JP2003338530A5 - - Google Patents
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- JP2003338530A5 JP2003338530A5 JP2002145139A JP2002145139A JP2003338530A5 JP 2003338530 A5 JP2003338530 A5 JP 2003338530A5 JP 2002145139 A JP2002145139 A JP 2002145139A JP 2002145139 A JP2002145139 A JP 2002145139A JP 2003338530 A5 JP2003338530 A5 JP 2003338530A5
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- JP
- Japan
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002145139A JP3867014B2 (en) | 2002-05-20 | 2002-05-20 | Semiconductor wafer metal contamination evaluation method, semiconductor wafer manufacturing method, these apparatuses and dummy wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002145139A JP3867014B2 (en) | 2002-05-20 | 2002-05-20 | Semiconductor wafer metal contamination evaluation method, semiconductor wafer manufacturing method, these apparatuses and dummy wafer |
Publications (3)
Publication Number | Publication Date |
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JP2003338530A JP2003338530A (en) | 2003-11-28 |
JP2003338530A5 true JP2003338530A5 (en) | 2005-10-06 |
JP3867014B2 JP3867014B2 (en) | 2007-01-10 |
Family
ID=29704584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002145139A Expired - Lifetime JP3867014B2 (en) | 2002-05-20 | 2002-05-20 | Semiconductor wafer metal contamination evaluation method, semiconductor wafer manufacturing method, these apparatuses and dummy wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3867014B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5099024B2 (en) * | 2009-01-27 | 2012-12-12 | 信越半導体株式会社 | Epitaxial wafer manufacturing method and semiconductor device manufacturing method |
JP5691363B2 (en) * | 2009-10-09 | 2015-04-01 | 株式会社Sumco | Method for removing heavy metal inside semiconductor substrate |
JP2014110373A (en) * | 2012-12-04 | 2014-06-12 | Shin Etsu Handotai Co Ltd | Method of performing heat treatment on evaluation wafer |
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2002
- 2002-05-20 JP JP2002145139A patent/JP3867014B2/en not_active Expired - Lifetime