JP2004004039A - 電子システムにおける被給電要素に関する電流特性を求めるためのテスト方法 - Google Patents

電子システムにおける被給電要素に関する電流特性を求めるためのテスト方法 Download PDF

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Publication number
JP2004004039A
JP2004004039A JP2003107773A JP2003107773A JP2004004039A JP 2004004039 A JP2004004039 A JP 2004004039A JP 2003107773 A JP2003107773 A JP 2003107773A JP 2003107773 A JP2003107773 A JP 2003107773A JP 2004004039 A JP2004004039 A JP 2004004039A
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JP
Japan
Prior art keywords
current
printed circuit
circuit board
power
electronic system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003107773A
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English (en)
Japanese (ja)
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JP2004004039A5 (enExample
Inventor
Christian L Belady
クリスチャン・エル・ベラディ
Stuart C Haden
スチュアート・シー・ヘイデン
Paul A Wirtzberger
ポール・エイ・ウィッツバーガー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JP2004004039A publication Critical patent/JP2004004039A/ja
Publication of JP2004004039A5 publication Critical patent/JP2004004039A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
    • G01R15/181—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers using coils without a magnetic core, e.g. Rogowski coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Measurement Of Current Or Voltage (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2003107773A 2002-04-12 2003-04-11 電子システムにおける被給電要素に関する電流特性を求めるためのテスト方法 Withdrawn JP2004004039A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/121,356 US6825651B2 (en) 2002-04-12 2002-04-12 Test method for characterizing currents associated with powered components in an electronic system

Publications (2)

Publication Number Publication Date
JP2004004039A true JP2004004039A (ja) 2004-01-08
JP2004004039A5 JP2004004039A5 (enExample) 2006-06-15

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ID=28790311

Family Applications (1)

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JP2003107773A Withdrawn JP2004004039A (ja) 2002-04-12 2003-04-11 電子システムにおける被給電要素に関する電流特性を求めるためのテスト方法

Country Status (2)

Country Link
US (1) US6825651B2 (enExample)
JP (1) JP2004004039A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103064010A (zh) * 2013-01-08 2013-04-24 浙江大学 基于希尔伯特-黄变换的模拟电路故障元件参数估计方法
JP5770720B2 (ja) * 2010-05-19 2015-08-26 パナソニック株式会社 Ｉｃ電流測定用装置、及びｉｃ電流測定用アダプタ

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6930872B2 (en) * 2001-05-16 2005-08-16 John Mezzalingua Associates, Inc. Spark gap device
US7420794B2 (en) * 2001-05-16 2008-09-02 John Mezzalingua Associates, Inc. Compact spark gap for surge protection of electrical componentry
US7532000B2 (en) 2006-08-03 2009-05-12 The Boeing Company Method and system for measurement of current flows in fastener arrays
RU2499374C2 (ru) * 2012-01-24 2013-11-20 Общество с ограниченной ответственностью "Тегас Электрик" Плата печатная
KR20150052563A (ko) * 2013-11-06 2015-05-14 삼성전자주식회사 검사 장치 및 방법
US9651585B2 (en) * 2013-12-18 2017-05-16 National Instruments Corporation Via layout techniques for improved low current measurements
FR3089539B1 (fr) * 2018-12-10 2021-04-09 Continental Automotive France Poignée de portière avec des moyens de réduction d’un rayonnement en communication ultra haute fréquence
DE102019121980A1 (de) * 2019-01-22 2020-07-23 Roman Nachsel Hochstrom-Bauelement
CN113777387B (zh) * 2021-11-11 2022-02-15 武汉精熔潮电气科技有限公司 基于无铁芯的霍尔检测导体稳态瞬态电流的方法及其应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
JP3214766B2 (ja) * 1992-08-06 2001-10-02 アジレント・テクノロジーズ・インク 接続検査のための装置
US5888837A (en) * 1996-04-16 1999-03-30 General Electric Company Chip burn-in and test structure and method
US6087842A (en) * 1996-04-29 2000-07-11 Agilent Technologies Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
KR19980015274A (ko) * 1996-08-20 1998-05-25 김광호 모터의 이상상태 감지장치 및 이상상태 감지방법
JPH11223505A (ja) * 1997-12-03 1999-08-17 Mitsutoyo Corp 誘導型位置測定装置
JP2000099551A (ja) * 1998-09-18 2000-04-07 Sony Corp 集積回路の電流見積装置およびその方法
US6504392B2 (en) * 1999-03-26 2003-01-07 International Business Machines Corporation Actively controlled heat sink for convective burn-in oven
TW484249B (en) * 2000-10-20 2002-04-21 Hon Hai Prec Ind Co Ltd Antenna module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5770720B2 (ja) * 2010-05-19 2015-08-26 パナソニック株式会社 Ｉｃ電流測定用装置、及びｉｃ電流測定用アダプタ
CN103064010A (zh) * 2013-01-08 2013-04-24 浙江大学 基于希尔伯特-黄变换的模拟电路故障元件参数估计方法
CN103064010B (zh) * 2013-01-08 2015-04-15 浙江大学 基于希尔伯特-黄变换的模拟电路故障元件参数估计方法

Also Published As

Publication number Publication date
US6825651B2 (en) 2004-11-30
US20030193326A1 (en) 2003-10-16

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