JP2003338530A5 - - Google Patents

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Publication number
JP2003338530A5
JP2003338530A5 JP2002145139A JP2002145139A JP2003338530A5 JP 2003338530 A5 JP2003338530 A5 JP 2003338530A5 JP 2002145139 A JP2002145139 A JP 2002145139A JP 2002145139 A JP2002145139 A JP 2002145139A JP 2003338530 A5 JP2003338530 A5 JP 2003338530A5
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JP
Japan
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JP2002145139A
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Japanese (ja)
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JP3867014B2 (en
JP2003338530A (en
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Priority claimed from JP2002145139A external-priority patent/JP3867014B2/en
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Publication of JP2003338530A5 publication Critical patent/JP2003338530A5/ja
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JP2002145139A 2002-05-20 2002-05-20 Semiconductor wafer metal contamination evaluation method, semiconductor wafer manufacturing method, these apparatuses and dummy wafer Expired - Lifetime JP3867014B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002145139A JP3867014B2 (en) 2002-05-20 2002-05-20 Semiconductor wafer metal contamination evaluation method, semiconductor wafer manufacturing method, these apparatuses and dummy wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002145139A JP3867014B2 (en) 2002-05-20 2002-05-20 Semiconductor wafer metal contamination evaluation method, semiconductor wafer manufacturing method, these apparatuses and dummy wafer

Publications (3)

Publication Number Publication Date
JP2003338530A JP2003338530A (en) 2003-11-28
JP2003338530A5 true JP2003338530A5 (en) 2005-10-06
JP3867014B2 JP3867014B2 (en) 2007-01-10

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ID=29704584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002145139A Expired - Lifetime JP3867014B2 (en) 2002-05-20 2002-05-20 Semiconductor wafer metal contamination evaluation method, semiconductor wafer manufacturing method, these apparatuses and dummy wafer

Country Status (1)

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JP (1) JP3867014B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5099024B2 (en) * 2009-01-27 2012-12-12 信越半導体株式会社 Epitaxial wafer manufacturing method and semiconductor device manufacturing method
JP5691363B2 (en) * 2009-10-09 2015-04-01 株式会社Sumco Method for removing heavy metal inside semiconductor substrate
JP2014110373A (en) * 2012-12-04 2014-06-12 Shin Etsu Handotai Co Ltd Method of performing heat treatment on evaluation wafer

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