JP2003326622A - High heat conduction honeycomb sandwich panel and panel loaded with equipment for artificial satellite provided with the sandwich panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a high conduction honeycomb sandwich panel which is hot lower than 150 W/m/K in thermal conductivity in the surface direction and hot lower than 10 W/m/K in thermal conductivity in the thickness direction, and has a thermal expansion coefficient lower than that of an aluminum alloy honeycomb sandwich panel. <P>SOLUTION: A honeycomb core 2 and a skin 3 covering the both side surfaces of the honeycomb core 2 are provided. The skin 3 comprises C/C (Carbon/Carbon: carbon fiber reinforcing carbon) filled with a filler (metal or metal ceramic) having thermal conductivity higher than that of the skin 3. The volume ratio of the filler to the skin 3 is 5-10%. The honeycomb core 2 is made of CFRP (Carbon Fiber-Reinforced Plastic) in which the thickness direction coincides with the orientation direction of the carbon fibers. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a honeycomb sandwich panel having excellent thermal conductivity, which is used in artificial satellites, aviation equipment, and the like, and an artificial satellite equipment mounting panel including the honeycomb sandwich panel.

[0002]

2. Description of the Related Art FIG. 11 is a cross-sectional view showing one process of a conventional honeycomb sandwich panel made of carbon / carbon and carbon / ceramic disclosed in Japanese Patent Application Laid-Open No. 10-24507. In the figure, 101 is a honeycomb sandwich panel. Reference numeral 102 is a honeycomb core, and 103 is a skin covering both side surfaces of the honeycomb core 102. The honeycomb core 102 and the skin 103 are made of carbon / carbon or carbon / ceramic. Reference numeral 104 denotes a sheet-like adhesive that bonds the honeycomb core 102 and the surface skin 103. 105 and 106 are molds for making honeycomb sandwich panels. The honeycomb sandwich panel is formed by bonding the honeycomb core 102 and the skin 103 in the molds 105 and 106 with the sheet adhesive 104 interposed therebetween. Arrows X and Y indicate the in-plane direction of the honeycomb sandwich panel, and arrow Z also indicates the thickness direction.

[0003]

Since the conventional honeycomb sandwich panel is constructed as described above, it has the following problems. Carbon / ceramic in-plane thermal conductivity (arrow X, Y direction) is 400 W / m
/ K, which exceeds the thermal conductivity of aluminum alloy, but the thermal conductivity in the thickness direction is approximately 10 W / m / K, which is compared with the thermal conductivity in the thickness direction of CFRP (1 to 5 W / m / K). Then, it is high, but the thermal conductivity of the metal (for example, aluminum alloy; 150
It is low compared with W / m / K). Therefore, there is a problem in that it is difficult to use an optimum material for, for example, a honeycomb sandwich panel for satellite devices, which requires high exhaust heat efficiency.

On the other hand, in the case of a general honeycomb sandwich panel in which both the honeycomb core and the skin are made of an aluminum alloy, the thermal conductivity is high in both the in-plane direction and the thickness direction as already described, but the thermal expansion coefficient of the aluminum alloy is high. Is as large as about 23 ppm / K, and large thermal deformation occurs with a slight temperature difference. Therefore, for example, a panel that supports an optical device that requires high accuracy has a problem that it cannot be used because the thermal deformation of the panel adversely affects the accuracy of the optical device.

The present invention has been made to solve the above problems, and an object thereof is to obtain a high thermal conductive honeycomb sandwich panel satisfying the following conditions 1 to 3. 1. The thermal conductivity in the in-plane direction exceeds that of a honeycomb sandwich panel having an aluminum alloy skin. 2. The thermal conductivity in the thickness direction exceeds that of a honeycomb sandwich panel having a carbon / carbon or CFRP skin. 3. Both the honeycomb core and the skin have a lower coefficient of thermal expansion than a honeycomb sandwich panel made of aluminum alloy.

In this case, the thermal conductivity in the in-plane direction exceeds that of the honeycomb sandwich panel having the skin made of aluminum alloy, and the heat conductivity in the thickness direction exceeds that of the honeycomb sandwich panel having the skin made of carbon / carbon or CFRP. A honeycomb sandwich panel that satisfies both conductivity and high heat conductivity is referred to as a high thermal conductivity honeycomb sandwich panel.

[0007]

A high-heat-conductivity honeycomb sandwich panel according to the present invention comprises a honeycomb core and a skin covering both side surfaces of the honeycomb core, and the skin is a filling material having a higher thermal conductivity than the skin. C filled with material
/ C (Carbon / Carbon: carbon / carbon, carbon fiber reinforced carbon).

In the high heat conductive honeycomb sandwich panel according to the present invention, the filling material is metal or metal silicon.

In the high heat conductive honeycomb sandwich panel according to the present invention, the proportion of the filling material with respect to the total volume of the skin is within the range of 5% to 30%.

In the high-heat-conductivity honeycomb sandwich panel according to the present invention, the honeycomb core has a CFRP (Carbon Fiber Reinf) in which the thickness direction of the honeycomb core is aligned with the fiber running direction.
orced Plastic: Carbon fiber reinforced plastic).

An artificial satellite device mounting panel according to the present invention is provided with the high thermal conductive honeycomb sandwich panel of another invention described in this specification.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below. Embodiment 1. FIG. 1 is an exploded perspective view for explaining the structure of a honeycomb sandwich panel 1 according to Embodiment 1 of the present invention. 2A is a perspective view of the skin 3 of the honeycomb sandwich panel 1, FIG. 2B is an enlarged view of a part of the skin 3, and FIG. 2C is a cross-sectional view. FIG. 3 is a detailed view of the honeycomb core 2. Here, the honeycomb sandwich panel refers to a panel having a thickness of about 10 to 100 mm and including a honeycomb core and a skin covering both surfaces of the honeycomb core.

In the drawing, reference numeral 1 is a honeycomb sandwich panel (high heat conductive honeycomb sandwich panel; hereinafter also simply referred to as panel). 2 is a honeycomb core. The honeycomb core has a honeycomb structure in which a large number of hexagonal cells each having a side length of about 3 to 20 mm are gathered, and is made of, for example, a metal such as an aluminum alloy or a composite material such as CFRP. 3 covers both side surfaces of the honeycomb core 2 and is made of metal (filling material; for example, Al, Cu, Ag, Au, Mg, etc.)
It is a C / C-filled epidermis (hereinafter, also simply referred to as epidermis). Here, the term “filling” refers to embedding a metal or the like in a large number of pores formed inside or on the surface of the skin 3 in the process of forming the skin 3. Reference numeral 3a is carbon as a base material of the skin 3, and reference numeral 3b is carbon fibers arranged in a diagonal stripe shape in the carbon 3a. Numeral 4 is a pore generated when the panel 1 is manufactured, and a plurality of pores are present in the gap between the carbon fibers 3b. The arrow X and Y directions are in-plane directions of the honeycomb core 2, and the arrow Z direction is similarly the thickness direction of the honeycomb core 2.

Next, a method of manufacturing the panel 1 will be described. 1. The epidermis 3 is formed. First, prepregs are laminated.
A prepreg is a sheet-shaped uncured plastic obtained by impregnating carbon fiber with a resin. As carbon fiber,
For example, K13D (manufactured by Mitsubishi Chemical Co., Ltd.) is used, and as the resin, for example, epoxy type, cyanate type, phenol type,
A furan resin is used. Next, the laminated prepreg is thermally cured to form a plate-shaped CFRP. Next, the plate-shaped CFRP is baked at a high temperature (about 2000 ° C.) to carbonize the resin to form C / C. During firing, the resin shrinks in volume, resulting in numerous pores inside and on the surface of the skin. C / C that has been fired is sandwiched between thin films of metal (eg, Al, Cu, Ag, Au, Mg), heated to near the melting point, and a high pressure of several hundred atmospheres is applied to embed the metal in the pores. , Closing ends.

Desirably, the proportion of metal in the total volume of the skin 3 is set within the range of 5 to 30%. This is because if the proportion of metal is 5% or more, the thermal conductivity in the thickness direction is further increased, and conversely, if it does not exceed 30%, the increase in the thermal expansion coefficient can be suppressed. is there. Within this range, the influence of thermal deformation of the metal on the entire skin 3 is reduced even if the metal having high thermal conductivity is used for filling, so that the panel 1 is not likely to be thermally deformed. Specifically, by adjusting the temperature when firing the plate-shaped CFRP, the proportion of carbon or carbon fiber as the base material, and the like, the above-mentioned desired range can be achieved.

2. Next, a honeycomb core is prepared. As a material for the honeycomb core, it is preferable to use a metal such as an aluminum alloy or a composite material such as CFRP. For example, an aluminum alloy honeycomb core, AL3 / 16-5052-0.0007 (manufactured by Showa Aircraft Industry Co., Ltd.) is used. 3. The honeycomb core 2 is sandwiched between two skins 3 having a sheet-shaped adhesive on the surface, and heat and pressure (about 100 ° C., 1 atm) are applied to bond the skin 3 and the honeycomb core 2. After that, the honeycomb sandwich panel 1 is completed by cutting so as to have a desired size.

The skin 3 of the honeycomb sandwich panel 1 produced as described above has high characteristics in terms of thermal conductivity and thermal expansion coefficient. For example, when aluminum is used as the filling metal and the volume ratio of aluminum to the total volume of the skin 3 is 30%, the thermal conductivity in the thickness direction of the skin 3 is about 50 W / m / K, and C It was confirmed that the thermal conductivity was higher than 10 W / m / K, which is the thermal conductivity in the thickness direction of the skin 3 manufactured with / C.

The thermal conductivity in the in-plane direction is 330 W / m.
/ K, and the thermal conductivity of the skin made of aluminum alloy is 150 W / m / K or more. Thermal expansion coefficient is 3.5pp
It becomes about m / K, which is a value equivalent to 0-4 ppm / K, which is the coefficient of thermal expansion of the skin prepared by general CFRP.
It was confirmed that the honeycomb sandwich panel 1 produced by using the skin 3 had a thermal conductivity in the thickness direction increased by about 10% as compared with the panel using the C / C skin.

As described above, according to the honeycomb sandwich panel 1 of Embodiment 1, since the skin 3 made of C / C filled with metal is provided, it is high in the in-plane direction and the thickness direction. It has an effect that it has a thermal conductivity and the thermal expansion coefficient can be suppressed.

Embodiment 2. FIG. 4 is an exploded perspective view for explaining the structure of the honeycomb sandwich panel 11 according to Embodiment 2 of the present invention. In the figure, reference numeral 11 denotes a honeycomb sandwich panel (high thermal conductivity honeycomb sandwich panel; hereinafter also simply referred to as panel). 1
Reference numeral 3 is a skin (hereinafter also simply referred to as a skin) made of C / C that covers both side surfaces of the honeycomb core 2 and is filled with metal silicon (filling material). Here, metallic silicon is Si with extremely high purity (99% or more), and its thermal conductivity is about 150 W / m / K at room temperature,
The coefficient of thermal expansion is about 2.6 ppm / K.

Next, a method of manufacturing the panel 11 will be described. 1. A skin 13 filled with metal silicon is formed.
First, C / C is formed by the same procedure as in the first embodiment.
During firing, the resin shrinks in volume, resulting in numerous pores inside and on the surface of the skin. By pouring the metal silicon melted at a high temperature (1600 to 2000 ° C.) into the burned C / C, the metal silicon is embedded in the pores and the filling is completed. Since liquid metallic silicon has a low viscosity, it can be plugged without applying pressure like metal.

For the same reason as in the first embodiment, it is desirable that the proportion of metallic silicon in the total volume of the skin 13 be 5%.
Approximately 30%. Within this range,
Even if the metal silicon having a high thermal conductivity is used for filling, the influence of the thermal deformation of the metal on the entire skin 13 is reduced, so that the panel 11 is not likely to be thermally deformed. 2. Next, a honeycomb core is prepared. As a material for the honeycomb core, it is preferable to use a metal such as an aluminum alloy or a composite material such as CFRP. For example, aluminum alloy honeycomb core, AL
3 / 16-5052-0.0007 (Showa Aircraft Industry) is used. 3. The honeycomb core 2 is sandwiched between two skins 13 having a sheet-shaped adhesive on the surface thereof, and heat and pressure (about 100 ° C., 1
Atmospheric pressure) to bond the skin 13 and the honeycomb core 2 together.
After that, cut to the desired size,
The honeycomb sandwich panel 11 is completed.

The skin 13 of the honeycomb sandwich panel 11 manufactured as described above has high characteristics in terms of thermal conductivity and thermal expansion coefficient. For example, when the ratio of the volume of metallic silicon to the total volume of the skin 13 is 30%, the thermal conductivity in the thickness direction of the skin 13 is about 50 W / m /
It was confirmed that K was K, and the thermal conductivity in the thickness direction of the skin prepared by C / C was higher than 10 W / m / K. The thermal conductivity in the in-plane direction is 330 W / m / K
The degree of thermal conductivity exceeds 150 W / m / K, which is the thermal conductivity of the skin made of aluminum alloy. The coefficient of thermal expansion is
It is 1.0 ppm / K or less, which is equivalent to a value of 0 to 4 ppm / K which is a general CFRP value. This skin 13
Honeycomb sandwich panel 11 produced by using
It was confirmed that the thermal conductivity in the thickness direction increased by about 10% as compared with the panel using the C / C skin.

As described above, according to the honeycomb sandwich panel 11 of the second embodiment, since the C / C skin 13 filled with metallic silicon is provided,
The same effect as that of the first embodiment can be obtained.

Embodiment 3. FIG. 5 is an exploded perspective view for explaining the configuration of the honeycomb sandwich panel 21 according to Embodiment 3 of the present invention. In the figure, reference numeral 21 is a honeycomb sandwich panel (high heat conductive honeycomb sandwich panel; hereinafter also simply referred to as panel), and 22 is a high heat conductive honeycomb core (honeycomb core). The high thermal conductivity honeycomb core 22 has its fiber direction oriented in the honeycomb core 22.
It is a honeycomb core made of CFRP, which has a characteristic of having a high thermal conductivity in the thickness direction. The shape of the high thermal conductivity honeycomb core 22 is the same as that of the honeycomb core 2, the thickness direction is the Z direction in FIG. 3, and the in-plane directions are the X and Y directions in FIG. The thermal conductivity in the thickness direction of the high thermal conductive honeycomb core 22 is 8 to 20.
It is about W / m / K, and the thermal conductivity in the thickness direction of the standardly used aluminum alloy honeycomb core (5 W / m / K
K)). 23 covers both side surfaces of the high thermal conductive honeycomb core 22 and is made of metal (for example, Al, Cu, Ag, A).
u, Mg, etc.) or C filled with metallic silicon
/ C is an epidermis (hereinafter, also simply referred to as epidermis).
The skin 23 made of C / C filled with metal or metal silicon is the same as the skin 3 or the skin 13.

The manufacturing method of the honeycomb sandwich panel 21 is the same as that of the first embodiment when the metal-filled C / C is used as the skin 23, and the metal-silicon filled C / C is used. The case is the same as in the second embodiment. In either case, the high thermal conductive honeycomb core 22 is used as the honeycomb core.

The honeycomb sandwich panel 21 manufactured by using the skin 23 and the high thermal conductive honeycomb core 22 of the third embodiment has a thermal conductivity in the thickness direction which is higher than that of a honeycomb sandwich panel manufactured by a general aluminum alloy. It was confirmed that the temperature increased by about 60%.

As described above, according to the honeycomb sandwich panel 21 of the third embodiment, the C / C skin 23 filled with metal or metal silicon and the high thermal conductive honeycomb core 22 are provided. Therefore, the effect that the thermal conductivity of the entire panel can be further increased is obtained.

Fourth Embodiment Next, the honeycomb sandwich panel 31 of Embodiment 4 will be described. The honeycomb sandwich panel 31 is configured such that the high thermal conductive honeycomb core 22 and the surface skin 23 of the honeycomb sandwich panel 21 of the third embodiment are adhered to each other with a high thermal conductive sheet adhesive. FIG. 6 is an exploded perspective view for explaining the structure of the honeycomb sandwich panel 31 according to the fourth embodiment of the present invention. In the figure, 31
Is a honeycomb sandwich panel (high heat conductive honeycomb sandwich panel; hereinafter also simply referred to as panel), and 34 is a sheet-like adhesive containing a high heat conductive filler. The sheet-shaped adhesive 34 containing the high thermal conductive filler is inserted into the gap between the high thermal conductive honeycomb core 22 and the skin 23.

Next, a method of manufacturing the panel 31 will be described. The preparation of the skin 23 and the preparation of the high thermal conductive honeycomb core 22 are the same as those in the third embodiment. Next, the adhesive 34 containing the high thermal conductive filler (for example, aluminum pieces) is used.
Is inserted into the gap between the high thermal conductive honeycomb core 22 and the skin 23, and appropriate heat and pressure are applied to bond the skin 23 and the high thermal conductive honeycomb core 22. After that, the honeycomb sandwich panel 31 is completed by cutting so as to have a desired size.

The adhesive 34 containing the high thermal conductive filler used for bonding the surface skin 23 of the honeycomb sandwich panel 31 and the high thermal conductive honeycomb core 22 is 3 to 7 W /.
It is about m / K, which is higher than the thermal conductivity of about 0.1 W / m / K of the epoxy adhesive or the like which is normally used. Therefore, the honeycomb sandwich panel 31 manufactured using the adhesive 34 containing the high thermal conductive filler has higher thermal conductivity than the honeycomb sandwich panel manufactured using the standard adhesive.

For example, in the case of a honeycomb sandwich panel in which the skin is C / C and the honeycomb core is made of aluminum alloy,
Comparing the thermal conductivity in the thickness direction of the entire panel between the case of using the epoxy adhesive and the case of using the adhesive 34 containing the filler for the adhesion of the skin and the honeycomb core, the latter panel as compared with the former is compared with the former. Thermal conductivity in the thickness direction is about 20%
It was confirmed to rise back and forth.

As described above, according to the honeycomb sandwich panel 31 of the fourth embodiment, the C / C skin 23 filled with metal or metal silicon and the high thermal conductive honeycomb core 22 are provided. Embodiment 3
The same effect as can be obtained. Further, the high thermal conductive honeycomb core 22 and the surface skin 23 are bonded to each other with an adhesive 34 containing a high thermal conductive filler.
Since they are bonded together, the effect that the thermal conductivity of the entire panel can be made higher can be obtained.

Embodiment 5. Next, the honeycomb sandwich panel 41 of Embodiment 5 will be described. The honeycomb sandwich panel 41 is made by bonding the high thermal conductive honeycomb core 22 and the skin 23 of the honeycomb sandwich panel 21 of the third embodiment to carbon by carbonizing the adhesive by subsequently firing with a sheet-shaped epoxy resin or the like, The thermal conductivity of the adhesive portion is increased.

FIG. 7 is an exploded perspective view for explaining the structure of the honeycomb sandwich panel 41 according to the fifth embodiment of the present invention. In the figure, reference numeral 41 is a honeycomb sandwich panel (high heat conductive honeycomb sandwich panel; hereinafter also simply referred to as panel). Reference numeral 44 denotes carbon that is inserted into the gap between the high thermal conductive honeycomb core 22 and the skin 23, and bonds the high thermal conductive honeycomb core 22 and the skin 23 together.

Next, a method of manufacturing the panel 41 will be described. The preparation of the skin 23 and the preparation of the high thermal conductive honeycomb core 22 are the same as those in the third embodiment. Next, an epoxy-based adhesive or the like is inserted into the gap between the skin 23 and the high thermal conductive honeycomb core 22, and appropriate heat and pressure (about 100 ° C., 1
After applying the atmospheric pressure) to bond the skin 23 and the high thermal conductive honeycomb core 22 to each other, they are fired at a higher temperature. The firing carbonizes the adhesive to form carbon. After that, the honeycomb sandwich panel 41 is completed by cutting so as to have a desired size.

The carbon 44 used for adhering the skin 23 of the honeycomb sandwich panel 41 and the high thermal conductive honeycomb core 22 has a thermal conductivity of about 10 W / m / K, which is a standard non-fired epoxy. The thermal conductivity of adhesives, etc. exceeds about 0.1 W / m / K. Therefore, the honeycomb sandwich panel 41 manufactured by using the carbon 44 as an adhesive has higher thermal conductivity than the honeycomb sandwich panel manufactured by using the standard adhesive.

For example, in the case of a honeycomb sandwich panel in which the skin is C / C and the honeycomb core is made of aluminum alloy,
Comparing the thermal conductivity in the thickness direction of the entire panel between the case where the epoxy-based adhesive is used for the adhesion of the skin and the honeycomb core and the case where the carbon 44 obtained by carbonizing the same is used, the latter panel as a whole is compared with the former case. Has a thermal conductivity of approximately 2 in the thickness direction.
It was confirmed to rise by around 0%.

As described above, according to the honeycomb sandwich panel 41 of the fifth embodiment, the C / C skin 23 filled with metal or metal silicon and the high thermal conductive honeycomb core 22 are provided. Therefore, the same effect as that of the third embodiment can be obtained. Further, since the high thermal conductive honeycomb core 22 and the skin 23 are bonded by the carbon 44, the effect that the thermal conductivity of the entire panel can be further increased is obtained.

Sixth Embodiment FIG. 8 is an exploded perspective view for explaining the structure of the honeycomb sandwich panel 51 according to the sixth embodiment of the present invention. In the figure, reference numeral 51 is a honeycomb sandwich panel (high thermal conductivity honeycomb sandwich panel; hereinafter also simply referred to as panel). 5
Reference numeral 4 is a low melting point metal such as solder that adheres the skin 23 and the high thermal conductive honeycomb core 22.

Next, a method of manufacturing the panel 51 will be described. The preparation of the skin 23 and the preparation of the high thermal conductive honeycomb core 22 are the same as those in the third embodiment. Next, a low melting point metal such as solder is applied to the skin 23 and the high thermal conductive honeycomb core 22.
Insert it in the gap between the two and apply appropriate heat and pressure to the epidermis 2.
3 and the high thermal conductive honeycomb core 22 are bonded together. afterwards,
The honeycomb sandwich panel 51 is completed by cutting so as to have a desired size.

The thermal conductivity of the low melting point metal 54 used for adhering the surface skin 23 of the honeycomb sandwich panel 51 and the high thermal conductivity honeycomb core 22 is about several tens W / m / K, which is used in the sixth embodiment. In the case of the applied solder, it is about 40 W / m / K. The thermal conductivity of a standard epoxy adhesive or the like is about 0.1 W / m / K, which is much higher than this. Therefore, the honeycomb sandwich panel 51 produced by using the low melting point metal 54 as an adhesive agent
Has a higher thermal conductivity than honeycomb sandwich panels made using standard adhesives.

For example, in the case of a honeycomb sandwich panel in which the skin is C / C and the honeycomb core is made of aluminum alloy,
Comparing the thermal conductivity in the thickness direction of the entire panel between the case of using the general epoxy adhesive and the case of using the low melting point metal 54 for bonding the skin and the honeycomb core, the latter panel as a whole is compared with the former. It was confirmed that the thermal conductivity in the direction of the thickness of was increased by about 20%.

When CFRP was conventionally used as a material for the skin, it was impossible to use metal for adhesion, but since the skin was mixed with metal or metal silicon by clogging, (in a good condition) It has become possible).

As described above, according to the honeycomb sandwich panel 51 of the sixth embodiment, the skin 23 made of C / C filled with metal or metal silicon and the high thermal conductive honeycomb core 22 are provided. Embodiment 3
The same effect as can be obtained. Further, since the low melting point metal 54 is used for bonding the high thermal conductivity honeycomb core 22 and the skin 23, the effect that the thermal conductivity of the entire panel can be further increased is obtained.

Embodiment 7. FIG. 9 is an exploded perspective view for explaining the configuration of the honeycomb sandwich panel 61 according to Embodiment 7 of the present invention. In the figure, reference numeral 61 denotes a honeycomb sandwich panel (high heat conductive honeycomb sandwich panel; hereinafter also simply referred to as panel). 6
Reference numeral 2 denotes a divided high thermal conductive honeycomb core, which is formed in the same manner as the high thermal conductive honeycomb core 22 of the third embodiment. 64 is a sheet-shaped adhesive. Reference numeral 65 is a heat pipe that passes through the center of the divided high thermal conductive honeycomb core 62. As the heat pipe 65, for example, one made of aluminum alloy is used. This has a thermal conductivity of 150W
/ M / K.

The manufacturing method of the honeycomb sandwich panel 61 is the same as that of the third embodiment, but when preparing the honeycomb core, the honeycomb core 62 is divided at the position where the heat pipe 65 passes, and then the heat pipe 65 is arranged. To do so. Since the heat pipe 65 is made of metal (made of aluminum alloy), it has a higher thermal conductivity than the honeycomb core made of CFRP or the like. Therefore, the thermal conductivity of the honeycomb sandwich panel 61 near the portion where the heat pipe 65 passes has a high thermal conductivity regardless of the type of honeycomb core.

For example, the skin is C / C and the honeycomb core is C.
For the FRP honeycomb sandwich panel, when the above-mentioned aluminum alloy heat pipe 65 is passed through the central portion of the honeycomb core 62, the thermal conductivity in the thickness direction near that portion of the panel 61 is 40 W / m / K. It has a much higher thermal conductivity than the honeycomb sandwich panel that does not pass through the heat pipe.

As described above, according to the honeycomb sandwich panel 61 of the seventh embodiment, the C / C skin 23 filled with metal or metal silicon and the separated high thermal conductive honeycomb core 62 are provided. Therefore, the same effect as that of the third embodiment can be obtained. Further, since the honeycomb core 62 is provided with the heat pipe 65 in the central portion thereof, it is possible to obtain the effect that the thermal conductivity of the entire panel can be further increased.

Embodiment 8. 10 is a schematic external view of an artificial satellite 10 according to Embodiment 8 of the present invention. The artificial satellite 10 uses the high thermal conductive honeycomb sandwich panel described in any of the first to seventh embodiments as a member. In the figure, 10 is an artificial satellite. Reference numeral 20 denotes a satellite structure, and reference numeral 20a denotes a structure panel (a device mounting panel for artificial satellites) that constitutes the structure 20. Structure panel 2
0a is formed by using the honeycomb sandwich panels 1 to 61 as a base material, and a device (not shown) is mounted inside. Reference numeral 30 is a flat plate-shaped solar cell paddle (a panel for mounting an artificial satellite device) provided on both sides of the structure 20. The solar cell paddle 30 is configured by laying solar cells on the honeycomb sandwich panels 1 to 61. Particularly, high heat exhaust efficiency is required because sunlight is concentrated on the solar cell paddle 30 and reaches a high temperature, and the structure panel 20a may reach a high temperature due to heat generated by the device.

Therefore, the structure panel 20a and the solar cell paddle 30 including the honeycomb sandwich panels 1 to 61 described in the first to seventh embodiments as members have very high thermal conductivity and also improved heat exhaust efficiency. For this reason, CFRP, which is commonly used as a satellite structural member,
It was confirmed that the exhaust heat efficiency in the thickness direction was up to about twice as high as that of the honeycomb sandwich panel using the skin and the honeycomb core made of.

As described above, according to the structure panel 20a or the solar cell paddle 30 which constitutes the artificial satellite 10 of the eighth embodiment, the honeycomb sandwich panels 1 to 6 are provided.
The honeycomb sandwich panel of any one of 1 is formed. Since the panel having high thermal conductivity is used as the member as described above, the effect of improving the exhaust heat efficiency of the panel for mounting the artificial satellite device can be obtained.

[0053]

As described above, according to the present invention, a honeycomb core and a skin covering both side surfaces of the honeycomb core are provided, and the skin is filled with a filling material having a higher thermal conductivity than the skin. Since the high-heat-conductivity honeycomb sandwich panel is made of C / C (Carbon / Carbon: carbon / carbon, carbon fiber reinforced carbon), it has high thermal conductivity in the in-plane direction and the thickness direction, and There is an effect that a high thermal conductive honeycomb sandwich panel capable of suppressing the coefficient of thermal expansion is obtained.

According to the present invention, since the high thermal conductivity honeycomb sandwich panel is formed by using the filling material as metal or metal silicon, it has a high thermal conductivity in the in-plane direction and the thickness direction, and the coefficient of thermal expansion is high. There is an effect that a highly heat conductive honeycomb sandwich panel that can be suppressed is obtained.

According to the present invention, since the high-heat-conductivity honeycomb sandwich panel is constructed so that the ratio of the filling material to the total volume of the surface skin is within the range of 5% to 30%, the metal or the like having high heat conductivity can be used. Even if the filling is performed with metallic silicon or the like, the effect of thermal deformation of the metal or metallic silicon on the entire surface of the skin is reduced, so that there is an effect that a highly heat-conductive honeycomb sandwich panel in which thermal deformation does not occur can be obtained.

According to the present invention, the honeycomb core has a CFRP (Carb) in which the thickness direction and the running direction of the fibers are aligned.
Since the high thermal conductivity honeycomb sandwich panel is made of on Fiber Reinforced Plastic (carbon fiber reinforced plastic), there is an effect that a high thermal conductivity honeycomb sandwich panel capable of increasing the overall thermal conductivity can be obtained.

According to the present invention, since the artificial satellite device mounting panel is configured so as to include the high heat conductive honeycomb sandwich panel of the other invention of this specification, an artificial satellite device mounting panel having a high exhaust heat efficiency can be obtained. effective.

[Brief description of drawings]

FIG. 1 is an exploded perspective view for explaining the configuration of a high thermal conductive honeycomb sandwich panel according to Embodiment 1 of the present invention.

[Fig. 2] Fig. 2 is a diagram for explaining a configuration of a skin of a high thermal conductivity honeycomb sandwich panel.

FIG. 3 is a detailed view of a honeycomb core.

[Fig. 4] Fig. 4 is an exploded perspective view for explaining a configuration of a high heat conductive honeycomb sandwich panel according to Embodiment 2 of the present invention.

[Fig. 5] Fig. 5 is an exploded perspective view for explaining a configuration of a high-heat-conductivity honeycomb sandwich panel according to Embodiment 3 of the present invention.

[Fig. 6] Fig. 6 is an exploded perspective view for explaining the structure of a high-heat-conductivity honeycomb sandwich panel according to Embodiment 4 of the present invention.

[Fig. 7] Fig. 7 is an exploded perspective view for explaining the configuration of a high-heat-conductivity honeycomb sandwich panel according to Embodiment 5 of the present invention.

[Fig. 8] Fig. 8 is an exploded perspective view for explaining the configuration of a high-heat-conductivity honeycomb sandwich panel according to Embodiment 6 of the present invention.

[Fig. 9] Fig. 9 is an exploded perspective view for explaining the configuration of a high thermal conductive honeycomb sandwich panel according to Embodiment 7 of the present invention.

FIG. 10 is a schematic external view of an artificial satellite according to an eighth embodiment of the present invention.

FIG. 11 is a cross-sectional view showing one step of a conventional honeycomb sandwich panel made of carbon / carbon and carbon / ceramic.

[Explanation of symbols]

1,11,21,31,41,51,61 Honeycomb sandwich panel (high thermal conductivity honeycomb sandwich panel), 2 high thermal conductivity honeycomb core, 3 skin made of C / C filled with metal (filling material), 3a
Carbon, 3b carbon fiber, 4 pores, 10 satellites, 1
3 C / C skins filled with metallic silicon (filling material), 20 satellite structure, 20a structure panel (artificial satellite equipment mounting panel), 22 high thermal conductivity honeycomb core (honeycomb core), 23 metal or C / C skin covered with metallic silicon, 30
Solar battery paddle (panel with satellite equipment), 54
Low melting point metal, 62 separated high thermal conductivity honeycomb core,
64 sheet adhesive, 65 heat pipe.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4F100 AB01A AB01C AB01H AB10B                       AB11A AB11C AB11H AB31B                       AD11A AD11C BA03 BA06                       BA10A BA10C BA13 DC02B                       DG01A DG01C DH00A DH00C                       GB90 JJ01 JL04

Claims (5)

[Claims] 1. A C / C (Carbon) having a honeycomb core and a skin covering both side surfaces of the honeycomb core, the skin being filled with a filling material having a thermal conductivity higher than that of the skin.
/ Carbon: High thermal conductivity honeycomb sandwich panel characterized by comprising carbon / carbon, carbon fiber reinforced carbon). 2. The high heat conductive honeycomb sandwich panel according to claim 1, wherein the filling material is metal or metal silicon. 3. The high heat conductive honeycomb sandwich panel according to claim 1, wherein the proportion of the filling material with respect to the total volume of the skin is within the range of 5% to 30%. 4. The honeycomb core has a CFRP (Carbon Fiber Reinf) in which the thickness direction and the running direction of the fibers are matched.
orced plastic: a carbon fiber reinforced plastic), The high heat conductive honeycomb sandwich panel according to claim 1. 5. An artificial satellite equipment mounting panel comprising the high thermal conductivity honeycomb sandwich panel according to any one of claims 1 to 4.