JP2003327931A - Adhesive substrate having heat radiation plate for fixing lead frame - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive substrate having a heat radiation plate, having a thermoplastic polyimide excellent in heat resistance after absorbing moisture and fixing the tip end of a lead frame. <P>SOLUTION: This adhesive substrate having the heat radiation plate for fixing the lead frame obtained by laminating a non-thermoplastic polyimide layer and a thermoplastic polyimide layer in this order on the one side surface of a metal plate becoming the heat radiation plate is characterized by using 1,3-bis(3-aminophenoxy)benzene (hereinafter abbreviated sometimes as APB) as a diamine component and 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride (hereinafter abbreviated sometimes as BTDA) as a tetracarboxylic acid dianhydride component of the resin for forming the thermoplastic polyimide layer by 0.900-0.998 molar using ratio of (tetracarboxylic acid dianhydride/APB). <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal laminate having a thermoplastic polyimide having excellent heat resistance after absorbing moisture and fixing the tip of a lead frame.

[0002]

2. Description of the Related Art In recent years, with the high integration of semiconductor chips, high positional accuracy has been required during wire bonding of the lead frame and the chip. In order to solve this, the outer frame of the lead frame has a thermosetting adhesive. A method of fixing with a heat resistant tape using is used. However, this method has a problem that outgas is generated from the adhesive during wire bonding and the lead frame is contaminated. In addition, if the lead frame tip is adapted to a narrower pitch due to further pinning of the chip, that is, it is necessary to fix the tip so that the lead frame does not fluctuate, this method fixes the tip of the lead frame. Was difficult to apply to.

On the other hand, there is a problem of circuit malfunction and reliability deterioration due to heat generation of the chip, and as a method of preventing them, a metal or the like having a high thermal conductivity is used as a heat dissipation plate to be bonded to the back surface of the die pad and the inner lead. Then, a package with a heat spreader for releasing the heat generated by the chip to the outside has been developed and put into practical use.

The heat radiating plate is adhered to the back surface of the die pad and the surface opposite to the bonding surface of the inner lead by using a double-sided adhesive film or a coating type adhesive. However, in the method using the film with the double-sided adhesive, the material cost of the film is high, and moreover, the step of adhering the adhesive film to the heat dissipation plate and then adhering it to the lead frame is also required, so that the production cost is high and the ordinary semiconductor It was difficult to apply to the device. On the other hand, in the method using a coating type adhesive, the work is complicated because the adhesive layer is applied by a special method such as screen printing,
There was a problem of contamination in each process, and there were not only production costs but also quality problems.

As a method of solving these problems, Japanese Patent Laid-Open No. 5-218284 discloses a method of forming an adhesive layer on a metal foil for a heat sink, processing it into a predetermined shape, and then crimping it to an inner lead frame. Proposed. However, although this method simplifies the manufacturing process, it does not disclose an adhesive, and when a normal thermosetting adhesive is used, when a copper foil with an adhesive layer is bonded to a lead frame or a wire is used. At the time of bonding, outgas is generated from the adhesive, which causes a problem of contaminating the lead frame. When a general thermoplastic resin is used,
Not only is the reflow resistance poor, but the adhesive layer becomes soft during wire bonding, and the inner lead portions of the lead frame sink into the adhesive layer and come into contact with the copper foil, resulting in reduced insulation and short circuits.

Since these adhesives easily cause migration of copper ions from the copper alloy as the inner lead material and have a problem in terms of long-term reliability, a great improvement is desired. On the other hand, JP-A-7-23
Although polyimide is used as an adhesive layer in Japanese Patent No. 5626, heat resistance after absorbing moisture JEDEC STANDARD TEST METHOD A11
3-A LEVEL1: After treatment at 85 ℃ ・ 85% RH for 168 hours, 22
There were some abnormalities in the substrate after 3 cycles of 0 ° C. reflow soldering, and there was a problem in terms of reliability.

[0007]

SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide an adhesive base material with a heat dissipation plate, which has a thermoplastic polyimide excellent in heat resistance after absorbing moisture and which fixes the lead frame tip. That is.

[0008]

Means for Solving the Problems The inventors of the present invention have made extensive studies to solve the above problems, and as a result, a non-thermoplastic polyimide layer and a thermoplastic polyimide layer are formed in this order on one surface of a metal plate to be a heat dissipation plate. In a laminated adhesive base material for fixing a lead frame with a heat sink, 1,3-bis (3-aminophenoxy) benzene (hereinafter abbreviated as APB) as a diamine component of a resin forming a thermoplastic polyimide layer, tetracarboxylic acid dianhydride As a product component, a tetracarboxylic dianhydride containing 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride (hereinafter abbreviated as BTDA) is used, and its molar ratio (tetracarboxylic dianhydride is used. / APB) is 0.900 to 0.998, the temperature is 85 ° C and the humidity is 85.
The present invention was completed by finding that the soldering heat resistance temperature is 220 ° C. or higher after being left for 168 hours in the% RH environment.

That is, according to the present invention, the thermoplastic polyimide layer is formed in the adhesive base material for fixing the lead frame with the heat radiating plate, in which the non-thermoplastic polyimide layer and the thermoplastic polyimide layer are laminated in this order on one surface of the metal plate to be the heat radiating plate. 1,3-bis (3-aminophenoxy) as diamine component of resin
Benzene (hereinafter sometimes abbreviated as APB) and tetracarboxylic dianhydride component containing 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride (hereinafter sometimes abbreviated as BTDA) And the molar ratio (tetracarboxylic dianhydride / APB) used is 0.900.
The present invention provides an adhesive base material for fixing a lead frame with a heat dissipation plate, wherein the adhesive base material has a heat conductivity of 0.998.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
The present invention, the inner lead portion of the lead frame is sunk into the adhesive layer on one surface of the metal plate to be a heat dissipation plate, contact with the metal plate, non-thermoplastic polyimide in order to suppress the occurrence of insulation deterioration and short circuit An adhesive base material for fixing a lead frame with a heat sink, in which non-thermoplastic polyimide is laminated to form an adhesive layer. APB is used as the diamine component of the laminated thermoplastic polyimide layer, and BTDA is used as the tetracarboxylic dianhydride. Is important to use.

An example of the method for producing the thermoplastic polyamic acid or polyimide will be described below. First, diamines are dissolved in an organic solvent in a container equipped with a stirrer, a reflux condenser and a nitrogen introducing pipe. Next, an aromatic tetracarboxylic dianhydride was added to this solution in a nitrogen atmosphere so as to be 0.900 to 0.998 molar equivalents to the diamine, and preferably stirred at 0 to 90 ° C. for 24 hours. A polyamic acid solution is obtained. This polyamic acid solution is preferably 1
A polyimide solution is obtained by stirring and reaction dehydration at 00 to 200 ° C. These polyamic acid solution and polyimide solution may be diluted with an organic solvent in order to adjust the viscosity.

To produce the base material for fixing the lead frame with the heat sink of the present invention, a solution containing the above-mentioned thermoplastic polyimide resin or a solution containing the polyamic acid as a precursor thereof is aromatic tetra It is important to set the carboxylic acid dianhydride to 0.900 to 0.998 molar equivalent with respect to the diamine. This is because if it is less than 0.900, it becomes difficult to form a film, and if it exceeds 0.998, the molecular weight increases and the viscosity during polymerization increases.
Poor polymerization occurs. On the other hand, if it exceeds 1.0, the molecular weight at the glass transition point or more is lowered, that is, the elastic modulus is lowered, so that it loses the water vapor pressure in the package generated in the solder heat resistance test, and Swelling occurs.

The tetracarboxylic dianhydride component of the thermoplastic polyimide is 3,3 ', 4, in addition to BTDA.
4'-biphenyltetracarboxylic dianhydride (hereinafter BP
DA is sometimes abbreviated as a molar ratio (BTDA: BPD
It is also possible to use A) in the range of 10:90 to 100: 0.

As an example of the method for producing a non-thermoplastic polyimide, p-phenylenediamine (hereinafter sometimes abbreviated as PPD), 4,4-diaminobiphenyl ether, 4,4′-bis (diamine component) is used as a diamine component. 3-aminophenoxy) biphenyl or the like is used, and as the tetracarboxylic acid component, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride, or the like is used.
There may be mentioned a method in which N′-dimethylacetamide and N-methyl-2-pyrrolidone are mixed and dissolved in a mixed solvent and reacted at 23 ° C. for about 6 hours.

The amino component used in producing the precursor solution of the non-thermoplastic polyimide includes at least one diamine selected from phenylenediamine and diaminophenyl ether, and preferably PPD, 4,4-
Examples thereof include diaminobiphenyl ether (hereinafter sometimes abbreviated as ODA), 4,4′-bis (3-aminophenoxy) biphenyl (hereinafter sometimes abbreviated as m-BA), and the like.

The acid anhydride component for producing the precursor solution of the non-thermoplastic polyimide is selected from pyromellitic dianhydride (hereinafter sometimes abbreviated as PMDA) and biphenyltetracarboxylic dianhydride. It is possible to exemplify at least one kind of tetracarboxylic acid dianhydride. Preferred examples include 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride.

To prepare the lead frame fixing base material with a heat sink of the present invention, a solution containing a non-thermoplastic polyimide resin or a solution containing a precursor thereof, polyamic acid, is applied to a metal foil. It can be applied and dried. The thickness range of the non-thermoplastic polyimide used in the present invention is preferably in the range of 3 to 100 μm, but the thickness is more preferably 5 μm or more and 20 μm or less if it finally functions as a heat dissipation plate. If the thickness is less than 3 μm, the surface roughness of the metal foil cannot be covered, and thus the metal foil may become conductive during wire bonding.

To produce the base material for fixing the lead frame with the heat sink of the present invention, a solution containing the above-mentioned thermoplastic polyimide resin or a solution containing the precursor polyamic acid is thermoplastic. It may be applied on the polyimide and dried. The thickness of the thermoplastic polyimide used in the present invention is preferably in the range of 5 to 100 μm, but if it finally functions as a heat sink, the thickness is more preferably 5 μm or more and 20 μm or less. 5 μm
If the amount is less than the above, sufficient adhesive force with the thermoplastic polyimide may not be exhibited during wire bonding.

The thickness range of the metal foil used in the present invention is preferably 3 μm to 200 μm, but if it finally functions as a heat sink, the thickness is 50.
It is more preferably at least μm. The upper limit of the metal foil thickness is 200, considering that polyimide resin is continuously applied.
It is about μm. As the type of metal foil, known metal foils, specifically, copper, nickel, aluminum, stainless steel, and alloy foils are all applicable, but rolled copper foils, electrolytic copper foils, copper alloy foils, and stainless steel foils are available. It is suitable from the viewpoints of cost, heat conductivity, rigidity, and the like.

On the metal foil surface to which the polyamic acid is applied, in order to improve the adhesive strength, particles are attached by electrolytic plating which is often carried out in the surface treatment of copper foil and AC etching is carried out.

The method of coating and drying the polyimide solution or polyamic acid solution of the present invention on a metal foil or a polyimide film is not particularly limited, and conventionally known compa coater, T-die, roll coater, knife coater, reverse coater. It may be applied by using an application device such as the above, heated and dried for a sufficient time and temperature, and cured.

The imidization method after drying may be a batch method using an inert oven or a continuous method using an imidizing furnace.
A known method is used, and the method and conditions are not particularly limited, but a continuous method using an imidization furnace is preferable. The imidization is usually carried out at 200 to 450 ° C., and the imidization is carried out to the range where the solvent content does not exceed 0.5 parts by weight with respect to 100 parts by weight of the polyimide.

[0023]

EXAMPLES Synthesis Example 1 <Synthesis of Thermoplastic Polyimide Precursor> 10 mol of ABP as a diamine component and B as a tetracarboxylic dianhydride
Each 9.0 mol of TDA was weighed, mixed in a N, N-dimethylacetamide solvent, and reacted at 40 ° C. for 4 hours. The solid content concentration after the reaction was 30% by weight. The viscosity of the obtained polyamic acid is 2000 cps,
It was suitable for coating.

Synthesis Example 2 <Synthesis of Thermoplastic Polyimide Precursor> 10 mol of APB as a diamine component and B as a tetracarboxylic dianhydride
TDA9.4 was weighed and mixed in a N, N-dimethylacetamide solvent and reacted at 40 ° C. for 4 hours. The solid content concentration after the reaction was 30% by weight. The viscosity of the obtained polyamic acid was 4000 cps, which was suitable for coating.

Synthesis Example 3 <Synthesis of thermoplastic polyimide precursor> 10 mol of APB as a diamine component and B as a tetracarboxylic dianhydride
Each 9.98 mol of TDA was weighed, mixed in an N, N-dimethylacetamide solvent, and reacted at 40 ° C. for 4 hours. The solid content concentration after the reaction was 20% by weight.
The viscosity of the obtained polyamic acid was 30,000 cps, which was suitable for coating.

Synthesis Example 4 <Synthesis of Thermoplastic Polyimide Precursor> 10 mol of ABP as a diamine component and B as a tetracarboxylic dianhydride.
Each of 9.5 mol of TDA was weighed, mixed in an N, N-dimethylacetamide solvent, and reacted at 40 ° C. for 4 hours. The solid content concentration after the reaction was 30% by weight. The viscosity of the obtained polyamic acid is 7000 cps,
It was suitable for coating.

Synthesis Example 5 <Synthesis of Thermoplastic Polyimide Precursor> 10 mol of APB as a diamine component and B as a tetracarboxylic dianhydride
4.85 mol of TDA and 4.85 mol of BPDA were weighed and mixed in an N, N-dimethylacetamide solvent, and 4
The reaction was carried out at 0 ° C for 4 hours. The solid content concentration after the reaction is 3
It was 0% by weight. The viscosity of the obtained polyamic acid is 9
It was 000 cps and was suitable for coating.

Synthesis Example 6 <Synthesis of Thermoplastic Polyimide Precursor> 10 mol of APB as diamine component and B as tetracarboxylic dianhydride
2.75 mol of TDA and 7.0 mol of BPDA were weighed and mixed in a N, N-dimethylacetamide solvent, and 4
The reaction was carried out at 0 ° C for 4 hours. The solid content concentration after the reaction is 3
It was 0% by weight. The viscosity of the obtained polyamic acid is 8
It was 000 cps and was suitable for coating.

Synthesis Example 7 <Synthesis of Thermoplastic Polyimide Precursor> 10 mol of APB as a diamine component and B as a tetracarboxylic dianhydride
10.5 mol of TDA was weighed and mixed in a N, N-dimethylacetamide solvent, and reacted at 40 ° C. for 4 hours. The solid content concentration after the reaction was 30% by weight.
The viscosity of the obtained polyamic acid was 18,000 cps, which was suitable for coating.

Synthesis Example 8 <Synthesis of Thermoplastic Polyimide Precursor> 10 mol of APB as a diamine component and B as a tetracarboxylic dianhydride
Each 9.8 mol of PDA was weighed, mixed in an N, N-dimethylacetamide solvent, and reacted at 40 ° C. for 4 hours. The solid content concentration after the reaction was 30% by weight. The viscosity of the obtained polyamic acid was 18,000 cps, which was suitable for coating.

Synthesis Example 9 <Synthesis of Non-Thermoplastic Polyimide Precursor> As the diamine component, 7.7 mol of PPD, 1.15 mol of ODA and m
1.15 mol of BP was weighed. As tetracarboxylic acid components, 5.4 mol of BPDA and 4.45 mol of PMDA were weighed. N, N dimethylacetamide and N-methyl-
It was dissolved in a 2-pyrrolidone mixed solvent and mixed. The solvent ratio was 23% by weight of the former and 77% by weight of the latter. The reaction temperature and time were 23 ° C. and 6 hours. The solid content concentration during the reaction is 20% by weight. The viscosity of the obtained polyamic acid varnish was 20000 cps at 25 ° C., which was suitable for coating.

Example 1 Commercially available copper foil (manufactured by Japan Energy Co., Ltd., trade name: BH)
Y-22B-T, thickness: 18 μm), the polyamic acid of Synthesis Example 9 was applied to one surface of the polyamic acid of Synthesis Example 1 using a coater dryer and dried at 60 ° C. to 200 ° C. for 6 minutes. Was applied, dried at 60 ° C. to 200 ° C. for 5 minutes, and then cured at 200 to 270 ° C. for 2 minutes to form a polyimide layer, thereby producing a single-sided copper-clad laminate. The coating thickness was such that the non-thermoplastic polyimide layer had a thickness of 5 μm and the thermoplastic polyimide layer had a thickness of 30 μm after drying and curing. As the obtained single-sided copper-clad laminate and lead frame material, 42 alloy (YEF4 manufactured by Hitachi Metals, Ltd.)
2) is a pulse bonder (TC-13, manufactured by Kell Co., Ltd.)
20 UD) at 300 ° C., 30 kg / cm ² , 1
It was thermocompression bonded in seconds. Using the obtained test piece, IPC-T
A 90 ° peel test was performed according to M-650method, 2, 4, 9. As a result, the peel adhesion strength with 42 alloy was 1.62 kg / cm. On the other hand, the obtained test piece was used for transfer molding with an epoxy-based sealing resin to prepare a sample. The test piece thus obtained is heat-resistant after absorbing moisture JEDEC STANDARD TEST METHOD A113-
A LEVEL1: 220 ° C ・ 85% RH, after processing for 168 hours, 220
The presence or absence of abnormality of the substrate after 3 cycles of the reflow soldering process at ℃ was confirmed by cross-section observation, but no abnormality was confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal.

Example 2 Commercially available copper foil manufactured by Nippon Denshoku Co., Ltd., trade name: SLP-105W
B, thickness: 105 μm, the polyamic acid of Synthesis Example 2 was used as the thermoplastic polyimide, and the coating thickness was dry.
A single-sided copper-clad laminate with a sealing resin was produced in the same manner as in Example 1 except that the non-thermoplastic polyimide layer had a thickness of 10 μm and the thermoplastic polyimide layer had a thickness of 20 μm after curing.
The one-sided copper-clad laminate with encapsulating resin thus obtained has heat resistance after moisture absorption JEDEC STANDARD TEST METHOD A113-
A LEVEL1: 220 ° C ・ 85% RH, after processing for 168 hours, 220
The presence or absence of abnormality of the substrate after 3 cycles of the reflow soldering process at ℃ was confirmed by cross-section observation, but no abnormality was confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, the peel adhesion strength with 42 alloy is 1.39 kg.
Was / cm.

Example 3 Instead of the copper foil in Example 2, stainless steel foil (manufactured by Nippon Metal Co., Ltd., trade name: SUS301EH-TA, thickness: 60 μm thickness) was used, and the polyamic acid of Synthesis Example 3 was used as the thermoplastic polyimide. Then, a single-sided copper-clad laminate with a sealing resin was prepared in the same manner as in Example 1 except that the coating thickness was 20 μm for the non-thermoplastic polyimide layer and 5 μm for the thermoplastic polyimide layer after drying and curing. The single-sided copper-clad laminate with encapsulating resin thus obtained has a heat resistance after moisture absorption JEDEC STANDARD TEST METHOD A113-A LEVEL
1: After processing for 168 hours at 85 ° C / 85% RH and after 220 cycles of 220 ° C reflow soldering
No abnormalities were found when confirmed by cross-sectional observation. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, the peel adhesion strength with 42 alloy is 1.52 kg / cm.
Met.

Example 4 Instead of the copper foil in Example 2, stainless steel foil (manufactured by Nikko Metal Co., Ltd., trade name: SUS304H-TA, thickness:
(Thickness of 30 μm) and used as a thermoplastic polyimide in Synthesis Example 4
Single-sided copper-clad laminate with sealing resin in the same manner as in Example 1 except that the non-thermoplastic polyimide layer has a thickness of 5 μm and the thermoplastic polyimide layer has a thickness of 10 μm after the coating thickness is dried and cured by using the polyamic acid Was produced. The single-sided copper-clad laminate with encapsulating resin thus obtained is heat-resistant after moisture absorption JEDEC STANDARD TEST METHOD A113-A LEVEL1: 8
After processing for 168 hours at 5 ° C. and 85% RH and after 220 cycles of 220 ° C. reflow soldering, the presence or absence of abnormality in the substrate was confirmed by cross-sectional observation, but no abnormality was confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, the peel adhesion strength with 42 alloy is 1.82 kg / cm.
Met.

Example 5 Instead of copper foil, stainless steel foil (manufactured by Nikko Metal Co., Ltd., trade name: SUS304H-TA, thickness: 30 μm thickness) was used, and the polyamic acid of Synthesis Example 5 was used as the thermoplastic polyimide, and the coating thickness was After drying and curing, the non-thermoplastic polyimide layer is 10 μm and the thermoplastic polyimide layer is 10 μm.
A single-sided copper-clad laminate with a sealing resin was produced in the same manner as in Example 1 except that the thickness was changed to m. The single-sided copper-clad laminate with encapsulation resin thus obtained has heat resistance after moisture absorption JEDEC
STANDARD TEST METHOD A113-A LEVEL1: 85 ℃ ・ 85% RH
After 168 hours of treatment, the presence or absence of abnormality of the substrate after 3 cycles of 220 ° C. reflow solder was confirmed by cross-sectional observation, but no abnormality was confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, the peel adhesion strength with 42 alloy was 2.05 kg / cm.

Example 6 Instead of the stainless steel foil in Example 4, a copper foil (manufactured by Furukawa Circuit Foil Co., Ltd., trade name: F1-WS, thickness: 9 μm thickness) was used, and the polyamic acid of Synthesis Example 6 was used as the thermoplastic polyimide. A single-sided copper-clad laminate with a sealing resin was prepared in the same manner as in Example 1 except that the coating thickness was 5 μm for the non-thermoplastic polyimide layer and 5 μm for the thermoplastic polyimide after the coating thickness was dried and cured. The single-sided copper-clad laminate with encapsulating resin thus obtained has heat resistance after moisture absorption JEDEC STANDARD TEST METHODA113-A LEVEL1: 85 ℃
-After processing at 85% RH for 168 hours, the presence or absence of abnormality of the substrate after 3 cycles of 220 ° C reflow solder was confirmed by cross-section observation, but no abnormality was confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, 42
The peel adhesion strength with the alloy was 2.22 kg / cm.

Comparative Example 1 An example except that the polyamic acid of Synthesis Example 7 was used as the thermoplastic polyimide and the coating thickness was 10 μm for the non-thermoplastic polyimide layer and 10 μm for the thermoplastic polyimide layer after drying and curing. A single-sided copper clad laminate with a sealing resin was prepared in the same manner as in 1. The single-sided copper-clad laminate with encapsulating resin thus obtained is heat-resistant after moisture absorption.
DARD TEST METHOD A113-A LEVEL1: 1 at 85 ℃ ・ 85% RH
After the treatment for 68 hours, the presence or absence of abnormality in the substrate after 3 cycles of 220 ° C. reflow solder was confirmed by cross-section observation, and abnormalities such as swelling and peeling between the sealing resin and the thermoplastic polyimide were confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, the peel adhesion strength with 42 alloy was 1.92 kg / cm.

Comparative Example 2 A single-sided copper-clad laminate with a sealing resin was prepared in the same manner as in Example 2 except that the polyamic acid of Synthesis Example 8 was used. The single-sided copper-clad laminate with encapsulating resin thus obtained has a heat resistance after moisture absorption JEDEC STANDARD TEST METHOD A113-A LEVEL
1: After processing for 168 hours at 85 ° C / 85% RH and after 220 cycles of 220 ° C reflow soldering
As a result of cross-sectional observation, abnormalities of swelling and peeling between the sealing resin and the thermoplastic polyimide were confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, the peel adhesion strength with 42 alloy was 1.68 kg / cm.

Comparative Example 3 A single-sided stainless steel laminated plate with a sealing resin was produced in the same manner as in Example 5 except that the polyamic acid of Synthesis Example 7 was used instead of the polyamic acid of Synthesis Example 5. The single-sided copper clad laminate with a sealing resin thus obtained has a heat resistance after absorbing moisture.
JEDEC STANDARD TEST METHOD A113-A LEVEL1: 85 ℃ ・
After processing for 168 hours at 85% RH and after 220 cycles of 220 ° C. reflow solder, the presence or absence of abnormality in the substrate was confirmed by cross-section observation. As a result, abnormalities such as swelling and peeling between the sealing resin and the thermoplastic polyimide were confirmed. The results are shown in Table 1 as to whether or not the sample is abnormal. On the other hand, the peel adhesion strength with 42 alloy was 0.52 kg / cm.

[0041]

[Table 1]

[0042]

As described above, according to the present invention, in the lead frame fixing adhesive substrate with the heat sink, the lead frame tip is fixed, and in the heat resistance test after humidification, between the non-thermoplastic polyimide and the metal foil. It is possible to prevent swelling and peeling from occurring in the thermoplastic polyimide layer or between the sealing resin and the polyimide.

Continued front page    F-term (reference) 4J004 AA11 AA16 AB03 CA08 CE01                       FA05 FA08 FA10                 4J040 EH031 JA09 JB01 LA07                       LA08 MA02 MB03 NA19 NA20                 5F067 AA03 BB08 CA04 CC03 CC07                       DA05

Claims (4)

[Claims] 1. A diamine resin for forming a thermoplastic polyimide layer in an adhesive base material for fixing a lead frame with a heat radiating plate, wherein a non-thermoplastic polyimide layer and a thermoplastic polyimide layer are laminated in this order on one surface of a metal plate to be a heat radiating plate. 1,3-bis (3-aminophenoxy) benzene (hereinafter sometimes abbreviated as APB) as a component, and tetracarboxylic dianhydride as a component, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride (Hereinafter sometimes abbreviated as BTDA) is used, and the molar ratio (tetracarboxylic dianhydride / APB) used is 0.900 to 0.998.
An adhesive base material for fixing a lead frame with a heat dissipation plate, characterized in that 2. A tetracarboxylic dianhydride component,
3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride (hereinafter sometimes abbreviated as BTDA) and 3,
A thermoplastic polyimide which is 3 ′, 4,4′-biphenyltetracarboxylic dianhydride (hereinafter sometimes abbreviated as BPDA) and has a molar ratio (BTDA: BPDA) of 10:90 to 100: 0. The adhesive base material for fixing a lead frame with a heat radiating plate according to claim 1, which is used. 3. A precursor solution of a non-thermoplastic polyimide is selected from at least one diamine selected from phenylenediamine and diaminophenyl ether, and pyromellitic dianhydride and biphenyltetracarboxylic dianhydride. The adhesive base material for fixing a lead frame with a heat sink according to claim 1 or 2, which is a solution containing a polycondensate synthesized from at least one tetracarboxylic dianhydride. 4. The adhesive base material for fixing a lead frame with a heat dissipation plate according to claim 1, wherein the metal plate is selected from the group consisting of copper, nickel, aluminum, stainless steel, or alloys thereof.