JP2003303879A - Semiconductor substrate storage container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity by securely suppressing the extremely small amount of contamination on a semiconductor substrate due to an ambient atmosphere, gas from a container, etc., during storage and transportation. <P>SOLUTION: A semiconductor substrate storage container 5 is constituted including a body 51 which is equipped with a means for holding the semiconductor substrate and made of metal, a lid 52 which is mounted on the body and made of metal, and metal fittings 53 which can attach and detach the body and lid by a specified lid clamping force; and a recessed groove 511b which is rectangularly sectioned is formed in an area along the side wall of the opening surface of the body, and a pillow-shaped projection 521b is formed in an area of the lid corresponding to the recessed groove, the height of the pillow- shaped projection exceeding the depth of the recessed groove. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a container for a semiconductor substrate such as a semiconductor wafer which is susceptible to chemical influences, and more particularly to a semiconductor caused by the ambient atmosphere during storage or transportation or outgassing from the container. The present invention relates to a container for a semiconductor substrate, which reliably suppresses a trace amount of contamination as a substrate to improve productivity.

Generally, in the manufacturing process of a semiconductor substrate, a semiconductor substrate in a clean room is made of, for example, polypropylene (P
P), Teflon (registered trademark) (PTFE), polycarbonate, etc. are often stored and transported in a storage container made of a resin, but in this case, the semiconductor substrate becomes extremely polar due to the ambient atmosphere or degassing from the storage container. There is a strong demand for the realization of a storage container that can reliably shut off the ambient atmosphere and at the same time suppress degassing from the container during use, since it may be contaminated in a small amount and eventually reduce productivity. Is starting to appear.

In the present invention, the target semiconductor substrate is
A case where the wafer is a semiconductor wafer before being divided into semiconductor chips will be described as an example.

[0004]

2. Description of the Related Art FIG. 12 is a diagram for explaining a semiconductor substrate which is a target of the present invention, FIG. 13 is a schematic diagram for illustrating the configuration of a conventional semiconductor substrate storage container, and FIG. 14 is a carrier as a middle box in FIG. FIG. 15 is a diagram for explaining the main body as an outer box in FIG. 13, FIG. 16 is a diagram for explaining the lid in FIG. 13, and FIG. 17 is a process for assembling the semiconductor wafer storage container in FIG. It is a figure.

In FIG. 12, the semiconductor wafer 1 has a predetermined thickness t.
It has a disk shape with a diameter of 6 inches, for example.
An orientation flat 1a is formed at each point. 13A and 13B for explaining a conventional semiconductor substrate storage container (hereinafter, simply referred to as a storage container), FIG. 13A is an overall perspective view, and FIG.

In the figure, a storage container 2 comprises a carrier 21 made of polyester resin and a main body 2 made of polypropylene resin.
2, a gasket 23 as a packing made of polyester elastomer resin attached to the main body, a lid 24 made of a polycarbonate resin attached to the upper surface of the main body, and a plurality of (positioning and fixing the main body 22 and the lid 24 ( It is composed of four hooks 25 in the figure).

Here, each of the above components will be described first. 14A and 14B for explaining the carrier, FIG. 14A is an overall perspective view, FIG. 14B is a plan view, FIG.
FIG. 3B is a side view in which (b) is partially cross-sectionally viewed. In the figure, a carrier 21 having a size capable of positioning a plurality of the above-mentioned semiconductor wafers 1 in parallel in an upright state has a tubular shape with a rectangular shape in plan view and a predetermined length "h ₁ ", and has an opening surface on one side. 21
A flange 21 protruding outward with a thickness "t ₁ " around a
b.

On the inner wall surface 21c 'of each of the opposing side walls 21c, there is provided a groove 21d for positioning the semiconductor wafer 1 in an upright state in parallel with each other by inserting the diameter portion of the semiconductor wafer 1 into a guide. Opening surface 21
a to a predetermined length, and the above-mentioned wafer is formed into the groove 21d.
When it is inserted into the wafer, a part of the wafer 1 is projected from the opening surface 21a by a predetermined value "s ₁ " as shown by a broken line A in FIG. 14C regardless of the position of the orientation flat 1a. ing.

On the other hand, in FIG. 15 for explaining the main body, (a)
Is an overall perspective view, (b) is a plan view, (c) is a partially cut front view, and (d) is a partially cut side view.
In the figure, a bottomed box-shaped main body 22 having a size capable of accommodating the carrier 21 by inserting it from the non-flange forming surface side thereof.
Are those provided with a flange 22b protruding outward thick predetermined thickness "t _2" of the flange 21b in the carrier 21 in the periphery of the opening surface 22a.

A recess 22c having a size corresponding to the flange 21b of the carrier 21 is provided on the upper surface side of the flange 22b. When the carrier 21 is inserted from the non-flange forming surface side, the carrier 21 is formed. By fitting the flange 21b of the carrier 21 into the recess 22c, the carrier 21 is positioned in the main body 22.

Further, in the area of the flange 22b, a groove 22d for inserting a gasket, which will be described later, is formed in a square shape in plan view in the area along the periphery of the upper surface of the flange 22b, and the lower surface of the lower surface of the flange 22b. A concave step surface 22e having a predetermined width "w ₁ " and directed inward from the periphery of the flange is formed at a plurality of locations (two locations in the vicinity of each of the opposing side walls in the figure, a total of four locations) for attaching hooks to be described later. There is.

On the other hand, the gasket 23 has a ring shape having a thickness which can be mounted on the main body 22 by being inserted into the concave groove 22d provided in the main body 22 and a width which is more than twice the depth of the concave groove 22d. The end face in the width direction of the concave groove 22d projects from the opening surface 22a when the concave groove 22d is mounted. 16A and 16B for further explaining the lid, FIG. 16A is an overall perspective view, FIG. 16B is a side sectional view, and FIG.

In the figure, the lid 24 attached to the opening surface 22a of the main body 22 is an opening substantially corresponding to the opening of the main body 22, and the amount of protrusion "s ₂ " slightly exceeding the protrusion amount "s ₁ " explained for the carrier 21. It has a bottomed box shape having a depth of "", and the flange 22b of the main body 22 is provided around the opening surface 24a.
Is provided with a flange 24b having a size corresponding to the above and protruding outward.

On the side of the opening surface 24a of the flange 24b, a concave groove 24 equal to the concave groove 22d in the main body 22 is formed.
c is formed at a position corresponding to the concave groove 22d, and a concave step surface 24d equal to the concave step surface 22e of the main body 22 is formed on the rear surface (upper surface in the drawing) of the flange 24b. Are provided at respective positions corresponding to.

Therefore, by placing the lid 24 on the main body 22 so that the opening surface 24a of the lid 24 and the opening surface 22a of the main body 22 coincide with each other, the respective concave grooves 22d and 24c are formed.
At the same time as they are made to face each other,
24d can also be positioned correspondingly. On the other hand, the above-mentioned hook 25 is formed by bending an elastic plate material having a width capable of entering the stepped surfaces 24d and 22e of the concave portion of the lid 24 and the main body 22 into a U-shape. The lid 25 can be positioned and fixed to the main body 22 by pushing in the hook 25 so as to sandwich the concave step surfaces 22e and 24d corresponding to when the lid 24 is placed on the surface 22a.

Therefore, as shown in FIG. 17, first, the gasket 23 is inserted into the concave groove 22d of the main body 22 as shown by the arrow, and then the carrier 21 is inserted into the main body 22 from the non-flange forming surface side as shown by the arrow to form the flange. The carrier 21 is positioned and fixed to the main body 22 by fitting of 21b and the concave portion 22c. Next, while the region of the gasket 23 mounted in the concave groove 22d of the body 22 protruding from the opening surface is positioned in the concave groove 24c of the lid 24, the lid 24 is opened as indicated by the arrow. Then, the hook 25 is pushed between the corresponding concave step surfaces 22e and 24d as indicated by the arrow, so that the required storage container 2 can be constructed as shown in FIG.

At the same time when the semiconductor wafer is accommodated, its lower side and both side surfaces are positioned by the groove of the carrier 21, and at the same time, the projecting region from the carrier opening surface 21a has a slight gap between the lid 24 and the lid 24. Since it is suppressed by the inner bottom surface 24e, it is in a stable state without contact between adjacent parts or causing unnecessary movement. In such a storage container 2, the main body 2
Since the gasket 23 located between the concave grooves 22d and 24c of the lid 2 and the lid 24 is compressed and deformed by the close contact between the opening surfaces 22a and 24a, there is an advantage that a reliable sealing effect can be obtained.

[0018]

However, in the conventional storage container, since all the constituent members are made of organic resin,
There is a problem that it may be contaminated by degassing from the container during storage or transportation of the semiconductor wafer, and whether the contamination of the semiconductor wafer in this case is due to the good or bad atmosphere environment as a clean room. There was a problem that it was difficult to judge.

[0019]

SUMMARY OF THE INVENTION The above-mentioned problems are solved by: a main body made of box-shaped metal having a bottom and provided with means for holding semiconductor substrates in an upright state in parallel; A bottomed box-shaped lid made of metal, a latch attached to the main body, and a hook attached to the lid. The main body and the lid are attached and detached with a predetermined lid fastening force. A lid stopper fitting for obtaining the lid stopper is provided, and a concave groove having a flat bottom surface is provided in a region along the side wall on the opening surface of the main body portion, and the concave groove corresponds to the concave groove of the lid portion. In the region to be formed, a pillow-like protrusion having a size capable of being inserted into the groove and having a flat tip surface is provided, and the height of the pillow-like protrusion exceeds the depth of the groove. Solved by the storage container.

Also, the semiconductor substrate is provided with a main body made of metal having a concave hole having a depth equal to the thickness of the substrate for positioning by abutting in the vicinity of the periphery, and a concave step surface having a diameter smaller than that of the semiconductor substrate. A lid part made of metal attached to the opening surface of the body part, a latch attached to the body part, and a hook attached to the lid part. A lid stopper that can be attached and detached by force, and a concave groove having a flat bottom surface in a cross section is provided in an area along the side wall on the opening surface of the main body portion, and the concave groove of the lid portion is formed. A semiconductor provided with a pillow-shaped projection having a flat tip surface with a size that can be inserted into the groove in a corresponding region, and the height of the pillow-shaped projection exceeds the depth of the groove. It is solved by the substrate storage container.

[0021] All the constituent members as a storage container including a main body unit and a lid unit in which a conventional carrier is integrated are all made of metal, and the main body unit and the lid unit are housed so that they can come into contact with each other by an elastic biasing force. Constructing the container can prevent contamination by degassing from the container during storage or transportation. Therefore, in the present invention, the carrier and the main body in the conventional storage container are integrated, and all the constituent members as the storage container are made of aluminum that does not generate organic substances, and a general commercial item with a spring between the main body and the lid. A lid stopper having the same structure as described above is used to attach / detach, and a plurality of semiconductor wafers housed therein are prevented from moving individually.

This means that the flow of air between the inside and outside of the storage container is suppressed, so that the degassing of the storage container and the occurrence of contamination due to the inflow of organic gas from the ambient atmosphere can be suppressed. Therefore, it is possible to suppress the generation of contamination due to the organic gas and expect to improve the productivity as a semiconductor wafer.

[0023]

1 is a view for explaining the structure of a semiconductor substrate storage container according to the present invention, FIG. 2 is a view for explaining a main body housing in FIG. 1, and FIG. 3 is a lid part in FIG. And FIG. 4 is a diagram for explaining the lid housing in FIG.
FIG. 5 is a diagram for explaining the wafer pressing spring in FIG. 3, and FIG. 6 is a diagram for explaining a state in which the semiconductor wafer is stored in the storage container in FIG.

FIG. 7 is a diagram for explaining the structure of another semiconductor substrate storage container according to the present invention, FIG. 8 is a diagram for explaining the main body casing in FIG. 7, and FIG. 9 is a main body portion in FIG. FIG. 10 is a diagram for explaining the state of housing the semiconductor wafer in the housing, and FIG.
FIG. 11 is a diagram for explaining the lid housing in FIG. 11, and FIG. 11 is a diagram for explaining a wafer storage state in the storage container in FIG. 7. It should be noted that in the drawings, the same target members and parts are allotted with the same symbols, and duplicate explanations are omitted.

1A and 1B for explaining the structure of the semiconductor substrate storage container according to the present invention, FIG. 1A is an overall perspective view partially cut away with the lid stopper metal fitting removed, and FIG. It is a top view in the closed state. In the figure, a semiconductor substrate storage container 5 provided with a metal lid 53 having the same configuration as a general commercial product made of metal is composed of a main body portion 51 and a lid portion 52.

The main body 51 is composed of a main body housing 511 made of metal and a latch 531 of the lid stopper metal fitting 53 attached to the main body housing, and the lid portion 52 is the main body housing. A lid housing 521 made of the same metal and a wafer pressing spring 5 made of metal to be mounted inside the lid housing
22 and the lid stopper 5 mounted on the outer surface of the lid housing
And at least three hooks 532.

And, in particular, the lid stopper metal fitting 53 in this case.
Is a general commercial product that is composed of a latch 531 with a spring and a hook 532 and is configured to be closed by an elastic urging force (hereinafter referred to as a lid tightening force) between the main body housing and the lid housing. It has the same structure as. In the figure, the case where the lid portion 52 is provided with a hand-carrying metal fitting 54 having the same structure as a general commercial product made of metal is shown as an example.

As described above, each of the above components will be described first. In FIG. 2 for explaining the main body housing,
(A) is an overall perspective view, (b) is a front view in which (a) is viewed through arrows a to a, and (c) is a side cross-sectional view in which (a) is viewed through arrows bb. In the figure, for example, a main body housing 511 made of aluminum with surface alumite treatment is a bottomed box shape having a size such that a plurality of the semiconductor wafers 1 can be positioned in parallel in an upright state, and the circumference of an opening surface 511a thereof. A concave groove 511b is formed in a rectangular shape in plan view in a region along the surface, and the semiconductor wafer 1 in a standing state is individually inserted into the inner wall surface 511c 'of one of the opposing side walls 511c by a guide insertion of its diameter portion. A groove 511d that can be positioned in parallel with the above is formed from the opening surface 511a to the vicinity of the bottom surface.

The concave groove 511b has a width "w ₁ " and a depth "d" as shown in an enlarged circle (d) of the area.
_Although it is dug into a rectangular cross section of ₁ ", at least the bottom surface is formed flat over the entire area. Further, the groove 511d has an inner wall surface 511c 'as shown in an enlarged view (e) of the area. The semiconductor wafer 1 is formed in a ladder shape that is open in plan view such that the width of the wafer exceeds the thickness of the semiconductor wafer 1. When the wafer is inserted into the groove 511d, the bottom surface 511e abuts the wafer. Figure 2
As shown in (c), a predetermined value "S" is calculated from the opening surface 511a.
It is designed to project by an amount close to ₁ ”.

Then, each outer surface 511 of the other side wall 511g.
A pair of female screws 511f for fixing the latch 531 of the lid stopper 53 are provided as blind screws which do not penetrate through the side wall at the corresponding two predetermined positions of each e '. Therefore, by fixing the latch 531 of the lid stopper fitting 53 having the same structure as the above-mentioned general commercial item to the area of the female screw 511f by screwing, the main body portion 51 according to the present invention.
Can be configured as shown in FIG.

On the other hand, FIG. 3 for explaining the lid portion is a view in which the lid portion in FIG. 1 is turned upside down. In the figure, the lid 52 is fixed to the lid housing 521, the wafer pressing spring 522 fixed to the bottom surface inside the lid housing, the hook 532 fixed to the outer surface of the side wall of the lid housing, and the outer surface of the bottom plate. And the hand-carrying metal fitting 54.

4A and 4B for explaining the lid housing in this case in the same state as in FIG. 3, FIG. 4A is an overall perspective view, FIG. 4B is a plan view thereof, and FIG. ) Is the back view. In the figure, a lid casing 521 made of aluminum with anodized surface has a size in plan view of the main casing 51.
1 has a bottomed box shape having the same size as that of 1, and a pillow-like protrusion 521b having a size insertable into the concave groove 511b is formed in a region corresponding to the concave groove 511b in the main body housing on the opening surface 521a. There is.

In this case, the pillow-like protrusion 521b is
The width “w ₂ ” shown in an enlarged diagram (e) of the region extracted and enlarged is smaller than the width “w ₁ ” in the concave groove 511 _b of the main body housing 511, and the height “d ₂ ” is Groove 511
b depth "d _1" with set to be larger in than for example 0.5 mm about a small level, at least the projecting tip face is formed flat over the entire region.

On the inner surface 521c 'of the bottom plate 521c, a pair of female screws 521d are provided as blind screws which do not pass through the bottom plate at centrally symmetrical positions on the center line between the two side walls 511c of the main body casing. , Outer surface 521
A female screw 521g for attaching the hand-held metal fitting 54 is provided at c "as a blind screw that does not penetrate the bottom plate.

On the other hand, FIG. 5 for explaining the wafer pressing spring.
Here, (a) is a plan view and (b) is a side view thereof. In the figure, the wafer pressing spring 522 made of a metal plate such as a spring steel plate is formed by punching and bending a rectangular plate material having a size in plan view that can be accommodated in the lid housing 521 with a margin, and is flat. The tongue pieces 522a having a predetermined length "l" are arranged in the both end regions of the main body housing 511 at a pitch interval equal to the pitch "p" between the adjacent grooves 511d. The slits 522c of "1" are provided, and both sides except the mounting portion 522d located at the center between the tongue piece forming areas are bent in the same direction at an acute angle.

The wafer pressing spring 522 is attached to the bottom surface of the lid housing 521 by an unillustrated male screw passing through a mounting hole 522e formed in the mounting portion 522d so as to correspond to the female screw 521d of the lid housing 521. 52
It is fixed to 1c '. The bending angle α of each of the tongue piece forming regions with respect to the mounting portion 522d is
As shown by the broken line of FIG. 2C in the main body housing 511, the angle is set so as to make at least contact with the periphery of the wafer when the semiconductor wafer 1 is inserted.

Accordingly, the wafer pressing spring 522 is fixed to the bottom surface 521c 'of the lid casing 521 as described above, and the female screw 521f provided on the side wall 521e' of the lid casing 521 has the above-mentioned general commercial product. By fixing the hook 532 of the lid stopper 53 having the same structure as the above with a screw (not shown), and further by fixing the above-mentioned carrying metal fitting 54 having the same structure as a general commercial product with a screw (not shown) to the female screw 521g provided on the outer surface 521c ″ of the bottom plate. The lid portion 52 according to the present invention can be configured as shown in FIG.

Therefore, all the latches 53 of the main body 51 are
1 is opened, the lid portion 52 is placed on the body portion 51 so that the concave groove 511b of the body portion housing 511 and the pillow-shaped protrusion 521b of the lid portion housing 521 are fitted to each other. When the latch 531 is hooked on the hook 532 of the main body 51 and the latch is closed, a spring (not shown) provided on the latch 531 causes the main body 51 and the lid 52 to be integrated by a predetermined lid fastening force. Required semiconductor substrate storage container 5
Can be configured as shown in FIG.

6A and 6B for explaining the semiconductor wafer storage state in the semiconductor substrate storage container, FIG. 6A shows the state when the lid is not attached, and FIG. 6B shows the state when the lid is attached. In (a) of the figure, the semiconductor wafer 1 is inserted into the main body housing 511 of the main body 51, and in this state, a part of the wafer is removed from the opening surface 511 a of the main body housing 511 by “s ₁ ”. It is as described above that it only projects ".

When the lid 52 located at the upper corresponding position of the main body 51 is lowered, the tongues 522a of the wafer pressing spring 522 of the lid 52 first come into contact with the peripheral surface of the wafer 1, but continue. The concave groove 511b and the pillow-like protrusion 52 are kept in the pressed state of the tongue pieces against the wafers 1 by the descent.
Although the engagement between the two by the fitting with 1b is completed and the state shown in (b) is reached, each of the tongue pieces 522a has the slit 52a.
Since the wafers are separated by 2c, for example, the above wafer 1
Even if there are variations in the positions of the wafers, the variations are absorbed by the deformation of the tongue piece 522a.
Can be fixed so that there is no rattling.

In this case, as described above, the height "d ₂ " of the pillow-shaped protrusion 521b of the lid housing is the concave groove 511b of the body housing.
Since the depth is higher than the depth “d ₁ ”, a gap A is formed between the main body portion 51 and the lid portion 52, as shown in the enlarged circled view (c) of the contact area between them. As described above, since the tip surface of the pillow-like protrusion and the bottom surface of the groove are both formed flat, the gap between the tip surface of the protrusion and the bottom surface of the groove can be almost completely eliminated. Airflow between the inside and outside of the container can be eliminated.

Incidentally, the concave groove 5 of the pillow-shaped projection 521b.
In order that the pressing force against 11b and by extension the lid tightening force between the main body 51 and the lid 52 should be 1.3 kg / cm ² or more,
It has been experimentally confirmed that the airflow can be almost completely eliminated by setting the spring constant of the spring provided in the latch 531. In the semiconductor substrate storage container 5 having such a configuration, all the constituent members are made of metal that does not generate organic substances, and the semiconductor wafer 1 directly inserted into the main body portion 51 is provided with the wafer pressing spring 522 provided in the lid portion 52. Since it is elastically held by the unit and the air flow between the main unit and the lid can be almost completely blocked, it is possible to suppress the generation of organic gas on the semiconductor substrate during storage or transportation and the occurrence of contamination caused by movement There is a merit that the improvement of the property can be realized.

On the other hand, the semiconductor substrate storage container is classified into a batch type that targets a plurality of semiconductor substrates like the semiconductor substrate storage container 5 and a single-wafer type that targets a single semiconductor substrate. In FIG. 7, another semiconductor substrate storage container 6 of the present invention is of the above-mentioned single-wafer type and is composed of a main body portion 61 and a lid portion 62. However, the main body portion housing 611 and the lid portion housing 621 are structurally configured. And a lid stopper metal fitting 6 having the same configuration as a general commercial product for attaching and detaching between the respective casings
3 and 3.

The main body portion 61 comprises the main body portion housing 611 and a latch 631 which constitutes the lid stopper metal fitting 63, and the lid portion 62 includes the lid portion housing 621 and the lid stopper metal fitting 63. It is configured with a hook 632. The lid stopper fitting 63 has the same structure as the lid stopper fitting 63 used for the semiconductor substrate storage container 5.

Here, each of the above components will be described first. 8A and 8B for explaining the main body housing, FIG.
(B) is a plan view, (c) is a partial sectional view taken along arrows a to a,
(D) is a cross-sectional view taken along arrows bb, and (e) is a cross-sectional view taken along arrows cc. In the figure, for example, a main body housing 611 made of aluminum with a surface alumite treatment has a diameter such that one semiconductor wafer 1 described above can be planarly positioned and mounted by a guide of its diameter portion and has a thickness of the wafer 1. It has a square plate shape in plan view having a recessed hole 611a of a corresponding depth in the center, and the recessed groove 61 is formed in a region along the peripheral surface of the opening surface 611b.
1c is formed in a rectangular shape in plan view.

The recessed groove 611c in this case is dug into a rectangular cross section having a width "w ₃ " and a depth "d ₃ ", as shown in a circle (f) in which the area is extracted and enlarged. Moreover, at least the bottom surface is formed flat over the entire area. Further, the concave hole 611a is provided with a concave stepped hole 611d concentrically as a relief for the wafer 1, and at a plurality of locations on the circumference of the concave hole 611a (corresponding to the four corners of the housing in the figure. Wafer attachment / detachment holes 611e having a depth exceeding at least the recessed holes 611a are provided at four locations.

Further, in the vicinity of both ends of each side wall 611f, a pair of female screws 611g for fixing the latch 631 of the lid stopper fitting 63 are provided as blind screws. Therefore, as shown in FIG. 9A, for example, robot tweezers P
By moving the semiconductor wafer 1 gripped by the robot tweezers P so as to come to the wafer attachment / detachment hole 611e, the semiconductor wafer 1 can be easily placed on the main body housing 611 as shown in (b). You can

The mounted semiconductor wafer 1 can be easily taken out by inserting the robot tweezers P into the wafer attaching / detaching hole 611e and holding the semiconductor wafer 1. Therefore, by fixing the latch 631 of the lid stopper fitting 63 having the same structure as that of a general commercial product to the area of the female screw 611f, the main body 61 according to the present invention can be configured as shown in FIG. .

On the other hand, FIG. 10 for explaining the lid body is a view showing the lid portion in FIG. 7 in the upside down state.
(A) is an overall perspective view, (b) is a plan view, and (c) is an arrow a.
It is a partial cross section in FIG. In the figure, the lid housing 621 made of aluminum with a surface alumite treatment is a square plate shape having the same size in plan view as the body housing 611, and a concave step hole 611d in the body housing 611.
A stepped hole 621a having the same diameter is formed at the same position as the stepped hole 621a, and a pillow having a size that can be inserted into the concave groove 611c of the main body housing 611 on the opening surface thereof. The protrusions 621b are formed.

In this case, the pillow-shaped protrusion 621b is
The width “w ₄ ” shown in the enlarged circle view (d) of the region extracted is smaller than the width “w ₃ ” in the groove 611 c of the main body housing 611, and the height “d ₄ ” is Groove 611
The depth is set to be slightly larger than the depth "d ₃ " of c, for example, about 0.5 mm, and at least the tip end surface of the protrusion is formed flat over the entire area.

Further, a pair of female screws 621d for fixing the hooks 632 of the lid stopper fitting 63 are provided as blind screws at positions corresponding to the female screws 611g in the main body housing near both ends of each side wall 621c. Has been. Therefore, in the same manner as described above, the hook 63 of the lid stopper 63
2 is screwed and fixed in the area of the female screw 621d to form the lid portion 62 according to the present invention.

Therefore, after opening the latch 631 of the main body 61, the concave groove 611c of the main body housing 611 and the lid housing 621 are opened.
The lid portion 62 is placed on the main body portion 61 by fitting with the pillow-shaped protrusion 621b of the lid portion 62, and the latch 631 is attached to the hook 6 of the lid portion 62.
By closing the latch in a state of being hung on 32, the main body 6
A required semiconductor substrate storage container 6 in which 1 and the lid portion 62 are integrated can be configured as shown in FIG. 7.

11A and 11B for explaining the storage state of the semiconductor wafers in the semiconductor substrate storage container 6, FIG. 11A shows the state when the lid is not attached, and FIG. 11B shows the state when the lid is attached. In FIG. 11A, the concave hole 611 of the main body housing 611 is shown.
A semiconductor wafer 1 is placed on a. Then, when the lid portion 62 located at the upper corresponding position of the main body portion 61 is lowered, the pillow-like protrusion 621b of the lid portion 62 is fitted into the concave groove 611c of the main body portion 61 to be in the state shown in (b). Is the same as in the case of the semiconductor substrate storage container 5.

In this case, since the height "d ₄ " of the pillow-like protrusion 621b of the lid housing is higher than the depth "d ₃ " of the recessed groove 611c of the body housing, the body 61 and the lid are closed. 62
A gap A is formed between the contact area and the circle as shown in the enlarged circle (c) of the contact area. However, as described above, the tip end surface of the pillow-like projection and the bottom surface of the groove are both flat. Since it is formed, the gap between the tip end surface of the protrusion and the bottom surface of the concave groove can be almost completely eliminated, and the air flow between the inside and outside of the semiconductor substrate storage container can be eliminated, as in the semiconductor substrate storage container 5.

In the case of the semiconductor substrate storage container 6, the latch 6 is provided so that the pressing force of the pillow-shaped protrusion 621b against the concave groove 611c is 0.8 kg / cm ² or more.
By setting the spring constant of the coil spring existing in 31,
It has also been experimentally confirmed that the air flow can be almost completely eliminated. Also in the semiconductor substrate storage container 6 having such a configuration, all the constituent members are made of metal, and the main body 61 is formed.
Since the semiconductor wafer 1 placed on the semiconductor wafer 1 is held by being sandwiched by the lid portion 62 and the air flow between the main body portion and the lid portion can be almost completely blocked, the same effect as in the case of the semiconductor substrate storage container 5 can be obtained. There is an advantage.

Here, experimental values of the effects of the semiconductor substrate storage containers 5 and 6 will be specifically described in Table 1.

[0057]

[Table 1]

In Table 1, the first experiment is a gas chromatograph showing the total amount of organic substances attached per unit area on the wafer surface immediately after cleaning the semiconductor wafer and the amount of total organic substances attached per unit area on the wafer surface after 7 days of container storage. Is a comparative measurement at the picogram level using the.
In the second experiment, 5 semiconductor wafers stored in a container were used.
This is a comparison of the total amount of organic substances attached per unit area on the wafer surface after being transported by 00 km at a picogram level using a gas chromatograph and comparing the difference in the amount of organic substances attached to the container.

As is clear from Table 1, the total amount of organic substances attached to the semiconductor substrate storage containers 5 and 6 according to the present invention is orders of magnitude smaller than the total amount of organic substance attachments to the semiconductor substrate storage container 2 described in the prior art. I was able to confirm. In the description of the present invention, the case where the target semiconductor substrate is a semiconductor wafer is taken as an example, but the same effect can be obtained by applying the present invention to any substrate that is easily affected by an organic gas. it is obvious.

(Supplementary Note 1) A bottomed box-shaped metal body having means for holding semiconductor substrates in an upright state in parallel, and a bottomed box-shaped body mounted on the opening surface of the body. A lid stopper made of a metal, a latch attached to the main body, and a hook attached to the lid, and a lid stopper fitting for attaching and detaching the main body and the lid with a predetermined lid fastening force; The opening surface of the main body is provided with a concave groove having a flat bottom surface in a region along the side wall, and the concave portion is formed in a region corresponding to the concave groove of the lid portion. A semiconductor substrate storage characterized in that a pillow-like protrusion having a size capable of being inserted into the groove and having a flat end surface is provided, and the height of the pillow-like protrusion exceeds the depth of the concave groove. container.

(Supplementary Note 2) The semiconductor according to Supplementary Note 1, wherein the lid portion is provided with a wafer pressing spring on the bottom surface of the lid portion for individually pushing each of the semiconductor substrates toward the main body portion. Substrate storage container. (Supplementary Note 3) The semiconductor substrate storage container according to Supplementary Note 1, wherein the lid fastening force is 1.3 kg / cm ² or more.

(Supplementary Note 4) A main body made of metal with a concave hole having a depth equal to the thickness of the substrate for positioning the semiconductor substrate by abutting in the vicinity of the periphery, and a concave step surface having a diameter smaller than that of the semiconductor substrate. A lid part made of metal and attached to the opening surface of the body part, a latch attached to the body part, and a hook attached to the lid part. The main body is provided with a lid stopper which can be attached and detached by a lid fastening force, and an opening along the side wall is provided with a concave groove having a rectangular cross section in a region along the side wall. A pillow-shaped protrusion having a flat tip surface with a size that can be inserted into the groove is provided in a region corresponding to the groove, and the height of the pillow-shaped protrusion is configured to exceed the depth of the groove. A semiconductor substrate storage container characterized in that

(Supplementary Note 5) The lid tightening force is 0.8 kg /
The semiconductor substrate storage container according to Note 4, which has a cm ² or more. (Supplementary Note 6) The semiconductor substrate storage container according to Supplementary Note 4, wherein the main body portion and the lid portion are formed in a square shape having the same size in plan view. (Supplementary Note 7) The semiconductor substrate storage container according to Supplementary Note 4, wherein the main body portion has a concave step surface that is concentric with the concave hole and has a smaller diameter than the concave hole.

[0064]

As described above, according to the present invention, it is possible to surely suppress the trace amount of contamination as a semiconductor substrate due to the degassing from the ambient atmosphere or the container during storage or transportation, thereby improving the productivity. A semiconductor substrate storage container can be provided.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a configuration of a semiconductor substrate storage container according to the present invention.

FIG. 2 is a diagram illustrating a main body housing in FIG.

FIG. 3 is a diagram illustrating a lid portion in FIG.

FIG. 4 is a diagram for explaining a lid housing in FIG.

FIG. 5 is a diagram illustrating the wafer pressing spring in FIG.

FIG. 6 is a view for explaining a semiconductor wafer storage state in the storage container of FIG.

FIG. 7 is a diagram illustrating the configuration of another semiconductor substrate storage container according to the present invention.

FIG. 8 is a diagram illustrating a main body housing in FIG.

FIG. 9 is a diagram for explaining a semiconductor wafer storage state in the main body housing of FIG.

FIG. 10 is a view for explaining the lid housing in FIG.

FIG. 11 is a view for explaining a wafer storage state in the storage container of FIG.

FIG. 12 is a diagram illustrating a semiconductor substrate which is a target of the present invention.

FIG. 13 is a schematic view illustrating the configuration of a conventional semiconductor substrate storage container.

FIG. 14 is a diagram illustrating a carrier as a middle box in FIG.

FIG. 15 is a diagram illustrating a main body as an outer box in FIG.

16 is a view for explaining the lid in FIG.

FIG. 17 is a diagram illustrating a process of assembling the semiconductor wafer storage container of FIG.

[Explanation of symbols]

1 Semiconductor Wafer (Semiconductor Substrate) 5,6 Semiconductor Substrate Storage Container 51,61 Main Body 52,62 Lid 53,63 Lid Stopper 54 Handheld Metal 511,611 Main Body Housing 511a, 521a, 611b Opening 511b, 611c Grooves 511c, 511e Side walls 511c 'Inner wall surface 511d Grooves 511e', 521c "Outer surfaces 511f, 521d, 521f, 521g, 611g,
621d Female screw 521,621 Lid housing 521b, 621b Pillow-like protrusion 521c Bottom plate 521c 'Bottom surface (inner surface) 521e', 611f, 621c Side wall 522 Wafer pressing spring 522a Tongue piece 522b Edge 522c Slit 522d Mounting portion 522e Mounting hole 531 631 Latch 532, 632 Hook 611a Recessed hole 611d, 621a Recessed stepped hole 611e Wafer attachment / detachment hole

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3E084 AA05 AA14 AA22 AB10 BA01                       CA03 CB04 CC01 DA03 DB09                       DB13 DB18 DC01 FA09 FC12                       GB13                 3E096 AA01 AA06 BA16 BB04 CA02                       CB03 DA11 DA17 DA23 DB06                       EA06X FA03 FA09 FA22                       GA01 GA07 GA14                 5F031 CA02 DA08 EA01 EA10 EA12                       EA14 EA19 NA02 PA26

Claims (5)

[Claims] 1. A body having a bottomed box-shaped metal having means for holding semiconductor substrates in an upright state in parallel, and a bottomed box-shaped metal mounted on an opening surface of the body. And a lid stopper metal fitting configured to attach and detach the main body portion and the lid portion with a predetermined lid tightening force. The lid stopper metal member includes a latch attached to the main body portion, and a hook attached to the lid portion. In the opening surface of the main body portion, a concave groove having a flat bottom surface is provided in a region along the side wall, and the concave groove is formed in a region corresponding to the concave groove of the lid portion. A semiconductor substrate storage container, characterized in that a pillow-shaped protrusion having a size capable of being inserted and having a flat end surface is provided, and the height of the pillow-shaped protrusion exceeds the depth of the concave groove. 2. The semiconductor substrate according to claim 1, wherein the lid portion is provided with a wafer pressing spring on the bottom surface of the lid portion for individually pushing each of the semiconductor substrates toward the main body portion side. Storage container. 3. The semiconductor substrate storage container according to claim 1, wherein the lid tightening force is 1.3 kg / cm ² or more. 4. A main body made of metal having a concave hole having a depth equal to the thickness of the substrate for positioning the semiconductor substrate by abutting in the vicinity of the periphery, and a concave step surface having a diameter smaller than that of the semiconductor substrate. A lid part made of metal attached to the opening surface of the body part, a latch attached to the body part, and a hook attached to the lid part. A lid stopper that can be attached and detached by force, and a concave groove having a flat bottom surface in a cross section is provided in an area along the side wall on the opening surface of the main body portion, and the concave groove of the lid portion is formed. Pillow-shaped projections having a size that can be inserted into the groove and having a flat tip surface are provided in the corresponding region, and the height of the pillow-shaped projection exceeds the depth of the groove. A semiconductor substrate storage container characterized by: 5. The semiconductor substrate storage container according to claim 4, wherein the lid tightening force is 0.8 kg / cm ² or more.