JP2004013733A - Non-contact data carrier and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact data carrier and its manufacturing method for simplifying a manufacturing process and improving mechanical strength. <P>SOLUTION: An antenna pattern is printed on an inlet sheet 12 with a silver paste. An IC module 24 is mounted on IC module connection parts 18, 20 of the antenna pattern. At that time, the IC module 24 is depressed toward the inlet sheet 12 at a certain extent that the silver paste protrudes from through holes 34, 36 bored in antenna connection terminal parts 30, 32 of the IC module 24. After that, the printing antenna is completed by thermally hardening the silver paste and the IC module 24 is connected to the printing antenna mechanically and electrically. Thus, the non-contact IC card (data carrier) is manufactured where the printing antenna and the IC module 24 are directly connected without other binding material. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a contactless data carrier and a method for manufacturing the same.
[0002]
[Prior art]
A non-contact IC card, which is a type of non-contact data carrier, literally exchanges data with a terminal device in a non-contact manner via radio waves. Therefore, the non-contact type IC card has high reliability because there is no defect caused by the contact of the contact type IC card having a contact with a terminal device, for example, a contact failure due to scratches or dirt on the contact. In recent years, attention has been paid to the fact that there is no need to insert a terminal into a slot of a terminal device, which is convenient.
[0003]
A non-contact IC card has a coil antenna for transmitting / receiving data to / from a terminal device and an IC chip (so-called bare chip) for storing and processing data. The coil antenna and the IC chip are arranged, for example, on a resin sheet called an inlet sheet, and a resin sheet called an overlay sheet is laminated on both surfaces of the inlet sheet to form a card shape. Have been.
[0004]
The non-contact IC card having the above configuration is manufactured by the following steps.
First, silver paste is printed on the inlet sheet surface in a coil shape.
Next, the inlet sheet on which the silver paste is printed is heated in a heating furnace to cure the silver paste. Thereby, the coil antenna is completed.
[0005]
An ACF (Anisotropic Conductive Film), which is a bonding material, is arranged at both ends of the coil antenna (the bonding position with the IC chip) on the inlet sheet on which the coil antenna is formed.
Subsequently, the IC chip on which the bump is formed is arranged on the coil antenna via the ACF with the bump side facing down.
[0006]
Then, while the IC chip is pressed toward the coil antenna, the IC chip and the coil antenna are joined by locally heating and curing from under the inlet sheet.
Thereafter, the overlay sheet is thermocompression bonded to both sides of the inlet sheet.
[0007]
[Problems to be solved by the invention]
However, according to the above-mentioned conventional manufacturing method, silver paste printing → silver paste heating and curing (coil antenna completion) → ACF arrangement → IC chip arrangement → IC chip from the antenna fabrication to the completion of connection between the antenna and the IC chip. In addition to having many steps such as pressurization and ACF heat curing, the cost is high because ACF is required as a bonding material. In addition, the conventional non-contact IC card uses the IC chip as it is (as a bare chip), and thus has a problem that the mechanical strength is insufficient and the card is easily damaged by bending the card.
[0008]
The present invention has been made in view of the above problems, and has as its object to provide a non-contact data carrier in which a manufacturing process can be further simplified and mechanical strength is improved, and a manufacturing method thereof.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, a non-contact data carrier according to the present invention includes an IC module in which an IC chip is mounted on a lead frame, and an antenna in which at least a connection portion with the IC module is formed by printing. And a pair of antenna connection terminal portions of the lead frame and the connection portion of the antenna are directly joined without any other joining material.
[0010]
Further, the antenna connection terminal portion is plated with a metal having good compatibility with a printed portion of the antenna.
Further, the printed portion of the antenna is obtained by heating and curing a silver paste containing silver, and the antenna connection terminal portion is silver-plated.
[0011]
Further, the antenna connection terminal portion has at least one hole, and a part of a material forming the connection portion enters the hole.
In order to achieve the above object, a method for manufacturing a non-contact data carrier according to the present invention includes: a printing step of printing an electrically conductive paste to form an antenna pattern; An IC module mounting step of arranging the IC module mounted on the lead frame such that a pair of antenna connection terminal portions of the lead frame are in close contact with a corresponding connection portion of the antenna pattern; and heating and curing the printed antenna pattern. And a heating step.
[0012]
Further, the antenna connection terminal portion has at least one hole, and in the IC module arranging step, the IC module is pressed against the antenna pattern with a force at least such that the paste enters the hole. It is characterized by.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a non-contact data carrier according to the present invention will be described with reference to the drawings, taking a non-contact IC card as an example.
FIG. 1 is a perspective view of a non-contact IC card 10 according to an embodiment, in which a part of an overlay sheet 38 described later is cut away.
[0014]
The non-contact IC card 10 has an inlet sheet 12 made of a resin sheet. In addition, the thing made from PET-G is used for a resin sheet, for example.
The non-contact IC card 10 has an antenna (hereinafter, referred to as a “print antenna”) 14 which is mostly printed on the surface of the inlet sheet 12. The printed portion of the printed antenna 14 on the surface of the inlet sheet 12 includes a portion printed in a coil shape (hereinafter, referred to as a “coil pattern portion”) 16 and a portion 18 printed in a strip shape. One end portion 20 of the coil pattern portion 16 and the portion 18 printed in a strip form a connection portion with an IC module 24 described later. Hereinafter, the portion indicated by reference numerals 18 and 20 is referred to as an IC module connection portion. The IC module connection portion 18 and the other end portion 22 of the coil pattern portion 16 are connected to a through hole formed in the inlet sheet 12 and a jumper wire 44 formed on the back surface of the inlet sheet 12 as described later. (FIG. 3), they are electrically connected.
[0015]
The non-contact IC card 10 has an IC module 24, and the IC module 24 is connected to both IC module connecting portions 18 and 20 of the print antenna 14.
FIG. 2 is an enlarged perspective view of the IC module 24.
The IC module 24 includes at least an IC chip (so-called bare chip) (not shown) and a lead frame 26. The IC module 24 according to the present embodiment is manufactured by mounting an IC chip on a lead frame 26 by a wire bonding method, and then molding the IC chip with a synthetic resin by transfer molding. FIG. 2 shows the mold portion (28) (the IC chip is hidden inside the mold 28 and does not appear in the drawing). The IC module to be used is not limited to the IC chip mounted on the lead frame by the wire bonding method, but may be a flip chip method. That is, a method in which a bump is formed on the surface of an IC chip and the bump portion is bonded (mounted) to a lead frame via a bonding material such as ACF may be used.
[0016]
The IC chip is composed of a semiconductor integrated circuit that processes and stores information, and has a function of communicating with an external terminal device in addition to the processing and storage of the information.
The communication is performed via the print antenna 14. Further, power for driving the semiconductor integrated circuit is also supplied via the print antenna 14.
The electrical connection between the IC chip and the print antenna 14 is made via the lead frame 26. Therefore, the lead frame 26 is divided into at least two parts in an electrically insulating manner, and each of the divided parts projecting from the mold 28 is connected to (joined to) the printed antenna 14 by a terminal part (hereinafter, referred to as an “antenna”). Connection terminal section ").
[0017]
In the lead frame 26, at least the antenna terminal portions 30 and 32 are plated with silver, and the antenna terminal portions 30 and 32 are provided with through holes 34 and 36, respectively. Of course, the lead frame 26 may be entirely plated with silver.
Returning to FIG. 1, overlay sheets 38 and 40, which are also made of resin sheets, are attached to both sides of the inlet sheet 12 on which the printed antenna 14 and the IC module 24 are arranged.
[0018]
A method of manufacturing the non-contact IC card 10 having the above configuration will be described with reference to FIGS. 3 and 4 and FIG. 5 showing manufacturing steps.
First, the antenna pattern 42 is printed on the surface of the inlet sheet 12 using a silver paste by a screen printing device as shown in FIG. The antenna pattern 42 is a pattern corresponding to the coil pattern section 16 and the IC module connection section 18. The silver paste is a paste in which silver powder, which is a conductive substance, a solvent and a synthetic resin are mixed. Prior to this step, through-holes are provided at predetermined positions of the inlet sheet 12 corresponding to the formation area of the one end 22 of the coil pattern section 16 and the formation area of the IC module connection section 18, respectively. A hole (not shown) is formed. Further, a jumper wire 44 is printed on the back surface of the inlet sheet 12 in a form of a strip, as shown by a broken line, so as to connect both through holes.
[0019]
When the antenna pattern 42 is printed on the surface of the inlet sheet 12, the IC module 24 is placed on the inlet sheet 12 (on the antenna pattern 42) by an IC module mounting device (not shown) as shown in FIG. Mounted on. At this time, the IC module 24 is not merely placed on the antenna pattern 42, but is also pressed against the inlet sheet 12 and thus the antenna pattern 42 with a predetermined magnitude of force (arrow 46). The predetermined size is such that the viscous silver paste at least enters the through holes 34 and 36. By doing so, it is possible to prevent the displacement of the IC module when the inlet sheet 12 is transported to the next step. Further, as shown in FIGS. 4A and 4B, the silver paste overflows from the through holes 34 and 36 and is pressed with a force enough to protrude to the surface (upper surface) of the antenna connection terminal portions 30 and 32. It may be. FIG. 4B is a cross-sectional view in which the antenna terminal connection portion 30 or 32 in the IC module 24 after the pressing is cut along a cross section including the through hole 34 or 36.
[0020]
The inlet sheet 12 on which the IC module 24 is mounted is transferred to a heating furnace (not shown) and heated at a temperature of about 110 ° C. in the heating furnace. By the heating, the silver paste is dried and hardened to complete the printed antenna 14, and the mechanical and electrical connection between the IC module connecting portions 18 and 20 of the printed antenna 14 and the antenna connecting terminal portions 32 and 30 of the IC module 24. Connection is made.
[0021]
At this time, since the antenna connection terminals 30 and 32 are plated with silver, which is the same material as silver as the main component of the silver paste, higher bonding strength can be obtained. In addition, since the silver paste (part of the IC module connection portions 18 and 20) enters the through holes 34 and 36, the silver paste is hardened, so that a high bonding strength can be obtained. Further, when the silver paste is hardened while protruding from the surfaces (upper surfaces) of the antenna connection terminal portions 30 and 32 (FIG. 4B), the protruding portion serves as a stopper for preventing the IC module 24 from falling off. It plays a role and further increases the bonding strength.
[0022]
When the bonding (connection) of the IC module 24 is completed, the overlay sheets 38 and 40 (FIG. 1) are thermocompression-bonded to the inlet sheet 12 by a laminating apparatus (not shown), and the non-contact IC card 10 is almost completed.
All known devices are used for the printing device used for the screen printing, the mounting device for disposing the IC module on the inlet sheet (on the antenna pattern), the heating furnace for curing the silver paste, and the laminating device. It is possible.
[0023]
As described above, according to the present embodiment, since the curing of the silver paste and the connection of the IC module and the printed antenna are performed in the same process, a comparison is made with the conventional manufacturing method in which these processes are individually performed. Thus, the manufacturing process can be simplified.
In addition, since the silver paste serving as the printed antenna also serves as a bonding material with the IC module, a non-contact IC card can be manufactured at a lower cost as compared with the related art that requires a separate bonding material (ACF or the like). Further, the step of arranging the ACF and the like is not required, so that the manufacturing process can be simplified.
[0024]
Further, since the IC chip is not used as it is (as a bare chip) but is used as a module, the mechanical strength against card bending and the like is improved as compared with the IC chip used as it is.
Although the present invention has been described based on the embodiments, the present invention is not limited to the above embodiments, and may be, for example, as follows.
(1) The number of through holes formed in each antenna terminal connection is not limited to one. The number may be two or more.
(2) Further, the antenna terminal connection portion does not necessarily need to be provided with a through hole. It has been confirmed that even when no through-hole is provided, the IC module and the printed antenna can be joined with sufficient strength without any problem when used as an IC card. Also in this case, when the IC module is mounted on the antenna pattern, the lead frame (antenna connection terminal portion) of the IC module is at least sunk into the silver paste. It is preferable to press the IC module so as to be in close contact with the module connection portion.
(3) The printing of the antenna is not limited to silver paste. For example, a copper paste containing copper may be used. In short, any conductive paste that can be used as an antenna and that is used after being cured in a post-printing process may be used.
[0025]
When a paste other than the silver paste is used, the base material of the lead frame is plated with a metal of the same type as the main component of the other paste, that is, a metal that is compatible with the main component of the printed antenna. It is preferable to keep it. As described above, this is for further increasing the bonding strength between the lead frame and the printed antenna. Of course, if the base material of the lead frame itself is a metal having good compatibility with the main component of the paste, plating is not necessarily required.
(4) The number of divisions of the lead frame is not limited to two. Three or more divisions may be used. For example, a capacitor may be provided on the inlet sheet, and when the IC chip is connected to the capacitor, a terminal portion for connecting the capacitor is added. In this case, the lead frame is divided into four parts.
(5) The non-contact IC card according to the above-described embodiment is of a type in which drive power is externally supplied via a print antenna. However, the present invention is also applicable to a non-contact IC card with a built-in battery. It goes without saying that it is applicable.
[0026]
【The invention's effect】
As described above, according to the non-contact data carrier according to the present invention, the pair of antenna connection terminals in the lead frame on which the IC chip is mounted and the connection formed by printing the antenna are connected to each other. Since they are directly joined without any intervening material, the step of arranging and curing the other joining materials can be omitted, and the manufacturing process can be further simplified. Further, since the IC chip is used while mounted on a lead frame, the lead frame serves as a kind of reinforcing material for the IC chip, and the mechanical strength of the non-contact data carrier is improved.
[0027]
Further, according to the method for manufacturing a non-contact data carrier according to the present invention, a pair of antenna connection terminals in a lead frame of an IC module is connected to a corresponding connection of an antenna pattern on which conductive paste is printed. After being placed in close contact with each other, the printed antenna pattern is subjected to a heating process. In the heating process, the antenna is completed and, at the same time, the antenna and the IC module are directly joined without any other joining material. It becomes. Therefore, the same effect as described above can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view of a non-contact IC card according to an embodiment, with a part of an overlay sheet cut away.
FIG. 2 is an enlarged perspective view of an IC module.
FIG. 3 is a diagram showing an antenna pattern printed on an inlet sheet.
FIG. 4A is a perspective view showing an IC module mounted on an inlet sheet (on an antenna pattern).
FIG. 2B is a cross-sectional view of the antenna terminal connection portion of the IC module cut along a cross section including a through hole.
FIG. 5 is a view showing a part of a manufacturing process of the non-contact IC card.
[Explanation of symbols]
Reference Signs List 10 Non-contact IC card 14 Printed antenna 18, 20 IC module connection part 24 IC module 26 Lead frame 34, 36 Through hole 42 Antenna pattern

Claims (6)

An IC module having an IC chip mounted on a lead frame;
An antenna in which at least a connection with the IC module is formed by printing;
Has,
A non-contact data carrier, wherein a pair of antenna connection terminal portions of the lead frame and the connection portion of the antenna are directly joined without interposing any other joining material. 2. The non-contact data carrier according to claim 1, wherein the antenna connection terminal is plated with a metal having good compatibility with a printed portion of the antenna. The printed portion of the antenna is obtained by heating and curing a silver paste containing silver,
The non-contact data carrier according to claim 2, wherein the antenna connection terminal portion is silver-plated. The antenna connection terminal according to any one of claims 1 to 3, wherein the antenna connection terminal has at least one hole, and a part of a material forming the connection enters the hole. A contactless data carrier as described. A printing step of printing an electrically conductive paste to form an antenna pattern,
An IC module arranging step of arranging an IC module in which an IC chip is mounted on a lead frame with respect to the antenna pattern so that a pair of antenna connection terminals of the lead frame are in close contact with corresponding connection portions of the antenna pattern; ,
A heating step of heating and curing the printed antenna pattern,
A method for manufacturing a non-contact data carrier, comprising: The antenna connection terminal has at least one hole,
In the IC module arranging step,
6. The method according to claim 5, wherein the IC module is pressed against the antenna pattern with a force at which the paste at least enters the holes.

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