JP2003329409A - Positioning method and positioning device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positioning method and a positioning device which can be used when the accurate positioning is required irrespective of the increase in size of an object. <P>SOLUTION: The present invention provides a positioning method which comprises image-picking up the entire object roughly in such a degree of accuracy that the rough position of a positioning mark can be understood, recognizing a region where the positioning mark is present from the result of the rough image-pickup, image-picking up the recognized region where the mark is present in detail, recognizing the detailed position of the positioning mark from the detailed image-pickup of the region where the mark is present, recognizing the position of the object to be positioned from the recognized detailed position of the positioning mark, and positioning the object based on the recognized position of the object to be positioned, and the present invention also provides a positioning device. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of aligning an alignment object provided with alignment marks required for various detailed alignments, which are represented by various circuit boards during manufacturing and inspection. And the alignment device.

[0002]

2. Description of the Related Art Among various semiconductor package substrate systems, TCP (Tape Carrier Package) is used.
The method such as e) or COF (Chip On Film) is one in which a circuit pattern is formed using a tape film such as polyimide as a base material. Up to now, the size of the circuit pattern was relatively large and the number of impositions was small, but in recent years, the number of impositions has been increasing due to the size reduction and the increase in the width of the base material of the semiconductor package substrate.

Various inspections such as electrical characteristics, wiring, and appearance of a semiconductor package substrate are often conducted on a piece-by-piece basis. This is because when the area of the product is large, the position shift is likely to occur and accurate inspection cannot be performed. Therefore, it is better to inspect in units of as small an area as possible, and in the case of wiring inspection, one inspection head This is because it is possible to reduce the cost of the inspection head by reducing the number of pins as much as possible.

Therefore, the conventional alignment method in which the alignment is performed for each piece before the inspection has a drawback that the number of alignments increases as the number of imposition increases and the inspection speed decreases.

Further, when the alignment is performed, the piece 1
It is necessary to recognize the positional relationship between two or more alignment marks on the sheet. In the conventional alignment method, the camera 2
Either one or more cameras are used to image each alignment mark, or one camera is moved to the location of each alignment mark to image. In the former case, if the size of one substrate becomes small, it becomes impossible to simultaneously arrange the cameras at the positions where the alignment marks are present. In the case of the latter, time is required to move the camera every time alignment is performed,
After all, the inspection speed decreases.

[0006]

DISCLOSURE OF THE INVENTION The present invention is intended for the purpose of increasing the size of an object, such as alignment performed before various inspections of various semiconductor package substrates formed on a tape film base material, even though the object is large. It was made in order to solve the above problems in the case where accurate alignment is required, for example, the alignment method before various inspections of various semiconductor package substrates with a smaller size and a larger number of impositions than the conventional method and This relates to the case of a device or the like.

[0007]

In order to achieve the above object in the present invention, in the invention of claim 1, the accuracy of grasping the approximate position of the alignment mark for the alignment object provided with the alignment mark. At the same time, the whole area is roughly imaged, the existence area of the alignment mark is recognized from the result of the outline imaging, the recognized existence area is imaged in detail, and the detailed position of the alignment mark is recognized from the detailed imaging of the existence area. The present invention provides a positioning method characterized by recognizing the position of a positioning target object based on the detailed position of the recognized positioning mark and performing positioning based on the recognized position of the positioning target object. .

Further, according to the invention of claim 2, an image pickup means for roughly picking up an image of the alignment object provided with the alignment mark with accuracy with which the approximate position of the alignment mark is grasped, and a result of the rough image pickup. Mark existence area recognition means for recognizing the existence area of the alignment mark, detailed imaging means for making a detailed image of the recognized existence area, detailed position recognition means for recognizing the detailed position of the alignment mark from the detailed imaging of the existence area, recognition The object position recognizing means for recognizing the position of the object to be aligned by the detailed position of the registered alignment mark, and the aligning means for performing the alignment by the recognized position of the object to be aligned. A registration device is provided.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

FIG. 1 is a top view showing the outline of the alignment state according to the first embodiment of the present invention. Further, FIG. 2 is a flowchart showing an outline of alignment according to the first embodiment of the present invention. The object to be aligned is the object to be inspected and is a tape film.

In FIG. 1, reference numeral 1 is a tape film on which a semiconductor package substrate circuit pattern, which is an object to be inspected, is formed.

Reference numeral 2 is an area where a circuit pattern of the semiconductor package substrate is formed on the tape film 1,
A semiconductor package substrate circuit piece 3 (described later) is attached on multiple sides to form a unit. Circuit pattern forming regions 2 are periodically and repeatedly formed on the tape film 1.

Numerals 21 and 22 are alignment marks of the circuit pattern formation region 2, which are formed inside the circuit pattern formation region 2 for alignment in the circuit pattern formation process and the inspection process. Circuit pattern formation area 2
In general, there are many alignment marks, and FIG. 1 shows two alignment marks 21 and 22.

Reference numeral 3 is one piece of a semiconductor package substrate circuit. Pieces 3 are finally cut off one by one
Although it becomes a single semiconductor package substrate, a plurality of pieces 3 are formed on the inside of the circuit pattern formation region 2 in multiple faces in the production process.

Reference numeral 31 is an alignment mark formed inside the piece 3 for alignment in an inspection process, an electric element mounting process and the like. Generally, a plurality of alignment marks 31 are generally formed,
FIG. 1 shows the case of two pieces.

Reference numeral 4 denotes at least the circuit pattern forming area 2
It is a line sensor which is a schematic image pickup mechanism installed so that the whole image can be picked up.
An image of the circuit pattern forming area 2 is picked up in synchronization with the conveyance by the first and second 72, and the image data is sent to the calculation processing means 5 (described later).

The line sensor 4 may be installed in the immediate vicinity of the tape film 1 to take an image directly, or the line sensor 4 may be taken from a position away from the tape film 1 by using an optical system such as a lens.

In order to perform highly accurate alignment, it is necessary to capture an image of the circuit pattern forming area 2 with high resolution. Currently, the number of pixels of a general area sensor is 200
Although it is up to about 0 × 2000, the resolution is often insufficient.

For example, a tape film having a width of 50 mm is 20
When the image is picked up by an area sensor of 00 × 2000 pixels, the resolution is 25 μm, but the alignment accuracy is higher, and the size of the wiring pattern that can be handled is up to about 50 μm. Many things cannot be handled.

Therefore, in the present invention, the number of pixels is 5000 or 1.
The line sensor 4 of 0000 is used to obtain high resolution image data. When a line sensor with 10000 pixels is used to capture an image of a tape film with a width of 50 mm, the resolution is 5 μm, and the size of the wiring pattern that can be used is
It is up to about μm, and it can be applied to most semiconductor package substrates.

Reference numeral 5 denotes a calculation processing means, which is the line sensor 4
The pattern matching processing of the alignment marks 21, 22 of the circuit pattern forming area 2 and the alignment mark 31 of each piece 3 with the shape of the alignment marks 21, 22, 31 registered in advance from the image data from The alignment mark 21,
The respective relative position coordinates are obtained by calculating the respective barycentric positions of the images of 22 and 31.

Alignment marks 21, 22 and 31
Should always have the same relative position coordinates, but in reality, the relative position may slightly shift due to expansion and contraction of the tape film 1 or a slight shift in step feed during exposure.

In order to detect this, it is necessary to recognize the positions of all the alignment marks in each circuit pattern forming area 2.

Reference numerals 61 and 62 denote cameras, which are detailed image pickup mechanisms for recognizing detailed positions of the alignment marks 21 and 22, respectively, and are installed in the vicinity of places where various inspections and mountings are performed. The circuit pattern forming area 2 on the tape film 1 is conveyed to this place by the conveying means 71, 72 (described later) and stands still.

First, the relative position coordinates obtained from the image of the line sensor camera 4 by the calculation processing means 5 as described above,
The current positions of the alignment marks 21 and 22 are calculated from the distance from the position of the line sensor 4 to the currently stationary position, and the cameras 61 and 62 are moved to their respective positions. The cameras 61 and 62 have alignment marks 2 respectively.
Imaging of Nos. 1 and 22 is performed, and the image data is sent to the calculation processing unit 5.

The calculation processing means 5 extracts the alignment marks 21 and 22 from the image data by performing pattern matching processing with the shapes of the alignment marks 21 and 22 registered in advance, and further aligns them. Detailed static position coordinates of the alignment marks 21 and 22 are calculated by, for example, calculating the barycentric positions of the images of the marks 21 and 22. Further, from the detailed stationary position coordinates of the alignment marks 21 and 22 and the positional coordinates of the alignment mark 31 of each piece 3 previously calculated from the image data of the line sensor 4, the stationary position of the alignment mark 31 of each piece 3 is calculated. The coordinates are calculated and sent to an inspection mechanism or mounting mechanism (not shown).

In the inspection mechanism and the mounting mechanism, the inspection head and the electric elements are aligned based on the stationary position coordinates of the alignment mark 31 of the piece 3.

Denoted at 71 and 72 are conveying means for conveying the tape film 1 and for stopping it.

The line sensor 4 is the circuit pattern forming area 2
When capturing the image, the tape film 1 is conveyed in synchronization with the image capturing timing.

The circuit pattern forming area 2 is the camera 6
The tape film 1 is conveyed so as to reach the positions 1 and 62, and the alignment marks 21 and 2 of the cameras 61 and 62.
The tape film 1 is held still during image pick-up of 2 and during work of an inspection mechanism and a mounting mechanism (not shown).

[0031]

As described above, the alignment mechanism of the present invention is smaller in size than conventional ones, and can be used for alignment of an object which is difficult to align, such as a semiconductor package substrate for which a alignment camera cannot be arranged. If it is performed or the pieces are aligned for each piece, there is an effect that the number of impositions is larger than in the conventional case and thus it takes much time to perform the alignment in a short time on an object such as a semiconductor package substrate.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an outline of a positioning mechanism according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing an outline of alignment according to the first embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Tape film 2 which is a base material of a semiconductor package circuit board 2 Areas 21 and 22 in which a circuit pattern is formed on the tape film 1 Alignment mark 3 of a circuit pattern forming area 3 1 piece 31 of semiconductor package board circuit 3 piece 3 Alignment mark 4 of the line sensor 5 installed so that the entire circuit pattern forming area 2 can be imaged Calculation processing means 61, 62 Cameras 71, 72 for recognizing the detailed positions of the alignment marks 21, 22 Carrying the tape film 1 Transportation means to be stationary

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Claims (2)

[Claims] 1. An overall image of an alignment object provided with an alignment mark is accurately photographed with the accuracy of grasping the approximate position of the alignment mark, and the area where the alignment mark is present is recognized from the result of the approximate image pickup. , The detailed image of the existing area is recognized, the detailed position of the alignment mark is recognized from the detailed image of the existing area, the position of the alignment target is recognized based on the detailed position of the recognized alignment mark, and the position thereof is detected. A registration method characterized by performing registration according to the recognized position of the alignment object. 2. An image pickup means for roughly picking up an image of an alignment object provided with an alignment mark with accuracy with which an approximate position of the alignment mark can be grasped, and a region where the alignment mark exists is recognized from a result of the rough image pickup. Mark presence area recognition means, detailed image pickup means for performing detailed image pickup of the recognized presence area, detailed position recognition means for recognizing the detailed position of the alignment mark based on the detailed image pickup of the presence area, and detailed position of the recognized alignment mark An alignment device comprising: an object position recognition means for recognizing the position of an alignment object by means of; and an alignment means for performing alignment according to the recognized position of the alignment object.