JP2003298120A - Light source device and fluorescent pattern sheet, method of manufacturing them, liquid crystal display device using them, lighting device, bulletin light, display light, and push button switch - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain white light of high quality with low electric power. <P>SOLUTION: Basic blue light L0 emitted from a light emitting element 1a equivalent to a blue light LED is given to a fluorescent pattern layer 11a. Three primary color basic blocks K each composed of three RGB unit regions; AR, AG, and AB, are periodically arranged on the fluorescent pattern layer 11a, an R fluorescent cell CR which outputs R light as receiving the basic light L0 is provided in the R unit region AR, and a G fluorescent cell CG which outputs G light as receiving the basic light L0 is provided in the G unit region AG. No fluorescent material is provided in the B unit region AB. White light as an aggregate of RGB component light can be obtained from the fluorescent pattern layer 11a, and the white light becomes high in quality because the size of the three primary color basic block K is smaller than the planar size of a light emitting plane Q. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device and its application, and more particularly to a technique for producing white light using the principle of wavelength conversion by a fluorescent material.

[0002]

2. Description of the Related Art As a backlight light source for a liquid crystal display device (LCD) and the like, there is an increasing demand for a white light source that is small in size and consumes less power.

As such a white light source, Japanese Patent Laid-Open No. 10-
In No. 154830, the periphery of a blue LED chip is surrounded by a yellow fluorescent material, and the blue light from the blue LED and the yellow light obtained by wavelength-converting the blue light by the fluorescent material are visually detected. A technique for obtaining pseudo white light by mixing is disclosed (first conventional technique).

In Japanese Patent Laid-Open No. 11-46019, R
White light or the like is to be obtained by mixing three kinds of fluorescent substances each of which emits fluorescence of GB wavelength and arranging the layer of the mixed fluorescent substances on the front side of the blue LED (second prior art). .

Further, as a third conventional technique, there is also a technique in which a large number of three types of color LEDs for individually generating RGB light are arranged and white light is obtained as a whole.

[0006]

However, in the first prior art, even if it is visually white light, it is actually only a mixed light of blue wavelength light and yellow wavelength light. The amount of red component is small. For this reason, this mixed light is converted into a color LD.
When passing through an RGB pixel filter such as C, the amount of light passing through the R filter is insufficient, the brightness in RGB full color display is low, and color balance is difficult to achieve.

In the second conventional technique, red light obtained from one fluorescent substance (for example, red fluorescent substance) is scattered by molecules of other types of fluorescent substances before it is output to the outside. Will end up. The same applies to light of other color components. Therefore, the conversion efficiency of light as a whole of RGB is poor.

In the third prior art, the size of each unit area for each of RGB is about the size of the light emitting surface of a light emitting element such as an LED. Therefore, R
Since each unit area of GB has a size such that it can be visually recognized from the naked eye, the arrangement of RGB light has a spatially rough structure, and the quality of white light is low. Also, three wire bondings are required for each set of RGB unit areas as a minimum unit for generating white light.
Chips are required, three drive circuits are required, the circuit system becomes complicated, and the device size and manufacturing cost are inevitably large. In particular, when a plurality of sets of RGB unit areas are provided, the number of wire bondings and the number of drive circuits are remarkably increased.

The above problems are not limited to backlights of LCD display devices, but are common to various applications in which high quality white light is desired to be efficiently generated.

[0010]

SUMMARY OF THE INVENTION The first object of the present invention is to overcome the above-mentioned problems in the prior art, and a first object thereof is to provide a light source device capable of efficiently producing high-quality white light.

A second object of the present invention is to make such a light source device small in size.

A third object of the present invention is to provide a related art of a light source device having these characteristics.

[0013]

In order to solve the above problems, the invention of claim 1 is a light source device for producing white light, which has at least one integral light emitting surface, And a fluorescent pattern layer for receiving the basic light and outputting white light, wherein the basic light is red. An R unit area in which cells of R fluorescent material for converting light are formed, a G unit area in which cells of G fluorescent material for converting the basic light to green light are formed, and the basic light is transmitted in a blue light state. At least one three-primary-color unit block including the B unit area is provided in a state in which the RGB unit areas are arranged in parallel to the layer surface of the fluorescent pattern layer, and at least the arrangement direction of the RGB unit areas is arranged. To There are, characterized in that the size of the three primary unit block is equal to or less than the size of the emitting surface.

According to a second aspect of the present invention, there is provided a light source device for generating white light, which has at least one integral light emitting surface,
A light emitting means for generating ultraviolet light obtained based on light emission from the light emitting surface as basic light, and a fluorescent pattern layer for receiving the basic light and outputting white light, and in the fluorescent pattern layer, the basic An R unit region in which cells of R fluorescent material for converting light into red light are formed, a G unit region in which cells of G fluorescent material for converting the basic light into green light are formed, and the basic light in blue light At least one three-primary-color unit block including a B unit area in which cells of B fluorescent material to be converted into the above are formed in a state where the RGB unit areas are arranged in parallel to the layer surface of the fluorescent pattern layer. The size of the three primary color unit blocks is equal to or smaller than the size of the light emitting surface in at least the arrangement direction of the RGB unit areas.

A third aspect of the present invention is the light source device according to the first or second aspect, wherein the three primary color unit blocks are repeatedly arranged in the arrangement direction.

The invention of claim 4 is the light source device according to claim 3, wherein the three primary color unit blocks are periodically arranged in the repeating direction.

A fifth aspect of the present invention is the light source device according to the third aspect, wherein the three primary color unit blocks are repeatedly arranged in a plurality of directions parallel to the layer surface, and the three primary color unit blocks are arranged in the plurality of directions. The size of the primary color unit block is equal to or smaller than the size of the light emitting surface.

A sixth aspect of the present invention is the light source device according to the fifth aspect, wherein the three primary color unit blocks are periodically arranged in each of the plurality of directions.

According to a seventh aspect of the present invention, in the light source device according to any one of the first to sixth aspects, the areas of the respective unit areas of the RGB in the three primary color unit blocks are not the same. Characterize.

The invention of claim 8 is the light source device according to any one of claims 1 to 7, wherein the light emitting means includes a semiconductor chip, and the fluorescent pattern layer is on a main surface of the semiconductor chip. It is characterized in that it is formed integrally.

The invention of claim 9 is the light source device according to any one of claims 1 to 8, wherein the basic light from the light emitting means is incident on the side surface of the light guide plate, It is characterized in that white output light is obtained from the fluorescent pattern layer arranged on the main surface.

The invention of claim 10 is the light source device according to any one of claims 1 to 8, wherein the fluorescent pattern layer is disposed on the light emitting surface, and The output light enters the side surface of the light guide plate and is emitted from the main surface of the light guide plate.

According to the invention of claim 11, the light source device according to claim 9 or 10 is used as a backlight,
A liquid crystal display device is characterized in that a liquid crystal display layer is disposed on the light guide plate.

According to a twelfth aspect of the present invention, a plurality of the light emitting means in the light source device according to any one of the first to eighth aspects are provided and arranged, and white light from the light source device is output as illumination light. It is a lighting device characterized by the above.

According to a thirteenth aspect of the present invention, in the illumination device according to the twelfth aspect, the light emitting device further comprises a translucent cover in which a plurality of arrays of the light emitting means are housed, and the fluorescent pattern layer has a fluorescent pattern. It is characterized by covering the cover as a sheet.

According to a fourteenth aspect of the present invention, a plurality of the light emitting means are provided in the light source device according to any one of the first to eighth aspects, and the plurality of light emitting means are two-dimensionally arranged. Is used as a backlight of a transparent image sheet that is removably displayed on the output surface side of the fluorescent pattern layer.

The invention of claim 15 comprises the light source device according to any one of claims 1 to 8 and a color filter for receiving white light from the light source device and converting it into color light. It is a characteristic indicator light.

According to a sixteenth aspect of the present invention, in the indicator light according to the fifteenth aspect, the color filter is detachable.

According to a seventeenth aspect of the present invention, a switching unit,
The push button that is disposed on the switching unit and operates the switching unit, and a light emitting display unit that is visible through a button surface of the push button, the light emitting display unit. Item 10. A push-button switch comprising the light source device according to any one of items 8.

The invention of claim 18 can be used in combination with a light emitting means having at least one integral light emitting surface, and is a sheet which receives blue light from the light emitting means as basic light and outputs white light. An R unit area in which cells of R fluorescent material for converting the basic light into red light are formed; a G unit area in which cells of G fluorescent material for converting the basic light into green light are formed; A three-primary-color unit block including a B unit region that transmits basic light in a blue light state,
The fluorescent pattern layer is repeatedly arranged parallel to the layer surface, and one size of the three primary color unit blocks is equal to or smaller than the size of the light emitting surface in the repeating direction.

A nineteenth aspect of the present invention is a sheet which can be used in combination with a light emitting means having at least one integral light emitting surface, and which receives the ultraviolet light from the light emitting means as basic light and outputs white light. And an R unit region in which a cell of an R fluorescent material that converts the basic light into red light is formed,
A G unit area in which a cell of a G fluorescent material that converts the basic light into green light is formed, and a B unit area that converts the basic light into blue light
Three primary color unit blocks including a B unit area in which cells of a fluorescent material are formed are repeatedly arranged in parallel to the layer surface of the fluorescent pattern layer, and one of the three primary color unit blocks is arranged in the repeating direction. One size is less than or equal to the size of the light emitting surface.

The invention of claim 20 is the fluorescent pattern sheet according to claim 18 or claim 19, wherein each of the RGB unit areas is defined on a flexible base material layer. And

The invention of claim 21 is a method of manufacturing a fluorescent pattern layer, which comprises a first pattern forming step of forming a first repeating pattern containing a first fluorescent substance on a predetermined surface, and a predetermined pattern on the predetermined surface. And a second pattern forming step of forming a second repetitive pattern containing a second fluorescent substance.
1 and 2, each of the n-th pattern forming step includes (a) a step of forming a resist layer containing an n-th fluorescent substance on the predetermined surface, and (b) selecting the n-th resist layer. Developing the nth resist layer after the selective exposure, and (c) selectively removing the nth resist layer to obtain the nth repeating pattern as a residual portion of the nth resist. And a step of arranging the first and second repeating patterns so as to be offset from each other in a direction parallel to the predetermined surface.

The invention of claim 22 is the manufacturing method according to claim 21, further comprising a third pattern forming step of forming a third repeating pattern containing a third fluorescent substance on the predetermined surface, Steps (a) to (c) are also performed for n = 3, and the third repeating pattern is replaced with the first and second
Is arranged in a direction parallel to the predetermined plane with respect to the repetitive pattern.

The invention of claim 23 is a method of manufacturing a light source device, which comprises the steps of forming a structure having a semiconductor structure capable of generating blue light as basic light, and the method of claim 21. The main surface of the structure is applied as the predetermined surface, thereby forming a fluorescent pattern layer on the semiconductor structure.

The invention of claim 24 is a method of manufacturing a light source device, which comprises the steps of forming a structure having a semiconductor structure capable of generating ultraviolet light as basic light, and the method of claim 22. The main surface of the structure is applied as the predetermined surface, thereby forming a fluorescent pattern layer on the semiconductor structure.

[0037]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention are roughly classified into two.

The first method uses blue light (color B light) as basic light. Then, an R unit region in which a cell containing a fluorescent substance that emits red light (R light) (hereinafter “R fluorescent substance”) is formed, a fluorescent substance that emits green light (G light) (hereinafter “G fluorescent substance”) ), A unit cell in which G is formed, and a unit unit region in which B light is substantially transmitted are microscopically arranged repeatedly, and the fluorescent pattern layer is irradiated with the above-mentioned basic light to form a fluorescent pattern. White light is obtained as the output light of the layer.

Here, "microscopically" means "one three primary colors in the arrangement direction of the RGB unit areas" with respect to the three primary color unit blocks which are composed of RGB unit areas and function as the minimum unit of white light generation. The size of the unit block is
The size is equal to or smaller than the size of one light emitting surface of the light emitting means (hereinafter, “block size condition”).

When the light emitting surface of the light emitting means faces the fluorescent pattern layer substantially in parallel, each in-plane direction of the light emitting surface and each layer surface direction of the fluorescent pattern layer correspond to each other. , "Block size condition" is defined in the corresponding direction.

On the other hand, the "block size condition" when there is an optical path changing member such as a lens or a mirror between the light emitting surface of the light emitting means and the fluorescent pattern layer is defined in consideration of such optical path changing. To be done. For example, when the light from the light emitting surface is bent 90 degrees by a mirror or the like and applied to the fluorescent pattern layer, the arrangement direction of the RGB unit areas in the three primary color unit area blocks is set as the first direction, and from this first direction ( When the direction inclined by 90 degrees (corresponding to the above bending) is the second direction, the relative size relationship between the block size of the three primary color unit area blocks in the first direction and the size of the light emitting surface in the second direction is shown. "Block size condition"
Is prescribed.

Further, there is an optical path mixing member such as a light guide plate or a diffusion plate between the light emitting surface of the light emitting means and the fluorescent pattern layer, and the relative directional relationship between the light emitting surface and the fluorescent pattern layer is optical due to the mixing of the optical paths. In the case where it is not uniquely defined, the maximum value of the crossover length of the light emitting surface is defined as the size of the light emitting surface, and the “block size condition” is defined in the relation between the size and the size of the three primary color unit blocks. Impose.

However, even if there is such a mixing member,
When the distance between the mixing member and the fluorescent pattern layer is small, the light after the optical path mixing travels only a short distance before reaching the fluorescent pattern layer, and therefore the mixing in the optical path direction is local. Therefore, in such a case, RGB
Since the correspondence relationship between the arrangement direction of the unit regions and the direction on the light emitting surface is not broken as a whole, the “block size condition” is defined as in the case where the light emitting surface faces the fluorescent pattern layer substantially in parallel. be able to.

On the other hand, in the second method of the present invention, ultraviolet light (UV light) is used as the basic light. Then, not only the cells of the R fluorescent material and the G fluorescent material are formed in the R unit area and the G unit area, respectively, but also the B unit area includes a fluorescent material that emits blue light (hereinafter, "B fluorescent material"). A cell is formed. The “block size condition” is the same as in the first method.

The embodiments of the respective methods will be described in detail below.

<1. Structure of Light Source Device><1.1 Structural Example According to First Method (Blue Light Method)><SheetType> FIG. 1 schematically shows a cross-sectional structure of a light source device 100a according to an embodiment of the first method of the present invention. FIG. The light source device 100a includes a blue light emitting element 1a such as a blue LED. The semiconductor chip 2a of this light emitting element 1a has a pn junction surface J of a p-type semiconductor layer and an n-type semiconductor layer, and blue light is generated from this junction surface J. Therefore, the joint surface J is the integrated light emitting surface Q in this embodiment. Although not shown in FIG. 1, wirings to the p-type semiconductor layer and the n-type semiconductor layer are also provided. Further, a protective film or a light reflection layer may be provided on the lower surface side or the side surface side of the light emitting element 1a.

The blue light obtained on the light emitting surface Q is reflected directly or on the light reflecting surface and travels upward in FIG. 1 as the basic light L0. A sheet-like fluorescent pattern portion 10a is arranged above the semiconductor chip 2a. This fluorescent pattern portion 10
In a, the fluorescent pattern layer 11a is formed on the transparent resin substrate layer 12 by periodically arranging the three primary color unit blocks K into a two-dimensional array pattern PT, which is a fluorescent pattern sheet FS. (Various examples of the two-dimensional array pattern PT will be described later).

Each of the three primary color unit blocks K has a first unit area (R) for generating the R color light LR.
Unit area) AR, second unit area (G) for generating G color light LG
Unit area) AG, and a third unit area (B for generating B color light LB)
(Unit area) AB, which is a repeating unit in the two-dimensional array pattern PT. Here, "parallel" means that they are arranged in a direction substantially parallel to the layer surface of the fluorescent pattern layer 11a (left-right direction in FIG. 1), which is substantially orthogonal to the incident direction Z of the basic light L0. It corresponds to the direction. Further, in this example, the three primary color unit block K includes one spatially continuous RGB unit areas AR, AG, and AB, respectively, but as will be described later, the unit areas AR, AG, and A are used.
There are other embodiments of the repeating unit of the B group.

Of these unit areas AR, AG, and AB, in the R unit area AR, a fluorescent cell CR containing an R fluorescent substance that absorbs the blue fundamental light L0 and emits R-color fluorescence is formed. And in the G unit area AG, the blue basic light L
A fluorescent cell CG containing a G fluorescent substance that absorbs 0 and emits G-color fluorescence is formed. The R unit area AR and the fluorescent cell CR have the same size, and the G unit area AG and the fluorescent cell CG have the same size. Therefore, the unit areas AR and AG are covered with the fluorescent cells CR and CG, respectively.

On the other hand, a layer containing a fluorescent substance is not formed in the B unit area AB, and the blue basic light L0 is substantially transmitted in the blue state.

Therefore, if the blue light emitting element 1a is driven to generate the blue basic light L0, the three unit areas A
R color light LR and G color light L from R, AG, and AB, respectively.
The G and B color lights LB are respectively output in the Z direction.

In such a structure, the semiconductor chip 2
Sizes (widths) DR, D of the unit areas AR, AG, AB in the direction H1 parallel to the light emitting surface Q in a.
G and DB are not only smaller than the size D0 of the light emitting surface Q, but also the size DC of the three primary color unit block K is less than or equal to the size D0 of the light emitting surface Q. It is preferable that a plurality (more preferably a large number) of three primary color unit blocks K be accommodated in the area range corresponding to the light emitting surface Q.

When the width D0 of the light emitting surface Q is 300 μm, for example, the sizes DR, DG of the unit areas AR, AG, AB,
The preferable range of DB is 10 μm to 100 μm.
The preferable range of the block size DC is 30 μm to 300 μm, which is about three times as large as these. In this preferable range, the light emitting surface Q is covered with one to ten three primary color unit blocks K in the direction H1. Further, in the case of a two-dimensional periodic array described later, the light emitting surface Q is covered with 1 to 100 three primary color unit blocks K corresponding to this preferable range.

Therefore, at least one (preferably a plurality, and more preferably a large number) of three primary color unit blocks K are contained in the range of the light emitting surface Q, and a white color obtained from each of the three primary color unit blocks K is obtained. In the output light, the space width of each RGB color component light can be reduced. Therefore, from this light source device 100a, R
GB color component light is densely output spatially with high density,
High quality white light is obtained.

Further, since the light source device 100a uses the fluorescent substance, the light conversion efficiency is high, and since the plural kinds of fluorescent substances are not mixed, the fluorescence generated from the molecule of one fluorescent substance is generated. Also, there is no attenuation due to being scattered by the presence of molecules of fluorescent substances of other colors.

FIG. 2 shows a light source device 100 as another embodiment using a semiconductor chip 2b which generates ultraviolet light Luv.
b is shown. In this case, the fluorescent layer 3 is interposed between the resin base layer 12 and the fluorescent pattern portion 10a to form the composite fluorescent pattern portion 10u. The fluorescent layer 3 uniformly contains a fluorescent substance that absorbs the ultraviolet light Luv to generate blue light, and has a spread that substantially covers the light emitting surface Q of the semiconductor chip 2b and that of the semiconductor chip 2b. The ultraviolet light Luv from the light emitting surface Q is the blue basic light (not shown)
Convert to. This blue basic light is given to the fluorescent pattern layer 11a similar to that of FIG. Therefore, the fluorescent pattern portion 10u outputs white light as a set of RGB light.

<On-Chip Type> FIG. 3 shows an on-chip type in which a fluorescent pattern portion 10b integrally formed on the main surface of the semiconductor chip 2a is used instead of the sheet-like fluorescent pattern portion 10a in FIG. Type light source device 1
00c is shown. The fluorescent pattern portion 10b includes an optically transparent buffer layer 13 formed on the semiconductor chip 2a, and a fluorescent pattern layer 11a laminated on the buffer layer 13, of which a fluorescent pattern layer is provided. The structure and function of 11a are the same as those of FIG.
The buffer layer 13 may be omitted.

The light source device 100c of this embodiment can be handled as an integrated white LED device.

In FIG. 4, the buffer layer 13 in FIG. 2 is integrally laminated on the main surface of the semiconductor chip 2b with the fluorescent layer 3 interposed therebetween, and the fluorescent pattern portion 10b is integrated on the main surface of the buffer layer 13. The light source device 100d is formed by stacking layers. The internal structure and function of the fluorescent pattern portion 10b are the same as those in FIG. Therefore, this light source device 1
00d corresponds to an on-chip type of the wavelength conversion structure of the light source device 100b. Similar to the case of FIG.
The buffer layer 13 may be omitted.

The light source device 100d of this embodiment also has
It can be handled as an integrated white LED device.

<Aspects of Repeated Arrangement of Unit Areas> The unit areas AR, AG, in each of the embodiments shown in FIGS.
Examples of repeating arrangements of AB and the three primary color unit blocks K are shown as plan views in FIGS. 5 to 7, respectively, and the I-I cross section in each may have any of the structures in FIGS. 1 to 4 ( (The scale shown is different from those in FIGS. 1 to 4).

In the arrangement pattern PT1 of FIG. 5, each of the RGB unit areas AR, AG, and AB has a strip shape or a stripe shape, and they are periodically arranged repeatedly in the horizontal direction H1. Therefore, the three primary color unit blocks K also have a stripe shape. However, the “horizontal plane” in these corresponds to a plane substantially parallel to the light emitting surface Q in each of the semiconductor chips in FIGS. In FIG. 5 etc., another direction H2 orthogonal to the horizontal H1 direction in the horizontal plane is shown.
, And the horizontal XY axes common to these figures are defined for intercomparison of the respective arrays of FIGS.

In the illustrated example, the widths of the unit areas AR, AG, and AB in the respective directions H1 correspond to the widths DR, DG, and DB in FIGS. In the case of the structure of FIG. 5, the unit areas AR, AG, A are arranged in the horizontal direction H2.
Each of the B's is only stretched with equal width. Therefore, the periodic array pattern PT1 of FIG. 5 is a one-way periodic array having only one horizontal direction H1 as the repeating direction.

The periodic repeating array pattern PT2 of FIG.
Is a honeycomb-shaped two-dimensional periodic array in which the unit areas AR, AG, and AB are hexagonal. Generally, in order to make the unit areas AR, AG, and AB have the same shape and the same size with each other and to arrange them periodically without a gap, the unit areas AR, AG, and AB are triangular, quadrangular ( It may be rectangular or hexagonal, but the example of FIG. 6 corresponds to the hexagonal shape. However, as shown in FIG. 7, which will be described later, the present invention also allows an arrangement in which the unit areas AR, AG, and AB have mutually non-identical shapes or non-identical sizes. Therefore,
The unit areas AR, AG, AB are triangular, quadrangular, or 6
It does not have to be rectangular. In the example of FIG. 6, the unit areas AR, AG, and AB are periodically and repeatedly arrayed not only in the horizontal direction H1 but also in another horizontal direction H2 orthogonal to the horizontal direction H1. In any case, the sizes of the unit areas AR, AG, and AB are as shown in FIGS.
Is smaller than the size D0 of the light emitting surface Q of. Further, the size of the direction H1 of the three primary color unit block K (a set of three unit areas hatched in FIG. 6) including the unit areas AR, AG, and AB is also less than or equal to the size D0 of the light emitting surface Q. ing. Although the arrangement of the three primary color unit blocks K is arbitrary, if they are spatially continuous,
Even if the three primary color unit blocks other than the hatched three primary color unit block K (for example, each of the unit areas AR, AG, and AB that are continuous in the Y direction) are adopted as the three primary color unit blocks, the size is equal to or smaller than the size D0 of the light emitting surface Q. Become.

In this embodiment, the light emitting surface Q is X
Size (side length) in each direction X, Y in the Y plane
The case where it is a square having D0 is taken as an example. In this case, for example, the correct value of the diagonal length of the light emitting surface Q is SqrtD0 (Sqrt indicates a square root) with respect to the reference size D0, but here the light emission in the unit area or the arrangement direction of the three primary color unit blocks is performed. The crossover length of the plane Q is generally written as "size D0". Therefore, the specific value of the size D0 may have a different value depending on the unit area and the arrangement direction of the three primary color unit blocks.

The example of FIG. 7 will be described with reference to FIG. 8 which is a partially enlarged view thereof. In this example, the unit areas AR, AG
Are substantially circular, and the gaps between these matrix arrangements are unit areas AB. The unit area AB is a cross-shaped star formed of a combination of arcs. It is possible to introduce the concept of a unit cell (unit cell as a repeating unit) as known in crystallography as the three primary color unit block K. In the example of FIG. The unit block K is a square, one unit area AB in the center of the square, two fan-shaped areas having a central angle of 90 degrees, that is, a unit area AR
(1/2) of the unit area AG, and other half of the sector area having a central angle of 90 degrees, that is, (1/2) of the unit area AG.

Therefore, when the unit areas AR, AG are in contact with each other, the area ratio of the unit areas AR, AG, AB in the three primary color unit block K is one side of the square defining the three primary color unit block K. AR: AG: AB = (πd × d / 2) :( πd × d / 2) :( 2d × 2d−πd × d) = π: π: (8-2π), where d is the length of Since this is an approximate value of 3: 3: 2,
As a magnitude relation, AR = AG> AB is established.

In the case of this array pattern PT3, the unit areas AR, AG, and AB are also periodically repeated in the other horizontal direction H2. Further, the maximum values of the sizes of the respective unit areas AR, AG, AB, that is, the maximum values DRm, DGm, DBm of the crossover lengths of the unit areas AR, AG, AB in an arbitrary direction in the horizontal plane are shown in FIGS. It is larger than the sizes DR, DG, and DB shown in FIG.
That is, as shown in FIG. 8, the cross section line I-I is the unit area A.
These are sectional lines that do not pass through the diameters of the respective circles that form R and AG, and are compared with the sizes DR, DG, and DB of FIGS. 1 to 4 defined on the sectional lines, and unit areas AR and A
Maximum G, AB crossover lengths DRm, DGm, DBm
Is getting bigger. However, not only the sizes DR, DG, and DB on the cross-section line I-I, but also the maximum values DRm, DGm, and DBm of these crossover lengths are the sizes in the corresponding direction of the light emitting surface Q of one semiconductor chip. (Hereinafter referred to as "corresponding light emitting surface size"), and also regarding the three primary color unit block K, how to determine the three primary color unit block K by combining adjacent unit areas AR, AG, AB Regardless, it is smaller than the corresponding light emitting surface size.

The array pattern PT3a shown in FIG. 9 shows an example in which the unit areas AR, AG, and AB, which are substantially circular, do not come into contact with each other, and the chain of the unit areas AB is continuous in a vertical and horizontal manner. ing. In this case, when the three primary color unit blocks K are defined so as to satisfy the unit cell condition, the range of “one unit area AB” is within one of the three primary color unit blocks K in the chain of the unit areas AB. It is defined as the included part. Section line II
Not only the respective sizes DR, DG, and DB of the unit areas AR, AG, and AB along the line, but also the maximum value D of the passing length
Rm, DGm, and DBm are also less than or equal to the corresponding light emitting surface size, the size of the three primary color unit blocks K is less than or equal to the corresponding light emitting surface size, and the unit area array has a two-dimensional periodicity. , Which is similar to the case of FIG.
However, in the example of FIG. 9, the area of the unit area AB is larger than the area of each of the other two-color unit areas AR and AG.

By making the shapes, sizes (widths), and / or areas of the unit areas AR, AG, and AB non-identical in this way, it is possible to adjust the whiteness of the output light. That is, when the respective amounts of R fluorescence and G fluorescence per unit area are smaller than the amount of blue light from the light emitting element per unit area, as shown in the example of FIG. By making the area larger than the unit area AB, R in the output light is increased.
It is possible to prevent a shortage of the color light component and the G color light component and obtain more accurate white light.

Further, in the example of FIGS. 1 to 4, the unit area AB of the B color light is simply a window, and a transparent protective layer or the like is only formed in the window, but the protective layer in this window is In the case where the light absorption by A is relatively large, the area of the unit area AB of B color light is set to the other unit areas AR and AG as shown in FIG.
The white balance of white light can be adjusted to be larger than that.

Regarding the relative relationship between the R color light and the G color light, for example, when the fluorescence of the R color light is relatively weak, the area of the unit area AR of the R color light is made larger than the unit areas of the other unit areas AG and AB. It is also possible.

On the other hand, the array pattern PT4 of FIG. 10 is a repeating array of the unit areas AR, AG, AB, but is not a complete periodic array, but the respective unit areas AR, AG,
This is an example in which the plane size has randomness in the AB direction H2 (direction Y). That is, the arrangement pitch DP of the columns of the unit areas AR, AG, and AB in the direction H1 is common to all the rows, but the size (length) DR, DG of the unit areas AR, AG, and AB in the other direction H2. , D
B varies from place to place. However, in any of the unit areas AR, AG, and AB, the widths DR,
DG and DB are smaller than the corresponding light emitting surface size, and the sum of the sizes of three consecutive unit areas AR, AG, and AB (size in the direction H2 of the three primary color unit block K) is also the corresponding light emitting surface. It is less than or equal to the size. The cross-sectional view in the case of such a random arrangement is also the same except that the unit areas AR, AG, and AB have different sizes.
It is similar to FIGS.

In any of the above arrangements, since the plane sizes of the unit areas AR, AG, AB and the three primary color unit blocks K are equal to or smaller than the corresponding light emitting surface size, one or more (preferably in the light emitting surface Q is preferable. There are a plurality, more preferably a large number, of three primary color unit blocks K. Therefore, the range corresponding to the light emitting surface of one semiconductor chip is output as a set of microscopic RGB light emitting points, and is visually recognized as smooth white light. Since the fluorescence obtained in one fluorescent cell is not output through the fluorescent substances of other colors, the amount of output light is large.

In the following, R fluorescent cells CR and G
The two-color fluorescent cells of the fluorescent cell CG are provided in FIGS.
The fluorescent pattern layer 11a of FIG. 4 is referred to as “RG fluorescent pattern layer”.
In particular, of these, a sheet formed separately from the light emitting elements 1a and 1b, such as the fluorescent pattern portion 10a, is referred to as an "RG fluorescent pattern sheet".

<1.2 Structural Example by Second Method (Ultraviolet Light Method)> In the embodiment corresponding to the second method of the present invention, ultraviolet light is generated from the light emitting element, and the ultraviolet light is converted into RGB fluorescence. It is designed to be converted into white light.

<Sheet Type> FIG. 11 is a principle view of a sectional structure of a light source device 110a which is an embodiment of such a second system. The light source device 110a includes a light emitting element 1
Ultraviolet light is generated from b, and the sheet-like fluorescent pattern portion 20a is planarly irradiated with the ultraviolet light as basic light L0.

In the fluorescent pattern portion 20a, a fluorescent pattern layer 11b composed of a two-dimensional array pattern PU in which three primary color unit blocks K are periodically repeated is formed on the transparent resin substrate layer 12. . Each of the three primary color unit blocks K has a first unit area (R unit area) AR for generating the R color light LR and a second unit for generating the G color light LG, as in the first system embodiment. An area (G unit area) AG and a third unit area (B unit area) AB for generating the B color light LB are arranged in parallel.

Of these unit areas, the R unit area AR
Is formed with a fluorescent cell CR containing an R fluorescent substance that absorbs the ultraviolet fundamental light L0 and emits fluorescence of R color light.
The G unit area AG has a basic light L having a wavelength in the ultraviolet range.
A fluorescent cell CG containing a G fluorescent substance that absorbs 0 and emits fluorescence of G color light is formed. These points are similar to those of the first system embodiment, but in the second system embodiment, B unit area AB absorbs the basic ultraviolet light L0 and emits B-color light fluorescence. Fluorescent cell C containing substance
B is formed. The B unit area AB and the fluorescent cell CB have the same size, and the B unit area AB is the fluorescent cell CB.
Is covered with.

Therefore, if the light emitting element 1b is driven to generate the ultraviolet basic light L0, the three unit areas AR, A
From G and AB, R color light LR, G color light LG, and B color light LB are output in the Z direction, respectively.

Also in this embodiment, the size (width) of each unit area AR, AG, AB in the direction H1 (direction parallel to the light emitting surface Q in the semiconductor chip 2b).
DR, DG, and DB are smaller than the size D0 of the light emitting surface Q.

The size DC of the three primary color unit block K is also equal to or smaller than the size D0 of the light emitting surface Q, and preferably a plurality (more preferably a large number) of three primary color basic blocks are included in the size of the light emitting surface Q. Let K fit.

The width D0 of the light emitting surface Q, the unit areas AR, AG,
AB size DR, DG, DB and 3 primary color unit block K
The preferred range of the size DC of is similar to that of the first scheme embodiment.

Therefore, one or more (preferably a plurality, more preferably a large number) of three primary color unit blocks K are included in the range of the light emitting surface Q, and the respective component lights LR and LG obtained from the respective unit areas. , LB of white output light, the width of each color component light becomes a small size that is difficult to visually identify. For this reason,
The white light obtained by this device is of high white quality.

Further, since the fluorescent substance is used, the light conversion efficiency is high, and since the fluorescent substance is not of the type constituted by mixing plural kinds of fluorescent substances, the fluorescence generated from the molecule of one fluorescent substance is There is also no attenuation due to scattering due to the presence of molecules of fluorescent substances of other colors.

<On-Chip Type> FIG. 12 shows an on-chip type in which a fluorescent pattern portion 20b integrally formed on the main surface of the semiconductor chip 2b is used instead of the sheet-like fluorescent pattern portion 20a in FIG. A type of light source device 110b is shown. This fluorescent pattern portion 20b
Includes an optically transparent buffer layer 13 formed on the semiconductor chip 2b, and a fluorescent pattern layer 11b laminated on the buffer layer 13. The fluorescent pattern layer 11b has a structure shown in FIG. It is similar to the one. The buffer layer 13 may be omitted.

In the following description, the fluorescent pattern layer 11b shown in FIGS. 11 and 12 in which fluorescent cells of three colors of R fluorescent cell CR, G fluorescent cell CG and B fluorescent cell CB are provided will be referred to as "RG."
The “B fluorescent pattern layer” is collectively referred to as “B fluorescent pattern layer”, and in particular, a sheet formed separately from the light emitting element 1b such as the fluorescent pattern portion 20a is referred to as “RGB fluorescent pattern sheet”.

In addition, the "RG
The "fluorescent pattern layer" and the "RGB fluorescent pattern layer" in the second method are collectively referred to as "fluorescent pattern layer", and "R
The “G fluorescent pattern sheet” and the “RGB fluorescent pattern sheet” are collectively referred to as the “fluorescent pattern sheet FS”.

<1.3 Aspects of repeating sequence of unit region>
The pattern PU1 of FIG. 13 and the pattern PU2 of FIG.
FIG. 13 is a plan view corresponding to the embodiment of FIGS. 11 and 12 (the XI-XI cross sections of FIGS. 13 and 14 correspond to FIGS. 11 and 12). Unit area A in these
The arrangement of R, AG, and AB is the pattern PT of FIG. 5, respectively.
1 and 6 are the same as the pattern PT2 of FIG. 6 and are different from each other in FIG. 13 and FIG. 14 in order to show that the fluorescent cells CB are arranged on the unit area AB as well. It is only the point where "B" is attached.

The conditions CR, CG, and CB of the unit areas AR, AG, and AB, the size DC of the three primary color unit block K, and the repetition period in the repeating arrangement are the same as those in FIGS. 5 and 6. Is.

A more specific device configuration is shown in FIGS. FIG. 15 shows an example in which sapphire as an insulator is used as a base material (base substrate), and the semiconductor chip 2b is formed on a 300 μm square sapphire base substrate 21 (FIG. 15 (a)). The main surface 23 of the semiconductor chip 2b or the buffer layer 13 formed thereon
Pads of the first electrode E1 and the second electrode E2 are formed in the portions corresponding to the two corners of each. Figure 15
As shown in (b), avoiding the electrodes E1 and E2,
3 of the pattern PU1 on the main surface 23 (or the buffer layer 1
By forming on 3), a white light emitting device is obtained.

FIG. 16 shows an example in which a conductor such as SiC as a conductor is used as a base material, and the semiconductor chip 2b is formed on a 300 μm square SiC substrate 22 (FIG. 16 (a)). A pad of the first electrode E1 is formed on the main surface 23 of the semiconductor chip 2b or on a portion corresponding to one corner of the buffer layer 13 formed thereon. Since the base material (base substrate) is a conductor, it is not necessary to provide the second electrode on the main surface.
Take the electrode. Then, as shown in FIG. 16B, the white light emitting device is obtained by forming the pattern PU2 of FIG. 14 on the main surface 23 (or the buffer layer 13) while avoiding the pole E1.

Although the case where the sapphire base material or the SiC base material is used has been described above, the light emitting device of the present invention can be configured using a base material or a base substrate made of other materials.

<2. Manufacturing Method> The fluorescent pattern layer of the present invention can be obtained, for example, by forming a fluorescent substance pattern (fluorescent cell array) on a predetermined surface by photolithography, offset printing, or inkjet printing. Here, a new method devised for manufacturing a white light emitting device including a fluorescent pattern layer will be described by taking the on-chip white light emitting device of FIG. 12 using an ultraviolet light emitting element as an example.

First, as shown in FIG. 17A, a semiconductor laminated structure 30 having a semiconductor pn junction capable of generating ultraviolet light on a base substrate (not shown) made of an insulator or a conductor.
Are formed in a wafer state. Although the buffer layer 13 of FIG. 12 is not provided in the illustrated example, an optically transparent buffer layer 13 may be formed on the main surface of the semiconductor laminated structure 30. Therefore, a structure having a semiconductor structure capable of generating ultraviolet light is generally obtained at this stage.

After that, as shown in FIG. 17B, a negative resist solution in which an R fluorescent substance is uniformly mixed in advance is applied to the main surface of the semiconductor laminated structure 30 (generally, the main body of the structure including the semiconductor laminated structure 30 is used). The surface, hereinafter the same) is applied using a spinner or the like to form a resist layer 31. Unit area AR
Using the mask 32 (FIG. 17 (c)) in which only the arrangement of (1) is printed, only the arrangement of the unit regions AG is selectively pattern-exposed for the resist layer 31 containing the G fluorescent substance. As the original resist solution before the R fluorescent substance is mixed, a material which is optically transparent or close to it after being exposed and developed is used.

After the development processing, the resist layer 31 is selectively removed leaving only the exposed portion to obtain a partial arrangement layer 32 corresponding to the arrangement of the G fluorescent cells CG (FIG. 17 (d). )).

Next, as shown in FIG. 18 (a), G
A negative type resist solution in which a fluorescent substance is uniformly mixed is applied to the partial array layer 32 and the main surface of the semiconductor laminated structure 30 to form a resist layer 33, and a mask 34 (FIG. 18 ( b)) is used to selectively expose only the arrangement of the unit areas AR in the resist layer 33 containing the R fluorescent substance. Also in this case, as the original resist solution before the GR fluorescent substance is mixed, a material which is optically transparent or close to it after being exposed and developed is used.

After the development processing, the resist layer 33 is selectively removed leaving only the exposed portion to obtain a partial arrangement layer 35 corresponding to the arrangement of the R fluorescent cells CR (FIG. 18 (c). )).

Further, as shown in FIG. 19A, a negative type resist solution in which a B fluorescent substance is uniformly mixed in advance is applied to the partial array layers 32 and 35 and the main surface of the semiconductor laminated structure 30 to form a resist. Using the mask 37 (FIG. 19B) in which only the unit area AB array is printed as the layer 38, only the array of the unit area AB is selectively exposed for the resist layer 38 containing the B fluorescent substance. Also in this case, as the original resist solution before the B fluorescent substance is mixed, a material that is optically transparent or close to it after being exposed and developed is used.

After the development processing, the resist layer 38 is selectively removed leaving only the exposed portion to obtain a partial arrangement layer 39 corresponding to the arrangement of the B fluorescent cells B (FIG. 19 (c). )).

In this way, the unit areas AR, AG, A
A repeating array pattern PU of RGB fluorescent cells CR, CG, CB on B is obtained. The intermediate structure in the wafer state is cut along the dicing line DL into rectangular chips of about 300 μm on a side, and bonding and packaging are performed. As a result, an integrated white light emitting device can be obtained. In addition, the electrodes and the like can be formed in the same manner as in the manufacture of a normal LED.

The resist solution may be either negative type or positive type. In the latter case, unit areas AR, AG, AB
The respective complementary patterns are formed on the respective masks. The order of forming the fluorescent cells CR, CG and CB is arbitrary.

According to the manufacturing method using such a patterning process, a manufacturing method using a normal photolithography technique, that is, after providing a resist layer on the fluorescent material layer and selectively etching the resist layer, Compared to the technique of patterning the fluorescent material layer using the resist layer pattern as a mask, the selective etching step of the resist layer itself is the patterning step of the fluorescent material layer, so the number of steps is reduced and the number of alignment steps is also reduced. In addition, a fine fluorescent pattern layer and a light source device including the same can be obtained at low cost and with high quality.

Although the semiconductor chip 2b that emits ultraviolet light is used in the above example, when the semiconductor chip 2a that emits blue light is used instead, a fluorescent cell CB for B-color light is used.
18 is unnecessary, the process of FIG.
When the state of (c) is obtained, dicing is performed to divide into a plurality of chips. An optically transparent protective layer may be formed on the entire upper surface including a window corresponding to the unit region AB, and then the chip may be divided into a plurality of chips.

<3. Application of Light Source Device of Present Invention><White LED Sphere> FIG. 20 shows an example in which the light source device of the present invention is configured as a white LED sphere 210. This white LE
The D bulb 210 has the same configuration as the semiconductor chips 2a, 2b described above, and the semiconductor chip TP that emits blue light or ultraviolet light is enclosed together with the fluorescent pattern sheet FS to have the same external shape as a miniature bulb. It is a light source.

The semiconductor chip TP is the first lead frame 2
It is arranged on the bottom surface of the concave portion of 12 and is connected to the first lead frame 212 and the second lead frame 214 by the lead wire 215. Second lead frame 214
The connection with is made through a gap 213 provided between the pillars of the first lead frame 212.

The fluorescent pattern sheet FS is arranged on the pillar of the first lead frame 212 and receives the basic light emitted from the semiconductor chip TP. The concave portion of the lead frame 212 is a tapered mirror surface, and has a function as a reflecting surface that reflects the basic light emitted laterally from the light emitting surface of the semiconductor chip TP and guides it to the fluorescent pattern sheet FS.

Each of these structures is enclosed in a transparent resin 211a. The transparent resin 211a is a combination of a hemisphere and a cylinder as shown in FIG. 21 (a), but a simple cylinder 211b (cylinder, square cylinder) can also be used as shown in FIG. 21 (b).

FIG. 22 is a diagram showing the structure of another white LED sphere 220. As shown in FIG. 22, this white LED
The main difference between the sphere 220 and the white LED sphere 210 of FIG. 20 is that the semiconductor chip TP and the lead frames 217 and 218 are different.
Also, the lead wire 215 is molded in the transparent resin block 216, and the fluorescent pattern sheet FS is attached to the top surface of the transparent resin block 216. As can be seen by comparing with FIG. 20, the white L in FIG.
In the ED sphere 220, the first lead frame 217 does not have a pillar portion for supporting the fluorescent pattern sheet FS. That is, when a column portion for supporting the fluorescent pattern sheet FS is provided, the column portion is apt to obstruct the optical path of the basic light. Therefore, by omitting the column portion as shown in FIG. 22, the utilization efficiency of the basic light is improved. Also, the fluorescent pattern sheet FS
Since it may be attached on the transparent resin block 216, its rigidity may be relatively low as compared with the point support type as in the case of FIG.

In manufacturing the white LED bulb 220 of FIG. 22, the fluorescent pattern sheet FS is placed on the flat bottom of the mold frame 218, as shown in FIG. Next, the melted transparent resin 216a is put into the mold frame 218, and the semiconductor chip TP and the lead frame 21 are put therein.
After the head of the module 218 in which the 7, 118 and the lead wire 215 are assembled is suspended, the module 218 is put upside down and placed in the transparent resin 216a, and then the transparent resin 216a is cured.

After the transparent resin 216a is cured, the fluorescent pattern sheet FS attached to the transparent resin 216a and the module 218 are integrally taken out and turned upside down. The cured transparent resin 216a corresponds to the transparent resin block 216 in FIG.

Then, the white LED sphere 220 is obtained by encapsulating these in the transparent resin 211a.

Other examples of the white LED sphere will be described in the section of "Modification" below.

<White LED Unit> FIG. 24 shows a flat type white LED unit 230. A pair of electrodes 233a and 233b are provided so as to penetrate the bottom surface of a container (box) 231 having a light-reflecting tapered surface inside, and one of the electrodes 233a extends along the inner bottom surface of the container 231. It has been inserted in the closed state.
At the bottom of the container 231, the semiconductor chip TP formed on the insulating base material is attached on the electrode 233a, and the electrodes 233a and 233b and the respective semiconductor layers of the semiconductor chip TP are connected by the lead wires 232. There is. However, when a conductive base material is used instead of an insulating base material in the semiconductor chip TP, the semiconductor chip T
A lead wire for connecting the semiconductor layer under P to the electrode 233a is unnecessary. In addition, the inside of the container 231 is molded with the transparent resin layer 234, and the fluorescent pattern sheet FS is formed.
Is attached to the flat top surface of the transparent resin 234. As a result, the white LED unit 2 having a flat light emitting surface
30 is obtained.

Instead of attaching the fluorescent pattern sheet FS, as described in FIGS. 17 to 19, using a mixture of a fluorescent substance and a resist, the fluorescent pattern layer is formed on the flat top surface of the transparent resin 234 layer. It may be formed directly. Further, a transparent protective film may be provided on the fluorescent pattern layer. Further, it is possible to form the transparent resin layer 234 into two layers and provide the fluorescent pattern layer between the two layers.

<White illumination lamp (white ball bulb)> FIG.
Shows a white ball sphere 240 as an example of a white illumination lamp (white illumination device) using a plurality of LEDs. In this white ball sphere 240, a triangular pyramidal support 242 as shown in FIG. 26 (a) is fixed to an end of an electrode portion 241 having a built-in LED driving power supply circuit. A plurality of semiconductor chips TP are arranged and fixed on each side surface (three side surfaces in this case) of the support 22. In addition, these structures are housed in a hollow ball cover unit 243, and a portion of the electrode portion 241 projecting to the outside of the ball cover unit 243 is used as an AC power lamp socket or a DC power socket. Used by mounting.

When the semiconductor chip TP is an LED light emitting element which emits blue light or ultraviolet light, the ball cover unit 243 has a fluorescent pattern sheet F on the surface of the ball cover main body 244 made of a transparent material such as glass.
It is formed by pasting S. In this case, the blue or ultraviolet basic light is converted into white light in the fluorescent pattern sheet FS, which is used as white illumination light. Instead of attaching the fluorescent pattern sheet FS, a fluorescent pattern layer may be integrally formed on the surface of the ball cover body 244. Further, the surface of the fluorescent pattern layer (sheet) may be covered with a transparent protective film.

Further, instead of the semiconductor chip TP, the on-chip type light source devices 100c, 100 described above are used.
It is also possible to use d, 110b. If the term “white LED chip WTP” is used as a generic term for these, the semiconductor chip T in the white ball sphere 240 is
Instead of P, a plurality of white LED chips WTP are arranged.
In this case, since the white LED chip WTP produces white light, it is not necessary to attach a fluorescent pattern sheet to the ball cover unit 243, and a normal light diffusion process for uniforming the luminance distribution is performed. A glass or resin ball can be used as the ball cover unit 243.

In place of the triangular pyramid support 242,
Using a rectangular parallelepiped support 242a as shown in FIG. 26 (b),
A plurality of semiconductor chips TP or a plurality of white LED chips WTP are arranged on each of the four side surfaces and the top surface (outside of the bottom surface in the directional relationship of FIG. 26B), which is a total of five surfaces. In addition, the shape of the support and the chips TP and WTP are determined according to the required luminance distribution in the respective solid angle directions.
The arrangement distribution of can be variously changed.

This white ball sphere 240 consumes less power and has a longer life than a conventional fluorescent ball sphere having a discharge tube type fluorescent lamp built therein. In addition, unlike conventional fluorescent ball spheres, there is no problem that it takes time to stabilize the discharge, and the brightness is low and white is not stable during that time. Unlike the discharge tube, the semiconductor chips can be arranged in a high degree of freedom, and thus can be easily deformed into a shape other than a ball.

<White illumination lamp (white fluorescent straight tube, etc.)> FIG.
Shows a white fluorescent straight tube 250 as another example of a white illumination lamp (white illumination device) using a plurality of LEDs. In this white fluorescent straight tube 250, a plurality of semiconductor chips TP are arrayed and fixed to three side surfaces of a long triangular columnar support 252 having a built-in LED driving power supply circuit. In addition, this structure is housed in a hollow transparent circular tube 251, and an LED drive circuit is incorporated inside the triangular prism support 252.

A fluorescent pattern sheet FS is wound around the hollow transparent circular tube 251. The fluorescent pattern sheet FS is formed by forming the above-described RG (or RGB) fluorescent pattern array PT or PU on a flexible base material layer such as resin.

As a result, the blue light or the ultraviolet light generated in the plurality of semiconductor chips TP is emitted from the fluorescent pattern sheet F.
White light is obtained by passing through S.

In particular, since this fluorescent pattern sheet FS is flexible, it is not limited to the cylindrical shape as shown in FIG.
It can be deformed according to the outer shape of various light sources.

FIG. 28 shows an example of a ceiling-mounted white illumination light source 260. A substrate 262 with a built-in LED drive circuit is provided on the lower surface of the support plate 261, and a plurality of semiconductor chips TP are arranged and fixed on the main surface of the substrate 263. In addition, this structure is housed in a transparent cover 263 having a partially cylindrical shape (a semi-cylindrical shape).
A fluorescent pattern sheet FS is wound around the area 3.

Also with this structure, the blue light or the ultraviolet light generated in the plurality of semiconductor chips TP becomes white illumination light by passing through the fluorescent pattern sheet FS.

The advantages of these compared with the conventional fluorescent lamp of the discharge tube type are the same as those of the fluorescent ball bulb.

<LCD Backlight> FIG. 29 shows an example in which the light source device of the present invention is used as a backlight of a liquid crystal display device (LCD). In the LCD 270a of FIG. 29 (a), a light source device of an on-chip type, that is, a white LED element 271 configured as the above-described light source devices 100c, 100d, and 110b in which a fluorescent pattern layer is integrally formed on a semiconductor chip is used. White light is introduced into one side surface of the light plate 272, and the white light reflected by the reflection surface (not shown) formed on the bottom surface and the other side surface of the light guide plate 272 is used as the backlight of the color liquid crystal panel body 273. The color liquid crystal panel body 273 has a known structure,
The liquid crystal layer is sandwiched by a pair of transparent electrode layers and a pair of polarizing plates having polarization directions different by 90 degrees, and the screen is covered with a color filter colored RGB for each pixel.

In this LCD 270a, white LED
A white backlight is obtained by the element 271, and a color-variable image display of a clear color is possible. Since the light of each of the RGB components obtained by the fluorescent pattern layer is mixed by the light guide plate 272, this also has a function of generating white light for each pixel, but preferably, each of the three primary color unit blocks is The size is set to be equal to or smaller than the size of each pixel in the color liquid crystal panel body 273. As a result, the uniformity of the white of each pixel as a backlight becomes particularly high.

In the LCD 270b of FIG. 29 (b), a blue light or ultraviolet light LED element 274 having no fluorescent pattern layer is used as a light emitting element, and a separate fluorescent pattern sheet FS is arranged on the light projecting surface. And is arranged on the side surface of the light guide plate 272.

Further, in the LCD 270c of FIG. 29 (c),
Similarly, the light emitting element itself uses a blue light or ultraviolet light LED element 274 having no fluorescent pattern layer, and supplies blue light or ultraviolet light to the light guide plate 272. Light guide plate 27
On the main surface of No. 2, the color liquid crystal panel body 273 is provided via the fluorescent pattern sheet FS. In the case of FIG. 29C, since the light emitting surface of the LED element 274 and the fluorescent pattern sheet FS do not directly correspond to each other, the “block size condition” is the maximum value of the crossover length of the light emitting surface of the LED element 274. Is defined as the size of the light emitting surface, and the "block size condition" is satisfied in the relationship between the size and the size of the three primary color unit blocks.

In any of these structures, FIG.
The same effect as that of (a) can be obtained, but in particular, FIG.
The configuration also has an advantage that a monochromatic LED can be used as the light emitting element itself.

It is the same in the devices of FIGS. 29 (b) and 29 (c) that the size of the three primary color unit blocks is preferably equal to or smaller than the size of each pixel in the color liquid crystal panel body 273, and in particular, in FIG. In the configuration of (c), since the output light from the fluorescent pattern sheet FS does not pass through the light guide plate,
If the size of the three primary color unit block is relatively large, it is likely to be affected. Therefore, in the configuration of FIG. 29 (c),
3 in each pixel in the color liquid crystal panel body 273.
A unit area AR is provided so that a plurality of primary color unit blocks are inserted.
It is preferable to determine the sizes of AG and AB.

29 (a) to 29 (c), a monochrome color liquid crystal panel body may be used instead of the color liquid crystal panel body 273, and in this case as well, a uniform white backlight is used. A clear image can be obtained by light.

<Poster Light> FIG. 30 (a) is an external view of a postal light 280 using the light source device of the present invention.
(b) is a sectional view thereof. In this bulletin lamp 280, a light source unit 282 in which a large number of white LEDs that generate blue light or ultraviolet light are two-dimensionally arranged in a matrix is provided in the back of a box 281 having an open front. A relatively thick transparent glass plate (or transparent resin plate) 28 is provided at the front opening of the box 281.
3 is fitted and fixed, and the light diffusion sheet 284
And the fluorescent pattern sheet FS are laminated on the inner surface of the transparent glass plate 283 to cover the transparent glass plate 283.
Then, on the outer surface of the transparent glass plate 283, an image sheet 28 prepared for advertisement or other notices such as a film on which a color transmission image is printed by a transparent adhesive tape or the like.
5 is detachably attached, and the transmitted image is visually recognized from the outside by using the white light output from the fluorescent pattern sheet FS as a backlight.

By using such a display lamp 280, the image on the image sheet 285 is displayed in a bright and natural color. In particular, in such applications, the power consumption tends to increase due to the large overall size.
By using a white light source in which a semiconductor light emitting element such as an ED and a fluorescent pattern layer are combined, the amount of reduction in power consumption is increased.

The "image" in the above-mentioned "image sheet" is a concept indicating a general visual image including not only photographs, pictures and illustrations but also character fonts and handwritten characters.

<Indicator Light> FIG. 31 is a perspective view showing an example in which the present invention is applied to the collective indicator light 310. When the collective indicator lamp 310 is actually installed and used, the upper side of FIG. 31 is installed toward the observer side of the display, but here, for convenience, the display surface side is shown as an upper side.

This collective indicator light 310 includes a housing 31
2 is assembled with a plurality of unit indicator lights 311a to 311i. These unit indicator lights 311a to 311
11i are different in their size and display color, but have the same basic configuration.
The configuration of 11a will be described.

FIG. 32 (a) is an exploded perspective view of the unit indicator light 311a. In this unit indicator light 311a, a plurality of LED light emitting elements 314 that generate a plurality of blue lights or ultraviolet lights are arranged in a matrix inside a resin case 313 having a window 313W. The light emitting element 314 is mounted on the main surface of the printed circuit board and is housed in the case 313.
It is exposed toward the upper surface side of 3.

On the other hand, the fluorescent pattern sheet FS is previously fixed to the upper frame portion of the case 313 by adhesion so as to cover the entire window 313W. FIG. 32B shows a state in which the white light emitting unit WU is integrally formed by such fixing. An integrated white light emitting unit WU is used for assembling the unit indicator lamp 311a.

Further, as shown in FIG. 32 (a), a frame 315 is arranged around the upper surface of the window 313W. This frame 315 is shown in FIG.
It is designed to fit inside the housing 312 of
A light diffusion plate 316, a color filter 317, a name plate 318, and a transparent resin cover plate 319 are sequentially stacked on the frame 313. Characters and symbols to be displayed are written on the name plate 318.

When the LED light emitting element 314 produces blue light, an RG fluorescent pattern sheet is used as the fluorescent pattern sheet FS. When the LED light emitting element 314 produces ultraviolet light, an RGB fluorescent pattern sheet is used as the fluorescent pattern sheet FS.

Therefore, in any case, the light transmitted through the fluorescent pattern sheet FS is white light, and by passing through the color filter 317, light of a color unique to the color filter 317 is obtained, which is the display light. As seen from the outside. The color filter 317 is attachable / detachable to / from each of the unit display lights 311a to 311i, and by mounting the color filter 317 of a desired color on each of the unit display lights 311a to 311i,
Any color display is possible in each, and each color display light can be obtained based on white light with high purity.

Instead of using the fluorescent pattern sheet as described above, a light emitting device in which the LED light emitting element 314 itself has a fluorescent pattern layer formed on-chip in accordance with the structures of FIGS. 3, 4 and 12 is used. Good.

<Push Button Switch> FIG. 33 is an exploded perspective view showing an example in which the present invention is applied to an illuminated push button switch, and FIG. 34 is a partial perspective exploded view of FIG.
Of these, the illuminated push button switch 350 is a separate type, and its constituent elements are the control panel 3 to which the illuminated push button switch 350 is attached.
The contact unit 370 is inserted into the mounting hole 361 from the back side of the panel 60, and the operation unit unit 380 is inserted from the front side (operation side) of the panel 360. Of these, the contact unit 370 is a main body 37 having a built-in switch contact.
The LED unit light source 371 is detachably attached to the main body 373.

The LED unit light source 371 has a substantially cylindrical shape, and a plurality of LED light emitting elements 372 for generating white light are arranged on the top thereof. LED light emitting element 372
Each has a structure of the type shown in FIG. 3, FIG. 4 or FIG. 12 in which a fluorescent pattern layer is formed on-chip on the LED light emitting element body (semiconductor pn junction) that emits blue light or ultraviolet light.

Further, a ring 374 used when connecting the operation unit 380 to the contact unit 370 is provided.

On the other hand, the operation section unit 380 comprises an operation section body 381 and a push section (push button) 390. A rectangular receiving opening 382 is formed in the upper portion of the operation portion main body 61, and the pushing portion 390 is accommodated in the receiving opening 382. Although details of the push section 390 will be described later, the push section 390 opens and closes the contacts in the contact unit 370 by manually pressing the push section 390 after assembly. The LED unit light source 371 may be turned on or off in response to opening and closing of the contact, and the illuminated push button switch 3 may be used.
It may be turned on or off in response to a signal from an external device (such as a controller) to which 50 is connected. The operation surface 390S of the push portion 390 is translucent, and the characters and the like displayed inside the operation surface 390S are illuminated by the light from the LED unit light source 371 and are recognized from the outside.

FIG. 34 showing the disassembled state of the push portion 390.
In, the push portion 390 is a colorless transparent reinforcing plate 3 formed of a resin such as acrylic on the hollow substrate 391.
92, a color filter 393, a colorless and transparent name plate 3 made of a resin such as acrylic.
94, are laminated in this order. And the operation surface 3 of FIG.
As a member for defining 90S, a colorless and transparent front plate 395 made of acrylic, for example, is provided.

In this illuminated push-button switch, since the LED light emitting element 372 emits high quality white light, a color filter having a high purity can be obtained by using a filter of a desired color as the detachable color filter 393. You can get the light. An LED element that emits blue light or ultraviolet light may be used, and a fluorescent pattern sheet may be provided above or below the reinforcing plate 392.

Further, instead of the LED light emitting element 372,
L that generates blue light or ultraviolet light as shown in FIG.
The white light emitting element 410 may be used in which the fluorescent pattern sheet FS is attached to the output side of the array of the ED element body 401 and integrated.

<4. Modification> ◎ FIG. 36 (a) is a diagram showing the internal structure of a modification of the white LED sphere described in FIG. 20, and FIG. 36 (b) is a plan view thereof. In this modification, the first lead frame 2
The 12L pillar portion 212b is configured to be lower than that shown in FIG. 20, and a step is provided inside the upper end portion 212c of the pillar portion 212b. Then, on this step, the fluorescent pattern sheet FS
It is in a state of being embedded.

A pair of notches 212d are formed in the upper end portion 212c of the first lead frame. Further, a pair of cutouts FSC is formed in the fluorescent pattern sheet FS corresponding to the cutouts 212d.
SC is positionally aligned.

Utilizing the notch 212d and the FSC,
Electrical connection is made between the first lead frame 212L and the lead wire 215, and electrical connection between the second lead frame 214 and the other lead wire 215. Particularly, the electrical connection between the second lead frame 214 and the lead wire 215 is realized by the lead wire 215 passing through the gap formed by the notch 212d and the FSC.

According to this modification, since the first lead frame 212L is constructed low, the fluorescent pattern sheet FS can be arranged at a position relatively close to the light emitting surface of the semiconductor chip TP. Therefore, the semiconductor chip TP
It is possible to particularly reduce the proportion of the blue light or the ultraviolet light generated from the light that does not reach the fluorescent pattern sheet FS and is dissipated, and the light utilization efficiency is high. It is also possible to reduce the height of the white LED sphere as a whole.

The upper end portion 212 of the first lead frame
The shape of c may not be a circular ring shape as shown in FIG. 36B in a plan view, but may be another shape such as a rectangular ring shape.

A diffusing material may be mixed in each fluorescent cell forming the fluorescent pattern layer.

In the case of the on-chip type structure described above, the fluorescent cells may be formed on the semiconductor structure in a wafer state as described above, and the fluorescent pattern is individually formed on the bare chip after dicing the semiconductor wafer. You may form a layer.

The fluorescent pattern sheet FS can be adapted to various shapes by making it flexible, but the fluorescent pattern layer may be provided on a rigid base layer.

The resin substrate layer 12 (FIG. 1, FIG. 2, FIG. 11) in the fluorescent pattern sheet FS may be a transparent glass plate, and in either case, it is on one side (preferably on the semiconductor chips 2a, 2b). The facing surface) may be satin finished.

[0163]

As described above, according to the inventions of claims 1 to 10, blue light or ultraviolet light is used as the basic light, and white light is obtained from this basic light by using the fluorescent pattern layer. Since the size of the RGB three-primary-color unit block in the fluorescent pattern layer is set to be equal to or smaller than the size of the integrated light emitting surface of the light emitting means, each of the RGB color components is spatially and densely output, and high quality as a whole thereof. White light is obtained.

Further, this white light is white light which sufficiently contains the respective components of RGB, and since the light of the respective color components of RGB can be output without passing through the fluorescent substances of other colors, it is scattered. There is little attenuation due to etc.

Further, since it is not necessary to provide the same number of light emitting elements as the total number of unit areas, the device becomes compact.

In particular, according to the invention of claim 8, since the fluorescent pattern layer is formed on-chip on the semiconductor chip, it is not necessary to prepare a separate fluorescent pattern sheet,
The number of parts is small.

According to the inventions of claims 11 to 17, since the white light having the above characteristics is used, the quality of illumination light, backlight, display light, etc. is improved.

According to the eighteenth to twentieth aspects of the invention, the fluorescent pattern layer is constituted as a fluorescent pattern sheet, and it can be used in combination with various blue or ultraviolet light emitting means, so that it is highly versatile. .

Particularly, in the invention of claim 20, since the sheet is flexible, it can be adapted to various shapes.

Further, according to the inventions of claims 21 to 24, since the fluorescent substance is mixed in the resist and the fluorescent pattern layer is obtained by the selective etching of the resist layer, the fluorescent pattern layer is formed. In comparison with the case where a resist layer is separately provided and the fluorescent material layer is patterned using the resist as a mask after the selective etching of the resist, the fluorescent pattern layer can be accurately obtained in a smaller number of steps.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a main part of a light source device of an embodiment configured so that basic light obtained from a blue LED is given to a fluorescent pattern sheet to obtain white light.

FIG. 2 is a cross-sectional view of a main part of a light source device according to an embodiment configured to obtain white light by applying blue basic light obtained by wavelength converting ultraviolet light to a fluorescent pattern sheet.

FIG. 3 is a cross-sectional view of essential parts of a light source device according to an embodiment in which the structure of FIG. 1 is configured as an on-chip type.

4 is a cross-sectional view of a main part of a light source device according to an embodiment in which the structure of FIG. 2 is configured as an on-chip type.

FIG. 5 is a plan view showing an example of arrangement of unit areas in an RG fluorescent pattern layer.

FIG. 6 is a plan view showing an arrangement example of unit areas in an RG fluorescent pattern layer.

FIG. 7 is a plan view showing an arrangement example of unit areas in an RG fluorescent pattern layer.

8 is a partially enlarged view of the arrangement example of FIG.

9 is a partially enlarged view showing a modified example of the arrangement of FIG.

FIG. 10 is a plan view showing an arrangement example in which the size of a unit area in a fluorescent pattern layer is random.

FIG. 11 is a cross-sectional view of a main part of a light source device according to an embodiment configured to give white light by applying basic light obtained from an ultraviolet LED to a fluorescent pattern sheet.

12 is a cross-sectional view of a main part of a light source device according to an embodiment in which the structure of FIG. 11 is configured as an on-chip type.

FIG. 13 is a plan view showing an arrangement example of unit areas in an RGB fluorescent pattern layer.

FIG. 14 is a plan view showing another arrangement example of the unit areas in the RGB fluorescent pattern layer.

FIG. 15 is a plan view showing an arrangement example of unit areas in an RGB fluorescent pattern layer in a chip size.

FIG. 16 is a plan view showing another array example of the unit areas in the RGB fluorescent pattern layer in a chip size.

FIG. 17 is a manufacturing process diagram of an on-chip type fluorescent pattern layer.

FIG. 18 is a manufacturing process diagram of an on-chip type fluorescent pattern layer.

FIG. 19 is a manufacturing process diagram of an on-chip type fluorescent pattern layer.

FIG. 20 is a diagram showing a white LED sphere using the light source device of the present invention.

FIG. 21 is a diagram showing a variation of the transparent cover in the white LED ball of FIG. 20.

FIG. 22 is a diagram showing the structure of another white LED sphere.

FIG. 23 is a diagram showing a method of manufacturing the white LED sphere of FIG. 22.

FIG. 24: Flat type white LED unit 230
FIG.

FIG. 25 is a diagram showing a white ball sphere using a plurality of LEDs.

FIG. 26 is a view showing a variation of the support in the white ball sphere of FIG. 25.

FIG. 27 is a diagram showing a white fluorescent straight tube using a plurality of LEDs.

FIG. 28 is a diagram showing an example of a white illumination light source using a plurality of LEDs.

FIG. 29 shows a liquid crystal display device (LC
It is a figure which shows the example utilized for the backlight of D).

FIG. 30 is a diagram showing a notice lamp using the light source device of the present invention.

FIG. 31 is a perspective view showing an example in which the present invention is applied to a collective indicator lamp.

32 is a partially exploded view of the collective indicator lamp of FIG. 31. FIG.

FIG. 33 is an exploded perspective view showing an example in which the present invention is applied to an illuminated push button switch.

34 is a partial perspective exploded view of the structure of FIG. 33. FIG.

FIG. 35 is a diagram showing another example of a white light emitting element that can be used as a push button switch.

FIG. 36 is a diagram showing a main part of a modified example of a white LED sphere using the light source device of the present invention.

[Explanation of symbols]

1a Blue LED element 1b Ultraviolet LED element 2a, 2b Semiconductor chip 3 Blue fluorescent substance layer 10a, 10b, 10u, 20a, 20b Fluorescent pattern part 11a RG fluorescent pattern layer 11b RGB fluorescent pattern layer 13 Buffer layer 21 Transparent resin sheet 100a- 100d Blue light type light source device 110a, 100b UV light type light source device K 3 Primary color unit block J pn junction surface Q light emitting surface L0 basic light (blue light or ultraviolet light) FS fluorescent pattern sheet PT, PT1 to PT4 RG fluorescent cell Array pattern PU, PU1, PU2 RGB fluorescent cell array pattern AR R unit area AGG unit area AB B unit area CR R fluorescent cell CG G fluorescent cell CB B fluorescent cell D0 size of light emitting surface DC 3 primary color unit block size DR R unit area size DG G unit area size Size of DB B unit area

Continued front page    F-term (reference) 2H091 FA02Y FA45Z GA01 LA11                       LA30                 5F041 AA11 CA02 DB01 DB09 EE25                       FF11

Claims (24)

[Claims] 1. A light source device for generating white light, comprising at least one integral light emitting surface, and light emitting means for generating blue light obtained as a basis light from light emitted from the light emitting surface. A fluorescent pattern layer that outputs the white light by receiving the basic light, and in the fluorescent pattern layer, an R unit region in which a cell of an R fluorescent material that converts the basic light into the red light is formed, At least one three-primary-color unit block including a G unit region in which a cell of a G fluorescent material that converts the basic light into green light is formed, and a B unit region that transmits the basic light in a blue light state, RG
The unit areas B are arranged in parallel with the layer surface of the fluorescent pattern layer, and at least in the arrangement direction of the RGB unit areas,
The light source device, wherein the size of the unit block of the three primary colors is equal to or smaller than the size of the light emitting surface. 2. A light source device for generating white light, which has at least one integral light emitting surface, and which emits ultraviolet light obtained based on light emission from the light emitting surface as basic light. A fluorescent pattern layer that outputs the white light by receiving the basic light, and in the fluorescent pattern layer, an R unit region in which a cell of an R fluorescent material that converts the basic light into the red light is formed, At least 1 including a G unit region in which a cell of G fluorescent material that converts the basic light into green light is formed, and a B unit region in which a cell of a B fluorescent material that converts the basic light into blue light is formed. The three primary color unit blocks are provided in a state where the RGB unit areas are arranged in parallel to the layer surface of the fluorescent pattern layer, and at least in the arrangement direction of the RGB unit areas,
The light source device, wherein the size of the unit block of the three primary colors is equal to or smaller than the size of the light emitting surface. 3. The light source device according to claim 1 or 2, wherein the three primary color unit blocks are repeatedly arranged in the arrangement direction. 4. The light source device according to claim 3, wherein the three primary color unit blocks are periodically arranged in the repeating direction. 5. The light source device according to claim 3, wherein the three primary color unit blocks are repeatedly arranged in a plurality of directions parallel to the layer surface, and the size of the three primary color unit blocks in the plurality of directions. Is less than or equal to the size of the light emitting surface. 6. The light source device according to claim 5, wherein the three primary color unit blocks are arranged periodically in each of the plurality of directions. 7. The light source device according to claim 1, wherein the area of each of the RGB unit areas in the three primary color unit blocks is not the same. . 8. The light source device according to claim 1, wherein the light emitting means includes a semiconductor chip, and the fluorescent pattern layer is integrally formed on a main surface of the semiconductor chip. A light source device characterized by being provided. 9. The light source device according to claim 1, wherein the basic light from the light emitting means is incident on a side surface of the light guide plate and is arranged on a main surface of the light guide plate. A white light output device is obtained from the fluorescent pattern layer. 10. The light source device according to claim 1, wherein the fluorescent pattern layer is disposed on the light emitting surface, and output light from the fluorescent pattern layer is a light guide plate. The light source device is characterized in that it is incident on the side surface of the light source and is emitted from the main surface of the light guide plate. 11. A liquid crystal display device, wherein the light source device according to claim 9 or 10 is used as a backlight, and a liquid crystal display layer is disposed on the light guide plate. 12. The light source device according to any one of claims 1 to 8, wherein a plurality of the light emitting means are provided and arranged, and white light from the light source device is output as illumination light. Lighting equipment. 13. The lighting device according to claim 12, further comprising: a translucent cover having a plurality of arrays of the light emitting means housed in an internal space, wherein the fluorescent pattern layer serves as a fluorescent pattern sheet. A lighting device characterized by covering a cover. 14. The light source device according to claim 1, wherein a plurality of the light emitting means are provided, and the plurality of light emitting means are two-dimensionally arranged, and white light from the light source device is emitted. A notice lamp, which is used as a backlight for a transparent image sheet that is detachably attached to the output surface side of the fluorescent pattern layer. 15. An indicator lamp comprising: the light source device according to claim 1; and a color filter that receives white light from the light source device and converts the white light into color light. . 16. The indicator lamp according to claim 15, wherein the color filter is detachable. 17. A switching unit, a push button disposed on the switching unit to operate the switching unit, and a light emitting display unit visible through a button surface of the push button, A push-button switch, wherein the light emitting display unit is configured by using the light source device according to any one of claims 1 to 8. 18. A sheet that can be used in combination with a light emitting means having at least one integral light emitting surface, and that receives blue light from the light emitting means as basic light and outputs white light. An R unit region in which cells of R fluorescent material that convert light into red light are formed, a G unit region in which cells of G fluorescent material that convert the basic light into green light are formed, and the basic light is blue light The three primary color unit blocks including the B unit region that is transmitted in the state are repeatedly arranged in parallel to the layer surface of the fluorescent pattern layer, and one size of the three primary color unit blocks is arranged in the repeating direction. A fluorescent pattern sheet having a size equal to or smaller than the size of the light emitting surface. 19. A sheet which can be used in combination with a light emitting means having at least one integral light emitting surface, and which receives the ultraviolet light from the light emitting means as basic light and outputs white light. An R unit region in which cells of R fluorescent material that convert light into red light are formed, a G unit region in which cells of G fluorescent material that convert the basic light into green light are formed, and the basic light is blue light 3 primary color unit blocks including B unit regions in which cells of the B fluorescent substance to be converted into are formed repeatedly in parallel to the layer surface of the fluorescent pattern layer, and in the repeating direction, A fluorescent pattern sheet, wherein one size of the primary color unit block is equal to or smaller than the size of the light emitting surface. 20. The fluorescent pattern sheet according to claim 18 or 19, wherein each of the RGB unit areas is defined on a flexible base material layer. . 21. A method of manufacturing a fluorescent pattern layer, comprising: a first pattern forming step of forming a first repeating pattern containing a first fluorescent material on a predetermined surface; and a second fluorescent material on the predetermined surface. A second pattern forming step of forming a second repetitive pattern including: when n = 1, 2, each of the nth pattern forming steps includes (a) an nth pattern on the predetermined surface. Forming a resist layer containing a fluorescent material; (b) selectively developing the nth resist layer after exposing the nth resist layer; and (c) selectively forming the nth resist layer. To obtain the n-th repeating pattern as a residual portion of the n-th resist, and the first and second repeating patterns are displaced from each other in a direction parallel to the predetermined surface. Firefly characterized by being placed Method for producing a pattern layer. 22. The manufacturing method according to claim 21, further comprising a third pattern forming step of forming a third repeating pattern containing a third fluorescent material on the predetermined surface, the step (a) (C) is also executed for n = 3, and the third repeating pattern is arranged so as to be displaced from the first and second repeating patterns in a direction parallel to the predetermined plane. A method of manufacturing a fluorescent pattern layer. 23. A method of manufacturing a light source device, comprising the steps of: forming a structure having a semiconductor structure capable of generating blue light as basic light; Is applied as the predetermined surface, thereby forming a fluorescent pattern layer on the semiconductor structure. 24. A method of manufacturing a light source device, comprising the steps of forming a structure having a semiconductor structure capable of generating ultraviolet light as basic light; Is applied as the predetermined surface, thereby forming a fluorescent pattern layer on the semiconductor structure.