling structure, the heat generated by the processor is not diffused into the housing of the information processing apparatus, but is discharged outside the information processing apparatus by the cooling fan of the power supply. As a result, a rise in temperature inside the housing of the information processing apparatus can be suppressed, and no thermal effect is exerted on other electronic components. Related to this type of cooling structure is, for example, FlexATX Thermal Design Surges Version 1.1, page 31, FIG.23. When a FlexATX motherboard is used, the cooling structure inside the housing of the small-sized information processing device is normal due to the restriction of the PCI board standard.
[0003]
As another conventional technique, there is also a cooling structure in which a processor is arranged at a position far from a power supply device with a cooling fan without using a FlexATX standard motherboard. Such a structure avoids the thermal effects of the processor and the power supply on each other.
[0004]
[Problems to be solved by the invention]
Among the above prior arts, the former configuration has the following problems.
[0005]
First, heat released from the radiation fins is discharged by the cooling fan of the heat sink. One of the discharged heat passes through the power supply device and is discharged to the outside of the housing by the cooling fan of the power supply device. When the heat is discharged, the high heat generating components inside the power supply device receive the heat directly, so that the temperature of the high heat generating components further increases. In addition, the heat discharged in the other direction once leaves the processor and then collides with other electronic components. Due to the cooling fan of the power supply, heat that has collided with the power supply flows back, and part of the heat is drawn into the cooling fan of the processor. Such cooling air circulation reduces the cooling effect.
[0006]
Thus, arranging the processor at a position close to the power supply device with a cooling fan has an advantage that a rise in temperature inside the housing of the information processing device can be suppressed and no thermal effect is exerted on other electronic components. On the other hand, there is a problem that the cooling effect of the processor is adversely affected, and the processor and the power supply device, which are high heat generating components, thermally affect each other, so that cooling them becomes more difficult.
[0007]
Further, of the other conventional techniques, the latter configuration has the following problems.
[0008]
First, there is a problem that the temperature inside the housing of the information processing apparatus rises. This is because the heat released in the two directions by the radiation fins is both discharged into the housing of the information processing device by the cooling fan of the processor. Such a rise in the temperature inside the housing of the information processing apparatus causes a rise in the temperature of other electronic components. For example, heat discharged in one direction passes through the auxiliary storage device and is discharged to the outside of the housing by the power supply cooling fan, so that the temperature of the auxiliary storage device is increased.
[0009]
In this way, disposing the processor far from the power supply with a cooling fan may adversely affect the cooling effect of the processor, or may prevent the processor and the power supply, which are high heat components, from thermally affecting each other. it can. On the other hand, the temperature inside the housing of the information processing device is increased, and a thermal effect is exerted on other electronic components.
[0010]
In order to suppress the temperature rise inside the housing of the information processing apparatus, it is possible to provide a separate system fan. However, the information processing apparatus becomes large and noise cannot be avoided. In order to suppress the temperature rise of the information processing device, it is possible to provide an opening in the top surface of the housing. However, there is a risk that foreign matter may enter the inside of the housing, and the safe operation of the device will be completely stopped. Cannot be expected.
[0011]
[Means for Solving the Problems]
An information processing apparatus according to the present invention includes, in a housing, at least one intake unit that sucks a gas for cooling a processor and two or more exhaust units that discharge a gas that cools a processor. Another information processing apparatus of the present invention further includes two or more cooling fans for exhausting air to the outside of the housing. That is, it has a cooling fan that discharges gas that has cooled the processor and a cooling fan that discharges gas that has cooled other high-temperature parts.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of the inside of a housing of a small-sized information processing apparatus having a width of 300 mm, a depth of 320 mm, and a height of 78 mm.
[0013]
First, the overall configuration inside the housing of the information processing apparatus will be described.
[0014]
The processor cooling unit 10 includes a processor cooling fan 10a for flowing air taken into the housing to the processor and an extruded aluminum heat sink 10b, and is disposed on the motherboard on the front side of the device. For the processor, Pentium4 (Pentium is a registered trademark of Intel Corporation) is used. The processor cooling fan 10a is of a type that rotates with respect to a heat sink by a downflow method in which air is sucked from above and air is blown to the processor.
[0015]
The power supply unit 11 has an output capacity of 160 W and is equipped with two 70 mm square fans 11 a and 11 b. The power supply fan 11a is arranged near the secondary rectifier diode 11c, which is a high heat-generating electronic component. A voltage is added from an inlet 11g described later, the voltage is converted by the transformer 11f, and the current is rectified by the secondary rectifier diode. Therefore, the secondary rectifier diode is connected to the inlet 11g. Usually, it is arranged at the back.
[0016]
In the present embodiment, the power supply fan 11a and the heat exhaust fan 11b are of a suction type that draws in intake air inside the housing and discharges the air to the outside of the housing via the inside of the power supply device.
[0017]
Other components include a transformer 11f and an inlet 11g. The transformer 11f is a transformer, and the inlet 11g is a power cable connector. The auxiliary storage device includes a 3.5-inch hard disk 12, a slim type CD-ROM 13, and a slim type FDD 14. In the present embodiment, these are located near the power supply fan 11a. Here, the slim type generally has a width (height) of 10 cm or less. Since the hard disk 12 and the CD-ROM 13 are arranged at a short distance, the hard disk 12 may malfunction due to vibration during operation of the CD-ROM 13. Therefore, although not shown, the hard disk 12 is provided with an anti-vibration rubber to prevent this. As expansion boards, two half-sized PCI boards (hereinafter, referred to as PCI boards) 17a and 17b can be mounted, and these are mounted on a daughter board 18.
[0018]
Next, a housing of the information processing apparatus will be described.
[0019]
At the front of the housing is a front bezel 24. The front bezel 24 has a function as an operation surface of various devices (CD-ROM / FDD), SWs, connectors, and the like, and a design characteristic of the product. The opening 15 is provided in the front bezel 24. The opening 15 corresponds to a first exhaust unit that discharges a part of the heat released from the processor heat-generating cooling unit 10 to the outside of the housing. Further, an opening 16 is provided. The opening 16 corresponds to a second intake unit that takes in air for cooling the auxiliary storage device. An opening 23 is provided on a side surface of the housing. The opening 23 corresponds to a first intake unit that cools heat generated by the processor. An opening 11h is provided on the back of the housing. The opening 11h corresponds to a second exhaust unit that exhausts heat generated inside the housing. In the present embodiment, the opening ratios of the opening 15 are 30%, the opening 16 is 10%, the opening 23 is 20%, and the opening 11h is 60%. Here, the aperture ratio is, for example, in the case of the opening 11h, the ratio of the space (hole area) within the area of the opening 11h. The calculation formula is
Aperture ratio = hole area inside 11h / area of 11h (%)
It is.
[0020]
FIG. 2 is a sectional view of a portion including the processor cooling unit 10 and the opening 15, and FIG. 3 is a perspective view when the processor cooling unit 10 and the front bezel 24 having the opening 15 are disassembled.
[0021]
First, in FIGS. 2 and 3, an opening 44 is provided in the chassis 26 which is a part of the housing. Here, the chassis 26 is a case formed by processing a metal plate such as a steel plate, and has a role of an EMC electromagnetic shield. The opening 44 is provided at a position where a wind (hereinafter, referred to as “wind”) 32 accompanied by heat flow is blown out, but the height of the opening 44 is limited to be lower than the height of the heat sink 10b. Thus, the amount of wind 32 that wind 32 is sucked into fan 10a again can be reduced.
[0022]
Next, a cover 43 is provided in the opening 44. Here, the cover 43 has a U-shape in order to reduce the pressure loss due to the resistance to the wind discharged from the opening 15. Further, a hole 43a is arranged on the surface of the cover 43. This hole is a small 3.5 mm square hole to suppress the emission of radio waves as a measure against EMC.
[0023]
Further, a housing flat sheet metal 25 is provided on the rear surface of the housing. The case back sheet metal is a metal plate supporting the case and is a part of the case.
[0024]
In addition, there are a serial connector 19a, a display connector 19b, a USB connector 19c, and a connector for a PS / 2 mouse and a keyboard (not shown) on the back of the housing. On the front surface of the housing, there are a power switch 20, a power lamp 21a, a main power standby lamp 21b, a hard disk access lamp 21c, a microphone connector 22a, a line input connector 22b, a speaker connector 22c, and an infrared interface 22d. Further, a foot 25 is provided so that the opening 23 is not blocked when the housing is placed vertically.
[0025]
Next, the cooling structure of the present embodiment will be described with reference to FIGS.
[0026]
First, a cooling structure around the processor cooling unit will be described with reference to FIG.
[0027]
The cooling fan 10a draws in the air 31 that has entered from the opening 23 in FIG. 1 and blows it to the heat sink 10b. The blown wind 41 flows along the heat radiation fins 42 of the heat sink 10b, and the heat radiation fins 42 have a plate shape, and are arranged so as to face the opening 15 and the inside of the housing, respectively. Therefore, the wind 41 flows as the wind 32 and the wind 33 which are hot air. At this time, the wind 32 is discharged from the opening 15 to the outside of the housing.
[0028]
Next, a cooling structure around the power supply device will be described with reference to FIG.
[0029]
First, in FIG. 1, the wind 33 discharged from the processor cooling unit 10 is discharged to the inside of the housing, but the discharged wind 33 flows along the daughter board 18 and the PCI boards 17a and 17b. The amount of air flowing back to the cooling fan 10a is small. Next, in FIG. 1, the flow of the wind 33 reaches the case back sheet metal 25, but the wind speed is high on the way, so that the amount of air sucked into the power supply fan 11 a is small. After the wind 33 collides with the housing back sheet metal 25 and is weakened, it is sucked by the heat exhaust fan 11b. Then, it is discharged outside through the opening 11h.
[0030]
Next, a cooling structure around the auxiliary storage device will be described.
[0031]
The air 34 is sucked in from the opening 16 by the action of the power supply fan 11 a and flows into the power supply device 11 via the hard disk 12. Then, the exhaust gas 35 that has passed through the power supply fan 11a cools the rectifier diode 11c and the heat sink 11d on the secondary side, and is discharged outside through the opening 11h.
[0032]
In the above configuration, the processor cooling unit cools the processor.
[0033]
The processor used in the present embodiment has a heat value of about 76 W, and the processor cooling unit 10 discharges a part of the hot air from the opening 15. The amount of heat of this hot air is about 20 W, which is about 26% of the calorific value of the processor.
[0034]
Here, the relationship between the amount of heat and the case temperature will be described. Equation (1) shows the relationship between the amount of air V discharged outside the case, the amount of heat Q, and the temperature rise ΔT in the case. In equation (1), ρ is the density of air, and Cp is the specific heat of air.
ΔT = Q / (ρ · Cp · V) (1)
Further, the equation (1) can be approximated by the following equation (2).
ΔT (° C.) = 1.79 × Q (W) / V (CFM) (2)
Here, the amount of heat generated inside the housing by the processor is
76-20 = 56W
It is. When the amount of air discharged to the outside of the housing is set to 12 CFM, the temperature rise ΔT is obtained from the equation (2).
79 × 56 (W) / 12 (CFM) = 8.4 (° C.)
It is.
[0035]
On the other hand, as in the conventional case, when the total heat generation of the processor 76 W enters the inside of the housing, the temperature increase ΔT inside the housing is:
79 × 76 (W) / 12 (CFM) = 11.3 (° C.)
It becomes.
[0036]
As described above, the structure according to the present embodiment in which part of the heat generated by the processor is discharged to the outside,
11.3-8.4 = 2.9 (° C.)
It becomes.
[0037]
That is, there is an effect of lowering the internal temperature of the housing by 2.9 ° C. The heat discharged from the front surface is released to the outside as a breeze because the opening ratio of the opening 15 is as low as 30%. Therefore, the user rarely feels this heat uncomfortable.
[0038]
On the other hand, in the power supply device 11, the heat generated by the processor is discharged to the outside through the heat exhaust fan 11b, so that the secondary side rectifier diode 11c and the heat sink 11d do not pass through. Therefore, overheating of the power supply device 11 can be avoided. The wind 34 from the power supply fan 11a is kept at a low temperature because there is no heat source of high heat generation on the way to the power supply device 11. In the present embodiment, the temperature of the air flowing into the power supply fan 11a is lower by about 5 ° C. than the temperature of the air flowing into the heat exhaust fan 11b.
[0039]
As described above, since the secondary-side rectifier diode 11c and the heat sink 11d are cooled by the low-temperature air 34, a high cooling effect on the power supply device 11 can be obtained.
[0040]
Next, noise reduction according to the present embodiment will be described.
[0041]
Although the noise of the information processing apparatus is mainly caused by the cooling fan, in the present embodiment, the number of revolutions of the power supply fan 11a can be suppressed because the inlet temperature of the power supply fan 11a is lower than that of the conventional structure. Further, since a part of the heat generated by the processor is discharged to the outside without being stored in the housing, a rise in the temperature inside the housing is suppressed. Therefore, the number of rotations of the heat exhaust fan 11b can be suppressed.
[0042]
In the cooling structure of the present embodiment, it is possible to control the rotation speed of the fan separately. That is, for example, when the processor is stopped and there is almost no heat generation, the heat exhaust fan 11b can be stopped. This makes it possible to minimize noise.
[0043]
Next, in the present embodiment, the size of the housing of the device will be described.
[0044]
First, regarding the processor cooling unit 10, conventionally, if the height of the processor cooling unit is reduced, the surface area is reduced due to the decrease in the height of the heat sink, and the air flow is reduced due to the thinning of the fan. descend. In addition, there is a problem that the cooling capacity of the processor cooling unit is reduced due to a problem such as an increase in the temperature inside the housing.
[0045]
Therefore, the information processing apparatus can be downsized by the cooling structure of the present invention. That is, in the present embodiment, the housing size is as small as 300 mm in width, 320 mm in depth, 78 mm in height, and 7.49 L in capacity, although the structure is such that an 80 W class processor can be cooled. In particular, the height is 78 mm. This is because the height of the processor cooling unit 10 is 47 mm and the power supply 11 is 75 mm.
[0046]
Normally, in a power supply device that also serves to discharge hot air from the inside of the housing, a single 80 mm square fan is generally used in the 160 W class. For this reason, the thickness of the power supply device needs to be 80 mm or more. Also, the maximum value of the air volume of this power supply device is about 13 CFM. On the other hand, the power supply device 11 used in the present embodiment is equipped with a 70 mm square fan, so that the thickness of the power supply device 11 is 75 mm. This is because the power supply fan 11a and the heat exhaust fan 11b can respectively reduce the size of the fan because the power supply fan 11a and the heat exhaust fan 11b exhaust the heat generated by the processor.
[0047]
Further, since two fans 11a and 11b are mounted, the air volume is increased. When comparing the air volume, the noise is the same, 1.5 CFM higher than the conventional one, and 14.5 CFM.
[0048]
When the PCI boards 17a and 17b are not mounted, the amount of air returning to the fan 10a can be reduced by slightly increasing the rotation speed of the heat exhaust fan 11b and increasing the suction capability of the air 33. .
[0049]
In the present embodiment, the opening 16 for taking in air for cooling the auxiliary storage device and the like is provided on the front surface of the housing. However, a configuration in which the opening 16 is not provided may be adopted. In this case, the air supplied from the opening 23 enters the power supply fan 11a.
[0050]
In this embodiment, a suction fan is used as the processor cooling fan 10a, but the present invention is not limited to this. A blowout fan may be used as long as it allows air to flow through the processor cooling fan 10a. The same applies to the power supply fan 11a and the heat exhaust fan 11b.
[0051]
Thus, the housing can be made thinner by the configuration of the processor cooling unit 10 and the power supply device 11. Further, since the power supply fan 11a and the heat exhaust fan 11b are provided, a high cooling effect of the information processing apparatus can be obtained.
[0052]
Next, another embodiment will be described.
[0053]
In the above embodiment, the power supply fan 11a and the heat exhaust fan 11b are arranged in parallel as in the power supply device 11 of FIG. On the other hand, as shown in FIG. 5, the power supply fan 11a may be arranged on the auxiliary storage device 12 side. In this case, it is necessary to secure the space 51 for the intake of the power supply fan 11a. The space 51 is a space between the auxiliary storage device 12 and the power supply device 11. Since a flow of wind occurs in the entire auxiliary storage device 12, this is effective particularly when the auxiliary storage device is to be cooled.
[0054]
That is, the power supply fan 11a acts to cool the rectifier diode 11c on the secondary side of the heat exhaust fan 11b. On the other hand, the heat exhaust fan 11b only needs to be configured to suck heat generated by the processor more than the power supply fan 11a. Therefore, the power supply device 11 may be provided with a power supply fan 11a, and the heat exhaust fan 11b may be provided as a case fan on the rear surface of the housing.
[0055]
Further, in the power supply device 11 shown in FIG. 1, the inlet 11g is an obstacle to the exhaust 35, but by moving the inlet 11g as shown in FIG. 6, the flow of the exhaust 35 can be further improved. Further, the opening 11h is provided as shown in FIG. 7, and the flow of the exhaust gas 35 can be further improved.
[0056]
Further, as shown in FIG. 8, the wind 32 from the opening 15 on the front face of the housing can be designed to be discharged downward in the horizontal direction so as not to directly hit the user.
[0057]
In the above embodiment, the processor cooling unit 10 of FIG. 1 is located diagonally with respect to the power supply unit 11, the processor cooling unit 10 is disposed on the front side of the housing, and the power supply unit 11 is disposed on the rear side of the housing. I have.
[0058]
Here, the processor cooling unit 10 is located at a position facing the power supply device 11 and may be arranged on the rear side of the housing. In this structure, the opening 15 can be provided on the side surface of the foot 25 shown in FIG. 1 and the opening 23 corresponding to the first intake unit can be provided on the back of the housing. In this case, the daughter board 18 is arranged so as to be parallel to the rear surface of the housing.
[0059]
In the above structure, since the processor cooling unit 10 is disposed below the PCI boards 17a and 17b, the thickness of the entire housing increases. However, the direction of the fins 42 is directed to the heat exhaust fan 11b and the opening 15. Thereby, the wind 33 is sucked linearly by the heat exhaust fan 11b without passing through the PCI boards 17a and 17b, and is discharged to the outside of the housing from the opening 11h. On the other hand, the wind 32 is exhausted from the opening 15 by the processor cooling fan 10a.
[0060]
【The invention's effect】
As described above, with respect to the temperature inside the housing of the information processing device, a part of the heat generated by the processor is exhausted to the outside without being taken into the housing, and the heat generated by the processor released into the housing is also described. Since the heat exhaust fan attached to the power supply device quickly exhausts the heat to the outside of the housing, a rise in the temperature inside the housing of the information processing device can be suppressed.
[0061]
Further, the structure around the processor cooling unit 10 has a structure in which the opening 15 is provided to prevent the heat generated by the processor from being taken into the processor cooling fan 10a again. Does not happen.
[0062]
Further, with respect to the power supply device 11, since the heat generated by the processor does not pass through the high heat generation portion of the power supply device 11, overheating of the power supply device 11 can be suppressed.
[0063]
Further, the heat exhaust fan 11b attached to the power supply device 11 can be controlled so as to stop when there is almost no heat generation of the processor, so that there is an effect that noise can be minimized.
[0064]
According to the above effects, the information processing apparatus equipped with the high heat generation processor can be reduced in size and reduced in noise without providing an opening to the top surface regardless of whether the apparatus is placed horizontally or vertically.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration and a cooling structure according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view around a processor cooling unit 10;
FIG. 3 is an exploded view around a processor cooling unit 10;
FIG. 4 is a perspective view of a processor cooling fan 10a and a heat sink 10b.
FIG. 5 is a second perspective view of the power supply device 11.
FIG. 6 is a third perspective view of the power supply device 11;
FIG. 7 is a fourth perspective view of the power supply device 11.
FIG. 8 is a cross-sectional view and a hatched view of an opening 15 according to another embodiment.
[Explanation of symbols]
Reference Signs List 10 processor cooling unit 10a processor cooling fan 10b processor heat sink 11 power supply device 11a power supply fan 11b heat exhaust fan 11c secondary side rectifier diode 11d power supply heat sink 11f transformer 11g inlet 11h opening 11h
12 ... Hard disk 13 ... Slim type CD-ROM
14 ... Slim type FDD
15 Opening 15
16 ... opening 16
23 ... opening 23
17a PCI expansion board 17b PCI expansion board 18 daughter board 19a serial connector 19b display connector 19c USB connector 20 power switch 21a power lamp 21b main power standby lamp 21c hard disk access lamp 22a microphone connector 22b ... Line input connector 22c speaker connector 22d infrared interface 24 front bezel 25 feet 26 chassis 31 wind 31
32 ... wind 32
33 ... wind 33
34 ... wind 34
35 ... wind 35

Claims (12)

A processor,
A processor cooling unit that emits hot air due to heat generated from the processor in first and second directions;
A first cooling fan for flowing cooling air to the processor cooling unit;
A first side surface forming a first exhaust portion for discharging the hot air discharged from the first direction to the outside and a second exhaust portion for discharging the hot air discharged from the second direction to the outside are formed. A housing having a second side face,
An information processing apparatus, comprising: a second cooling fan that causes hot air discharged from the second direction to flow through the second exhaust unit. 2. The information processing apparatus according to claim 1, further comprising a power supply device having a high heat-generating electronic component, and further including a third cooling fan for discharging hot air emitted from the high heat-generating electronic component to the outside. Information processing device. A processor,
A processor cooling unit that emits hot air due to heat generated from the processor in first and second directions;
A power supply device having high heat-generating electronic components;
A first cooling fan for flowing cooling air to the processor cooling unit;
A first side surface forming a first exhaust portion for discharging the hot air discharged from the first direction to the outside and a second exhaust portion for discharging the hot air discharged from the second direction to the outside are formed. A housing forming a second side surface and a third exhaust portion for discharging hot air emitted from the high heat-generating electronic component to the outside;
A second cooling fan for flowing the hot air discharged from the second direction to the second exhaust portion,
An information processing apparatus, comprising: a third cooling fan for flowing hot air discharged from the high heat-generating electronic component to the third exhaust unit. 4. The information processing device according to claim 3, wherein the third exhaust unit is formed on the second side surface. A processor,
A processor cooling unit that emits hot air due to heat generated from the processor in first and second directions;
A first cooling fan for flowing cooling air to the processor cooling unit;
Second and third cooling fans formed in a power supply having high heat-generating electronic components;
A first side surface forming a first exhaust portion for discharging the hot air discharged from the first direction to the outside, and a second side for discharging the hot air discharged from the second direction and the high heat-generating electronic component to the outside. A housing having a second side surface forming the second exhaust portion;
The second cooling fan for flowing hot air discharged from the second direction to the second exhaust unit;
An information processing apparatus, comprising: the third cooling fan that causes hot air discharged from the high heat-generating component to flow through the second exhaust unit. 6. The information processing apparatus according to claim 1, wherein the first side surface is a front surface of a housing. 6. The information processing apparatus according to claim 1, wherein the second side surface is a rear surface of a housing. A processor,
A processor cooling unit that emits hot air due to heat generated from the processor in first and second directions;
A first cooling fan for flowing cooling air to the processor cooling unit;
Second and third cooling fans formed in a power supply having high heat-generating electronic components;
An auxiliary storage device;
A first cooling mechanism that forms a first intake unit and a first exhaust unit that cools hot air emitted from the first direction;
A second cooling mechanism that forms the first intake unit and the second exhaust unit that cools the hot air released from the second direction;
A second cooling mechanism that forms a second intake unit that cools hot air emitted from the auxiliary storage device and the second exhaust unit;
The second cooling fan for flowing hot air discharged from the second direction to the second exhaust unit;
An information processing apparatus, comprising: the third cooling fan that allows hot air discharged from the high heat-generating component and the auxiliary storage device to flow through the second exhaust unit. 9. The information processing apparatus according to claim 8, wherein the second intake unit is a front surface of the information processing apparatus. 9. The information processing apparatus according to claim 8, wherein the first exhaust unit is a front surface of the information processing apparatus. 9. The information processing apparatus according to claim 8, wherein the second exhaust unit is a rear surface of the information processing apparatus. 9. The information processing apparatus according to claim 1, wherein the number of rotations of the second cooling fan is controlled.

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