JP2004031970A5 - - Google Patents
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- Publication number
- JP2004031970A5 JP2004031970A5 JP2003187828A JP2003187828A JP2004031970A5 JP 2004031970 A5 JP2004031970 A5 JP 2004031970A5 JP 2003187828 A JP2003187828 A JP 2003187828A JP 2003187828 A JP2003187828 A JP 2003187828A JP 2004031970 A5 JP2004031970 A5 JP 2004031970A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003187828A JP4464631B2 (ja) | 2003-06-30 | 2003-06-30 | 半導体素子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003187828A JP4464631B2 (ja) | 2003-06-30 | 2003-06-30 | 半導体素子の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001253099A Division JP2003068705A (ja) | 2001-08-23 | 2001-08-23 | 半導体素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004031970A JP2004031970A (ja) | 2004-01-29 |
| JP2004031970A5 true JP2004031970A5 (el) | 2007-01-11 |
| JP4464631B2 JP4464631B2 (ja) | 2010-05-19 |
Family
ID=31185459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003187828A Expired - Fee Related JP4464631B2 (ja) | 2003-06-30 | 2003-06-30 | 半導体素子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4464631B2 (el) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4101280B2 (ja) | 2006-07-28 | 2008-06-18 | 住友精密工業株式会社 | 終点検出可能なプラズマエッチング方法及びプラズマエッチング装置 |
| DE102012200211A1 (de) * | 2012-01-09 | 2013-07-11 | Carl Zeiss Nts Gmbh | Vorrichtung und Verfahren zur Oberflächenbearbeitung eines Substrates |
| JP2015032780A (ja) * | 2013-08-06 | 2015-02-16 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及びプラズマ処理方法 |
| JP2015060934A (ja) * | 2013-09-18 | 2015-03-30 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
| US10460988B2 (en) * | 2017-12-21 | 2019-10-29 | Tokyo Electron Limited | Removal method and processing method |
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2003
- 2003-06-30 JP JP2003187828A patent/JP4464631B2/ja not_active Expired - Fee Related