JP2003285297A - Ultrasonically vibrating cutting tool and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the durability of a blade. <P>SOLUTION: In an ultrasonically vibrating cutting tool 1, having an initial form comprising a tool body 2 made of aluminum which is one of the materials having good acoustical characteristics, a vibration converting part 3, a protrusion 4, tool fit-engaging parts 6 and screw holes 7, etc., all the parts except one side face of the protrusion 4 and one part of the outer circumferential face of the vibration converting part 3, that is, the tool body 2, the outer circumferential face of the vibration converting part 3 at the location of the margin of the one side face of the protrusion 4, the circumferential face and the other side face of the protrusion 4, the tool fit- engaging parts 6, and the screw holes 7, etc., are masked with a masking member 10. Thereafter, the ultrasonically vibrating cutting tool 1 is placed in a plating bath 31 wherein a blade 5 of a mixture of large-diameter and small-diameter particles of diamonds is developed, with the protrusion 4 as a seed, at a portion not covered with the masking material 10, thereby growing a form wherein the gaps between mutually adjacent large-diameter diamond particles 36 on the blade 5 are filled with a plurality of small-diameter diamond particles 37 while the latter are bonded with the large-diameter diamond particles 36. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic vibration cutting tool and a method for manufacturing the same.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication No. 2001-162493 discloses an ultrasonic vibration cutting tool having a blade containing diamond as a main component by an electrolytic plating method using a plating solution containing diamond powder.

[0003]

However, in the conventional example, when cutting was performed, there was a problem that the diamond fell off from the blade and the life of the blade was short.

Therefore, the present invention provides an ultrasonic vibration cutting tool capable of improving the durability of the blade and a method of manufacturing the same.

[0005]

In the ultrasonic vibration cutting tool according to the present invention, the outer peripheral surface of the tool body is mainly composed of protrusions and mixed diamonds of large and small grain sizes supported by the protrusions. With the blade is provided, the tip of the blade is projected outward than the projection, in the blade a plurality of small-diameter diamond while filling the gap between the large-diameter diamond is bonded with the large-diameter diamond, Compared to the case where the particle size of diamond powder is unified,
The durability of the blade can be improved. In the method of manufacturing an ultrasonic vibration cutting tool according to the present invention, the tool body having the protrusions is immersed in a plating solution containing a large-diameter diamond powder and a small-diameter diamond powder, and electrolytic plating is used. Easily manufacture ultrasonic vibration cutting tools with blades containing diamonds with large and small grain sizes as the main components by growing blades containing diamonds with large and small grain sizes as the main component can do. Further, in the method for manufacturing an ultrasonic vibration cutting tool according to the present invention, if the protrusion is removed so as to be inside the tip of the blade after the blade is grown, the outer diameter of the blade is appropriately formed. be able to.

[0006]

1 to 3 show a first embodiment, FIG. 1 shows a method for manufacturing an ultrasonic vibration cutting tool 1, and FIG. 2 shows an ultrasonic vibration cutting tool 1 and a booster 11. 3 shows a coupling structure of the vibrator 15 and the vibrator 15, and FIG. 3 shows an ultrasonic vibration cutting machine.

Referring to FIG. 1, an ultrasonic vibration cutting tool 1
The manufacturing method of will be described. In this manufacturing method, first, as shown in FIG. 1A, an initial shape made of aluminum, which is one of the materials with good acoustic characteristics of the ultrasonic vibration cutting tool 1, is formed. In this initial shape, the ultrasonic vibration cutting tool 1 includes a tool body 2, a vibration converting portion 3, a protrusion 4, a tool fitting portion 6, a screw hole 7, and the like. The tool body 2 is
It is an ultrasonic horn having a length of ½ wavelength that resonates with ultrasonic vibration input from one end. At both ends of the tool main body 2, there are maximum vibration amplitude points f1 and f3 of a vibration waveform W1 showing a momentary displacement (vibration amplitude) vibrating in the axial direction shown by an arrow X1 as shown in FIG. At the center of the tool body 2, there is a minimum vibration amplitude point f2 of the vibration waveform W1.

The vibration converting portion 3 is an annular shape that projects coaxially with the tool body 2 outside the outer peripheral surface of the tool body 2 at the position of the minimum vibration amplitude point f2 of the vibration waveform W1. Vibration converter 3
Has a diameter larger than that of the tool body 2 and a width evenly distributed on both sides in the axial direction about the minimum vibration amplitude point f2, and converts the vibration transmission direction from the axial direction to the radial direction indicated by arrow Y. The instantaneous displacement (vibration amplitude) of the ultrasonic vibration in which the vibration transmission direction is converted to the radial direction is the vibration waveform W2. The maximum vibration amplitude points f4 and f5 in the vibration waveform W2 exist on the outer peripheral side of the vibration conversion unit 3. The protrusion 4 is an annular shape that projects coaxially with the tool body 2 outside the outer peripheral surface of the vibration converting portion 3. The protrusion 4 is displaced from the position of the minimum vibration amplitude point f2 to the vicinity of one side in the axial direction. The tool fitting portion 6 is provided on the outer peripheral surface of the tool body 2 at a position where it does not interfere with the vibration converting portion 3. The screw hole 7 is formed inside the center of both end surfaces of the tool body 2.

Next, as shown in FIG. 1B, a portion of the protrusion 4 excluding a side surface and a part of the outer peripheral surface of the vibration converting portion 3, that is, the tool main body 2 and the periphery of the protrusion 4 on one side surface. The outer peripheral surface of the vibration converting portion 3, the peripheral surface and the other side surface of the protrusion 4, the tool fitting portion 6, the screw hole 7 and the like are covered (masking) with a masking member 10. After that, as shown in FIG. 1c, the masked member shown in FIG. B is put in a plating bath 31 and a diamond blade 5 mixed with large and small particles is coated with a masking member 10 using the projections 4 as seeds. Not grow to the part. The plating bath 31 is filled with a plating solution 32 in which a nickel sulfate solution, a large-diameter diamond powder 36, and a small-diameter diamond powder 37 are mixed.

As the diamond powder, for example, a combination of a diamond powder 36 having a large particle size of several tens μm and a diamond powder 37 having a small particle size of several μm, a diamond powder 36 having a large particle size of μm and a small particle of nm is used. The diamond powder 37 having a diameter is combined with the diamond powder 36 having a large particle diameter of several tens of μm and the diamond powder 37 having a small particle diameter of nm. The positive electrode 33 of the power source for plating is connected to the portion of the protrusion 4 other than the blade growth portion, and the negative electrode 34 of the power source for plating is connected to the plating tank 31. Then, the masked ultrasonic vibration cutting tool 1 of FIG. B is immersed in the plating solution 32, and the plating solution 32 is stirred by the rotary blades 35, and the plating power is turned on.
By this electrolytic plating method, as shown in FIG. 1D, the protrusions 4 are formed in a state where the large-diameter diamond powder 36 and the small-diameter diamond powder 37 in the plating solution 32 are mixed with each other.
Is used as a seed to grow on one side surface of the protrusion 4 and a part of the outer peripheral surface of the vibration converting portion 3 to form a blade 5 containing diamond having large and small grain sizes as a main component. When the blades 5 are bonded to the large-diameter diamond powders 36 while filling the gaps between the large-diameter diamond powders 36 adjacent to each other with a plurality of small-diameter diamond powders 37, when the particle sizes of the diamond powders are unified. The durability of the blade 5 can be improved as compared with.

Then, after the ultrasonic vibration cutting tool 1 shown in FIG. 1D is taken out from the plating bath 31, the masking member 10 is removed. This grown blade 5 is located at the minimum vibration amplitude point f2 as shown in FIG. 2e, and its thickness t is, for example, several microns to 200 microns. Further, as shown in FIG. 1e, after the portions other than the removed portion 4a, which is the outer peripheral portion of the protrusion 4, are covered with a masking member (not shown), the removed portion 4a of the protrusion 4 is removed by aluminum etching. Has a smaller outer diameter than the outer diameter of the blade 5, and the tip of the outer peripheral portion of the blade 5 projects outward in the radial direction with respect to the projection 4, and ultrasonic waves in which the tool body 2 and the blade 5 are integrated with each other. The vibration cutting tool 1 is obtained.

The form of the ultrasonic vibration cutting tool 1 used for ultrasonic vibration cutting will be described with reference to FIG. A booster 11 is provided at one end of the tool body 2 with a headless screw 1
6 and the oscillator 15 is connected to one end of the booster 11.
Are joined by headless screws 17. The booster 11 is made of a material having good acoustic characteristics, such as titanium, aluminum, or hardened iron, and has a length of one wavelength that resonates with the ultrasonic vibration transmitted from the vibrator 15. At both ends of the booster 11, the maximum vibration amplitude point f of the vibration waveform W1
There are 11 and f15. Tool body 2 and booster 11
And form a resonator.

The booster 11 includes a front and rear support portion 12 and a tool fitting portion 13. The support portion 12 has a crank shape including a thick root portion 12a, a thin portion 12b, and a thick portion 12c. The root portion 12a is the minimum vibration amplitude point f of the booster 11.
12; An annular shape that projects radially outward from the outer surface of the booster 11 at the position of f14. The thin portion 12b is the root portion 12
It has a cylindrical shape protruding from the peripheral edge of a in a direction parallel to the axial direction. The thick portion 12c is an annular shape that projects radially outward from the tip of the thin portion 12b. The crank shape of the support portion 12 is symmetrical to the left and right, but the left and right directions may be the same. The tool fitting portion 13 is provided on the outer peripheral surface of the booster 11 at a position where it does not interfere with the support portion 12.

Then, for example, in a state where the supporting portion 12 is supported by the ultrasonic vibration rotation mechanism 21 of FIG.
When ultrasonic vibration is generated by electric energy in 5, the ultrasonic vibration is transmitted from the vibrator 15 to the tool main body 2 via the booster 11, and the tool main body 2 resonates with the ultrasonic vibration transmitted from the vibrator 15. Then, the outer peripheral surface of the blade 5 vibrates in the radial direction indicated by the arrow Y. The radial vibration of the outer peripheral surface of the blade 5 is determined by the amount of protrusion from the vibration conversion unit 3. If the diameter of the blade 5 is too larger than the diameter of the vibration converting portion 3, the outer peripheral surface of the blade 5 also vibrates in the direction of the arrow X1. It is set within a range that vibrates only in the Y direction.

Referring to FIG. 3, ultrasonic vibration cutting tool 1
The cutting process using is explained. A description will be given of an example of a cutting process for cutting a semiconductor wafer 23 having an IC or the like as a member to be cut into a plurality of dice-shaped semiconductor chips called bare chips. The booster 11 and the vibrator 15 of FIG. 2 are coaxially incorporated in the ultrasonic vibration rotation mechanism 21 of the ultrasonic vibration cutting device 20, and the support portions 12 before and after the booster 11 of FIG.
1, the vibration converting portion 3 of the ultrasonic vibration cutting tool 1 shown in FIG. 1, the blade 5 and the protrusion 4 are arranged outside the ultrasonic vibration rotating mechanism 21. Further, the semiconductor wafer 23 is fixed to the mounting table 22 of the ultrasonic vibration cutting device 20.
Then, when the operator operates the operation panel (not shown) of the ultrasonic vibration cutting device 20 and the cutting start is instructed to the control unit 24 of the ultrasonic vibration cutting device 20, the control unit 24 causes the ultrasonic vibration cutting device 20 to operate. The CCD camera 25 is instructed to start photographing.

Then, the CCD camera 25 outputs the image signal of the semiconductor wafer 23 on the mounting table 22 to the control section 24,
The control unit 24 outputs the positional deviation, which is the calculation result based on the image signal and the reference image information, to the mounting table 22 to activate the adjusting function of the mounting table 22 to align the semiconductor wafer 23 with the ultrasonic vibration rotation mechanism 21. finish. After that, the control unit 24 controls the ultrasonic vibration rotation mechanism 21, the three-axis drive mechanism 26 of the mounting table 22 and the vibrator 15 in FIG. 2 so that the blade 5 rotates in one direction and resonates with the ultrasonic vibration. While drawing a quadrangle locus by moving straight in the front-back, left-right and up-down directions. In one locus of the quadrangle, the blade 5 cuts the semiconductor wafer 23 once in one direction. The semiconductor wafer 23 is cut into a plurality of strips by repeating the movement of the triaxial drive mechanism 26 that draws a square trajectory. When the band-shaped cutting is completed, the control unit 24 instructs the mounting table 22 to rotate 90 degrees to activate the adjusting function of the mounting table 22 and change the orientation of the semiconductor wafer 23 with respect to the ultrasonic vibration rotation mechanism 21 by 90 degrees. In this state, the control unit 24 restarts the control of the triaxial drive mechanism 26, and the blade 5 cuts the belt-shaped semiconductor wafer 23 into a plurality of dice, thereby cutting one semiconductor wafer 23 by ultrasonic vibration rotation. The work is finished. In the step of cutting the semiconductor wafer 23, the blade 5 is cooled by the cooling system 28 of the ultrasonic vibration cutting device 20.

In the above embodiment, the protrusion 4 and the blade 5 are provided with the minimum vibration amplitude point f2 as a reference.
If the blade 5 and the blade 5 are in the axial range of the outer peripheral surface of the vibration converting portion 3, even if the blade 5 is provided at a position displaced from the minimum vibration amplitude point f2, the blade 5 can be similarly applied. The reason is that the vibration converter 3
This is because the vibration amplitude in the ultrasonic vibration converted in the radial direction indicated by the vibration waveform W2 is the same in every part of the outer peripheral surface.

FIG. 4 shows the appearance of the ultrasonic vibration cutting tool 41 according to the second embodiment. In the first embodiment, the rotary cutting type ultrasonic vibration cutting tool 1 is illustrated, while in the second embodiment, the push-cut cutting type ultrasonic vibration cutting tool 41 is shown. As shown in FIG. 4, the ultrasonic vibration cutting tool 41 of the second embodiment has an initial shape made of aluminum having a tool body 42, a protrusion 43, and a screw hole 44 and having good acoustic characteristics. Tool body 4
Reference numeral 2 denotes a rectangular rod having a vertical length of ½ wavelength of the resonance frequency resonating with the ultrasonic vibration input from the vibrator 15 via the booster 46 of FIG. Is the maximum vibration amplitude point. The projection 43 is a laterally elongated plate-like member that projects downward from the lower end surface of the tool body 42. The screw hole 44 is formed in the center of the upper end of the tool body 42 for fastening a headless bolt.

In the initial shape of the ultrasonic vibration cutting tool 41, the portion excluding one side surface of the protrusion 43, that is, the tool body 42, the lower surface and the other side surface of the protrusion 43, the screw hole 44, etc. are shown in FIG. Covering (masking) with the masking member 10. Thereafter, the ultrasonic vibration cutting tool 41 covered with the masking member 10 is filled with the plating solution 32 in which the nickel sulfate solution of FIG. 1, the large-diameter diamond powder 36 and the small-diameter diamond powder 37 are mixed. And the diamond blade 45 mixed with large and small particle diameters is projected into the plating bath 31 by electroplating.
3 is used as a seed and grown on a portion not covered with the masking member 10. The grown blade 45 has a protrusion 4 at the bottom.
The protrusion amount from 3 is a triangle that gradually increases from one side to the other side. Then, after removing the ultrasonic vibration cutting tool 41 from the plating bath 31, the tip end (lower end) of the protrusion 43 is removed by aluminum etching so that the lower portion of the blade 45 protrudes from the protrusion 43. Tool body 42 and blade 4 shown in FIG.
The ultrasonic vibration cutting tool 41 in which 5 and 5 are integrated is obtained.

FIG. 5 shows the appearance of the ultrasonic vibration cutting tool 51 according to the third embodiment. In the second embodiment, the rectangular rod-shaped ultrasonic vibration cutting tool 41 is exemplified, while in the third embodiment
The embodiment shows a tool 51 for ultrasonic vibration cutting of a round bar-shaped press-cutting type. As shown in FIG. 5, the ultrasonic vibration cutting tool 51 of the third embodiment has a round bar-shaped tool body 5.
The vertical length of 2 is a half wavelength of the resonance frequency resonating with the ultrasonic vibration input from the vibrator 15 via the booster 46 of FIG. 6, and is lower than the lower end surface of the tool body 52. A laterally elongated plate-like protrusion 43 protruding in the direction of
The protrusion 43 is provided with a blade 55 whose main component is a mixed diamond of large and small grain sizes. The lower portion of the blade 55 is an isosceles triangle in which the amount of protrusion from the protrusion 43 gradually increases from both sides toward the inside. Blade 5
5 is grown using the projection 43 as a seed by the same electrolytic plating method as in the second embodiment, and then the lower portion of the projection 43 is removed by aluminum etching. According to the third embodiment, the tip portion of the blade 55 is an isosceles triangle that gradually lowers from the center to both sides, so that one reciprocation by linearly moving the mounting base 66 shown in FIG. Can be cut twice.

Referring to FIG. 6, the ultrasonic vibration cutting tool 4
The cutting process using 1 will be described. Semiconductor wafer 2
In the case of pressing and cutting 3 by ultrasonic vibration, the tool main body 42 and the booster 46 are attached to the holder 62 of the ultrasonic vibration cutting device 61 in a state of being coaxially coupled with each other by a headless screw (not shown). Specifically, when the support portion 47 of the booster 46 is inserted into the through hole 63 of the holder 62 from above or below, the bolt 64 is fastened to form the split groove 65 formed on the peripheral wall of the holder 62. The narrowing reduces the diameter of the through hole 63, and the holder 62 holds the support portion 47 and supports the booster 46. Booster 46
Is a rod that resonates with ultrasonic vibration output from the vibrator 15 at a predetermined resonance frequency with a metal such as titanium having good acoustic characteristics, and the vertical length of the booster 46 is, for example, the resonance frequency. 1/2 wavelength of the booster 46 and the upper and lower ends of the booster 46 become the maximum vibration amplitude point.
The support portion 47 projects from the outer surface of the booster 46 at the minimum vibration amplitude point at the center of the. An output end, which is the maximum vibration amplitude point of the vibrator 15, is coaxially coupled to the upper end of the booster 46 with a headless screw (not shown).

The mounting table 6 of the ultrasonic vibration cutting device 61
The semiconductor wafer 23 is mounted on 6 and is fixedly supported so as not to be laterally displaced. Then, by rotating the motor 68 fixed to the support portion 67 of the ultrasonic vibration cutting device 61 in one direction, the screw rod 69 connected to the output end of the motor 68 to rotate together rotates, The support mechanism 72 having the nut 70 and the upper wall 71 fitted in the screw rod 69 descends while being guided by the sliding contact engagement between the guide mast 73 of the support mechanism 72 and the guide rail 74 fixed to the support portion 67, The blade 45 of the tool main body 42 stops from the solid line position shown in FIG. 6 to the virtual line position. This stop position is a position where the blade 45 contacts the semiconductor wafer 23 but does not contact the mounting table 66. Until the blade 45 is stopped, electric energy is supplied to the vibrator 15 from an ultrasonic oscillator (not shown) and the vibrator 1
5. Generate ultrasonic vibration in 5. The booster 46, the tool main body 42, and the blade 45 resonate with this ultrasonic vibration.
The blade 45 vibrates in the direction indicated by the arrow Z.

After that, the mounting table 66 is horizontally moved linearly from the position indicated by the solid line to the position indicated by the alternate long and short dash line by the XY drive mechanism as shown by the arrow X2, whereby the lower part of the blade 45 is moved to the position of the mounting table 66. The semiconductor wafer 23 is cut by being in contact with the upper semiconductor wafer 23 and receiving ultrasonic vibration from the blade 45. Since the lower portion of the blade 45 has a triangular shape, the lower portion of the blade 45 is located on the semiconductor wafer 2
Since the semiconductor wafer 23 is cut so as to come into contact with the part 3 from 3 and gradually increase its contact area, the cutting is appropriately performed as compared with the case where the entire lower part of the blade 45 contacts the semiconductor wafer 23 together. It is considered that the reason is that the lower part of the blade 45 acts on the semiconductor wafer 23 in a manner that the food is cut off with a knife.

In FIG. 6, the ultrasonic vibration cutting tool 5 is used.
By replacing 1 with the ultrasonic vibration cutting tool 41, the ultrasonic vibration cutting tool 51 according to the third embodiment
It can be easily understood that the push-cut cutting can be performed by the ultrasonic vibration cutting device 61 using the.

In the first to third embodiments, the semiconductor wafer 23 is used as the cutting target component. However, as the cutting target component, sticky and soft ones such as gold, silver, aluminum, solder, copper, ceramics, glass, quartz. ,silicon,
A hard and brittle material such as ferrite, a circuit board, a laminated structure composed of a synthetic resin and a metal, or a laminated structure composed of an inorganic material, a metal and a synthetic resin may be used.

[Brief description of drawings]

FIG. 1 is a process diagram showing a method of manufacturing a tool according to a first embodiment.

FIG. 2 is a side view in which the tool, the booster, and the vibrator according to the first embodiment are combined.

FIG. 3 is a side view showing a cutting apparatus using the tool according to the first embodiment.

FIG. 4 is a perspective view showing a tool according to a second embodiment.

FIG. 5 is a perspective view showing a tool according to a third embodiment.

FIG. 6 is a side view showing a cutting apparatus using the tools of the second and third embodiments.

[Explanation of symbols]

1; 41; 51 Ultrasonic vibration cutting tool 2; 42; 52 Tool body 3 Vibration converter 4; 43 protrusions 5; 45; 55 blade

Claims (3)

[Claims] 1. A tool body is provided with a protrusion and a blade supported by the protrusion and having a mixture of large and small grain diameters and containing diamond as a main component, and the tip of the blade protrudes outward from the protrusion. Ultrasonic vibration cutting tool characterized by the following. 2. A tool body having protrusions is dipped in a plating solution in which a large-diameter diamond powder and a small-diameter diamond powder are mixed, and a diamond mixed with large and small grains is formed by the electrolytic plating method using the protrusions as seeds. A method for manufacturing an ultrasonic vibration cutting tool, which comprises growing a blade comprising a main component. 3. The method for manufacturing an ultrasonic vibration cutting tool according to claim 2, wherein the protrusion is removed after the blade is grown so as to be inside the tip portion of the blade.