JP2003317947A - Manufacturing method for lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method simply miniaturizing a light emitting part, in particular, in the manufacturing method for a lighting system suited for lighting an electro-optic display device such as a liquid crystal display device as a lighting object. <P>SOLUTION: This manufacturing method for the lighting system includes a process of vapor-depositing, at least, a light shielding light absorbing layer 309, a reflecting electrode layer 308, an alkaline earth metal layer 307, and a buffer layer 306 and a light emitting body layer 305 as components of the light emitting part to an outer side substrate 302 with recesses/projections on its surface from the diagonal direction to the substrate surface, a process of forming films of the whole surfaces of a positive electrode 303, a positive hole filling layer 314, and a positive hole transport layer 304 as the residual parts of the components of the light emitting part on a panel side substrate 301, and a sticking process of sticking the outer side substrate 302 to the panel side substrate and sealing the respective components between the substrates. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an illuminating device, and more particularly to a method for manufacturing an illuminating device applicable as a front light arranged on the viewing side of a display device.

[0002]

2. Description of the Related Art Conventionally, as an electro-optical display device such as a liquid crystal display device, external light such as sunlight is incident on the electro-optical panel from the observer side, and the incident light is reflected inside the electro-optical panel. There is known a reflection type display device of a type that emits light to the observer side. However, in a reflective display device, it may be difficult to visually recognize the display in a dark place. Therefore, a reflective display device equipped with an illumination device as a front light on the viewer side (observation side or viewing side) of the electro-optical panel is not available. Proposed.

As such a front light, there are known a lateral arrangement type in which a light source is arranged on the side of the electro-optical panel and a front arrangement type in which the light source is arranged on the visible side of the electro-optical panel. Of these, the former side-disposed front light is a light source arranged on the visible side of the electro-optical panel and a light source arranged on the visible side of the electro-optical panel for emitting light emitted from the light source to the electro-optical panel. And a light guide plate for irradiating the side. On the other hand, the front type front light of the latter has a light emitting portion formed of a light emitting element provided on a transparent substrate, and has a structure in which the light emitting direction of the light emitting element is directed to the electro-optical panel side.

[0004]

By the way, as an illuminating device applied to such a front light, there is an illuminating device in which a light emitting portion has a light emitting layer interposed between a cathode and an anode. In some cases, the light emitting layer is mainly composed of an electroluminescent material such as EL, and light emission in the light emitting layer is realized by generating an electric field between the cathode and the anode. The light thus emitted from the light emitting portion is incident on the electro-optical panel described above and then reflected by the electro-optical panel, and the reflected light passes through the gap between the light emitting portions formed in a stripe shape, for example. And is emitted to the observer side. Therefore, the front light in which the light emitting portions are arranged in a stripe shape in this manner can be applied as a front surface arrangement type.

By the way, in order to realize a light emitting portion having a stripe-shaped fine structure, for example, a method of finely patterning the cathode in a stripe shape in the manufacturing process of the lighting device can be considered. Specifically, there is a method of finely patterning the cathode, the anode, the light emitting layer, etc. by mask vapor deposition or the like, but the line width of the stripe becomes as large as at least about 60 μm. -Shaped shadows may be visible, and good display may not be obtained.

The present invention has been made in view of the above-mentioned problems, and is a method of manufacturing an illumination device suitable for illuminating an electro-optical display device such as a liquid crystal display device as an illuminated object, and in particular, it emits light. It is an object of the present invention to provide a manufacturing method capable of easily achieving miniaturization of a part.

[0007]

In order to solve the above-mentioned problems, a method of manufacturing an illuminating device of the present invention is a method of manufacturing an illuminating device having a light emitting portion between a pair of substrates, wherein the surface has unevenness. First substrate-side film forming step of forming at least a light-shielding member and at least a part of the constituent elements of the light emitting unit on one substrate from an oblique direction with respect to the substrate surface, the first substrate, and the first substrate And a second substrate different from the above, and a bonding step of sandwiching the constituent elements of the light emitting unit between these substrates. The film formation in the first substrate side film formation step is performed in the concave bottom part of the first substrate. The first substrate is characterized in that it is performed on the first substrate from an angle at which the area of the shadow of the convex portion of the first substrate is 20% or more of the area of the concave bottom portion.

According to such a manufacturing method, when forming a film on the first substrate (for example, by oblique vapor deposition (oblique vapor deposition), sputtering, etc.), a portion which becomes a shadow of the convex portion of the first substrate Can be a concave bottom, and its area is 2 of the total area of the concave bottom.
It becomes 0% or more. In this case, the shaded concave bottom portion is an area where the light-shielding member and at least a part of the constituent elements of the light emitting portion are not formed, and the shaded concave bottom portion can function as a non-light emitting portion. That is, a light-shielding member and a light emitting component are laminated on the convex portion of the first substrate to form a light emitting main body that mainly emits light at that portion, while the convex portion of the first substrate is formed. A light-shielding member and a non-formation part of a component are formed in the concave bottom part which becomes a shadow of, and a non-light emitting part is formed in the part. Therefore, it becomes possible to form a light emitting portion having a pattern corresponding to the concavo-convex pattern of the first substrate. For example, by forming the concavo-convex pattern of the first substrate into a fine striped pattern, a similar fine striped pattern can be obtained. It becomes possible to form a light emitting portion having a light emitting pattern.

By using an illuminating device having a light emitting portion having such a fine stripe pattern as a front light of an electro-optical panel, for example, a problem such as a stripe shadow being visually recognized is unlikely to occur. . In addition,
If the area of the shadowed portion during film formation is less than 20% of the total area of the concave bottom portion, it is not possible to obtain a non-luminous portion having a sufficient area. Even when it is used as a front light, a problem such as a decrease in brightness of the electro-optical panel may occur.
The area of the shadowed portion during film formation can be preferably 50% or more of the area of the entire concave bottom portion.

Specifically, as the uneven shape of the first substrate,
It is possible to form a pattern that is linear in a plan view and has an uneven cross section in a direction intersecting the linear direction. In this case, the light-shielding member, the component, and the like are formed on the unevenness formed in the plan view linear pattern in a direction intersecting the linear direction to form a plan view linear pattern. It is possible to obtain a light emitting unit. The illuminating device including the light emitting portion having such a line-shaped pattern in a plan view is extremely suitable as a front light of an electro-optical panel.

On the other hand, in order to solve the above-mentioned problems, a manufacturing method of an illuminating device of the present invention is, as a different aspect, a manufacturing method of an illuminating device provided with a light emitting portion between a pair of substrates, wherein unevenness is formed on the surface. A first substrate-side film forming step of forming at least a light-shielding member and at least a part of the constituent elements of the light-emitting section on the first substrate, the first substrate-side film forming step; And a second substrate different from the first substrate, and a bonding step of sandwiching the constituent elements of the light emitting unit between the substrates. The uneven shape of the first substrate is linear in plan view and in the linear direction. The cross-section in the direction intersecting with is a concavo-convex pattern, and the film formation in the first substrate-side film forming step is a direction intersecting with the longitudinal direction of the linear protrusion in the range of 70 ° to 110 °, 5 ° to 80 ° to the substrate surface of one substrate
It is characterized by performing from the direction of.

According to such a manufacturing method, when the film is formed on the first substrate (for example, by oblique evaporation (oblique evaporation), sputtering, etc.), the longitudinal direction of the linear convex portion of the first substrate is increased. Since the film formation is performed from the direction of the predetermined angle with respect to the substrate surface of the first substrate, the linear convex portion of the first substrate is shaded to form a concave shape. A non-film-forming portion will be formed on the bottom. The non-film-forming portion of such a concave bottom portion serves as a region in which the light-shielding member and some or all of the constituent elements of the light-emitting portion are not formed, and this can function as the non-light-emitting portion. That is, the first
A light-shielding member and a light-emitting component are laminated on the convex portion of the substrate to form a light-emitting main portion in which light is mainly emitted, while non-film formation on the concave bottom portion of the first substrate. A light-shielding member and a non-formation portion of the component are formed in the portion, and the non-light emitting portion is formed in that portion.

Therefore, it becomes possible to form a light emitting portion having a linear light emitting pattern in accordance with the concave-convex pattern (linear pattern in plan view) of the first substrate.
When the uneven shape of the first substrate is made into a fine linear shape, it becomes possible to form a light emitting portion having a fine linear light emitting pattern. Then, by using the illumination device including such a light emitting unit as a front light of an electro-optical panel, for example, a defect such as a stripe-shaped shadow being visually recognized is unlikely to occur.

When the angle of film formation with respect to the substrate surface of the first substrate is less than 5 °, the desired light-shielding material and the light emitting component cannot be sufficiently laminated on the substrate surface, especially on the convex portion. If it exceeds 80 °, the formation ratio of the non-film-forming portion of the concave bottom becomes small, and, for example, even when the lighting device is used as a front light of an electro-optical panel, the brightness of the electro-optical panel is reduced. Problems such as deterioration may occur. The angle of film formation with respect to the substrate surface of the first substrate is
It can preferably be 10 ° to 30 °. Also,
By forming a film by vapor deposition, sputtering, or the like from a direction intersecting the longitudinal direction of the linear convex portion of the first substrate in the range of 70 ° to 110 °, it is possible to reliably form the non-film forming portion, Therefore, it becomes possible to realize the fine patterning of the light emitting portion more reliably. In addition, it is preferable that the film formation is performed from a direction intersecting with the longitudinal direction of the linear protrusions of the first substrate in the range of 80 ° to 100 °.

Next, in the manufacturing method of each of the above aspects, the pattern formation of the first substrate (substrate pattern forming step) can be performed in various shapes by, for example, photolithography or machining. , It is possible to form an extremely fine pattern, for example, a line width of 5 to 50
It is possible to form a linear pattern of about μm. Therefore, it becomes possible to manufacture an illuminating device including a light emitting portion patterned in a fine linear shape having a line width of about 5 to 50 μm, and as a result, an illuminating device extremely suitable for use as a front light of an electro-optical panel can be obtained. Can be provided.
In addition, the shape of the light emitting unit can be easily controlled according to the concave-convex pattern shape of the first substrate, and in turn, the lighting efficiency of the lighting device can be controlled.

In addition, in the manufacturing method of the present invention, the first substrate having the patterned unevenness is used, and the light emitting portion having the predetermined pattern is obtained only by forming the film from the predetermined direction on the first substrate. As a result, it is possible to realize further miniaturization of the light-emitting portion very easily as compared with the case of patterning the light-emitting element components by mask vapor deposition, etc. Since it is not necessary to form a pattern, various materials can be applied as the constituent element of the light emitting unit. Therefore, it is possible to reduce the cost and improve the yield of the lighting device applied to the front light and the like. As described above, the patterning of the unevenness on the first substrate can be performed very easily, and the first substrate is not particularly limited as long as it can be miniaturized by photolithography or machining. Instead, for example, a glass substrate or a resin substrate may be used.

Furthermore, when a part of the constituent elements of the light emitting portion is formed on the first substrate, the second substrate side film forming step of forming the rest of the constituent elements on the second substrate is included. You can As described above, the light emitting component constituting the fine pattern may be at least a part of a member or the like having a light shielding property, and the rest can be formed as a solid film over the entire surface of the second substrate, for example.

The height of the convex portion of the uneven surface formed on the surface of the first substrate may be 1 μm to 100 μm. If the height of the convex portion is less than 1 μm, a shadow or a non-film-forming portion may not be sufficiently obtained at the concave bottom portion, while if it exceeds 100 μm, the lighting device itself may become thick. is there. The height of the convex portion can be preferably about 5 μm to 20 μm.

Further, the bottom width of the concave portion having the unevenness in cross section formed on the surface of the first substrate can be set to 5 μm to 500 μm. When the bottom width of the concave portion is less than 5 μm, shadows or non-film-forming portions may not be sufficiently obtained at the concave bottom portion, and thus the area of the non-light emitting portion becomes small.
When the illuminating device is used as a front light of an electro-optical panel or the like, a problem such as a decrease in brightness of the electro-optical panel may occur. On the other hand, if the bottom width of the concave portion exceeds 500 μm, sufficient miniaturization cannot be obtained, and a defect such as a linear shadow being visually recognized may occur. In some cases, the area of the main body becomes small and the luminous efficiency decreases. The bottom width of the concave portion can be preferably about 30 μm to 100 μm.

Further, the upper surface width of the convex portion having the uneven cross section formed on the surface of the first substrate may be 1 μm to 50 μm. If the upper surface width of the convex portion is less than 1 μm, the area of the light emitting main portion that actually emits light may be small and the luminous efficiency may be reduced. If it exceeds 50 μm, sufficient miniaturization cannot be obtained, Problems such as visual recognition of linear shadows may occur. The upper surface width of the convex portion is preferably 5 μ
It can be set to about m to 20 μm.

Next, the constituent elements of the light emitting section may include at least a cathode, a light emitting main body layer, and an anode, and at least one of them is obliquely formed on the first substrate to form a film. It becomes possible to form the non-light emitting portion as described above. Specifically, when the cathode is mainly composed of Al, the film can be formed obliquely on at least the first substrate. Al
Has a light-shielding property, the cathode mainly containing Al is
By forming a film in the substrate-side film forming step and patterning the film in accordance with the uneven shape, it becomes possible to obtain a light emitting portion having a pattern corresponding to the shape. Note that the cathode may be configured to include an alkaline earth metal layer in addition to the Al layer. In this case as well, since each layer exhibits a light-shielding property, the first substrate side film formation step It is preferable to form the film obliquely with respect to one substrate.

The light emitting body layer can be composed mainly of, for example, an organic EL, and the anode is, for example, ITO.
(Indium tin oxide) can be used as a main component, and since these show translucency, it is not always necessary to form the film obliquely on the first substrate, and for example, by vapor deposition or the like on the second substrate. The entire surface may be formed into a solid film.

Further, a low molecular weight EL is used as the light emitting main body layer, and a buffer layer is interposed between the light emitting main body layer and the cathode,
Further, the hole injection layer and / or the hole transport layer may be interposed between the light emitting main body layer and the anode from the anode side. Since the low-molecular-weight EL exhibits translucency, it is not always the first
It is not necessary to form a film obliquely with respect to the substrate.
It is possible to form a solid film on the entire surface of the substrate by vapor deposition or the like. Further, the buffer layer can be composed mainly of a fluoride of an alkaline earth metal such as LiF. Since such a buffer layer also has a light-transmitting property, it is not always necessary to form the film obliquely with respect to the first substrate. And the hole injection layer is copper phthalocyanine (CuPc)
In this case as well, the film does not necessarily have to be obliquely formed on the first substrate because it exhibits translucency. The hole-transporting layer can be composed mainly of polyethylenedioxythiophene (conductive polymer). However, it is difficult to deposit such a conductive polymer by vapor deposition. It is preferable to form a solid film over the entire surface.

A polymer EL may be used as the light emitting main body layer, and a hole transport layer may be interposed between the light emitting main body layer and the anode. In this case, since it is difficult to form the polymer EL from an oblique direction by vapor deposition, sputtering, etc., it is preferable to form a solid film on the entire surface of the second substrate by spin coating or the like, and the hole transport layer is also the same. In addition, it is possible to form a solid film over the entire surface of the second substrate.

The light-shielding member can be composed of a light-absorbing member or a light-reflecting member that blocks the light emitted from the light-emitting body layer in the lighting device. By providing such a light absorbing layer or a light reflecting layer, when the lighting device is used as a front light of an electro-optical panel, it is possible to prevent light leakage from the light emitting portion to the observer side. However, since each of these layers is composed of a light-shielding member (for example, resin black or Cr as a main component),
In the present invention, the film is formed obliquely on the first substrate by oblique evaporation or the like. Therefore, it becomes possible to finely pattern the light-shielding member, to realize a light emitting section having a fine pattern, and to provide an illuminating device suitable as a front light of an electro-optical panel.

At least the bonding surface of the second substrate with the first substrate may be a flat surface. On the second substrate having such a flat surface, in the second substrate-side film forming step, if there is at least a component that does not form a film on the first substrate, the entire surface is made solid by spin coating, printing, or the like. The second substrate can be formed into a film, and the second substrate can be bonded in a bonding step to form a light emitting portion having a fine pattern.

The laminating step includes a step of filling a gap between the concave bottom portion of the first substrate and the second substrate with a filler after the first substrate and the second substrate are laminated. It can be wasteful. In this case, it becomes possible to more reliably ensure the airtightness between the substrates that sandwich the light emitting unit.

In the present invention, the "main component" means the component with the highest content among the constituent components.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. First, the structure of a liquid crystal display device including an illumination device manufactured according to the present invention will be described with reference to FIGS. 1 and 2. 1 is an exploded perspective view of the liquid crystal display device, and FIG. 2 is a partial schematic sectional view of the liquid crystal display device. In this case, as an example of the liquid crystal display device, an active matrix reflection type liquid crystal display device using a TFT element as a switching element will be taken up and described. Also,
In each drawing, the scale is different for each layer and each member in order to make each layer and each member recognizable in the drawings.

1 and 2, reference numeral 10 is a liquid crystal display device, reference numeral 20 is a liquid crystal panel (illumination target), and reference numeral 30 is an illuminating device manufactured by the manufacturing method of the present invention. 1 and 2, the upper side of the liquid crystal panel 20 (liquid crystal display device 10) in the figure is the side on which the display is viewed (viewing side, that is, the viewer side), and the illumination device 30 is provided on the viewing side of the liquid crystal panel 20. The liquid crystal panel 20 and the lighting device 30 are integrated to form the liquid crystal display device 10. That is, the lighting device 30 is configured as a front light that illuminates the liquid crystal panel 20 from the viewing side.

As shown in FIGS. 1 and 2, a liquid crystal panel 20 is provided.
Is an element substrate (first substrate) 21 having a TFT element 28, a pixel electrode 29, etc. formed on the inner surface thereof, and a counter substrate (second substrate) 22 having a common electrode 24 formed on the inner surface thereof. A liquid crystal layer (electro-optical material layer) 23 is sandwiched between a substrate 21 and a counter substrate 22, and a polarizer 25 such as a polarizing plate is attached to the upper side of the counter substrate 22 in the drawing. As a basic configuration in which the liquid crystal layer 23 is sandwiched between the substrates 21 and 22, a sealing material (not shown) is interposed on the peripheral side of the substrates 21 and 22, and the substrates 21 and 22 are actually
The liquid crystal layer 23 is sandwiched between the liquid crystal layer 22 and the sealing material. On the other hand, in FIG. 1, the display of the polarizer 25 and the liquid crystal layer 23 is omitted. Further, in FIG. 2, the TFT element 2 formed on the inner surfaces of the element substrate 21 and the counter substrate 22.
8, the display of the pixel electrode 29, the common electrode 24, etc. is omitted.

The “inner surfaces” of the element substrate 21 and the counter substrate 22 mean the “surfaces on the liquid crystal layer side” of the element substrate 21 and the counter substrate 22, respectively. As shown in FIG. 1, a large number of source lines 26 (data lines) and a large number of gate lines 27 (scanning lines) are provided in a matrix on the inner surface of the element substrate 21 so as to intersect each other. The TFT element 2 is provided near the intersection of each source line 26 and each gate line 27.
8 are formed, and the pixel electrode 29 is connected to each line through each TFT element 28. On the other hand, the counter substrate 22
A transparent common electrode 24 made of ITO (indium tin oxide) or the like is formed on the inner surface side of the so as to correspond to the display area.

In the liquid crystal panel 20, the area in which the individual pixel electrodes 29 are formed is the pixel 2. Further, in a normal liquid crystal display device, color filters for displaying red, green, and blue are provided on the inner surface of the element substrate 21, but in the present embodiment, the color filters are omitted and the liquid crystal panel 2 is omitted.
0 is configured as a monochrome display type.

The pixel electrode 29 is made of a light-reflective metal material and functions as a reflective electrode. Then, when the place of use is a bright place, the lighting device 30 is not turned on, and external light such as sunlight or a fluorescent lamp enters the liquid crystal panel 20 from the viewing side, and the element substrate 2
Display is performed by reflecting the light by the pixel electrode 29 formed on the inner surface of the first electrode 1 and emitting the light again toward the observer side (viewing side: above the drawing). On the other hand, when the place of use is a dark place, the lighting device 30 is turned on, and the light emitted to the liquid crystal panel 20 side by the lighting device 30 is reflected by the pixel electrode 29 formed on the inner surface of the element substrate 21, and the lighting device is again illuminated. Display is performed by passing the light through 30 to the viewer side (viewing side: above the drawing). Instead of using the pixel electrode 29 as a reflective layer, it is of course possible to provide a reflective layer on the inner surface of the element substrate 21 separately from the pixel electrode 29.

Next, the structure of the lighting device 30 provided in the liquid crystal display device 10 will be described. As shown in FIG. 2, the lighting device 30 is roughly configured by a pair of transparent substrates 301 and 302 made of glass, transparent resin, or the like, and a light emitting section 300 sandwiched between the substrates 301 and 302.
A sealant (filler) made of epoxy resin or the like is inserted between the substrates 301 and 302. Of the pair of substrates, the substrate 302 disposed on the viewing side (upper side in the figure) of the liquid crystal display device 10 is the outer side substrate and the panel side substrate 301 disposed on the liquid crystal panel 20 side (lower side in the figure). The second substrate.

The light emitting section 300 is patterned to have a plurality of linear shapes when the panel-side substrate 301 is viewed in a plan view, and the anode 303, the light-emitting layer 311 and the cathode 310 are arranged in this order from the panel-side substrate 301 side. It is included by stacking. The line width of the patterned light emitting unit 300 is 5 to 20.
The total area of the linear anode 303 is about 5 to 20% of the total area of the illumination region.

The anode 303 is composed of a transparent electrode made of ITO (indium tin oxide), and the cathode 310 is composed of an alkaline earth metal layer 307, a reflective electrode layer 308, and a light absorption layer 309 from the light emitting layer 311 side. And are laminated in this order and included. In addition, the light emitting layer 311 includes the anode 30.
A hole injection layer 314, a hole transport layer 304, a light emitting main body layer 305, and a buffer layer 306 are laminated in this order from the third side.

The layers constituting the lighting device 30 will be described in detail below. First, the anode 303 is made of ITO as described above, and is formed as a solid film over the panel-side substrate 301, and its film thickness is about 0.1 to 0.2 μm. The anode 303 is, for example, IZO.
It is also possible to use a transparent electrode mainly composed of (indium zinc oxide).

Hole injection layer 314 constituting the light emitting layer 311
Is mainly composed of, for example, copper phthalocyanine (CuPc), and is formed as a solid film over the entire surface of the anode 303 in the drawing. The layer thickness is about 0.05 to 0.2 μm and has a function of promoting injection of holes from the anode 303. The hole transport layer 304 which also constitutes the light emitting layer 311 is mainly composed of, for example, polyethylenedioxythiophene (conductive polymer), and is formed on the entire surface of the hole injection layer 314 in the figure as a solid film. . The layer thickness is about 0.05 to 0.2 μm, and has a function of transporting holes injected from the anode 303 to the light emitting main body layer 305.

The light emitting body layer 305 which also constitutes the light emitting layer 311 is made of, for example, an electroluminescent material mainly composed of a low molecular weight EL (electroluminescence: electroluminescent substance), and its layer thickness is 0.05. It is set to about 0.2 μm. In the case of this embodiment, the light emitting body layer 305 is formed on the hole transport layer 304 with a fine linear pattern.
Specifically, the fine linear light emitting portions formed at predetermined intervals are formed in a stripe shape. In addition, small molecule EL
Examples of the material for forming rubrene, perylene,
It is possible to use those mainly containing 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like.

Similarly, the buffer layer 306 forming the light emitting layer 311 functions as a buffer layer for promoting injection of electrons from the cathode 310 to the light emitting main body layer 305, and L
It is mainly composed of iF, and its layer thickness is about 0.5 to 5 nm. The buffer layer 306 is also formed with a fine linear pattern along the light emitting main body layer 305,
The fine linear light emitting portions are formed in a stripe shape.

On the other hand, the alkaline earth metal layer 307 constituting the cathode 310 is mainly composed of Ca or Mg, and its layer thickness is about 0.2 to 40 nm (preferably about 0.2 to 10 nm). Has been done. Similarly, the reflective electrode layer 308 which also constitutes the cathode 310 is mainly composed of Al, and the layer thickness thereof is about 0.1 to 0.2 μm. The reflective electrode layer 308 is made of, for example, Al.
It is also possible to mainly configure an alloy, Ag, or an Ag alloy. Further, the light absorption layer 309 has a function of preventing reflected light from the reflective electrode 308 toward the observer side, is mainly composed of resin black, and has a layer thickness of about 0.5 to 2 μm. There is. The light absorption layer 309 can also be mainly composed of chromium.

The alkaline earth metal layer 307, the reflective electrode layer 308, and the light absorption layer 309 which compose the cathode 310 are
A fine linear pattern is formed along the light emitting main body layer 305 and the buffer layer 306, and the fine linear light emitting portions are formed in a stripe shape. Thus, the light emitting body layer 305, the buffer layer 306, the alkaline earth metal layer 3
07, the reflective electrode layer 308, and the light absorption layer 309 are formed in a fine linear pattern, so that the light emitting unit 300 is patterned in a fine linear shape. Since the lighting device 30 including the light emitting unit 300 as described above is used as the front light of the liquid crystal panel 20, the liquid crystal display device 10 is provided.
Is not likely to cause a defect such as a linear shadow being visually recognized based on the pattern shape of the light emitting portion.

Next, an embodiment of a method of manufacturing the lighting device 30 provided in the liquid crystal display device 10 will be described.
The drawings shown in FIGS. 3 to 10 are schematic views of each layer and each member in the manufacturing process, and each layer and each member have a size that can be recognized in the drawings. The scales are different.

First, as shown in FIG. 3, a predetermined concavo-convex pattern is formed on a substrate 302 (which is a substrate for an outer surface side substrate) such as glass or metal. Specifically, a fine pattern that is linear in plan view is formed on the surface of the substrate 302 having a flat surface by a photolithography method, a machining method, or the like (substrate pattern forming step). That is, FIG.
As also shown in a perspective view of, for example, a plane is linear, and a fine pattern having a concave-convex cross section in a direction intersecting the linear direction is formed on the substrate, and more specifically,
The height d of the convex portion 313 having an uneven cross section formed on the surface of the substrate 302 is set to 1 μm to 100 μm (for example, 10 μm),
The upper surface width W1 of the convex portion 110 is 1 μm to 50 μm (for example, 5 μm), and the width W2 of the concave bottom surface is 5 μm to 500 μm.
(For example, 50 μm).

The substrate 30 is formed by the photolithography method.
When forming a pattern on the substrate 2, a resist having a flat surface is first coated with a resist, and a pattern having a fine line width is formed by a process of mask exposure, development, etching, and resist removal. You can It should be noted that the etching and resist removing steps may be either wet or dry.

Next, as shown in FIGS. 5 and 6, with respect to the substrate 302 which is formed in a pattern having a concavo-convex shape in cross section in a plan view, the concavo-convex surface has constituent materials of a light absorption layer, a cathode and a light emitting layer. A part is formed by vapor deposition (first substrate film forming step). In this case, vapor deposition is performed in the longitudinal direction of the linear convex portion and θ2 = 70 ° to 11 °.
0 ° (about 90 ° in this embodiment) intersecting direction,
Θ1 = 5 ° to 80 ° with respect to the substrate surface (11 in this embodiment)
°) It is performed from an inclined direction. Therefore, the substrate 302
In the concave portion, a portion 211 which becomes the shadow of the convex portion 313 against the vapor deposition is formed, and in this embodiment, the portion 21 which becomes the shadow thereof.
The area of the concave bottom of 1 is 20 times the area of the entire concave bottom.
The vapor deposition direction is determined so as to be at least%.

The substrate 302 having such a convex portion 313.
As a result of the oblique vapor deposition, the shadowed portion of the concave bottom surface becomes a non-vapor deposition portion, while the concave bottom surface and / or the side surface of the convex portion 313 facing the vapor deposition source has a trace of vapor deposition partially. These vapor deposition traces do not reduce the luminous efficiency of the illuminating device, nor are their shadows visible. Further, these traces cannot be avoided by the manufacturing method of the present invention, and so to speak, the traces can be said to be a characteristic configuration of the lighting device manufactured by the manufacturing method of the present invention. In addition, in the present embodiment, the vapor deposition is performed from the one direction side with respect to the convex portion 313, but it is also possible to perform oblique vapor deposition from the side symmetrical with the convex portion 313, that is, from two different directions. Is.

Under the above vapor deposition conditions, as shown in FIG. 7, the light absorption layer 30 is formed on the convex portions 313 of the linear pattern.
9, the reflective electrode layer 308, the alkaline earth metal layer 307, the buffer layer 306, and the light emitting main body layer 305 are formed. Therefore, each of the layers 305 to 309 is formed in a fine linear pattern along the convex shape of the substrate 302.

On the other hand, as shown in FIG. 8, the above-mentioned patterned substrate 30 is added to the substrate 301 for the panel side substrate.
2. Elements other than the constituent elements of the light emitting portion vapor-deposited with respect to 2, that is, the anode 303, the hole injection layer 314, and the hole transport layer 304.
To form a solid film over the entire surface. For example, the anode 303 can be formed by depositing a material mainly composed of ITO by vapor deposition, sputtering, ion plating or the like, and the hole injection layer 314 can be formed by spinning a material mainly composed of copper phthalocyanine (CuPc). The film can be formed by coating or coating. The hole transport layer 304 can be formed by coating a material (conductive polymer) mainly composed of polyethylenedioxythiophene (PEDT) by spin coating, printing, or the like.

Next, the substrate 301 and the substrate 302 on which these layers are formed are bonded together as shown in FIG. 9, and each component is sealed between the substrates 302 and 301 (bonding step). In this case, as shown in FIG. 10, a sealant (filler) 312 such as an epoxy resin is applied to the substrates 302, 301.
It is supposed that the bonding is performed with the interposition between them.

Through the above steps, the illuminating device 30 having the light emitting portion 300 having the miniaturized pattern shown in FIG.
Can be manufactured. In this embodiment, first, unevenness of a fine pattern is formed on the substrate 302 by photolithography or machining, and various components are obliquely vapor-deposited from the predetermined angle on the substrate 302 having the uneven shape. Thus, the light emitting unit 30 according to the pattern
It is possible to form 0, that is, it is possible to manufacture the illuminating device including the minute light emitting portion 300 by an extremely simple method.

In this embodiment, the light absorption layer 309, the reflection electrode 308, the alkaline earth metal layer 307, the buffer layer 3 are used.
06, the light emitting body layer 305, the substrate 30 having an uneven shape
2 was vapor-deposited, but at least a member having a light-shielding property (light absorbing layer 309, reflective electrode 308, alkaline earth metal layer 30
If 7) is deposited on the substrate 302, a light emitting portion having a fine light emitting pattern can be formed. In that case, for example, the buffer layer 306 and the light-emitting main body layer 305 may be formed on the entire surface of the substrate 301 in a solid state. Specifically, the buffer layer 306 is made of a material mainly composed of LiF by vapor deposition, sputtering, or ion implantation. The light emitting main body layer 305 can be formed on the entire surface by plating or the like, and the low molecular weight EL can be formed on the entire surface by vapor deposition.

Furthermore, the manufacturing method as described above can be applied to a lighting device using polymer EL as the light emitting main body layer 305. As shown in FIG. 11, when the polymer EL is used, for example, the hole injection layer 31 is higher than that of the low molecular EL.
4. The buffer layer 306 can be omitted, and the same components as the low-molecular EL can be adopted as the other components of the light emitting unit.

In this case, the polymer EL is mainly composed of, for example, a fluorene polymer derivative, a polyparaphenylene vinylene derivative, a polyphenylene derivative, a polyfluorene derivative, polyvinylcarbazole, a polythiophene derivative, etc. In many cases, it is difficult to form a film, and it is preferable to form the entire surface of the substrate 301 without forming the light emitting main body layer 305 by vapor deposition on the uneven substrate 302. Therefore, in the case of using the polymer EL, the cathode 31 can be applied to the substrate 302 having irregularities.
0 (light absorption layer 309, reflective electrode 308, alkaline earth metal 307) is formed by oblique vapor deposition, while the anode 303 and the light emitting layer 311 (hole transport layer 304, The light emitting body layer 305) is formed in a solid film over the entire surface, and these substrates are attached as shown in FIGS.

In the case where an electrode conducting portion is formed in order to secure conduction to the outside of the cathode 310, a portion where the electrode conducting portion is formed after the cathode 310 is obliquely vapor-deposited on the substrate 302. Other than masking, vapor deposition (non-orthogonal vapor deposition), and then forming each layer in sequence,
The electrode conduction part can be formed. Also, the anode 303
The conductive portion of the substrate 3 is also formed on the substrate 301, and these substrate 3
01 and 302 are eccentric to each other, that is, the conductive parts are not sealed between the substrates 301 and 302.
If they are attached while being shifted from each other, it is possible to ensure electrical continuity between the lighting device and the outside.

In the manufacturing method described above, the example in which the lighting device of the present invention is applied to the liquid crystal display device has been described, but the lighting device of the present invention is not limited to the lighting device for the liquid crystal display device. is there. That is, for example, as an illuminating device for illuminating an exhibit such as a framed photograph or painting, the illuminating device of the present invention can be applied alone to illuminate other members or places. Further, although the example of the lighting device using the organic EL material as the light emitting portion has been shown in the above-mentioned embodiment, the manufacturing method of the present invention can be applied to a device using an inorganic EL or the like as the light emitting portion.

[0058]

As described above, according to the method for manufacturing an illuminating device of the present invention, it is possible to form, for example, a light emitting portion having a fine linear pattern corresponding to the concave-convex pattern of the substrate. It is possible to provide a lighting device including a light emitting unit having a linear pattern.

Further, in the manufacturing method of the present invention, the light emitting portion can be miniaturized only by patterning the substrate and obliquely forming each light emitting portion constituent element on the substrate. Compared to the case of patterning the constituent elements, it is possible to realize further miniaturization of the light emitting section very easily, and it is not necessary to individually finely pattern the constituent elements of the light emitting section by photolithography or the like. Various materials can be applied as the constituent elements of the light emitting unit. Therefore, it is possible to reduce the cost and improve the yield of the lighting device applied to the front light and the like.

[Brief description of drawings]

FIG. 1 is an exploded perspective view schematically showing an example of a liquid crystal display device provided with a lighting device manufactured by a manufacturing method of the present invention.

2 is a schematic partial cross-sectional view of the liquid crystal display device of FIG.

FIG. 3 is an explanatory view showing a step of forming a concavo-convex shape on a substrate in the manufacturing process of the lighting device of FIG.

FIG. 4 is a perspective view schematically showing an example of a substrate manufactured in the process of FIG.

5 is an explanatory diagram showing an example of an oblique vapor deposition process in the manufacturing process of the lighting device of FIG. 1. FIG.

6 is an explanatory view showing an example of an oblique vapor deposition process in the manufacturing process of the lighting device of FIG.

7 is an explanatory view showing an example in which each component is patterned and laminated on a substrate in the manufacturing process of the lighting device of FIG.

8 is an explanatory view showing an example in which each component is entirely formed on a substrate in a manufacturing process of the lighting device of FIG.

9 is an explanatory view showing an example of a laminating step in the manufacturing process of the lighting device of FIG.

FIG. 10 is an explanatory diagram showing an example of a laminating step following FIG. 9.

FIG. 11 is a partial cross-sectional schematic view showing an example of a liquid crystal display device including an illuminating device in which a light emitting main body layer is made of polymer EL.

[Explanation of symbols]

10 Liquid crystal display device 20 LCD panel 30 lighting equipment 300 light emitting part 301 panel side substrate (second substrate) 302 Outer side substrate (first substrate) 303 Anode 304 Hole transport layer 305 Light-emitting body layer 306 buffer layer 307 Alkaline earth metal layer 308 reflective electrode layer 309 Light absorbing layer 310 cathode 311 light emitting layer 312 Sealant (filler) 313 convex

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05B 33/22 H05B 33/22 Z

Claims (14)

[Claims] 1. A method of manufacturing a lighting device comprising a light emitting portion between a pair of substrates, wherein at least a light blocking member is provided on a first substrate having an uneven surface, and at least a part of constituent elements of the light emitting portion. A first substrate-side film forming step of forming a film from an oblique direction with respect to the substrate surface; and bonding the first substrate and a second substrate different from the first substrate to each other to form a component of the light emitting unit. A laminating step of sandwiching between the substrates, and the film formation in the film forming step on the first substrate side is performed by forming the concave bottom portion of the first substrate such that an area shaded by a convex portion of the first substrate has the concave shape. From the angle of 20% or more of the bottom area,
A method for manufacturing a lighting device, which is performed on a substrate. 2. The illuminating device according to claim 1, wherein the uneven shape of the first substrate is a linear pattern in a plan view and an uneven pattern is formed in a cross section in a direction intersecting the linear direction. Manufacturing method. 3. A method of manufacturing a lighting device comprising a light emitting portion between a pair of substrates, wherein at least a light blocking member is provided on a first substrate having an uneven surface, and at least a part of constituent elements of the light emitting portion. A first substrate-side film forming step of forming a film from an oblique direction with respect to the substrate surface; and bonding the first substrate and a second substrate different from the first substrate to each other to form a component of the light emitting unit. Laminating step of sandwiching between these substrates, the uneven shape of the first substrate is a line pattern in a plan view, and a cross section in a direction intersecting the linear direction is an uneven pattern,
The film formation in the first substrate-side film formation step is a direction intersecting with the longitudinal direction of the linear protrusions in the range of 70 ° to 110 °, and 5 ° to the substrate surface of the first substrate. A method for manufacturing a lighting device, which is performed from a direction of 80 °. 4. A second substrate-side film forming step of forming a film on a portion of the constituent elements of the light emitting unit on the first substrate, and forming a remaining part of the constituent on the second substrate. The manufacturing method of the illuminating device according to any one of claims 1 to 3, further comprising: 5. The illumination according to any one of claims 1 to 4, wherein the height of the convex portion of the uneven surface formed on the surface of the first substrate is 1 μm to 100 μm. Device manufacturing method. 6. The illuminating device according to claim 1, wherein a bottom width of a concave portion having an uneven cross section formed on the surface of the first substrate is 5 μm to 500 μm. Manufacturing method. 7. The illumination according to claim 1, wherein an upper surface width of a convex portion having an uneven cross section formed on the surface of the first substrate is 1 μm to 50 μm. Device manufacturing method. 8. The method for manufacturing a lighting device according to claim 1, wherein at least a cathode, a light emitting body layer, and an anode are included as constituent elements of the light emitting section. 9. The cathode is mainly composed of Al,
9. The method of manufacturing an illumination device according to claim 8, wherein in the film forming step on the first substrate side, the cathode is formed on at least the first substrate. 10. The cathode comprises an Al layer and an alkaline earth metal layer, and the cathode is formed on at least the first substrate in the film forming step on the first substrate side. The method for manufacturing a lighting device according to claim 8. 11. A low-molecular-weight EL is used as the light emitting main body layer, a buffer layer is interposed between the light emitting main body layer and the cathode, and holes are added from the anode side between the light emitting main body layer and the anode. The method for manufacturing a lighting device according to claim 8, further comprising an injection layer and / or a hole transport layer. 12. The light-shielding member is composed of a light-absorbing member or a light-reflecting member that blocks light emitted from the light-emitting body layer in the lighting device. The manufacturing method of the illuminating device as described in any one of 1 above. 13. The second substrate is at least the first substrate.
13. The method for manufacturing a lighting device according to claim 4, wherein a surface to be bonded to the substrate is a flat surface. 14. A step of filling a gap between a concave bottom portion of the first substrate and the second substrate with a filler after the first substrate and the second substrate are attached in the attaching step. The manufacturing method of the illuminating device of any one of Claim 1 thru | or 13 characterized by including.