JP2003297710A - Treatment system and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment system and method which enables the acquisition of recording useful for investigating a change in the state of the processing system. <P>SOLUTION: The treatment system for treating a work piece W comprises a plurality of detection means 29, 30, 52, 65, and 87 for detecting the state of each part of the treatment system, and recording means 85, 86, 88, and 89 for recording information indicating the state of each part of the treatment system. The recording means 85, 86, 88, and 89 can change information to be recorded according to the state of each part of the treatment system. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing system and a processing method for processing a substrate such as a semiconductor wafer or a glass for an LCD substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, for example, a substrate processing apparatus for supplying a processing solution to a semiconductor wafer (hereinafter referred to as "wafer") to perform a predetermined processing, and a drying apparatus for drying the processed wafer. A processing system including the above is used. Such a processing system includes a transfer device for transferring a wafer to the substrate processing device, various devices arranged in the processing system, a control device for controlling the operation of the entire processing system, and a predetermined liquid transfer device for feeding the substrate processing device. Various devices such as a chemical liquid storage device for storing the treatment liquid are provided, and further, a detection means for detecting the state of each device is provided. For example, a substrate processing apparatus is provided with a thermometer for detecting the temperature of the processing liquid supplied to the substrate, a densitometer for detecting the concentration of the processing liquid, and the like. When the substrate processing apparatus is a POU type processing tank that stores the processing liquid and dips the substrate, a liquid level sensor that detects the height (position) of the liquid surface is installed. Further, a thermometer for detecting the temperature in the unit in which the substrate processing apparatus is installed, a pressure gauge for detecting the pressure of the atmosphere, and the like are installed. These detecting means are hard-wired to the control unit, and the detected value is transmitted to the control unit as an output signal so that the control unit can detect the state of the processing system. For example, when the control unit is connected to the temperature controller of the processing liquid as a control signal output means, the detected value is used as a feedback signal to maintain the temperature of the processing liquid at a predetermined temperature. There is. In addition, when a state in which a failure may occur during operation of the processing system is detected, for example, when the detected value exceeds a preset allowable value, an alarm is issued to the operator in preparation for the failure. . Then, the operator manually stops the processing system or the control unit automatically stops the occurrence of trouble.

On the other hand, the output signal from each detecting means is stored in a storage device such as a disk provided in the control unit as transition information indicating a state change in the apparatus, stored as readable data, and output for printing or the like. Is possible. That is, the log software for writing the information obtained as the output signal as a log in the log file is stored in the storage device in advance, and the control unit executes the log software during the operation of the processing system to change the transition information. To the log file. Then, when a failure occurs in the processing system, or when a failure is predicted while the processing system is operating and the operation is stopped, the log file that stores the state transition information of the processing system can be used for investigating the occurrence of the failure. Be utilized.

[0004]

However, in the conventional processing system, if the detailed transition information of the processing system is recorded in the log file, the used area of the storage capacity of the storage device becomes maximum in a short time, There has been a problem that the subsequent recording of transition information becomes impossible. On the other hand, since the transition information is taken for a long time, if only the main information is recorded in the log file in order to prevent the overflow of the storage capacity, it is useful in the investigation of the state change of the processing system, for example, the investigation about the failure occurrence. It was not possible to obtain a record with high quality.

Therefore, an object of the present invention is to provide a processing system and a processing method capable of obtaining a record which is highly useful in investigating the state change of the processing system.

[0006]

In order to solve the above problems, according to the present invention, there is provided a processing system for processing an object to be processed, comprising a plurality of detecting means for detecting the states of respective parts of the processing system. A processing system is provided, which is provided with a recording unit that records information representing the state, and the recording unit can change the information to be recorded according to the state. In this processing system, for example, only main information can be recorded while the processing system is operating normally, and detailed transition information can be recorded only when an important state change occurs. Therefore, the used area of the storage capacity of the storage device is not maximized in a short time. Also,
It is possible to obtain a highly useful record regarding the change in the state of the processing system.

Further, it is preferable that the recording means, when detecting a state in which a failure may occur, increase the amount of information to be recorded as compared with that before the detection. In this processing system, when an abnormal state occurs in a part of the processing system and develops into a failure, detailed transition information from the occurrence of the abnormal state to the occurrence of the failure can be recorded. Therefore,
It is possible to obtain records that are highly useful in investigating the cause of failure.

Further, it is preferable that the recording means, when detecting a state related to the occurrence of a failure, increases the amount of information to be recorded as compared with that before the detection. In this processing system, when an abnormal state occurs in the processing system and develops into a failure, detailed transition information can be recorded for the abnormal state that occurred first and the abnormal state induced by the abnormal state. . Therefore, it is possible to obtain a useful record in the investigation of the process in which the cause of failure develops into a failure.

[0009] It is preferable that the recording means, when detecting a state in which the fear of occurrence of the failure is eliminated, reduces the information to be recorded as compared with that before the detection. In this processing system, for example, when an abnormal state occurs in the processing system, but the failure can be prevented by the operation of the operator or the control function of the processing system, the abnormal state that occurs first and the abnormal state It is possible to record detailed transition information about the abnormal state induced by, and further record detailed transition information until the abnormal state is resolved. Therefore, it is possible to obtain a useful record when investigating the abnormal state and the process leading to its elimination.

The recording means preferably stores software for creating a log file. Further, it is preferable that the recording means changes a level according to the state and records information belonging to the level. In this case, the transition information to be recorded can be easily selected.

Further, according to the present invention, there is provided a method for processing an object to be processed by a processing system, characterized in that information representing the state is recorded according to a change in the state of each part in the processing system. A method of processing is provided. In this processing method, for example, only main information can be recorded during normal processing, and detailed transition information can be recorded during abnormal processing. . Therefore, since information is not excessively recorded while the processing is normally performed, it is possible to prevent the recording during the abnormal state of the processing from being buried in a large amount of transition information. As a result, the problems of the processing system and the processing method can be efficiently tracked.

In the present invention, it is preferable to increase the amount of information to be recorded when a state in which a failure may occur is detected. Further, it is preferable to increase the amount of information to be recorded when a condition related to the occurrence of a failure is detected. Furthermore, it is preferable to reduce the amount of information to be recorded when the state in which the possibility of the occurrence of the failure is eliminated is detected.

Further, the information is classified into a plurality of categories based on the cause of occurrence of the state, a level is created by combining the plurality of categories, the level is changed according to the state, and the level belongs to the level. It is preferable to record information. In this case, the transition information to be recorded can be easily selected.

Further, when classifying the information into a plurality of categories based on the cause of the occurrence of the state, the information may be classified based on a plurality of different constituent parts constituting the processing system. In this case, the transition information can be recorded based on the operating state of the constituent parts.

Furthermore, it is preferable to create the level based on an analysis of past operation information. For example, when a transition to a certain state is expected to occur next when a transition is made to a certain state, only information for knowing a sign of transition to the specific state is recorded. In this case, for example, it is possible to record detailed transition information regarding an abnormal state that occurs first when a failure may occur and an abnormal state related to the occurrence of a failure that is triggered by the abnormal state. Therefore, it is possible to obtain a useful record in the investigation of the process in which the cause of failure develops into a failure.

In the present invention, it is preferable to create a log file for recording the information. In this case, the transition information can be easily recorded by the control unit provided in the processing system.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below based on a processing system for processing a wafer as an example of a substrate. FIG. 1 is a perspective view showing a processing system 1 according to this embodiment, and FIG. 2 is a plan view thereof. As shown in FIGS. 1 and 2, the processing system 1 is
A loading / unloading section 2 for loading / unloading and storing the carrier C in which the wafer W is stored in a horizontal state; , And an interface section 3 for carrying the wafer W between the loading / unloading section 2 and the liquid processing section 4.
Furthermore, the processing system 1 includes a control unit 5 that controls the processing of the processing system 1 based on the output signals of various detection means that detect the states of the respective units of the processing system 1.

The loading / unloading unit 2 can store a predetermined number of wafers W, for example, 25 wafers W substantially horizontally at a predetermined interval, and one side surface thereof serves as a loading / unloading port for the wafer W, and this loading / unloading port is a lid. A predetermined number of carrier loading / unloading portions 6 in which a stage 11 for mounting a carrier C having a structure that can be opened and closed by a body is formed and a carrier holding member 13 for holding the carrier C are arranged, and a plurality of carrier holding members 13 are provided. The carrier stock section 7 is configured so that the carrier C can be stored. The carrier C in which the unprocessed wafer W mounted on the stage 11 is stored is carried into the carrier stock unit 7 by the carrier transfer device 12, while the carrier C in which the liquid-processed wafer W is stored is , Using the carrier transfer device 12 from the carrier stock section 7 to the stage 1
It is carried out to 1.

A shutter 14 is provided between the carrier loading / unloading unit 6 and the carrier stock unit 7, and the shutter 14 is used when the carrier C is transferred between the carrier loading / unloading unit 6 and the carrier stock unit 7. The carrier loading / unloading section 6 and the carrier stock section 7 are opened at other times.
The shutter 14 is kept closed so as to separate the atmosphere between the shutter 14 and the shutter.

The carrier transfer device 12 has, for example, an arm 12a such as an articulated arm or a telescopic arm which is driven so that at least the carrier C can be moved in the X direction. Holds the carrier C and carries the carrier C. Further, the carrier transfer device 12 can also be driven in the Y direction and the Z direction (height direction) by a Y-axis drive mechanism and a Z-axis drive mechanism (not shown). The carrier C can be placed on the holding member 13.

In FIG. 2, the carrier holding member 13 is provided in the vicinity of the wall surface forming the carrier stock portion 7, and is provided in a plurality of stages in the height direction at each location, for example, four stages. The carrier stock unit 7 plays a role of temporarily storing the carrier C in which the wafer W before liquid processing is stored and storing the carrier C in which the inside of the wafer W from which the wafer W is taken out is empty.

A window portion 16 is formed at the boundary between the carrier stock portion 7 and the interface portion 3, and the lid of the carrier C faces the window portion 16 on the side of the carrier stock portion 7 of the window portion 16. An inspection / loading / unloading stage 15 having the same structure as the carrier holding member 13 is provided so that the carrier C can be placed. The carrier transfer device 12 may hold the carrier C for a predetermined time in a predetermined space facing the window 16 without disposing the inspection / loading / unloading stage 15. On the side of the carrier stock 7 of the window 16, inspection /
A lid opening / closing mechanism 17 for opening and closing the lid of the carrier C placed on the carry-in / out stage 15 is provided, and by opening the window 16 and the lid of the carrier C, the carrier The wafer W in C can be carried out to the interface section 3 side, and conversely, the wafer W can be carried in from the interface section 3 side into the empty carrier C. In addition, the lid opening / closing mechanism 17 includes the window 1
6 may be provided on the interface section 3 side.

On the interface section 3 side of the window section 16,
A wafer inspection device 18 for counting the number of wafers W in the carrier C is provided. Wafer inspection device 18
Is, for example, an infrared sensor head having a transmitter and a receiver is scanned in the Z direction in the vicinity of the X direction end of the wafer W housed in the carrier C, while transmitting infrared rays between the transmitter and the receiver. The number of wafers W is inspected by detecting the signal of light or reflected light. Here, the wafer inspecting device 18 performs the inspection of the number of the wafers W in parallel with the storage state of the wafers W, for example, whether or not the wafers W are arranged in the carrier C one by one in parallel at a predetermined pitch. It is preferable to use a wafer W having a function of detecting whether or not the wafer W is deviated from the step and is not stored obliquely. Also, after confirming the stored state of the wafer W,
The same sensor may be used to detect the number of wafers W. The wafer inspection apparatus that inspects only the number of the wafers W is used, for example, when a step difference of the wafers W in the carrier C or the like rarely occurs in experience. The wafer detection device for inspecting can be used, for example, when the number of stored wafers W is deficient and empirical, and it occurs only a very small number of times. The wafer inspection device 18 is connected to the controller 5 by wiring as a signal input device, and transmits the detected number of stored sheets and the stored state as an output signal to the controller 5.

Carrier transfer device 12 and wafer inspection device 1
The operation of the control unit 8 is controlled by the control unit 5. For example, the control unit 5 controls the carrier transfer device 12 so that the carrier C is stored in the carrier stock unit 7 after the number of wafers W in the carrier C is inspected by the wafer inspection device 18. The control unit 5 controls the opening / closing of the shutter 14, the opening / closing of the window 16, and the operation of the lid opening / closing mechanism 17 in conjunction with the movement of the carrier transfer device 12.

The interface unit 3 is provided with a wafer loading / unloading device 19, a wafer transfer device 21, and a wafer transfer device 22. The wafer transfer device 21 includes:
Attitude conversion mechanism 21 for transferring the wafer W to and from the wafer loading / unloading device 19 and for converting the attitude of the wafer W
a, a vertical wafer holding mechanism 21b for transferring the wafer W between the posture changing mechanism 21a and the wafer transfer device 22.
It consists of

The wafer loading / unloading device 19 unloads the wafer W in the carrier C through the window portion 16 to move the attitude changing mechanism 21.
Further, the wafer W that has been transferred to a and has undergone the liquid processing is received from the posture changing mechanism 21a and carried into the carrier C.
The wafer loading / unloading device 19 has two systems of arms: an arm 19a for carrying an unprocessed wafer W and an arm 19b for carrying a liquid-processed wafer W.
a. 19b is a carrier C so that a plurality of wafers W accommodated in the carrier C can be collectively held.
A predetermined number of the wafers W are arranged in the Z direction at predetermined intervals in conformity with the arrangement pitch of the wafers W therein. Further, in the state shown in FIG. 2, the arms 19a and 19b are movable (slide) or extendable in the arrow A direction, and Z
It is possible to move up and down in a predetermined direction. Further, the entire wafer loading / unloading device 19 is configured to be rotatable in the θ direction, so that the arms 19a and 19b can be mounted on either the carrier C mounted on the inspection / loading stage 15 or the attitude changing mechanism 21a. Is also accessible.

The driving mode of the wafer loading / unloading device 19 is as follows, for example. First, in a state where the arm 19a is on the wafer transfer device 21 side and the arrow A direction coincides with the X direction, the arm 19a is moved (slide) or extended and inserted into the lower side of the wafer W.
Is lifted by a predetermined distance to hold the wafer W on the arm 19a, and then the arm 19a is moved (slide) or contracted in the opposite direction to carry out the wafer W in the carrier C. Next, the entire wafer loading / unloading device 19 is rotated 90 degrees (°) counterclockwise in FIG.
The wafer W held by the arm 19a can be transferred to the posture changing mechanism 21a by moving (sliding) or expanding and contracting the arm 19a in the same direction as the arm 19a on the side of the liquid processing unit 4. . On the other hand, in a state where the arrow A direction coincides with the Y direction and the arm 19b is on the liquid processing unit 4 side, the arm 19b is moved (slide) or expanded / contracted to move the liquid processed wafer W from the posture changing mechanism 21a. After the removal, the entire wafer loading / unloading device 19 is rotated clockwise by 90 ° in FIG. 2 so that the arrow A direction and the X direction are aligned with each other, and the arm 19b is on the wafer transfer device 21 side. By moving (sliding) or expanding / contracting 19b, the arm 19
The wafer W held by b can be carried into the empty carrier C.

The transfer of the wafer W using the wafer loading / unloading device 19 is carried out with the wafer W in a substantially horizontal state, but the cleaning of the wafer W needs to be carried out with the wafer W in a substantially vertical state. At 21a, the attitude of the wafer W is changed. The attitude changing mechanism 21a has, for example, a guide member or the like in which grooves or the like for holding the wafers W are formed in accordance with the arrangement pitch of the wafers W in the wafer loading / unloading device 19, and the guide members and the like are plural. Wafer W
The wafers W are converted from the horizontal state to the vertical state by holding the wafer and rotating it by about 90 ° in a predetermined direction. The wafer W thus converted into the vertical state is transferred to the wafer transfer device 2
The wafer vertical holding mechanism 21
Handed over to b.

The wafer vertical holding mechanism 21b includes a carrier C.
The wafer W has a structure in which the groove portions are formed so that the wafers W can be housed at an arrangement pitch that is half the wafer arrangement pitch in the inside, and a total of 50 wafers W housed in the two carriers C are stored. It can be stored. In this way, the wafers W stored in the two carriers C can be simultaneously subjected to liquid processing. The wafer vertical holding mechanism 21b is provided between a position where the wafer W can be transferred to and from the attitude changing mechanism 21a and a position where the wafer W can be transferred to and from the chucks 28a to 28c of the wafer transfer device 22. Wafer W that is slidable and is almost vertical
Holding the wafer W on the lower side of the wafer W, the chuck 28 of the wafer transfer device 22 is slid toward the wafer transfer device 22 side.
It has a structure that does not collide with a to 28c.

Wafer W in Wafer Transfer Device 21
The arrangement pitch is adjusted as follows, for example. First, 25 wafers W from the first carrier C are transferred to the posture changing mechanism 21a by the wafer loading / unloading device 19. Next, the posture changing mechanism 21a changes the posture of the wafer W into a substantially vertical state and transfers it to the wafer vertical holding mechanism 21b. At this time, the arrangement pitch of the wafers W transferred to the wafer vertical holding mechanism 21b is the same as the arrangement pitch in the carrier C. Subsequently, 25 wafers W from the second carrier C are transferred to the posture changing mechanism 21a by the wafer loading / unloading device 19. After that, the posture conversion mechanism 21
At a, the attitude of the wafer W is changed to a substantially vertical state and is transferred to the wafer vertical holding mechanism 21b. At this time, the position of the wafer vertical holding mechanism 21b is shifted in the arrangement direction of the wafer W by a distance of half the arrangement pitch. Thus, the wafer W can be held in the wafer vertical holding mechanism 21b at an arrangement pitch that is half the arrangement pitch in the carrier C.

The wafer transfer device 22 transfers the wafer W in the vertical state to and from the vertical wafer holding mechanism 21b, carries in the unprocessed wafer W to the liquid processing section 4, and conversely ends the liquid processing. The carried wafer W is unloaded from the liquid processing unit 4,
The wafer is vertically transferred to the vertical holding mechanism 21b. In the wafer transfer device 22, the wafer W has three chucks 28 a-2.
It is held by 8c. The wafer transfer device 22 transfers the wafer W to and from the wafer vertical holding mechanism 21b,
Further, the wafer transfer device 22 moves in the X direction along the guide rails 23 so that the wafer W can be transferred to the liquid processing unit 4 and can enter / exit the liquid processing unit 4. Has become.

The wafer W is transferred between the wafer vertical holding mechanism 21b and the wafer transfer device 22 in order to confirm whether the wafer W after the liquid processing is damaged or displaced. A wafer detection sensor 27 for inspecting the arrangement state of the wafers W is provided at the position. The wafer detection sensor 27 is not limited to such a position and may be any position as long as the wafer W can be inspected after the liquid processing and before being transferred to the wafer loading / unloading position 19. The wafer detection sensor 27 is wire-connected to the control unit 5 as a signal input device, and transmits the detected value as an output signal to the control unit 5.

The interface section 3 has a parking area 10 beside the place where the wafer W is transferred between the wafer vertical holding mechanism 21b and the wafer transfer device 22.
a is provided, and, for example, an unprocessed wafer W can be made to wait in this parking area 10a. For example, when the wafer W of a lot having the liquid treatment or the drying treatment is performed and it is not necessary to operate the wafer transfer device 22, the wafer W to be next subjected to the liquid treatment is set in the parking area 10.
It is transported to a. As a result, compared with, for example, the case where the wafer W is transferred from the carrier stock unit 7, it is possible to shorten the time required to move the wafer W to the liquid processing unit 8 and improve the throughput.

The liquid processing unit 4 is composed of a liquid processing unit 8, a drying unit 9 and a parking area 10b.
The liquid processing unit 8 and the parking area 10b are arranged in this order. The wafer transfer device 22 can be moved in the liquid processing section 4 along a guide rail 23 extending in the X direction.

The parking area 10b, like the parking area 10a, is a place for waiting an unprocessed wafer W. The wafer W to be started next is transferred to the parking area 10b by using the time when the wafer W of the lot having the liquid processing or the drying processing is performed and it is not necessary to operate the wafer transfer device 22. To be done. Since the parking area 10b is adjacent to the liquid processing unit 8, it is possible to shorten the moving time of the wafer W when starting the liquid processing and improve the throughput.

As shown in FIG. 2, the liquid processing unit 8 includes the substrate processing apparatus 3 from the parking area 10b side.
1, 32, 33, 34, 35 and 36 are arranged in order. Further, a transfer device 37 for transferring the wafer W between a chemical solution tank in the substrate processing apparatus 31 (chemical solution tank 48 described later) and a washing tank in the substrate processing apparatus 32, and a chemical solution tank in the substrate processing apparatus 33. A transfer device 38 for transferring the wafer W to and from the water washing tank in the substrate processing apparatus 34, and a wafer W between the chemical bath in the substrate processing apparatus 35 and the water washing tank in the substrate processing apparatus 36. The transport device 39 of FIG.

For example, the chemical solution tank in the substrate processing apparatus 31 stores a chemical solution for removing organic dirt and surface metal impurities. As a chemical solution for removing organic dirt and surface metal impurities, for example, an SPM solution (mixed solution of concentrated sulfuric acid and hydrogen peroxide solution) heated to about 130 ° C. is stored. Further, a chemical solution for removing adhered substances such as particles, for example, SC-1 solution (a mixed solution of ammonia, hydrogen peroxide and water) is stored in the chemical solution tank in the substrate processing apparatus 33. An etchant for etching the oxide film formed on the surface of the wafer W, for example, dilute hydrofluoric acid (DHF) is stored in the chemical bath in the 35. As the etching solution, in addition to dilute hydrofluoric acid,
It is also possible to use a mixture of hydrofluoric acid (HF) and ammonium fluoride (buffered hydrofluoric acid (BHF)). When etching the nitride film formed on the surface of the wafer W, phosphoric acid can be used as an etching solution. The water washing tanks in the substrate processing devices 32, 34, 36 remove chemicals adhering to the wafer W by liquid treatment in the chemical liquid baths in the substrate processing devices 31, 33, 35, respectively. Various washing methods such as dump rinse are used.

The transfer device 37 has a drive mechanism capable of moving up and down in the Z direction, and lowers the wafer W transferred from the wafer transfer device 22 to immerse it in the chemical bath in the substrate processing device 31 for a predetermined time. After the lapse of time, the wafer W is moved in parallel with the X direction, so that the wafer W is immersed in a washing bath in the substrate processing apparatus 32, held for a predetermined time, and lifted. The wafer W that has been processed in the washing tank in the substrate processing apparatus 32 is once transferred to the chuck 28 of the wafer transfer apparatus 22.
After being returned to a to 28c, the wafer is transferred from the wafer transfer device 22 to the transfer device 38. The transfer devices 38 and 39 have the same configuration as the transfer device 37 and operate in the same manner. The wafer W is transferred between the wafer transfer device 22 and the transfer devices 37 to 39, respectively.
It is preferable to carry out on the washing tank in 34 and 36. This is to transfer the wafer transfer device 22 to the substrate processing devices 31, 33, 3
This is to prevent the wafer transfer device 22 from being contaminated and damaged by the vapor of the chemical liquid when it is stopped at the upper part of the chemical liquid tank in 5.

The liquid processing unit 8 includes the liquid processing unit 8
Liquid processing unit thermometer 29 for detecting the temperature of the internal atmosphere
And a liquid processing unit pressure gauge 30 for detecting the pressure. The liquid processing unit thermometer 29 and the liquid processing unit pressure gauge 30 are wired and connected to the control unit 5 as signal input devices, and respectively send the detected temperature and pressure to the control unit 5 as output signals.

The drying unit 9 is provided with a washing tank 24 and a chuck cleaning mechanism 26 for cleaning the chucks 28a to 28c of the wafer transfer device 22. Above the washing tank 24, for example, isopropyl alcohol (IPA) is provided. Is provided with a drying chamber (not shown) for drying the wafer W. Further, a transfer device 25 for transferring the wafer W is provided between the washing tank 24 and the drying chamber, and the wafer W washed in the washing tank 24 is pulled up by the transferring device 25 and IPA dried in the drying chamber. It is like this. The transfer device 25 has the same structure as the transfer device 37 described above except that it cannot move in the X direction, and can transfer the wafer W to and from the wafer transfer device 22.

Next, a substrate processing apparatus 31 for removing organic stains and surface metal impurities from the wafer W with a chemical solution having a predetermined concentration will be described. FIG. 4 is an explanatory diagram of a circuit system of the substrate processing apparatus 31 when the chemical liquid is circulated and circulated. Chemical bath 48 provided in the substrate processing apparatus 31
Is composed of a box-shaped inner tank 50 and an outer tank 51 having a size large enough to accommodate the wafer W. The upper surface of the inner tank 50 is open, and the wafer W is opened through the opening on the upper surface.
Is inserted into the inner tank 50. The outer tank 51 is the inner tank 50
The inner tank 50 is mounted so as to surround the opening so as to receive the chemical solution overflowing from the upper end of the inner tank 50. Further, the liquid level of the chemical liquid stored in the outer tank 51 is provided with a liquid level sensor 52 for measuring the position of the liquid level.
The liquid level sensor 52 is wired and connected to the control unit 5 as a signal input device, and transmits the detected position of the liquid level to the control unit 5 as an output signal.

A wafer W is provided between the inner tank 50 and the outer tank 51.
A circulation supply circuit 54 is connected to supply and circulate the chemical solution during the etching process. This circulation supply circuit 5
One of the four is connected to the bottom surface of the outer tank 51, a pump 56, a temperature control unit 58, and a filter 60 are sequentially arranged in the middle of the circulation supply circuit 54, and the other of the circulation supply circuit 54 is inside the inner tank 50. Connected to the nozzle. Therefore, the inner tank 5
The chemical liquid that has overflowed from 0 to the outer tank 51 flows into the circulation supply circuit 54, passes through the temperature control unit 58 and the filter 60 in this order by the operation of the pump 56, is temperature-controlled and cleaned, and then passes through the nozzle again to the inner tank 50. It will be supplied inside. The nozzle is located below the outer tank 51,
It is configured to supply the chemical liquid toward the surface of the wafer W.

The temperature control unit 58 prevents the chemical liquid in the inner tank 50 from becoming lower or higher than the predetermined processing temperature before the chemical liquid supplied from the circulation supply circuit 54 into the inner tank 50 before the immersion of the wafer W. It has the function of cooling or heating in advance. In this way, the pre-cooled or heated chemical solution is supplied to the inner tank 5
By supplying to the inside of 0, it becomes possible to maintain the temperature of the chemical liquid in the inner tank 50. Further, the temperature control unit 58 is connected to the control unit 5 by wiring as a signal output device and receives the control signal output from the control unit 5. For example, the temperature control unit 58 is composed of a heater, a heat exchanger, and a cooling water supply means, and a valve and a heater arranged in the middle of a cooling water supply path for introducing cooling water into the heat exchanger control the heater. Part 5
It is connected to the. Then, based on this transmission, the control unit 5 is configured to transmit a predetermined control signal to either the heater or the valve as needed.

In the middle of the circulation supply circuit 54, a branch pipe 62 for connecting the chemical liquid in the circulation supply circuit 54 to the outer tank 51 is connected, and the branch pipe 62 detects the temperature and concentration of the chemical liquid. A concentration / temperature detection unit 65 is provided for this purpose. The concentration / temperature detection unit 65 is connected to the control unit 5 as a signal input device by wiring. The concentration / temperature detection unit 65 includes a thermometer that detects the temperature of the chemical liquid and a concentration meter that detects the concentration of the chemical liquid, and sends the detected temperature and concentration to the control unit 5 as output signals.

The branch pipe 62 is thinner than the pipe of the circulation supply circuit 54, and the diameter of the branch pipe 62 is 1/3 of the diameter of the circulation supply circuit 54, for example. In this case, since turbulent flow can be prevented, even if an ultrasonic densitometer is used in the concentration / temperature detection unit 65, the ultrasonic waves used for measuring the concentration are not affected by the turbulent vortex. Further, the influence of the pressure fluctuation of the chemical liquid caused by the driving of the pump 56 on the measurement of the concentration is suppressed. Therefore, highly accurate concentration measurement is possible.
The upstream end of the branch pipe 62 may be connected to the drain line of the filter 60 so that the chemical liquid that has passed through the filter 60 may flow into the outer tank 51 from the drain line.

The chemical liquid tank 48 is provided with a chemical liquid supply circuit 70 for filling the chemical liquid into the chemical liquid tank. Chemical supply circuit 7
Reference numeral 0 includes a chemical solution supply source 71, a pure water supply source 72, and a mixing supply unit 73 for mixing the chemical solution and pure water. The mixing supply unit 73 is connected to the control unit 5 as a signal output device by wiring. The chemical solution supply circuit 70 has a function as a chemical solution replenishing means, and controls the chemical solution to be supplemented from the chemical solution supply source 71 and the pure water supply source 72 when the concentration of the chemical solution in the chemical solution tank 48 decreases. To be done.

As shown in FIG. 4, the mixture supply unit 73 includes a chemical solution major tank 80 for storing the chemical solution supplied from the chemical solution supply source 71 and pure water for storing the pure water supplied from the pure water supply source 72. The measuring tank 81 and the mixing valve 82 are provided. For example, the chemical measure tank 80 can store a predetermined amount of chemical solution, and the pure water measure tank 81 can store a predetermined amount of pure water.
By mixing these stored treatment liquids in the mixing valve 82, a chemical liquid having a desired mixing ratio can be prepared,
From the chemical liquid supply circuit 70 connected to the mixing valve 82 to the chemical liquid tank 4
8 can be supplied. As described above, the chemical liquid major tank 80 and the pure water major tank 81 play a role of measuring the liquid amount by storing the treatment liquid. The other end of the chemical solution supply circuit 70 is connected to the outer tank 51, and the adjusted chemical solution once flows through the circulation supply circuit 54,
After the temperature is adjusted, the wafer W is supplied from below the inner tank 50.

The above is the configuration and function of the substrate processing apparatus 31, but the substrate processing apparatuses 33 and 35 in the liquid processing unit 8 are described.
Also, since it has almost the same configuration and function as the substrate processing apparatus 31, the description thereof will be omitted. The substrate processing apparatus 33 includes a chemical bath 48 ', an inner bath 50', an outer bath 51 ', and a liquid level sensor 5
2 ', a circulation supply circuit 54', a temperature / concentration detector 65 'equipped with a thermometer and a concentration meter, and a chemical solution supply circuit 70' for supplying, for example, SC-1 solution to the chemical solution tank. The substrate processing apparatus 35 includes a chemical solution tank 48 ″, an inner tank 50 ″, an outer tank 51 ″, a liquid level sensor 52 ″, a circulation supply circuit 54 ″, a temperature / concentration detection unit 65 ″ having a thermometer and a concentration meter, a chemical solution. It has a chemical solution supply circuit 70 ″ for supplying an etching solution to the bath. Further, the substrate processing apparatus 32, 34, 36 having a washing bath,
They have the same configuration and function as each other. That is, it has a washing tank including an inner tank and an outer tank and a circulation supply circuit, and pure water is supplied from the pure water supply circuit to the washing tank.

As described above, the processing system 1
Is provided with various detecting means for detecting the state of each component of the processing system 1. Here, the constituent part means each part such as the interface part 3, the control part 5 and the like constituting the treatment system 1, the liquid treatment unit 8, the unit such as the drying unit 9 and the constituent devices constituting each of these units, for example, Substrate processing apparatus 31 installed in the liquid processing unit 8
Devices such as ~ 36. For example, the liquid processing unit 8
A liquid treatment unit thermometer 29 and a liquid treatment unit pressure gauge 30 are installed as detection means for detecting the state of the internal atmosphere. Further, as the detection means for detecting the state of each part of the substrate processing apparatus 31, a liquid level sensor 52, a thermometer and a densitometer of a temperature / concentration detection part 65 are installed. Similarly, as the detection means for detecting the state of the substrate processing apparatus 33, a liquid level sensor 52 ', a thermometer and a densitometer of a temperature / concentration detection unit 65' are installed. As the detection means for detecting the state of the substrate processing apparatus 35, the liquid level sensor 52 ″,
A thermometer and a densitometer of the temperature / concentration detection unit 65 ″ are installed. In addition, a wafer inspection device 18 is installed in the interface unit 3 as a detection unit for detecting the storage state of the wafer W, and the wafer W array is arranged. A wafer detection sensor 27 is installed as a detection means for detecting the state.

Wafer inspection device 18, wafer detection sensor 2
7. Liquid treatment unit thermometer 29, liquid treatment unit pressure gauge 30, liquid level sensors 52, 52 ', 52 ", thermometers and densitometers installed in temperature / concentration detectors 65, 65', 65" , Is connected to the control unit 5 as a signal input device. The wafer inspection device 18 detects the number of wafers W, the wafer detection sensor 27 detects the array state of the wafers W, the liquid processing unit thermometer 29 detects the temperature of the atmosphere in the liquid processing unit 8, and the liquid processing unit The pressure gauge 30 detects the pressure of the atmosphere in the liquid processing unit 8, and the liquid level sensor 52,
52 ′ and 52 ″ detect the liquid surface positions of the outer tanks 51, 51 ′ and 51 ″, and detect the temperature / concentration detection units 65 and 65 ′,
The thermometer provided in the 65 "detects the temperature of each chemical liquid flowing in the circulation supply circuit 54, and detects the temperature / concentration detection unit 6
The densitometers provided in 5, 65 ′ and 65 ″ detect the concentration of each chemical liquid flowing in the circulation supply circuit 54 and transmit the detected value to the control unit 5 as an output signal.

The control unit 5 includes a wafer inspection device 18, a wafer detection sensor 27, a liquid processing unit thermometer 29, a liquid processing unit pressure gauge 30, liquid level sensors 52, 52 ', 52 ",
The output signals of the thermometer and the densitometer installed in each of the temperature / concentration detectors 65, 65 ', 65 "are received. Further, the control unit 5 receives the output signals at predetermined time intervals, and the processing system The control unit 5 can detect a change in state of each part of the processing system, and the control unit 5 can detect a detection signal that exceeds an allowable value. Then, the built-in warning function gives an alarm to the operator.

As shown in FIG. 3, the control unit 5 includes a storage device 8 for storing data necessary for controlling the wafer W process.
5, an information processing device 86 that performs information processing for controlling the process based on the data of the storage device 85 and the detection signal, a timer 87 with a built-in control unit that measures the time when the process starts and the time when the process ends And an input / output device 88 for transmitting the output signal of the detection means as a detection signal to the storage device 85 and the information processing device 86. Storage device 85, information processing device 86, control unit built-in timer 87,
The input / output devices 88 are mutually connected by the connecting means 89, and signals can be mutually transmitted and received. The recording means according to the present embodiment includes a storage device 85, an information processing device 8
6, an input / output device 88 and a connecting means 89.

The storage device 85 stores in advance log software for creating a log file. Here, the log file is a file in which various detection signals representing the state of each part of the processing system 1 are written as detection information (log). The log file in which the state transition information of the processing system 1 is written is stored in the storage device 85 and can be called as output data. The log software is
The detection signal is designed to be stored in the storage device 85 as detection information according to the format of the log file. Further, the detection signal is written into the log file momentarily as detection information, and the state transition information is stored in the storage device 85 according to the format of the log file. The information processing device 86 has a function of storing the detection information in the storage device 85. That is, the log software stored in the storage device 85 is executed, and information processing for writing the detection signal as detection information in the log file is performed. The control unit built-in timer 87 is a detection means for detecting time,
The detection signal is transmitted to the information processing device 86 and the storage device 85. For example, the processing start time when the processing is started, the processing elapsed time after the processing is started, the processing end time when the processing is finished, and the time are transmitted to the storage device 85 as detection signals. The input / output device 88 receives, as an input signal, the output signal transmitted from the detection unit connected to the control unit 5 as a signal input device, and uses the input signal as a detection signal via the connection unit 89 and the information processing apparatus. To the device 86.

When the log software is executed by the information processing device 86 during the operation of the processing system 1, the liquid processing unit thermometer 29 detected via the input / output device 88.
Temperature detection signal from the liquid processing unit pressure gauge 30, liquid level position detection signal from each liquid level sensor 52, 52 ', 52 ", each temperature / concentration detection unit 65, 6
Temperature detection signals from thermometers installed at 5 ', 65 ",
Concentration detection signals from densitometers installed in the temperature / concentration detectors 65, 65 ′, 65 ″, wafer W number detection signals from the wafer inspection device 18, and wafer W array state detection from the wafer detection sensor 27. The signal and the time detection signal of the control unit built-in timer 87 become detection information (input data) written in the log file by the log software, and temperature detection information in the liquid processing unit 8 and pressure detection in the liquid processing unit 8. Information, liquid surface position detection information of the outer tank 51,
Temperature detection information of the chemical liquid in each circulation supply circuit 54, 54'54 ", concentration detection information of the chemical liquid in each circulation supply circuit 54, 54'54", wafer number detection information, wafer W array state detection information The time detection information is recorded in the log file every moment, and is saved as transition information indicating the state change of the processing system 1. The log file in which the state transition information of the processing system 1 is saved is used to investigate the occurrence of a failure when the processing system 1 has a failure, or when the processing system 1 is predicted to fail and stops operating. Be utilized for.

Here, a process in which a failure occurs in the processing system 1 will be described. First, the root cause of the first abnormal condition occurs. Various causes are expected to be the root cause, for example, the occurrence of a crack in a pipe, which will be described later, and the adhesion of the chemical liquid to the wafer W when the chemical liquid is lifted from the chemical liquid tank. As a result, for example, an abnormal state such as a drop in the liquid level in the chemical liquid tank occurs and is detected by any of the detecting means. Then, new abnormal conditions are caused one after another by the root cause, and if left unattended, a final failure occurs. Note that the root cause is not limited to one and may be multiple. As the abnormal state of each component of the processing system 1, for example, various things such as processing delay, liquid leakage of the chemical liquid supply circuit and circulation supply circuit, chemical liquid temperature control abnormality, chemical liquid abnormal reaction, etc. are assumed. Various forms such as a fire and an explosion of the processing system 1 are assumed as a final failure that occurs in the operation of the processing system 1.

The log software classifies the detection information indicating the state of each component of the processing system 1 into a plurality of categories based on the cause of the detection information. That is,
The detection information related to the same abnormal state is classified into the same category. Also, categories can be created in any number. Furthermore, one piece of detection information may be classified so as to belong to two or more categories. It should be noted that these categories may be classified based on the components in which the detection means is installed. That is, the detection information obtained from the detection means installed in the same constituent device is classified into the same category, or the detection information obtained from the detection means installed in the same unit is classified into the same category. Is also good. Further, the categories may be classified according to the characteristics of the process. For example, when an abnormal state in which the chemical liquid is erroneously supplied to the washing tank of the substrate processing apparatus 32 is assumed, it is necessary to create a category for detecting the abnormal state in the processing liquid supply process. The log software according to the present embodiment classifies 14 pieces of detection information into four categories K1, K2A, K2B, K3, and K4, as shown in tables shown in FIGS.

The root cause of the abnormal state that occurs during the operation of the processing system 1 can be clarified by investigating the transition of one or a plurality of abnormal states. That is,
When a log file is used for tracing the state transitions of the abnormal states that occur one after another and for investigating the root cause, it is sufficient to record one or more categories in the log file. On the other hand, in the operation of the processing system 1, regarding various failures that occurred in the past, when detailed transition information from the first abnormal state occurrence to the failure occurrence is recorded, these are analyzed, and each failure is analyzed. It is possible to create a table of abnormal state occurrence processes up to, that is, a state transition table leading to each failure. The state transition table is
It is also possible to create an arbitrary number for each failure. Therefore, the log software further divides the categories into groups based on such a state transition table. That is, when a state transition table up to a specific failure is created, the categories to which the detection information for detecting each abnormal state during the state transition belongs are classified as the same group. Therefore, in any category within the same group, detection information that serves as a material for identifying the root cause when this group is recorded as transition information in a log file is hidden. It should be noted that the category in which the detection information, which is a material for investigating the root cause, is hidden is not limited to one, and it may be hidden in a plurality of categories. In the present embodiment, for example, as shown in the table shown in FIG. 7 which will be described later in detail, four categories K1, K2A, K2 are provided.
B, K3, and K4 are grouped into four groups in an overlapping manner.

Furthermore, the log software sets the log level for the category in each group based on the state transition table created from the analysis of past operation information. Here, the log level is a hierarchy of logs (detection information) left in the storage device 85. That is, when there is detection information obtained from the processing system 1, for example, at the log level L1, only the processing start time (log 1) and the processing end time (log 2) classified into the category K1 are stored. At the log level L2, in addition to the process start time (log 1) and the process end time (log 2) classified into the category K1, the chemical concentration in the circulation supply circuit 54 (log 3) classified into the category K2A, The chemical concentration (log 4) in the circulation supply circuit 54 ′ and the chemical concentration (log 5) in the circulation supply circuit 54 ″ are stored. When the log level L3 is set, the liquid treatment unit is added to the log level L2. The temperature (log 6) in 8 and the pressure (log 7) in the liquid processing unit 8 are stored in this manner. In the present embodiment, as shown in the table of FIG. 7 which will be described later in detail, three log levels L1, L2, L are set for each category in the four groups. 3. That is, there are four patterns P1, P2, P3, P4 for setting the log levels L1, L2, L3 for each category K1, K2A, K2B, K3, K4. The number of log level layers can be arbitrarily set for each group.

When the log software is executed, patterns P1 and P are generated according to the state of each component of the processing system 1.
It is possible to change the log level to any of the log levels L1, L2, and L3 according to any one of P2, P3, and P4, and record the log in the category belonging to the log level in the log file. In this case, the patterns P1, P2, P
By selecting any one of P3 and P4, the detection information to be recorded can be easily selected according to the state of each component of the processing system 1. That is, it is possible to select and record only the detection information of the abnormal state and the detection information that can investigate the root cause of the abnormal state. Further, by selecting the log level, it is possible to easily increase or decrease the amount of detection information to be recorded according to the state of each component of the processing system 1. For example, a trigger for changing the log level can be set, and when the trigger newly occurs, the log level is raised and the detection information related to the abnormal state can be recorded. Conversely, when a trigger that lowers the log level occurs, the log level can be lowered and only the necessary detection information can be recorded. The trigger is, for example, a detection signal detected as a value exceeding a preset allowable value.

FIGS. 5 and 6 show the categories of the names of the constituent parts of the processing system 1, the name of the detecting means for detecting the state of each part of the processing system 1, and the categories of detection information. Is a table composed of columns of names, and shows the detection information detected by each detection means classified into each category K1, K2A, K2B, K3, K4 and detected by the control unit 6. The interface section 3, the control section 5, the liquid processing unit 8, and the substrate processing apparatuses 31, 33, and 35 are shown in the column of the name of the constituent section. In the column of the name of the detecting means, the wafer inspection device 18, the wafer detection sensor 27, the control unit built-in timer 87, the liquid processing unit thermometer 29, the liquid processing unit pressure gauge 30, and the temperature / concentration detecting unit 65 of the substrate processing device 31. , A liquid level sensor 52 and a thermometer installed in the temperature / concentration detection unit 65, a concentration meter installed in the temperature / concentration detection unit 65 ′ of the substrate processing apparatus 32, a liquid level sensor 52 ′, and Temperature / concentration detector 65 '
A thermometer installed in the temperature sensor, a concentration meter installed in the temperature / concentration detection unit 65 ″ of the substrate processing apparatus 33, a liquid level sensor 52 ″, and a thermometer installed in the temperature / concentration detection unit 65 ″. The detection information includes the time, the processing elapsed time, the processing start time, the processing end time, the concentration of the chemical liquid in the circulation supply circuit 54 of the substrate processing apparatus 31, the liquid surface position of the chemical liquid in the outer tank 51, and the chemical liquid in the circulation supply circuit 54. Temperature, chemical concentration in circulation supply circuit of substrate processing apparatus 33, liquid surface position of chemical solution in outer tank and chemical temperature in circulation supply circuit, chemical concentration in circulation supply circuit of substrate processing apparatus 35, chemical solution in outer tank Surface position and chemical liquid temperature in circulation supply circuit, internal temperature of liquid processing unit 8, liquid processing unit 8
The internal pressure, the number of wafers W, and the arrangement state of the wafers W are shown.

The elapsed processing time classified into the category K1 is the elapsed time since the wafer W was immersed in the chemical solution in each chemical solution tank of the substrate processing apparatus 31, 33, 35, and the wafer W was processed by the solution processing unit 8. This is the time elapsed since the item was delivered.
At the processing start time, the wafer W is processed by the substrate processing apparatus 31, 33,
The wafer W was carried into the liquid processing unit 8 during the time when the wafer W was immersed in the chemical liquid in each of the chemical liquid tanks 35, and the time when the wafer W was immersed in the pure water in the water washing tanks in the substrate processing apparatuses 32, 34, and 36. It's time. The processing end time is the time when the wafer W is pulled up from the chemical solution, the time when it is pulled up from pure water, and the time when the wafer W is unloaded from the liquid processing section 4. From the detection information classified into the category K1, the processing system 1
It is possible to detect the progress state of the processing in. When the detection information classified into the category K1 is recorded in the log file, for example, a processing delay or each of the transport devices 37 and 3 is performed.
8, 39, the defect of the drive means of the wafer transfer device 22 can be traced.

The chemical concentration in the circulation supply circuits 54, 54 ', 54 "is detected by the concentration meters installed in the temperature / concentration detecting portions 65, 65'65" of the substrate processing apparatuses 31, 33, 35, respectively. This is detection information and is classified into the category K2A. The liquid surface position in the substrate processing apparatus 31, 33, 35 is the liquid surface sensor 52, 52'52 ", respectively.
This is the detection information detected by category K2A
It is classified into. From the detection information classified into the category K2A, it is possible to detect the state relating to the chemical liquid amount of the substrate processing apparatus 31, 33, 35. Category K2A
By recording the detection information classified into the log file in the log file, it is possible to detect the liquid leakage of the chemical liquid supply circuit and the circulation supply circuit. For example, when a high-concentration chemical liquid leaks from the chemical liquid supply circuit to the chemical liquid tank 51 due to a defect of the mixing supply portion 73 of the chemical liquid supply circuit 70, the liquid surface position continues to rise and the chemical liquid concentration continues to rise. To do. Further, when the low-concentration chemical liquid leaks from the chemical liquid supply circuit to the chemical liquid tank 51, the liquid surface position continues to rise and the chemical liquid concentration continues to decrease. When the pipe of the circulation supply circuit 54 is cracked, the liquid surface position continues to descend, but the chemical concentration does not change. Therefore, if the detection information classified into the category K2A is recorded in the log file, it is possible to investigate, for example, a defect in the mixing portion of the chemical liquid supply circuit or a crack in the circulation supply circuit.

The temperature of the chemical liquid in the circulation supply circuits 54, 54 ', 54 "is detected by thermometers installed in the temperature / concentration detecting portions 65, 65'65" of the substrate processing apparatuses 31, 33, 35, respectively. This is detection information and is classified into category K2B. From the information classified into the category K2B, it is possible to detect the abnormal state of the temperature control of the chemical liquid in the substrate processing apparatus 31, 33, 35. Therefore,
When the detection information classified into the category K2B is recorded in the log file, for example, a failure of the temperature control unit installed in the circulation supply circuit, a detection failure of the temperature / concentration detection unit itself, calculation of the temperature control signal in the control unit 5 is performed. You can track your mistakes.

The temperature in the liquid processing unit 8 is the detection information detected by the liquid processing unit thermometer 29 and is classified into the category K3. The pressure in the liquid processing unit 8 is detection information detected by the liquid processing unit pressure gauge 30, and is classified into the category K3. From the information classified in category K3, the liquid processing unit 8
It is possible to detect an abnormal state of the atmosphere generated inside. When the detection information classified into the category K3 is recorded in the log file, for example, it is possible to trace that gas is generated due to an abnormal reaction of the chemical liquid. The abnormal reaction gas is generated, for example, by the chemical liquid dissolving the clothing of the electric wiring, and in this case, a crack is generated in the portion of the pipe of the chemical liquid supply circuit or the circulation supply circuit surrounded by the liquid processing unit 8. Turns out.

The number of wafers W is determined by the interface unit 3
Is the detection information detected by the wafer inspecting device 18 installed in the wafer inspection device 18, and the array state of the wafers W is the detection information detected by the wafer detection sensor 27.
It is classified into 4. Even if the information classified into the category K4 is recorded in the log file, the state change in the liquid processing unit 8 cannot be traced. For example, the wafer W before the processing in the liquid processing unit 8 is performed by the wafer inspection device 18 and the wafer detection sensor 27.
Although it is possible to detect the state of, the transition information does not represent the state change in the liquid processing unit 8. That is, since the wafer W is inspected by the wafer inspection device 18 and the wafer detection sensor 27 and then carried into the liquid processing unit 8 and processed, the detection signal of the wafer inspection device 18 indicates the processing state in the liquid processing unit 8. It is the detection information that has nothing to do with the transition. However, when inspecting the wafer W that has been processed in the liquid processing unit 8, the liquid processing unit 8 is indirectly
It is possible to detect the state inside. For example, when a plurality of wafers W are continuously processed, the wafer detection sensor 27 detects a damaged state of the wafer W after the processing of the liquid processing unit 8 to detect an abnormal state in the liquid processing unit 8. Can be tracked.

Categories K1, K2A, K2 as described above
Log levels L1 and L by combining B, K3 and K4
2, L3 are created. The initial level L1 is
Only the main detection information is recorded in the log file. For example, only the detection information regarding time is recorded. The level L2 is switched from the level L1 when an abnormality occurrence detection signal indicating a state in which a failure may occur is detected. The abnormality occurrence detection signal representing a state in which a failure may occur is, for example, a detection signal detected as a value exceeding a preset allowable value. The level L2 increases the amount of information to be recorded as compared with the level L1 so that the state related to the occurrence of the failure can be recorded. That is, it is a level for recording detailed transition information regarding the abnormal state indicated by the abnormality occurrence detection signal. The level L3 is switched from the level L2 when an abnormality occurrence detection signal indicating a state in which a failure may occur is detected, and when the abnormality occurrence detection signal is further detected, there is a possibility that a failure occurs. The level is switched from L1 when the abnormality occurrence detection signal indicating the state is detected. At the level L3, the information to be recorded is increased from that at the level L1 or the level L2 so that the state related to the occurrence of the failure can be recorded. That is, it is a level for recording detailed transition information regarding an abnormal state that occurred first and an abnormal state related to the occurrence of a fault induced by the abnormal state.

For example, when an abnormal state occurs in the substrate processing apparatus 31, patterns for setting the log levels L1, L2, L3 are patterns P1, P2, P shown in FIG.
3, P4 can be defined. Similarly, patterns P1, P2, P3, and P4 shown in FIG. 7 can be determined when an abnormal state occurs in the substrate processing apparatuses 33 and 35. In the illustrated example, the category K4 has patterns P1 and P.
Levels L1, L2, L based on information about past operation of the processing system 1 although not included in P2, P3, P4
You may classify in 3.

In the pattern P1, the level L1 is a level for recording the information classified in the category K1. Level L2 is a level for recording information classified into categories K1 and K2A. Level L3 is a level for recording information classified into categories K1, K2A, and K3. This pattern P1 has levels L1 and L
2 and L3 do not include the category K2B, and are used when there is no abnormal state in the temperature of the chemical liquid in the substrate processing apparatus 31. For example, when a crack is generated in the circulation supply circuit 54, an abnormal state occurs in the liquid surface position of the chemical liquid in the substrate processing apparatus 31, but the abnormal state does not occur in temperature.
Further, for example, when the mixing valve of the chemical solution supply circuit 70 fails, an abnormal state occurs in the concentration and the liquid surface position of the chemical solution in the substrate processing apparatus 31, but the abnormal state does not occur in the temperature. Therefore, even if a log is recorded using the pattern P1 in these cases, it is possible to obtain a record with a sufficiently high degree of usefulness regarding the state transition caused by the crack generation in the circulation supply circuit 54.

In the pattern P2, the level L1 is a level for recording the information classified in the category K1. Level L2 is a level for recording information classified into categories K1 and K2B. Level L3 is a level for recording information classified into categories K1, K2B, and K3. This pattern P2 has levels L1 and L
2 and L3 do not include the category K2A, and are used when there is no abnormal state in the concentration of the chemical liquid and the liquid surface position in the substrate processing apparatus 31. For example, the circulation supply circuit 5
When a failure occurs in the temperature control unit 58 of No. 4, the abnormal condition is indicated by the temperature detection signal of the chemical liquid in the substrate processing apparatus 31, but the abnormal condition is not indicated by the detection signals of the concentration of the chemical liquid and the liquid surface position. Even if a log is recorded using the pattern P2, it is possible to obtain a record with a sufficiently high degree of usefulness regarding the failure of the temperature control unit 58.

In the pattern P3, the level L1 is a level for recording the information classified in the category K1. Level L2 is a level for recording information classified into categories K1, K2A, and K2B. Level L3
Is a level for recording information classified into categories K1, K2A, K2B, and K3. This pattern P2
Are assigned to categories L1, L2, L3 in categories K1, K2A,
It includes K2B and K3 and is used when an abnormal state occurs in the concentration, liquid surface position and temperature of the chemical liquid in the substrate processing apparatus 31. Further, it can be used when there is no abnormal state in the temperature of the chemical liquid in the substrate processing apparatus 31 or when there is no abnormal state in the concentration and liquid surface position.

In the pattern P4, the level L1 is a level for recording the information classified in the category K1. Level L2 is a level for recording information classified into categories K1, K2A, and K2B. Level L3
Is a level for recording information classified into categories K1, K2A, and K3. This pattern P4 is designed not to be recorded when K2B recorded at level L2 is changed to level L3. For example, when it is known that the state of transition from the FA state to the FB state can be traced by the level L2 and that the FB state can be traced by the level L3 when the transition to the FB state is made after the transition to a certain FA state, Can be used.

When the log software is executed in the information processing device 86, the patterns P1, P2 and
The log level is changed based on either P3 or P4, and the log is recorded. As a result, only main information can be recorded while the processing system is operating normally, and detailed transition information can be recorded only when a significant state change occurs in the processing system. Therefore, the used area of the storage capacity of the storage device is not maximized in a short time. Also,
It is possible to obtain a highly useful record regarding the change in the state of the processing system.

First, in the initial state, the pattern P
The level L1 common to 1, P2, P3 and P4 is set. After that, when a detection signal indicating the first abnormal state, that is, a state in which a failure may occur is detected, one of the patterns P1, P2, P3, and P4 is selected based on the detection signal. However, since it is difficult to clarify the root cause of the first abnormal state by recording only a low log level like the record of level L1, the state predicted from the first abnormal state. Based on the transition pattern, any one of the patterns P1, P2, P3 and P4 is selected and the log level is raised to the level L2.
This increases the detection information recorded in the log file. Then, when the first abnormal state is triggered and the second abnormal state occurs, a detection signal indicating a state in which the risk of failure increases is detected, and the log level is set according to the selected pattern. Change from L2 to level L3,
This increases the detection information recorded in the log file. That is, in the case of recording at an intermediate log level such as level L2, it is possible to infer the root cause of the abnormal state from the record and limit it to a plurality of items.
Since it is difficult to identify the pattern P1, the pattern P1, based on the state transition pattern predicted from the first abnormal state.
Select one of P2, P3 and P4 and raise the log level to level L3. Then, the related detection information generated from the root cause of the abnormal state is recorded. That is, it is possible to identify the root cause of the abnormal state by recording a high log level like the level L3. In this way, when a detection signal indicating the occurrence or reduction of the risk of failure is detected, by changing from a low log level to a high log level,
Increase the information logged. In this case, when an abnormal state occurs in a part of the processing system 1 and develops into a failure, detailed transition information from the occurrence of the abnormal state to the occurrence of the failure can be recorded. Therefore, it is possible to obtain a log file that is highly useful for status changes in the investigation of the cause of failure. Further, since the pattern is selected based on the detection signal indicating the state in which a failure may occur, it is possible to increase the amount of information to be recorded regarding the status related to the occurrence of the failure. In this case, it is possible to record detailed transition information regarding the abnormal state that occurred first and the abnormal state related to the failure occurrence induced by the abnormal state.

On the other hand, when the log level is changed from the level L1 which is the initial state to the level L2 in accordance with the occurrence of the first abnormal state and then the detection signal indicating the state in which the possibility of the failure is eliminated is detected, Based on the detection signal, the log level is changed from the level L2 to the level L1 according to the selected pattern, thereby reducing the information recorded in the log file. Similarly, when the log level is changed from the level L2 to the level L3 according to the occurrence of the next abnormal state induced by the first abnormal state, and when the detection signal indicating the state in which the risk of failure is reduced is detected, Based on the detection signal, the log level is changed from level L3 to level L2 according to the selected pattern. Further, when the log level is changed from the level L3 to the level L2 according to the decrease in the risk of occurrence of a failure and then the detection signal indicating the state in which the risk of the failure is eliminated is detected, the log level is changed from the level L2 to the level. Change to L1. In this way, when the detection signal indicating the elimination or reduction of the risk of occurrence of a failure is detected, the log level is changed from the high log level to the low log level, thereby reducing the information recorded in the log. In this case, for example, if an abnormal state occurs in the processing system, but the fault can be prevented by the operator's operation or the automatic control of the device, the abnormal state that occurs first and the abnormal state induced by the abnormal state It is possible to record detailed transition information regarding the state, and further it is possible to record detailed transition information until the risk of a failure is eliminated. Therefore, it is possible to obtain a highly useful record when investigating the process leading to the occurrence of an abnormal state and the elimination of the abnormal state. After changing the log level from the level L3 to the level L2 according to the decrease in the risk of failure occurrence, when the detection signal indicating the increased risk of failure occurrence is detected again, the log level is set to the level again. L
The information recorded in the log can be increased by changing from 2 to level L3. That is, the amount of information recorded in the log can be increased or decreased according to the state of the processing system 1.

Next, the processing steps of the wafer W in the processing system 1 according to this embodiment configured as described above will be described. First, a carrier C (not shown) stores, for example, 25 unprocessed wafers W each in a carrier C on the carrier loading / unloading section 6 of the loading / unloading section 2. The shutter 14 is opened, and the carrier C placed on the carrier loading / unloading unit 6 is loaded into the carrier stock unit 7 by the carrier transport device 12. In the carrier stock section 7,
The carrier C is placed on the inspection / loading / unloading stage 15 so as to face the window 16. Then, the window 16 is opened by the lid opening / closing mechanism 17, the number of wafers W in the carrier C is measured by the wafer inspection device 18, and it is appropriately detected whether or not the wafers W are arranged in parallel at a predetermined pitch. Thereafter, the wafer loading / unloading device 19 is used to move the window 16
The 25 wafers W stored in one carrier C are unloaded through the attitude changing mechanism 21a to change the attitude of the 25 wafers W from the horizontal state to the vertical state. Then, it is transferred to the wafer vertical holding mechanism 21b. Subsequently, 25 wafers W from the second carrier C are transferred to the posture changing mechanism 21a by the wafer loading / unloading device 19 and transferred to the wafer vertical holding mechanism 21b. Here, the arrangement pitch of the wafers W is halved, and a total of 50 wafers W accommodated in the two carriers C are accommodated. Then, the wafer transfer device 22 receives the wafer W from the wafer vertical holding mechanism 21b, appropriately waits in the parking areas 10a and 10b, and then transfers it to the transfer device 37 in the liquid processing unit 4.

The transfer device 37 lowers the wafer W into the chemical solution tank 48 of the substrate processing apparatus 31 in which the chemical solution is stored. The chemical liquid tank 48 is filled with a chemical liquid whose temperature and concentration are adjusted in advance. Further, the chemical liquid in the chemical liquid tank 48 is circulated and supplied to the circulation supply circuit 5.
It circulates in 4. In this way, the transfer device 37 holding 50 wafers W descends with respect to the inner tank 50 in which the chemical liquid is stored, and the wafer W is immersed in the chemical liquid to remove organic dirt and surface metal impurities. Then, the transfer device 37 lifts the wafer W from the substrate processing apparatus 31 after a predetermined time elapses, and transfers the wafer W to the substrate processing apparatus 32. Then,
The substrate processing apparatus 32 is dipped in a washing bath, held for a predetermined time, and pulled up. Wafer W that has been processed by the substrate processing apparatus 32
Is the chuck 28a of the wafer transfer device 22 on the washing tank.
To 28c, and is transferred to the transfer device 38 by the wafer transfer device 22.

During the processing of the wafer W, the chemical liquid overflowing from above the inner tank 50 is received by the outer tank 51, and the chemical solution is pumped by the pump 5.
By the operation of No. 6, it flows to the circulation supply circuit 54. After adjusting the temperature with the temperature controller 58 and cleaning with the filter 60, the inner tank 5
The chemical liquid is circulated by supplying again from the lower part of the inner tank 50 by the nozzle arranged below 0. After that, this circulation is repeated to reuse the chemical solution, and the consumption of the chemical solution is saved.

The temperature control unit 58 cools or heats the chemical liquid flowing in the circuit to adjust the temperature so that the temperature of the chemical liquid in the inner tank 50 is maintained at a predetermined value. A part of the chemical solution flowing through the circulation supply circuit 54 flows into the branch pipe 62, and after the temperature and concentration are measured by the temperature / concentration detection unit 65, it is returned to the outer tank 51 and flows through the circulation supply circuit 54 again. The measurement value of the temperature / concentration detection unit 65 is transmitted to the control unit 5 as a detection signal.

Subsequently, the transfer device 38 lowers the wafer W and immerses it in the SC-1 solution in the chemical bath of the substrate processing apparatus 33.
Remove particles and other deposits and pull up after a predetermined time. Then, the substrate is immersed in a washing bath of the substrate processing apparatus 34, held for a predetermined time, and pulled up. The wafer W, which has been processed by the substrate processing apparatus 33, is transferred to the wafer transfer apparatus 22 on the washing tank.
After being returned to the chucks 28a to 28c, the wafer is transferred from the wafer transfer device 22 to the transfer device 39.

Then, the transfer device 39 lowers the wafer W into the chemical bath of the substrate processing apparatus 35 in which the etching liquid (DHF) is stored. The chemical bath is filled with DHF whose temperature and concentration are adjusted in advance. In addition, the substrate processing apparatus 35
The DHF in the chemical solution tank circulates in the circulation supply circuit 54. In this way, the transfer device 39 holding the wafer W descends with respect to the inner tank 50 in which the DHF is stored, and the wafer W is immersed in the DHF to be etched. Then, it is conveyed from the substrate processing apparatus 35 to the substrate processing apparatus 36. Next, the substrate is immersed in a washing bath of the substrate processing apparatus 36, held for a predetermined time, and pulled up. The wafer W that has been processed by the substrate processing apparatus 36 is returned to the chucks 28 a to 28 c of the wafer transfer apparatus 22 on the water washing tank.

The wafer W which has been processed in the liquid processing unit 8 is transferred into the drying unit 9 by the wafer transfer device 22 and washed in the water washing tank 24, and then transferred by the transfer device 25.
And then IPA dried in the drying chamber. The wafer W after the drying process is returned to the interface unit 3 by the wafer transfer device 22, and the parking area 10 is appropriately used.
Waiting for a. Thereafter, the wafer W group is subjected to pitch conversion and attitude conversion in the interface section 3. Then, the wafer W is stored in the carrier C at the loading / unloading section 2, and the carrier C containing the processed wafer W is placed on the carrier loading / unloading section 6 and carried out of the processing system 1.

Next, the creation of a log file in a state in which the processing system 1 for performing the above processing is operating will be described. In addition, as an example, the pattern P3 shown in FIG.
Logs recorded when the level is changed based on In the pattern P3, the level L1 is a level for recording the processing start time and the processing end time which are information classified into the category K1 for the substrate processing apparatus 31. The level L2 is the time that is information classified into the category K1 of the substrate processing apparatus 31, and the circulation supply circuit 5 that is information classified into the category K2A.
4 is a level for recording the concentration of the chemical liquid in 4 and the liquid surface position of the outer tank 51. The level L3 is the time that is information classified into the category K1 of the substrate processing apparatus 31, and the circulation supply circuit 54 that is the information classified into the category K2A.
The chemical concentration inside and the liquid surface position of the outer tank 51, category K2
At the level of recording the chemical liquid temperature in the circulation supply circuit 54 which is the information classified into B, the temperature in the liquid processing unit 8 which is the information classified into category K3, and the pressure inside the liquid processing unit 8. is there.

In the processing shown in FIG. 9, first, the wafer W is loaded into the liquid processing unit 8 to start the processing in the liquid processing unit 8 (SA1). On the other hand, the control unit 5 monitors the detection signal transmitted from the detection means (SA2). At this time, as shown in FIG. 10, the log level for recording the log is the initial level L1 (SA3), the processing start time when the wafer W is loaded into the liquid processing unit 8, and the substrate processing apparatus. 31, 33, 3
Processing start time when the wafer W is immersed in the chemical bath in 5 and the washing bath in the substrate processing apparatus 32, 34, 36, and the chemical bath in the substrate processing apparatus 31, 33, 35 and the substrate processing apparatus 32, 3
The processing end time when the wafer W is pulled up from the water washing tank in 4, 36 and the processing end time when the wafer W is unloaded from the liquid processing unit 8 are recorded (SA4).

By the way, the chemical bath 48 of the substrate processing apparatus 31.
Since the chemical liquid adheres to the wafer W when the wafer W soaked from the wafer W is pulled up, the amount of the chemical liquid in the chemical liquid tank 48 that is circulated and supplied decreases as the number of wafers W processed increases (SA5). . Then, the amount of the chemical liquid flowing from the inner tank 50 to the outer tank 51 is reduced, and the liquid surface position of the outer tank 51 is lowered (SA6). It is transmitted to the control unit 5. The control unit 5 receives this output signal as a detection signal (SA7),
Based on this detection signal, a control signal for supplying a chemical solution having a predetermined concentration to the mixing supply section 73 installed in the chemical solution supply circuit 70 is transmitted (SA8). On the other hand, when the control unit 5 receives the liquid level drop detection signal, the log recording means in the control unit 5 changes the log level from the level L1 to the level L2 (SA9). Then, from the time of changing to the level L2, the processing start time of loading the wafer W into the liquid processing unit 8, the chemical solution tank in the substrate processing apparatus 31, 33, 35 and the water washing in the substrate processing apparatus 32, 34, 36. Processing start time when the wafer W is immersed in the bath, and the substrate processing apparatus 31, 33, 3
5, a processing end time when the wafer W is pulled up from the chemical bath in the substrate processing apparatus 5 and the washing baths in the substrate processing apparatuses 32, 34 and 36, a time including the processing end time when the wafer W is unloaded from the liquid processing unit 8, and the chemical bath 48. The chemical concentration inside and the liquid surface position of the chemical in the outer tank 51 are recorded (SA10). That is, by changing the log level from level L1 to level L2,
Increase the recorded detection information.

When a chemical solution having a predetermined concentration is supplied to the chemical solution tank 48 based on the control signal from the control section 5 (SA11), the liquid surface position of the outer tank 51 is restored to a normal value (SA12). In this way, the liquid level height is maintained at a desired height, and the processing of the wafer W is continued (SA13). And outer tank 5
The detected value of the state where the liquid level position of 1 is restored to the normal value is transmitted to the control unit 5 as an output signal, and the control unit 5 receives this output signal as a detection signal (SA14). Then, the log recording means in the control unit 5 changes the log level from the level L2 to the level L1 (SA15). Then, the processing of the wafer W is continuously monitored (SA16), and from the time of changing to the level L1, the processing start time of loading the wafer W into the liquid processing unit 8 and the substrate processing apparatus 31,
Chemical solution tanks in 33, 35 and substrate processing apparatus 32, 34, 36
Processing start time when the wafer W is immersed in the water washing tank inside, and the chemical liquid tank and the substrate processing apparatus 3 in the substrate processing apparatuses 31, 33, and 35.
The processing end time when the wafer W is pulled up from the washing tank in 2, 34, 36 and the processing end time when the wafer W is unloaded from the liquid processing unit 8 are recorded (SA17). That is,
By changing the log level from the level L2 to the level L1, the recorded detection information is reduced.

As described above, when an abnormal state in which a failure may occur is detected by the detection signal, the information to be recorded is increased, and when the control function of the control unit 5 detects the state in which the abnormal state is eliminated, ， Try to reduce the information recorded. In this case, it is possible to record detailed transition information about the abnormal state that occurred first and the abnormal state induced by the abnormal state, and further to record detailed transition information until the abnormal state is resolved. it can. Therefore, it is possible to obtain a useful record when investigating the abnormal state and the process leading to its elimination.

Next, a description will be given of a fault that may occur in the processing system 1 and the recording of a log in the state transition. One of the obstacles of the processing system 1 is that the chemical liquid leaking from the pipe of the circulation supply circuit 54 comes into contact with the electric wiring in the liquid processing unit 8 to cause a failure of the processing system 1.
It is assumed that there will be a fire and an explosion. For this fault, the liquid level drop of the liquid level sensor 52 is set as information indicating the cause of the fault.

In the processing shown in FIG. 11, first, the wafer W is loaded into the liquid processing unit 8 to start the processing in the liquid processing unit 8 (SB1). on the other hand,
The control unit 5 monitors the detection signal transmitted from the detection means (SB2). At this time, as shown in FIG. 12, the log level at which the log is recorded is level 1 which is the initial state (SB3). That is, based on the time detection signal of the timer 87 built in the control unit, the processing start time when the wafer W is loaded into the liquid processing unit 8 and the substrate processing apparatuses 31, 33, 3
Processing start time when the wafer W is immersed in the chemical bath in 5 and the washing bath in the substrate processing apparatus 32, 34, 36, and the chemical bath in the substrate processing apparatus 31, 33, 35 and the substrate processing apparatus 32, 3
The processing end time when the wafer W is pulled up from the washing tank in 4, 36 and the processing end time when the wafer W is unloaded from the liquid processing unit 8 are recorded (SB4).

Here, as an abnormal state of the processing system 1, when the pipe of the circulation supply circuit 54 is cracked due to deterioration of the pipe of the circulation supply circuit 54 or the like (S
B5), chemical liquid leakage from the piping of the circulation supply circuit 54 occurs (SB6). Then, since the amount of the chemical liquid flowing from the inner tank 50 to the outer tank 51 decreases and the liquid surface position of the outer tank 51 lowers (omitted), the liquid surface sensor 52 detects the liquid surface lowering, and the detected value is used as an output signal. It is transmitted to the control unit 5. In the control unit 5,
This output signal is received as a detection signal (SB7), and based on this detection signal, a control signal for supplying a chemical solution having a predetermined concentration to the mixing supply section 73 installed in the chemical solution supply circuit 70 is transmitted (SB8). ). On the other hand, when the control unit 5 receives the liquid level drop detection signal, the log recording unit in the control unit 5 changes the log level from the level L1 to the level L2 (SB9). Then, from the time when the level is changed to L2, the time based on the time detection signal of the control unit built-in timer 87, the chemical concentration in the chemical tank 48, and the liquid surface position of the chemical solution in the outer tank 51 are recorded (SB10). ). That is, by changing the log level from the level L1 to the level L2, the recorded detection information is increased.

On the basis of the control signal from the control unit 5, the chemical liquid having the predetermined concentration is supplied to the chemical liquid tank 48 (SA11), but the liquid surface position of the outer tank 51 does not recover to the normal value (SA).
12). That is, since the chemical liquid leakage continues, it is recorded in the log file that is set to the log level L2 that the liquid surface position of the chemical liquid in the outer tank 51 continues to decrease (S).
B10). On the other hand, since the liquid surface position of the outer tank 51 is further lowered (not shown), the liquid surface sensor 52 detects the liquid surface lowering and transmits the detected value as an output signal to the control unit 5. When the control unit 5 receives the detection signal which is equal to or less than the predetermined allowable value (SB13), it issues an alarm to warn the operator (SB14). In addition, the processing system 1
Automatically stops the processing of the wafer W (SB1
5).

However, when the chemical liquid leaking from the pipe of the circulation supply circuit 54 comes into contact with the electric wiring in the liquid processing unit 8 and begins to dissolve the clothing of the electric wiring (SB1
6), gas is generated in the liquid processing unit 8 (SB1
7). On the other hand, when the temperature inside the liquid processing unit 8 becomes high due to the generated gas, it is detected by the liquid processing unit thermometer 29 that the atmosphere inside the liquid processing unit 8 becomes high, and the detected value is used as an output signal for the control unit. Send to 5. The control unit 5 receives this output signal as a detection signal (SB
18) When the control unit 5 receives the detection signal which is equal to or more than the predetermined allowable value, it issues an alarm to warn the operator (SB19). In addition, the control unit 5
When the detection signal that the value exceeds the allowable value is received, the control unit 5
The log recording means therein changes the log level from level L2 to level L3 (SB20). From the time of changing to the level L3, the time based on the time detection signal of the control unit built-in timer 87, the chemical concentration in the chemical tank 48, the liquid surface position of the chemical in the outer tank 51, and the chemical temperature in the chemical tank 48. Then, the temperature of the atmosphere in the liquid processing unit 8 and the pressure of the atmosphere in the liquid processing unit 8 are recorded (SB21). That is, by changing the log level from the level L2 to the level L3, the recorded detection information is increased. Log level L3
In the log file being set to, it is recorded that the liquid surface position of the chemical liquid in the outer tank 51 continues to decrease and the temperature of the atmosphere in the liquid processing unit 8 rises (SB2
1). Furthermore, since the generated gas raises the pressure of the atmosphere in the liquid processing unit 8, it is recorded that the pressure of the atmosphere in the liquid processing unit 8 has risen (SB21).
Therefore, by examining this log file, it is possible to trace that the chemical liquid has leaked from the chemical liquid tank 48, that a high temperature atmosphere has been generated in the liquid processing unit 8, and that gas has been generated. That is, the circulation supply circuit 54 in which an abnormal state that may cause a failure first occurs, and the outer tank 51 in which an abnormal state related to the failure is induced by the abnormal state.
Further, detailed transition information can be recorded regarding the liquid processing unit 8.

When a fire occurs due to a short circuit of the electrical wiring whose clothes have been melted (SB22) after a further lapse of time (SB23), the liquid processing unit 8 is recorded in the log file being set to the log level L3. It is recorded that the temperature of the atmosphere inside has become even higher. Chemical solution tank 4
The temperature of the chemical liquid in 8 rises due to the heat generated by the fire, and an abnormality detection signal is transmitted until the temperature cannot be measured because the thermometer of the temperature / concentration detection unit fails due to the fire. Therefore,
By examining this log file, it is possible to trace the occurrence of a fire in the liquid processing unit 8. Also, the outer tank 5
From the transition of the decrease in the liquid surface position of the chemical liquid in No. 1, it is traced that the cracks in the piping of the circulation supply circuit 54 progress, and when the chemical liquid completely flows out from the outer tank 51,
It becomes impossible to measure the liquid surface position of the chemical liquid in. If the fireproof specifications are not met, it can be tracked that the fire caused a failure of the densitometer of the temperature / concentration detection unit and the liquid level sensor 52 to make measurement impossible. In this way, the log recording is continued until the processing system 1 finally explodes (SB24).

Even if gas is generated, the liquid processing unit 8
If the inside does not reach a high temperature, the liquid treatment unit pressure gauge 30 detects that the atmosphere inside the liquid treatment unit 8 has become high, and the control unit 5 determines that the atmosphere pressure inside the liquid treatment unit 8 is equal to or higher than the allowable value. The log recording means in the control unit 5 changes the log level from the level L2 to the level L3 by receiving the detection signal. In the log file being set to the log level L3, it is recorded that the liquid surface position of the chemical liquid in the outer tank 51 is continuously lowered and the pressure of the atmosphere in the liquid processing unit 8 is increased (SB21). Therefore,
By examining this log file, it is possible to trace that the chemical liquid has leaked from the chemical liquid tank 48 and that gas has been generated in the liquid processing unit 8.

According to the processing system 1, only main information is recorded while the processing system 1 is operating normally, and detailed transition information is recorded only when a significant state change occurs in the processing system 1. can do. In addition, detailed transition information can be recorded until the risk of failure is eliminated. Therefore, the used area of the storage capacity of the storage device 85 is not maximized in a short time. Since the information of the component that was processed normally is not recorded excessively,
It is possible to prevent the records of the constituent parts in which a serious processing condition has occurred from being buried in a large amount of transition information. When an abnormal state occurs in a part of the processing system 1 and develops into a failure,
It is possible to record detailed transition information from the occurrence of an abnormal state to the occurrence of a failure. The control unit 5 that stores and executes the software that creates the log file can easily select the transition information to be recorded.

An example of the preferred embodiment of the present invention has been described above. However, it goes without saying that the present invention is not limited to the embodiment described above, and can be appropriately modified and implemented. For example, the detection means for detecting the state of each part of the processing system 1 is not limited to the above. It is preferable that various other sensors are installed in each unit of the processing system 1, these are connected to the control unit 5 as signal input means, and the detected state is transmitted to the control unit 5 as an output signal. For example, the chemical solution supply circuit 70 and the circulation supply circuit 54 may be provided with a pressure sensor for measuring the pressure of the chemical solution flowing through the piping in the circuit or a flow rate sensor for measuring the flow rate. In addition, in the belt drive mechanism of the wafer transfer device 22,
By arranging a detecting means for detecting the life of the belt, a detecting means for monitoring the output pulse number of the servo motor for driving the belt, and a detecting means for monitoring the encoder value of the servo mechanism, the wafer transfer device 22 is driven. May be detected.

In the present embodiment, when the detection information is classified into categories, it is classified based on the cause of occurrence of the state.
You may classify based on the component part in which a detection means is installed. When a level is created in this category, transition information can be recorded based on the operating status of the component. That is, it is possible to record only the main transition information for a component in a normal state and record detailed transition information for a component in which an abnormal state has occurred. For example,
Since the thermometer and the densitometer of the temperature / concentration detection unit 65 are both installed in the circulation supply circuit 54 and are the detection means for detecting the state of the chemical liquid flowing in the circulation supply circuit 54,
These detection signals are classified into the same category. That is,
For example, the liquid surface position of the outer tank 51 is classified into the category K2A,
The chemical liquid concentration in the circulation supply circuit 54 and the chemical liquid temperature in the circulation supply circuit 54 are classified into the category K2B. This category K2
By using A and K2B, it is possible to create a level for recording the chemical liquid temperature together with the chemical liquid concentration in the circulation supply circuit 54 when the chemical liquid concentration in the circulation supply circuit 54 is an abnormal detection value.

As a method of changing the log level, as shown in the present embodiment, in addition to changing when the abnormality detection signal exceeding a certain detection value is detected, the abnormality detection signal is detected. It can be set to change with a frequency as a trigger. For example, when the abnormality detection signal TA is continuously detected, the level is set to increase when the third abnormality detection signal TA is detected. Also,
The detection of different types of abnormality detection signals TA, TB, and TC may be used as a trigger. Further, the interval at which the abnormality detection signal is detected may be set as a trigger to change. Furthermore, a trigger that combines these frequencies and intervals may be used.

The object to be processed of the present invention is not limited to the substrate, and the processing system is not limited to the one for processing the substrate, but can be carried out by a processing system for performing processing on various objects to be processed. .

[0099]

According to the processing system and the processing method of the present invention, it is possible to obtain a highly useful record regarding a state change of the processing system. Obtaining highly useful records for investigating the cause of failure, investigating the process in which the cause of failure develops into failure, or investigating the process leading to the occurrence of a condition that may cause a failure and its elimination You can Furthermore, this record enables efficient tracking of problems with the processing system and method. Also, the information to be recorded can be easily selected by changing the level.

[Brief description of drawings]

FIG. 1 is a perspective view of a processing system according to the present embodiment.

FIG. 2 is a plan view of the processing system according to the present embodiment.

FIG. 3 is a circuit in which a chemical solution circulates in the substrate processing apparatus,
It is explanatory drawing which showed the structure of the control part.

FIG. 4 is an explanatory diagram showing a configuration of a chemical liquid supply circuit.

FIG. 5 is a table showing a relationship between a detection unit in which a detection signal is detected, a category into which the detection signal is classified, and a component in a processing system detected by the detection unit.

FIG. 6 is a table showing the relationship between the detection means for detecting the detection information, the categories into which the detection information is classified, and the components in the processing system detected by the detection means.

FIG. 7 is a table showing the relationship between levels and the categories that make up the levels in each pattern.

FIG. 8 is a table showing the relationship between levels in pattern P3, logs belonging to each level, and their categories.

FIG. 9 is a flowchart showing a state transition of processing when a decrease in chemical liquid occurs in the chemical liquid tank.

FIG. 10 shows a case where a decrease in the chemical liquid occurs in the chemical liquid tank,
It is a flow chart showing processing of a recording means which records a state transition.

FIG. 11 is a flowchart showing a process state transition when a crack occurs in a pipe of a circulation supply circuit of a chemical liquid tank.

FIG. 12 is a flowchart showing a process of a recording unit that records a state transition when a crack occurs in the pipe of the circulation supply circuit of the chemical liquid tank.

[Explanation of symbols]

C carrier K1, K2A, K2B, K3 categories L1, L2, L3 level P1, P2, P3, P4 pattern W wafer 1 processing system 3 Interface section 5 control unit 8 liquid processing unit 18 Wafer inspection equipment 27 Wafer detection sensor 22 Wafer transfer device 29 Liquid Processing Unit Thermometer 30 Liquid processing unit pressure gauge 31-36 Substrate processing apparatus 50 inner tank 51 outer tank 52,52'52 "Liquid level sensor 54, 54 ', 54 "circulation supply circuit 58 Temperature controller 65,65'65 "Concentration / temperature detector 70 Chemical supply circuit 73 Mixing Supply Section 82 Mixing valve 85 storage 86 Information processing equipment 87 Control unit built-in timer 88 I / O device 89 Connection means

Claims (14)

[Claims] 1. A processing system for processing an object to be processed, comprising: a plurality of detecting means for detecting a state of each part of the processing system; and a recording means for recording information indicating the state.
The processing system, wherein the recording means can change the information to be recorded according to the state. 2. The processing system according to claim 1, wherein the recording unit increases the amount of information to be recorded when it detects a state in which a failure may occur, compared to before the detection. 3. The processing system according to claim 1, wherein the recording unit increases the amount of information to be recorded when a condition related to the occurrence of a failure is detected, compared to before the detection. . 4. The recording device according to claim 2, wherein the recording unit reduces the information to be recorded when it detects a state in which the risk of occurrence of the failure is eliminated, compared to before the detection. Processing system. 5. The processing system according to claim 1, wherein the recording means stores software for creating a log file. 6. The processing system according to claim 1, wherein the recording unit changes a level according to the state and records information belonging to the level. 7. A method of processing an object by a processing system, wherein information representing the state is recorded according to a change in the state of each part in the processing system. 8. The processing method according to claim 7, wherein the information to be recorded is increased when a state in which a failure may occur is detected. 9. The information to be recorded is increased when a condition related to the occurrence of a failure is detected,
The processing method according to claim 7. 10. The processing method according to claim 8, wherein the information to be recorded is reduced when the state in which the possibility of the occurrence of the failure is eliminated is detected. 11. The information is classified into a plurality of categories based on the cause of occurrence of the state, a level is set for each category, the level is changed according to the state, and a level according to the state is set. The processing method according to any one of claims 7 to 10, characterized in that the information belonging to (4) is recorded. 12. The method according to claim 11, wherein when classifying the information into a plurality of categories based on the cause of the occurrence of the state, the information is classified based on a plurality of different constituent parts that configure the processing system. The processing method described. 13. The level according to claim 11, wherein the level is set based on an analysis of past operation information.
The processing method according to 2. 14. The processing method according to claim 7, wherein a log file that records the information is created.