JP2003308505A - Ic card and manufacturing method of ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card having high durability against an ATM insertion-extraction test, and to provide its manufacturing method. <P>SOLUTION: In an IC card composed by mounting, to a card substrate 1, an IC module with a mold resin part having a projecting curved surface with respect to a module substrate 11, this IC card is characterized by that the curved surface of a cross section passing almost the center of a recessed hole 20 formed in the card substrate for mounting the IC module is formed into a shape approximate to the curved surface of the mold resin of the IC module. This manufacturing method of the IC card is characterized by that the recessed part for mounting the IC module is formed into a stepped cone-like shape by cutting it with a thin end mill having a cutting width of 2.0 mm or less so as to be formed into the shape approximate to the curved surface of the mold resin of the IC module, and thereafter the IC module substrate is fitted and fixed to the recessed hole. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an IC card and an I card.
The present invention relates to a method of manufacturing a C card. Specifically, a non-contact type IC that uses a contact type IC card or an IC module with a substrate.
TECHNICAL FIELD The present invention relates to a technique for improving the durability of an IC card by minimizing a gap between an IC module mounting recess and an IC module fitted to the IC module mounting recess. Therefore, the field of use of the present invention relates to the field of manufacture and use of IC cards.

[0002]

2. Description of the Related Art Conventionally, various improvements have been made to improve the durability of an IC card in the manufacturing process of the IC card. That is, while the IC card is in use, the IC module may fall off the card base or the ATM (Automatic
In order to prevent the IC card from being damaged by the insertion and removal of the IC teller machine), various researches and improvements have been made on the IC module mounting method.

5 and 6 are views showing a conventional example of a mounting method of an IC module. In recent years, as a mounting method generally adopted, as shown in the cross section of the IC module mounting portion of FIG. 5, a recessed hole 20 having two step depths is formed in the card base body and shallowly cut (counterbored). In the first concave portion 21, I
The mold resin portion 1 of the IC module 10 is received in the second recess 22 that is formed by receiving the substrate 11 of the C module 10 and cutting it deeper.
2 are fitted together. This is done in order to increase the number of pieces machined per hour of the equipment, in order to cut at high speed in a short time with an end mill with the largest diameter,
This is because it is not necessary to match the cross-sectional shape of the second recess, considering only that the mold resin portion fits in the card. Between the substrate 11 of the IC module 10 and the surface of the first concave portion, a heat-reactive (hot melt type) adhesive tape 8 is melted to fix the IC module in the concave hole 20. Note that the mold resin portion is illustrated as a hemispherical shape for ease of illustration, but is actually a thin plate shape.

Such a mounting method is the same for a non-contact IC card (using an IC module having a terminal board) or a contact-type non-contact type common IC card (2-way IC card). No. 207518 discloses a mounting method as shown in FIG. In the case of the non-contact type IC card, it is the same as the case of the contact type IC card except that it is necessary to connect the antenna coil connection terminal 4 in the card base and the IC module side terminal with the conductive material 9. However, in the above-mentioned publication, although the stress absorption groove 23 is provided around the first concave portion 21, the absorption hole may be adopted in the contact type IC card.

For reference, FIG. 7 shows a perspective view of a general-purpose IC module shape. The IC module manufacturing method includes (1) a transfer molding method in which the entire periphery of the IC chip on the substrate is surrounded by a mold, and a mold resin is press-fitted into the mold to be heat-cured, and (2) only the planar periphery of the IC chip is covered. There is a potting method or a printing method in which the resin is surrounded by a frame mold, a mold resin is dropped or a resin is printed by screen printing or the like, and the frame mold is removed and solidified before the resin is completely cured.

In the case of the former transfer molding method, the IC module 10 has a flat shape surrounded by a cubic resin as shown in FIG. 7A and having a constant thickness, but in the case of the latter potting method or printing method. Since the resin slightly flows when the frame mold is removed, the mold resin portion is likely to be an IC module having a flat convex curved surface with respect to the module substrate 11 as shown in FIG. 7B. IC module 10
The actual thickness of the mold resin portion 12 is 0.4 to 0.
It is formed to about 7 mm. Therefore, the IC module used in the present invention is the IC module manufactured by the latter manufacturing method (2). The IC module for an IC card is often manufactured as a COT (Chip On Tape) together with the front surface side terminal surface.

[0007]

The above-mentioned method of mounting the IC module has markedly higher durability than the initial development of the IC card. The required quality is required to be higher and higher. One of the problems with conventional products is that when handling an IC card with an ATM, in a repeated test (ATM insertion / extraction test) of passing through a transport roller, the thin portion on the lower surface of the IC module mounting recess hole is found in several hundred tests. There is a problem that breakage or crack 15 (FIGS. 5 and 6) occurs.

This breakage or crack is caused by a slight gap between the bottom of the IC module and the bottom of the concave hole.
It is considered that the thin portion on the bottom surface of the card substrate is repeatedly deformed when the ATM passes between the rollers, and finally cracks or cracks are caused by a phenomenon such as metal fatigue. Therefore,
In order to solve this problem, the present invention has been completed by research into minimizing the gap between the bottom of the IC module and the bottom of the recessed hole.

[0009]

The first object of the present invention to solve the above problems is to provide an IC card in which an IC module having a mold resin portion having a convex curved surface with respect to a module substrate is mounted on a card base. The IC card is characterized in that the cross section of the portion corresponding to the portion where the mold resin portion of the concave hole formed in the card base for mounting the IC module is fitted is cut into a shape similar to the mold resin curved surface of the IC module. ,It is in.

In the first aspect of the present invention, the portion of the concave hole in which the mold resin portion is housed can be formed into a stepped serpentine shape with a cutting width of 2.0 mm or less.
A heat-reactive adhesive tape may be inserted between the mold resin surface of the module and the bottom surface of the deepest part of the recess. In addition, the IC module is a contact type, a non-contact type,
IC for IC card of either contact or non-contact type
It can also be a module.

A second aspect of the present invention is that the IC is transferred from the surface of the card substrate.
In a method of manufacturing an IC card in which a module mounting recess is cut to mount an IC module, a step having a cutting width of 2.0 mm or less is formed so that the IC module mounting recess has a shape close to the mold resin curved surface of the IC module. According to another aspect of the present invention, there is provided an IC card manufacturing method, which comprises fitting the IC module substrate into the concave hole after mounting the IC card substrate.

A third aspect of the present invention is an IC card in which an IC module is mounted by embedding an antenna coil and an antenna coil connection terminal in a card base and then cutting an IC module mounting recess from the surface of the card base. In the manufacturing method, in order to make the recess for mounting the IC module into a shape approximate to the mold resin curved surface of the IC module,
After forming a stepped platter shape with a cutting width of 2.0 mm or less,
A method of manufacturing an IC card, characterized in that the IC module substrate is fitted and mounted in the recess.

In the second and third aspects of the present invention, it is also possible to attach the heat-reactive adhesive tape to the mold resin surface of the IC module substrate and then fit and fix the IC module substrate in the recess. .

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an IC module mounting portion of an IC card of the present invention, FIG. 1 (A) is a plan view, and FIG. 1 (B) is a sectional view taken along the line AA of FIG. 1 (A). FIG. 2 is a plan view of the recessed hole before mounting the IC module, and FIG. 3 is a view showing another embodiment of the IC module mounting portion. In FIG. 1 and FIG. 3, the scale of the IC card in the thickness direction is enlarged in the lateral direction.

As shown in FIG. 1A, the IC module 10
On the surface side of the terminal board 11 of 8
Individual terminal (C1 to C8) plates are formed. The size and shape of the terminal board can be freely designed within the ISO standard, and is not limited to the illustrated one. FIG. 1B shows a cross section taken along the line AA of FIG. Although there is a first recess 21 that is shallowly cut (counterbored) as in the case of FIG. 5, the second recess 22 is stepped from the periphery of the recess 20 in a stepwise manner to reach the deepest part. Has been done. Figure 1
In the case of (B), the second concave portion has depth portions L1 and L of 6 levels.
2, L3, L4, L5, L6, and the L6 portion is the deepest part.

As shown in the plan view of FIG. 2, the inside of the second concave portion of the concave hole 20 is stepped with a constant width and has a step-like brim shape, but the present invention is not limited to this.
It may be one that continuously cuts in a spiral shape, one that has a different cutting width, or one that cuts with a surface inclined toward the deepest part. In short, it is sufficient that the second recess is not a cubic shape as in the conventional method, but is cut into a shape that is as close as possible to the mold resin curved surface of the IC module.
By doing so, the space volume formed between the mold resin bottom surface 10b and the bottom surface 22b of the second recess is reduced. Therefore, the deformation of the bottom surface member 20B received by the ATM roller can be minimized, and as a result, the bottom surface is less likely to be damaged or cracked and the durability can be improved.

FIG. 3 shows another embodiment of the IC module mounting portion. In this embodiment, the heat-reactive adhesive tape 14 is inserted between the bottom surface 10b of the mold resin and the bottom surface 22b of the second recess. Has been done. This is a so-called hot melt type adhesive tape, in which a tape piece cut into a mold resin shape of an IC module is attached to the mold resin surface, and then the IC module is mounted in the recess. When fixing the IC module, heat pressure is applied, so that the tape is melted or semi-melted to firmly fix the IC module in the recess.

Normally, when fixing the IC module, only the periphery of the module is heated, so that the heat-reactive adhesive tape on the bottom surface of the mold resin is not completely melted, and the thickness of the tape is thinner than the gap thickness. As a result, air pockets remain and the gap is not completely filled with tape material after the module is fixed, but since there are fewer voids than at least completely spaces, deformation of the bottom member is less and cushion material Since the adhesive tape functions as a role, the above effect can be obtained.

Conventionally, the heat-reactive adhesive tape has been used, but in order to prevent heat from flowing into the back surface through the adhesive tape and thermally deforming the back surface of the card in the hot-pressing step, the mold portion is allowed to escape. It was punched and then attached to the IC module. In the present invention, the same sticking method may be used, but by sticking on the entire surface without intentionally punching out the heat-reactive adhesive tape, the adhesive tape enters the contact portion between the module and the bottom surface of the concave hole, further reducing the space volume. However, the stress can be relieved, the bottom surface is less likely to be damaged or cracked, and the durability can be improved. Thermal deformation can also be avoided by leaving an air pocket between the bottom surface of the concave hole and the bottom surface 10b of the mold resin.

The IC module used in the present invention is usually an IC module for a contact type IC card, but may be either a non-contact type or a contact non-contact type. In the case of the non-contact type, reading is rarely performed between the conveying rollers like an ATM machine, but when used as a contact type card, the sheet is also passed between the conveying rollers. The same applies to the contact / non-contact type. In the case of the contact / non-contact type, the surface side terminals (C1 to C8) shown in FIG. 1 (A)
Besides, a terminal for connecting to the antenna coil is provided on the IC chip side, and the terminals are connected as shown in FIG.

Such an IC card can be manufactured in the following steps. The IC module is molded by the potting method or the printing method. This is because these modules have a convex mold resin portion curved surface. A heat-reactive adhesive tape is applied to the mold resin portion by applying heat and pressure (lamination). In order to reduce the damage to the IC module, it is desirable to use the whole surface attachment method. Next, first, the printed card base is subjected to counterboring. At this time, as described above, the IC module is cut into a shape similar to the curved surface shape of the mold resin portion. The shape is not particularly limited as long as it is an approximate shape, but since the minimum cutting width of the end mill is about 0.5 mm, it actually tends to be a stepped serration shape. The end mill may have a cutting width of about 0.5 to 3 mm depending on the program. The number of stages is actually about 3 to 4 to 10. Since the card substrate is formed to have a thickness of 0.68 to 0.84 mm as described above, if the total depth of the recess is set to about 0.65 mm, a residual thickness in the range of 30 to 190 μm remains on the bottom surface of the recess. become. Normally, a wall thickness of about 150 μm is left.

The IC module to which the adhesive tape has been attached is punched out from the COT and fitted into a card base that has been subjected to counterboring, and the adhesive tape is melted by applying heat and pressure to bond the two by thermal reaction. To mount the IC module, the heater block 5 is applied to the IC module surface as shown in FIG. 4, and the adhesive tape is melted by applying heat and pressure, and at the same time, fixed in the concave hole. Heater block 5
Has a heat source inside and is configured to be able to press only the periphery of the IC module terminal surface with a width of about 1 mm. Although the use of the adhesive tape is not essential to the present invention as described above, good results can be obtained as an embodiment. Hereinafter, detailed description will be made based on specific examples.

[0023]

(Embodiment) An embodiment of the present invention will be described with reference to FIGS. 1, 2, 3, and 4. <Preparation of IC module for IC card> Approximately 0.05 ml of epoxy resin is dropped around the IC chip of COT (glass epoxy base material, thickness 160 μm) on which the terminal board is formed and the IC chip is mounted and around the wire bonding portion. It was then resin-molded. The size of the terminal board 11 is 13.0 mm × 11.8 mm, and the mold portion is 8.0.
mm × 8.0 mm, and the height of the top of the mold portion from the substrate surface was 440 μm (see FIG. 7B).
A thermo-reactive adhesive tape (polyester resin, thickness 50 μm) is formed on the back surface of the COT (the surface opposite to the terminal substrate) so as to cover the mold portion, and a concave portion corresponding to the mold portion is formed so that pressure is not applied to the mold portion. Lamination was performed by applying heat pressure from the press plate provided. Press condition is 130 °
C, 10 kgf / cm ² , and 5 seconds. The adhesive tape is compressed by about 10 μm during lamination.

<Preparation of IC card substrate> As the core sheet of the card substrate, a surface-printed white hard vinyl chloride sheet (thickness 310 μm) and a surface-printed white hard vinyl chloride sheet (thickness 310 μm) are used in the same manner. Then, two transparent vinyl chloride sheets with a thickness of 100 μm were used on the upper and lower surfaces of the sheet, and heat fusion bonding (150 °
C, 20 kgf / cm ² , 30 minutes) card base 1
Prepared. Due to slight shrinkage after lamination, the total thickness of the card was 800 μm.

The recess 20 of the IC module mounting portion was formed by NC cutting. First, the IC module substrate 11
First, the depth corresponding to the total thickness of the adhesive tape 8 and
The recess 21 was cut. At this stage, the size of the first concave portion 21 is 13.1 mm × 11.9 mm (corner radius of curvature 2.
5 mm) and the depth was 200 μm. As described above, it is preferable to open each of the terminal boards by about 0.1 mm larger than the actual terminal board size. Subsequently, the portion (size 8 mm × 8 mm) into which the mold resin portion of the module was fitted was cut into a stepped serpentine shape having a depth of 6 steps. An end mill with a cutting width of 1.0 mm was used for cutting, and the width of each step was also set to about 1.0 mm. As a result, the size of the deepest part was 3.0 mm × 2.0 mm. The depth of the deepest part was 650 μm from the surface of the card substrate 1, and was set to be 450 μm deeper than the first recess. Similarly, the depth of each step from the surface of the card substrate 1 is 640 μm in order,
620 μm, 590 μm, 540 μm and 480 μm.

Therefore, the lower surface of the concave hole 20 has a thickness of 1
The bottom member 20B of 50 μm remains (see FIG. 1).
(See (B)). The depth of the concave hole 20 is 650 μm, and the total thickness of the module including the substrate is 600 μm. However, when the adhesive tape (thickness 50 μm) 14 is attached to the mold resin surface, the clearance ( Space) will not occur. However, there is room for clearance of about 10 μm due to the compression of the adhesive tape.

After the polyester resin adhesive tape 8 having a thickness of 50 μm is temporarily placed on the surface of the first recess 21, the previously prepared IC module 10 is removed from the COT and fitted into the recess, and heated by the heater block 5. Pressure (160 °
C, 5 seconds), and the IC module 10 was mounted.

(Comparative Example 1) A COT with an IC module and a card substrate were prepared under the same conditions as in Example, but the recessed holes were formed as follows. The first recess 21 has the same size as the embodiment, and the size is 13.1 mm × 11.9 mm.
(Corner radius of curvature is 2.5 mm) and depth is 200 μm. The size of the second recess 22 was 8.0 mm × 8.0 mm, the depth was 450 μm deeper than that of the first recess, and the stepwise cutting was not performed. The IC previously prepared in this recess
An IC card was manufactured by mounting the module under the same conditions as in the example.

(Comparative Example 2) A thermo-reactive adhesive tape (polyester resin, thickness 50 μm) on the lower surface of the mold part.
So that the adhesive tape is not applied to the center of the mold part.
An IC card was manufactured under the same conditions as in Comparative Example 1 except that the center part of the mold was punched into a rectangle of 8.0 × 8.0 mm and laminated on COT.

An ATM insertion / removal test was performed on 10 points of each of the samples of this example, Comparative example 1 and Comparative example 2 (
Repeated tests of inserting and removing the card) revealed that the samples of Comparative Examples 1 and 2 had cracks, cracks or damages on the lower surface of the concave hole of the card base after an average of about 500 times. No cracks, cracks, or damages were observed after 1,250 or more tests. Table 1 shows the test results. In the table, the denominator is the number of samples, and the numerator is the number of each insertion / removal, which means the cumulative number of backside cracks, cracks, and damages.

[0031]

[Table 1]

The ATM device used for the test is a test device manufactured to analyze the roller arrangement, the roller shape and the pressure of a plurality of general bank ATM machines and reproduce the conditions similar thereto. , Its basic structure is ISO1037
3-3: 2001 (E) Annex A.

[0033]

As described above, in the IC card of the present invention, the base body on the lower surface of the module is not easily damaged by the insertion and removal of the ATM device and has high durability. Furthermore, when the entire surface of the heat-reactive adhesive tape is attached to the back surface of the IC module together, the space on the bottom surface of the IC module is reduced and the COT is reduced.
It is also effective in alleviating damage to the module due to contact between the card base and the card.

[Brief description of drawings]

FIG. 1 is a diagram showing an IC module mounting portion of an IC card of the present invention.

FIG. 2 shows a plan view of a concave hole before mounting an IC module.

FIG. 3 is a diagram showing another embodiment of an IC module mounting portion.

FIG. 4 is a diagram showing a state where an IC module is fixed by a heater block.

FIG. 5 is a diagram showing an example of a conventional IC module mounting method.

FIG. 6 is a diagram showing another example of a conventional IC module mounting method.

FIG. 7 is a perspective view showing the shape of a general-purpose IC module.

[Explanation of symbols]

1 card base 4 Antenna coil connection terminal 5 heater block 8 adhesive tape 9 Conductive material 10 IC module 10b Mold resin bottom surface 11 Module board 12 Mold resin part 14 Thermoreactive adhesive tape 15 cracks 20 recess 20B Bottom member 21 first recess 22 Second recess 22b Bottom of second recess 23 Stress absorption groove

Claims (7)

[Claims] 1. An IC card in which an IC module having a convex curved surface with respect to a module substrate is mounted on a card base, wherein the molded resin part has a recessed hole formed in the card base for mounting the IC module. An IC card characterized in that a cross section of a portion corresponding to a portion where is accommodated is cut into a shape similar to the mold resin curved surface of the IC module. 2. The IC card according to claim 1, wherein a portion of the recessed hole in which the mold resin portion is housed has a stepped serpentine shape having a cutting width of 2.0 mm or less. 3. The IC card according to claim 1, wherein a heat-reactive adhesive tape is inserted between the mold resin surface of the IC module and the bottom surface of the deepest part of the concave hole. 4. The IC card according to claim 1, wherein the IC module is an IC module for an IC card used for any of a contact type, a non-contact type, and a contact / non-contact type. 5. In a method of manufacturing an IC card in which an IC module mounting recess is cut from the surface of a card base to mount an IC module, the IC module mounting recess has a shape close to a mold resin curved surface of the IC module. In the method for manufacturing an IC card, the IC module substrate is fitted into and fixed to the recessed hole after the stepped skirt shape having a cutting width of 2.0 mm or less is formed. 6. A method of manufacturing an IC card, comprising mounting an IC module by embedding an antenna coil and an antenna coil connection terminal in a card base, and then cutting an IC module mounting recess from the surface of the card base. A cutting width of 2.0 mm in order to make the module mounting recess approximate to the mold resin curved surface of the IC module.
A method for manufacturing an IC card, which comprises fitting an IC module substrate into a recessed hole and fixing the IC module substrate after forming the stepped stave shape. 7. The IC module substrate is fitted with a thermo-reactive adhesive tape on the mold resin surface of the IC module substrate and then fixed by fitting the IC module substrate into the recess.
Alternatively, the method of manufacturing an IC card according to claim 6.