JP2004022600A - Tape carrier and electronic apparatus using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent disconnection of wiring when a tape carrier is bent at the part of a through hole or in the vicinity thereof. <P>SOLUTION: The tape carrier comprises at least one insulating film 1, a first wiring layer 4a and a second wiring layer 4b formed on the different surfaces of the insulating film 1, a through hole 2 made through the insulating film 1 in order to connect the first wiring layer 4a and the second wiring layer 4b electrically, a conductor 7 filling the through hole 2, and a first land 3a and a second land 3b formed to be connected, respectively with the first wiring layer 4a and the second wiring layer 4b while covering the conductor 7. The cross-sectional area of the first land 3a along a plane parallel with the insulating film 1 is set wider than that of the second land 3b. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a tape carrier for mounting a semiconductor device such as a driving semiconductor device for driving a liquid crystal display device, a passive component, and the like, and an electronic apparatus using the same.
[0002]
[Prior art]
The tape carrier is for mounting semiconductor devices, passive components, and the like, and has a structure in which a wiring pattern is formed on an insulating film. The tape carrier is used, for example, in a driving semiconductor device for driving a liquid crystal display device used in a mobile phone or the like. In recent years, with the progress of miniaturization, high density, and high performance of mobile phones and the like, tape carriers are also required to be miniaturized and densely mounted.
[0003]
To cope with this, fine pitch of the wiring pattern has been promoted as a method of increasing the density, but since the wiring processing technology and the assembly technology are limited, it has been currently mounted on one side. The use of both sides of the tape carrier has increased the mounting area, and the development of a double-sided wiring type tape carrier in which the mounting area is doubled for tape carriers of the same size is being promoted.
[0004]
Generally, as shown in FIG. 11, a double-sided wiring type tape carrier includes an insulating film layer 51, a through hole (through hole) 52, a land 53 covering the through hole 52, a wiring layer 54, a semiconductor device (chip) 55, and a semiconductor device 55. It comprises a resin layer 56 for protecting and fixing a connection portion such as a pad, and a conductive substance 57.
[0005]
In addition, a wiring layer 54 on which a wiring pattern for external electrical connection to the semiconductor device 55 is printed on both sides (both sides) of the insulating film layer 51. The insulating film layer 51 has a through hole 52 in order to electrically connect the wiring layers 54 arranged on both sides. In addition, the through-hole 52 is filled with a conductive substance 57 to enable electrical connection as described above.
[0006]
[Problems to be solved by the invention]
However, since the through-hole 52 requires electrical connection, it is formed of a conductive material 57 having poor flexibility, such as plating or metal lump, and is not easily deformed. Therefore, when the tape carrier is bent at and around the through hole, the tensile stress applied to the bent portion is concentrated, and the conductive substance 57 in the through hole 52, the land 53 covering the through hole 52, or the land 53 or The drawn wiring will be disconnected. For this reason, the currently developed multilayer wiring type tape carrier prohibits bending in and around the through hole 52, and can be used in any part such as COF (Chip On Film) and SOF (System On Film). The feature of the foldable tape carrier is impaired.
[0007]
Therefore, the present invention has been proposed to solve the above-mentioned conventional problems, a tape that can relax the tensile stress even when bent at or around a through hole portion, and can prevent disconnection of wiring. An object is to provide a carrier and an electronic device using the carrier.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, a tape carrier according to the present invention includes at least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and a first wiring. A through-hole provided in the insulating film for electrically connecting the first wiring and the second wiring; a conductor filling the through-hole; and a first wiring and a second wiring formed to cover the conductor. In the tape carrier having a first land and a second land respectively connected to the wiring, the first land has a cross-sectional area along a plane parallel to the insulating film is wider than the second land. Features.
[0009]
According to the above configuration, in the case where the first wiring side is bent at the through hole portion or its peripheral portion so that the surface on the first wiring side is outside, the adhesion between the first land and the insulator increases. The resistance of the first land to the tensile stress applied to the generated first land in the mountain-side portion is increased.
[0010]
As a result, disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0011]
Here, "formed so as to cover the conductor" means that the conductor is formed so as to cover the whole or most of the surface of the conductor.
[0012]
In order to solve the above problems, a tape carrier according to the present invention includes at least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and a first wiring. A through-hole provided in the insulating film for electrically connecting the first wiring and the second wiring; a conductor filling the through-hole; and a first wiring and a second wiring formed to cover the conductor. In a tape carrier including a first land and a second land connected to the respective wirings, the thickness of the first land is smaller than the thickness of the second land.
[0013]
According to the above configuration, in the case where the first wiring side surface is bent outward at the through hole portion or the periphery thereof, the layer thickness of the first land at the crest side portion at the time of bending is reduced to the valley side portion. Is thinner than the second land. Therefore, the radius of curvature of the first land surface when bent at or around the through hole is reduced. As the thickness of the first land increases, the tensile stress applied when the first land is bent increases. Therefore, the tensile stress applied is reduced by reducing the radius of curvature by thinning the first land.
[0014]
As a result, disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0015]
In order to solve the above problems, a tape carrier according to the present invention includes at least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and a first wiring. A through-hole provided in the insulating film for electrically connecting the first wiring and the second wiring; a conductor filling the through-hole; and a first wiring and a second wiring formed to cover the conductor. A tape carrier including a first land and a second land respectively connected to the first and second wirings, wherein a concave portion is formed on at least one surface of the first land and the second land.
[0016]
According to the above configuration, at least one of the first land and the second land has the concave portion, so that the surface area is increased. Therefore, the same effect as in the case where the cross-sectional area of the land along the plane parallel to the insulating film is widened, and the stress applied to at least one of the first land and the second land at the time of bending is reduced. It is possible to do.
[0017]
As a result, disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0018]
In order to solve the above problems, a tape carrier according to the present invention includes at least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and a first wiring. A through-hole provided in the insulating film for electrically connecting the first wiring and the second wiring; a conductor filling the through-hole; and a first wiring and a second wiring formed to cover the conductor. In the tape carrier having the first land and the second land respectively connected to the wiring of (1), at least one of the first land and the second land has a defective portion that does not cover the conductor, such as a hole or a hole. It is characterized in that notches are formed.
[0019]
According to the above configuration, the first land or the second land is partially provided with a defective portion such as a hole or a cut. Due to the presence of the defective portion, a portion not covering the insulating film is formed, so that the stress can be dispersed.
[0020]
As a result, disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0021]
In order to solve the above problems, a tape carrier according to the present invention includes at least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and a first wiring. A tape carrier provided with a through hole provided in an insulating film for electrically connecting the second wiring and the second wiring, and a conductor filling the through hole, wherein the through hole is an end on the first wiring side. Is formed to be larger than the cross-sectional area at the end on the second wiring side.
[0022]
According to the above configuration, in the case where the first wiring side surface is bent outward at or around the through hole portion, the through hole connected to the first land on the mountain side portion when bent. Is larger than the cross-sectional area at the end (end on the second wiring side) of the through-hole connected to the second land on the valley side. Is also wide. This makes it possible to reduce the tensile stress applied to the first land.
[0023]
As a result, disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0024]
In order to solve the above problems, a tape carrier according to the present invention includes at least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and a first wiring. In a tape carrier including a through hole provided in an insulating film to electrically connect the second wiring and the second wiring, and a conductor filling the through hole, the conductor is formed of a conductive paste. It is characterized by:
[0025]
According to the above configuration, when the conductor buried in the through-hole is a plating or metal lump that is not easily deformed when bent, the applied stress is likely to concentrate, but the conductive material having flexibility is used for the conductor. By using the conductive paste, it is possible to reduce the stress at the time of bending at or around the through hole.
[0026]
As a result, disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0027]
An electronic device according to the present invention is an electronic device including a tape carrier having any one of the above configurations and a semiconductor device mounted on the tape carrier, in order to solve the above-described problems. However, it is characterized in that it is bent so that the surface on the side of the first wiring is outside at the portion of the through hole or the periphery thereof.
[0028]
According to the above configuration, even when the tape carrier is bent at or around the through hole, it is possible to supply the tape carrier that does not break the wiring. Accordingly, it is possible to use the tape carrier in various bent shapes in the electronic device, and the electronic device can be downsized.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
[Embodiment 1]
The first embodiment of the present invention will be described below with reference to FIGS. Note that the present invention is not limited to this.
[0030]
As shown in FIG. 1, the tape carrier according to the present invention includes an insulating film 1, a through hole 2, a first land 3a, a second land 3b, a first wiring layer 4a, a second wiring layer 4b, and a semiconductor. A device (chip) 5, a resin layer 6, and a conductor 7 are provided.
[0031]
The insulating film 1 is for disposing the first wiring layer 4a and the second wiring layer 4b on the surface. The insulating film 1 needs to be flexible because it is used in various shapes as well as having insulating properties. For this reason, as a material for forming the insulating film 1, for example, a resin material such as polyimide, glass epoxy, or polyester is used.
[0032]
The through-hole 2 is a hole formed in the insulating film 1 to electrically connect the first wiring layer 4a and the second wiring layer 4b disposed on different surfaces of the insulating film 1 to each other. .
[0033]
The first land 3a and the second land 3b are arranged so as to cover the entire or most of the through hole 2. This is for electrically connecting to the first wiring layer 4a and the second wiring layer 4b on the insulating film 1 through the through holes 2, respectively.
[0034]
The first wiring layer 4a and the second wiring layer 4b are each formed by printing a wiring pattern on the insulating film 1. As the first wiring layer 4a and the second wiring layer 4b, a conductive metal foil such as a copper foil or a silver foil is used.
[0035]
The semiconductor device 5 is connected to the first wiring layer 4a and the second wiring layer 4b, and is used for driving an electronic device.
[0036]
The resin layer 6 connects the first wiring layer 4a and the second wiring layer 4b to the semiconductor device 5, and protects and fixes the connection.
[0037]
The conductor 7 is embedded in the through hole 2 and is for electrically connecting the first land 3a and the second land 3b. As the conductor 7, for example, plating, a metal lump, a conductive paste, or the like is used.
[0038]
In the above configuration, the tape carrier according to the present invention will be specifically described.
[0039]
The main features of the tape carrier according to the present invention are that at least one insulating film 1, a first wiring layer 4 a and a second wiring layer 4 b formed on different surfaces of the insulating film 1, The through-hole 2 provided in the insulating film 1 for electrically connecting the wiring layer 4a and the second wiring 4b, the conductor 7 filling the through-hole 2, and covering all or most of the conductor 7 And a first land 3a and a second land 3b respectively connected to the first wiring layer 4a and the second wiring layer 4b, the first land 3a is The cross-sectional area along a plane parallel to the insulating film 1 is wider than the second land 3b.
[0040]
This makes it possible to prevent the disconnection of the wiring that has occurred around the through hole 2, the first land 3a, and the second land 3b when the tape carrier itself is bent.
[0041]
That is, as shown in FIG. 1, in the tape carrier according to the present invention, the first land 3a arranged on the insulating film 1 is larger than the second land 3b.
[0042]
In general, when the tape carrier is bent, a bending center line 8 at which neither tensile stress nor compressive stress is generated substantially passes through the center of the insulating film 1. Therefore, when the tape carrier is bent at or around the through hole 2 so that the surface on the side of the first wiring 4a is outside, a tensile stress is generated in the first land 3a on the mountain side, and the valley corresponding to the first land 4a is bent. Compressive stress will be generated in the second land 3b on the side portion.
[0043]
Here, when the tape carrier has the above structure, the first lands 3a come into contact with the insulating film 1 in a relatively wide area, so that the adhesion between the first lands 3a and the insulating film 1 is increased. Therefore, as shown in FIG. 2, when the tape carrier is bent at or around the through hole 2, the resistance of the first land 3a to the tensile stress increases, so that disconnection occurs. It becomes difficult. Further, since the second land 3b comes into contact with the insulating film 1 in a relatively narrow area, a wide area in which wiring can be routed can be secured.
[0044]
Note that the larger the area of the first land 3a, the greater the proof stress against tensile stress. For this reason, it is preferable to make the first land 3a as large as possible so that the wiring can be routed.
[0045]
The sizes of the first land 3a and the second land 3b are determined in consideration of the mounting density and the bending resistance.
[0046]
In addition, the first land 3a and the second land 3b may have a circular shape. In this case, the diameter of the first land 3a is larger than the diameter of the second land 3b. Then, the same effect can be obtained.
[0047]
For example, when the thickness of the insulating film 1 of the tape carrier is 25 to 50 μm and the thickness of the first land 3a and the second land 3b and the wiring film 4 is 12 to 18 μm, the diameter of the second land 3b is May be set to about 300 μm and the diameter of the first land 3a may be increased from about 300 μm, or the diameter of the first land 3a may be set to about 300 μm and the diameter of the second land 3b may be reduced to about 300 μm.
[0048]
Further, the diameters need not be changed separately, and the same effect can be naturally obtained by simultaneously changing the diameters of the first land 3a and the second land 3b.
[0049]
[Embodiment 2]
The second embodiment of the present invention will be described below with reference to FIGS. Note that the present invention is not limited to this. Further, for convenience of explanation, members having the same functions as the members used in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
[0050]
The tape carrier of the present embodiment is different from the tape carrier of the first embodiment in that the first land 3a having a larger plane size (cross-sectional area along a plane parallel to the insulating film 1) than the second land 3b is used. , The first land 33a which is thinner than the second land 3b. That is, the main feature of the tape carrier of the present embodiment is that the thickness of the first land 33a is smaller than the thickness of the second land 3b, as shown in FIG.
[0051]
As shown in FIG. 4, when the tape carrier is bent at or around the through hole 2 so that the surface on the side of the first wiring 4a is outside, the tensile stress generated in the first land 33a becomes the bending center. The greater the distance from the line 8, the greater the distance. In the present embodiment, by reducing the thickness of the first land 33a, the distance from the bending center line 8 is reduced, and the tensile stress can be reduced. For example, if the thickness is 5 μm, which can be currently manufactured, the tensile stress can be greatly reduced. Further, by increasing the thickness of the second land 3b, the strength at the time of bending can be increased.
[0052]
Thereby, disconnection of the wiring when the tape carrier is bent at or around the through hole 2 can be prevented.
[0053]
The shape of the first land 33a in the present embodiment is the same as the shape of the first land 3a in the first embodiment, that is, the first land 33a is cut along a plane parallel to the insulating film 1. It is more preferable that the area be larger than the second land 3b.
[0054]
[Embodiment 3]
The third embodiment of the present invention will be described below with reference to FIG. Note that the present invention is not limited to this. Further, for convenience of explanation, members having the same functions as the members used in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
[0055]
The main feature of the present invention is that a concave portion is formed on at least one surface of the first land and the second land in the tape carrier. Specifically, as shown in FIG. 5, the tape carrier of the present embodiment differs from the tape carrier of the first embodiment in that the first land 3a and the second land 3b having different shapes from each other are the same. A first land 23a and a second land 23b having a shape are provided, and the first land 23a and the second land 23b have a shape having concave portions (dents) 24a and 24b.
[0056]
Since the first land 23a has the recess 24a, the surface area of the first land 23a is larger than that of the first land 23a in which the recess is not formed, and there is an extra area or length.
[0057]
For this reason, when the tape carrier is bent by the first land 23a so that the surface on the side of the first wiring 4a is at or outside the through hole 2, the sectional area of the first land 3a is reduced. The effect similar to that of the tape carrier according to the first embodiment in which the width is widened is obtained, and it becomes possible to reduce the tensile stress generated by bending the surplus portion.
[0058]
Thus, disconnection of the wiring when the tape carrier is bent can be prevented.
[0059]
In the present embodiment, the concave portions are formed on both the first land 23a and the second land 23b, but the concave portions are formed only on the first land 23a. Is also good.
[0060]
Further, it is more preferable that the first land 23a and the second land 23b combine the features of the shape of the present embodiment and the shapes of the two embodiments described above.
[0061]
[Embodiment 4]
A fourth embodiment of the present invention will be described below with reference to FIGS. Note that the present invention is not limited to this. Further, for convenience of explanation, members having the same functions as the members used in the first or third embodiment are denoted by the same reference numerals, and description thereof is omitted.
[0062]
The main feature of the present invention is that in the tape carrier, at least one of the first land and the second land is formed with a defective portion that does not cover the conductor, for example, a hole or a cut.
[0063]
Specifically, as shown in FIG. 6, the tape carrier according to the present embodiment is different from the tape carrier according to the third embodiment in that the first land 23a and the second land 23b having the concave portions (depressions) 24a and 24b. , A first land 13a and a second land 13b having a through hole 14a and a through hole 14b are provided. In other words, the first land 13a and the second land 13b have a structure in which the through holes 14a and the through holes 14b are formed as missing portions that do not cover the conductor, and thus have a partially missing structure. The shape does not cover all the holes 2.
[0064]
In general, when both the first land 13a and the second land 13b have no defect and cover the entire through-hole 2, the first land 13a can be bent even at or around the through-hole 2. The tensile stress applied to 3a and the compressive stress applied to second land 3b are not reduced.
[0065]
On the other hand, in the tape carrier of the present embodiment, as shown in FIG. 7, the tape carrier is bent at or around the through hole 2 such that the surface on the first wiring 4a side is outside. However, since the central portion of the first land 13a to which a large tensile stress is applied is missing and the tensile stress can be dispersed, the tensile stress can be reduced. Further, since the central portion of the second land 13b to which a large compressive stress is applied is missing, and the compressive stress can be dispersed, the compressive stress can also be reduced.
[0066]
Therefore, disconnection of the wiring when the tape carrier is bent at or around the through hole 2 can be prevented.
[0067]
In this embodiment, as shown in FIG. 6, both the first land 13a and the second land 13b have the through holes 14a and the through holes 14b, but as shown in FIG. Alternatively, the first land 13a may have a through-hole 14a, and the second land 13b may have a structure without a defect.
[0068]
Further, it is more preferable that the first land 13a and the second land 13b combine the features of the shape of the present embodiment and those of the above-described three embodiments.
[0069]
[Embodiment 5]
The fifth embodiment of the present invention will be described below with reference to FIGS. Note that the present invention is not limited to this. Further, for convenience of explanation, members having the same functions as the members used in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
[0070]
The main feature of the present invention is that at least one insulating film 1, a first wiring layer 4a and a second wiring layer 4b formed on different surfaces of the insulating film 1, a first wiring layer 4a, The same through hole 12 provided in the insulating film 1 for electrically connecting the second wiring layer 4b, the conductor 7 filling the through hole 12, and the same one arranged so as to cover the entire through hole 12 In the tape carrier having the first land 43a and the second land 3b, the cross-sectional area of the through hole 12 at the end on the first wiring layer 4a side is equal to the end area on the second wiring layer 4b side. Is formed so as to be wider than the cross-sectional area of
[0071]
Specifically, as shown in FIG. 8, the through holes 12 have different shapes in cross section at both ends.
[0072]
As a through hole provided in a tape carrier, a through hole having the same cross-sectional area at both ends is generally used, but the through hole 12 has a wide end on the first wiring layer 4a side where a tensile stress is generated. The end portion on the side of the second wiring layer 4b where the compressive stress occurs is narrowed. Accordingly, when the tape carrier is bent so that the surface on the first wiring 4a side is at or around the through hole 12, the tensile stress and the compressive stress with respect to the bending can be reduced.
[0073]
Accordingly, it is possible to prevent disconnection of the wiring when the tape carrier is bent at or around the through hole 12.
[0074]
The through hole 12 is more preferably in a shape such that the sectional area gradually changes, that is, a so-called tapered shape. Thereby, disconnection of the wiring when the tape carrier is bent at or around the through hole 12 can be more effectively prevented.
[0075]
Such a tapered through-hole 12 is formed by, for example, masking one surface and forming the through-hole 12 by etching from the other surface to reduce the diameter of the masked side. Can be.
[0076]
It is more preferable that the tape carrier is a combination of the shape of the present embodiment and the features of the above-described first to fourth embodiments.
[0077]
For example, as shown in FIG. 9, a tape carrier having a through hole 12 according to the present invention and having a first land 3a having a larger cross-sectional area than the second land 3b instead of the first land 43a. Then, when the tape carrier is bent at or around the through hole 12, the effect of relaxing the tensile stress and the compressive stress is increased.
[Embodiment 6]
The sixth embodiment of the present invention is described below with reference to FIG. Note that the present invention is not limited to this. Further, for convenience of explanation, members having the same functions as the members used in Embodiment 1 or 5 are denoted by the same reference numerals, and description thereof is omitted.
[0078]
The tape carrier according to the present embodiment is different from the tape carrier according to the fifth embodiment in that a through-hole 2 having the same cross-sectional area at both ends is provided instead of the through-hole 12 having a different cross-sectional area at both ends. The body is formed of the conductive paste 17.
[0079]
In general, the conductor 7 embedded in the through hole 2 for electrically connecting the first wiring layer 4a and the second wiring layer 4b disposed on different surfaces is formed by plating or metal lump. And it is difficult to deform and easily receives stress.
[0080]
On the other hand, in the present embodiment, as shown in FIG. 10, by embedding a flexible conductive paste 17 that is easily deformable as a conductor in the through-hole 2, the tape carrier can be connected to the portion of the through-hole 2 or The stress applied when bending around the periphery can be reduced.
[0081]
The conductive paste 17 is a mixture of a thermosetting resin and a metal. For example, there is a conductive paste 17 in which silver as a metal is filled as a filler in an epoxy resin as a thermosetting resin.
[0082]
In the present embodiment, an uncured thermosetting resin is used as the conductive paste 17. When the thermosetting resin is cured, the conductive paste 17 has the same flexibility as that of a conventional conductor (metal or plating), whereas when not cured, the conductive paste 17 has greater flexibility. it can.
[0083]
Thereby, disconnection of the wiring when the tape carrier is bent at or around the through hole 2 can be prevented.
[0084]
Also, in the configuration according to the present embodiment, it is more preferable to use a tape carrier that combines the features of the first to fifth embodiments described above.
[0085]
[Embodiment 7]
The following will describe the seventh embodiment of the present invention. Note that the present invention is not limited to this.
[0086]
The main feature of the present invention is that, in the electronic device provided with the tape carrier according to the first to sixth embodiments, as shown in FIGS. At the first wiring side.
[0087]
Specifically, a tape carrier having the features of Embodiments 1 to 6 is used, and the first wiring side surface is set to the outside in order to reduce the size and increase the density of the electronic device. This is an electronic device in which a bent tape carrier is arranged.
[0088]
Further, the tape carrier used in the electronic device according to the present invention is not limited to any one of the tape carriers in the first to sixth embodiments, and may be a tape carrier combining the respective features.
[0089]
In all of the above-described embodiments, an example in which the first land 3a and the second land 3b, the first wiring layer 4a, and the second wiring layer 4b are provided on both surfaces of one insulating film will be described. However, the present invention is not limited to this, and may be a multilayer film substrate in which the insulating film 1 is multilayered, and not to mention the lands on the front and back (both sides) of the multilayer film substrate, The land may be formed inside the film substrate.
[0090]
For example, as a structure of a multilayer wiring type tape carrier used for improving the mounting density, it can be used for a tape carrier of a type in which front and rear wirings are connected by through holes such as general through holes and blind vias.
[0091]
Further, the tape carrier of the present invention has a wiring pattern on both surfaces of the insulating film layer, and the insulating film layer has a through hole filled with a conductive substance for electrically connecting the wiring pattern on both surfaces. A tape carrier provided with a land for connecting the wiring pattern from the through hole, wherein the land diameter of the land is completely covered with different land diameters on both surfaces of the insulating film layer. May be.
[0092]
This can prevent the disconnection of the wiring when the tape carrier is bent at or around the through hole.
[0093]
The tape carrier of the present invention has a wiring pattern on both sides of the insulating film layer, the insulating film layer has a through hole filled with a conductive substance for electrically connecting the wiring pattern on both sides, In a tape carrier provided with a land for connecting the wiring pattern from the through hole, the surface of the land is completely covered by a land having a depression that is not the same surface as the wiring pattern. A configuration may be used.
[0094]
This can prevent the disconnection of the wiring when the tape carrier is bent at or around the through hole.
[0095]
The tape carrier of the present invention has a wiring pattern on both sides of the insulating film layer, the insulating film layer has a through hole filled with a conductive substance for electrically connecting the wiring pattern on both sides, In a tape carrier provided with a land for connecting the wiring pattern from the through hole, when the insulating film layer is bent, the wiring pattern thickness coming outside and the wiring pattern thickness coming inside the land thickness. Alternatively, the thickness may be smaller than the land thickness.
[0096]
This can prevent the disconnection of the wiring when the tape carrier is bent at or around the through hole.
[0097]
According to the present invention described above, in the double-sided wiring COF (or SOF) having wirings on both layers of the insulating film, there is a possibility that the wirings on both sides may be bent when the wirings are bent around the through holes for electrically connecting. A certain disconnection can be prevented, and a highly reliable tape carrier can be obtained.
[0098]
Further, since it does not cause a cost increase, it can be obtained as an inexpensive tape carrier.
[0099]
Furthermore, since the bending reliability is high and can be reliably realized, it is possible to obtain a tape carrier suitable for a small portable device having a high mounting density with a high degree of freedom in design.
[0100]
【The invention's effect】
As described above, in the tape carrier according to the present invention, the first land has a configuration in which the cross-sectional area along the plane parallel to the insulating film is wider than the second land.
[0101]
Thereby, when the first wiring side surface is bent outward at the through hole portion or its peripheral portion, the adhesion between the first land and the insulator is increased, and the ridge side generated at the time of bending is increased. The resistance of the first land to the tensile stress applied to the first land of the part is increased. As a result, the configuration described above has an effect of preventing disconnection of wiring when the tape carrier is bent at or around the through hole.
[0102]
As described above, the tape carrier according to the present invention has a configuration in which the thickness of the first land is smaller than the thickness of the second land.
[0103]
Accordingly, the radius of curvature of the surface of the first land when the first wiring is bent so that the surface on the side of the first wiring at the through hole portion or the peripheral portion thereof is outside is reduced. As the thickness of the first land increases, the tensile stress applied when the first land is bent increases. Therefore, the tensile stress applied is reduced by reducing the radius of curvature by thinning the first land. As a result, the configuration described above has an effect of preventing disconnection of wiring when the tape carrier is bent at or around the through hole.
[0104]
As described above, the tape carrier according to the present invention has a configuration in which the concave portion is formed on at least one surface of the first land and the second land.
[0105]
This increases the surface area of at least one of the first land and the second land. Therefore, the same effect as when the cross-sectional area of the land along the plane parallel to the insulating film is widened is obtained, and the stress applied to at least one of the first land and the second land during bending is reduced. It is possible to ease. Therefore, the configuration described above has an effect of preventing disconnection of wiring when the tape carrier is bent at or around the through hole.
[0106]
As described above, the tape carrier according to the present invention has a configuration in which at least one of the first land and the second land is formed with a defective portion that does not cover the conductor.
[0107]
Thereby, since a portion that does not cover the insulating film is formed due to the formation of the defective portion, the stress can be dispersed. Therefore, the configuration described above has an effect of preventing disconnection of wiring when the tape carrier is bent at or around the through hole.
[0108]
As described above, in the tape carrier according to the present invention, the through-hole is formed such that the cross-sectional area at the end on the first wiring side is larger than the cross-sectional area at the end on the second wiring side. Configuration.
[0109]
Thereby, the cross-sectional area at the end of the through hole connected to the first land (the end on the first wiring side) is changed to the end of the through hole connected to the second land (the second end). (The end on the wiring side). Thereby, the tensile stress applied to the first land can be reduced. Therefore, the above configuration has an effect that the disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0110]
As described above, the tape carrier according to the present invention has a configuration in which the conductor filled in the through hole is formed of a conductive paste.
[0111]
Thus, by using a flexible conductive paste for the conductor, it is possible to alleviate the stress at the time of bending at or around the through hole. Therefore, the above configuration has an effect that the disconnection of the wiring when the tape carrier is bent at or around the through hole can be prevented.
[0112]
An electronic device according to the present invention is an electronic device including a tape carrier having any one of the above-described configurations and a semiconductor device mounted on the tape carrier, wherein the tape carrier has a through-hole portion or a periphery thereof. In this configuration, the first wiring side is bent so that the surface on the side of the first wiring is outside.
[0113]
Thus, it is possible to use the tape carrier in various bent shapes, and it is possible to reduce the size of the electronic device.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a tape carrier in which lands having different cross-sectional areas are arranged according to an embodiment of the present invention.
FIG. 2 is a sectional view of the tape carrier shown in FIG. 1 when it is bent.
FIG. 3 is a cross-sectional view of a tape carrier in which lands having different thicknesses are arranged according to an embodiment of the present invention.
4 is a cross-sectional view of the tape carrier shown in FIG. 3 when it is bent.
FIG. 5 is a cross-sectional view of a tape carrier on which lands on which concave portions are formed are arranged according to an embodiment of the present invention.
FIG. 6 is a cross-sectional view of a tape carrier on which a land in which a defective portion that does not cover a conductor is formed is arranged according to an embodiment of the present invention.
FIG. 7 is a cross-sectional view of a tape carrier formed on a land arranged on a first wiring side, where a defective portion that does not cover a conductor according to an embodiment of the present invention is bent.
FIG. 8 has a through-hole formed so that the cross-sectional area at the end on the first wiring side is larger than the cross-sectional area at the end on the second wiring side in one embodiment of the present invention; It is sectional drawing of a tape carrier.
9 is a cross-sectional view of the tape carrier in which lands having different cross-sectional areas according to one embodiment of the present invention are arranged on the tape carrier shown in FIG. 8;
FIG. 10 is a cross-sectional view of a tape carrier in which a flexible conductive material is embedded in a through hole according to an embodiment of the present invention.
FIG. 11 is a sectional view showing a conventional tape carrier.
[Explanation of symbols]
1 insulating film
2 Through hole
3a First land
3b Second land
4a First Wiring Layer
4b Second wiring layer
5 Semiconductor devices
6 resin layer
7 Conductor
8 Bending center line
9a First Wiring End
9b End of second wiring side
12 Through hole
13a First land
13b Second land
14a Through-hole (defective part)
14b Through-hole (defect)
17 Conductive paste (conductor)
23a first land
23b 2nd land
24a recess
24b recess
33a first land
43a first land
51 Insulating film
52 Through hole
53 Land
54 Wiring layer
55 Semiconductor Device
56 resin layer
57 Conductor

Claims (7)

At least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and an insulating film for electrically connecting the first wiring and the second wiring. A through hole provided; a conductor filling the through hole; a first land and a second land formed to cover the conductor and connected to the first wiring and the second wiring, respectively. In a tape carrier comprising
A tape carrier, wherein the first land has a larger cross-sectional area along a plane parallel to the insulating film than the second land. At least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and an insulating film for electrically connecting the first wiring and the second wiring. A through hole provided; a conductor filling the through hole; a first land and a second land formed to cover the conductor and connected to the first wiring and the second wiring, respectively. In a tape carrier comprising
The thickness of the first land is smaller than the thickness of the second land. At least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and an insulating film for electrically connecting the first wiring and the second wiring. A through hole provided; a conductor filling the through hole; a first land and a second land formed to cover the conductor and connected to the first wiring and the second wiring, respectively. In a tape carrier comprising
A tape carrier, wherein a concave portion is formed on at least a surface of the first land. At least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and an insulating film for electrically connecting the first wiring and the second wiring. A through hole provided; a conductor filling the through hole; a first land and a second land formed to cover the conductor and connected to the first wiring and the second wiring, respectively. In a tape carrier comprising
A tape carrier, characterized in that at least one of the first land and the second land is provided with a defect that does not cover the conductor. At least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and an insulating film for electrically connecting the first wiring and the second wiring. In a tape carrier including a provided through hole and a conductor filling the through hole,
The tape carrier, wherein the through hole is formed such that a cross-sectional area at an end on a first wiring side is larger than a cross-sectional area at an end on a second wiring side. At least one insulating film, a first wiring and a second wiring formed on different surfaces of the insulating film, and an insulating film for electrically connecting the first wiring and the second wiring. In a tape carrier including a provided through hole and a conductor filling the through hole,
A tape carrier, wherein the conductor is formed of a conductive paste. An electronic apparatus comprising: the tape carrier according to any one of claims 1 to 6; and a semiconductor device mounted on the tape carrier.
An electronic device, wherein the tape carrier is bent so that a surface on a first wiring side is outside at a through hole portion or a peripheral portion thereof.

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