JP2003285314A - Manufacturing method for baked ceramic molded object, manufacturing method for ceramic heater, and glow plug - Google Patents
Manufacturing method for baked ceramic molded object, manufacturing method for ceramic heater, and glow plugInfo
- Publication number
- JP2003285314A JP2003285314A JP2002089102A JP2002089102A JP2003285314A JP 2003285314 A JP2003285314 A JP 2003285314A JP 2002089102 A JP2002089102 A JP 2002089102A JP 2002089102 A JP2002089102 A JP 2002089102A JP 2003285314 A JP2003285314 A JP 2003285314A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- ceramic molded
- ceramic
- molded member
- unfired ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning In General (AREA)
- Resistance Heating (AREA)
- Laser Beam Processing (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、未焼成セラミック
成形部材の余剰部分を除去する除去工程を備える焼成済
セラミック成形体の製造方法、及びセラミックヒータの
製造方法と、この製造方法で製造されたセラミックヒー
タを有するグロープラグとに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a fired ceramic compact, which includes a removing step for removing an excessive portion of an unfired ceramic compact, a method for producing a ceramic heater, and a method for producing the same. And a glow plug having a ceramic heater.
【０００２】[0002]
【従来の技術】従来より、焼成済セラミック成形体の製
造において、未焼成セラミック成形部材を射出成形によ
って成形した場合、射出成形で生じた余剰部分を除去す
る必要がある。このため、未焼成セラミック成形部材を
射出成形金型から取り出して、この未焼成セラミック成
形部材の狙いの外形形状に合わせた専用の切断金型によ
って、バリ等の余剰部分を切断除去していた。2. Description of the Related Art Conventionally, in manufacturing a fired ceramic molded body, when a non-fired ceramic molded member is molded by injection molding, it is necessary to remove an excess portion generated by injection molding. For this reason, the unfired ceramic molded member is taken out from the injection molding die, and a surplus portion such as a burr is cut and removed by a dedicated cutting die that matches the target outer shape of the unfired ceramic molded member.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このような専
用の切断金型は高価であり、さらに、切断の繰り返しに
より切断刃が劣化するために定期的に交換しなければな
らず、経済的な方法ではなかった。このような焼成済セ
ラミック成形体としては、例えば、グロープラグの先端
側に組付けられるセラミックヒータや、ガスセンサの固
体電解質材料からなる検出素子を加熱して活性化させる
ために用いられるセラミックヒータが挙げられる。However, such a dedicated cutting die is expensive, and the cutting blade deteriorates due to repeated cutting, so that the cutting die must be replaced periodically, which is economical. It wasn't the way. Examples of such a fired ceramic molded body include a ceramic heater assembled on the tip side of a glow plug and a ceramic heater used for heating and activating a detection element made of a solid electrolyte material of a gas sensor. To be
【０００４】本発明は、かかる問題点に鑑みてなされた
ものであって、射出成形によって成形した未焼成セラミ
ック成形部材の余剰部分を、低コストな方法で除去する
ことができる焼成済セラミック成形体の製造方法、及び
セラミックヒータの製造方法と、この製造方法で製造さ
れたセラミックヒータを有するグロープラグとを提供す
ることを目的とする。The present invention has been made in view of the above problems, and a fired ceramic molded body capable of removing an excessive portion of an unfired ceramic molded member molded by injection molding by a low cost method. And a method of manufacturing a ceramic heater, and a glow plug having the ceramic heater manufactured by this manufacturing method.
【０００５】[0005]
【課題を解決しようとする課題、作用及び効果】その解
決手段は、焼成済セラミック成形体の製造方法であっ
て、焼成後に上記焼成済セラミック成形体の一部または
全部をなす、射出成形された未焼成セラミック成形部材
について、上記射出成形で生じた余剰部分をレーザを用
いて除去する除去工程を備える焼成済セラミック成形体
の製造方法である。[Problems, Actions, and Effects to Solve the Problems] A means for solving the problems is a method for producing a fired ceramic molded body, which is injection-molded to form a part or all of the fired ceramic molded body after firing. A method for manufacturing a fired ceramic molded body, comprising: a removal step of removing, with a laser, an excess portion of the unfired ceramic molded member produced by the injection molding.
【０００６】本発明の製造方法では、射出成形された未
焼成セラミック成形部材について、射出成形で生じたバ
リ等の余剰部分をレーザを用いて除去することにした。
レーザを用いた除去工程は、未焼成セラミック成形部材
の加工寸法をレーザ加工装置に設定し、その加工寸法
（狙いの外形形状）に基づいて、レーザを未焼成セラミ
ック成形部材の外側面の特定部位または略全体に照射す
ることで可能となるので、従来のような専用の切断金型
は不要となり、さらに、未焼成セラミック成形部材の寸
法変更・外形形状変更にも容易に対応することができる
ので経済的である。In the manufacturing method of the present invention, the excess portion such as burrs produced by injection molding is removed by using a laser in the injection-molded unfired ceramic molded member.
In the removal process using a laser, the processing dimensions of the unfired ceramic molded member are set in the laser processing device, and the laser is set to a specific portion on the outer surface of the unfired ceramic molded member based on the processing dimension (the target outer shape). Or because it can be performed by irradiating almost the entire body, it does not require a dedicated cutting die as in the past, and it can easily respond to changes in dimensions and external shape of unfired ceramic molded members. It is economical.
【０００７】さらに、上記焼成済セラミック成形体の製
造方法であって、前記除去工程では、レーザを用いて切
断された前記余剰部分を吸引または飛散させて除去する
焼成済セラミック成形体の製造方法とすると良い。Further, there is provided a method for manufacturing a fired ceramic molded body, wherein in the removing step, the surplus portion cut by using a laser is sucked or scattered to be removed. Good to do.
【０００８】ところで、未焼成セラミック成形部材は、
射出成形によって成形される関係から、バインダ（有機
結合材）を含んでいるために粘着性を有している。この
ため、バリ等の余剰部分をレーザを用いて切断しても、
切断された余剰部分が未焼成セラミック成形部材に付着
し、残留してしまうことがあった。そこで、本発明で
は、切断されたバリ等の余剰部分を吸引または飛散させ
て除去することにした。このようにすることで、切断さ
れた余剰部分が付着していない未焼成セラミック成形部
材を得ることができる。なお、バリ等の余剰部分を吸引
または飛散させつつ切断すれば、切断された余剰部分が
未焼成セラミック成形部材に付着することがないので好
ましい。By the way, the unfired ceramic molded member is
Due to the fact that it is molded by injection molding, it has adhesiveness because it contains a binder (organic binder). Therefore, even if the excess portion such as burrs is cut with a laser,
The cut excess portion may adhere to and remain on the green ceramic molded member. Therefore, in the present invention, the excessive portion such as the cut burr is removed by suction or scattering. By doing so, it is possible to obtain an unfired ceramic molded member to which the cut surplus portion does not adhere. It should be noted that it is preferable to cut the surplus portion such as burrs while sucking or scattering it so that the cut surplus portion does not adhere to the unfired ceramic molded member.
【０００９】さらに、上記焼成済セラミック成形体の製
造方法であって、前記未焼成セラミック成形部材は、一
端から他端に向かって延びる形状であって、一部と他の
一部とが互いに接近する形状を有し、焼成後に導電性を
発現する材質からなり、前記除去工程は、上記未焼成セ
ラミック成形部材の上記一部と他の一部のうち少なくと
も互いに接近する接近部に生じた前記余剰部分を除去す
る焼成済セラミック成形体の製造方法とすると良い。Further, in the method for manufacturing a fired ceramic molded body, the unfired ceramic molded member has a shape extending from one end to the other end, and one part and another part approach each other. The removing step is carried out by a material having a shape that exhibits conductivity after firing. It is advisable to adopt a method for manufacturing a fired ceramic compact that removes a portion.
【００１０】本発明の未焼成セラミック成形部材のよう
に、一端から他端に向かって延びる形状であって、一部
と他の一部とが互いに接近する形状の未焼成セラミック
成形部材では、射出成形で生じたバリ等の余剰部分が上
記接近部に存在していると、この余剰部分を介して接近
部が接続してしまう虞がある。さらに、本発明では、こ
のような未焼成セラミック成形部材を焼成した焼成済セ
ラミック成形体が導電性を有するため、この焼成済セラ
ミック成形体を使用に供すれば、バリ等の余剰部分を介
して電気的なショートが生じる虞がある。Like the unfired ceramic molded member of the present invention, in the unfired ceramic molded member having a shape extending from one end to the other end and a shape in which a part and another part are close to each other, If a surplus portion such as a burr generated by molding exists in the approaching portion, the approaching portion may be connected via the surplus portion. Furthermore, in the present invention, since the fired ceramic molded body obtained by firing such a non-fired ceramic molded member has conductivity, if this fired ceramic molded body is used, it is possible to eliminate excess parts such as burrs. There is a risk of electrical short circuit.
【００１１】これに対し、本発明の除去工程では、この
ような未焼成セラミック成形部材について、少なくとも
接近部に生じたバリ等の余剰部分をレーザによって切断
し、さらに、切断したバリ等の余剰部分を吸引または飛
散させて除去する。このため、本発明の除去工程後の未
焼成セラミック成形部材には、バリ等の余剰部分が接近
部に存在しなくなる。従って、本発明の除去工程を用い
て製造した導電性を有する焼成済セラミック成形体は、
バリ等の余剰部分を介して電気的なショートが生じにく
く好ましい。On the other hand, in the removing step of the present invention, with respect to such an unfired ceramic molded member, at least an excessive portion such as a burr generated in the approaching portion is cut by a laser, and the excessive portion such as a burr cut is further cut. Remove by aspirating or scattering. Therefore, the unfired ceramic molded member after the removing step of the present invention has no excess portion such as burrs in the approaching portion. Therefore, the fired ceramic molded body having conductivity produced by using the removing step of the present invention is
It is preferable that an electrical short circuit is less likely to occur via a surplus portion such as a burr.
【００１２】なお、一端から他端に向かって延びる形状
であって、一部と他の一部とが互いに接近する形状とし
ては、例えば、一端から他端までに少なくとも一部が屈
曲しているものが挙げられる。具体的には、Ｕ字状、螺
旋状、渦巻き状、波状等が挙げられる。さらに具体的に
は、例えば、略Ｕ字状の未焼成セラミック成形部材であ
って、このうち略平行な直線部分が接近しているものが
挙げられる。As a shape that extends from one end to the other end and a part and another part approach each other, for example, at least a part is bent from one end to the other end. There are things. Specific examples include a U-shape, a spiral shape, a spiral shape, and a wavy shape. More specifically, for example, there is a substantially U-shaped unfired ceramic molded member in which substantially parallel straight line portions are close to each other.
【００１３】さらに、上記いずれかに記載の焼成済セラ
ミック成形体の製造方法であって、前記未焼成セラミッ
ク成形部材を射出成形に用いた複数の金型のうち保持用
金型に保持しつつ、他の金型を上記保持用金型から分離
した後、上記保持用金型に保持したままで上記未焼成セ
ラミック成形部材を前記除去工程に供する焼成済セラミ
ック成形体の製造方法とすると良い。Further, in the method for manufacturing a fired ceramic molded body according to any one of the above, while holding the unfired ceramic molded member in a holding mold among a plurality of molds used for injection molding, After the other mold is separated from the holding mold, the method for producing a fired ceramic molded body may be one in which the unfired ceramic molded member is subjected to the removing step while being held in the holding mold.
【００１４】本発明では、射出成形された未焼成セラミ
ック成形部材を保持用金型から取り出さずに、保持用金
型に保持したまま除去工程に供することにした。つま
り、射出成形用の金型の１つをレーザ加工における未焼
成セラミック成形部材の保持用治具としても用い、未焼
成セラミック成形部材の余剰部分を除去することにし
た。このため、本発明では、除去工程専用の未焼成セラ
ミック成形部材の保持用治具が不要であり、さらに、射
出成形された未焼成セラミック成形部材を、除去工程で
用いる未焼成セラミック成形部材の保持用治具に移し換
える必要もないので、作業効率が良く、低コストであ
る。In the present invention, the injection-molded unfired ceramic molded member is not removed from the holding mold but is subjected to the removing step while being held in the holding mold. That is, one of the molds for injection molding is also used as a jig for holding the unfired ceramic molded member in laser processing, and the surplus portion of the unfired ceramic molded member is removed. Therefore, in the present invention, a jig for holding the unfired ceramic molded member dedicated to the removing step is not required, and further, the unfired ceramic molded member injection-molded is held by the unfired ceramic molded member used in the removing step. Since there is no need to transfer to a jig for work, work efficiency is good and the cost is low.
【００１５】さらに、上記焼成済セラミック成形体の製
造方法であって、前記除去工程では、前記未焼成セラミ
ック成形部材の加工位置を、前記保持用金型を基準とし
て位置決めする焼成済セラミック成形体の製造方法とす
ると良い。Further, in the method for manufacturing a fired ceramic green body described above, in the removing step, the processing position of the non-fired ceramic green body is determined with the holding die as a reference. A manufacturing method is recommended.
【００１６】本発明では、前述したように、射出成形さ
れた未焼成セラミック成形部材を保持用金型から移し換
えることなく保持用金型に保持したまま除去工程に供す
るので、除去工程における未焼成セラミック成形部材の
保持用金型に対する位置は一定となる。従って、本発明
の除去工程では、未焼成セラミック成形部材の加工位置
を保持用金型を基準として位置決めするので、高精度に
未焼成セラミック成形部材の加工位置を位置決めするこ
とができ、高精度にバリ等の余剰部分を切断することが
可能となる。In the present invention, as described above, the injection-molded unfired ceramic molding member is subjected to the removing step while being held in the holding die without being transferred from the holding die. The position of the ceramic molded member with respect to the holding mold is constant. Therefore, in the removing step of the present invention, the processing position of the unfired ceramic molded member is positioned with reference to the holding mold, so that the processing position of the unfired ceramic molded member can be positioned with high accuracy, and with high accuracy. It is possible to cut the surplus portion such as burrs.
【００１７】他の解決手段は、導電性セラミックからな
る発熱体と、絶縁性セラミックからなり、上記発熱体の
少なくとも一部を包囲してこれと一体に焼成されてなる
絶縁性基体と、を有するセラミックヒータの製造方法で
あって、焼成後に上記発熱体となる射出成形された未焼
成セラミック成形部材のうち、上記射出成形で生じた余
剰部分をレーザを用いて除去する除去工程を備えるセラ
ミックヒータの製造方法である。Another solution includes a heating element made of a conductive ceramic, and an insulating base made of an insulating ceramic and surrounding at least a part of the heating element and integrally fired with the heating element. A method of manufacturing a ceramic heater, comprising: a removal step of removing, using a laser, an excess portion of the injection-molded unfired ceramic molding member that becomes the heating element after firing, which is caused by the injection molding. It is a manufacturing method.
【００１８】本発明は、セラミックヒータの製造方法で
あり、このうち、焼成後に発熱体となる射出成形された
未焼成セラミック成形部材について、射出成形で生じた
バリ等の余剰部分をレーザを用いて除去することにし
た。レーザを用いた除去工程は、発熱体となる未焼成セ
ラミック成形部材の加工寸法をレーザ加工装置に設定
し、その加工寸法（狙いの外形形状）に基づいて、レー
ザを未焼成セラミック部材の外側面の特定部位または略
全体に照射することで可能となるので、従来のような専
用の切断金型は不要となり、さらに、未焼成セラミック
成形部材の寸法変更・外形形状変更にも容易に対応する
ことができるので経済的である。The present invention is a method for manufacturing a ceramic heater, in which, for an injection-molded unfired ceramic molded member that becomes a heating element after firing, a surplus portion such as burrs produced by injection molding is laser-used. I decided to remove it. In the removal process using a laser, the processing dimension of the unfired ceramic molded member that becomes the heating element is set in the laser processing apparatus, and the laser is applied to the outer surface of the unfired ceramic member based on the processing dimension (target external shape). Since it is possible to irradiate a specific part or almost the entire area, it is not necessary to use a dedicated cutting die as in the past, and it is also possible to easily change the size and external shape of the unfired ceramic molded member. It is economical because it can be done.
【００１９】さらに、上記セラミックヒータの製造方法
であって、前記除去工程では、レーザを用いて切断され
た前記余剰部分を吸引または飛散させて除去するセラミ
ックヒータの製造方法とするのが好ましい。このように
することで、切断された余剰部分が付着していない、焼
成後に発熱体となる未焼成セラミック成形部材を得るこ
とができる。なお、バリ等の余剰部分を吸引または飛散
させつつ切断すれば、切断された余剰部分が未焼成セラ
ミック成形部材に付着することがないので好ましい。Further, in the above-mentioned method for manufacturing a ceramic heater, it is preferable that the removing step is a method for manufacturing a ceramic heater in which the excessive portion cut by using a laser is sucked or scattered to be removed. By doing so, it is possible to obtain an unfired ceramic molded member that does not have a cut surplus portion attached thereto and becomes a heating element after firing. It should be noted that it is preferable to cut the surplus portion such as burrs while sucking or scattering it so that the cut surplus portion does not adhere to the unfired ceramic molded member.
【００２０】さらに、上記セラミックヒータの製造方法
であって、前記未焼成セラミック成形部材は、一端から
他端に向かって延びる形状であって、一部と他の一部と
が互いに接近する形状を有し、前記除去工程は、上記未
焼成セラミック成形部材の上記一部と他の一部のうち少
なくとも互いに接近する接近部に生じた前記余剰部分を
除去するセラミックヒータの製造方法とするのが好まし
い。例えば、前述したような、接近部を有する略Ｕ字状
の未焼成セラミック成形部材では、射出成形で生じたバ
リ等の余剰部分が接近部に存在していると、これを焼成
した後の発熱体において、バリ等の余剰部分を介しての
電気的なショートが生じ、十分に発熱しない虞がある。
これに対し、この製造方法の除去工程では、少なくとも
接近部に生じたバリ等の余剰部分を除去するので、セラ
ミックヒータについて、バリ等の余剰部分を介しての電
気的なショートが生じにくくできる。Further, in the above-mentioned method for manufacturing a ceramic heater, the unfired ceramic molded member has a shape extending from one end to the other end, and a shape in which a part and another part are close to each other. It is preferable that the removing step is a method for manufacturing a ceramic heater that removes the surplus portion that has occurred at least in the approaching portions of the unfired ceramic molded member that are close to each other among the one portion and the other portion. . For example, in a substantially U-shaped unfired ceramic molded member having an approaching portion as described above, if a surplus portion such as a burr produced by injection molding exists in the approaching portion, heat generated after firing this In the body, an electrical short circuit may occur via a surplus portion such as a burr, and heat may not be sufficiently generated.
On the other hand, in the removing step of this manufacturing method, at least the surplus portion such as the burr that has occurred in the approaching portion is removed, so that the ceramic heater is less likely to cause an electrical short circuit via the surplus portion such as the burr.
【００２１】さらに、上記いずれかに記載のセラミック
ヒータの製造方法であって、前記未焼成セラミック成形
部材を射出成形に用いた複数の金型のうち保持用金型に
保持しつつ、他の金型を上記保持用金型から分離した
後、上記保持用金型に保持したままで上記未焼成セラミ
ック成形部材を前記除去工程に供するセラミックヒータ
の製造方法とするのが好ましい。この製造方法では、射
出成形用の金型の１つをレーザ加工における未焼成セラ
ミック成形部材の保持用治具としても用いるため、除去
工程専用の未焼成セラミック成形部材の保持用治具が不
要である。また、未焼成セラミック成形部材を除去工程
で用いる保持用治具に移し換える必要もなくなり、作業
効率が良く、低コストである。Further, in the method for manufacturing a ceramic heater according to any one of the above, while holding the unfired ceramic molded member in a holding mold among a plurality of molds used for injection molding, another metal mold is used. After the mold is separated from the holding mold, it is preferable to provide a method for manufacturing a ceramic heater in which the unfired ceramic molded member is subjected to the removing step while being held in the holding mold. In this manufacturing method, since one of the molds for injection molding is also used as a jig for holding the unfired ceramic molded member in laser processing, a jig for holding the unfired ceramic molded member dedicated to the removing step is unnecessary. is there. Further, there is no need to transfer the unfired ceramic molded member to a holding jig used in the removing step, and the work efficiency is good and the cost is low.
【００２２】さらに、上記セラミックヒータの製造方法
であって、前記除去工程では、前記未焼成セラミック成
形部材の加工位置を、前記保持用金型を基準として位置
決めするセラミックヒータの製造方法とするのが好まし
い。この製造方法では、前述したように、未焼成セラミ
ック成形部材を保持用金型に保持したまま除去工程に供
するので、除去工程における未焼成セラミック成形部材
の保持用金型に対する位置は一定となる。従って、この
除去工程では、未焼成セラミック成形部材の加工位置を
保持用金型を基準として位置決めするので、高精度に未
焼成セラミック成形部材の加工位置を位置決めすること
ができ、高精度にバリ等の余剰部分を切断することが可
能となる。Further, in the method of manufacturing the ceramic heater, in the removing step, the processing position of the unfired ceramic molded member is positioned with reference to the holding mold. preferable. In this manufacturing method, as described above, since the unfired ceramic molding member is subjected to the removing step while being held in the holding die, the position of the unfired ceramic molding member with respect to the holding die in the removing step is constant. Therefore, in this removing step, the processing position of the unfired ceramic molding member is positioned with reference to the holding die, so that the processing position of the unfired ceramic molding member can be positioned with high accuracy, and burrs and the like with high accuracy. It becomes possible to cut the surplus part of.
【００２３】他の解決手段は、上記セラミックヒータの
製造方法によって製造された上記セラミックヒータを有
するグロープラグである。Another solution is a glow plug having the ceramic heater manufactured by the method for manufacturing the ceramic heater.
【００２４】本発明のグロープラグは、レーザを用いた
除去工程を備える製造方法によって製造したセラミック
ヒータを有するグロープラグである。前述したように、
レーザを用いた除去工程は、焼成されて発熱体となる未
焼成セラミック成形部材の加工寸法をレーザ加工装置に
設定し、その加工寸法（狙いの外形形状）に基づいて、
レーザを未焼成セラミック成形部材の外側面の特定部位
または略全体に照射することで可能となるので、従来の
ような専用の切断金型は不要となり、さらに、グロープ
ラグの品番変更に伴う未焼成セラミック成形部材の寸法
変更・外形形状変更にも容易に対応することができるの
で経済的である。従って、本発明のグロープラグは、低
コストなグロープラグとなる。The glow plug of the present invention is a glow plug having a ceramic heater manufactured by a manufacturing method including a removal process using a laser. As previously mentioned,
In the removal process using a laser, the processing dimension of the unfired ceramic molded member that is fired to become a heating element is set in the laser processing apparatus, and based on the processing dimension (target external shape),
This can be done by irradiating a specific portion or almost the entire surface of the outer surface of the unfired ceramic molded member, so there is no need for a dedicated cutting die as in the conventional case. It is economical because it is possible to easily respond to changes in the dimensions and external shape of the ceramic molded member. Therefore, the glow plug of the present invention is a low-cost glow plug.
【００２５】[0025]
【発明の実施の形態】次に、本発明の実施の形態を、図
面を参照しつつ説明する。図１は、本実施形態の製造方
法によって製造されるセラミックヒータ１０を使用した
グロープラグ１を、その内部構造と共に示すものであ
る。このグロープラグ１は、その先端に設けられたセラ
ミックヒータ１０と、このセラミックヒータ１０の先端
部１０ｂが突出するようにその外周を覆う金属製の外筒
２、さらにこの外筒２を外側から覆う筒状の金属ハウジ
ング３を備えている。なお、セラミックヒータ１０と外
筒２、及び外筒２と金属ハウジング３は、それぞれろう
付けにより接合され、または圧入されて一体化してい
る。BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a glow plug 1 using a ceramic heater 10 manufactured by the manufacturing method of the present embodiment together with its internal structure. The glow plug 1 has a ceramic heater 10 provided at its tip, a metal outer cylinder 2 that covers the outer periphery of the ceramic heater 10 so that the tip 10b of the ceramic heater 10 projects, and further covers the outer cylinder 2 from the outside. It has a cylindrical metal housing 3. The ceramic heater 10 and the outer cylinder 2, and the outer cylinder 2 and the metal housing 3 are joined by brazing or press-fitted to be integrated.
【００２６】セラミックヒータ１０の後端部１０ｃに
は、金属線により両端が弦巻バネ状に形成された結合部
材５の一端が外側から嵌合している。この結合部材５の
他端側は、金属ハウジング３内に挿入された金属軸６の
先端部に嵌着している。金属軸６の後端側は、金属ハウ
ジング３の外側へ延びると共に、その外周面に形成され
たネジ部６ｂにナット７が螺合し、これを金属ハウジン
グ３に向けて締付けることにより、金属軸６が金属ハウ
ジング３に対して固定されている。また、ナット７と金
属ハウジング３との間には、絶縁ブッシュ８が嵌め込ま
れている。そして、金属ハウジング３の外周面には、図
示しないエンジンブロックにグロープラグ１を固定する
ためのネジ部４が形成されている。To the rear end portion 10c of the ceramic heater 10, one end of a connecting member 5 whose both ends are formed in a spiral spring shape by a metal wire is fitted from the outside. The other end of the connecting member 5 is fitted to the tip of a metal shaft 6 inserted in the metal housing 3. The rear end side of the metal shaft 6 extends to the outside of the metal housing 3, and a nut 7 is screwed into a screw portion 6b formed on the outer peripheral surface of the metal shaft 3, and the nut 7 is tightened toward the metal housing 3 to form a metal shaft. 6 is fixed to the metal housing 3. An insulating bush 8 is fitted between the nut 7 and the metal housing 3. A screw portion 4 for fixing the glow plug 1 to an engine block (not shown) is formed on the outer peripheral surface of the metal housing 3.
【００２７】セラミックヒータ１０は、図２にその断面
図を示すように、略Ｕ字状の発熱体１１を備え、その端
部には線状の第１電極リード部材１５及び第２電極リー
ド部材１６の先端部が埋設されている。この発熱体１
１、第１電極リード部材１５、及び第２電極リード部材
１６は、円形断面を有する棒状の絶縁性基体１７内に埋
設されるように形成されている。ただし、第１電極リー
ド部材１５及び第２電極リード部材１６の他端１５ｂ，
１６ｂは、絶縁性基体１７の外表面から露出している。
このうち、発熱体１１は、絶縁性基体１７の先端部１７
ｂに位置する方向変換部１４と、これに連結する互いに
平行な第１直線部１２及び第２直線部１３とを有する。
さらに、この第１直線部１２と第２直線部１３とは互い
に接近しており、第１直線部１２のうち第２直線部１３
に接近している部分を第１接近部１２ｂ、第２直線部１
３のうち第１直線部１２に接近している部分を第２接近
部１３ｂとする。As shown in the sectional view of FIG. 2, the ceramic heater 10 is provided with a substantially U-shaped heating element 11, and linear end portions of the first electrode lead member 15 and the second electrode lead member 15 at the ends thereof. 16 tips are buried. This heating element 1
The first electrode lead member 15 and the second electrode lead member 16 are formed so as to be embedded in a rod-shaped insulating base 17 having a circular cross section. However, the other ends 15b of the first electrode lead member 15 and the second electrode lead member 16,
16b is exposed from the outer surface of the insulating base 17.
Of these, the heating element 11 is the tip portion 17 of the insulating substrate 17.
It has the direction changing part 14 located in b, and the 1st linear part 12 and the 2nd linear part 13 which are mutually parallel and which are connected to this.
Further, the first straight line portion 12 and the second straight line portion 13 are close to each other, and the second straight line portion 13 of the first straight line portion 12 is close to each other.
The first approaching portion 12b and the second straight portion 1
A portion of 3 which is close to the first linear portion 12 is referred to as a second approaching portion 13b.
【００２８】このようなセラミックヒータ１０は、次の
ようにして製造する。まず、Ｓｉ３Ｎ４を主成分とする
粉末を８５重量％、焼結助剤としてのＹｂ２Ｏ３粉末を
１０重量％、及びＳｉＯ２粉末を５重量％の割合で配合
した絶縁成分用原料を用意する。さらに、この絶縁成分
用原料を４５重量％、ＷＣ粉末を５５重量％の割合で混
合し、原料粉末とする。次いで、図３に示すような、第
１金型３１と第２金型３２とからなる射出成形用金型３
０のうち電極設置部３０ｂに、断面形状が円形のタング
ステン製の第１電極材２５及び第２電極材２６を固定す
る。図３（ａ）は射出成形用金型３０の上面図、図３
（ｂ）はそのＡ−Ａ断面図である。なお、第１電極材２
５及び第２電極材２６は、焼成後に第１電極リード部材
１５及び第２電極リード部材１６となる。The ceramic heater 10 as described above is manufactured as follows. First, a raw material for an insulating component is prepared in which 85% by weight of powder containing Si3N4 as a main component, 10% by weight of Yb2O3 powder as a sintering aid, and 5% by weight of SiO2 powder are mixed. Further, 45% by weight of the raw material for the insulating component and 55% by weight of the WC powder are mixed to obtain a raw material powder. Next, as shown in FIG. 3, an injection molding die 3 including a first die 31 and a second die 32.
The first electrode material 25 and the second electrode material 26, which are made of tungsten and have a circular cross-sectional shape, are fixed to the electrode installation portion 30b of No. 0. 3A is a top view of the injection molding die 30, FIG.
(B) is the AA sectional view. The first electrode material 2
The fifth and second electrode materials 26 become the first electrode lead member 15 and the second electrode lead member 16 after firing.
【００２９】次いで、公知の射出成形手法によって、上
記原料粉末とバインダ（有機結合剤；例えばワックス系
の有機材料）とを混練したスラリーを、図３に示す射出
口３０ｄから射出成形用金型３０内へ射出し、成形室３
０ｃ内に未焼成セラミック成形部材２１を成形する（図
４参照）。このとき、未焼成セラミック成形部材２１と
第１電極材２５及び第２電極材２６とが一体となった、
一体成形体２０が形成される（図４参照）。なお、第１
金型３１が、前述した保持用金具に相当する。Next, a slurry obtained by kneading the raw material powder and a binder (organic binder; for example, a wax-based organic material) by a known injection molding method is used to inject a metal mold 30 for injection molding from an injection port 30d shown in FIG. Injection into the molding room 3
The unfired ceramic molded member 21 is molded into the inside 0c (see FIG. 4). At this time, the unfired ceramic molded member 21, the first electrode material 25, and the second electrode material 26 are integrated.
The integrally molded body 20 is formed (see FIG. 4). The first
The mold 31 corresponds to the above-mentioned holding metal fitting.
【００３０】次いで、この一体成形体２０が第１金型３
１に保持されるように、第２金型３２の貫通孔３２ｃ内
に挿入されている図示しないノックアウトピンを用いて
押圧し、一体成形体２０を第２金型３２から分離させつ
つ、第２金型３２を第１金型３１から分離する。分離後
の第１金型３１に保持された一体成形体２０を図４に示
す。図４に示すように、一体成形体２０のうち未焼成セ
ラミック成形部材２１は略Ｕ字状であり、成形材料の流
入経路部分が成形した連結部２９ｃによって複数の未焼
成セラミック成形部材２１が一体となっている。さら
に、図４に拡大して示すように、未焼成セラミック成形
部材２１は、第１接近部２２ｂ及び第２接近部２３ｂを
有し、この第１、第２接近部２２ｂ，２３ｂを含む未焼
成セラミック成形部材２１の外側面には、射出成形によ
って生じた複数のバリ２９ｂが存在している。Next, the integrally molded body 20 is used as the first mold 3.
1 is pressed by using a knockout pin (not shown) inserted into the through hole 32c of the second mold 32 so as to be held by the first mold 32 so that the integrally molded body 20 is separated from the second mold 32. The mold 32 is separated from the first mold 31. FIG. 4 shows the integrally molded body 20 held by the first mold 31 after separation. As shown in FIG. 4, the unfired ceramic molded member 21 of the integrally molded body 20 is substantially U-shaped, and the plurality of unfired ceramic molded members 21 are integrated by the connecting portion 29c formed by the molding material inflow path portion. Has become. Further, as shown enlarged in FIG. 4, the unfired ceramic molded member 21 has a first approaching portion 22b and a second approaching portion 23b, and the unfired ceramics including the first and second approaching portions 22b, 23b. On the outer surface of the ceramic molded member 21, there are a plurality of burrs 29b formed by injection molding.
【００３１】次に、除去工程において、このような未焼
成セラミック成形部材２１から、余剰部分２９であるバ
リ２９ｂ及び連結部２９ｃをレーザを用いて除去する。
具体的には、まず、一体成形体２０を第１金型３１に保
持したままの状態で、図５に示すように、公知のＣＯ２
レーザ加工装置４０のＸ−Ｙテーブル４１上に載置す
る。次いで、第１金型３１に形成されている基準マーク
３１ｂ（図６参照）を画像認識により検出し、これを利
用して未焼成セラミック成形部材２１の加工位置を位置
決めする。すなわち、未焼成セラミック成形部材２１の
うち、図６に破線で示すような、余剰部分２９を除いた
未焼成セラミック成形部材２１の仮想外形線を加工位置
として位置決めする。このようにして位置決めした、図
６に破線で示す加工位置にＣＯ２レーザを照射して、余
剰部分２９であるバリ２９ｂ及び連結部２９ｃを切断す
る。Next, in the removing step, the burrs 29b and the connecting portions 29c, which are the surplus portions 29, are removed from the unfired ceramic molded member 21 using a laser.
Specifically, first, as shown in FIG. 5, in the state where the integrally molded body 20 is held in the first mold 31, as shown in FIG.
The laser processing apparatus 40 is placed on the XY table 41. Next, the reference mark 31b (see FIG. 6) formed on the first mold 31 is detected by image recognition, and the processing position of the unfired ceramic molded member 21 is positioned by utilizing this. That is, of the unfired ceramic molded member 21, the virtual outline of the unfired ceramic molded member 21 excluding the surplus portion 29 as shown by the broken line in FIG. 6 is positioned as the processing position. The machining position shown by the broken line in FIG. 6 positioned in this way is irradiated with a CO 2 laser to cut off the burr 29 b and the connecting portion 29 c which are the surplus portion 29.
【００３２】レーザを用いた除去工程は、未焼成セラミ
ック成形部材２１の加工寸法をレーザ加工装置４０に設
定し、その加工寸法（狙いの外形形状）に沿った形でレ
ーザを未焼成セラミック成形部材２１に照射することで
可能となるので、従来のような専用の切断金型は不要と
なり、さらに、焼成されて発熱体となる未焼成セラミッ
ク成形部材の寸法変更・外形形状変更にも容易に対応す
ることができるので経済的である。さらに、本実施形態
では、射出成形された未焼成セラミック成形部材２１を
第１金型３１から取り出さずに、第１金型３１に保持し
たまま除去工程に供することにした。つまり、射出成形
用の金型の１つである第１金型３１をレーザ加工におけ
る未焼成セラミック成形部材２１の保持用治具としても
用いることにした。このため、本実施形態では、除去工
程専用の未焼成セラミック成形部材２１の保持用治具が
不要であり、さらに、射出成形された未焼成セラミック
成形部材２１を、除去工程で用いる未焼成セラミック成
形部材２１の保持用治具に移し換える必要もないので、
作業効率が良く、低コストである。In the removal process using a laser, the processing dimension of the unfired ceramic molding member 21 is set in the laser machining apparatus 40, and the laser is fired in a shape along the machining dimension (target outer shape). Since it becomes possible by irradiating 21, it is not necessary to use a dedicated cutting die as in the past, and it is also easy to change the size and external shape of the unfired ceramic molded member that becomes a heating element by firing. It is economical because it can be done. Further, in the present embodiment, the injection-molded unfired ceramic molded member 21 is not taken out from the first mold 31 but is subjected to the removing step while being held in the first mold 31. That is, the first mold 31, which is one of the molds for injection molding, is also used as a jig for holding the unfired ceramic molded member 21 in laser processing. Therefore, in the present embodiment, a jig for holding the unfired ceramic molded member 21 dedicated to the removing step is not required, and the unfired ceramic molded member 21 injection-molded is used in the removing step. Since it is not necessary to transfer the member 21 to a holding jig,
Good work efficiency and low cost.
【００３３】さらに、本実施形態では、射出成形した未
焼成セラミック成形部材２１を第１金型３１から移し換
えることなく、第１金型３１に保持したまま除去工程に
供したので、除去工程における未焼成セラミック成形部
材２１の第１金型３１に対する位置は一定となった。且
つ、未焼成セラミック成形部材２１の加工位置を、第１
金型３１に形成されている基準マーク３１ｂ（図４参
照）を利用して位置決めしたので、未焼成セラミック成
形部材２１について高精度に加工位置を位置決めでき、
高精度にバリ等の余剰部分２９を切断することができ
た。従って、本実施形態の除去工程では、未焼成セラミ
ック成形部材について、射出成形で生じた余剰部分を高
精度に切断することができる。Furthermore, in this embodiment, the injection-molded unfired ceramic molding member 21 is subjected to the removal step while being held in the first mold 31 without being transferred from the first mold 31, so that in the removal step The position of the unfired ceramic molded member 21 with respect to the first mold 31 was constant. In addition, the processing position of the unfired ceramic molded member 21 is set to the first
Since the positioning is performed by using the reference mark 31b (see FIG. 4) formed on the die 31, the unfired ceramic molded member 21 can be positioned with high precision,
It was possible to cut the surplus portion 29 such as burrs with high accuracy. Therefore, in the removing step of the present embodiment, the surplus portion of the unfired ceramic molded member produced by injection molding can be cut with high accuracy.
【００３４】次いで、図７に示すように、公知の真空技
術を利用した吸引除去装置５０を用いて、切断したバリ
２９ｂを吸引して除去する。具体的には、吸引除去装置
５０の吸引口５１を、一体成形体２０を搭載している第
１金型３１の上方に位置させ、一定の間隔を保持しつつ
切断したバリ２９ｂを吸引除去した。その後、一体成形
体２０を第１金型３１から取り出すことによって、切断
した連結部２９ｃとも分離し、図８に示すような、切断
した余剰部分２９が未焼成セラミック成形部材２１に付
着していない、特に、第１接近部２２ｂ及び第２接近部
２３ｂに余剰部分２９が存在しない未焼成セラミック成
形部材２１を得ることができた。Then, as shown in FIG. 7, the cut burr 29b is removed by suction using a suction removing device 50 utilizing a known vacuum technique. Specifically, the suction port 51 of the suction / removal device 50 is located above the first mold 31 on which the integrally molded body 20 is mounted, and the burrs 29b that have been cut while maintaining a constant interval are removed by suction. . After that, by removing the integrally molded body 20 from the first mold 31, the cut connecting portion 29c is also separated, and the cut surplus portion 29 as shown in FIG. 8 is not attached to the unfired ceramic molded member 21. In particular, it was possible to obtain the unfired ceramic molded member 21 in which the surplus portion 29 does not exist in the first approaching portion 22b and the second approaching portion 23b.
【００３５】一方、これとは別に、絶縁性基体１７を形
成するための原料粉末を、予め金型プレス成形すること
により、図９に示すような、上下別体に形成された分割
絶縁部材２７，２８を用意しておく。具体的には、ま
ず、Ｓｉ３Ｎ４粉末を８３重量％、焼結助剤としてのＹ
ｂ２Ｏ３粉末を１０重量％、ＳｉＯ２粉末を５重量％、
及びＭｏＳｉ２粉末を２重量％の割合で配合した原料粉
末を用意する。次いで、この原料粉末をバインダと共に
２０時間湿式混合したものをスプレードライにより造粒
し、この造粒粉末を金型プレス成形によって圧粉し、分
割絶縁部材２７，２８を形成した。この分割絶縁部材２
７，２８の合わせ面２７ｃ，２８ｃには、図９に示すよ
うに、一体成形体２０に対応した形状の凹部２７ｂ，２
８ｂがそれぞれ形成されている。On the other hand, separately from this, the raw material powder for forming the insulating substrate 17 is press-molded in advance with a die to separately form the divided insulating member 27 as shown in FIG. , 28 are prepared. Specifically, first, 83% by weight of Si3N4 powder and Y as a sintering aid were used.
b2O3 powder 10% by weight, SiO2 powder 5% by weight,
And a raw material powder in which MoSi2 powder is mixed at a ratio of 2% by weight is prepared. Next, this raw material powder was wet-mixed with a binder for 20 hours, granulated by spray drying, and the granulated powder was pressed by die press molding to form divided insulating members 27 and 28. This split insulation member 2
As shown in FIG. 9, the mating surfaces 27c, 28c of the 7, 28 have recesses 27b, 2 having a shape corresponding to the integrally molded body 20.
8b are formed respectively.
【００３６】次に、図９に示すように、一体成形体２０
を分割絶縁部材２８の凹部２８ｂ内に配置する。さら
に、分割絶縁部材２７の凹部２７ｂ内に一体成形体２０
を収容させつつ、合わせ面２７ｃを合わせ面２８ｃに接
触させるようにして、一体成形体２０を分割絶縁部材２
７，２８内に収容する。次いで、これらをプレス・圧縮
することにより、一体成形体２０及び分割絶縁部材２
７，２８が一体化した複合成形体６０を形成する。Next, as shown in FIG. 9, the integrally molded body 20.
Are placed in the recesses 28b of the divided insulating member 28. Further, the integrally molded body 20 is provided in the recess 27b of the divided insulating member 27.
The integral molding body 20 is divided into the split insulating member 2 by bringing the mating surface 27c into contact with the mating surface 28c.
It accommodates in 7,28. Next, by pressing and compressing these, the integrally molded body 20 and the divided insulating member 2
A composite molded body 60 in which 7, 28 are integrated is formed.
【００３７】こうして得られた複合成形体６０につい
て、まず、原料粉末中のバインダ成分を除去するため
に、所定の温度（例えば約６００℃）で仮焼する。続い
て、これをホットプレス用金型内に収容し、加圧しなが
ら所定の温度（例えば約１８００℃）で焼成する。この
とき、未焼成セラミック成形部材２１が発熱体１１に、
分割絶縁部材２７，２８が絶縁性基体１７に、第１電極
材２５及び第２電極材２６が第１電極リード部材１５及
び第２電極リード部材１６になる。次いで、絶縁性基体
１７の外側の面に研磨加工を施して、図２に示したよう
に、第１電極リード部材１５及び第２電極リード部材１
６の他端１５ｂ，１６ｂが絶縁性基体１７の外表面から
露出したセラミックヒータ１０を得ることができた。The composite molded body 60 thus obtained is first calcined at a predetermined temperature (for example, about 600 ° C.) in order to remove the binder component in the raw material powder. Subsequently, this is housed in a hot-pressing die and baked at a predetermined temperature (for example, about 1800 ° C.) while being pressurized. At this time, the unfired ceramic molded member 21 is attached to the heating element 11,
The divided insulating members 27 and 28 serve as the insulating substrate 17, and the first electrode material 25 and the second electrode material 26 serve as the first electrode lead member 15 and the second electrode lead member 16. Next, the outer surface of the insulating substrate 17 is subjected to polishing processing, and as shown in FIG. 2, the first electrode lead member 15 and the second electrode lead member 1
It was possible to obtain the ceramic heater 10 in which the other ends 15b and 16b of 6 were exposed from the outer surface of the insulating substrate 17.
【００３８】本実施形態では、特に、本実施形態の未焼
成セラミック成形部材２１が第１接近部２２ｂ及び第２
接近部２３ｂを含む略Ｕ字形状であり、この第１接近部
２２ｂ及び第２接近部２３ｂには射出成形で生じた余剰
部分２９が複数存在していた。このため、この余剰部分
２９を介して第１接近部２２ｂと第２接近部２３ｂとが
接続してしまう虞があった。しかも、未焼成セラミック
成形部材２１を焼成した発熱体１１は導電性を有するた
め、第１接近部２２ｂ及び第２接近部２３ｂに余剰部分
２９が存在したままでセラミックヒータ１０を使用に供
すれば、余剰部分を介して電気的なショートが生じる虞
があった。In this embodiment, in particular, the unfired ceramic molded member 21 of this embodiment is the first approaching portion 22b and the second approaching portion 22b.
The first approaching portion 22b and the second approaching portion 23b are substantially U-shaped including the approaching portion 23b, and there are a plurality of surplus portions 29 produced by injection molding. Therefore, there is a possibility that the first approaching portion 22b and the second approaching portion 23b may be connected via the surplus portion 29. Moreover, since the heating element 11 obtained by firing the unfired ceramic molded member 21 has conductivity, if the ceramic heater 10 is used while the surplus portion 29 is present in the first approaching portion 22b and the second approaching portion 23b. However, there is a fear that an electrical short circuit may occur via the surplus portion.
【００３９】これに対し、本実施形態の除去工程では、
このような未焼成セラミック成形部材２１のうち、第１
接近部２２ｂ及び第２接近部２３ｂに生じた余剰部分２
９についてもレーザによって切断し、切断した余剰部分
２９を吸引して確実に除去することができた。このた
め、本実施形態では、除去工程後の未焼成セラミック成
形部材２１のうち第１接近部２２ｂ及び第２接近部２３
ｂには、図８に示したように、余剰部分２９が存在する
ことがなく、焼成後のセラミックヒータ１０について、
余剰部分を介して電気的なショートが生じる虞はなくな
った。On the other hand, in the removing process of this embodiment,
Of such unfired ceramic molded members 21, the first
Surplus portion 2 generated in the approaching portion 22b and the second approaching portion 23b
With respect to 9 as well, it was possible to cut by a laser, and the cut excess portion 29 could be sucked and reliably removed. Therefore, in this embodiment, the first approaching portion 22b and the second approaching portion 23 of the unfired ceramic molded member 21 after the removing step are performed.
In b, as shown in FIG. 8, the surplus portion 29 does not exist, and the ceramic heater 10 after firing is
There is no longer a possibility that an electrical short will occur via the surplus portion.
【００４０】その後、公知の手法によって、図１に示す
ような、セラミックヒータ１０を用いたグロープラグ１
を完成させる。具体的には、まず、金属製の外筒２内に
セラミックヒータ１０を挿入し、その先端部１０ｂが金
属製の外筒２から突出するような位置で、両者をろう付
けにより接合する。次いで、これらと金属軸６とをバネ
状の結合部材５の両端部に嵌合させて連結し、さらに、
この連結したものを筒状の金属ハウジング３内に挿入
し、外筒２と金属ハウジング３とをろう付けにより接合
する。次いで、金属軸６の後端側から絶縁ブッシュ８を
嵌め込み、さらに、金属軸６のネジ部６ｂにナット７を
螺挿して金属ハウジング３に向けて締付けることによ
り、金属軸６を金属ハウジング３に対して固定する。こ
のようにして、図１に示すような、セラミックヒータ１
０を用いたグロープラグ１を完成させた。After that, the glow plug 1 using the ceramic heater 10 as shown in FIG.
To complete. Specifically, first, the ceramic heater 10 is inserted into the metal outer cylinder 2, and the two are joined by brazing at a position where the tip 10b of the ceramic heater 10 projects from the metal outer cylinder 2. Next, these and the metal shaft 6 are fitted and connected to both ends of the spring-shaped coupling member 5, and further,
The connected one is inserted into the cylindrical metal housing 3, and the outer cylinder 2 and the metal housing 3 are joined by brazing. Then, the insulating bush 8 is fitted from the rear end side of the metal shaft 6, and the nut 7 is screwed into the threaded portion 6b of the metal shaft 6 and tightened toward the metal housing 3 to fix the metal shaft 6 to the metal housing 3. Fix it against. In this way, the ceramic heater 1 as shown in FIG.
The glow plug 1 using 0 was completed.
【００４１】以上において、本発明を実施形態に即して
説明したが、本発明は上記実施形態に限定されるもので
はなく、その要旨を逸脱しない範囲で、適宜変更して適
用できることはいうまでもない。例えば、実施形態で
は、レーザ加工装置４０を用いて余剰部分２９を切断し
た後に、吸引除去装置５０を用いて切断した余剰部分２
９を吸引して除去した。しかし、吸引除去装置５０を用
いて吸引しつつ、レーザ加工装置４０を用いて余剰部分
２９を切断するようにしても良い。このようにすれば、
切断された余剰部分２９が、未焼成セラミック成形部材
２１に付着する可能性をさらに小さくできるので好まし
い。さらに、切断された余剰部分２９の除去にあたって
は、上記実施形態のように吸引装置５０を用いずに、公
知の空気噴出装置を用いて一体成形体２０を搭載してい
る第１金型３１に加圧空気を供給し、切断したバリ２９
ｂ等を飛散させつつ除去しても良い。Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments, and it is needless to say that the present invention can be appropriately modified and applied without departing from the scope of the invention. Nor. For example, in the embodiment, after the surplus portion 29 is cut by using the laser processing device 40, the surplus portion 2 is cut by using the suction removing device 50.
9 was aspirated off. However, the surplus portion 29 may be cut using the laser processing device 40 while suctioning using the suction removing device 50. If you do this,
It is preferable that the cut surplus portion 29 can further reduce the possibility of being attached to the unfired ceramic molded member 21. Further, in removing the cut excess portion 29, the first mold 31 on which the integrally molded body 20 is mounted by using a well-known air ejection device without using the suction device 50 as in the above embodiment. Burr 29 cut by supplying pressurized air
It may be removed while scattering b and the like.
【００４２】また、本実施形態の除去工程に供した未焼
成セラミック成形部材２１は、第１接近部２２ｂ及び第
２接近部２３ｂを含む略Ｕ字形状であったが、このよう
な形状に限定されることはない。本実施形態の除去工程
は、直線形状、方形状、コイル形状等、いずれの形状の
未焼成セラミック成形部材についても、射出成形で生じ
た余剰部分を高精度に除去することができる。また、本
実施形態では、未焼成セラミック成形部材２１と分割絶
縁部材２７，２８とを一体にした複合成形体６０を焼成
してセラミックヒータ１０（焼成済セラミック成形体）
とした。しかし、未焼成セラミック成形部材２１のみを
焼成して焼成済セラミック成形体としても良い。The unfired ceramic molded member 21 used in the removing step of this embodiment has a substantially U-shape including the first approaching portion 22b and the second approaching portion 23b, but is not limited to such a shape. It will not be done. In the removing step of the present embodiment, it is possible to remove the surplus portion produced by injection molding with high accuracy for any shape of the unfired ceramic molded member such as a linear shape, a rectangular shape, and a coil shape. Further, in the present embodiment, the ceramic heater 10 (fired ceramic molded body) is obtained by firing the composite molded body 60 in which the unfired ceramic molded member 21 and the divided insulating members 27 and 28 are integrated.
And However, only the unfired ceramic molded member 21 may be fired to obtain a fired ceramic molded body.
【００４３】また、本実施形態では、ＣＯ２レーザ加工
装置４０を用いて、未焼成セラミック成形部材２１にＣ
Ｏ２レーザを照射したが、ＹＡＧレーザ加工装置を用い
てＹＡＧレーザを照射するようにしても良い。また、本
実施形態では、未焼成セラミック成形部材２１の加工位
置の位置決めを、第１金型３１に形成されている基準マ
ーク３１ｂを画像認識により検出し、Ｘ−Ｙテーブル４
１を移動させるようにしたが、レーザ照射部をＸ−Ｙ方
向に移動させるようにしても良い。また、基準マーク３
１ｂを用いずに、第１金型３１の枠体から外側に突出し
ている第１電極リード部材１５及び第２電極リード部材
１６を、未焼成セラミック成形部材２１ごとに画像認識
により検出しながら、Ｘ−Ｙテーブルを移動させて位置
決めするようにしても良い。In the present embodiment, the CO2 laser processing device 40 is used to apply C to the unfired ceramic molding member 21.
Although the O2 laser is applied, the YAG laser may be applied using a YAG laser processing device. Further, in the present embodiment, the positioning of the processing position of the unfired ceramic molding member 21 is detected by image recognition of the reference mark 31b formed on the first mold 31, and the XY table 4 is detected.
Although 1 is moved, the laser irradiation unit may be moved in the XY directions. Also, the reference mark 3
While detecting the first electrode lead member 15 and the second electrode lead member 16 protruding outward from the frame body of the first mold 31 without using 1b for each unfired ceramic molding member 21 by image recognition, The XY table may be moved and positioned.
【図１】実施形態にかかるセラミックヒータ１０を組付
けたグロープラグ１の部分断面図である。FIG. 1 is a partial sectional view of a glow plug 1 in which a ceramic heater 10 according to an embodiment is assembled.
【図２】実施形態にかかるセラミックヒータ１０の断面
図である。FIG. 2 is a sectional view of a ceramic heater 10 according to an embodiment.
【図３】実施形態にかかる射出成形用金型３０を示す図
であり、（ａ）はその上面図、（ｂ）はそのＡ−Ａ断面
図である。3A and 3B are diagrams showing an injection molding die 30 according to the embodiment, FIG. 3A is a top view thereof, and FIG. 3B is a sectional view taken along line AA.
【図４】実施形態にかかる射出成形後の第１金型３１に
保持された一体成形体２０を示す上面図、及び未焼成セ
ラミック成形部材２１の拡大図である。FIG. 4 is a top view showing the integrally molded body 20 held by the first mold 31 after injection molding according to the embodiment, and an enlarged view of the unfired ceramic molded member 21.
【図５】実施形態にかかる除去工程における、レーザ加
工方法を説明するための説明図である。FIG. 5 is an explanatory diagram for explaining a laser processing method in the removing step according to the embodiment.
【図６】実施形態にかかる除去工程における、レーザ加
工位置を示す説明図である。FIG. 6 is an explanatory diagram showing a laser processing position in a removing step according to the embodiment.
【図７】実施形態にかかる除去工程において、切断した
余剰部分２９を吸引除去する方法を説明するための説明
図である。FIG. 7 is an explanatory diagram for explaining a method of suction-removing the cut excess portion 29 in the removing step according to the embodiment.
【図８】実施形態にかかる未焼成セラミック成形部材２
１を示す図であり、（ａ）は上面図、（ｂ）は側面図で
ある。FIG. 8 is an unfired ceramic molded member 2 according to an embodiment.
1A and 1B, FIG. 1A is a top view, and FIG.
【図９】実施形態にかかる複合成形体６０の分解斜視図
である。FIG. 9 is an exploded perspective view of the composite molded body 60 according to the embodiment.
１ グロープラグ １０ セラミックヒータ（焼成済セラミック成形体） １２ｂ，２２ｂ 第１接近部 １３ｂ，２３ｂ 第２接近部 １１ 発熱体 １７ 絶縁性基体 ２０ 一体成形体 ２１ 未焼成セラミック成形部材 ２９ 余剰部分 ２９ｂ バリ ２９ｃ 連結部 ３０ 射出成形用金型 ３１ 第１金型（保持用金型） ３２ 第２金型（他の金型） ６０ 複合成形体 1 glow plug 10 Ceramic heater (fired ceramic compact) 12b, 22b 1st approach part 13b, 23b 2nd approach part 11 heating element 17 Insulating substrate 20 integrally molded body 21 Unfired ceramic molding 29 Surplus part 29b Bali 29c connection part 30 Injection Mold 31 1st mold (holding mold) 32 Second mold (other mold) 60 composite molded body
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｂ 3/18 Ｈ０５Ｂ 3/18 Ｆターム(参考） 3B116 AA47 AB47 BB72 BC01 3K092 PP16 QA01 QB13 QB24 QB62 QB74 QC09 QC16 QC25 QC46 RA10 RB08 RB21 RB27 RC10 RC17 VV31 VV34 4E068 AE00 CG02 DA09 DB12 4G055 AA08 AB08 BA52 BA74 BA85─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H05B 3/18 H05B 3/18 F term (reference) 3B116 AA47 AB47 BB72 BC01 3K092 PP16 QA01 QB13 QB24 QB62 QB74 QC09 QC16 QC25 QC46 RA10 RB08 RB21 RB27 RC10 RC17 VV31 VV34 4E068 AE00 CG02 DA09 DB12 4G055 AA08 AB08 BA52 BA74 BA85
Claims (7)
て、 焼成後に上記焼成済セラミック成形体の一部または全部
をなす、射出成形された未焼成セラミック成形部材につ
いて、上記射出成形で生じた余剰部分をレーザを用いて
除去する除去工程を備える焼成済セラミック成形体の製
造方法。1. A method of manufacturing a fired ceramic molded body, which comprises a step of forming an unfired ceramic molded member, which is part or all of the fired ceramic molded body after firing, by injection molding. A method for manufacturing a fired ceramic molded body, comprising a removing step of removing an excessive portion by using a laser.
の製造方法であって、 前記除去工程では、レーザを用いて切断された前記余剰
部分を吸引または飛散させて除去する焼成済セラミック
成形体の製造方法。2. The method for manufacturing a fired ceramic molding according to claim 1, wherein in the removing step, the surplus portion cut by using a laser is removed by suction or scattering. Body manufacturing method.
の製造方法であって、 前記未焼成セラミック成形部材は、一端から他端に向か
って延びる形状であって、一部と他の一部とが互いに接
近する形状を有し、焼成後に導電性を発現する材質から
なり、 前記除去工程は、上記未焼成セラミック成形部材の上記
一部と他の一部のうち少なくとも互いに接近する接近部
に生じた前記余剰部分を除去する焼成済セラミック成形
体の製造方法。3. The method for manufacturing a fired ceramic molded body according to claim 2, wherein the unfired ceramic molded member has a shape extending from one end to the other end, and a part and another The part has a shape close to each other and is made of a material exhibiting conductivity after firing, and the removing step includes at least the approaching part approaching at least one of the part and the other part of the unfired ceramic molded member. A method for manufacturing a fired ceramic molded body, which removes the surplus portion generated in the above.
の焼成済セラミック成形体の製造方法であって、 前記未焼成セラミック成形部材を射出成形に用いた複数
の金型のうち保持用金型に保持しつつ、他の金型を上記
保持用金型から分離した後、上記保持用金型に保持した
ままで上記未焼成セラミック成形部材を前記除去工程に
供する焼成済セラミック成形体の製造方法。4. The method for manufacturing a fired ceramic molded body according to claim 1, wherein the unfired ceramic molded member is used for injection molding. While holding it in the holding mold, after separating the other mold from the holding mold, the unfired ceramic molded member is subjected to the removing step while being held in the holding mold. Body manufacturing method.
の製造方法であって、 前記除去工程では、前記未焼成セラミック成形部材の加
工位置を、前記保持用金型を基準として位置決めする焼
成済セラミック成形体の製造方法。5. The method for manufacturing a fired ceramic molded body according to claim 4, wherein in the removing step, the processing position of the unfired ceramic molded member is positioned with reference to the holding die. For manufacturing a finished ceramic molded body.
部を包囲してこれと一体に焼成されてなる絶縁性基体
と、を有するセラミックヒータの製造方法であって、 焼成後に上記発熱体となる射出成形された未焼成セラミ
ック成形部材のうち、上記射出成形で生じた余剰部分を
レーザを用いて除去する除去工程を備えるセラミックヒ
ータの製造方法。6. A ceramic heater comprising: a heating element made of a conductive ceramic; and an insulating substrate made of an insulating ceramic and surrounding at least a part of the heating element and integrally fired with the heating element. A method of manufacturing a ceramic heater, comprising: a removal step of removing, with a laser, an excess portion of the injection-molded unfired ceramic molded member that becomes the heating element after firing, which is produced by firing.
方法によって製造された上記セラミックヒータを有する
グロープラグ。7. A glow plug having the ceramic heater manufactured by the method for manufacturing a ceramic heater according to claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089102A JP4202665B2 (en) | 2002-03-27 | 2002-03-27 | Method for producing sintered ceramic molded body and method for producing ceramic heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002089102A JP4202665B2 (en) | 2002-03-27 | 2002-03-27 | Method for producing sintered ceramic molded body and method for producing ceramic heater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003285314A true JP2003285314A (en) | 2003-10-07 |
| JP4202665B2 JP4202665B2 (en) | 2008-12-24 |
Family
ID=29234780
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002089102A Expired - Fee Related JP4202665B2 (en) | 2002-03-27 | 2002-03-27 | Method for producing sintered ceramic molded body and method for producing ceramic heater |
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| JP (1) | JP4202665B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008123296A1 (en) | 2007-03-29 | 2008-10-16 | Kyocera Corporation | Ceramic heater, and its mold |
| EP2219414A1 (en) | 2007-10-29 | 2010-08-18 | Kyocera Corporation | Ceramic heater, and glow plug having the heater |
| JP2011516318A (en) * | 2008-04-18 | 2011-05-26 | スネクマ | Method for deburring ceramic casting cores |
| WO2022024474A1 (en) * | 2020-07-30 | 2022-02-03 | 株式会社日立ハイテクファインシステムズ | Processing method and processing apparatus |
-
2002
- 2002-03-27 JP JP2002089102A patent/JP4202665B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008123296A1 (en) | 2007-03-29 | 2008-10-16 | Kyocera Corporation | Ceramic heater, and its mold |
| EP2141961A1 (en) * | 2007-03-29 | 2010-01-06 | Kyocera Corporation | Ceramic heater, and its mold |
| JPWO2008123296A1 (en) * | 2007-03-29 | 2010-07-15 | 京セラ株式会社 | Ceramic heater and its mold |
| KR101089678B1 (en) | 2007-03-29 | 2011-12-07 | 쿄세라 코포레이션 | Ceramic heater, and its mold |
| EP2141961A4 (en) * | 2007-03-29 | 2012-05-02 | Kyocera Corp | Ceramic heater, and its mold |
| JP4989719B2 (en) * | 2007-03-29 | 2012-08-01 | 京セラ株式会社 | Ceramic heater and its mold |
| US8530802B2 (en) | 2007-03-29 | 2013-09-10 | Kyocera Corporation | Ceramic heater and mold |
| EP2219414A1 (en) | 2007-10-29 | 2010-08-18 | Kyocera Corporation | Ceramic heater, and glow plug having the heater |
| EP2219414B1 (en) * | 2007-10-29 | 2017-03-22 | Kyocera Corporation | Ceramic heater, and glow plug having the heater |
| JP2011516318A (en) * | 2008-04-18 | 2011-05-26 | スネクマ | Method for deburring ceramic casting cores |
| WO2022024474A1 (en) * | 2020-07-30 | 2022-02-03 | 株式会社日立ハイテクファインシステムズ | Processing method and processing apparatus |
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