JP2003315974A5 - - Google Patents

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Publication number
JP2003315974A5
JP2003315974A5 JP2002117102A JP2002117102A JP2003315974A5 JP 2003315974 A5 JP2003315974 A5 JP 2003315974A5 JP 2002117102 A JP2002117102 A JP 2002117102A JP 2002117102 A JP2002117102 A JP 2002117102A JP 2003315974 A5 JP2003315974 A5 JP 2003315974A5
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JP
Japan
Prior art keywords
exposure
pattern
mask
phase shifter
line width
Prior art date
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Pending
Application number
JP2002117102A
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Japanese (ja)
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JP2003315974A (en
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Publication date
Application filed filed Critical
Priority to JP2002117102A priority Critical patent/JP2003315974A/en
Priority claimed from JP2002117102A external-priority patent/JP2003315974A/en
Publication of JP2003315974A publication Critical patent/JP2003315974A/en
Publication of JP2003315974A5 publication Critical patent/JP2003315974A5/ja
Pending legal-status Critical Current

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Claims (8)

マスクパターンの線幅方向両側を透過する光の位相をシフトさせる位相シフタを備えた露光マスクの作製方法であって、
設計パターンの中から、線幅精度が要求されるパターンと、高解像度でのパターン露光が要求されるパターンとを抽出する工程と、
前記抽出されたパターンに対応するマスクパターンに対して位相シフタを発生させる工程とを行う
ことを特徴とする露光マスクの作製方法。
A method for producing an exposure mask comprising a phase shifter that shifts the phase of light transmitted through both sides of the line width direction of the mask pattern,
Extracting a pattern that requires line width accuracy and a pattern that requires high-resolution pattern exposure from the design pattern; and
And a step of generating a phase shifter for the mask pattern corresponding to the extracted pattern. An exposure mask manufacturing method comprising:
請求項1記載の露光マスクの作製方法において、
前記線幅精度が要求されるパターンは、ゲート電極パターンである
ことを特徴とする露光マスクの作製方法。
In the manufacturing method of the exposure mask of Claim 1,
The pattern requiring the line width accuracy is a gate electrode pattern. An exposure mask manufacturing method, wherein:
請求項1記載の露光マスクの作製方法において、
前記パターンを抽出した後、
前記抽出されたパターンに対応するマスクパターンに対して位相シフタを発生させると共に、当該位相シフタが位相矛盾なく配置されるまで前記マスクパターンを複数枚の露光マスクに分割する
ことを特徴とする露光マスクの作製方法。
In the manufacturing method of the exposure mask of Claim 1,
After extracting the pattern,
An exposure mask characterized by generating a phase shifter for a mask pattern corresponding to the extracted pattern and dividing the mask pattern into a plurality of exposure masks until the phase shifter is arranged without phase contradiction Manufacturing method.
マスクパターンの線幅方向両側を透過する光の位相をシフトさせることで高解像度のパターン露光を行う露光方法であって、
設計パターンの中から線幅精度が要求されるパターンと高解像度でのパターン露光が要求されるパターンとを抽出し、抽出されたパターンに対応するマスクパターンに対して位相シフタを発生させてなる露光マスクを作製し、
前記露光マスクを用いた露光を行う
ことを特徴とする露光方法。
An exposure method for performing high-resolution pattern exposure by shifting the phase of light transmitted through both sides of the mask pattern in the line width direction,
An exposure that extracts a pattern that requires line width accuracy and a pattern that requires high-resolution pattern exposure from the design pattern, and generates a phase shifter for the mask pattern corresponding to the extracted pattern. Make a mask,
Exposure using the said exposure mask. The exposure method characterized by the above-mentioned.
請求項4記載の露光方法において、
前記設計パターンのうち前記抽出後に残されたパターンに対応するマスクパターンが形成された通常の露光マスクを作製し、
前記通常の露光マスクを用いて前記露光に重ね合わせた露光を行う
ことを特徴とする露光方法。
The exposure method according to claim 4, wherein
Producing a normal exposure mask in which a mask pattern corresponding to the pattern left after the extraction of the design pattern is formed,
An exposure method characterized by performing exposure superimposed on the exposure using the normal exposure mask.
請求項4記載の露光方法において、
前記抽出されたパターンに対応するマスクパターンに対して位相シフタを発生させると共に、当該位相シフタが位相矛盾なく配置されるまで前記マスクパターンを複数枚の露光マスクに分割し、
分割された複数のマスクを用いた重ね合わせ露光を行う
ことを特徴とする露光方法。
The exposure method according to claim 4, wherein
A phase shifter is generated for the mask pattern corresponding to the extracted pattern, and the mask pattern is divided into a plurality of exposure masks until the phase shifter is arranged without phase contradiction,
An exposure method comprising performing overlay exposure using a plurality of divided masks.
請求項6記載の露光方法において、
前記設計パターンのうち前記抽出後に残されたパターンに対応するマスクパターンが形成された通常の露光マスクを作製し、
前記通常の露光マスクを用いて前記重ね合わせ露光に対して、さらに重ね合わせた露光を行う
ことを特徴とする露光方法。
The exposure method according to claim 6, wherein
Producing a normal exposure mask in which a mask pattern corresponding to the pattern left after the extraction of the design pattern is formed,
An exposure method comprising performing further superimposed exposure on the overlay exposure using the normal exposure mask.
マスクパターンの線幅方向両側を透過する光の位相をシフトさせることで高解像度のパターン露光を行う工程を有する半導体装置の製造方法であって、A method of manufacturing a semiconductor device including a step of performing high-resolution pattern exposure by shifting the phase of light transmitted through both sides of a line width direction of a mask pattern,
設計パターンの中から線幅精度が要求されるパターンと高解像度でのパターン露光が要求されるパターンとを抽出し、抽出されたパターンに対応するマスクパターンに対して位相シフタを発生させてなる露光マスクを作製し、  An exposure that extracts a pattern that requires line width accuracy and a pattern that requires high-resolution pattern exposure from the design pattern, and generates a phase shifter for the mask pattern corresponding to the extracted pattern. Make a mask,
前記露光マスクを用いた露光を行う  Perform exposure using the exposure mask
ことを特徴とする半導体装置の製造方法。  A method for manufacturing a semiconductor device.
JP2002117102A 2002-04-19 2002-04-19 Method of manufacturing exposure mask and exposure method Pending JP2003315974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002117102A JP2003315974A (en) 2002-04-19 2002-04-19 Method of manufacturing exposure mask and exposure method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002117102A JP2003315974A (en) 2002-04-19 2002-04-19 Method of manufacturing exposure mask and exposure method

Publications (2)

Publication Number Publication Date
JP2003315974A JP2003315974A (en) 2003-11-06
JP2003315974A5 true JP2003315974A5 (en) 2005-09-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002117102A Pending JP2003315974A (en) 2002-04-19 2002-04-19 Method of manufacturing exposure mask and exposure method

Country Status (1)

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JP (1) JP2003315974A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7435533B2 (en) 2004-06-14 2008-10-14 Photronics, Inc. Method of forming a semiconductor layer using a photomask reticle having multiple versions of the same mask pattern with different biases
US7396617B2 (en) 2004-06-14 2008-07-08 Photronics, Inc. Photomask reticle having multiple versions of the same mask pattern with different biases
US9005848B2 (en) 2008-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same
US9005849B2 (en) 2009-06-17 2015-04-14 Photronics, Inc. Photomask having a reduced field size and method of using the same

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