JP2003280535A - Method for manufacturing display device, apparatus for manufacturing display device, display device and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide means which can flexibly deal with a display device employing a liquid drop discharge system/or a device according to the kinds of the manufacturing process steps to be applied. <P>SOLUTION: The constitution/method for controlling a relative velocity V, a discharge period T and a diameter D so as to satisfy the relation VT<D are adopted when the relative velocity of a liquid drop discharge head to a wafer is defined as V, the discharge period of the liquid drops as T, and the diameter of the liquid drops after the liquid drops land on the wafer and expand to wet as D. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device manufacturing method and a display device manufacturing apparatus for manufacturing a display device by discharging liquid droplets from a plurality of nozzles, and a display device manufacturing method and a display device manufacturing apparatus. Display device and a device manufactured with the display device. In particular, the present invention relates to a display device manufacturing method and a display device manufacturing apparatus that can flexibly respond to the type of manufacturing process to be applied, and a display device and a device manufactured by the display device manufacturing method and the display device manufacturing apparatus.

[0002]

2. Description of the Related Art In recent years, the development of personal computers,
In particular, with the development of portable personal computers, the demand for liquid crystal displays, especially color liquid crystal displays, tends to increase. However, cost reduction is necessary for further popularization, and there is an increasing demand for cost reduction of a color filter, which has a particularly large weight in terms of cost.

As a method of manufacturing a color filter of this type, conventionally, there are a dyeing method, a pigment dispersion method, an electrodeposition method and the like. Further, in order to reduce cost, a method of forming by a printing method or a droplet discharge method is used. Proposed. Regarding the droplet discharge method, for example, in Japanese Patent Laid-Open No. 59-75205,
A method has been proposed in which droplets containing dyes of three colors of R, G, and B are applied onto a substrate by a droplet discharge method, and each droplet is dried to form a colored portion. In such a droplet discharge method, each pixel of R, G, and B can be formed in one process, so that the manufacturing process can be greatly simplified and the cost can be significantly reduced. In addition to the R, G, and B coloring of each pixel of the color filter, this droplet discharge method also manufactures an organic EL element, forms a photoresist, forms an overcoat, forms an alignment film, and the like. It can also be used for forming a liquid crystal film, metal wiring, and the like.

[0004]

As described above, although the droplet discharge method has the ability to cover a wide range in each manufacturing process of the display device, what is formed by the discharged droplets correspondingly. Since the ejection conditions (for example, the ejection amount of droplets) vary depending on the conditions, it is necessary to secure the optimal ejection conditions according to the manufacturing process in order to improve the product yield.

The present invention has been made in view of the above circumstances, and provides a means capable of flexibly responding to the type of manufacturing process to be applied in manufacturing a display device / device using a droplet discharge method. To aim.

[0006]

The present invention adopts the following means in order to solve the above problems. [1] A method of manufacturing a display device by ejecting liquid droplets toward a substrate from a plurality of nozzles provided in the liquid droplet ejecting head, wherein a relative speed of the liquid droplet ejecting head with respect to the substrate is V, and the liquid is the liquid. When the droplet discharge cycle is T and the diameter of the droplet after landing on the substrate and spreading is D, VT
A method for manufacturing a display device, wherein the relative velocity V, the ejection period T, and the diameter D are controlled so as to satisfy the relationship of <D. According to the display device manufacturing method of [1], even if it is necessary to change the relative velocity V depending on the type of manufacturing process to be applied, for example, the viscosity of the discharged droplet, VT <D Optimum ejection conditions for securing the yield by simply selecting a combination of the droplet diameter D (that is, the ejection amount) and the ejection cycle T that satisfy the relationship so that the droplets ejected on the substrate are not separated from each other. Will be able to secure. Further, even when it becomes necessary to change the ejection amount (that is, the diameter D of the droplet), similarly, only by selecting the combination of the relative velocity V and the ejection cycle T that satisfies the relationship of VT <D, The droplets discharged onto the substrate do not separate from each other, and it becomes possible to secure the optimum discharge conditions for securing the yield. Also,
For example, even if the ejection cycle T can be shortened due to the performance improvement of the droplet ejection head, the substrate is simply selected by selecting a combination of the relative velocity V and the diameter D that also satisfies the relationship of VT <D. The droplets ejected on top of each other do not separate from each other, and it becomes possible to secure the optimum ejection conditions for securing the yield. Moreover, in any of these cases, the diameter D of the droplet, which is one of the control elements, is
Since the dimension after landing on the substrate and spreading after wetting is adopted, while maintaining the overlapping portion between adjacent droplets,
It becomes possible to widen the space between each droplet as much as possible.

[2] In the display device manufacturing method according to the above [1], a display is characterized in that the overlapping portion between the droplets after landing on the substrate and spreading by wetting is arranged on a straight line. Device manufacturing method. According to the method for manufacturing a display device described in [2], it is possible to form a linearly continuous printed line without a break.

[3] A display device manufacturing method characterized by manufacturing a color filter substrate by using the display device manufacturing method described in [2] above. According to the method for manufacturing a display device described in [3], it is possible to form a linearly continuous printed line (each colored line of R, G, and B) without breaks in each pixel. .

[4] In the method of manufacturing a display device according to the above [3], the discharge pattern of the droplets on the color filter substrate is a stripe type in which all the pixels in one direction have the same color, or The mosaic type in which the color arrangement of the three primary colors is repeated in one direction of the pixel arrangement, or the delta type in which the three primary colors are arranged in a triangular shape and arranged such that the relative pixel arrangement between adjacent columns is staggered, A method for manufacturing a display device, comprising: According to the display device manufacturing method of [4], it is possible to provide a color filter substrate with less color unevenness in any of the ejection patterns.

[5] A method for manufacturing a display device, which comprises manufacturing an organic EL element using the method for manufacturing a display device according to the above [2]. According to the method for manufacturing a display device described in [5], it is possible to form a continuous linear print line (each line of R, G, and B) in each pixel without a break.

[6] A method of manufacturing a display device, wherein metal wiring of the display device is performed by using the method of manufacturing the display device according to the above [2]. According to the method of manufacturing a display device described in [6], it is possible to form metal wiring that is continuous and has no breaks. Therefore, it is possible to manufacture a liquid crystal display device or the like with few defective conduction. it can.

[7] In the method for manufacturing a display device according to the above [1], the overlapping portions between the liquid droplets that have landed on the substrate and have spread wet are arranged in both the column direction and the row direction. A method for manufacturing a display device, which comprises forming a film. According to the method for manufacturing a display device described in [7], it is possible to form a coating film that is free from omissions (portions where droplets are not ejected) in plan view.

[8] A photoresist is formed, an overcoat is formed, an alignment film is formed, or a liquid crystal film is formed by using the display device manufacturing method described in [7]. And a method for manufacturing a display device.
According to the method for manufacturing a display device described in [8], there is no dropout (a portion where no droplet is ejected) in plan view.
The L element can be manufactured, the photoresist can be formed, the overcoat can be formed, the alignment film can be formed, and the liquid crystal film can be formed.

[9] A device for manufacturing a display device by ejecting liquid droplets toward a substrate from a plurality of nozzles provided in the liquid droplet ejecting head, wherein the relative speed of the liquid droplet ejecting head with respect to the substrate is V. , T is the discharge cycle of the droplets, and D is the diameter of the droplets after the droplets have landed on the substrate and spread, and the relative velocity V and the discharge are set so as to satisfy the relationship of VT <D. A display device manufacturing apparatus comprising a control means for controlling the period T and the diameter D. According to the display device manufacturing apparatus of [9], even if it is necessary to change the relative speed V depending on the type of manufacturing process to be applied, for example, the viscosity of the discharged droplets, the control means can control the relative speed. , VT <D, only by selecting a combination of the droplet diameter D (that is, the ejection amount) and the ejection cycle T, the droplets ejected onto the substrate are not separated from each other and the yield is secured. It becomes possible to secure the optimum discharge conditions of. Also, when it is necessary to change the ejection amount (that is, the diameter D of the droplet), the control means similarly sets the combination of the relative velocity V and the ejection cycle T so as to satisfy the relationship of VT <D. By only selecting, the droplets ejected on the substrate are not separated from each other, and it becomes possible to secure the optimum ejection conditions for securing the yield. Further, for example, even when the ejection cycle T can be shortened due to the performance improvement of the droplet ejection head, the control means similarly combines the relative velocity V and the diameter D so as to satisfy the relationship of VT <D. By simply selecting, the droplets ejected on the substrate do not separate from each other, and it becomes possible to secure the optimal ejection conditions for securing the yield. Moreover, in any of these cases, since the diameter D of the droplet, which is one of the control elements, is the dimension after the droplet has landed on the substrate and has spread, the overlapping portion between the adjacent droplets. It becomes possible to widen the space between the liquid droplets as much as possible while maintaining the above.

[10] In the display device manufacturing apparatus according to the above [9], the control means arranges the overlapping portion between the droplets after they have landed on the substrate and spread by wetting, on a straight line. An apparatus for manufacturing a display device, which is characterized in that According to the display device manufacturing apparatus of [10],
It becomes possible to form an unbroken, linearly continuous printed line.

[11] A display device manufacturing apparatus characterized by manufacturing a color filter substrate using the display device manufacturing apparatus according to the above [10]. According to the display device manufacturing apparatus described in [11], it is possible to form linearly continuous print lines (each line of R, G, and B) without breaks in each pixel.

[12] In the display device manufacturing apparatus according to the above [11], the control means has a stripe in which the discharge pattern of the liquid droplets on the color filter substrate has the same color in all the pixel arrangement in one direction. Type, or a mosaic type in which the color arrangement of the three primary colors is repeated in one direction of the pixel arrangement, or the relative pixel arrangement between adjacent columns is staggered, and the three primary colors are arranged in a triangular color and arranged. A display device manufacturing apparatus characterized by being controlled to either a delta type. According to the display device manufacturing apparatus described in [12], it is possible to provide a color filter substrate with little color unevenness in any ejection pattern.

[13] A display device manufacturing apparatus characterized by manufacturing an organic EL element using the display device manufacturing apparatus according to the above [10]. According to the display device manufacturing apparatus described in [13], it is possible to form a continuous linear print line (each line of R, G, and B) in each pixel without breaks.

[14] A display device manufacturing apparatus according to the above [10], wherein metal wiring of the display device is performed. According to the display device manufacturing apparatus described in [14], it is possible to form metal wiring which is continuous and has no discontinuity. Therefore, it is possible to manufacture a liquid crystal display device or the like with few conduction defects. it can.

[15] In the display device manufacturing apparatus according to the above [9], the control means causes the overlapping portion between the droplets after landing on the substrate and spreading by wetting in the column direction and the row direction. An apparatus for manufacturing a display device, which is arranged on both sides to form a film. According to the display device manufacturing apparatus described in [15], it is possible to form a coating film that is free from omissions (portions where droplets are not ejected) in plan view.

[16] In the display device manufacturing apparatus described in [15], a photoresist is formed, an overcoat is formed, an alignment film is formed, or
A display device manufacturing apparatus characterized by forming a liquid crystal film. According to the display device manufacturing apparatus of [16],
To be able to perform photoresist formation, overcoat formation, alignment film formation, liquid crystal film formation, and other film formation in which there are no omissions (where droplets are not ejected) in plan view. Become.

[17] The method for manufacturing a display device according to any one of [1] to [8] above, or [9] above.
A display device manufactured by using the display device manufacturing apparatus according to any one of the above [16]. This [1
According to the display device described in [7], since the applicable display device manufacturing method or display device manufacturing apparatus can improve the production efficiency, a high-quality and inexpensive display device can be obtained.

[18] A device manufactured by including the display device according to the above [17]. According to the device described in [18], since a high-quality and inexpensive display device can be adopted, a high-quality and low-cost device can be obtained.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is a display device manufacturing method and a display device manufacturing apparatus for manufacturing a display device by ejecting liquid droplets from a plurality of nozzles, and the display device manufacturing method and the display device manufacturing apparatus. And a device manufactured by including the display device, and particularly, a display device manufacturing method and a display device manufacturing apparatus capable of flexibly responding to the type of manufacturing process to be applied, and the display device manufacturing method and The present invention relates to a display device and a device manufactured by a display device manufacturing apparatus, and one embodiment thereof will be described below with reference to the drawings, but it goes without saying that the present invention is not limited to this. Is. The term “droplet” as used in the present invention refers to a liquid having a function, such as a color filter composition and an organic EL element composition, in addition to a conventional droplet.

In the following description, first, referring to FIG.
~ A general description of the display device manufacturing method, the display device manufacturing apparatus, the display device, and the device of the present embodiment will be mainly given with reference to Fig. 13, and then, with reference to Fig. 14 to Fig. 19. The description will be focused on the characteristic part of the present embodiment. Further, in the following description, a case will be described as an example where the display device manufacturing apparatus, the display device manufacturing method, the display device, and the device correspond to the following.・ Display device manufacturing device ・ ・ ・ Color filter substrate manufacturing device ・ Display device manufacturing method ・ ・ ・ Color filter substrate manufacturing method ・ Display device ・ ・ ・ Color filter substrate / device ・ ・ ・ Note personal computer

(1) Display Device Manufacturing Device (Color Filter Substrate Manufacturing Device) First, the display device manufacturing device of this embodiment will be described with reference to FIG. It should be noted that FIG. 1 is a plan view showing the arrangement of each component in the display device manufacturing apparatus. As shown in FIG. 1, the display device manufacturing apparatus according to the present embodiment includes a wafer supply unit 1 that accommodates a substrate (glass substrate; hereinafter referred to as a wafer Wf) to be processed, and a transfer from the wafer supply unit 1. Wafer rotator 2 that determines the drawing direction of the wafer Wf
Then, the droplet discharge device 3 for landing R (red) droplets on the wafer Wf transferred from the wafer rotating part 2 and the wafer Wf transferred from the droplet discharge device 3 are dried. The baking furnace 4, robots 5a and 5b for transferring the wafer Wf between these devices, and cooling and drawing direction determination of the wafer Wf transferred from the baking furnace 4 to the next step. The carrier unit 6, the droplet discharge device 7 for landing G (green) droplets on the wafer Wf transferred from the intermediate carrier unit 6, and the wafer Wf transferred from the droplet discharge device 7. Bake furnace 8 for drying the wafer, robots 9a and 9b for transferring wafer Wf between these devices, and cooling and drawing direction determination of wafer Wf transferred from bake furnace 8 before being sent to the next process. And the intermediate transfer unit 10 forming the B to the wafer Wf, which is (blue)
, A bake furnace 12 for drying the wafer Wf transferred from the droplet discharge device 11, and a robot 13a for transferring the wafer Wf between these devices. 13b, a wafer rotating unit 14 that determines the storage direction of the wafer Wf transferred from the baking furnace 12,
The wafer Wf is transferred from the wafer rotating unit 14 and a wafer housing unit 15 for housing the wafer Wf is provided.

The number of wafer supply units 1 is, for example, 20 per unit.
It is provided with two magazine loaders 1a and 1b having an elevator mechanism for accommodating one wafer Wf in the vertical direction,
The wafers Wf can be sequentially supplied. The wafer rotating unit 2 determines the drawing direction of the drawing direction of the droplet discharge device 3 on the wafer Wf, and temporarily positions the wafer Wf before the wafer Wf is transferred to the droplet discharge device 3. The wafer Wf is held rotatably at 90-degree pitch intervals around the vertical axis by the two wafer turntables 2a and 2b.

Since the details of the droplet discharge devices 3, 7, 11 will be described later, the description thereof will be omitted here. The bake oven 4 dries the red droplets of the wafer Wf transferred from the droplet discharge device 3 by placing the wafer Wf in a heating environment of 120 ° C. or lower for 5 minutes, for example. It is possible to prevent inconveniences such as red droplets being scattered during the movement of the wafer Wf.

The robots 5a and 5b are provided with an arm (not shown) capable of extending and rotating around the base, and the wafer Wf is attached to the tip of the arm by a vacuum suction pad. By sucking and holding, the transfer work of the wafer Wf between the respective devices can be smoothly and efficiently performed.

The intermediate transfer unit 6 cools the heated wafer Wf transferred from the baking furnace 4 by the robot 5b before sending it to the next process, and a cooler 6a and a cooled wafer Wf.
On the other hand, the wafer rotating table 6b for determining the drawing direction in which the droplet discharge device 7 should draw and the temporary positioning before the transfer to the droplet discharge device 7 and the cooler 6a and the wafer are performed. A buffer 6c which is arranged between the rotary tables 6b and absorbs a processing speed difference between the droplet discharge devices 3 and 7.
And is configured. The wafer turntable 6b is capable of rotating the wafer Wf at a pitch of 90 degrees or a pitch of 180 degrees around the vertical axis.

The droplet ejecting device 3 for ejecting red droplets and the droplet ejecting device 7 for ejecting green droplets will be described in the respective droplet ejecting heads (droplet ejecting devices 3, 7, 11). Since the time required for the cleaning work (described later) is different, as a result, a difference occurs in the processing speed between the droplet discharge devices 3 and 7. The buffer 6c is provided to absorb this difference in processing speed, and is capable of temporarily temporarily placing a plurality of wafers Wf on an elevator stock table.

The bake furnace 8 is a heating furnace having the same structure as that of the bake furnace 4, and is transferred from the droplet discharge device 7 by placing the wafer Wf in a heating environment of 120 ° C. or lower for 5 minutes. This is to dry the green droplets of the wafer Wf that have been received, and this makes it possible to prevent inconveniences such as scattering of the green droplets during the movement of the wafer Wf.

The robots 9a and 9b are the same as the robot 5 described above.
A wafer having a structure similar to that of a and 5b, equipped with an arm (not shown) capable of extending and rotating around a base, and a vacuum suction pad equipped at the tip of the arm. By sucking and holding Wf, the transfer operation of the wafer Wf between the respective devices can be performed smoothly and efficiently.

The intermediate transfer section 10 has the same structure as the intermediate transfer section 6, and the baking furnace 8 is operated by the robot 9b.
The cooler 10a that cools the wafer Wf in the heated state transferred from the above before being sent to the next step, and the drawing direction determination of the drawing direction of the cooled wafer Wf by the droplet discharge device 11 and Is arranged between the wafer turntable 10b for performing temporary positioning before being transferred to the droplet discharge device 11 and the cooler 10a and the wafer turntable 10b.
It is configured to include a buffer 10c that absorbs a processing speed difference between the droplet discharge devices 7 and 11. Wafer turntable 1
In 0b, the wafer Wf can be rotated at a pitch of 90 degrees or a pitch of 180 degrees around the vertical axis.

The wafer rotating unit 14 is provided for each of the droplet discharge devices 3, 3.
With respect to each wafer Wf on which the R, G, B patterns have been formed by 7, 11, it is possible to perform rotational positioning so that each wafer Wf faces a certain direction. That is, the wafer rotator 14 includes two wafer rotators 14a and 14b so that the wafer Wf can be rotatably held at 90-degree pitch intervals around the vertical axis. The wafer accommodating unit 15 includes two magazines each having an elevator mechanism that accommodates, for example, 20 finished wafers Wf (color filter substrates) transferred from the wafer rotating unit 14 in a vertical direction, for example, 20 wafers each. Unloader 15a, 15
b, the wafers Wf can be sequentially accommodated.

(2) Display Device Manufacturing Method (Color Filter Substrate Manufacturing Method) and Liquid Crystal Display Device (Color Filter Substrate) RGB by the display device manufacturing apparatus of this embodiment described above.
A series of steps of the manufacturing process of the color filter substrate including the pattern forming process will be described below with reference to FIGS. Note that FIG. 2 shows the RG manufactured by the same display device manufacturing apparatus.
It is a figure which shows a series of color filter substrate manufacturing processes including B pattern formation process, and has shown the flow manufactured in order of (a)-(f). 3 is a diagram showing an example of an RGB pattern formed by each droplet discharge device of the display device manufacturing apparatus, (a) is a perspective view showing a stripe type, and (b) is a mosaic type. Partially enlarged view, (c) is a partially enlarged view showing a delta type.

The wafer Wf used for manufacturing is, for example, a rectangular thin plate-shaped transparent substrate, and has both a proper mechanical strength and a high light-transmitting property. As the wafer Wf, for example, a transparent glass substrate, an acrylic glass, a plastic substrate, a plastic film, a surface-treated product thereof, or the like is preferably used. It should be noted that a plurality of color filter regions are preliminarily formed in a matrix on the wafer Wf in the pre-process of the RGB pattern forming process from the viewpoint of improving productivity, and these color filter regions are formed after the RGB pattern forming process. By cutting in a process, it is used as a color filter substrate suitable for a device to be manufactured.

As shown in FIG. 3, in each color filter area, R (red) droplets, G (green) droplets, and B droplets are formed.
The (blue) droplets are formed in a predetermined pattern by each droplet discharge head 53 described later. As the formation pattern, in addition to the stripe type shown in FIG. 3A, there are a mosaic type shown in FIG. 3B and a delta type shown in FIG. 3C. Regarding, there is no particular limitation.

First, in the black matrix forming step which is the previous step, as shown in FIG. 2A, one surface of the transparent wafer Wf (the surface which is the base of the color filter substrate).
In contrast, a resin (preferably black) that does not transmit light is
By a method such as spin coating, a predetermined thickness (for example, 2
.about..mu.m) and then the black matrix b, ... Is formed in a matrix by a method such as a photolithography method. The minimum display element surrounded by the black matrix b, ... Is a so-called filter element (each pixel shown by reference numeral e, ...). The window has a length in the direction of about 100 μm. After forming the black matrices b, ..., Heat is applied by a heater (not shown) to bake the resin on the wafer Wf.

The wafer Wf on which the black matrix b has been formed in this manner is housed in each of the magazine loaders 1a and 1b of the wafer supply unit 1 shown in FIG. 1, and the RGB pattern forming process is subsequently performed. That is, first, the robot 5a sucks and holds the wafer Wf housed in one of the magazine loaders 1a and 1b, and then mounts it on one of the wafer turntables 2a and 2b. Place. Then, the wafer turntables 2a, 2
b is a pre-preparation for landing a red droplet,
The drawing direction and positioning are performed.

After that, the robot 5a again sucks and holds the wafer Wf on each of the wafer turntables 2a and 2b and transfers it to the droplet discharge device 3 this time. In this droplet discharge device 3,
As shown in FIG. 2B, a red droplet R is landed in the filter element e, ... At a predetermined position for forming a predetermined pattern. The amount of each droplet R at this time is sufficient considering the volume reduction amount of the droplet R in the heating process. In addition, the droplet R generated by the droplet discharge device 3
The details of the landing will be described later.

In this way, the wafer Wf after all the predetermined filter elements e, ... Are filled with the red droplets R is dried at a predetermined temperature (for example, about 70 ° C.). At this time, if the solvent of the droplet R evaporates,
Since the volume of the droplet R is reduced as shown in (c), when the volume is drastically reduced, the landing operation and the drying operation of the droplet R are performed until the droplet film thickness sufficient for the color filter substrate is obtained. Is repeated. By this treatment, the solvent of the droplet R evaporates, and finally only the solid content of the droplet R remains to form a film.

The drying operation in the red pattern forming step is performed by the baking furnace 4 shown in FIG. Since the wafer Wf after the drying operation is in the heated state, it is transferred to the cooler 6a and cooled by the robot 5b shown in the figure. The cooled wafer Wf is temporarily stored in the buffer 6c, time-adjusted, and then transferred to the wafer rotary table 6b, and its drawing direction and positioning are performed as a preliminary preparation for landing the green droplets. Is done. Then, after the robot 9a sucks and holds the wafer Wf on the wafer turntable 6b, this time, the droplet discharge device 7
Reprinted to.

In this droplet discharge device 7, as shown in FIG. 2B, a green droplet G is landed in the filter element e, ... At a predetermined position for forming a predetermined pattern. . The amount of each droplet G at this time is a sufficient amount in consideration of the volume reduction amount of the droplet G in the heating process.

Thus, the wafer Wf after all the predetermined filter elements e, ... Are filled with the green droplets G is dried at a predetermined temperature (for example, about 70 ° C.). At this time, if the solvent of the droplet G evaporates,
Since the volume of the droplet G is reduced as shown in (c), when the volume is drastically reduced, the droplet G is landed and dried until a sufficient droplet film thickness is obtained as a color filter substrate. Is repeated. By this treatment, the solvent of the droplet G evaporates, and finally only the solid content of the droplet G remains to form a film.

The drying operation in the green pattern forming step is performed by the baking oven 8 shown in FIG. Since the wafer Wf after the drying operation is in the heated state, it is transferred to the cooler 10a and cooled by the robot 9b shown in the figure. The cooled wafer Wf is temporarily stored in the buffer 10c, time-adjusted, and then transferred to the wafer turntable 10b, and its drawing direction and positioning are performed as a pre-preparation for landing blue droplets. Is done. Then, the robot 13a sucks and holds the wafer Wf on the wafer turntable 10b, and then transfers it to the droplet discharge device 11.

In this droplet discharge device 11, as shown in FIG. 2B, a blue droplet B is landed in the filter element e, ... At a predetermined position for forming a predetermined pattern. . The amount of each droplet B at this time is a sufficient amount in consideration of the volume reduction amount of the droplet B in the heating step. The details of landing of the droplet B by the droplet discharge device 11 will be described later.

In this way, the wafer Wf after all the predetermined filter elements e, ... Are filled with the blue droplets B, as shown in FIG. 2C, has a predetermined temperature (for example, 70 ° C.). It is dried at about 1). At this time, when the solvent of the droplet B is evaporated, the volume of the droplet B is reduced. Therefore, when the volume reduction is severe, the landing operation of the droplet B is performed until a sufficient droplet film thickness is obtained as a color filter. And the drying work is repeated. By this treatment, the solvent of the droplet B is evaporated, and finally only the solid content of the droplet B remains to form a film.

The drying operation in the blue pattern forming step is performed by the baking oven 12 shown in FIG. Then, the wafer Wf after the drying work is transferred by the robot 13b to one of the wafer turntables 14a and 14b, and then rotationally positioned so as to face a certain direction. The wafer Wf after rotational positioning is accommodated in either one of the magazine unloaders 15a and 15b by the robot 13b.

With the above, the RGB pattern forming process is completed. Then, subsequently, the post-process shown in FIG. That is, in the protective film forming step shown in FIG. 2D, heating is performed at a predetermined temperature for a predetermined time in order to completely dry the droplets R, G, and B. When the drying is completed, the protective film c is formed for the purpose of surface protection and surface flattening of the wafer Wf on which the droplet film is formed. A method such as a spin coating method, a roll coating method, or a ripping method can be adopted for forming the protective film c.

In the subsequent transparent electrode forming step shown in FIG. 2E, the transparent electrode t is formed so as to cover the entire surface of the protective film c by using a recipe such as a sputtering method or a vacuum adsorption method. In the subsequent patterning step shown in FIG. 2F, the transparent electrode t is
It is patterned as a pixel electrode. A TFT (Thin Film Transistor) is used to drive the liquid crystal display panel.
This patterning is not necessary when using (stor) or the like. By the manufacturing steps described above, the color filter substrate CK shown in FIG. 2F is manufactured.

(3) Device (notebook type personal computer) Then, the color filter substrate CK and the counter substrate (not shown) are arranged to face each other, and the liquid crystal display device is manufactured. The notebook personal computer 20 (device) shown in 4 is manufactured. The notebook computer 20 shown in FIG.
The liquid crystal display device housed in 1 (see reference numeral 22)
A keyboard 23 that is an input unit, various circuits such as a display information output source, a display information processing circuit, and a clock generation circuit, which are not shown, and a display signal generation unit that includes a power supply circuit that supplies power to these circuits. It is equipped with. The liquid crystal display device 22 is supplied with the display signal generated by the display signal generation unit based on the information input from the keyboard 23, for example, to form a display image.

Color filter substrate CK according to the present embodiment
The device equipped with is not limited to the notebook computer 20, but a mobile phone, an electronic notebook, a pager, a P
OS terminal, IC card, mini disk player, liquid crystal projector, engineering workstation (E
WS), word processor, television, viewfinder type or monitor direct view type video recorder, electronic desk calculator, car navigation device, device equipped with a touch panel, clock, game machine, and various other electronic devices.

(4) Details of Droplet Ejecting Device Next, referring to FIGS. 5 to 18, the respective droplet ejecting devices 3, 7, 1 provided in the display device manufacturing apparatus are described.
1 will be described in detail. Since the droplet discharge devices 3, 7 and 11 have the same structure, the droplet discharge device 3 will be described below, and the other droplet discharge devices 7 and 11 will be the same. The description will be omitted.

As shown in FIGS. 5 to 7, the droplet discharge device 3 of the present embodiment has a droplet discharge unit 30, a cap unit 60, and a wiping unit 70 (head cleaning mechanism) as its main components. And the weight measuring unit 9
0 (omitted in FIG. 5) and missing dot detection unit 100
(Omitted in FIG. 5). Note that FIG. 5 is a schematic configuration diagram showing main components of the droplet discharge device. Also,
FIG. 6 is a diagram showing a part of the droplet discharge device, and FIG.
It is the side view seen from the arrow A of FIG. Further, FIG. 7 is a view showing the same droplet discharge device, and is a plan view seen from an arrow B in FIG.

(A) Description of Droplet Ejecting Unit 30 The droplet ejecting unit 30 is a unit for ejecting and landing the droplet R toward the wafer Wf. As shown in FIG. 5, in the droplet discharge unit 30, first, an inert gas g such as nitrogen gas is supplied to the air filter 31 to remove impurities contained in the inert gas g. Further, the mist contained in the inert gas g is removed by further passing through the mist separator 32. The inert gas g after removing the mist is branched into two systems, a system for sending droplets under pressure and a system for sending cleaning fluid under pressure. The pressure can be switched by the pressure-feeding pressure switching valve 35.

That is, when the system for pressure-feeding the droplets is selected, the inert gas g passing through the mist separator 32 is selected.
Is supplied to the droplet pressure feed pressure adjustment valve 33, where the pressure is adjusted appropriately, and then passes through the droplet side residual pressure exhaust valve 34, the droplet / cleaning liquid pressure feed pressure switching valve 35, and the air filter 36, Further, after the supply pressure is checked by the inert gas pressure detection sensor 37, it is supplied into the droplet pressure feed tank 38.

On the other hand, when the system for pumping the cleaning liquid is selected, the inert gas g passing through the mist separator 32 is
It is supplied to the cleaning liquid pressure feed pressure adjusting valve 39, where the pressure is adjusted appropriately, and then passes through the cleaning liquid side residual pressure exhaust valve 40, the droplet / cleaning liquid pressure feed pressure switching valve 35, and the air filter 71, and further becomes inactive. After the supply pressure is checked by the gas pressure detection sensor 72, it is supplied into the cleaning liquid pressure feed tank 73. The continuation of the flow in this system will be described later in the description of the wiping unit 70 (head cleaning mechanism).

Droplets in the degassed droplet bottle 41 are replenished in the droplet pressure feed tank 38 by a droplet pressure feed pump 42. The presence / absence of the droplets can be confirmed by checking the droplets. The load is detected by the presence / absence detection load sensor 45. Therefore, when the remaining amount of the liquid droplets in the liquid droplet feeding tank 38 falls below a predetermined level, the liquid droplet presence / absence load detection sensor 45 detects this and the liquid droplet feeding pump 42.
Is activated to replenish the droplets to a predetermined level. Reference numeral 43 is an air filter equipped in the degassing liquid droplet bottle 41, and reference numeral 4
Reference numeral 4 is a tank exhaust pressure valve.

When the inert gas g is supplied into the droplet pressure-feeding tank 38, the internal pressure of the inert gas g is increased, so that the liquid surface of the droplet is pushed downward, whereby the ejected droplet is
Hydraulic pressure feed pressure detection sensor 46 measures the hydraulic pressure and then hydraulic pressure feed is turned on.
It passes through the ON / OFF switching valve 47 and is further pressure-fed to the sub tank 48. Reference numeral 49 indicates a flow path ground joint for releasing static electricity.

The sub tank 48 is provided with an air filter 50, a sub tank upper limit detection sensor 51, and a liquid drop level control detection sensor 52. The sub tank upper limit detection sensor 51 is a detection sensor for stopping the supply of liquid droplets to the sub tank 48 when the liquid level of the liquid droplets in the sub tank 48 exceeds a predetermined level. Further, the droplet liquid level control detection sensor 52 includes a plurality of droplet discharge heads 53 (for the arrangement thereof, refer to FIG. 6. In FIG. 5, the droplet discharge head 53 is described as a single unit for the sake of explanation. The water head value head of the liquid surface of the liquid droplets in the sub-tank 48 for each nozzle surface 53a
It is a detection sensor for adjusting within 0.5 mm.

The liquid droplets supplied from the sub-tank 48 are supplied to the liquid droplet ejection head 53 after passing through the head bubble removing valve 54. Note that reference numeral 55
Shows a flow path ground joint for releasing static electricity. The head bubble elimination valve 54 closes the upstream side flow path of the droplet discharge head 53, so that the droplet discharge head 53 is closed.
It is possible to increase the suction flow rate when the liquid droplets inside are sucked by the cap unit 60, which will be described later, so that the bubbles inside the liquid droplet ejection head 53 can be quickly exhausted.

Details of each droplet discharge head 53 will be described below with reference to FIGS. Note that FIG.
FIG. 3 is a plan view showing a nozzle head unit of the same droplet discharge device. Further, FIG. 9 is a side view of the nozzle head unit as seen from an arrow C in FIG. Further, FIG. 10 is a diagram illustrating a mechanism for ejecting droplets of a droplet discharge head provided in the nozzle head unit, and is an explanatory diagram in the case of a piezo system. FIG. 11 is a diagram for explaining another mechanism for ejecting droplets of the droplet discharge head, which is an explanatory diagram in the case of the bubble system. In addition, FIG.
FIG. 3 is a diagram showing a part of the droplet discharge head,
(A) is the figure seen from the side which opposes a nozzle surface, (b) is DD sectional drawing of (a). 13A and 13B are diagrams for explaining the droplet discharge head, FIG. 13A is an explanatory diagram showing a scanning direction, and FIG. 13B is an explanatory diagram showing a change in nozzle pitch.

As shown in FIGS. 8 and 9, each of the droplet discharge heads 53 of the present embodiment has a first head row 121A and a second head row 121 in which six droplet drop heads 53 are arranged in a row so as to obliquely overlap each other. The nozzle head unit 120 is configured by fixing 121B to the head holding plate 122. First head row 121A and second head row 121B
Are parallel to each other, and the axes c1 and c2 are arranged so as to intersect the feeding direction of the wiping sheet 75 (arrow S direction in FIG. 8) described later.

As the droplet discharge method of these droplet discharge heads 53, for example, the piezo method shown in FIG.
There is a bubble method shown in FIG. Hereinafter, each case will be described. First, the droplet discharge head 53 in the case of adopting the piezo method shown in FIG. 10 will be described. In the droplet discharge head 53, a piezo element 53d (piezoelectric element) is provided for each nozzle 53c. There is. The piezo element 53d is arranged corresponding to the nozzle 53c and the droplet chamber 53e, and when the applied voltage Vh is applied, the piezo element 53d expands and contracts in the direction of arrow P with a deformation amount according to the magnitude of the applied voltage Vh. Then, the inside of the droplet chamber 53e is pressurized to eject a predetermined amount of droplet R from each nozzle 53c. That is, the droplet R is ejected at an ejection amount corresponding to the input applied voltage Vh (voltage waveform).

Next, the droplet discharge head 53 when the bubble jet method (registered trademark) shown in FIG. 11 is adopted will be described. The droplet discharge head 53 is provided with a thermal resistor 53x corresponding to each nozzle, and the droplet R is heated by the pressure of the bubble b generated in the droplet R by heating the thermal resistor 53x. Is pushed toward the ejection outlet side to eject the droplet R. Since the thermal resistor 53x can increase or decrease the size (pressure) of the bubble b according to the drive pulse application time, the droplet R can be ejected at an ejection amount according to the drive pulse application time. It is like this.

As shown in FIGS. 12A and 12B, a plurality of rows (two rows in this embodiment) of grooves 53a1 and 53a2 are formed parallel to each other on the nozzle surface 53a of each droplet discharge head 53. In addition, these grooves 53a1 and 53a
The nozzles 53c are bored inside the chamber 2 at equal pitch intervals. As described above, these droplet discharge heads 53
Are arranged diagonally over each other. This is because when the droplets R are ejected while passing the droplet ejection heads 53 on the wafer Wf as shown in FIG. 13A, they are moved in the scanning direction (traveling direction) as shown in FIG. 13B. On the other hand, by inclining each of the droplet discharge heads 53 at an appropriate angle, the apparent nozzle spacing p2 is made to match in accordance with the pixel pitch p1 of the color filter substrate to be manufactured.

(B) Description of Cap Unit 60 Following the droplet discharge unit 30 described above, the cap unit 60 will be described below. The cap unit 60 shown in FIG. 5 has a nozzle surface 53 of each of the droplet discharge heads 53.
A plurality of caps 61 that are pressed against a from below (see FIGS. 6 and 7 for the arrangement thereof).
Thus, it is possible to suck the droplet waste liquid into the droplet waste liquid tank 65 by using the suction force of the droplet suction pump 62. The reference numeral 63 indicates each droplet discharge head 5.
A valve provided in the vicinity of the cap 61 for the purpose of shortening the time for maintaining the pressure balance (= atmospheric pressure) between the droplet discharge heads 53 and the suction side when sucking the droplets inside 3. Further, reference numeral 64 is a droplet suction pressure detection sensor for detecting a suction abnormality.

The droplet waste liquid tank 65 is provided with a waste liquid tank upper limit detection sensor 66, and the droplet waste liquid tank 6 is provided.
When it is detected that the liquid level in 5 exceeds a predetermined level, the liquid drop waste liquid pump 67 is activated to drop the liquid drop waste liquid bottle 68.
The waste liquid can be transferred to. And
According to the cap unit 60, a negative pressure is applied to the nozzles of the droplet discharge heads 53 before the discharge of the droplets R from the droplet discharge heads 53 to fill the nozzle surface 53a with the droplets. Negative pressure is applied to each nozzle of each droplet discharge head 53 to remove clogging of each nozzle, or suction is performed, or the droplets in each nozzle are prevented from drying during standby without manufacturing. Nozzle surface 5 with cap 61
3 can be covered to moisturize.

(C) Description of Wiping Unit 70 Following the cap unit 60 described above, the wiping unit 70 (head cleaning mechanism) will be described below.
The wiping unit 70 collectively and periodically cleans the nozzle surfaces 53a of the droplet discharge heads 53, as shown in FIG.
And a wiping sheet 7 for wiping
Roller 76 for pressing 5 toward each nozzle surface 53a
A cleaning liquid supply unit 77 for spraying the cleaning liquid onto the wiping sheet 75, an unwinding roller 78 for unwinding the wiping sheet 75 toward each nozzle surface 53a, and a cleaning roller 78 after wiping each nozzle surface 53a. A winding roller 79 that winds the wiping sheet 75 and an electric motor 153 that rotationally drives the winding roller 79 are configured. As the wiping sheet 75, for example, a woven fabric made of 100% polyester is preferably used. Further, the roller 76 is a rubber roller, and has elasticity that repels a pressing force applied to the peripheral surface thereof.

According to the wiping unit 70, the wiping sheet 75 unwound from the unwinding roller 78 is pressed toward the nozzle surfaces 53a by the rollers 76 while feeding the wiping sheet 75, whereby the wiping sheet 75 is newly cleaned. A surface can be constantly supplied to each nozzle surface 53a. Moreover, since the wiping sheet 75 is pressed against each nozzle surface 53a by the pressing force of the roller 76, the cleaning surface can be surely applied to each nozzle surface 53a.

(D) Description of Weight Measuring Unit 90 Following the wiping unit 70 described above, the weight measuring unit 90 will be described below with reference to FIG.
The weight measuring unit 90 is for measuring and managing the weight of each droplet R ejected from each nozzle of each droplet ejection head 53. For example, after receiving 2000 droplets R from each droplet discharge head 53 for the purpose of weight measurement, the weight of the 2000 droplets R is set to 2
By dividing by the number of 000, the weight per one droplet R is accurately measured. The weight measurement result of the droplet R is used to optimally control the amount of the droplet R ejected from each droplet ejection head 53.

(E) Description of Missing Dot Detecting Unit 100 Subsequently, the missing dot detecting unit 100 will be described below. This missing dot detection unit 10 shown in FIG.
0 is for checking the clogging of each nozzle of each nozzle unit 53, and after moving each droplet discharge head 53 to the position above this, a laser from a laser device (not shown) provided therein is provided. The inspection is performed by throwing away (spitting) each of the droplet discharge heads 53 while blocking the light. Then, if the laser beam is not blocked even though the throwing-off instruction is given, it is judged that the nozzle may be clogged and droplets may not be emitted, resulting in missing dots in the manufactured product. And the cap unit 60
Therefore, the nozzle of the droplet discharge head 53, which is a problem, is sucked and clogged.

Following the general description given above, a detailed description of particularly characteristic parts of the present invention will be given below with reference to FIGS. 14 to 19. Note that FIG. 14 is a plan view of a color filter substrate manufactured using the display device manufacturing apparatus / display device manufacturing method of the present embodiment. In addition, FIG.
FIG. 15 is a diagram showing a state in which droplets are ejected so as to be linearly continuous to each pixel of the color filter substrate by the display device manufacturing apparatus / display device manufacturing method. It is a figure. 16 is a diagram showing a case where droplets are ejected to each pixel of the color filter substrate without using the display device manufacturing apparatus / display device manufacturing method, which corresponds to FIG. FIG. In addition, FIG.
[FIG. 4] is an explanatory diagram regarding a diameter of a droplet used in the display device manufacturing apparatus / display device manufacturing method of the present embodiment,
The state of the droplets ejected in the order of (a), (b), and (c) is shown. FIG. 18 is an explanatory diagram showing a case where the same display device manufacturing apparatus / display device manufacturing method discharges so as to form a film.

In the following description, the case where the color filter substrate CK is manufactured by the stripe type discharge pattern described in FIG. 3A will be described as an example. That is, in the droplet discharge device 3, FIG.
, The droplet R is ejected while scanning the droplet ejection head 53 in the X direction of FIG. Is colored red. Then, in the baking oven 4, all the droplets R
The wafer Wf sent to the droplet discharge device 7 after being dried
Is applied to all the pixels to be colored green, while the droplet discharge head 53 scans in the X direction in FIG.
By being discharged, green coloring is made. And
After all the droplets G have been dried in the baking oven 8, the wafer Wf sent to the droplet discharge device 11 has the droplet discharge head 53 for all the pixels to be colored blue. By ejecting the droplet B while scanning in the X direction, blue coloring is performed.

By such R, G, B coloring work,
As shown in FIG. 3A, a stripe-shaped ejection pattern is formed in which all the pixels in one direction (that is, the scanning direction of the droplet ejection head 53) have the same color. As the ejection pattern, in addition to the stripe pattern, three primary colors R, in one direction of the pixel arrangement (that is, the scanning direction of the droplet ejection head 53) shown in FIG.
Mosaic type in which G and B color sequences are repeated, or
As shown in FIG. 3C, the relative pixel arrangement between adjacent columns is staggered (mismatched), and the three primary colors R, G, and B are arranged in a triangular shape and arranged in a delta type. It is needless to say that the present invention can be applied to the formation of the discharge pattern.

In the present invention, it is particularly important to control the discharge of liquid droplets in each pixel e, ..., And a control circuit (control means, not shown) for appropriately performing this control is used for each liquid. It is provided in each of the droplet discharge devices 3, 7, and 11. With this control circuit, for example, as shown in FIG. 15, the pixel e can be colored uniformly without interruption. That is, when the relative speed of the droplet discharge head 53 with respect to the wafer Wf is V, the droplet discharge cycle is T, and the diameter of the droplet after landing on the wafer is D, this control circuit satisfies VT <D. In order to satisfy the relationship, the relative speed V
Also, the ejection cycle T and the diameter D are controlled.

In the present embodiment, since the droplet discharge head 53 is discharged while moving in the X direction with respect to the wafer Wf in the fixed state, the scanning speed of the droplet discharge head 53 = relative speed V. The ejection cycle T indicates the ejection time interval of the liquid droplets ejected from the same nozzle 53c. Therefore, as shown in FIG.
The distance between the centers of the droplets ejected in the upper pixel e is V ×
Will be represented by T.

On the other hand, as the diameter D, the dimension after it has landed on the wafer Wf and has spread wet is used. The definition of the diameter D will be described in detail with reference to FIG.
As shown in FIG. 17A, when the diameter of the droplet i at the time of being ejected from the droplet ejection head 53 is d0, FIG.
As shown in (b), immediately after landing on the wafer Wf, the wall pressure from the wafer Wf is received to expand the diameter, and the diameter d1 is slightly larger than the diameter d0. As the time further advances, the diameter of the droplet i continues to expand, and finally the expansion stops in the state of FIG. 17 (c). The diameter D when the wetting and spreading stop in this way is used in the control by the control means. In actual use, the diameter D is not measured for each discharge, but the diameter D is measured in advance before the production process.
It can be said that it is preferable to use the diameter D obtained at this time by giving it to the control means from the viewpoint of improving the production efficiency.

Then, the control means controls the relative speed V, the discharge cycle T and the diameter D so that the magnitude relationship between the diameter D and the VT satisfies VT <D.
As shown in FIG. 15, the overlapping portions r, ... Between the droplets after they have landed on the wafer Wf and have spread by wetting can be arranged on a straight line. That is, these overlapping parts r, ... In each row of R, G, B,
All of them are arranged on a straight line formed by the scanning direction of the droplet discharge head 53 (that is, the moving direction of each nozzle 53c) shown by the broken line arrow in FIG. As a result, it is possible to form a linearly continuous printed line in each pixel e, ...

The black matrix b described with reference to FIG. 2 is arranged between each pixel e, ... Since light is shielded at this portion, for example, in the scanning direction of the droplet discharge head 53, Even if the droplets are ejected so as to straddle the adjacent pixels e, ..., There will be no problem as a color filter substrate. Therefore, in the scanning direction, the droplets of the same color may be ejected so as to be continuous without a break, or the droplets may not be ejected on the black matrix between the pixels e ,. e, ...
-It may be possible to discharge the ink only inward. In the present invention, it is an object of the present invention to prevent breaks g, ... Between droplets as shown in FIG. 16 in each pixel e ,. Occurs when the VT (that is, the distance dimension between adjacent droplet centers) becomes larger than the diameter D (VT> D). In such a case, the discontinuity g, ... causes color unevenness and deteriorates the quality of the color filter substrate, which causes a problem. However, in the present invention, since the control circuit secures the ejection condition of VT <D, such quality problem does not occur.

In determining the discharge condition of VT <D by the control means, the optimum combination is determined according to the type of manufacturing process to be applied, such as which droplet of R, G or B is to be discharged. It is like this. That is,
Since the R, G, and B droplets have different viscosities, for example, even if it is necessary to change the relative speed V according to the viscosity, the control means can satisfy the relationship of VT <D. By simply selecting a combination of the diameter D (that is, the ejection amount) and the ejection cycle T, the droplets ejected on the wafer Wf do not separate from each other, and the optimal ejection condition for securing the yield can be secured. Like

Also, when it is necessary to change the ejection amount (that is, the diameter D of the droplet), the control means similarly causes the relative speed V and the ejection cycle T to satisfy the relationship of VT <D. Only by selecting the combination, the droplets ejected on the wafer Wf do not separate from each other, and it becomes possible to secure the optimum ejection condition for securing the yield. Further, for example, even when the ejection cycle T can be shortened by improving the performance of the droplet ejection head, the control means similarly controls the relative velocity V and the diameter D such that the relationship VT <D is satisfied. By simply selecting the combination, the droplets ejected on the substrate do not separate from each other, and it becomes possible to secure the optimal ejection conditions for securing the yield.

In the above embodiment, the case where the present invention is applied to the R, G, B coloring process on the color filter substrate has been described as an example. However, since a continuous printed line can be formed, It is also applicable to metal wiring work. In this case, it is possible to form linearly continuous metal wirings (not shown) without breaks, so that it is possible to manufacture a display device with few conduction defects. Also in this case, the relative velocity V, the ejection cycle T, and the diameter D are set so that the ejection condition of VT <D is satisfied according to the viscosity of the droplet (metal wiring material) used.
By controlling the combination of, it becomes possible to form a metal wiring without breaks.

In the above embodiment, the case where the R, G, B coloring process on the color filter substrate is performed by forming a continuous printed line has been described as an example. The present invention can also be applied to the formation of a film, the formation of an overcoat, the formation of an alignment film, the formation of a coating film such as the formation of a liquid crystal film. This film formation will be described. For example, as shown in FIG. 18, the control unit controls the ejection of VT <D in the same manner as the above-described printed line formation, and each of the nozzles 53.
By narrowing the apparent pitch interval between c, the overlapping portions r, ... Between the respective droplets i that have landed on the printing surface of the wafer (substrate) and have spread wet, are expressed in the column direction (X direction). And in the row direction (Y direction), the printed surface can be covered without gaps, and a film can be formed.

That is, the overlapping portion r in the X direction in FIG.
For x, ..., Each droplet i is ejected by the ejection control of VT <D by the control means, and a printed line having no gap is formed in the X direction. On the other hand, the pitch dimension p3 between the print lines formed at this time is ...
As described in 3 (b), the droplet discharge head 53
Can be adjusted by inclining at an appropriate angle with respect to the scanning direction (traveling direction) to match the apparent nozzle spacing p2. As a result, the overlapping portion r in the Y direction of FIG.
Since y, ... Can be formed, the print lines can be overlapped with each other to form a print surface (coating film) having no gap in both the X direction and the Y direction.

In the example shown in the figure, the droplets i, ... Are ejected at the same position between the adjacent print lines, but the present invention is not limited to this and, for example, as shown in FIG. , The ejection patterns may be formed so that the droplets i, ... Are staggered (misaligned) between the adjacent print lines. In this case, the area of the overlapping portion r between the droplets i can be reduced while ensuring a flat surface without a gap, and a larger area can be printed even with the same droplet discharge amount. Will be able to. Therefore, the amount of droplets discharged can be suppressed, and the cost required for the manufacturing process for forming the coating film can be reduced.

The effects of the display device manufacturing method, the display device manufacturing apparatus, the display device, and the device of the present embodiment described above are summarized below. In the display device manufacturing apparatus / display device manufacturing method of the present embodiment, the relative speed of the droplet discharge head 53 with respect to the wafer Wf is V, the discharge cycle of the droplet i is T, and the wafer Wf is landed and wetted by the control means. When the diameter of the liquid droplet i after spreading is D, a configuration / method of controlling the relative velocity V, the ejection period T, and the diameter D is adopted so as to satisfy the relationship of VT <D. According to this, the relative speed V and the ejection cycle T may be changed depending on the type of manufacturing process applied.
Even if any element of the diameter D and the diameter D is changed, the control means adjusts the other elements so as to satisfy VT <D, so that the liquid droplets i ejected onto the wafer Wf are separated from each other. It is possible to secure the optimum ejection conditions for securing the yield without leaving. Therefore, since it is possible to flexibly deal with a wide variety of manufacturing processes to be applied, it is possible to improve production efficiency. Moreover, the diameter D of the droplet i, which is one of the control elements, is
Since the dimension after landing on f and spreading by wetting is adopted, it is possible to widen the interval between the droplets i as much as possible while ensuring the overlapping portion r, ... Between the adjacent droplets i. It is like this. As a result, the amount of droplets used can be reduced, and the production speed can be improved by increasing the relative velocity V. Therefore, the production cost can be further reduced and an inexpensive display device such as a color filter substrate can be provided. It becomes possible.

Further, in the display device manufacturing apparatus / display device manufacturing method of this embodiment, the control means causes the overlapping portions r, ... Between the droplets i after the control means has landed on the wafer Wf and has spread.
The configuration / method of controlling so as to be arranged on a straight line was adopted. According to this, there is no discontinuity and a linearly continuous printed line (for example, R, G, B colored lines, metal wiring, etc.)
Therefore, it is possible to manufacture a color filter substrate with less color unevenness, a liquid crystal display device with less electrical failure, and the like. Further, as another example of manufacturing a display device by linearly discharging droplets by the display device manufacturing apparatus / display device manufacturing method of the present embodiment, it can be applied to manufacturing of an organic EL element. Also in this case,
It is possible to form a continuous linear print line (each line of R, G, and B) in each pixel without a break.

Further, in the display device manufacturing apparatus / display device manufacturing method of the present embodiment, the control means sets the overlapping portion r between the droplets i after landing on the wafer Wf and spreading by wetting in the column direction. Arrangements / methods are also possible that are arranged both in the row direction to form the coating. In this case, since it becomes possible to form a coating film that is free from omissions (where the droplet i is not ejected) in plan view, for example, formation of a photoresist, formation of an overcoat, formation of an alignment film. Or
It is possible to form a film such as a liquid crystal film.

Further, the color filter substrate CK manufactured by using the display device manufacturing apparatus / display device manufacturing method of the present embodiment, the display device manufacturing method or the display device manufacturing apparatus applied to the manufacturing thereof can improve the production efficiency. Since this is possible, it is possible to obtain a good quality and inexpensive color filter substrate CK. Further, when the notebook computer 20 is manufactured by using the color filter substrate CK, the notebook computer 20 can adopt the high quality and inexpensive color filter substrate CK, and thus the high quality and the low cost are achieved. It becomes possible to do.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a display device manufacturing apparatus including a droplet discharge device of the present invention, and is a plan view showing an arrangement of respective constituent devices in the display device manufacturing apparatus.

FIG. 2 is a diagram showing a series of color filter substrate manufacturing processes including an RGB pattern forming process by the display device manufacturing apparatus, showing a flow of manufacturing in the order of (a) to (f).

FIG. 3 is a diagram showing an example of an RGB pattern formed by each droplet discharge device of the display device manufacturing apparatus, FIG.
Is a perspective view showing a stripe type, (b) is a partially enlarged view showing a mosaic type, and (c) is a partially enlarged view showing a delta type.

FIG. 4 is a perspective view showing a notebook computer which is an example of a device manufactured by using the liquid crystal display device manufactured by the display device manufacturing apparatus.

FIG. 5 is a schematic configuration diagram showing main components of a droplet discharge device of the display device manufacturing apparatus.

6 is a diagram showing a part of the droplet discharge device, which is a side view seen from an arrow A in FIG. 1. FIG.

7 is a diagram showing the droplet discharge device, and is a plan view seen from an arrow B in FIG. 6. FIG.

FIG. 8 is a plan view showing a nozzle head unit of the droplet discharge device.

9 is a side view of the nozzle head unit as seen from an arrow C in FIG.

FIG. 10 is a diagram illustrating a mechanism for ejecting droplets of a droplet discharge head included in the nozzle head unit, and is an explanatory diagram in the case of a piezo system.

FIG. 11 is a diagram illustrating another mechanism for ejecting droplets of the droplet discharge head, which is an explanatory diagram in the case of a bubble system.

12A and 12B are views showing a part of the droplet discharge head, in which FIG. 12A is a view seen from a side facing a nozzle surface, and FIG.
FIG. 7A is a sectional view taken along line DD of FIG.

FIG. 13 is a diagram illustrating the droplet discharge head,
(A) is an explanatory view showing a scanning direction, and (b) is an explanatory view showing a change of a nozzle pitch.

FIG. 14 is a plan view of a color filter substrate manufactured using the display device manufacturing apparatus / display device manufacturing method of the present embodiment.

FIG. 15 is a diagram showing a state in which droplets are ejected so as to be linearly continuous to each pixel of the color filter substrate by the display device manufacturing apparatus / display device manufacturing method,
It is an enlarged view of the E section of FIG.

16 is a diagram showing a case where a droplet is discharged to each pixel of the color filter substrate without using the display device manufacturing apparatus / display device manufacturing method, and is a partially enlarged view corresponding to FIG. Is.

FIG. 17 is an explanatory diagram regarding a diameter of a droplet used in the display device manufacturing apparatus / display device manufacturing method of the present embodiment, in which droplets are ejected in the order of (a), (b), and (c). Shows the state of.

FIG. 18 is an explanatory diagram showing a case where the same display device manufacturing apparatus / display device manufacturing method discharges so as to form a film.

FIG. 19 is an explanatory diagram showing another case of discharging so as to form a film by the display device manufacturing apparatus / display device manufacturing method.

[Explanation of symbols]

3, 7, 11 ... Droplet discharging device 20: Notebook computer (device) 53 ... Droplet ejection head 53c ... Nozzle CK: Color filter substrate i, R, G, B ... Droplet r, rx, ry ... overlapping part Wf ・ ・ ・ Wafer (substrate)

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 9/30 365 G09F 9/30 365Z 5G435 H05B 33/10 H05B 33/10 33/14 33/14 A F Terms (reference) 2H048 BA02 BA11 BA55 BA64 BB02 BB07 BB41 BB42 2H088 FA08 FA18 FA30 HA03 HA04 HA12 MA20 2H091 FA02Y FA35Y FC12 FC29 GA01 LA12 LA15 LA18 3K007 AB18 DB03 FA01 5C094 AA43 BA27 CA24 ED12 GB171212

Claims (18)

[Claims] 1. A method of manufacturing a display device by ejecting liquid droplets toward a substrate from a plurality of nozzles provided in the liquid droplet ejecting head, wherein a relative speed of the liquid droplet ejecting head with respect to the substrate is V.
When the discharge cycle of the liquid droplet is T and the diameter of the liquid droplet after landing and spreading on the substrate is D, the relative velocity V and the discharge cycle are set so as to satisfy the relationship of VT <D. A method of manufacturing a display device, comprising controlling T and the diameter D. 2. The display device manufacturing method according to claim 1, wherein the overlapping portion between the droplets after landing on the substrate and spreading by wetting is arranged on a straight line. Method. 3. A method for manufacturing a display device, which comprises manufacturing a color filter substrate by using the method for manufacturing a display device according to claim 2. 4. The display device manufacturing method according to claim 3, wherein the discharge pattern of the droplets on the color filter substrate has a stripe shape in which all the pixels in one direction have the same color, or the pixels thereof. Either a mosaic type in which the color arrangement of three primary colors is repeated in one direction of the arrangement, or a delta type in which the relative pixel arrangement between adjacent columns is staggered and the three primary colors are arranged in a triangular shape and arranged. A method of manufacturing a display device, comprising: 5. A method for manufacturing a display device, which comprises manufacturing an organic EL element by using the method for manufacturing a display device according to claim 2. 6. A method of manufacturing a display device, wherein metal wiring of the display device is performed by using the method of manufacturing a display device according to claim 2. 7. The display device manufacturing method according to claim 1, wherein the overlapping portions between the liquid droplets that have landed on the substrate and wet and spread are arranged in both the column direction and the row direction to form a film. A method of manufacturing a display device, comprising: 8. The method of manufacturing a display device according to claim 7, wherein a photoresist is formed, an overcoat is formed, an alignment film is formed, or a liquid crystal film is formed. Display device manufacturing method. 9. An apparatus for manufacturing a display device by ejecting droplets toward a substrate from a plurality of nozzles provided in the droplet ejection head, wherein a relative speed of the droplet ejection head with respect to the substrate is V.
When the ejection cycle of the droplet is T and the diameter of the droplet after landing and spreading on the substrate is D, the relative velocity V and the ejection cycle are set so as to satisfy the relationship of VT <D. A display device manufacturing apparatus, comprising a control means for controlling T and the diameter D. 10. The display device manufacturing apparatus according to claim 9, wherein the control unit controls so that the overlapping portion between the droplets after landing on the substrate and spreading by wetting is arranged on a straight line. An apparatus for manufacturing a display device, which is characterized by: 11. A display device manufacturing apparatus, which manufactures a color filter substrate by using the display device manufacturing apparatus according to claim 10. 12. The display device manufacturing apparatus according to claim 11, wherein the control unit is a stripe type discharge pattern of the droplets on the color filter substrate, in which all of the pixels arranged in one direction have the same color. Alternatively, a mosaic type in which a color arrangement of three primary colors is repeated in one direction of the pixel arrangement, or a relative pixel arrangement between adjacent columns is staggered, and the three primary colors are arranged in a triangular color and arranged in a delta. A display device manufacturing apparatus, characterized in that the display device is controlled to any one of a mold. 13. A display device manufacturing apparatus, wherein an organic EL element is manufactured by using the display device manufacturing apparatus according to claim 10. 14. The display device manufacturing apparatus according to claim 10, wherein metal wiring of the display device is performed. 15. The display device manufacturing apparatus according to claim 9, wherein the control unit causes an overlapping portion between the droplets after landing on the substrate and spreading to wet in both the column direction and the row direction. An apparatus for manufacturing a display device, which is arranged to form a film. 16. The display device manufacturing apparatus according to claim 15, wherein a photoresist is formed, an overcoat is formed, an alignment film is formed, or a liquid crystal film is formed. Display device manufacturing equipment. 17. The method for manufacturing a display device according to claim 1, or claim 9.
A display device manufactured using the display device manufacturing apparatus according to any one of 1. 18. A device manufactured by including the display device according to claim 17.