JP2004037908A - Method for depositing antireflection film on organic material surface - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for depositing an antireflection film on an organic material surface under a low temperature. <P>SOLUTION: In the method for depositing the antireflection film on the organic material surface, a base material composed of an organic material in which the generation of a gas by decomposition can not be neglected when exceeding a prescribed temperature is an object to be plated, and after placing it in a reaction chamber together with a target material as a plating material, while setting he temperature of the base material to a work temperature within a prescribed range lower than the prescribed temperature, plating material particles are released from the surface of the target material by excitation, shifted to a base material surface and deposited onto the base material surface as the antireflection film. By forming a prescribed distance between the base material and the target material, thermal effects generated by the collision of the shifting particles with the base material when reaching the base material and being deposited onto the base material are reduced and the work temperature of the base material surface during the process of depositing the antireflection film is kept within the prescribed range. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for forming an antireflection film on an organic material surface used for an optical element, for example, an LCD, a PDA, a CRT, a PDP, various cameras, a solar cell, or a window of a vehicle.
[0002]
[Prior art]
The formation of the antireflection film on the optical device is generally formed by a physical vapor deposition (PVD) method such as a sputtering method, a vacuum deposition method, and an ion plating method. Since these methods need to be performed at a high temperature, for a substrate made of an organic material such as plastic, if the temperature exceeds a predetermined temperature (for example, 60 ° C.), the base material is decomposed to generate gas, and a film is formed to some extent. May be clouded and the function may be degraded. For example, as for a polarizing plate, a layer made of triacetate cellulose (TAC) is formed on both surfaces of a substrate made of polyvinyl alcohol (PVA), and then a surface protective layer is further formed on one surface, and an optical adhesive is formed on the other surface. Since it is a composite plastic material formed by covering the release film by using, it is used when forming an anti-reflection film capable of reducing the reflectance to light on its outer surface by using it as a base material. The high temperature (at about 60 ° C. or higher) decomposes the substrate, the triacetate cellulose layer, the adhesive, etc. to generate gas, which generates air bubbles in the outermost release film, thereby deteriorating the function of the polarizing plate. In addition to this, there is a disadvantage in that the degree of vacuum in the reaction chamber for forming the anti-reflection film and the purity of the target material as the plating material are destroyed. Therefore, there is a need for a method capable of forming an antireflection film on the surface of an organic material at a low temperature.
[0003]
[Problems to be solved by the invention]
An object of the present invention is to provide a method capable of forming an antireflection film on an organic material surface at a low temperature.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, when a temperature exceeds a predetermined temperature, a base material made of an organic material whose generation of gas due to decomposition is not negligible is used as a substrate to be plated, and placed in a reaction chamber together with a target material as a plating material. Thereafter, while allowing the base material to be at a working temperature within a predetermined range lower than the predetermined temperature, the plating particles escape from the surface of the target material by excitation, and are transferred to the base material surface. A method of forming an anti-reflection film on the surface of an organic material to be attached as an anti-reflection film, by opening a predetermined distance between the base material and the target material, to reach the base material of the transition particles A heat effect generated by collision with the base material when adhering to the base material is reduced, and the working temperature of the base material surface during the formation process of the antireflection film is kept within the predetermined range. Organic material Method for forming a reflection preventing film to the surface. According to this forming method of the present invention, the temperature of the base material surface during the process of forming the antireflection film can be maintained at a working temperature within a predetermined range lower than the predetermined temperature. As a result, there is no danger of fogging the optical device to be manufactured and deteriorating its optical function.
[0005]
Here, the base material made of an organic material refers to a material made of a resin or a plastic material or a composite material thereof. The term “excitation” refers to various methods for allowing plating particles to escape from the surface of the target material. For example, a method of colliding the surface of the target material with an electron flux or an ion flux to eject the plating particles, or a method of heating the target material and evaporating the plating particles from the surface. In other words, the antireflection film of the present invention can be formed by a sputtering method, a vacuum deposition method, an ion plating method, an ion-assisted deposition method (IBAD; Ion Beam Assisted Deposition), or a combination method thereof. The working temperature within the predetermined range usually means a low temperature, that is, a temperature of 60 ° C. or less. Preferably, the predetermined distance is limited to a range of 40 to 80 cm. The surface roughness of the substrate is preferably 100 nm or less. The target material is preferably capable of producing the plating particles at a high capacity and a low temperature.
[0006]
Then, the method for forming an antireflection film on the surface of an organic material according to the present invention further comprises the step of forming the base material with a predetermined gas so that a high refractive index layer, a low refractive index layer, and a protective layer are sequentially formed as the antireflection film. A step of cleaning the surface, a step of forming the high-refractive-index layer on the substrate surface using a metal compound having a high refractive index as a target material, and a step of forming a metal compound having a low refractive index lower than the high-refractive index as the target material. Forming a low refractive index layer on the high refractive index layer, and forming the protective layer on the low refractive index layer. Also, a plurality of low refractive index layers may be formed on the high refractive index layer by repeating the step of forming the low refractive index layer a plurality of times. Preferably, the predetermined gas is selected from oxygen, nitrogen, and argon. As the metal compound having a high refractive index, a metal compound having a refractive index of 2.0 or more, for example, Ta ₂ O ₅ , Cr ₂ O ₃ , TiO ₂ , ZnS, ZnO ₂ , CdTe, CdS, Nd ₂ O _{3 and the} like It is preferred to use Examples of the metal compound having a low refractive index, 1.5 or less of the metal compound is a refractive index, for _{example, BaF 2, MgF 2, Na} 3 AlF 6, Na 5 Al 3 F 14, SiO 2, YbF 3, CeF 3 , etc. It is preferred to use It is preferable to use a material selected from MgF ₂ and SiO ₂ as the protective layer. The thickness of the high refractive index layer is preferably formed to be about 10 to 15 nm. The thickness of the protective layer is preferably about 80 to 120 nm. Further, when the step of forming the low refractive index layer is repeated four times to form four low refractive index layers on the high refractive index layer, the thickness of each low refractive index layer is 20 to 40 nm and 65, respectively. To 85 nm, 112.5 to 187.5 nm, and about 20 to 40 nm. When the step of forming the low-refractive-index layer is repeated five times to form five low-refractive-index layers on the high-refractive-index layer, the thickness of each low-refractive-index layer is 20 to 40 nm and 65 to 85 nm, respectively. , 112.5 to 187.5 nm, about 20 to 40 nm, and about 80 to 100 nm.
[0007]
The optical device manufactured by the method of forming an anti-reflection film on the surface of the organic material may have a temperature of the substrate surface during a process of forming the anti-reflection film within a predetermined range lower than the predetermined temperature. Since the anti-reflection film was formed while maintaining the temperature, when the temperature exceeded a predetermined temperature, gas generation due to decomposition did not fog the element and the function was not degraded. Etc. can be secured.
[0008]
Here, the light-related element refers to an element that has an operative relation with light, and in particular, it is necessary to reduce the reflection effect by an antireflection film. For example, polarizing plates, various image display devices, vehicle windows, glasses, camera lenses, and the like.
[0009]
Further, the optical-related element manufactured by the method for forming an anti-reflection film on the surface of the organic material preferably has an average reflectance of 0.5% or less with respect to light in a wavelength range of 450 to 750 nm.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the method for forming an antireflection film on the surface of an organic material according to the present invention will be described in detail. FIG. 1 is a flowchart showing steps in the case of forming an antireflection film on the surface of a substrate made of an organic material according to the first embodiment of the method for forming an antireflection film on the surface of an organic material according to the present invention. As shown in the drawing, the method for forming an antireflection film on the surface of an organic material according to the present invention includes a step of cleaning the surface of the base material with a predetermined gas (step 1), and a method of using a metal compound having a high refractive index as a target material. Forming a high refractive index layer on the substrate surface 2 (step 2); and forming a first to fourth low refractive index layers on the high refractive index layer using a metal compound having a low refractive index lower than the high refractive index as a target material. It comprises a step of sequentially forming a refractive index layer (steps 3, 4, 5, 6) and a step of forming a protective layer on the fourth low refractive index layer (step 7). Hereinafter, the respective steps in the method for forming an antireflection film on the surface of the organic material will be described in detail in the order of formation of the embodiment shown in FIGS. In the above embodiment, first, as shown in FIG. 2, a polarizing plate made of a composite plastic material and having a surface roughness of about 90 nm was used as a base material 2 and was heated at a temperature of about 50 ° C. and a degree of vacuum of about 2 × 10 After being placed in the reaction chamber 3 at ⁻³ Pa, the surface 21 of the substrate 2 was washed with an argon ion flux 41 (Step 1). Then, as shown in FIG. 3, the base material 2 washed as described above is used as a plating target, CeO ₂ having a refractive index of 2.1 is used as a target material 51, and while heating, the electron beam having a voltage of 6 KV is used. After colliding with the surface of the target material 51 and ejecting the plating particles 52 from the surface of the target material 51, the plating particles 52 are made fine and uniform by ion-assisted vapor deposition (IBAD). A high-refractive-index layer 53 having a thickness of about 10 to 15 nm (about 13 nm in this embodiment) was formed by being attached to the material surface 21 (step 2). During the process of forming the high refractive index layer 5, the distance between the base material 2 and the target material 51 was maintained at 60 cm, and the temperature of the base material 2 was maintained at about 50 ° C. Thereby, the thermal effect generated by the collision of the plating particles 52 with the substrate 2 when the plating particles 52 reach the substrate 2 and adhere to the substrate 2 is reduced, and the process of forming the high refractive index layer is performed. The surface temperature of the substrate in the inside was kept at about 50 ° C. Then, as shown in FIG. 4, the base material 2 on which the high refractive index layer 53 is formed is used as a plating target, and CeF ₃ having a refractive index of 1.4 is used as a target material 61, and the base material 2 and the target material are used. While maintaining the distance to 61 at 60 cm and the temperature of the substrate 2 at about 50 ° C., a first layer having a thickness of 20 to 40 nm (about 30 nm in this embodiment) is formed on the high refractive index layer 53. Was formed (step 3). Then, in order to further increase the range of the low refractive index layer, as shown in FIG. 5, a low refractive index layer forming step similar to the step 3 is repeated three times, and the low refractive index layer is formed on the first low refractive index layer 63. A second low refractive index layer 71 having a thickness of 65 to 85 nm (about 75 nm in this embodiment) and a thickness of 112.5 to 187.5 nm (a quarter of the wavelength of visible light; A third low-refractive-index layer 72 having a wavelength of 550 nm as a mode light and taking a quarter of the wavelength of about 137.5 nm) and a second low-refractive-index layer 72 having a thickness of 20 to 40 nm (about 30 nm in this embodiment). 4 and the low refractive index layer 73 were formed sequentially (steps 4, 5, 6). Next, as shown in FIG. 6, the substrate 2 on which the high refractive index layer 53 and the first to fourth low refractive index layers 63, 71 to 73 are formed is to be plated, and the MgF ₂ material is used as a target. As the material 81, the thickness between the base material 2 and the target material 81 is maintained at about 60 cm, and the temperature of the base material 2 is maintained at about 50 ° C. on the fourth refractive index layer 73. A protective layer 83 having a thickness of about 100 nm was formed (Step 7), and the formation of the antireflection film 20 on the base material 2 was completed. That is, the antireflection film 20 formed in this embodiment is composed of the high refractive index layer 53, the first to fourth low refractive index layers 63, 71 to 73, and the protective layer 83. The configuration of the optical device 9 with an antireflection film having the film 20 formed thereon is as shown in FIG.
[0011]
The second embodiment of the method of forming an antireflection film on the surface of an organic material according to the present invention is different from the first embodiment in that a fifth low-reflection film is formed before the protective layer forming step (step 7). A refractive index layer forming step is further provided, that is, a fifth low refractive index layer 74 having a thickness of 80 to 100 nm is formed between the fourth low refractive index layer 73 and the protective layer 83. In the example of the second embodiment, a fifth low refractive index layer 74 of about 90 nm was actually formed. In other words, in this embodiment, the antireflection film 201 includes the high refractive index layer 53, the first to fifth low refractive index layers 63, 71 to 74, and the protective layer 83. The configuration of the optical device 91 with the anti-reflection film 201 manufactured by the method for forming the anti-reflection film is as shown in FIG. FIG. 9 shows the reflectance with respect to visible light of the optical device 91 with the antireflection film 201 manufactured according to the second embodiment. As shown in the figure, the average reflectance of the light-related element 91 for light in the wavelength range of 450 to 750 nm of visible light is 0.5% or less, and the reflectance for light of 550 nm in wavelength is 0.2%. It is as follows.
[0012]
【The invention's effect】
The method for forming an anti-reflection film on the surface of an organic material according to the present invention can form an anti-reflection film at a low temperature on a substrate made of an organic material that has a drawback that gas generation due to decomposition cannot be ignored when the temperature exceeds a predetermined temperature. When the temperature exceeds a predetermined temperature, the generation of gas due to decomposition causes no fogging of the optical device to be manufactured and the possibility of deteriorating its optical function. The antireflection effect and the quality of the entire device can be ensured.
[0013]
The embodiments described above are intended to clarify the technical contents of the present invention, and the present invention is not limited to such specific examples and is not interpreted in a narrow sense. Various modifications can be made within the spirit and scope of the claims.
[Brief description of the drawings]
FIG. 1 is a flowchart showing steps when an antireflection film is formed on a surface of a substrate made of an organic material according to a first embodiment of the method of forming an antireflection film on an organic material surface of the present invention.
FIG. 2 is an explanatory view showing a cleaning step in the embodiment.
FIG. 3 is an explanatory view showing a high refractive index layer forming step in the embodiment.
FIG. 4 is an explanatory view showing a first low refractive index layer forming step in the embodiment.
FIG. 5 is an explanatory view showing second, third, and fourth low refractive index layer forming steps in the embodiment.
FIG. 6 is an explanatory view showing a protective layer forming step in the embodiment.
FIG. 7 is a longitudinal sectional view showing an optical device manufactured according to the embodiment.
FIG. 8 is a longitudinal sectional view showing an optical device manufactured according to a second embodiment of the method for forming an antireflection film on the surface of an organic material according to the present invention.
FIG. 9 is an explanatory diagram showing the reflectance with respect to visible light of the optical device with the antireflection film 201 manufactured according to the embodiment.
[Explanation of symbols]
2 base material 20, 201 antireflection film 21 base material surface 3 reaction chamber 41 ion flux 51, 61, 81 target material 53 high refractive index layer 63 first low refractive index layer 71 to 74 second to fifth low refractive index Layer 83 Protective layer 9, 91 Optical element

Claims (10)

When the temperature exceeds a predetermined temperature, a base material made of an organic material whose generation of gas due to decomposition is not negligible is to be plated, and after being placed in a reaction chamber together with a target material as a plating material, the base material is cooled to a predetermined temperature lower than the predetermined temperature. The plating particles escape from the surface of the target material by excitation while being brought into a working temperature within the range, are transferred to the substrate surface, and are reflected on the organic material surface to be attached to the substrate surface as an antireflection film. A method for forming a prevention film, comprising:
By providing a predetermined distance between the base material and the target material, a thermal effect generated by collision of the migrating particles with the base material when the migrated particles reach the base material and adhere to the base material is reduced. A method of forming an anti-reflection film on an organic material surface, wherein the working temperature of the surface of the base material during the process of forming the anti-reflection film is maintained within the predetermined range. 2. The method according to claim 1, wherein the working temperature within the predetermined range is set to 60 [deg.] C. or less. As the antireflection film, so as to sequentially form a high refractive index layer, a low refractive index layer and a protective layer,
Forming the high refractive index layer on the substrate surface using a metal compound having a high refractive index as a target material,
Forming the low refractive index layer on the high refractive index layer using a metal compound having a low refractive index lower than the high refractive index as a target material,
Forming the protective layer on the low refractive index layer. The method of forming an antireflection film on an organic material surface according to claim 1, further comprising: forming the protective layer on the low refractive index layer. 4. The method according to claim 1, wherein the predetermined distance is set to 40 to 80 cm. The reflection on the organic material surface according to claim 3, wherein a plurality of low refractive index layers are formed on the high refractive index layer by repeating the step of forming the low refractive index layer a plurality of times. A method for forming the prevention film. 4. The method according to claim 3, further comprising, before the step of forming the high refractive index layer on the substrate, a step of cleaning the surface of the substrate with a predetermined gas. For forming an antireflection film. 4. The method according to claim 3, wherein a metal compound having a refractive index of 2.0 or more is used as the metal compound having a high refractive index. The method according to claim 7, wherein a metal compound having a refractive index of 1.5 or less is used as the metal compound having a low refractive index. 7. The method according to claim 6, wherein the predetermined gas is selected from oxygen, nitrogen, and argon. 2. The method according to claim 1, wherein the surface roughness of the substrate is 100 nm or less.

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