JP2003512526A5 - - Google Patents
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- Publication number
- JP2003512526A5 JP2003512526A5 JP2001532257A JP2001532257A JP2003512526A5 JP 2003512526 A5 JP2003512526 A5 JP 2003512526A5 JP 2001532257 A JP2001532257 A JP 2001532257A JP 2001532257 A JP2001532257 A JP 2001532257A JP 2003512526 A5 JP2003512526 A5 JP 2003512526A5
- Authority
- JP
- Japan
- Prior art keywords
- winding
- tap
- transformer
- substrate
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 description 22
- 238000004544 sputter deposition Methods 0.000 description 17
- 239000000758 substrate Substances 0.000 description 17
- 210000002381 Plasma Anatomy 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 241000255925 Diptera Species 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15989699P | 1999-10-15 | 1999-10-15 | |
US60/159,896 | 1999-10-15 | ||
PCT/US2000/028482 WO2001029278A1 (fr) | 1999-10-15 | 2000-10-13 | Technique et dispositif de polarisation du substrat dans des systemes de pulverisation a electrodes in multiples |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003512526A JP2003512526A (ja) | 2003-04-02 |
JP2003512526A5 true JP2003512526A5 (fr) | 2007-11-22 |
Family
ID=22574565
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001532257A Pending JP2003512526A (ja) | 1999-10-15 | 2000-10-13 | 複数の電極のスパッタリングシステムにおいて基板にバイアスをかける方法および装置 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1235947A4 (fr) |
JP (1) | JP2003512526A (fr) |
KR (1) | KR20020040875A (fr) |
WO (1) | WO2001029278A1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6818103B1 (en) | 1999-10-15 | 2004-11-16 | Advanced Energy Industries, Inc. | Method and apparatus for substrate biasing in multiple electrode sputtering systems |
US7179350B2 (en) | 2003-05-23 | 2007-02-20 | Tegal Corporation | Reactive sputtering of silicon nitride films by RF supported DC magnetron |
US8691057B2 (en) | 2008-03-25 | 2014-04-08 | Oem Group | Stress adjustment in reactive sputtering |
DE102008060838A1 (de) | 2008-12-05 | 2010-06-10 | Zounek, Alexis, Dr. | Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens |
US8482375B2 (en) | 2009-05-24 | 2013-07-09 | Oem Group, Inc. | Sputter deposition of cermet resistor films with low temperature coefficient of resistance |
RU2540318C2 (ru) * | 2013-03-18 | 2015-02-10 | Федеральное государственное унитарное предприятие "Научно-производственное предприятие "Исток" (ФГУП "НПП "Исток") | Устройство для ионно-плазменного травления и нанесения тонких пленок |
RU2562568C2 (ru) * | 2013-06-18 | 2015-09-10 | Виталий Степанович Гончаров | Установка для вакуумного ионно-плазменного нанесения покрытий |
JP6458206B1 (ja) | 2017-06-27 | 2019-01-23 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
KR20220031132A (ko) | 2017-06-27 | 2022-03-11 | 캐논 아네르바 가부시키가이샤 | 플라스마 처리 장치 |
TWI690244B (zh) * | 2017-06-27 | 2020-04-01 | 日商佳能安內華股份有限公司 | 電漿處理裝置 |
TWI693860B (zh) | 2017-06-27 | 2020-05-11 | 日商佳能安內華股份有限公司 | 電漿處理裝置 |
WO2019003309A1 (fr) | 2017-06-27 | 2019-01-03 | キヤノンアネルバ株式会社 | Dispositif de traitement par plasma |
SG11202009122YA (en) | 2018-06-26 | 2020-10-29 | Canon Anelva Corp | Plasma processing apparatus, plasma processing method, program, and memory medium |
KR102512057B1 (ko) * | 2020-12-29 | 2023-03-20 | 주식회사 더블유에스지 | 비접촉식 전해연마 공정을 포함하는 강관의 제조방법, 이로부터 제조되는 강관 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4693805A (en) * | 1986-02-14 | 1987-09-15 | Boe Limited | Method and apparatus for sputtering a dielectric target or for reactive sputtering |
DE4042287C2 (de) * | 1990-12-31 | 1999-10-28 | Leybold Ag | Vorrichtung zum reaktiven Aufstäuben von elektrisch isolierendem Werkstoff |
US5415757A (en) * | 1991-11-26 | 1995-05-16 | Leybold Aktiengesellschaft | Apparatus for coating a substrate with electrically nonconductive coatings |
US5512164A (en) * | 1993-06-03 | 1996-04-30 | The United States Of America As Represented By The United States Department Of Energy | Method for sputtering with low frequency alternating current |
US5882492A (en) * | 1996-06-21 | 1999-03-16 | Sierra Applied Sciences, Inc. | A.C. plasma processing system |
US5897753A (en) * | 1997-05-28 | 1999-04-27 | Advanced Energy Industries, Inc. | Continuous deposition of insulating material using multiple anodes alternated between positive and negative voltages |
DK0908535T3 (da) * | 1997-10-08 | 2003-11-10 | Cockerill Rech & Dev | Fremgangsmåde til at dekapere et substrat og anlæg til at udføre fremgangsmåden |
-
2000
- 2000-10-13 EP EP00970916A patent/EP1235947A4/fr not_active Withdrawn
- 2000-10-13 WO PCT/US2000/028482 patent/WO2001029278A1/fr active Application Filing
- 2000-10-13 JP JP2001532257A patent/JP2003512526A/ja active Pending
- 2000-10-13 KR KR1020027004818A patent/KR20020040875A/ko not_active Application Discontinuation
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