JP2003332487A - High-frequency ic connection structure - Google Patents
High-frequency ic connection structureInfo
- Publication number
- JP2003332487A JP2003332487A JP2002138117A JP2002138117A JP2003332487A JP 2003332487 A JP2003332487 A JP 2003332487A JP 2002138117 A JP2002138117 A JP 2002138117A JP 2002138117 A JP2002138117 A JP 2002138117A JP 2003332487 A JP2003332487 A JP 2003332487A
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- connection structure
- housing
- high frequency
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Waveguide Connection Structure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高周波ＩＣ接続構
造に関し、特に、高周波ＩＣを接続するにあたって装置
の特性の劣化を招くことなく、装置の小型化を図った高
周波ＩＣ接続構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency IC connection structure, and more particularly to a high-frequency IC connection structure in which the device is downsized without deterioration of the characteristics of the device when connecting the high-frequency IC.
【０００２】[0002]
【従来の技術】従来、高周波ＩＣを接続するにあたっ
て、例えば、図５に示すような接続構造が使用されてい
る。この高周波ＩＣ接続構造は、２つの高周波ＩＣ１５
を、ハウジング１３を利用し、誘電体１７に囲繞された
導体１６及び高周波信号入出力ピン１４を介して接続し
ている。2. Description of the Related Art Conventionally, for connecting a high frequency IC, for example, a connection structure as shown in FIG. 5 has been used. This high-frequency IC connection structure has two high-frequency ICs 15
Are connected using the housing 13 via the conductor 16 surrounded by the dielectric 17 and the high frequency signal input / output pin 14.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記従来の高
周波ＩＣ接続構造においては、接続線路が直線にならず
に不連続となるため、高周波信号の不整合が生じて装置
の特性が劣化してしまうという問題があった。However, in the above-mentioned conventional high-frequency IC connection structure, since the connection line is not straight but discontinuous, a high-frequency signal mismatch occurs and the characteristics of the device deteriorate. There was a problem of being lost.
【０００４】また、第２の問題点として、ハウジング１
３の片方の面のみに高周波ＩＣ１５が実装されているた
め、複数個の高周波ＩＣ１５を装置内に実装する場合に
は、実装面積が増加し、装置の小型化を図るのが困難で
あるという問題があった。A second problem is that the housing 1
Since the high-frequency IC 15 is mounted on only one surface of No. 3, when mounting a plurality of high-frequency ICs 15 in the device, the mounting area increases and it is difficult to reduce the size of the device. was there.
【０００５】そこで、本発明は、上記従来の高周波ＩＣ
接続構造における問題点に鑑みてなされたものであっ
て、高周波ＩＣを接続するにあたって装置の特性の劣化
を招くことなく、装置の小型化を図ることのできる高周
波ＩＣ接続構造を提供することを目的とする。Therefore, the present invention is based on the conventional high-frequency IC described above.
The present invention has been made in view of the problems in the connection structure, and an object of the present invention is to provide a high-frequency IC connection structure capable of downsizing the device without deteriorating the characteristics of the device when connecting the high-frequency IC. And
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、請求項１記載の発明は、高周波ＩＣ接続構造であっ
て、上面と下面とを有するハウジングと、該ハウジング
の前記上面及び下面を貫通する貫通孔と、該貫通孔に挿
入される筒状の誘電体と、該誘電体に囲繞された状態で
前記貫通孔に挿入され、前記ハウジングの前記上面及び
下面側端部に高周波ＩＣの高周波信号入出力ピンを保持
する保持部を備えた接続用ピンとを備えることを特徴と
する。To achieve the above object, the invention according to claim 1 is a high-frequency IC connection structure, wherein a housing having an upper surface and a lower surface, and the upper surface and the lower surface of the housing are penetrated. A through-hole, a cylindrical dielectric body inserted into the through-hole, and a high-frequency IC high-frequency IC inserted in the through-hole in a state of being surrounded by the dielectric body, at the upper and lower end portions of the housing. And a connection pin having a holding portion for holding the signal input / output pin.
【０００７】そして、請求項１記載の発明によれば、ハ
ウジングに穿設した貫通孔、貫通孔に挿入した誘電体、
及び接続用ピンとによって高周波ＩＣの高周波信号入出
力ピンを直線上で接続することができるため、接続線路
において不連続性を減らすことができ、高周波ＩＣを接
続するにあたって装置の特性の劣化を招くことがない。
また、ハウジングの両面に高周波ＩＣを配置することに
よって装置の小型化を実現することができる。According to the first aspect of the invention, the through hole formed in the housing, the dielectric inserted in the through hole,
Since the high-frequency signal input / output pin of the high-frequency IC can be connected in a straight line by the connection pin and the connection pin, discontinuity in the connection line can be reduced, and the characteristics of the device may be deteriorated when connecting the high-frequency IC. There is no.
Further, by arranging the high frequency ICs on both surfaces of the housing, it is possible to realize the miniaturization of the device.
【０００８】請求項２記載の発明は、請求項１記載の高
周波ＩＣ接続構造の好ましい一形態として、前記接続用
ピンの保持部を、前記高周波ＩＣの高周波信号入出力ピ
ンを弾性的に保持するように構成したことを特徴とす
る。According to a second aspect of the present invention, as a preferred form of the high-frequency IC connection structure according to the first aspect, the holding portion of the connecting pin elastically holds the high-frequency signal input / output pin of the high-frequency IC. It is characterized in that it is configured as follows.
【０００９】請求項３記載の発明は、請求項１または２
記載の高周波ＩＣ接続構造において、前記誘電体を、異
なる誘電率を有する複数の誘電体で構成したことを特徴
とする。これによって、整合回路を構成することができ
る。The invention according to claim 3 is the invention according to claim 1 or 2.
In the high frequency IC connection structure described above, the dielectric is composed of a plurality of dielectrics having different dielectric constants. With this, the matching circuit can be configured.
【００１０】[0010]
【発明の実施の形態】次に、本発明にかかる高周波ＩＣ
接続構造の実施の形態の具体例を図面を参照しながら説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a high frequency IC according to the present invention
A specific example of the embodiment of the connection structure will be described with reference to the drawings.
【００１１】図１乃至図３は、本発明にかかる高周波Ｉ
Ｃ接続構造の第１実施例を示し、この高周波ＩＣ接続構
造は、ハウジング３と、ハウジング３を貫通する貫通孔
９と、貫通孔９に挿入される筒状の誘電体２と、誘電体
２に囲繞された状態で貫通孔９に挿入される接続用ピン
１とで構成される。1 to 3 show a high frequency I according to the present invention.
The first embodiment of the C connection structure is shown. The high frequency IC connection structure includes a housing 3, a through hole 9 penetrating the housing 3, a cylindrical dielectric 2 inserted into the through hole 9, and a dielectric 2. The connecting pin 1 is inserted into the through hole 9 in a state of being surrounded by.
【００１２】接続用ピン１は、図３に示すように、両端
部にすり割り部１ａを有する円筒状に形成され、両端部
において高周波ＩＣの高周波信号入出力ピンを弾性的に
保持することができる。そして、図２に示すように、接
続用ピン１の両端部において高周波ＩＣ５の高周波信号
入出力ピン４を保持した状態で、接続用ピン１、誘電体
２及びハウジング３が各々中心導体、外部誘電体及び外
部導体として機能し、同軸線路（分布定数線路）を構成
することができる。As shown in FIG. 3, the connecting pin 1 is formed in a cylindrical shape having a slot portion 1a at both ends, and can elastically hold the high frequency signal input / output pin of the high frequency IC at both ends. it can. Then, as shown in FIG. 2, with the high-frequency signal input / output pin 4 of the high-frequency IC 5 held at both ends of the connecting pin 1, the connecting pin 1, the dielectric 2 and the housing 3 are respectively the central conductor and the external dielectric. A coaxial line (distributed constant line) can be configured by functioning as a body and an outer conductor.
【００１３】これによって、高周波ＩＣ５の高周波信号
入出力ピン４の間を同一直線上で接続することができ、
接続線路の連続性を維持することができ、高周波信号の
不整合が生じるのを防止することができる。また、２つ
の高周波ＩＣ５をハウジング３の上面３ａ及び下面３ｂ
の両面に実装することができるため、装置の小型化を図
ることもできる。As a result, the high frequency signal input / output pins 4 of the high frequency IC 5 can be connected on the same straight line,
The continuity of the connection line can be maintained, and the occurrence of mismatch of high frequency signals can be prevented. Further, the two high frequency ICs 5 are connected to the upper surface 3a and the lower surface 3b of the housing 3.
Since it can be mounted on both sides of the device, the device can be downsized.
【００１４】ここで、誘電体２の誘電率をε、内径を
Ｄ、接続用ピン１の外径をｄとすると、接続用ピン１、
誘電体２及びハウジング３で構成されるコネクタ部の特
性インピーダンスＺ0は、式（１）によって求めること
ができる。Assuming that the permittivity of the dielectric 2 is ε, the inner diameter is D, and the outer diameter of the connecting pin 1 is d, the connecting pin 1,
The characteristic impedance Z 0 of the connector portion composed of the dielectric 2 and the housing 3 can be obtained by the equation (1).
【００１５】[0015]
【数１】
高周波ＩＣ５の特性インピーダンスに上記コネクタ部の
特性インピーダンスを合わせるには、式（１）によって
求められるＺ0を使用する。[Equation 1] In order to match the characteristic impedance of the connector section with the characteristic impedance of the high frequency IC 5, Z 0 calculated by the equation (1) is used.
【００１６】また、上記の理論を利用し、誘電体２の材
質を変更して誘電率を変化させてＺ 0を適切なインピー
ダンスに設定することにより、コネクタ部で高周波信号
の整合を取ることも可能である。Further, using the above theory, the material of the dielectric 2 is
Change the quality and change the permittivity to Z 0The proper impey
By setting to dance, the high frequency signal is
It is also possible to match.
【００１７】図４は、本発明にかかる高周波ＩＣ接続構
造の第２実施例を示し、この高周波ＩＣ接続構造は、ハ
ウジング３と、ハウジング３を貫通する貫通孔９と、貫
通孔９に挿入される筒状の２種類の誘電体２、８と、誘
電体２、８に囲繞された状態で貫通孔９に挿入される接
続用ピン１とで構成される。本実施例においては、誘電
体２、８の誘電率を互いに異なるようにして、整合回路
を構成している。FIG. 4 shows a second embodiment of the high-frequency IC connection structure according to the present invention. This high-frequency IC connection structure is inserted into the housing 3, the through hole 9 penetrating the housing 3, and the through hole 9. It is composed of two types of cylindrical dielectrics 2 and 8 and a connecting pin 1 which is inserted into the through hole 9 while being surrounded by the dielectrics 2 and 8. In the present embodiment, the matching circuits are configured by making the dielectric constants of the dielectrics 2 and 8 different from each other.
【００１８】[0018]
【発明の効果】以上説明したように、本発明にかかる高
周波ＩＣ接続構造によれば、高周波ＩＣを接続するにあ
たって装置の特性の劣化を招くことなく、装置の小型化
を図ることが可能となる。As described above, according to the high frequency IC connection structure of the present invention, the size of the device can be reduced without deteriorating the characteristics of the device when connecting the high frequency IC. .
【図１】本発明にかかる高周波ＩＣ接続構造の第１実施
例を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of a high-frequency IC connection structure according to the present invention.
【図２】図１の高周波ＩＣ接続構造において２つの高周
波ＩＣを接続した状態を示す断面図である。FIG. 2 is a cross-sectional view showing a state where two high frequency ICs are connected in the high frequency IC connection structure of FIG.
【図３】図１の高周波ＩＣ接続構造の接続用ピンを示す
図であって、（ａ）は上面図、（ｂ）は（ａ）のＡ−Ａ
線断面図である。3A and 3B are diagrams showing connection pins of the high-frequency IC connection structure of FIG. 1, in which FIG. 3A is a top view and FIG. 3B is AA of FIG.
It is a line sectional view.
【図４】本発明にかかる高周波ＩＣ接続構造の第２実施
例において２つの高周波ＩＣを接続した状態を示す断面
図である。FIG. 4 is a cross-sectional view showing a state in which two high frequency ICs are connected in the second embodiment of the high frequency IC connection structure according to the present invention.
【図５】従来の高周波ＩＣ接続構造の一例を示す断面図
である。FIG. 5 is a sectional view showing an example of a conventional high-frequency IC connection structure.
１ 接続用ピン １ａ すり割り部 ２ 誘電体 ３ ハウジング ３ａ 上面 ３ｂ 下面 ４ 高周波信号入出力ピン ５ 高周波ＩＣ ８ 誘電体 ９ 貫通孔 1 Connection pin 1a slot 2 dielectric 3 housing 3a upper surface 3b lower surface 4 High frequency signal input / output pin 5 high frequency IC 8 Dielectric 9 through holes
Claims (3)
記ハウジングの前記上面及び下面側端部に高周波ＩＣの
高周波信号入出力ピンを保持する保持部を備えた接続用
ピンとを備えることを特徴とする高周波ＩＣ接続構造。1. A housing having an upper surface and a lower surface, a through hole penetrating the upper surface and the lower surface of the housing, a cylindrical dielectric member inserted into the through hole, and a state surrounded by the dielectric material. And a connecting pin having a holding portion for holding the high frequency signal input / output pin of the high frequency IC, which is inserted into the through hole and is provided on the upper and lower surface side end portions of the housing.
ＩＣの高周波信号入出力ピンを弾性的に保持することを
特徴とする請求項１記載の高周波ＩＣ接続構造。2. The high frequency IC connection structure according to claim 1, wherein the holding portion of the connection pin elastically holds the high frequency signal input / output pin of the high frequency IC.
数の誘電体で構成したことを特徴とする請求項１または
２記載の高周波ＩＣ接続構造。3. The high frequency IC connection structure according to claim 1, wherein the dielectric is composed of a plurality of dielectrics having different permittivities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002138117A JP2003332487A (en) | 2002-05-14 | 2002-05-14 | High-frequency ic connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002138117A JP2003332487A (en) | 2002-05-14 | 2002-05-14 | High-frequency ic connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003332487A true JP2003332487A (en) | 2003-11-21 |
Family
ID=29699640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002138117A Pending JP2003332487A (en) | 2002-05-14 | 2002-05-14 | High-frequency ic connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003332487A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008146882A (en) * | 2006-12-06 | 2008-06-26 | Auto Network Gijutsu Kenkyusho:Kk | Coax connector |
| JP2008181738A (en) * | 2007-01-24 | 2008-08-07 | Nec Corp | Connecting connector, connecting method, and connection structure |
| JP2009267319A (en) * | 2008-04-25 | 2009-11-12 | Jiaotong Univ | Vertical transmission structure for high frequency transmission line |
-
2002
- 2002-05-14 JP JP2002138117A patent/JP2003332487A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008146882A (en) * | 2006-12-06 | 2008-06-26 | Auto Network Gijutsu Kenkyusho:Kk | Coax connector |
| JP2008181738A (en) * | 2007-01-24 | 2008-08-07 | Nec Corp | Connecting connector, connecting method, and connection structure |
| JP2009267319A (en) * | 2008-04-25 | 2009-11-12 | Jiaotong Univ | Vertical transmission structure for high frequency transmission line |
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