JP2003335858A - Polyimide resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polyimide resin suitable for an adhesive film which is used as a material for mounting electronic parts, allows assembly at a low temperature and has strong bonding characteristics and excellent heat resistance. <P>SOLUTION: The polyimide resin is obtained by reacting a styrene/maleic anhydride copolymer (A) with an aromatic amine and/or an aliphatic amine to give a polymer, and reacting the polymer with an aromatic tetracarboxylic acid dianhydride and an aromatic diamine and/or an aliphatic diamine. It is desirable that the content of the component (A) is 1-50 mol% based on the total acid components. The resin has a reactive functional group in its structure. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a novel polyimide resin, more specifically, a thermoplastic resin suitable for a semiconductor adhesive film having excellent reactivity with a thermosetting composition, good mechanical properties and heat resistance. It relates to a polyimide resin.

[0002]

2. Description of the Related Art Polyimide resin has not only high heat resistance, but also high strength and elasticity, excellent mechanical properties, high insulation and low dielectric constant, excellent electrical properties, chemical resistance, radiation resistance, and difficulty. Because of its excellent flammability, it has become an essential material for electric and electronic materials such as highly integrated semiconductors. It is widely used as a film for base materials of flexible printed wiring boards and heat-resistant adhesive tapes, and as a resin varnish for semiconductor insulating films and protective films.

In recent years, as the integration of semiconductors has rapidly increased, it has been strongly desired to improve the reliability of an adhesive film for adhering a semiconductor chip and a substrate, and accordingly, the adhesive film for a semiconductor. Further high heat resistance, high strength and high elasticity are required. Further, in the process of assembling a semiconductor device, if the assembly is performed at a high temperature at the time of bonding, residual stress occurs after the assembly due to the difference in the thermal expansion coefficient between the semiconductor chip and the substrate, and the reliability of the semiconductor device is significantly reduced. I will end up. Therefore, it has been desired that they can be bonded at low temperature and that they have characteristics such as high heat resistance, high strength and high elasticity after assembly. However, if the glass transition temperature of the resin is lowered for the purpose of improving low temperature adhesiveness, there is a problem that the elastic modulus at high temperature is lowered and the heat resistance is lowered.

[0004]

DISCLOSURE OF THE INVENTION The inventor of the present invention is capable of assembling at a low temperature by providing a reactive functional group in the polyimide molecular structure and, further, greatly improving the thermal elastic modulus after assembly. It has been found that the above is possible, and the present invention has been completed.

[0005]

Means for Solving the Problems As a result of intensive studies to develop a thermoplastic polyimide resin having the above-mentioned preferable properties, the present inventor has obtained by providing a reactive functional group in the polyimide molecular structure. It was found that the novel thermoplastic polyimide resin to be used can achieve the object, and the present invention has been completed based on these findings.

That is, the present invention provides (1) a polymer obtained by reacting a styrene / maleic anhydride copolymer (A) with an aromatic amine and / or an aliphatic amine, and an aromatic tetracarboxylic dianhydride. A polyimide resin obtained by reacting a product with an aromatic diamine and / or an aliphatic diamine,

(2) A polyimide resin according to item (1), which contains a structure represented by the following general formula (1):

[Chemical 3] (In the formula, R ₂ is an aliphatic group or an aromatic group, and n = 1 to 1
10 is shown. At least one of R ₁ , R ₃ , and R ₄ has a structure represented by the general formula (2).

[0008]

[Chemical 4] R ₅ in the formula represents an aliphatic group or an aromatic group. X is a reactive functional group, an acrylate group, an acetylene group, a carboxyl group, a hydroxyl group, a vinyl group, an amino group, an epoxy group, a silanol group, an alkoxysilane group, an imino group,
Isocyanate group, blocked isocyanate group, cyclocarbonate group, vinyl ether group, vinyl thioether group, aminomethylol group, alkylated aminomethylol group, acetal group, or ketal group. )

(3) Component (A) is 1 to 5 out of all acid components.
The polyimide resin according to item (1) or (2), which comprises 0 mol%. Hereinafter, the present invention will be described in detail.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The polyimide resin of the present invention is prepared by reacting a styrene / maleic anhydride copolymer with an aromatic amine and an aliphatic amine in advance, and then reacting the reaction product with an acid dianhydride.
It can be obtained by reacting with a diamine.

The styrene / maleic anhydride copolymer used in the present invention has a styrene / maleic acid ratio of 1: 1 to 6: 1.
Those having a styrene / maleic acid ratio of 3: 1 are particularly preferable. The styrene / maleic anhydride copolymer is 1 to 50 mol%, preferably 10 to 30 mol% of the total acid component. If it is less than 1 mol%, no effect is obtained. If it exceeds 50 mol%, the varnish may gel and the storage stability may be deteriorated due to the large number of functional groups.

Examples of the acid dianhydride used in the present invention include 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride. , 4,4'-oxydiphthalic dianhydride, 3,3 ', 4,4'-diphenylsulfone tetracarboxylic dianhydride, 2,2', 3,3'-biphenyltetracarboxylic dianhydride, Ethylene glycol bistrimellitic dianhydride, 2,2 ', 3,3'-benzophenone tetracarboxylic dianhydride, 4,4'-bisphenol A dianhydride, pyromellitic dianhydride, 4,4'-
(Hexafluoroisopropylidene) phthalic acid dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 1,4,5,7-naphthalenetetracarboxylic acid dianhydride, 1,2,5 6-naphthalene tetracarboxylic acid dianhydride, 3,4,9,10-naphthalene tetracarboxylic acid dianhydride, etc. are mentioned, and these are independent or 2
Used as a mixture of two or more species. From the viewpoint of heat resistance and solubility in organic solvents, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 3 , 3 ', 4,
4'-diphenylsulfone tetracarboxylic dianhydride,
1 selected from the group consisting of 4,4′-oxydiphthalic acid dianhydride and 4,4′-bisphenol A dianhydride
It is preferable to use one kind or two or more kinds of acid dianhydrides.

As the diamine component used in the present invention, 2,2-bis (4- (4-aminophenoxy) phenyl) propane and 2,2-bis (4) are aromatic diamines.
-(4-aminophenoxy) phenyl) hexafluoropropane, 2,2-bis (4-aminophenoxy) hexafluoropropane, bis-4- (4-aminophenoxy) phenyl sulfone, bis-4- (3-aminophenoxy) ) Phenyl sulfone, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,4-bis (3 -Aminophenoxy) benzene, 4,4'-bis (4-aminophenoxy) biphenyl and the like. Furthermore, with aliphatic diamines, 1,2-diaminocyclohexane, 1,12-diaminododecane, 1,3-diaminocyclohexane, 1,
4-diaminocyclohexane, 4,4'-diaminodisichexylmethane, 4,4'-diamino-3,3'-dimethyl-disichexylmethane, 4,4'-diamino-
3,3'-diethyl-disichexylmethane, 4,4 '
-Diamino-3,3 ', 5,5'-tetramethyl-disichexylmethane, 4,4'-diamino-3,3',
5,5'-tetraethyl-disichexylmethane, 4,
4'-diamino-3,3'-diethyl-5,5'-dimethyl-disichexylmethane, 4,4'-diamino-
3,3'-dimethyldicyclohexyl, 4,4'-diamino-3,3 ', 5,5'-tetramethyldicyclohexyl, 4,4'-diaminodicyclohexyl ether and the like can be mentioned, and further as another diamine component. Is 4,4 '
-Methylenedi-O-toluidine, 4,4'-methylenedi-2,6-xylidine, 4,4'-methylenedi-2,6
-Diethylaniline, 4,4'-diamino-3,3'-
Diethyl-5,5'-dimethyldiphenylmethane, 2,
2-bis (4- (4-aminophenoxy) phenyl) propane, 2,2-bis (4- (4-aminophenoxy))
Phenyl) hexafluoropropane, 2,2-bis (4
-Aminophenoxy) hexafluoropropane, bis-
4- (4-aminophenoxy) phenyl sulfone, bis-4- (3-aminophenoxy) phenyl sulfone, 1,3-bis (3-aminophenoxy) benzene,
1,4-bis (3-aminophenoxy) benzene, 1,
4-bis (4-aminophenoxy) benzene, 1,4-
Bis (3-aminophenoxy) benzene, 4,4'-bis (4-aminophenoxy) biphenyl, 4,4'-
(P-phenylene diisopropylidene) dianiline,
3,4-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,4 diaminodiphenyl sulfone, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 2,5 diaminotoluene, 2,4 diaminotoluene, 4 , 6-dimethyl-m
-Phenylenediamine, 2,5-dimethyl-p-phenylenediamine, 2,4,6-trimethyl-m-phenylenediamine, 4,4'-diaminobenzanilide, 3,
3'-dihydroxy-4,4'-diaminobiphenyl etc. can be mentioned.

It is more preferable to use the siloxane compound represented by the formula (3) as one of the diamine components of the polyimide resin in an amount of 5 to 50 mol% of the total amount of the diamine components.

[Chemical 5] (In the formula, R1 and R2 represent divalent aliphatic groups or aromatic groups having 1 to 4 carbon atoms, R3, R4, R5 and R6 represent monovalent aliphatic groups or aromatic groups, and k represents 1 to It is an integer of 100.) If it is less than 5 moles, the solubility of the resin is lowered, and if it exceeds 50 moles, the glass transition temperature is excessively lowered and the heat resistance may be deteriorated. Examples of the siloxane compound include 1,3
-Bis (3-aminopropyl) tetramethylsiloxane, α, ω-bis (3-aminopropyl) polydimethylsiloxane, 1,3-bis (4-aminophenyl) tetramethylsiloxane, α, ω-bis (4- Aminophenyl) polydimethylsiloxane, 1,3-bis (3-aminophenyl) tetramethylsiloxane, α, ω-bis (3-aminophenyl) polydimethylsiloxane, 1,
Examples thereof include 3-bis (3-aminopropyl) tetraphenylsiloxane and α, ω-bis (3-aminopropyl) polydiphenylsiloxane, which may be used alone or in combination with 2
Used as a mixture of two or more species.

Examples of aromatic amines and aliphatic amines for providing the reactive functional group X in the general formula (1) include aminobenzoic acid, aminophenol, 4-amino-1-naphthol, 6-amino, N- (4-aminobenzoyl) glycine, 2-amino-1-butanol, γ
-Aminobutyric acid, ε-aminocaproic acid, 4-amino-3
-Hydroxybutyric acid, δ-aminolevulinic acid, aminophosphine, aminophenylacetic acid, aminosalicylic acid and the like can be used, and these can be used alone or in admixture of two or more. It can also be used in combination with aniline to control the number of reactive functional groups added to the polyimide.

The reaction is carried out in an aprotic polar solvent. The aprotic polar solvent is, for example, N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAC), N-methyl-2-pyrrolidone (NM
P), anisole, tetrahydrofuran (THF), diglyme, cyclohexanone, gamma-butyrolactone (GBL), 1,4-dioxane (1,4-DO) and the like.

A non-polar solvent compatible with the aprotic polar solvent may be mixed and used. As the non-polar solvent, aromatic hydrocarbons such as toluene, xylene and solvent naphtha can be used. The proportion of the nonpolar solvent in the mixed solvent is preferably 30% by weight or less. This is because if the amount of the nonpolar solvent exceeds 30% by weight, the reaction rate of the thermal imidization by azeotropy is remarkably reduced, and it may be difficult to obtain a polyimide resin having a target molecular weight.

In the method for synthesizing the polyimide resin of the present invention, the styrene / maleic acid copolymer and the amine component are reacted at room temperature in advance, and then the tetracarboxylic dianhydride and the diamine component are added all at once. The polyamic acid solution thus obtained is subsequently heated and dehydrated in an organic solvent to form an imidized polyimide. Since the water generated by the imidization reaction interferes with the ring-closing reaction, an organic solvent that is not compatible with water is added to the system to azeotropically evaporate it and use a device such as a Dean-Stark tube to remove it from the system. To discharge. Dichlorobenzene is known as an organic solvent which is incompatible with water, but for electronics use, the aromatic hydrocarbon is preferably used since chlorine components may be mixed therein. Further, the use of compounds such as acetic anhydride, β-picoline and pyridine as a catalyst for the imidization reaction is not hindered.

[0019]

EXAMPLES Next, the present invention will be described more specifically by way of examples. The styrene / maleic anhydride copolymer used in the examples is EF-30 (average molecular weight 290 manufactured by Elf Atchem Co., Ltd.) having a styrene / maleic acid ratio of 3: 1.
0).

Example 1 A styrene / maleic acid copolymer 19.92 was placed in a 4-neck separable flask equipped with a thermometer, a reflux condenser and a stirrer.
Parts by weight, 7.68 parts by weight of p-aminobenzoic acid and 254.64 parts by weight of anisole were charged and stirred at room temperature. The obtained reaction product, as an acid component, 4,4′-oxydiphthalic acid dianhydride 17.37 parts by weight, anisole 100 parts by weight,
It was mixed with 88.66 parts by weight of toluene to obtain a suspension solution. As diamine component, 2,2-bis (4- (4-aminophenoxy) phenyl) propane 9.85 g and α, ω
-Bis (3-aminopropyl) polydimethylsiloxane (average molecular weight 836) (23.41 parts by weight) was added to anisole 1
What was heated and dissolved in 00 parts by weight at 125 ° C. was placed in a dropping funnel. Then, a Dean-Stark reflux condenser was attached to a 4-neck separable flask, and the suspension solution was dissolved and became transparent by heating with an oil bath. When heating under reflux started, the diamine solution was slowly added dropwise over 1 hour. At this time, water generated by imidization was removed from the system by azeotropic distillation with toluene. The reaction was terminated when the mixture was heated and refluxed for 3.0 hours after completion of the dropping, and a polyimide resin soluble in anisole was obtained.

30 parts by weight of a cresol novolac type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name EOCN-1020-80) and 100 parts by weight of the obtained polyimide resin, N-phenyl-γ-aminopropyltrimethoxy. Silane (manufactured by Shin-Etsu Silicone Co., Ltd., trade name KBM-5
73) After adding 5 parts by weight of the mixture and stirring and mixing, vacuum deaeration was performed.
This resin varnish was applied onto a polyethylene terephthalate supporting substrate having a thickness of 38 μm by a roll coater so that the film thickness after drying was 4 μm.
Apply it to 0μm, 60 ℃ for 2 minutes, 80 ℃ for 2 minutes.
Min, 90 ° C. for 2 minutes, and dried by heating in a hot air circulation dryer to obtain a polyimide resin film with a release film.

Next, the adhesive strength of the obtained polyimide resin was measured.

[Adhesive strength when heated at 240 ° C.] The film was punched out with a 7 × 7 mm mold, and the pressure was 160 ° C. and the pressure was 2M.
Temporarily pressure-bonding is performed at Pa for a pressure time of 0.3 seconds, and then the film is attached to a 42-alloy lead frame at a pressure-bonding temperature of 160 ° C., a pressure of 1 MPa, and a pressure time of 1.0 second. Then 4
A mm-square silicon chip is bonded to the above 7 × 7 mm film by a pressure bonding temperature of 180 ° C., a pressure of 1 MPa, and a pressure bonding time of 1.0.
Chip mount in seconds and cure at 180 ° C. for 1 hour.
After curing, a push shear gauge was used to measure the die shear strength under heat at 240 ° C. for 20 seconds.

Comparative Example 1 4,4'-oxydiphthalic acid dianhydride 43.43 as an acid component was placed in a 4-neck separable flask similar to that of Example 1.
191.43 parts by weight of anisole and 8 parts of toluene
Suspend to 1.96 parts by weight. And 1,3-bis (3-aminophenoxy) benzene 2 as a diamine component
0.46 parts by weight and α, ω-bis (3-aminopropyl)
Polydimethylsiloxane (average molecular weight 836) 58.5
2 parts by weight of 136.42 parts by weight of anisole dissolved at 70 ° C. are placed in a dropping funnel. Then, a Dean Stark reflux condenser was attached, and the suspension solution was dissolved and became transparent by heating with an oil bath. When heating under reflux started, the diamine solution was slowly added dropwise for 1 hour. At this time, water generated by imidization was removed from the system by azeotropic distillation with toluene. The reaction was terminated when the mixture was heated and refluxed for 3.0 hours after completion of the dropping, and a polyimide resin soluble in anisole was obtained.

With respect to 100 parts by weight of the obtained polyimide resin, 30 parts by weight of cresol novolac type epoxy resin (trade name EOCN-1020-80 manufactured by Nippon Kayaku Co., Ltd.) and N-phenyl-γ-aminopropyltrimethoxysilane. (Product name KBM-57 manufactured by Shin-Etsu Silicone Co., Ltd.
3) 5 parts by weight was added and mixed with stirring, and then degassed in vacuum. This resin varnish was applied onto a polyethylene terephthalate supporting substrate having a thickness of 38 μm by a roll coater so that the film thickness after drying was 40.
Apply so that it becomes μm, 2 minutes at 60 ℃, 2 minutes at 80 ℃
Min, 2 minutes at 90 ° C., heat drying was performed in a hot air circulation dryer to obtain a polyimide resin film with a release film.

The adhesive strength of the obtained polyimide resin film was measured at 240 ° C. in the same manner as in Example 1.

The polyimide resin film of Example 1 had a glass transition temperature before curing of 75 ° C. and an elastic modulus of 6 at 240 ° C. when heated.
The adhesive strength when heated at 0 MPa and 240 ° C. was 5.7 MPa. On the other hand, the polyimide resin film of Comparative Example 1 had a glass transition temperature before curing of 74 ° C., an elastic modulus at 240 ° C. heat of 10 MPa, and an adhesive strength at 240 ° C. of heat of 1 MPa.

[0028]

As described above, according to the polyimide resin of the present invention, it is possible to assemble at a low temperature and it is possible to greatly improve the elastic modulus at the time of assembly. Furthermore, it is possible to provide an adhesive film that has strong adhesive properties and excellent heat resistance and is optimal for electronic packaging materials.

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Claims (3)

[Claims] 1. A styrene / maleic anhydride copolymer (A)
A polyimide resin obtained by reacting a polymer obtained by reacting an aromatic amine and / or an aliphatic amine with an aromatic tetracarboxylic dianhydride and an aromatic diamine and / or an aliphatic diamine. 2. The polyimide resin according to claim 1, containing a structure represented by the following general formula (1). [Chemical 1] (In the formula, R ₂ is an aliphatic group or an aromatic group, and n = 2 to
10 is shown. At least one of R ₁ , R ₃ , and R ₄ has a structure represented by the general formula (2). [Chemical 2] (R ₅ in the formula represents an aliphatic group or an aromatic group. X is a reactive functional group, an acrylate group, an acetylene group, a carboxyl group, a hydroxyl group, a vinyl group, an amino group, an epoxy group, a silanol group, Alkoxysilane group, imino group, isocyanate group, blocked isocyanate group,
It is a cyclocarbonate group, a vinyl ether group, a vinyl thioether group, an aminomethylol group, an alkylated aminomethylol group, an acetal group, or a ketal group. ) 3. The polyimide resin according to claim 1, wherein the component (A) comprises 1 to 50 mol% of all the acid components.