JP2003328110A - Film deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus wherein a high quality coating film with less particulate defect is formed. <P>SOLUTION: The film deposition apparatus 1 is an apparatus for depositing a film on the surface of a substrate 100 by vacuum deposition and has a chamber 2, a material supply source 3 for supplying a film material 200, a holder 4 for holding the substrate 100 and a filter member 5 for capturing the splash of the film material 200 from the material supply source 3. The filter member 5 is composed of a disc like member on which many fine slits are formed and is installed rotatable by a rotatably driving means 6. A wire brush 7 is installed so that a brush part 71 is brought into contact with the back surface of the filter member 5. When the filter member 5 is rotated by the operation of the rotatably driving means 6 and the brush part 71 relatively slides to the filter member 5 to remove deposits composed of the film material 200 stuck on the filter member 5. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming apparatus for forming a thin film on the surface of an object to be formed by a vapor phase film forming method.

[0002]

2. Description of the Related Art There is known a film forming apparatus for forming a thin film on the surface of an object to be formed by a vapor phase film forming method such as vacuum evaporation. This film forming apparatus is widely used for applications such as forming an optical thin film (antireflection film, highly reflective film, optical filter, etc.) on the surface of an optical component such as a spectacle lens or a camera lens.

In the case of a film forming apparatus for performing vacuum evaporation, an evaporation material (film material) is heated by a resistance heating evaporation source or an electron beam evaporation source to be melted and evaporated or sublimated to form a thin film on an object.

However, in any of the evaporation sources, the entire vapor deposition material cannot be heated uniformly, so that the low temperature portion of the vapor deposition material is repelled and a splash occurs. When this splash adheres to the film-forming target, particle defects are generated on the film-forming surface. The formation of such particulate defects is a problem because it can be observed with the naked eye and impairs the aesthetics of the product in which the thin film is formed, or deteriorates the function of the thin film.

Further, in order to prevent the occurrence of splash, a method of slowly heating in a resistance heating evaporation source,
In the electron beam evaporation source, the temperature distribution of the vapor deposition material may be measured and the electron beam irradiation time for the low temperature part may be lengthened to achieve a uniform temperature distribution. It is not possible to prevent the splash caused by the rapid temperature distribution change caused by the deposits adhering to the inner wall of the chamber and the holder that holds the film formation target falling into the evaporation source, and as a result, particulate defects Could not be completely prevented.

[0006]

An object of the present invention is to provide a film forming apparatus capable of forming a high quality thin film with few particulate defects.

[0007]

The above objects are achieved by the present invention described in (1) to (18) below.

(1) A chamber, a material supply source installed in the chamber for supplying a film material, and a holder installed in the chamber for holding an object to be film-formed,
A film forming apparatus for forming a thin film on the surface of the film-forming target by a vapor-phase film forming method, characterized in that a filter member for catching a splash of the film material from the material supply source is provided. Deposition apparatus.

As a result, it is possible to provide a film forming apparatus capable of forming a high quality thin film with few particulate defects.

(2) The film forming apparatus according to (1), wherein the filter member is a plate-shaped member having a large number of holes formed therein. As a result, the filter member has a simple structure and can be easily manufactured.

(3) The film forming apparatus according to (1), wherein the filter member is formed by forming a large number of holes in a silicon wafer. Thereby, the filter member can be manufactured more easily.

(4) The film forming apparatus according to (2) or (3), wherein the hole is formed in an elongated slit shape. Thereby, a large aperture ratio of the filter member can be secured.

(5) The opening of the filter member is
The above (1) to (4), which is 0.1 to 10000 μm
The film forming apparatus according to any one of 1.

This makes it possible to form a thin film of sufficient quality and prevent the labor required for manufacturing the filter member from becoming excessive.

(6) The film forming apparatus as described in any of (1) to (5) above, which has a displacement means for displacing the filter member. Thereby, the film formation can be performed for a long time.

(7) The filter member has a size having a portion covering the material supply source and a portion not covering the material supply source, and the filter member is displaced by the operation of the displacement means. The film forming apparatus according to (6) above, in which a portion of the filter member that has not covered the material supply source is in a state of covering the material supply source. Thereby, the film formation can be performed for a long time.

(8) The film forming apparatus as described in (6) or (7), wherein the displacement means rotates the filter member. Thereby, the structure of the displacement means can be simplified and the space efficiency can be improved.

(9) The film forming apparatus according to the above (8), wherein the filter member has a disc shape. This allows
The filter member can be easily manufactured.

(10) The film forming apparatus as described in (8) or (9) above, wherein the material supply source is installed between the rotating shaft of the filter member and the outer peripheral portion of the filter member. Thereby, the space efficiency can be improved.

(11) The film forming apparatus as described in (6) or (7) above, wherein the displacing means moves the filter member in parallel. Thereby, the film formation can be performed for a long time.

(12) The film forming apparatus as described in any one of (1) to (11) above, which has a removing means for removing deposits made of the film material attached to the filter member. This can prevent clogging of the filter member.

(13) The film forming apparatus as described in (12) above, wherein the removing means is composed of a brush, a grinding plate or a file.

Thus, the deposit on the filter member can be reliably removed with a simple structure.

(14) Displacement means for displacing the filter member is provided, the removal means is fixedly installed in the chamber, and the filter member is displaced by the operation of the displacement means, The film forming apparatus as described in (12) or (13) above, wherein the removing unit slides relative to the filter member.

Thus, the deposits on the filter member can be removed without interrupting the film formation.

(15) The film forming apparatus as set forth in (14) above, wherein the removing means is installed at a position where the removed deposits do not fall onto the material supply source.

This makes it possible to prevent the occurrence of splash and form a higher quality thin film.

(16) The filter member is of a size having a portion covering the material supply source and a portion not covering the material supply source, and the filter member is displaced by the operation of the displacement means. The part of the filter member that has not covered the material supply source is in a state of covering the material supply source, and film formation is performed while continuously displacing the filter member. (14) or (15) Deposition apparatus.

Thus, the deposits on the filter member can be removed while forming the film.

(17) The filter member is of a size having a portion covering the material supply source and a portion not covering the material supply source, and the filter member is displaced by the operation of the displacement means. , A portion of the filter member that did not cover the material supply source is in a state of covering the material supply source, and in principle, film formation is performed with the filter member stopped, and the material supply source of the filter member is When deposits accumulate on the covered portion, film formation is performed by intermittently displacing the filter member so that the portion of the filter member that did not cover the material supply source covers the material supply source. The film forming apparatus according to (14) or (15) above, which performs

Thus, the deposits on the filter member can be removed while forming the film.

(18) The film forming apparatus as described in any one of (12) to (17) above, which has an adjusting means for adjusting the pressing force of the removing means against the filter member.

As a result, the pressing force of the removing means against the filter member can be adjusted to an optimum size.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION The film forming apparatus of the present invention will be described below in detail with reference to the preferred embodiments shown in the accompanying drawings.

<First Embodiment> FIG. 1 is a sectional side view showing a first embodiment of a film forming apparatus of the present invention, and FIG. 2 is a plan view of a filter member in the film forming apparatus shown in FIG. 4 and FIG. 4 are plan views for explaining the slit formation pattern in the filter member. In addition,
In the following description, the upper side in FIG. 1 is “upper” and the lower side is “lower”.
Say

The film forming apparatus 1 shown in FIG. 1 is an apparatus for forming a thin film on the surface of an object to be formed by vacuum vapor deposition. In addition,
The film forming apparatus of the present invention can also be applied to an apparatus that forms a film by a vapor phase film forming method other than vacuum evaporation (for example, an ion assisted evaporation method, ion plating, sputtering, etc.).

As shown in FIG. 1, the film forming apparatus 1 includes a chamber (vacuum chamber) 2, a material supply source (evaporation source) 3 for supplying a film material (vapor deposition material) 200, and a substrate (object to be formed). ) 10
A holder (holding part) 4 for holding 0, a filter member 5, a rotation driving means (displacement means) 6 for rotationally driving the filter member 5, a wire brush (removing means) 7, and a control means 12. ing. The configuration of each unit will be described below.

The chamber 2 is a container capable of airtightly blocking the internal space 21, and the material supply source 3, the holder 4, the filter member 5 and the wire brush 7 are installed in the internal space 21, respectively.

In the chamber 2, a flow path (not shown) to a vacuum pump for exhausting the gas in the internal space 21 and the internal space 2
1 is connected to a flow path (not shown) for introducing an atmospheric gas (inert gas, reaction gas, etc.).

The atmosphere of the internal space 21 is usually preferably a non-oxidizing atmosphere, for example, under reduced pressure (vacuum) or an inert gas such as nitrogen gas or argon gas. A small amount of reaction gas (oxygen gas or the like) may be introduced into the atmosphere.

A holder 4 is installed above the internal space 21. The holder 4 has a substantially plate shape,
The substrate 100 is placed on the holder 4. An opening (hole) 41 is provided at a position where the substrate 100 of the holder 4 is placed.
Is formed on the lower surface of the substrate 100 (deposition surface 101).
Is exposed. The vapor of the film material 200 supplied from the material supply source 3 is condensed and adhered to the lower surface of the substrate 100 to form a thin film.

In the present invention, the film-forming target such as the substrate 100 may be any object, for example, various kinds of glass, acrylic resin, polycarbonate resin,
Examples thereof include optical parts made of various resin materials such as polyarylate resin and polyolefin resin.

Above the holder 4, a heater (not shown) is installed. The heater can heat the atmosphere of the substrate 100 and the internal space 21.

The substrate 10 is provided near the holder 4.
A film thickness meter (not shown) may be installed at a position where a thin film equivalent to that formed on the 0 film forming surface 101 is formed. Thereby, the film thickness of the thin film formed on the film formation surface 101 can be monitored.

On the lower side of the holder 4, for example, an iris structure composed of a plurality of blades can be opened and closed, and the vapor of the film material 200 supplied from the material supply source 3 is deposited on the film formation surface 101 of the substrate 100. A shutter (not shown) that can block the transition may be installed.

A material supply source 3 is installed below the inner space 21 of the chamber 2. The material supply source 3 includes a crucible 31 that stores the film material 200, and an electron gun 32 that is installed near the crucible 31.

The electron gun 32 is electrically connected to an electron gun power source 11 installed outside the chamber 2. The electron gun 32 is operated by the electric power from the electron gun power source 11,
The electron beam B having a high energy density is emitted. The electron beam B heats and vaporizes the film material 200 in the crucible 31.

The electron gun power source 11 is electrically connected to the control means 12 composed of, for example, a microcomputer, and the intensity of the electron beam B from the electron gun 32 is controlled by the control means 12.

Such a film forming apparatus 1 has a filter member (filter plate) 5 for capturing a splash (spray) of the film material 200 from the material supply source 3. The term “splash” as used herein refers to a particle having a large particle size that becomes a particle defect when attached to the film formation surface 101, and does not form atoms and molecules of the film material 200 or substantially particle defects. It has a different particle size, that is, different from the particles of the fine film material 200 for forming a normal thin film.

As shown in FIG. 2, the filter member 5 is
It is composed of a disk-shaped member in which a large number of fine slits (holes) 51 are formed. The formation pattern of the multiple slits 51 may be any pattern, and examples thereof include the pattern shown in FIG. 3 and the pattern shown in FIG. Further, in addition to these patterns, the slits 51 may have the same orientation over the entire filter member 5, and the pattern as shown in FIG. 3 or the pattern as shown in FIG. 4 may be locally applied. It may be something like. It should be noted that in FIGS. 3 and 4, the formation intervals of the slits 51 are greatly exaggerated for easy understanding.

As shown in FIG. 1, the filter member 5 is
It is installed between the material supply source 3 and the holder 4 so as to separate them from each other. In the film forming apparatus 1, when a splash occurs due to the low temperature portion of the film material 200 in the material supply source 3 and the like, a splash having a particle size of at least the opening (opening) M of the filter member 5 or more is generated. Are captured by the filter member 5. Accordingly, it is possible to prevent the splash having a particle size of the opening M or more from adhering to the film forming surface 101 of the substrate 100, and thus, the particle-like defect having the size of the opening M or more is formed on the film forming surface 101. It can be reliably prevented from being formed. As a result, the film forming apparatus 1 can form a high-quality (high-quality) thin film with few particle defects (especially, relatively large ones).

Further, since the filter member 5 is provided, when an adhered matter or the like made of the film material 200 adhered to the inner wall of the chamber 2 or the holder 4 falls, it enters the crucible 31 of the material supply source 3. Can also be prevented. As a result, it is possible to prevent the occurrence of splash due to abrupt temperature distribution change caused by adhering substances mixed in the crucible 31, and it is possible to perform film formation in a better condition. It is also possible to prevent foreign matter from entering the film material 200 in the crucible 31. The film forming apparatus 1 can form a high quality thin film for the above reasons.

The opening M of the filter member 5 is not particularly limited, and a relatively fine one to a relatively coarse one can be used depending on the size of the particulate defect allowed on the film-forming surface 101. However, it is usually 0.1 to 100
It is preferably about 00 μm, and 0.5 to 1000 μm
It is more preferably about m, and even more preferably about 0.5 to 100 μm.

If the mesh opening M is less than the lower limit, it may be difficult to manufacture the filter member 5 or it may take a long time to manufacture it, depending on the material of the filter member 5. When the mesh opening M exceeds the upper limit value, a sufficient quality of the thin film may not be obtained depending on other film forming conditions.

As shown in FIG. 2, when the hole formed in the filter member 5 is an elongated hole such as the slit 51, the opening M means the width thereof.

The size of the opening M of the filter member 5 is
Although it is not necessary for the respective parts of the filter member 5 to be uniform, it is preferable that the entire size of the filter member 5 be substantially uniform.

The interval S between the slits 51 is not particularly limited, but is usually preferably about 0.1 to 10000 μm, more preferably about 0.2 to 2000 μm. When the interval S is less than the lower limit value,
Depending on the material of the filter member 5, the filter member 5
May decrease in strength. Further, when the interval S exceeds the upper limit value, the aperture ratio of the filter member 5 is lowered depending on the opening M of the slit 51, the vapor passage efficiency of the film material 200 is lowered, and the film formation rate is lowered. There are cases.

The method of forming the slit 51 when manufacturing the filter member 5 is not particularly limited, but it can be easily formed by electron beam processing (electron beam cutting), for example.

The constituent material of the filter member 5 is not particularly limited, and may be, for example, silicon (silicon wafer).
In addition, various metal materials such as stainless steel, aluminum or aluminum alloys, titanium or titanium alloys, copper or copper alloys, various glasses, and various ceramics can be used.

In the present invention, the holes formed in the filter member 5 need not be elongated holes such as the slits 51, but may be circular holes, quadrangular (polygonal) holes, or the like. , If it is an elongated hole such as the slit 51,
It is possible to secure a larger aperture ratio of the filter member 5, and it is possible to prevent the film formation rate from decreasing.

The filter member 5 as described above is installed with its center fixed to the rotary shaft 61 of the rotary drive means 6. The main body 62 of the rotation driving means 6 is installed outside the chamber 2, and the rotary shaft 61 is in a state of penetrating the bottom of the chamber 2. The airtightness of the chamber 2 is ensured by installing the seal member 13 in the through hole through which the rotary shaft 61 is inserted.

The main body portion 62 of the rotation driving means 6 is a motor,
It incorporates a transmission and the like, and rotationally drives the filter member 5 via the rotary shaft 61. The operation (stop / operation, rotation speed, rotation angle, etc.) of the rotation drive means 6 is controlled by the control means 12.

The material supply source 3 is located between the rotary shaft 61 and the outer peripheral portion of the filter member 5. In other words, the filter member 5 has such a size (diameter) that it can cover the upper side of the material supply source 3 between the central portion and the outer peripheral portion thereof.
have.

As described above, the size of the filter member 5 is such that it has a portion that covers the material supply source 3 and a portion that does not. With such a configuration, in the film forming apparatus 1, the film formation is performed with the filter member 5 stopped, and the film material 200 gradually adheres to the portion of the filter member 5 that covers the material supply source 3 to cause the film formation. When it becomes clogged, the rotation driving means 6 is operated to rotate the filter member 5 by a predetermined angle, so that the part of the filter member 5 that does not cover the material supply source 3, that is, the part that is not clogged is the material supply source 3. Can be covered. In this way, the filter member 5
When the portion covering the material supply source 3 is clogged, the filter member 5 can be rotated by a predetermined angle to form a film for a long time.

Further, in this embodiment, the filter member 5
A wire brush (metal brush) 7 is installed as a removing means for removing the deposits made of the film material 200 attached to the.

The wire brush 7 has a brush portion 71 having substantially the same length as the radius of the filter member 5, and the brush portion 71 extends from the central portion of the filter member 5 to the outer peripheral portion on the lower surface of the filter member 5. It is fixedly installed to make contact. The brush part 71 is made of, for example, steel wool.

When the filter member 5 is rotated by the operation of the rotation driving means 6, the brush portion 71 of the wire brush 7 slides relatively to the lower surface of the filter member 5, and as a result, the film material attached to the filter member 5 The deposit consisting of 200 is removed. In this embodiment, by removing the deposit in this way, it is possible to prevent the filter member 5 from being clogged and to perform film formation for a longer time.

The wire brush 7 is installed so as to come into contact with the portion of the filter member 5 which does not cover the material supply source 3. As a result, it is possible to prevent the removed deposits from falling into the material supply source 3 and being mixed therewith,
As a result, it is possible to prevent the occurrence of splash and the like.

When performing film formation, the filter member 5 may be continuously rotated by continuously operating the rotation driving means 6. As a general rule, film formation is performed with the filter member 5 stopped, and when deposits accumulate on the portion of the filter member 5 that covers the material supply source 3, the filter member 5 is rotated to remove the deposits. The rotation drive means 6 may be intermittently operated such that the material supply source 3 is covered with a non-existing portion (removed portion).

The means for removing the deposits on the filter member 5 is not limited to the brush such as the wire brush 7,
For example, it may be a grinding plate, a file (file), or the like.

Further, the removing means such as the wire brush 7 may be replaceably installed. As a result, when the removing means such as the wire brush 7 is deteriorated or worn, it can be replaced with a new one.

Further, the removing means may be installed not only on the lower surface side of the filter member 5 but also on the upper surface side thereof. As a result, even if the adhered matter that adheres to the inner wall of the chamber 2 or the holder 4 that holds the film-forming target (the substrate 100) drops onto the upper surface of the filter member 5, the filter member 5 will not be clogged. It can be prevented appropriately.

<Second Embodiment> FIG. 5 is a sectional side view showing a second embodiment of the film forming apparatus of the present invention. Note that FIG.
Then, only the lower part of the film forming apparatus is shown.

The second embodiment of the film forming apparatus of the present invention will be described below with reference to this drawing, but the description will focus on the differences from the above-mentioned embodiment, and the description of the same items will be omitted. .

In the film forming apparatus 1'of this embodiment, the filter member 5'has a substantially rectangular shape and is movably installed in its longitudinal direction (left and right direction in FIG. 5). Elongate support members 14 and 15 are fixed to both ends of the filter member 5 ′, and the support members 14 and 15 respectively penetrate through holes formed in the side wall of the chamber 2 to partially It projects outside the chamber 2. A seal member 16 is provided in each of the through holes through which the support members 14 and 15 are inserted to ensure the airtightness of the chamber 2. Through holes (sealing member 16) in which the supporting members 14 and 15 are formed in the side wall of the chamber 2.
By sliding with respect to the filter member 5 ′, the filter member 5 ′ moves in the left-right direction in FIG.

Further, the film forming apparatus 1'has a moving means (displacement means) 8 for moving the filter member 5'in the horizontal direction in FIG. The moving means 8 is a feed screw 81.
, A motor 82 for rotating the feed screw 81, and a nut 83 screwed onto the feed screw 81. Nut 83
Are fixed to the support member 15. As a result, when the motor 82 operates, the filter member 5'translates in the left-right direction in FIG.

In this embodiment, wire brushes 7'are provided on both sides of the material supply source 3, respectively. When the filter member 5'is translated in the left-right direction in FIG. 5, the brush portion 71 'of the wire brush 7'is moved to the filter member 5'.
Of the membrane material 200 attached to the filter member 5 ′ is removed.

According to the film forming apparatus 1'of this embodiment, the same effect as that of the first embodiment can be obtained.

<Third Embodiment> FIG. 6 is a sectional side view showing a third embodiment of the film forming apparatus of the present invention. Hereinafter, the third embodiment of the film forming apparatus of the present invention will be described with reference to this drawing, but the description will be focused on the differences from the above-described embodiment, and the description of the same matters will be omitted. In the following description, the upper side in FIG. 6 is referred to as “upper” and the lower side is referred to as “lower”.

The film forming apparatus 1 of this embodiment has a lift mechanism 17 capable of vertically moving the wire brush 7 as an adjusting means for adjusting the pressing force of the wire brush 7 against the filter member 5. The lift mechanism 17 supports the wire brush 7 movably in the vertical direction by, for example, a mechanism using a rack and pinion mechanism or a fluid pressure cylinder. The lift mechanism 17 operates under the control of the control means 12.

In the present embodiment, the pressing force of the brush portion 71 against the filter member 5 can be adjusted by moving the wire brush 7 up and down by the operation of the lift mechanism 17. Thereby, the pressing force of the brush portion 71 against the filter member 5 is adjusted to an optimum size that is sufficient for removing the deposits on the filter member 5 and does not cause excessive rotation resistance of the filter member 5. be able to. Further, even when the pressing force of the brush portion 71 against the filter member 5 is reduced due to abrasion of the brush portion 71, this can be readjusted to an optimum size.

The lift mechanism 17 can be adjusted so that the pressing force of the brush portion 71 against the filter member 5 becomes zero, that is, the brush portion 71 does not come into contact with the filter member 5. Is preferred. As a result, this can be easily done when replacing the filter member 5 or the wire brush 7.

<Fourth Embodiment> FIG. 7 is a sectional side view showing a fourth embodiment of the film forming apparatus of the present invention. Note that FIG.
Then, only the lower part of the film forming apparatus is shown. Hereinafter, the fourth embodiment of the film forming apparatus of the present invention will be described with reference to this drawing, but the description will be focused on the differences from the above-described embodiment, and the description of the same matters will be omitted. In the following description, the upper side in FIG. 7 is referred to as “upper” and the lower side is referred to as “lower”.

The film forming apparatus 1'of this embodiment has an adjusting means 18 for adjusting the pressing force of the wire brush 7'on the filter member 5 '. The adjusting means 18 includes a support 181 that supports the wire brush 7 ′ and a pedestal 18 that is fixed to the bottom of the chamber 2 and supports the lower end of the support 181.
It is composed of 2 and.

A male screw is formed at the lower end of the support column 181, and the lower end of the support column 181 is screwed into a screw hole (female screw) formed in the pedestal 182. With such a configuration, when the pillar 181 is rotated, the wire brush 7 ′ moves up and down, and the brush portion 7 with respect to the filter member 5 ′ is moved.
The pressing force of 1'can be adjusted.

Although the support column 181 is manually rotated in the illustrated structure, it may be electrically rotated from the outside of the chamber 2.

According to the film forming apparatus 1'of the fourth embodiment, the same effect as that of the third embodiment can be obtained.

The film forming apparatus of the present invention has been described above with reference to the illustrated embodiment, but the present invention is not limited to this, and each unit constituting the film forming apparatus can exhibit the same function. It can be replaced with an arbitrary configuration. In addition, any constituent may be added.

[0089]

EXAMPLES Next, specific examples of the present invention will be described.

(Example) A film forming apparatus as shown in FIG. 1 was manufactured. The conditions of this film forming apparatus were as follows. Material of the filter member 5: Silicon wafer (thickness: 1 mm) Diameter of the filter member 5: 500 mm Opening M of the filter member 5 (width of the slit 51): 0.5 μm S between the slits 51: 1 μm of the brush part 71 Material: # 0000 steel wool

Using such a film forming apparatus, a diameter of 10 m
A thin film of TiO ₂ (thickness 1 μm) was formed on the surface of a glass substrate having a thickness of m and a thickness of 1 mm. The conditions for this film formation were that the glass substrate was heated to 250 ° C. by a heater. The atmosphere in the chamber 2 (internal space 21) is set to a vacuum degree of about 1.3 × 1 by a vacuum pump.
After reducing the pressure to 0 ^-3 Pa, the degree of vacuum is about 1.3 x 10 ^-2.
O ₂ was introduced up to Pa. The filter member 5 was continuously rotated at a rotation speed of 1 rpm.

(Comparative Example) A film forming apparatus similar to the film forming apparatus of the example was manufactured except that the filter member 5 was not provided. Using the film forming apparatus of this comparative example, a thin film of TiO ₂ (thickness 1 μm) was formed on the surface of the same glass substrate under the same conditions as in the example.

The TiO ₂ thin films formed in Examples and Comparative Examples were observed with a stereoscopic microscope, and the number of particle defects within a 5 mm square area was counted by size. The results are shown in Table 1 below.

[0094]

[Table 1]

As shown in Table 1, the thin film formed by the film forming apparatus of the embodiment has no particle defects having a size (size) of 0.5 μm or more, and is a high quality thin film. It became clear.

On the other hand, the thin film formed by the film forming apparatus of the comparative example had many particle defects.

[0097]

As described above, according to the present invention, it is possible to form a high quality thin film with few particulate defects. Further, the above effect can be achieved with a simple structure.

Further, when the removing means for removing the deposits attached to the filter member is provided, the filter member can be prevented from being clogged and the film can be formed for a long time.

[Brief description of drawings]

FIG. 1 is a cross-sectional side view showing a first embodiment of a film forming apparatus of the present invention.

FIG. 2 is a plan view of a filter member in the film forming apparatus shown in FIG.

FIG. 3 is a plan view for explaining a formation pattern of slits in a filter member.

FIG. 4 is a plan view for explaining a formation pattern of slits in the filter member.

FIG. 5 is a cross-sectional side view showing a second embodiment of the film forming apparatus of the present invention.

FIG. 6 is a sectional side view showing a third embodiment of the film forming apparatus of the present invention.

FIG. 7 is a cross-sectional side view showing a fourth embodiment of the film forming apparatus of the present invention.

[Explanation of symbols]

1 film deposition equipment 2 chamber 21 Internal space 3 Material supply source 31 crucibles 32 electron gun 4 holder 41 opening 5, 5'filter member 51 slits 6 rotation drive means 61 rotation axis 62 Main body 7,7 'wire brush 71, 71 'Brush section 8 means of transportation 81 Lead screw 82 motor 83 nuts 11 electron gun power supply 12 Control means 13 Seal member 14, 15 Support member 16 Seal member 17 Lift mechanism 18 Adjustment means 181 prop 182 pedestal 100 substrates 101 film formation surface 200 Membrane material B electron beam

Claims (18)

[Claims] 1. A vapor phase film formation method comprising: a chamber; a material supply source that is installed in the chamber and supplies a film material; and a holding unit that is installed in the chamber and holds an object to be film-formed. A film forming apparatus for forming a thin film on the surface of the film forming object by a method, comprising a filter member for catching a splash of the film material from the material supply source. 2. The film forming apparatus according to claim 1, wherein the filter member is a plate-shaped member having a large number of holes formed therein. 3. The film forming apparatus according to claim 1, wherein the filter member is formed by forming a large number of holes in a silicon wafer. 4. The film forming apparatus according to claim 2, wherein the hole is formed in an elongated slit shape. 5. The opening of the filter member is 0.1
The film forming apparatus according to any one of claims 1 to 4, which has a thickness of 10000 m. 6. The film forming apparatus according to claim 1, further comprising a displacement unit that displaces the filter member. 7. The filter member is sized to have a portion that covers the material supply source and a portion that does not cover the material supply source, and the filter member is displaced by the operation of the displacement means, The film forming apparatus according to claim 6, wherein a portion of the filter member that has not covered the material supply source is in a state of covering the material supply source. 8. The film forming apparatus according to claim 6, wherein the displacement means rotates the filter member. 9. The film forming apparatus according to claim 8, wherein the filter member has a disc shape. 10. The film forming apparatus according to claim 8, wherein the material supply source is installed between a rotation shaft of the filter member and an outer peripheral portion of the filter member. 11. The film forming apparatus according to claim 6, wherein the displacement means moves the filter member in parallel. 12. The film forming apparatus according to claim 1, further comprising a removing unit that removes deposits made of the film material attached to the filter member. 13. The film forming apparatus according to claim 12, wherein the removing unit includes a brush, a grinding plate, or a file. 14. Displacement means for displacing said filter member, said removing means is fixedly installed in said chamber, and said filter member is displaced by the operation of said displacing means, The film forming apparatus according to claim 12, wherein the removing unit slides relative to the filter member. 15. The film forming apparatus according to claim 14, wherein the removing unit is installed at a position where the removed adhered matter does not fall onto the material supply source. 16. The filter member has a size having a portion covering the material supply source and a portion not covering the material supply source, and the filter member is displaced by the operation of the displacement means, The film forming apparatus according to claim 14 or 15, wherein a portion of the filter member that has not covered the material supply source is in a state of covering the material supply source, and film formation is performed while continuously displacing the filter member. 17. The filter member has a size having a portion covering the material supply source and a portion not covering the material supply source, and the filter member is displaced by the operation of the displacement means, A portion of the filter member that did not cover the material supply source is in a state of covering the material supply source. As a general rule, film formation is performed with the filter member stopped, and the material supply source of the filter member is covered. When deposits accumulate on the part of the filter member, film formation is performed while intermittently displacing the filter member so that the part of the filter member that does not cover the material source covers the material source. Claim 14 or 15
The film forming apparatus according to. 18. The adjusting means for adjusting the pressing force of the removing means against the filter member.
18. The film forming apparatus according to any one of 2 to 17.