JP2004047186A - Socket for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid an unwanted, lopsided pressurizing force acting on a part of a plurality of bumps in a contact sheet. <P>SOLUTION: Dummy bumps 62 are fitted for regulating pushing volume on the bumps in a bare chip 60, around the bumps 44B in the contact sheet 44. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor device socket including a contact sheet.
[0002]
[Prior art]
Various tests are performed on a semiconductor device mounted on an electronic device or the like before mounting to remove potential defects. The test is performed non-destructively by applying voltage stress, operating at a high temperature, and storing at a high temperature corresponding to a thermal and mechanical environment test. Among the various tests, a burn-in test for performing an operation test for a certain period of time under a high temperature condition is performed as a test that is effective for removing an initial operation defective integrated circuit.
[0003]
An inspection jig used for this burn-in test is generally called an IC socket. In the test of KGD (Known GoodDie), which is a non-defective bare chip that has been tested in a semiconductor device, such a bare chip is inserted into an IC socket accommodating portion by a carrier that can be detachably attached to the IC socket accommodating portion. It has been proposed to be worn.
[0004]
For example, as shown in FIG. 8, the carrier unit is disposed via a resilient sheet 4 on a carrier housing 2 having a housing 2A in which the bare chip 12 is housed, and on a bottom inside the housing 2A of the carrier housing 2. A configuration including a contact sheet, a pressing lid for pressing an electrode group of the bare chip against a bump group of the contact sheet, and a latch mechanism for selectively holding the pressing lid to the carrier housing. Have been.
[0005]
As shown in FIG. 8, the contact sheet 6 has a plurality of bumps 6b formed of copper or the like facing the electrode group of the bare chip 12 to be electrically connected. The tip of each bump 6b protrudes from the surface of the contact sheet 6 by a predetermined height.
[0006]
The pressing lid 14 includes a pressing body 16 having a pressing surface that is in contact with a surface of the bare chip 12 on which the electrode group is formed, a lid body 20 that houses the base of the pressing body 16, and a base of the pressing body 16. And a plurality of springs 18 arranged in a space between the cover body 20 and the inner surface of the lid body 20 to urge the pressing body 16 toward the bare chip 12.
[0007]
The base of the pressing body 16 is movably inserted into the concave portion of the lid body 20 and has a claw portion on the outer peripheral portion.
[0008]
The lid body 20 has, at both ends thereof, projections with which the hook members of the latch mechanism 10 are engaged.
[0009]
The latch mechanism 10 is rotatably supported by the carrier housing 2 and is engaged with the projection of the lid body 20 of the pressing lid 14, and engages the hook member 10 with the projection of the lid body 20. And a torsion coil spring that urges in the direction of rotation.
[0010]
Therefore, when disposing the pressing lid 14 on the bare chip 12 previously positioned with respect to the bump 6 b of the contact sheet 6, the hook member of the latch mechanism 10 is formed by the slope of the projection of the lid body 20 of the pressing lid 14. Are rotated in the directions away from each other, and the pressing body 16 of the pressing lid 14 is accommodated. When the pressing lid 14 is mounted in the housing portion 2A of the carrier housing 2, the lid body 20 is mounted in the housing portion 2A of the carrier housing 2 with its outer peripheral portion guided by the guide member 8 provided in the carrier housing 2. Is done. Thereafter, by being urged by the torsion coil spring, the tips of the hook members of the latch mechanism 10 are rotated in directions approaching each other and engaged with the upper surface of the projection of the lid main body 20. As a result, the pressing lid 14 is held by the carrier housing 2.
[0011]
[Problems to be solved by the invention]
It is desired that the carrier unit and the bumps 6b and the like of the contact sheet 6 have durability against repeated use. In particular, due to repeated use, the contact area between the tip of the bump 6b of the contact sheet 6 and the electrode group of the bare chip 12 may gradually increase as the bare chip 12 is pressed with a predetermined pressure.
[0012]
As described above, the lid body 20 of the pressing lid 14 is guided by the guide member 8 provided on the carrier housing 2 and is mounted on the accommodating portion of the carrier housing 2. In practice, a predetermined gap is formed between the bump 6b and the fitting portion of the guide member 8, so that the pressing lid 14 is inclined in one direction, that is, the bump 6b Will be pressed.
[0013]
Accordingly, the distribution of the protrusion heights and the contact areas of the plurality of bumps 6b vary more than the allowable value, so that the electrical connection between the tip of one of the plurality of bumps 6b and the electrode of the bare chip 12 is reduced. There is a possibility that it becomes uncertain.
[0014]
In view of the above problems, the present invention relates to a semiconductor device socket, which can prevent an undesired biased pressing force from acting on some of a plurality of bumps in a contact sheet. The purpose is to provide.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, a semiconductor device socket according to the present invention has a plurality of bumps electrically connected to a terminal group of the semiconductor device, and a contact sheet for inputting and outputting signals to and from the semiconductor device. A pressing member for pressing the terminals of the semiconductor device against the bumps of the contact sheet, a housing for housing the semiconductor device disposed on the contact sheet, and a semiconductor device when the pressing member provided for the housing is in a pressed state. And a movement amount regulating member that regulates the movement amount of the bump in the height direction of the bump.
[0016]
Further, the movement amount regulating member may be provided in a portion of the contact sheet around the bump and facing the semiconductor device, or the movement amount regulating member is made of a material having a rigidity as compared with the material of the bump. It may be formed. Further, the movement amount regulating member may be formed of an elastic material.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 4 shows a main part of an example of a semiconductor device socket according to the present invention, together with a semiconductor device to be tested.
[0018]
The semiconductor device socket shown in FIG. 4 includes a carrier unit 40 in which a bare chip as a semiconductor device is housed, and an IC socket 30 in which the carrier unit 40 is detachably mounted in a housing. ing.
[0019]
The IC socket 30 is disposed on a printed wiring board 38 for inputting / outputting an inspection signal to a bare chip, a detection output signal from the bare chip, and the like, and has a main body 32 having an accommodating section for accommodating the carrier unit 40; And a contact group 34 composed of a plurality of contacts electrically connected to respective pads of a contact sheet, which will be described later, which are constituent elements of the carrier unit 40, and a contact group arranged so as to be movable up and down with respect to the main body 32. And a cover member 36 for selectively electrically connecting the respective contact portions 34 to the respective pads of the contact sheet.
[0020]
The main body 32 formed of a resin material is arranged at a predetermined position corresponding to the electrode of the printed wiring board 38. As shown in FIG. 5, the main body 32 has a housing 32A in which the carrier unit 40 is housed. The accommodating portion 32A includes an inner peripheral portion of a lower base portion 32a engaged with a lower portion of a base portion of the carrier unit 40 described later, and an upper base connected to the base portion 32a and engaged with an upper portion of the base portion. It is formed so as to be surrounded by the inner peripheral portion 32b of the portion 32b. A contact group 34 is supported on the lower base 32a. The lower base portion 32a and the upper base portion 32b are formed with slits into which the contacts 34ai (i = 1 to n, n is an integer) forming the contact group 34 are inserted.
[0021]
Each contact 34ai (i = 1 to n, n is an integer) is connected to the terminal portion 34T pressed into the lower base portion 32a and the terminal portion 34T and is electrically connected to the pad of the contact sheet from below. A fixed-side contact portion 34f, a movable-side contact portion 34m that is connected to the pad of the contact sheet from above and has elasticity and is connected to the terminal portion 34T, and a cover member 36 branched from the movable-side contact portion 34m and described later. And an engaged portion 34e that is selectively engaged with the inclined surface of the movable member 34 to rotate the movable contact portion 34m in a direction away from the fixed contact portion 34f.
[0022]
The contacts 34ai are arranged at predetermined intervals along a direction substantially perpendicular to the paper surface, corresponding to pads of a contact sheet 44 described later. 4 and 5 show the contact group 34 of only a portion corresponding to one side of the contact group 34 surrounding the four sides of the housing portion 32A.
[0023]
The cover member 36 formed of a resin material has an opening 36a through which the carrier unit 40 passes. The frame-shaped portion forming the peripheral edge of the opening 36a is supported by a leg guided by a groove provided on the outer periphery of the main body 32 so as to be able to move up and down. The cover member 36 is urged by an elastic member (not shown) in a direction away from the main body 32. At the lower end of each side of the frame-shaped portion, as shown by the two-dot chain line in FIG. 4, when the cover member 36 is lowered to a predetermined position, the cover member 36 engages with the engaged portion 34e of each contact 34ai. Slope portions 36s for rotating the movable contact portion 34m in a direction away from the fixed contact portion 34f against its elastic force are formed.
[0024]
When a carrier unit 40, which will be described later, is mounted in the housing portion 32A of the main body portion 32 of the IC socket 30, the movable contact portions 34m of the contact group 34 are pressed down and held by a predetermined amount so that the movable contact portions 34m of the contact group 34 are housed. After that, the carrier unit 40 is positioned and placed in the accommodating portion 32A from above through the opening 36a. At this time, the fixed side contact portion 34f is brought into contact with the lower surface side of the pad of the contact sheet 44 in the carrier unit 40.
[0025]
Subsequently, when the cover member 36 in the held state is released, the cover member 36 is raised by the combined force of the above-described return force of the elastic body and the elastic force of the engaged portion 34e of each contact 34ai. At that time, each movable contact portion 34m of the contact group 34 is returned to the original position, and is brought into contact with the upper surface of the pad of the contact sheet 44 of the carrier unit 40. Thereby, as shown in FIG. 4, the contact sheet 44 and the contact group 34 are electrically connected.
[0026]
As shown in FIG. 5, the carrier unit 40 includes a carrier housing 46 having a housing portion 46A in which the bare chip 60 is housed, and an elastic sheet 58 formed on a base member 42 forming a bottom of the housing portion 46A of the carrier housing 46. A contact sheet 44 disposed therebetween, a pressing lid 52 including a pressing body 56 for pressing the electrode group of the bare chip 60 against the bump group 44B of the contact sheet 44, and the pressing lid 52 to the carrier housing 46. And a latch mechanism 50 for selectively holding.
[0027]
As shown in FIG. 1, the pressing lid 52 includes a pressing body 56 having a pressing surface 56 a that comes into contact with the upper surface of the bare chip 60, a lid body 64 that houses the base of the pressing body 56, and a base of the pressing body 56. A plurality of springs 54 are provided in a space between the concave portion and the concave portion of the lid main body 64 and bias the pressing body 56 toward the bare chip 60.
[0028]
The substantially square bare chip 60 has, for example, a predetermined electrode group on the lower surface of the contact sheet 44 facing the bump 44B.
[0029]
The base of the pressing body 56 is movably inserted into the recess of the lid body 64. At the end of the portion where the pressing body 56 is inserted, a plurality of claw portions 56n that are engaged with the claw portions provided at the lower end of the lid main body 64 are formed to face each other. As a result, the pressing body 56 is held by the lid body 64 in a state where the pressing body 56 is urged by the urging force of the spring 54.
[0030]
The lid body 64 has protrusions 64P at its opposite ends, respectively, with which the hook members 48A and 48B of the latch mechanism 50 are engaged. As will be described later, the projection 64P engages with the inclined surfaces at the tips of the hook members 48A and 48B when the pressing lid 52 is mounted, and presses the hook members 48A and 48B in directions away from each other. have.
[0031]
The latch mechanism 50 is configured to move the hook members 48A and 48B rotatably supported at both ends of the carrier housing 46 and holding the lid body 64, and the hook members 48A and 48B in the directions indicated by arrows in FIGS. That is, the torsion coil spring 66 is urged in the direction of engagement with the projection 64p of the lid body 64, and the hook members 48A and 48B and the support shaft 68 that supports the torsion coil spring 66 are configured. .
[0032]
Guide portions 46g are formed at both ends of the carrier housing 46 for guiding the outer periphery of the lower portion of the lid body 64 when the pressing lid 52 is mounted.
Both ends of the support shaft 68 are supported around the guide portion 46g.
[0033]
As shown in FIGS. 1 and 2, the contact sheet 44 has a plurality of bumps 44B in the base material 44M in an arrangement corresponding to the electrode group of the bare chip 60 to be electrically connected. For example, the tip of each bump 44B made of copper or the like has a diameter of about 100 μm and protrudes from the surface of the base material 44M by a predetermined height, for example, about 50 μm. The base material 44M is, for example, made of a polyimide resin material in a thin plate shape, and has a thickness of about several tens μm.
[0034]
Each bump 44B is connected to a pad 44P via a conductor layer 44C made of copper foil, as shown in FIG. The pads 44P are formed at both ends of the base material 44M, which protrude outward from both ends of the base member 42, respectively.
[0035]
As shown in FIGS. 1 and 2, dummy bumps 62 as movement amount restricting members are formed on portions of the base material 44M corresponding to the four corners of the bare chip 60, respectively. The dummy bumps 62 are made of, for example, palladium (Pd), platinum (Pt), cobalt (Co), iron (Fe), nickel (Ni), ruthenium (Ru), rhodium (Rh), osmium (Os), iridium (Ir). , Hassium (Hs), Meitnerium (Mt), Ununilium (Uun) and the like, or an alloy material containing these metals as a main component.
[0036]
In forming the dummy bumps 62, for example, as shown in Japanese Patent Application Laid-Open No. 11-326379, first, the tip of a wire made of the above-described material is attached to a pad formed in advance on the base material 44M. The pads are wire-bonded by ultrasonic welding. Next, the vicinity of the tip of the joined wire is torn. Thus, stud bumps are formed on the base material 44M. Then, the upper end of the formed stud bump is flattened by the molding tool, so that the dummy bump 62 is formed on the base material 44M.
[0037]
The protrusion height of the dummy bump 62 is set to, for example, a value equal to or slightly lower than the protrusion height of the bump 44B.
[0038]
The position where the dummy bump 62 is formed is not limited to the above example, and may be, for example, a portion without a pad and a wiring network, or a portion where the pad and the wiring network are covered with an insulating coat. Further, the material and the number of the dummy bumps 62 are not limited to the above example, and are, for example, the total of the loads acting on all the bumps 44B when it is assumed that a load of about 10 g acts on one bump 44B. When the total load is received by each of the dummy bumps, a material that does not cause the dummy bumps to be crushed by a predetermined value or more, for example, a material such as solder which is the same as the material of the bumps 44B may be appropriately selected. .
[0039]
In such a configuration, when mounting the bare chip 60 in the carrier unit 40, first, the electrode group of the bare chip 60 is positioned with respect to the bump 44B of the contact sheet 44, and the electrode group of the bare chip 60 contacts the bump 44B. Be placed. Next, the pressing lid 52 is inserted into the accommodating portion 46A of the carrier housing 46. At this time, the distal ends of the hook members 48A and 48B of the latch mechanism 50 are rotated in a direction away from each other against the biasing force of the torsion coil spring 66 by the inclined surface 64ps of the lid main body 64 of the pressing lid 52. Further, while the outer peripheral surface of the lid body 64 is guided by the inner surface of the guide portion 46g, the pressing surface 56a of the pressing body 56 is pressed against the upper surface of the bare chip 60 against the urging force of the spring 54.
Subsequently, by being urged by the torsion coil spring 66, the tips of the hook members 48 are rotated in directions approaching each other, and are engaged with the projections 64p of the lid main body 64. As a result, the pressing lid 52 is held by the carrier housing 46.
[0040]
At this time, in practice, a predetermined gap is provided between the outer peripheral surface of the lid main body 64 and the inner surface of the guide portion 46g, so that the pressing surface 56a of the pressing body 56 is inclined as shown in FIG. There is a possibility that the bare chip 60 and the bumps 44B may be pressed in an inclined posture.
[0041]
However, in such a case, since the dummy bumps 62 are provided around the bumps 44B, a part of the bare chip 60 interferes with the tip of the dummy bumps 62, so that the amount of pressing of the bare chip 60, for example, the bump 44B of the bare chip 60 The movement amount in the height direction or the contact area of the tip of the bump 44B with the electrode surface of the bare chip 60 is regulated. As a result, uneven crushing of the plurality of bumps 44B is avoided.
[0042]
6A and 6B schematically show a carrier unit used in another example of the semiconductor device socket according to the present invention. 6A and 6B, the same components in the example shown in FIG. 1 are denoted by the same reference numerals, and the description thereof will not be repeated.
[0043]
The dummy bumps 62 in the contact sheet 44 shown in FIG. 1 are formed of a relatively rigid material that is not likely to be crushed, but instead, in the examples shown in FIGS. 6A and 6B, Dummy bumps 72 made of an elastic material, for example, silicon rubber, are provided at four places in the contact sheet 70.
[0044]
The contact sheet 70 has a plurality of bumps 70B in the base 70M in an array corresponding to the electrode group of the bare chip 60 to be electrically connected. For example, the tip of each bump 70B formed of solder or the like has a diameter of about 100 μm and protrudes from the surface of the base material 70M by a predetermined height, for example, about 50 μm. The base material 70M is made of, for example, a polyimide resin material in a thin plate shape, and has a thickness of about several tens μm.
[0045]
Although not shown, each bump 70B is connected to a pad via a conductor layer made of copper foil. The pads are formed at both ends of the base material 70M that protrude outward from both ends of the base member 42, respectively.
[0046]
The dummy bumps 72 as the movement amount regulating members protrude respectively at portions corresponding to the four corners of the bare chip 60 on the base material 70M. The lowermost end of the dummy bump 72 is fixed to the base member 42, and the upper end of the dummy bump 72 protrudes through the base material 70 </ b> M of the contact sheet 70 and the minute through holes 70 a and 58 a of the elastic body 58. As shown in FIG. 6A, when the urging force of the coil spring 54 does not act on the dummy bump 72, the protrusion height of the dummy bump 72 is set to, for example, a value slightly higher than the protrusion height of the bump 70B. . In addition, as shown in FIG. 6B, when the biasing force of the coil spring 54 acts on the dummy bump 72, the height of the dummy bump 72 is substantially the same as the height of the dummy bump 72 or lower than the height of the dummy bump 72. Is set to
[0047]
In the present example, the position at which the dummy bump 72 is formed is not limited to this example. For example, the position where the pad and the wiring network are not provided, or the portion where the pad and the wiring network are covered with the insulating coat are covered. There may be. Further, the material and the number of the dummy bumps 72 are not limited to the above example, and are, for example, the total of the loads acting on all the bumps 70B assuming that a load of about 10 g acts on one bump 70B. Of course, when the total load is received by each dummy bump, a material and a quantity that do not have a possibility that each dummy bump is crushed by a predetermined value or more may be appropriately selected.
[0048]
In such a configuration, when the pressing lid 52 is mounted on the carrier housing 46, there is a possibility that the pressing surface of the pressing body 56 may press the bare chip 60 and the bump 70B in an inclined posture.
[0049]
However, in such a case, since the dummy bumps 72 are provided around the bumps 70B, a part of the inclined bare chip 60 contacts and presses the tip of the dummy bumps 72. At this time, the amount of pushing of the bare chip 60 is regulated to a predetermined value by the repulsive force of the dummy bump 72. As a result, uneven crushing of the plurality of bumps 70B is avoided.
[0050]
FIG. 7 schematically shows a carrier unit used in still another example of the semiconductor device socket according to the present invention. In FIG. 7, the same reference numerals are given to the same components in the example shown in FIG. 1, and the description thereof will not be repeated.
[0051]
In FIG. 7, in the above example, the upper end of the dummy bump 62 in the contact sheet 44 abuts on the surface of the bare chip 60 facing the bump 44B of the contact sheet 44, thereby directly regulating the amount of movement of the bare chip 60. Instead, dummy bumps 80 for restricting the amount of movement of the pressing body 56 for indirectly restricting the amount of movement of the bare chip 60 are provided at four places in the contact sheet 44 '. Each of the dummy bumps 80 is provided at a portion directly facing the pressing surface 56a of the pressing body 56 which avoids interference with the bare chip 60.
[0052]
The projecting height of the dummy bump 80 as a movement amount regulating member from the surface of the base material 44M 'is determined, for example, when the pressing lid 52 is inserted and held in the housing portion 46A of the housing 46. The distance between the surface portion and the surface of the base material 44M 'is set to be equal to or slightly lower than the protrusion height of the bump 44B.
[0053]
The dummy bumps 80 are formed of the same material as that of the above-described dummy bumps 62 by a molding method similar to the example shown in FIG. 1 described above.
[0054]
Therefore, also in this example, the same operation and effect as the above-described example can be obtained.
[0055]
In the above-described example, the example of the present invention is applied to the type in which the carrier unit 40 is mounted on the main body 32 of the IC socket 30. However, the present invention is not limited to such an example, and the example of the present invention is as follows. For example, it goes without saying that a single contact sheet may be mounted on another device and applied.
[0056]
【The invention's effect】
As is clear from the above description, according to the semiconductor device socket of the present invention, when the pressing member arranged in the housing portion is in the pressed state, the movement amount regulating member is in the height direction of the bump of the semiconductor device. Therefore, it is possible to prevent an undesired biased pressing force from acting on some of the plurality of bumps on the contact sheet.
[Brief description of the drawings]
FIG. 1 is a partial sectional view showing a main part of an example of a semiconductor device socket according to the present invention.
FIG. 2 is a plan view of the example shown in FIG.
FIG. 3 is a partial cross-sectional view used for explaining the operation in the example shown in FIG. 1;
FIG. 4 is a partial cross-sectional view schematically showing an entire configuration of an example of a semiconductor device socket according to the present invention.
FIG. 5 is a partial cross-sectional view showing a state where the carrier unit is removed from an IC socket main body in the example shown in FIG. 4;
6A and 6B are partial cross-sectional views schematically showing main parts of another example of the semiconductor device socket according to the present invention.
FIG. 7 is a partial sectional view schematically showing a main part of still another example of the semiconductor device socket according to the present invention.
FIG. 8 is a partial sectional view showing a configuration of a conventional socket for a semiconductor device.
[Explanation of symbols]
44, 70 Contact sheet 44B, 70B Bump 46 Carrier housing 46A Housing 52 Pressing lid 60 Bear chips 62, 72, 80 Dummy bump

Claims (4)

A contact sheet having a plurality of bumps electrically connected to a terminal group of the semiconductor device and inputting and outputting signals to and from the semiconductor device;
A pressing member for pressing the terminals of the semiconductor device against the bumps of the contact sheet;
An accommodating portion for accommodating the semiconductor device arranged on the contact sheet;
When the pressing member disposed in the housing portion is in a pressing state, a movement amount regulating member that regulates a movement amount of the semiconductor device along a protruding height direction of the bump;
A semiconductor device socket comprising: 2. The semiconductor device socket according to claim 1, wherein the movement amount regulating member is provided in a portion around the bump on the contact sheet and facing the semiconductor device. 3. 3. The semiconductor device socket according to claim 2, wherein the movement amount regulating member is formed of a material having a rigidity as compared with a material of the bump. 3. The socket for a semiconductor device according to claim 2, wherein the movement amount regulating member is formed of an elastic material.

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