JP2003282633A - Connector of parts being connected - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector of parts being connected in which the yield of a product having a part being connected can be enhanced by improving the connecting state of the parts being connected. <P>SOLUTION: A region on a connector terminal 1 not overlapping a panel terminal 3 is irradiated with YAG laser using a laser irradiator 7. Consequently, a part of the connector terminal 1 is heated by laser and remaining heat is transmitted from the connector terminal 1 to cream solder 2 which is thereby fused. When the fused cream solder 2 is solidified, the connector terminal 1 and the panel terminal 3 are bonded. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connected portion connecting device for connecting a first connected portion and a second connected portion by a joining mechanism.

[0002]

2. Description of the Related Art As an example of a conventional connected portion connecting device, for example, as shown in FIG.
Carrier Package: Tape carrier package) There is a connection device. Conventionally, the TCP connecting device is used to join the connected parts by the following steps.

First, the TCP 105 as an example of the first connected part.
The TCP terminal 101 of the second device is used as a second position by using a CCD (Charge Coupled Device) camera 109 and an image processing device 110 in a positioning base 111 which is an example of a position recognition device.
Panel terminal 103 of liquid crystal panel 104, which is an example of a connected portion
Overlay on top.

Next, the TCP terminal 101 and the panel terminal 10
3 and AFC (Anisotropic C
onductive film (anisotropic conductive film) 102 is sandwiched, and a thermocompression bonding tool 108, which is an example of a bonding mechanism, is used to perform temporary pressure bonding (temporary curing), so that the panel terminal 103 is formed.
The TCP 105 is positioned with respect to. Further, using the thermocompression bonding tool 108, connect the AFC 102 to the TCP terminal 1
05 and the panel terminal 103 are thermocompression bonded (main curing).
Considering that the mechanical strength of TCP 105 or AFC 102 is not so large, the reinforcing resin 106
Is applied to the connection between the TCP 105 and the liquid crystal panel 104.

[0005]

[Problems to be Solved by the Invention] However, the ACF
When the parts to be connected are connected to each other by thermocompression-bonding 102 to the TCP terminal 105 and the panel terminal 103, connection failure may occur during thermocompression bonding, which is a factor of lowering the yield of the mounting process.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a joined portion joining apparatus capable of improving the yield by improving the joined state of the joined portions. Is to provide.

[0007]

SUMMARY OF THE INVENTION A connected portion connecting device according to the present invention comprises a positional relation recognizing device for recognizing a relative positional relation between a first connected portion and a second connected portion, and a positional relation recognizing device. On the basis of the relative positional relationship between the first connected portion and the second connected portion recognized by, the relative positional relationship between the first connected portion and the second connected portion is corrected, A positioning mechanism for superimposing the first connected portion and the second connected portion, and melting the solder between the first connected portion and the second connected portion that are overlapped by the positioning mechanism to melt the solder. A joining mechanism for joining the connected portion and the second connected portion is provided.

According to the above structure, since the first connected portion and the second connected portion are joined by solder, when the first connected portion and the second connected portion are joined by the conventional ACF. In comparison, by improving the bonding between the first connected portion and the second connected portion, the yield of products having the connected portion can be improved.

In the connected portion connecting device of the present invention, the joining mechanism indirectly heats the solder to melt the solder and join the first connected portion and the second connected portion. Good.

According to the above configuration, the first connected portion and the second connected portion can be joined without directly heating the solder, so that the first connected portion is not damaged. And the second connected portion can be joined well.

In the connected portion connecting device of the present invention, the joining mechanism heats a portion other than the portion superposed by the positioning mechanism of at least one of the first connected portion and the second connected portion. As a result, the solder may be melted to join the first connected portion and the second connected portion.

According to the above configuration, the solder is melted without damaging the portion superposed by the positioning mechanism of at least one of the first connected portion and the second connected portion, The first connected portion and the second connected portion can be joined well.

In the connected portion connecting device of the present invention, the joining mechanism may join the first connected portion and the second connected portion by melting the solder using a laser.

According to the above arrangement, damage to the heated portion can be suppressed as compared with the case where the solder is melted using another heated member.

In the connected part connecting device of the present invention, solder may be applied to at least one of the first connected part and the second connected part.

In the connected portion connecting device of the present invention, the position recognizing device performs image recognition of the first connected portion and the second connected portion to thereby connect the first connected portion and the second connected portion. It may be an image processing device that recognizes a relative positional relationship.

In the connected part connecting device of the present invention, the position recognizing device measures the amount of positional displacement between the first connected part and the second connected part, whereby the first connected part and the second connected part are measured. The positional relationship with the connected portion may be recognized.

In the connected portion connecting device of the present invention, the position recognizing device recognizes the position of the first connected portion and the position of the second connected portion in the predetermined space, whereby the first connected portion is connected. The positional relationship between the second connected part and the second connected part may be recognized.

In the connected part connecting device of the present invention, the positioning mechanism brings one of the first connected part and the second connected part closer to the other, thereby allowing the first connected part and the second connected part. You may correct | amend the relative positional relationship with a connection part.

In the connected part connecting device of the present invention, the positioning mechanism brings both the first connected part and the second connected part close to each other, thereby making it possible to connect the first connected part and the second connected part. The relative positional relationship may be corrected.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION A solder connecting device as an example of a connected portion connecting device according to an embodiment of the present invention comprises a liquid crystal panel terminal (panel terminal 3) and a second connected portion as an example of a first connected portion. The case of using for connection with the connector terminal 1 of the example will be described with reference to FIG.

The solder connecting device according to the embodiment has a stage 10 for mounting a glass substrate 5 of a liquid crystal panel having a panel terminal 3 as an example of one connected portion, and a connector as an example of the other connected portion. The connector moving device 9 is an example of a positioning mechanism for correcting the relative positional relationship between the one connected part and the other connected part while gripping the connector 4.

Although not shown in detail, the connector moving device 9 has a suction cup-like structure, and the suction cup sucks the connector 4 to move the position of the connector 4. , The position of the connector 4 with respect to the panel terminal 3 is determined.

Although the connector moving device 9 holds the connector 4 by sucking the connector 4 with a suction cup, the binder 4 is sandwiched by the binder mechanism so that the connector 4 can be held.
May be held.

Below the stage 10, a CCD camera 6 for aligning the panel terminal 3 of the liquid crystal panel and the connector terminal 1 of the connector 4 and an image processing device for image-processing information from the CCD camera 6 are provided. 8 is provided as an example of a position recognition device that recognizes the relative positional relationship between the panel terminal 3 and the connector terminal 1.

The image processing device 8 recognizes the positions of the panel terminal 3 and the connector terminal 1 by using the image data of the panel terminal 3 and the image data of the connector terminal 1 transmitted from the CCD camera 6, and the panel terminal 3 and the connector terminal 3 are recognized. The amount of positional deviation from 1 is measured. The data of the amount of positional deviation is sent to the connector moving device 9. The connector moving device 9 can correct the position of the connector terminal 1 of the connector 4 based on the amount of displacement. In the solder connection device of the present embodiment, the connector moving device 9 corrects the position of only the connector terminal 1, but it is also possible to correct only the position of the panel terminal 3 and the connector terminal 1
The position may be corrected so that both the panel terminal 3 and the panel terminal 3 come close to each other. When the position of the panel terminal 3 is corrected, as the stage 10, a movable stage whose position can be changed by being controlled by a predetermined control means is used.

Further, the solder connecting device of the present embodiment is
A laser irradiation device 7 for irradiating a laser beam is provided near the connected portion. The laser irradiation device 7 is a YAG
(Yttrium Aluminum Garnet) A combination of a laser light source and a microscope.

Laser light (arrows in the drawing) emitted from the laser irradiation device 7 passes through the glass substrate 5 provided with the panel terminals 3 and is applied to the connector terminals 1 of the connector 4.

The panel terminal 3 of the liquid crystal panel is provided on a glass substrate 5 having a thickness of 0.2 mm to 1.2 mm, and an ITO (Indim Tin Oxid) having a line width of 50 μm to 1 mm.
e) / Ta (tantalum) laminated film.
The connector terminal 1 of the connector 4 is a terminal made of a resin, provided on a base material having a length of 0.3 mm to 3 mm and a width of 1 mm to 50 mm, and a copper foil having a line width of 50 μm to 1 mm.

Although the liquid crystal panel terminal and the connector terminal are used as the one connected portion and the other connected portion in the connected portion connecting device of the present embodiment, the connected portion for connecting to an external member is used. As long as it has
It is not limited to this.

Next, the solder connection method of the solder connection device, which is an example of the connection target connection device of this embodiment, will be described in detail.

First, in the solder connection method of the solder connection device, the glass substrate 5 constituting the liquid crystal panel is placed on the stage 10. Next, using a movable pressure pin (not shown), a predetermined two adjacent sides of the four sides of the rectangular glass substrate 5 when viewed from the upper surface side are aligned in the direction along the main surface of the glass substrate 2. In addition, by pressing in the diagonal direction of the rectangle, and by using the fixing pin (not shown), the other two adjacent sides of the glass substrate 5 pressed by the pressure pin are received. Position 3 is fixed. After that, the connector moving device 9 moves the connector 4 onto the panel terminal 3 of the liquid crystal panel while gripping the connector 4. Then, the panel terminal 3 and the connector terminal 1 are superposed.

Next, each terminal of the panel terminals 3 and each terminal of the connector terminals 1 are C
Accurate alignment is performed using the CD camera 6 and the image processing device 8. The alignment accuracy at this time is
Within ± 50 μm.

Next, using the panel terminal 3 and the connector terminal 1, the length is 0.3 mm to 5 mm and the width is 1 mm to 50 m.
The plate-shaped cream solder 2 having a thickness of 5 m and a thickness of 5 μm to 1 mm is sandwiched. Here, the cream solder 2 is applied onto the panel terminal 3 using a metal mask having a plurality of holes.

Further, a YAG laser is radiated by using the laser radiating device 7 to a region of the connector terminal 1 where the connector terminal 1 and the panel terminal 3 do not overlap each other.

As a result, a part of the connector terminal 1 is heated by the laser, and the residual heat is conducted from the connector terminal 1 to the cream solder 2. As a result, the cream solder 2 melts. When the melted cream solder 2 is cured, the connector terminal 1 and the panel terminal 3 are connected.

The TCP connecting device, which is an example of the connected part connecting device described in the prior art, requires temporary press-bonding, main curing, and application of a reinforcing resin, so that it takes a lot of time and labor to switch production models. Since it takes a huge amount of time for the operator to set the conditions of the apparatus, it is difficult to reduce the manufacturing cost. Further, in the TCP connecting device that connects the connected parts using the ACF, which is an example of the bonding material, the cost of the product is high because the member cost of the ACF itself is high.

However, the solder connecting device as an example of the connected part connecting device of the present embodiment has the following effects as compared with the conventional TCP connected part connecting device.

In the connected part connecting device of the present embodiment, a part of the connector terminal 1 is heated by a laser, and the residual solder is used to melt the cream solder 2 to connect the connector terminal 1 to the panel terminal 3. To do. Therefore, according to the connected portion connecting device of the present embodiment, since it is not necessary to directly heat the connected portion, the cream solder 2, the connector terminal 1 and the panel terminal 3 of the connected portion are not damaged by the laser, The connector terminal 1 and the panel terminal 3 can be connected.

Further, according to the connected part connecting device of the present embodiment, unlike the conventional TCP connecting device, the steps of temporary press-bonding, main curing, and application of the reinforcing resin are not performed, and therefore, the production is performed. The tact time can be greatly reduced.

According to the connected portion connecting device of the present embodiment, the cream solder 2 is used to connect the connected portions to each other, so that the manufacturing cost can be reduced and the connector terminal 1 and the panel terminal can be connected. The connection between 3 and 3 can be performed well.

It should be considered that the embodiments disclosed this time are exemplifications in all points and not restrictive. The scope of the present invention is shown not by the above description but by the scope of the claims, and is intended to include meanings equivalent to the scope of the claims and all modifications within the scope.

[0043]

According to the connected portion connecting device of the present invention, since the first connected portion and the second connected portion are joined by soldering, the first connected portion and the second connected portion are connected by the conventional ACF. By improving the bonding between the first connected portion and the second connected portion as compared with the case of joining the connected portion, the yield of products having the connected portion can be improved.

[Brief description of drawings]

FIG. 1 is a schematic diagram for explaining a solder connecting device according to an embodiment.

FIG. 2 is a schematic diagram for explaining a conventional TCP connection device.

[Explanation of symbols]

1 connector terminal, 2 cream solder, 3 panel terminal, 4 connector, 5 glass substrate, 6 CCD camera,
7 laser irradiation device, 8 image processing device, 9 connector moving device, 10 stages.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/36 H05K 3/36 BF term (reference) 2H088 FA30 HA02 HA05 HA06 MA20 2H092 GA45 GA46 GA48 GA50 GA51 GA59 NA29 5E319 AA03 AB05 AC01 BB05 CC46 CD04 CD29 CD53 GG03 GG15 5E344 AA02 BB04 DD02 EE16 EE23 EE26 5F044 NN13 NN18

Claims (4)

[Claims] 1. A positional relationship recognizing device for recognizing a relative positional relationship between a first connected part and a second connected part, and the first connected part and the first connected part recognized by the positional relationship recognizing device. 2 The relative positional relationship between the first connected portion and the second connected portion is corrected based on the relative positional relationship between the first connected portion and the second connected portion. A positioning mechanism for superposing with the connected part, and melting solder between the first connected part and the second connected part which are superposed by the positioning mechanism,
A connected portion connecting device comprising a joining mechanism for joining the first connected portion and the second connected portion. 2. The bonding mechanism indirectly heats the solder to melt the solder and bond the first connected part and the second connected part. The connected part connection device described. 3. The joining mechanism heats at least one of the first connected portion and the second connected portion other than the portion superposed by the alignment mechanism, The solder is melted to bond the first connected portion and the second connected portion.
Connected part connection device according to. 4. The bonding mechanism according to claim 1, wherein the solder is melted by using a laser to bond the first connected part and the second connected part. Connected part connection device.