JP2003330377A - Electro-optic device and double coated tape, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the malfunction occurring in the heat of a light source. <P>SOLUTION: A driver IC 6 is packaged to a transparent substrate 5 configurating a liquid crystal display panel 1 and a light transmission plate 8 of an illuminator 2 is bonded by means of a double coated tape 10 to the rear surface of the transparent substrate 5. The double coated tape 10 is formed by depositing metallic films by evaporation on the sheet surfaces of a foamed material and exists between an LED 7 and the driver IC 6. The double coated tape reflects the light and heat of the LED 7 by the metallic films and insulates the heat by the foamed material. As a result, the heat of the LED 7 is not transferred to the driver IC 6 and therefore the malfunction of the driver IC 6 does not occur. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to liquid crystal televisions, personal computers, mobile phones, and the like, and not only malfunctions caused by light incident on semiconductor elements such as driver ICs but also malfunctions caused by heat of a light source are prevented. The present invention relates to an electro-optical device and double-sided tape that can be prevented, and electronic equipment.

[0002]

2. Description of the Related Art In a conventional liquid crystal display device, a liquid crystal display panel is constructed by stacking transparent glass substrates, enclosing a liquid crystal therebetween, and laminating a deflection film on the surface of the glass substrate. A driver IC is mounted on a part of the transparent substrate by COG (Chip On Glass). An illumination device including a light source and a light guide plate is attached to the back surface of the liquid crystal display panel. With the illumination device attached, the light source is located opposite to the driver IC with the transparent substrate interposed therebetween. The light from the light source propagates through the light guide plate and is emitted from the light guide plate to the liquid crystal display panel side.

[0003]

In the above-mentioned conventional liquid crystal display device, firstly, a light source and a driver IC (Integrate Circulation) are used.
light from the light source passes through the transparent substrate and enters the driver IC, and secondly, external light such as sunlight propagates through the transparent substrate and enters the driver IC. As a result, there is a problem in that the driver IC malfunctions. To solve this problem, in the conventional liquid crystal display device, a black light shielding tape is attached to the driver IC mounting area on the back side of the transparent substrate on which the driver IC is mounted to attenuate the light propagating in the transparent substrate. The light from the light source is blocked so that it is difficult for the light to enter the driver IC.

However, the light source is an LED (Light Em
It is often used that generates a large amount of heat such as itting diode). Since the light-shielding tape is black, it easily absorbs heat. Therefore, the heat of the light source is applied to the driver IC via the light-shielding tape and the transparent substrate, and specifically, the light source is turned on for about 5 minutes. , 40 degrees to 60 degrees
The temperature of the driver IC rises to a degree. Usually, the driver IC has a function of detecting the ambient temperature by a temperature sensor formed inside and appropriately changing the driving state of the liquid crystal based on the temperature. Therefore, when the driver IC is heated, the driver IC recognizes a temperature different from the original ambient temperature, which causes a problem that the driver IC operates under an incorrect driving condition. This problem is caused by SOG (Sy
Stem OnGlass) Similar problems may occur when an electronic circuit other than the driver IC is formed on a transparent substrate such as a display.

Therefore, the present invention has been made in view of the above, and it is possible to prevent not only the malfunction caused by the incident light of the semiconductor element such as the driver IC but also the malfunction caused by the heat of the light source. An object is to provide a device, a double-sided tape, and an electronic device.

[0006]

In order to achieve the above object, an electro-optical device according to the present invention mounts a semiconductor element such as a driver IC on a partial surface of a transparent substrate constituting an electro-optical panel. The illuminating device is arranged on the side opposite to the semiconductor element mounting surface and the light source of the illuminating device is positioned so as to substantially face the semiconductor element, and between the light source and the transparent substrate, the semiconductor element side One side is a light absorbing surface,
A film having the other surface on the light source side as a reflecting surface is arranged.

External light such as sunlight incident on the light source propagates through the transparent substrate, but the semiconductor element (typically the driver IC) side of the transparent substrate has a light absorbing surface of black or the like. Attenuate the incident light. As a result, the amount of external light that enters the driver IC is extremely reduced, so that malfunction of the driver IC can be prevented. On the other hand, since the light from the light source is reflected by the reflecting surface, the light from the light source does not directly hit the driver IC. Further, since an LED or the like is used as the light source, a considerable amount of heat is generated, but by reflecting the light of the light source, it is possible to prevent the transparent substrate from being heated. That is, the driver I
When the drive state is changed by temperature change, C will erroneously detect that the heat of the light source is the ambient temperature and will malfunction, but since the reflecting surface can prevent the heating of the driver IC, The malfunction of the IC can be further prevented. The transparent substrate may include a deflection film in the case of a liquid crystal display device (the same applies hereinafter).

In the electro-optical device according to the next invention, a driver IC is formed on a part of the surface of a transparent substrate which constitutes the electro-optical panel.
A semiconductor device such as a semiconductor device is mounted, a lighting device is arranged on the side opposite to the semiconductor device mounting surface, and the light source of the lighting device is positioned so as to substantially face the semiconductor device. A heat insulating layer is provided between the and.

As the material of the heat insulating layer, it is preferable to use the material shown in the following embodiment such as a foam material. Moreover, the heat insulating layer does not need to be formed of a predetermined material. For example, a material having an internal space may be provided between the light source and the transparent substrate, and the heat insulation may be performed by a substantial air layer. In this invention, the heat of the light source is blocked by the heat insulating layer and is less likely to be transferred to the transparent substrate. This can effectively prevent the driver IC from malfunctioning due to heat. In particular, if the surface of the heat insulating layer on the driver IC side is a light absorbing surface, it is possible to prevent malfunction due to external light as in the above case. The heat insulating layer may be transparent, but preferably has a light absorbing color.

In the electro-optical device according to the next invention, in the above-mentioned structure, the film further extends around the effective display area (active area) of the electro-optical panel and up to the peripheral edge of the transparent substrate constituting the electro-optical panel. It is characterized by a frame shape to be arranged.

Although a so-called parting portion exists on the surface of the electro-optical panel, the parting portion is not provided from the manufacturing stage to the peripheral edge of the transparent substrate. Therefore, the light of the illumination device may enter from the periphery of the transparent substrate to cause white spots in the display portion. In this invention, by forming the frame-shaped film around the active area and up to the peripheral edge of the transparent substrate, the light of the lighting device is prevented from entering the active area and the whiteout phenomenon of the display is prevented. I chose

In the electro-optical device according to the next invention, in the above-mentioned structure, the film is a parting portion outside the effective display area of the electro-optical panel and inside the viewing area. . By configuring the parting portion with the film, the number of parts can be reduced. Further, by being inside the viewing area, it is possible to effectively prevent intrusion of external light.

The electro-optical device according to the next invention is characterized in that, in the above structure, the film is made of a cushioning foam material. The foam material absorbs a shock applied to the electro-optical device. For example, when bonding a light guide plate and a transparent substrate, cracks may occur in the transparent substrate from the end position of the light guide plate, but bite the foam material to absorb the shock and prevent the transparent substrate from cracking. To

In the electro-optical device according to the next invention, in the above structure, the film has a structure in which a metal thin film is laminated on a sheet-shaped heat-insulating foam material, and the metal thin film side is the reflecting surface. Characterize.

According to the present invention, the foam material is used for heat insulation, and a metal thin film is laminated on the foam material to form a reflecting surface, so that the light from the light source is reflected and the heat is prevented from being transmitted to the transparent substrate. . Further, since the heat is transferred to another portion through the metal thin film, the semiconductor element mounted on the transparent substrate such as the driver IC is not heated more than necessary, and therefore the malfunction of the semiconductor element is prevented. It is preferable to use a light absorbing material such as black as the foam material.

In the electro-optical device according to the next invention, a driver IC is formed on a part of the surface of a transparent substrate which constitutes the electro-optical panel.
A semiconductor device such as a semiconductor device is mounted, a lighting device is arranged on the semiconductor element mounting surface side, and the light source of the lighting device is positioned so as to substantially face the semiconductor device. In addition, a reflector for reflecting the light of the light source is arranged.

In the case of an electro-optical panel such as a so-called TFD, an illuminating device may be arranged on the semiconductor element mounting side, and its light source may be positioned so as to face the semiconductor element. In this case, the semiconductor element may malfunction due to the invasion and propagation of light into the transparent substrate on which the semiconductor element is mounted, or the heat of the light source is transmitted to the semiconductor element. By arranging the reflector between the light source and the light source, the light of the light source is reflected, so that the light of the light source does not reach the semiconductor element and the heat of the light source is cut off, so that the malfunction of the semiconductor element can be effectively prevented. . Note that the reflector includes a plate-shaped body having a light-reflecting color (white, silver, or the like) on the light source side, a reflective film formed so as to cover the semiconductor element, and the like.

In the electro-optical device according to the next invention, a driver IC is formed on a part of the surface of a transparent substrate which constitutes the electro-optical panel.
A semiconductor device such as a semiconductor device is mounted, a lighting device is arranged on the semiconductor element mounting surface side, and the light source of the lighting device is positioned so as to substantially face the semiconductor device. In addition, a heat insulator that blocks the heat of the light source is arranged. That is, since the heat of the light source is blocked by the heat insulator, the semiconductor element can be prevented from malfunctioning due to the heat.

In the electro-optical device according to the next invention, a driver IC is formed on a part of the surface of a transparent substrate which constitutes the electro-optical panel.
A semiconductor device such as a semiconductor device is mounted, a lighting device is arranged on the semiconductor element mounting surface side, and the light source of the lighting device is positioned so as to substantially face the semiconductor device. In addition, a heat radiating plate that blocks the light of the light source and contacts the light source to radiate the heat of the light source is arranged.

By bringing the light source into contact with the heat dissipation plate and diffusing the heat of the light source through the heat dissipation plate, the heat transmitted to the semiconductor element is reduced. Further, since the heat radiation plate blocks the light of the light source, it becomes difficult for the light of the light source to travel to the semiconductor element. Thereby, the malfunction of the semiconductor element can be effectively prevented.

In the electro-optical device according to the next invention, in the above structure, the heat dissipation plate has a structure in which a metal thin film is laminated on a sheet-shaped heat-insulating foam material, and the metal thin film side is the reflecting surface. Is characterized by.

As a result, the light of the light source traveling to the semiconductor element is reflected by the metal thin film which is the reflecting surface. Further, the heat of the light source is radiated by the metal thin film, and the heat transmitted to the semiconductor element is blocked by the heat insulating foam material. As a result, malfunction of the semiconductor element is effectively prevented.

In the electro-optical device according to the next invention, in the above-mentioned structure, the reflector or heat sink is further arranged around the active area of the electro-optical panel and up to the periphery of the transparent substrate constituting the electro-optical panel. It is characterized by the frame shape.

That is, by forming the frame-shaped film around the active area and up to the peripheral edge of the transparent substrate, it becomes difficult for the light of the illumination device to enter the active area. For this reason, the white spots in the display are prevented.

An electro-optical device according to the next invention is an electro-optical panel in which a semiconductor element such as a driver IC is mounted on a partial surface of a transparent substrate, and a light which is arranged on one side of the electro-optical panel and illuminates the semiconductor element. A lighting device having a light source that emits light and a light guide plate that guides the light of the light source, a frame that houses the electro-optical panel and the lighting device, one surface on the semiconductor element side is a light absorbing surface and the other surface on the light source side is a reflecting surface In other words, a film is provided between the transparent substrate of the electro-optical panel and the light guide plate of the illuminating device, and between at least one of these and the frame to adhere the both.

The film serves as a light absorbing surface on the semiconductor element side and attenuates light propagating through the transparent substrate. Further, the light of the light source is reflected on the reflection surface to prevent the light from traveling to the semiconductor element. This prevents malfunction of the semiconductor element. Further, the illuminating device and the electro-optical panel are fixed to the frame by adhering the transparent substrate and the light guide plate and adhering one of them to the frame by the film. As a result, the electro-optical device can be assembled by using the film, which simplifies the assembly. Further, since it is possible to assemble with a single film, it is not necessary to separately provide a fixing tape, a light shielding tape, a heat insulating tape and the like as in the conventional case, so that the structure is simplified.

The electro-optical device according to the next invention is characterized in that, in the above structure, the film is made of a cushioning foam material. This foam material is interposed between the light guide plate and the transparent substrate and absorbs a shock applied to the electro-optical device to prevent the transparent substrate from cracking.

A double-sided tape according to the next invention is arranged between a semiconductor element of a transparent substrate constituting an electro-optical panel and a light source of an illuminating device, and the semiconductor element side is a light absorbing surface and the light source side is a reflecting surface. The transparent substrate and the light guide plate of the lighting device are bonded together.

According to this double-sided tape, the transparent substrate and the light guide plate are adhered to each other, the light of the light source is prevented from proceeding to the semiconductor element by the reflecting surface, and the external light propagating in the transparent substrate is absorbed by the light absorbing surface. Attenuate with. Thereby, the assembly of the electro-optical device can be facilitated, and the malfunction of the semiconductor element can be prevented.

An electronic apparatus according to the next invention uses the electro-optical device described in any one of the above as a display device.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below in detail with reference to the drawings. The present invention is not limited to this embodiment. Further, the constituent features of the embodiments of the present invention include what can be easily replaced by those skilled in the art, or those which are substantially the same.

(Embodiment 1) FIG. 1 is an assembly view showing a liquid crystal display device according to Embodiment 1 of the present invention. Figure 2
3 and 4 are cross-sectional views of the liquid crystal display device shown in FIG. The liquid crystal display device 100 includes a liquid crystal display panel 1 and
An illumination device 2 that illuminates the liquid crystal display panel 1 and a frame 3 that houses the liquid crystal display panel 1 and the illumination device 2 are provided. The liquid crystal display panel 1 has a structure in which liquid crystal is sealed between two glass transparent substrates 4 and 5, and a driver IC 6 for driving a liquid crystal display unit is COG mounted on the lower transparent substrate 5. There is. Although not shown, a deflection plate is laminated on the outer surfaces of the two transparent substrates 5 and 6.

The lighting device 2 includes a plurality of LEDs 7 and a light guide plate 8.
Composed of and. The light guide plate 8 is made of a transparent acrylic plate, and is provided with a diffusion film, a reflection film, a prism sheet, etc., if necessary. The LED 7 is provided on the flexible printed board 9 connected to the electrode pattern of the transparent substrate 5, and the LED 7 on the flexible printed board 9 is
As shown in FIG. 2, it is arranged at a predetermined position (side surface position of the light guide plate 8) of the frame 3 in a curved state (details are omitted in FIG. 1).

The light guide plate 8 and the liquid crystal display panel 1 are fixed to the frame 3 with a double-sided tape 10. The double-sided tape 10 has a frame shape as shown in FIG.
The width of the portion corresponding to the mounting area 5a of the driver IC 6 is large. As shown in FIG. 4B, the double-sided tape 10 has a structure in which a metal film 12 is formed on one surface of a sheet-shaped foam material 11. The metal film 12 is formed by depositing aluminum or silver. In particular, it is preferable to use aluminum from the viewpoint of heat transfer. In the foam material 11,
The liquid crystal display panel 1 is provided with a cushioning property in order to prevent it from being damaged. For the foam material 11, for example, a polyethylene sheet cross-linked with a chemical cross-linking agent is foamed up to about 5 to 40 times to form closed cells, and a black pigment is mixed into the material to make it a light-absorbing black color. Use one.

In the double-sided tape 10, an adhesive layer 13 is formed on the surface of the foam material 11 and the surface of the metal film 12 in advance, and a release sheet 14 is attached to both surfaces thereof. An acrylic adhesive is used for the adhesive layer 13, but it is preferable to use an adhesive mixed with a black pigment for the adhesive on the surface of the foam material 11 in order not to impair the function as a light absorbing surface. When the double-sided tape 10 is actually used, the release sheet 14 is peeled off to expose the adhesive layer 13. The double-sided tape 10 configured in this manner has heat insulating properties and cushioning properties due to the foam material 11, and reflective properties and heat transfer properties due to the metal film 12. The frame 3 is made of resin, and the guide wall 3 in which the light guide plate 8 is inserted
a and a guide wall 3b into which the liquid crystal display panel 1 is inserted, and a constant step is provided between them. Also LED
7 is provided with a hole 3c through which L is inserted.
The ED 7 penetrates and projects into the frame 3.

In order to assemble this liquid crystal display device 100, first, the light guide plate 8 is put in a predetermined position in the frame 3, and then the release sheet 14 on the metal film 12 side of the double-sided tape 10 is peeled off, so that the light guide plate 8 is attached to the frame 3. Paste it on. Since the double-sided tape 10 has a frame shape and is slightly larger than the light guide plate 8, the double-sided tape 10 is adhered to the peripheral edge of the light guide plate 8 with the adhesive layer 13 and also to the step surface 3d of the frame 3. To be done. Thereby, the light guide plate 8 can be fixed to the frame 3. Next, the foam material 11 of the double-sided tape 10
The release sheet 14 on the side is peeled off to expose the adhesive layer 13.

Subsequently, the liquid crystal display panel 1 is placed thereon, and is bonded to the light guide plate 8 and the transparent substrate 5 of the liquid crystal display panel 1 with the adhesive layer 13. In addition, as shown in FIG.
Since the LED 7 is mounted on the flexible printed circuit board 9 connected to the transparent substrate 5, the flexible printed circuit board 9 is curved and the LED 7 is mounted on the hole 3c of the frame 3.
To insert. In this state, the LED 7 is located on the side surface of the light guide plate 8 and below the driver IC 6 in the drawing. The liquid crystal display panel 1 has a frame 3
It may be securely fixed by a hook or other locking means 3e provided on the.

As described above, if the light guide plate 8 and the transparent substrate 5 are fixed to the frame 3 by the double-sided tape 10, the assembly process of the liquid crystal display device 100 can be simplified and the number of parts can be reduced. In the first embodiment,
As shown in FIG. 3, the light guide plate 8 is held by attaching the lower surface of the double-sided tape 10 to the stepped upper surface 3d of the frame 3 and the light guide plate 8, and the liquid crystal display panel 1 is attached to the upper surface thereof. Although the liquid crystal display panel 1 is held, the attachment form is not limited to this. For example, the light guide plate 8 may be fixed by a hook portion (not shown) of the frame 3, and the liquid crystal display panel 1 may be bonded to the light guide plate 8 via the double-sided tape 10.

In this liquid crystal display device 100, the back surface of the driver IC mounting area 5a of the transparent substrate 5 is covered with the double-sided tape 10 in this assembled state, and the LED 7 is not in contact with the double-sided tape 10 and the LED 7 of the LED 7 is not in contact. The double-sided tape 10 exists on the optical path. That is, the double-sided tape 10 is arranged between the LED 7 and the driver IC 6, and therefore is located on the optical path of the LED 7. The LED 7 does not have to be located immediately below the driver IC 6, and may be on the optical path of the LED 7 even when it is completely deviated.

FIG. 5 shows the positional relationship between the double-sided tape and the liquid crystal display panel. The inner edge 10a of the double-sided tape 10 functions as a parting line. Therefore, the inner edge 10a of the double-sided tape 10 is positioned (or coincides) with the outer edge of the active area AE of the liquid crystal display panel 1,
It is also located inside the viewing area VE. on the other hand,
The outer edge 10b of the double-sided tape 10 is attached to the outer peripheral edges 5a, 6a of the transparent substrates 5, 6 of the liquid crystal display panel 1. In this way, the double-sided tape 10 is formed up to the outer peripheral edges 5a and 6a so that the light of the LED 7 is transmitted through the vicinity of the outer peripheral edges of the transparent substrates 5 and 6 and leaks to the display side, and white portions are generated on the screen. This is to prevent it.

Further, in this embodiment, the double-sided tape 1
It is preferable to use the parting line as 0. As a result, it is not necessary to provide a separate parting, and the number of parts can be reduced. In this case, the active area and the parting line in FIG. 5 match.

In the above structure, the light L1 of the LED 7 is
Since it is reflected by the metal film 12 of the double-sided tape 10, it does not enter the driver IC 6. Also, the light L of the LED 7
1 does not leak from the peripheral edges of the transparent substrates 5 and 6 to the display side. On the other hand, external light L2 such as sunlight propagates through the transparent substrate 5, but since the driver IC side of the double-sided tape 10 is colored black, it is absorbed and attenuated by the double-sided tape 10. Therefore, the double-sided tape 10 can effectively prevent unnecessary light L from entering the driver IC 6 and causing a malfunction.

Further, since the infrared rays of the heat H of the LED 7 are reflected by the metal film 12, the heating of the double-sided tape 10 itself and the transparent substrate 5 adhered thereto can be suppressed. In particular, the heat input to the transparent substrate 5 is minimized by the heat insulating effect of the foam material 11 of the double-sided tape 10. Further, the metal film 12 serves as a heat transfer member to diffuse and dissipate heat to the surroundings. Since the area of the double-sided tape 10 is increased by forming the double-sided tape 10 into a frame shape, more heat dissipation effect can be expected. As a result, the double-sided tape 10 and the transparent substrate 5 in the vicinity of the LED 7 are not locally heated, and the driver IC 6 does not erroneously detect the ambient temperature.
It is possible to effectively prevent the C6 from performing an erroneous drive operation.

Further, the liquid crystal display device 1 according to the first embodiment
In 00, as shown in FIG. 6, the double-sided tape 15 may be provided only in the driver IC mounting area 5a. In this case, it is necessary to provide a parting line separately. Also,
FIG. 7 shows a partial cross-sectional view showing another form of the double-sided tape.
In this way, a structure in which the foam material 17 of the double-sided tape 16 mixed with the black pigment to form a sheet and the foam material 18 mixed with the white pigment to form a sheet are bonded together May be. In the double-sided tape 16, the black foam material 17 serves as a light absorbing surface and the white foam material 18 serves as a reflecting surface, so that the double-sided tape 16 has light shielding properties, reflective properties, heat insulating properties, and cushioning properties. Further, aluminum powder may be added to the white foam material 18 (not shown). In this way, the heat dissipation of the white foam material 18 can be improved.

(Second Embodiment) FIG. 8 is a sectional view showing a liquid crystal display device according to a second embodiment of the present invention. This liquid crystal display device 200 is a TFD type liquid crystal display panel 201.
Is used. TFD type liquid crystal display panel 201
Is characterized in that a diode is used as an active element, and has a configuration in which liquid crystal is enclosed between two glass transparent substrates 202 and 203, and a driver IC 204 is COG-mounted on one transparent substrate 202. A deflecting plate (not shown) is provided on the surfaces of the transparent substrates 202 and 203. The transparent substrate 202 on the display side has a black frame-shaped parting 205 located outside or at the boundary of the active area, and the transparent substrate. A black light-shielding tape 206 is provided on the surface of 202 opposite to the driver IC 204.

A double-sided tape 210 having the same structure as that of the first embodiment is attached to the surface of the transparent substrate 203 (so-called upper glass substrate) which is not COG-mounted. Then, with this double-sided tape 210, the light guide plate 208 of the illumination device 207 is attached and held. In this case, as the double-sided tape 210, it is preferable to use one having a certain degree of rigidity in which the metal film 12 is formed on the foam material 11 as shown in FIG. The double-sided tape 210 may be a mere foam material having a heat insulating property or a mere metal plate having a reflecting property (not shown). Furthermore, double-sided tape 210
It is necessary to fulfill the function of adhesion as the case where it is interposed between the transparent substrate 203 and the light guide plate 208 (frame-shaped portion), and the portion 210a provided in the eaves-like shape on the driver IC 204 is provided. Does not require an adhesive layer (that is, the eaves portion 210a does not function as the double-sided tape 210). The LED 209 is a flexible printed circuit board 211 connected to the electrode pattern of the transparent substrate 202.
A plurality of them are mounted on the flexible printed circuit board 211, and the flexible printed circuit board 211 is bent to be positioned on the side surface of the light guide plate 208. In addition, the flexible printed circuit board 211 is
It has a core 212 that serves as a guide when curved. The core 212 has a groove 213 having a semicircular cross section and holding the double-sided tape 210.

When the liquid crystal display device 200 is assembled,
The LED 209 and the driver IC 204 are substantially opposed to each other, and the double-sided tape 210 is interposed between them.
That is, since nothing normally exists between the LED 209 and the driver IC 204, the light of the LED 209 directly reaches the driver IC 204, but since the double-sided tape 210 is positioned on the optical path of the LED 209,
The light L1 of 9 does not reach the driver IC 204. Further, since the double-sided tape 210 is formed of a foam material, it has a high heat insulating property, and since the metal film 12 is provided on the LED side,
It reflects the infrared light of the ED 209 (the metal film 12 is not shown). Further, the heat H of the LED 209 is diffused to the surroundings by the metal film 12 to prevent local heating. This can prevent the driver IC 204 from being heated by the LED 209 and malfunctioning. Although external light L2 such as sunlight propagates through the transparent substrate 202, it is absorbed and attenuated by the light shielding tape 206, so that the external light L2 incident on the driver IC 204 is extremely small. Further, since the external light L2 is blocked by the light shielding tape 206, the external light L2 does not directly enter the driver IC.

Further, the double-sided tape 210 is used only as a frame-shaped portion, and with this, the transparent substrate 203 and the light guide plate 2 are provided.
08 may be adhered and a metal plate functioning as a reflector and / or a heat insulator may be projected from the core 212 between the driver IC 204 and the LED 209. In addition,
The inner edge of the double-sided tape 210 is preferably located outside the inner edge of the parting strip 205. This double-sided tape 210
By assembling the light guide plate 208 and the transparent substrate 203, the liquid crystal display device 200 can be easily assembled.

As described above, according to the liquid crystal display device 200, the input of the light L and the heat H to the driver IC 204 is limited, so that the malfunction of the driver IC 204 can be effectively prevented.

FIG. 9 is a partial sectional view showing a modification of the liquid crystal display device according to the second embodiment. In this liquid crystal display device 250, the double-sided tape 210 is placed above the LED 209.
Is characterized in that it is adhered to the metal film 12, and the other configurations are the same as above. By bringing the LED 209 into contact with the metal film 12, the double-sided tape 210 functions as a radiator and positively diffuses and dissipates the heat of the LED 209 to the surroundings. Further, the heat H of the LED 209 is blocked by the heat insulating layer formed of the foam material 11, and the air layer 214 is further present, so that it does not reach the driver IC 204. Therefore, it is possible to prevent the driver IC 204 from erroneously detecting the ambient temperature due to the heat H of the LED 209, so that the driver IC 204 can be correctly driven.

When the LED 209 is bonded to the metal film 12, the LED 209 is mounted on the flexible printed circuit board 2.
Since it is mounted on the LED 11, the adhesive is applied to the upper part of the LED 209 and pushed up together with the flexible printed board 211 to be bonded to the metal film 12. In addition, LED2
A case in which a heat transfer member is interposed between 09 and the metal film 12 so that they are substantially in contact with each other is also included (not shown). Furthermore, both the second embodiment and the modified examples thereof,
It is preferable that the foam material 11 to be the heat insulating layer has a light absorbing property in which a black pigment is mixed. As a result, even if the external light L2 enters between the driver IC 204 and the double-sided tape 210, the double-sided tape 210 allows the external light L2 to enter.
Can be attenuated, and the malfunction of the driver IC 210 can be further prevented.

As another modification, the double-sided tape 21
0 is a sheet of foam material mixed with aluminum powder,
A sheet of foam material mixed with a black pigment may be laminated so that heat radiation is provided on one surface and heat insulation is provided on the other surface (not shown). When the LED is brought into contact with the surface mixed with aluminum powder, the same effect as described above can be obtained.

(Third Embodiment) FIG. 10 shows a third embodiment.
FIG. 3 is a partial cross-sectional view showing a liquid crystal display device according to the present invention. The liquid crystal display device 300 is characterized in that the heat dissipation layer 301 is provided on the back surface of the flexible printed board 9 on which the LEDs are mounted. Since other configurations are the same as those of the liquid crystal display device according to the first embodiment, description thereof will be omitted and the same components will be denoted by the same reference numerals. The heat H2 of the LED 7 is transmitted to the heat dissipation layer 301 via the flexible printed board 9, and the heat dissipation layer 3
01 diffuses and radiates heat to the light guide plate 8 and a reflection sheet (not shown). The heat dissipation layer 301 may be applied to the liquid crystal display devices 200 and 250 shown in FIGS. 8 and 9. With such a configuration, the heat of the LED 7 can be further radiated, so that the malfunction of the driver IC can be further prevented.

(Fourth Embodiment) FIG. 11 is a perspective view showing a portable telephone which is an electronic apparatus according to a fourth embodiment of the present invention. This mobile phone 400 is the same as that of the first embodiment.
Alternatively, the liquid crystal display devices 100 to 300 described in 2, a housing 402 that houses the liquid crystal display devices 100 to 300 and the electronic circuit 401, a microphone 403, and a speaker 4 are provided.
04 and. In the mobile phone 400, the signal data of the electronic circuit 401 and the like are sent to the driver ICs of the liquid crystal display devices 100 to 300, and the driver IC drives and controls the liquid crystal display panel based on the acquired data. Mobile phone 4
In the case of 00, there is a case where a telephone call is made for a long time, and since the housing 402 itself is relatively small, heat of the LED is easily transmitted to the driver IC. Also, since it is used outdoors, it is in an environment where external light can easily enter. Therefore, by adopting the configurations described in the first to third embodiments, the malfunction of the driver IC can be prevented and the mobile phone 400 can be normally used.

If the above-mentioned double-sided tape or heat dissipation plate is thermally connected to the housing 402, heat dissipation to the outside can be sufficiently performed. In addition, the above-described first to first embodiments
The liquid crystal display device shown in 3 can be applied not only to mobile phones but also to liquid crystal televisions, car navigations, personal computers, ticket vending machines, watches and the like. Further, in the above-described embodiment, the driver IC of the liquid crystal display device is described as an example, but the present invention can be applied to the case of other semiconductor elements. For example SOG
It is also useful for (System On Glass) display devices.

[0056]

As described above, in the electro-optical device according to the present invention, a semiconductor element such as a driver IC is mounted on a part of the surface of the transparent substrate which constitutes the electro-optical panel, and the surface opposite to the semiconductor element mounting surface is mounted. The lighting device is arranged on the surface side and the light source of the lighting device is positioned so as to substantially face the semiconductor element, and between the light source and the transparent substrate, one surface of the semiconductor element side is a light absorbing surface. Since the film whose other surface on the light source side serves as a reflection surface is arranged, malfunction of the driver IC can be effectively prevented.

In the electro-optical device according to the present invention,
A semiconductor element such as a driver IC is mounted on a part of the surface of a transparent substrate that constitutes the electro-optical panel, an illuminating device is arranged on the side opposite to the semiconductor element mounting surface, and the light source of the illuminating device is the semiconductor element. Since they are positioned so as to face each other and the heat insulating layer is provided between the light source and the transparent substrate, malfunction due to heat of the semiconductor element can be effectively prevented.

In the electro-optical device according to the present invention,
Since the film has a frame shape that is arranged around the effective display area of the electro-optical panel and up to the periphery of the transparent substrate that constitutes the electro-optical panel, it is possible to prevent the whiteout phenomenon in the display portion.

In the electro-optical device according to the present invention,
Since the film is a parting portion outside the effective display area of the electro-optical panel and inside the viewing area, the number of parts can be reduced and external light can be prevented from invading the driver. A malfunction of a semiconductor element such as an IC can be prevented.

In the electro-optical device according to the present invention,
Since the film is made of the cushioning foam material, it is possible to prevent the electro-optical device from being damaged by absorbing the shock applied to the electro-optical device.

In the electro-optical device according to the present invention,
The film has a structure in which a metal thin film is laminated on a sheet-shaped heat-insulating foam material, and the metal thin film side is the reflecting surface,
Since it becomes difficult for heat to be transferred to the semiconductor element, malfunction of the semiconductor element can be effectively prevented.

Further, in the electro-optical device according to the present invention,
A semiconductor element such as a driver IC is mounted on a part of the surface of a transparent substrate that constitutes an electro-optical panel, and a lighting device is arranged on the semiconductor element mounting surface side, and a light source of the lighting device substantially faces the semiconductor element. Since the reflector for reflecting the light of the light source is arranged between the light source and the semiconductor element, the electro-optical device having the configuration in which the illuminating device is arranged on the semiconductor element mounting side is It is possible to prevent malfunction of the semiconductor element due to light.

In the electro-optical device according to the present invention,
A semiconductor element such as a driver IC is mounted on a part of the surface of a transparent substrate that constitutes an electro-optical panel, and a lighting device is arranged on the semiconductor element mounting surface side, and a light source of the lighting device substantially faces the semiconductor element. Since a heat insulating body that blocks heat of the light source is arranged between the light source and the semiconductor element, the electro-optical device having the configuration in which the lighting device is arranged on the semiconductor element mounting side is It is possible to prevent malfunction of the semiconductor element due to heat.

In the electro-optical device according to the present invention,
A semiconductor element such as a driver IC is mounted on a part of the surface of a transparent substrate that constitutes the electro-optical panel, and a lighting device is arranged on the semiconductor element mounting surface side, and a light source of the lighting device substantially opposes the semiconductor element. Since the heat radiation plate that blocks the light of the light source and radiates the heat of the light source in contact with the light source is disposed between the light source and the semiconductor element, the lighting device is mounted on the semiconductor element mounting side. Even in the electro-optical device having a configuration in which the above-described arrangement is provided, malfunction of the semiconductor element can be effectively prevented.

In the electro-optical device according to the present invention,
The heat sink has a structure in which a metal thin film is laminated on a sheet-shaped heat-insulating foam material, and the metal thin film side serves as the reflecting surface, so that the heat and the light of the light source are shielded, and the malfunction of the semiconductor element is effective. Can be prevented.

In the electro-optical device according to the present invention,
Since the reflector or the heat sink has a frame shape that is arranged around the effective display area of the electro-optical panel and up to the periphery of the transparent substrate that constitutes the electro-optical panel, the lighting device is arranged on the semiconductor element mounting side. Even in the electro-optical device having the configuration, it is possible to prevent the blank area phenomenon in the display portion.

In the electro-optical device according to the present invention,
An electro-optical panel in which a semiconductor element such as a driver IC is mounted on a partial surface of a transparent substrate, a light source disposed on one side of the electro-optical panel, which emits light to the semiconductor element, and a light guide plate which guides the light from the light source. A lighting device having, a frame for housing the electro-optical panel and the lighting device, one surface of the semiconductor element side is a light absorbing surface and the other surface of the light source side is a reflecting surface,
Between the transparent substrate of the electro-optical panel and the light guide plate of the lighting device,
Further, since the film is provided between at least one of these and the frame to adhere the two, the semiconductor device is prevented from malfunctioning, and the assembly and configuration of the electro-optical device are simplified.

In the electro-optical device according to the present invention,
Since the film is made of the cushioning foam material, it is possible to prevent the electro-optical device from being damaged by absorbing the shock applied to the electro-optical device.

Further, in the double-sided tape according to the present invention, the double-sided tape is arranged between the semiconductor element of the transparent substrate which constitutes the electro-optical panel and the light source of the illuminating device, and the semiconductor element side is the light absorbing surface and the light source side is the reflecting surface. Since the transparent substrate and the light guide plate of the lighting device are adhered to each other, the electro-optical device can be easily assembled and the semiconductor device can be prevented from malfunctioning.

[Brief description of drawings]

FIG. 1 is an assembly diagram showing a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the liquid crystal display device shown in FIG.

3 is a cross-sectional view of the liquid crystal display device shown in FIG.

FIG. 4 is an explanatory diagram showing the double-sided tape shown in FIG.

FIG. 5 shows a positional relationship between the double-sided tape and the liquid crystal display panel.

FIG. 6 is a partial cross-sectional view showing another form of the double-sided tape.

FIG. 7 is a partial cross-sectional view showing another form of the double-sided tape.

FIG. 8 is a sectional view showing a liquid crystal display device according to Embodiment 2 of the present invention.

FIG. 9 is a partial cross-sectional view showing a modified example of the liquid crystal display device according to the second embodiment.

FIG. 10 is a partial cross-sectional view showing a liquid crystal display device according to Embodiment 3 of the present invention.

FIG. 11 is a perspective view showing a mobile phone which is an electronic device according to a fourth embodiment of the present invention.

[Explanation of symbols]

100 liquid crystal display 1 Liquid crystal display panel 2 lighting equipment 3 frames 4,5 transparent substrate 6 Driver IC 7 LED 8 Light guide plate 9 Flexible printed circuit board 10 double-sided tape 11 Foam material 12 metal film 13 Adhesive layer 14 Release sheet

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2H089 HA40 KA15 KA17 QA06 QA16                       TA03 TA07 TA18 TA20                 2H091 FA14Z FA21Z FA23Z FA34Z                       FA45Z GA02 GA11 GA17                       LA04                 2H092 GA50 GA59 NA01 PA06 PA12                       PA13                 5G435 AA12 BB12 EE03 EE05 EE27                       FF03 FF14 LL07 LL08

Claims (15)

[Claims] 1. A semiconductor device such as a driver IC is mounted on a partial surface of a transparent substrate which constitutes an electro-optical panel, and an illuminating device is arranged on the side opposite to the semiconductor device mounting surface and a light source of the illuminating device. Is disposed so as to substantially face the semiconductor element, and between the light source and the transparent substrate, a film is arranged in which one surface on the semiconductor element side is a light absorbing surface and the other surface on the light source side is a reflecting surface. An electro-optical device characterized by the above. 2. A semiconductor element such as a driver IC is mounted on a partial surface of a transparent substrate which constitutes an electro-optical panel, and an illuminating device is arranged on the side opposite to the semiconductor element mounting surface and a light source of the illuminating device. Is located so as to substantially face the semiconductor element, and an insulating layer is provided between the light source and the transparent substrate. 3. The film has a frame shape which is arranged around the effective display area of the electro-optical panel and up to the peripheral edge of the transparent substrate which constitutes the electro-optical panel. The electro-optical device according to. 4. The electro-optical device according to claim 1, wherein the film is a parting portion that is outside the effective display area of the electro-optical panel and is inside the viewing area. . 5. The electro-optical device according to claim 1, wherein the film is made of a cushioning foam material. 6. The film according to claim 1, wherein the film has a structure in which a metal thin film is laminated on a sheet-shaped heat-insulating foam material, and the metal thin film side is the reflecting surface. The electro-optical device according to one. 7. A semiconductor element such as a driver IC is mounted on a part of the surface of a transparent substrate constituting an electro-optical panel, and a lighting device is arranged on the semiconductor element mounting surface side, and the light source of the lighting device is the semiconductor. An electro-optical device characterized in that a reflector, which is positioned so as to substantially face the element, is disposed between the light source and the semiconductor element and reflects the light of the light source. 8. A semiconductor element such as a driver IC is mounted on a part of the surface of a transparent substrate constituting an electro-optical panel, and a lighting device is arranged on the semiconductor element mounting surface side, and the light source of the lighting device is the semiconductor. An electro-optical device, which is disposed so as to substantially face the element and has a heat insulating body disposed between the light source and the semiconductor element to block heat of the light source. 9. A semiconductor element such as a driver IC is mounted on a part of the surface of a transparent substrate that constitutes an electro-optical panel, and a lighting device is arranged on the semiconductor element mounting surface side and the light source of the lighting device is the semiconductor. A heat radiating plate that is positioned so as to substantially face the element and that blocks the light of the light source and that contacts the light source and radiates the heat of the light source is disposed between the light source and the semiconductor element. Electro-optical device. 10. The electric radiator according to claim 9, wherein the heat dissipation plate has a structure in which a metal thin film is laminated on a sheet-shaped heat-insulating foam material, and the metal thin film side is the reflecting surface. Optical device. 11. The frame-shaped reflector or the heat dissipation plate is arranged around the effective display area of the electro-optical panel and up to the periphery of the transparent substrate that constitutes the electro-optical panel. The electro-optical device according to any one of claims 7, 9, and 10. 12. An electro-optical panel in which a semiconductor element such as a driver IC is mounted on a partial surface of a transparent substrate, a light source arranged on one side of the electro-optical panel and emitting light for irradiating the semiconductor element, and the light source of the light source. A lighting device having a light guide plate for guiding light, a frame for housing the electro-optical panel and the lighting device, one surface of the semiconductor element side is a light absorbing surface and the other surface of the light source side is a reflecting surface, and the electro-optical panel is transparent. An electro-optical device comprising: a substrate and a light guide plate of an illuminating device; and a film interposed between at least one of the substrate and the frame to adhere the two. 13. The electro-optical device according to claim 12, wherein the film is made of a cushioning foam material. 14. A transparent substrate that constitutes an electro-optical panel and is disposed between a semiconductor element of a transparent substrate and a light source of a lighting device, and the semiconductor device side is a light absorbing surface and the light source side is a reflecting surface. A double-sided tape characterized by being bonded to a light guide plate. 15. An electronic apparatus using the electro-optical device according to claim 1 as a display device.