JP2003272847A - Chamber device, electrooptical device equipped with the same, and organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chamber device preventing a person entered into a chamber room from a state of oxygen defect, and to provide an electrooptical device equipped with the same, and an organic EL device. <P>SOLUTION: The chamber device 3, forming a fresh inert gas atmosphere in the chamber room by continuously supplying and exhausting the inert gas to and from the chamber room, capable of taking the outside air in the chamber room by stopping the supply and exhaust of the inert gas, comprises an oxygen density measuring means 191 measuring the oxygen density in the chamber room, a detachable panel body 113, 114 arranged to an opening of the chamber room, an electromagnetic locking mechanism 129 closing and locking the detachable panel body, and a lock control means 271 controlling the lock/unlock of the electromagnetic locking mechanism. When the measured value of the oxygen density measuring means exceeds a prescribed value while taking the outside air in the chamber room, the lock control means controls the lock/unlock of the electromagnetic locking mechanism. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention forms a fresh atmosphere of an inert gas in a chamber room by continuously supplying and exhausting an inert gas introduced from a gas supply source to the chamber room. , A chamber apparatus capable of introducing outside air into a chamber room in a state where supply of an inert gas is stopped, an electro-optical apparatus including the chamber apparatus, and an organic E
It relates to the L device.

[0002]

2. Description of the Related Art Conventionally, in a chamber apparatus (chamber room) used for a semiconductor manufacturing apparatus or the like in which work processing is performed in an atmosphere of an inert gas, the safety of workers in maintenance, work loading and unloading, etc. is considered (oxygen deficiency). The atmosphere of the inert gas in the chamber room is replaced with the atmosphere. Usually, the replacement of the inert gas in the chamber room with the atmosphere is performed by vacuum suction of the inert gas in the chamber room, and after the replacement is completed, the worker enters the room and starts the work.

[0003]

However, in such a conventional chamber apparatus, when the inert gas remains in the chamber room due to some cause such as a failure of the suction device, the worker who enters the chamber receives an acid. There was a risk of causing a gap.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a chamber device capable of surely preventing an oxygen deficiency of an operator entering a chamber room, an electro-optical device and an organic EL device having the chamber device.

[0005]

In the chamber apparatus of the present invention, the inert gas introduced from the gas supply source is continuously supplied to and exhausted from the chamber room so that the inert gas in the chamber room is refreshed. A chamber device that configures the atmosphere and is capable of introducing outside air into the chamber room while the supply of the inert gas is stopped. The chamber device supplies the inert gas to the chamber room and supplies gas through a gas damper. A flow passage, an exhaust flow passage through which an atmosphere in the chamber room is exhausted and an exhaust damper is interposed, an oxygen concentration measuring means for measuring the oxygen concentration in the chamber room, and a removable panel attached to the opening of the chamber room. An electromagnetic lock mechanism that locks the body and the detachable panel body by blocking.
Lock control means for controlling locking / unlocking of the electromagnetic lock mechanism, and the lock control means unlocks the electromagnetic lock mechanism when the measurement result of the oxygen concentration measuring means exceeds a predetermined value during introduction of outside air. It is characterized by controlling.

This chamber device is controlled to unlock the electromagnetic lock mechanism when the oxygen concentration in the chamber room exceeds a predetermined value. That is, the atmosphere is replaced by introducing the outside air and exhausting the inert gas in the chamber room (the outside air is introduced). At the time of this atmosphere replacement, when the atmosphere in the chamber room exceeds a predetermined oxygen concentration, The detachable panel body can be removed.
Therefore, not only when the chamber room is filled with an inert gas, but when the inert gas remains due to exhaust failure etc. when replacing the atmosphere, the detachable panel body is locked, so It is possible to prevent the detachable panel body from being opened, and thus it is possible to reliably prevent oxygen deficiency of the operator. The predetermined oxygen concentration is
Normally, oxygen concentration that humans can breathe (about 20%)
Is meant.

In this case, a damper control means for controlling the gas damper and a panel sensor for detecting attachment / detachment of the detachable panel body are further provided, and the damper control means uses the panel sensor to confirm that the detachable panel body is not attached. It is preferable to control the gas damper to be closed when detected.

According to this structure, when the panel sensor detects that the detachable panel body is not mounted, the gas damper is controlled to be closed, so that the inert gas is introduced with the detachable panel body open. There is no. Therefore, leakage of the inert gas into the atmosphere can be prevented.

In this case, when the measurement result of the oxygen concentration measuring means is less than a predetermined value when the outside air is introduced, and when the panel sensor detects that the detachable panel body is not attached when the inert gas is supplied, an error notification is given. It is preferable to further include an error notifying unit for performing.

According to this structure, when the oxygen concentration is below a predetermined value when the outside air is introduced, and when it is detected that the detachable panel is not attached at the time of supplying the inert gas, an error is notified, so that the chamber room An operator does not accidentally enter the chamber room when the inside is filled with the inert gas. That is, due to the double interlock between the electromagnetic lock mechanism and the panel sensor, it is possible to more reliably prevent the worker from being deficient in oxygen.

In these cases, the panel sensor is preferably a proximity sensor.

According to this structure, it is possible to reliably detect whether the removable panel body is mounted or not mounted with a simple device structure.

In these cases, it is preferable that the detachable panel body is composed of an outer panel and an inner panel that face each other with a gap.

According to this structure, the removable panel body has a double structure of the outer panel and the inner panel, so that the leak of the inert gas can be prevented as much as possible.

In this case, one end communicates with the gap between the inner and outer panels, and the other end communicates with the upstream exhaust passage of the exhaust damper, and the panel exhaust passage. It is preferable to further include a panel body exhaust damper provided in the above.

According to this structure, even if the inert gas leaks from the inner panel and collects in the gap between the inner panel and the outer panel, the leaked inert gas is discharged through the panel exhaust passage when the atmosphere is replaced. Since it flows to the exhaust flow path via, it is possible to prevent the inert gas from remaining in the voids of both the inner and outer panels.

In another chamber apparatus of the present invention, a fresh atmosphere of the inert gas is formed in the chamber room by continuously supplying and exhausting the inert gas introduced from the gas supply source to the chamber room. A chamber apparatus, in which an inert gas is replenished in the chamber room and a gas supply flow path having a gas damper interposed therebetween, an exhaust gas flow path for exhausting an atmosphere in the chamber room and an exhaust damper interposed therebetween, and a gas Wind speed measuring means respectively arranged in the supply flow path and the exhaust flow path, and an error notifying means for notifying an error when the difference between the measurement results of the two wind speed measuring means exceeds a predetermined value. Is characterized by.

According to this structure, when the difference in the wind force measured by the two wind speed measuring means respectively arranged in the gas supply passage and the exhaust passage exceeds a predetermined value, an error notification is given. It is possible to confirm a leak of inert gas.

In this case, a damper control means for controlling the gas damper and the exhaust damper, and a pressure detection means for detecting the pressure in the chamber room are further provided, and the damper control means controls the exhaust damper and the pressure detection means. It is preferable to control the exhaust gas flow rate so that the detection result of 1 becomes a predetermined value.

According to this structure, the exhaust flow rate is controlled by the exhaust damper so that the detection result of the pressure detecting means becomes a predetermined value, that is, the chamber room is always at a somewhat positive pressure with respect to the atmospheric pressure. Since such control is performed, it is possible to reliably prevent the outside air from entering the chamber room.

In this case, an oxygen concentration measuring means for measuring the oxygen concentration in the chamber room is further provided, and the damper control means controls the gas damper so that the replenishment flow rate is adjusted so that the detection result of the oxygen concentration measuring means becomes a predetermined value. Is preferably controlled.

According to this structure, since the replenishment flow rate is controlled by the gas damper so that the detection result of the oxygen concentration measuring means becomes a predetermined value, the atmosphere in the chamber room can be kept at a stable oxygen concentration.

Another chamber apparatus according to the present invention is a chamber apparatus which forms a fresh atmosphere of an inert gas in the chamber room by circulating an inert gas between the chamber room and the gas purifying apparatus. , A gas outflow path and a gas return path connecting the gas purifier and the chamber room, a gas outflow path valve and a gas return path valve provided in the gas outflow path and the gas return path, respectively, and an upstream side of the gas outflow path and a gas return path And a bypass passage communicating with a downstream side of the valve and having an opening / closing valve interposed therebetween.

According to this structure, since the inert gas is circulated between the chamber room and the gas purifying apparatus, a small amount of the inert gas in the chamber room can be used as compared with the case of continuously supplying and exhausting gas. It can compose a fresh atmosphere. Further, since the upstream side of the gas outward valve and the downstream side of the gas return valve are connected to each other and the bypass channel is provided through the opening / closing valve, when the supply of the inert gas to the chamber room is stopped, By closing the gas outward valve and the gas return valve and opening the open / close valve, the inert gas purified by the gas purifier can be circulated. As a result, it is possible to prevent the inside of the gas purification device from having a positive pressure due to the storage of the purified inert gas. Therefore, the supply of the inert gas to the chamber room can be stopped without imposing a burden on the gas purifier.

In this case, the compressed air is supplied to the chamber room and an air supply passage provided with an air supply valve, and an exhaust passage provided with an exhaust valve for exhausting the atmosphere from the chamber room are further provided. It is preferable to provide.

According to this structure, the air supply valve is opened while the exhaust passage is opened by the exhaust valve,
By supplying compressed air to the chamber room, the atmosphere can be replaced. Further, by supplying the compressed air, the inert gas in the chamber room is pushed out to the exhaust passage, so that the atmosphere replacement can be performed quickly and efficiently.

In this case, a valve control means for controlling the air supply valve and the exhaust valve is further provided, and the valve control means controls both valves when the inert gas is introduced, and controls both valves when the compressed air is supplied. Preferably.

According to this structure, when the inert gas is introduced, the air supply valve and the exhaust valve are controlled to be closed so that only the inert gas is introduced into the chamber room. The atmosphere can be configured. Further, when the air is supplied, the air supply valve and the exhaust valve are controlled to be opened, so that the atmosphere replacement can be performed quickly and efficiently.

In this case, an oxygen concentration measuring means for measuring the oxygen concentration in the chamber room is further provided, and the valve control means controls the air supply valve to be closed when the measurement result of the oxygen concentration measuring means exceeds a predetermined value. Preferably.

According to this structure, the air supply valve is controlled to be closed when the oxygen concentration exceeds a predetermined value, so that it is possible to prevent excessive air supply to the chamber room.

In this case, it is preferable that the oxygen concentration measuring means is provided in a circulation flow path connected to the chamber room.

According to this structure, the oxygen concentration measuring means is
Since it is provided in the circulation flow path connected to the chamber room, the degree of freedom in the configuration of the processing apparatus housed in the chamber room is not impaired. Moreover, since the oxygen concentration is measured by circulating the atmosphere in the chamber room, stable measurement can be performed without being affected by the processing apparatus housed therein.

In this case, there is further provided an outward valve and a return valve respectively provided in the circulation outward path and the circulation return path of the circulation flow path, and oxygen measuring valve control means for controlling the outward path valve and the return path valve. The measurement valve control means preferably controls the opening of the outward valve and the return valve when the compressed air is supplied.

According to this structure, when air is supplied, that is, when it becomes necessary to measure the oxygen concentration, the outward valve and the return valve can be controlled to be opened to measure the oxygen concentration. That is, when it is not necessary to measure the oxygen concentration, by closing them and stopping the circulation of the atmosphere in the chamber room, it is possible to suppress unnecessary power consumption for the oxygen concentration measurement.

In these cases, when the inert gas is introduced, the exhaust gas from the gas purifier is exhausted and a gas exhaust passage having a gas exhaust valve is further provided, and the gas exhaust valve is controlled by the valve control means. Preferably.

According to this structure, when the inert gas is introduced, the exhaust gas from the gas purification device is appropriately exhausted, so that the inert gas can be efficiently and safely provided between the chamber room and the gas purification device. Can be circulated.

In this case, the chamber room and the gas purifying device are directly communicated with each other, and a sub gas flow path provided with a first pressure detecting means for detecting the pressure in the chamber room is further provided, and the valve control means is inactive. At the time of introducing gas, when the detection result by the first pressure detecting means is equal to or more than a predetermined value, it is preferable to control the opening of the gas exhaust valve.

According to this structure, when the pressure in the chamber room is equal to or higher than a predetermined value when the inert gas is introduced, the gas exhaust valve is controlled to open so that the atmosphere in the chamber room is discharged through the sub gas passage. It can be exhausted to the exhaust passage. That is, it is possible to suppress an excessive increase in pressure in the chamber room when the inert gas is introduced.

In these cases, a second pressure detecting means for detecting the pressure in the chamber room is further provided, and the valve control means, when the detection result by the second pressure detecting means is a predetermined value or more when the compressed air is supplied, It is preferable to control the air supply valve to be closed.

According to this structure, when the internal pressure of the chamber room is equal to or higher than the predetermined value during the air supply, the air supply valve is controlled to be closed, so that the excessive pressure rise in the chamber room can be suppressed.

In these cases, it is preferable to further include an oil bubbler for releasing the atmosphere in the chamber room to the outside when the pressure in the chamber room exceeds a predetermined pressure value.

According to this structure, by controlling the liquid level by the oil bubbler, it is possible to release the liquid to the outside of the atmosphere in the chamber when the pressure exceeds a predetermined pressure value. That is, it is possible to suppress an excessive increase in pressure in the chamber by simple control.

In these cases, it is preferable to further include error notifying means for notifying an error when the value measured by the oxygen concentration measuring means is lowered during the supply of compressed air.

According to this structure, when the oxygen concentration in the chamber room is lowered during compressed air supply, an error is notified, so that the oxygen concentration is not sufficiently increased (state in which inert gas remains). ) Does not allow workers to enter the room. Therefore, it is possible to reliably prevent oxygen deficiency of the worker.

In these cases, a timer for counting the opening control time of the air supply valve and the exhaust valve is further provided, and the valve control means, when the compressed air is supplied, after the constant time is counted by the timer, the air supply valve Also, it is preferable to control the exhaust valve to be closed.

According to this structure, when the compressed air is supplied, the air supply valve and the exhaust valve are controlled to be opened for a certain period of time. That is, even when the oxygen concentration measuring means does not operate normally, the air is supplied and the inert gas is exhausted during the time when the oxygen concentration is expected to rise to a sufficient concentration, so that the atmosphere is reliably replaced. be able to. Therefore, it is possible to more reliably prevent oxygen deficiency of the worker.

In these cases, it is preferable to accommodate a work processing apparatus that requires the work processing in an atmosphere of an inert gas in a maintainable manner.

An electro-optical device of the present invention is characterized by including the chamber apparatus described in any one of the above and a work processing apparatus housed in the chamber apparatus.

With this configuration, the work processing can be performed in a good inert gas atmosphere, and the work processing apparatus can be maintained in a safe atmosphere.

In this case, it is preferable that the work processing device is a device for manufacturing an organic EL device.

According to this structure, the introduction of the inert gas and the air supply can be carried out quickly, so that the influence on the takt time (work processing) can be minimized.

In this case, the manufacturing apparatus of the organic EL device relatively scans the functional liquid droplet ejection head into which the light emitting functional material is introduced, with respect to the substrate which is the work, and selectively ejects the light emitting functional material. It is preferable to have a droplet discharge device that forms an organic EL functional layer in a large number of pixel regions above.

According to this structure, the step of ejecting the light-emitting functional material to form the organic EL functional layer can be performed in a good inert gas atmosphere, so that the deterioration and damage of the light-emitting functional material are effective. Can be prevented. Further, since the atmosphere replacement can be performed reliably, the maintainability of the droplet discharge device is not impaired.

In these cases, the inert gas is preferably nitrogen, carbon dioxide, helium, neon, argon, krypton, xenon or radon.

According to this structure, nitrogen, carbon dioxide, helium,
An atmosphere of neon, argon, krypton, xenon, radon, etc. can be formed in the chamber room.

The organic EL device of the present invention is characterized by being manufactured by any one of the electro-optical devices described above.

With this structure, it is possible to provide an organic EL device having high quality and high yield at low cost.

[0058]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings. Inkjet head of inkjet printer (Functional droplet discharge head)
Is capable of accurately ejecting minute ink droplets (droplets) in a dot shape. Therefore, for example, by using a special ink, a light emitting or photosensitive resin, or the like for the functional droplets (ejection target liquid). It is expected to be applied to the manufacturing field of various parts.

The electro-optical device according to the present embodiment is applied to a so-called flat display manufacturing device such as an organic EL device, and a plurality of functional liquid droplet ejection heads emit light-emitting materials or the like in an inert gas atmosphere. A functional liquid is ejected (inkjet method) to form an EL light emitting layer and a hole injecting layer of each pixel having a light emitting function of the organic EL device.

Therefore, in the present embodiment, the electro-optical device applied to the manufacturing apparatus of the organic EL device will be described, and the structure and manufacturing method (manufacturing process) of the organic EL device manufactured by the electro-optical device will be described.

As shown in FIG. 1, the electro-optical device 1 of the embodiment comprises a drawing device 2 and a chamber device 3 for accommodating the drawing device 2, and a functional liquid droplet ejection head 4 mounted on the drawing device 2 emits light. While the material is discharged to form the EL light emitting layer and the hole injection layer of the organic EL device, a series of manufacturing steps including the discharge operation of the functional liquid droplet discharge head 4 is performed by the inert gas ( It is done in an atmosphere of (nitrogen gas).

As will be described in detail later, the drawing device 2 is provided with a droplet discharge device 6 and an accessory device 7 including various devices associated therewith. The chamber device 3 has a so-called clean room configuration in which a chamber room 11 is provided with an electric room 12 and a machine room 13. A nitrogen gas, which is an inert gas, is introduced into the chamber room 11, and the droplet discharge device 6 and the auxiliary device 7 accommodated therein are stored.
Are exposed to the atmosphere of nitrogen gas as a whole and operate in the atmosphere of nitrogen gas.

As shown in FIGS. 2 to 5, the droplet discharge device 6 includes a pedestal 15 installed on the floor, a stone surface plate 16 installed on the frame 15, and an X-axis installed on the stone surface plate 16. The table 17 and a Y-axis table 18 orthogonal to the table 17 are provided, a main carriage 19 suspended from the Y-axis table 18, and a head unit 20 mounted on the main carriage 19.

The X-axis table 17 has an X-axis air slider 22 and an X-axis linear motor 23 which constitute a drive system in the X-axis direction, on which a θ table 24 and a suction table 25 for sucking the substrate W by air are mounted. And then configured. Further, the Y-axis table 18 has a pair of Y-axis sliders 27, 27, a Y-axis ball screw 28 and a Y-axis motor (servo motor) 29 that constitute a Y-axis direction drive system.
The bridge plate 30 for suspending the above-mentioned main carriage 19 is mounted on this structure.

A plurality of functional liquid droplet ejection heads 4 are mounted on the head unit 20 mounted on the main carriage 19 via the sub-carriage. Although not shown in detail in particular, twelve functional liquid droplet ejection heads 4 are mounted on the sub-carriage, and these functional liquid droplet ejection heads 4 are divided into six upper and lower halves, which are predetermined in the main scanning direction. Are tilted by an angle (see FIG. 6).

In the droplet discharge device 6 of this embodiment, the substrate W moves in synchronization with the driving of the functional droplet discharge head 4 (selective discharge of functional droplets). The so-called main scanning is performed by reciprocating the X-axis table 17 in the X-axis direction. Correspondingly, so-called sub-scanning is performed by the Y-axis table 18 by the forward movement of the functional liquid droplet ejection head 4 in the Y-axis direction.

On the other hand, the home position of the head unit 20 is the rear position in FIG. 1, and the head unit 20 is carried in or replaced from the rear of the droplet discharge device 6 (details will be described later). ). A substrate transfer device (not shown) faces the left side of the figure, and the substrate W is loaded and unloaded from the left side. And
The auxiliary device 7 is provided on the front side of the droplet discharge device 6 in the figure.
The main components of the above are integrally attached.

The accessory device 7 is a cabinet-type common machine base 32 arranged so as to be adjacent to the pedestal 15 and the stone surface plate 16, and an air supply device 33 housed in one half of the common machine base 32. And a vacuum suction device 34, a functional liquid supply / recovery device 35 that accommodates the main device in one half of the common machine base 32, and a maintenance device 36 that accommodates the main device on the common machine base 32. . Reference numeral 37 in the figure is an intermediate tank of the functional liquid supply / recovery device 35 provided in the functional liquid flow path between the main tank (not shown) and the head unit 20.

The air supply device 33 and the functional liquid supply / recovery device 35 constitute pressure supply sources and are used as a drive source for the air pressure actuator in the maintenance device 36 and the like. The vacuum suction device 34 is connected to the suction table 25, and suction-sets the substrate W by air suction. The functional liquid supply / recovery device 35 supplies the functional liquid to the functional liquid droplet ejection head 4 and recovers the unnecessary functional liquid from the maintenance device 36 and the like.

The maintenance device 36 includes a flushing unit 41 that receives the regular flushing of the functional liquid droplet ejection head 4 (discharging and ejecting the functional liquid from all the ejection nozzles).
A cleaning unit 42 for sucking and storing the functional liquid discharge head 4 and the functional liquid discharge head 4.
Wiping unit 4 for wiping the nozzle formation surface of
3 and 3. The cleaning unit 42 and the wiping unit 43 are arranged on the common machine base 32, and the flushing unit 41 is mounted on the X-axis table (θ table 24) 17 near the substrate W.

Now, with reference to the schematic view of FIG. 6, a series of operations of the drawing apparatus 2 operating in the atmosphere of the nitrogen gas in the chamber apparatus 3 will be briefly described. First, as a preparation step, the head unit 20 is carried into the droplet discharge device 6 and set on the main carriage 19. When the head unit 20 is set on the main carriage 19, the Y-axis table 18 moves the head unit 20 to the position of the head recognition camera (not shown), and the head unit 2
Position recognition of 0 is performed. Here, based on this recognition result, the head unit 20 is θ-corrected, and the position correction of the head unit 20 in the X-axis direction and the Y-axis direction is performed on the data. After the position correction, the head unit (main carriage 19) 20 returns to the home position.

On the other hand, the suction table 2 of the X-axis table 17
When a substrate (in this case, each substrate to be introduced) W is introduced onto the substrate 5, a substrate recognition camera (not shown) recognizes the position of the substrate W at the introduction position. Here, based on the recognition result, the θ of the substrate W is θ-corrected by the θ-table 24 supporting the suction table 25, and the position correction of the substrate W in the X-axis direction and the Y-axis direction is performed on the data.

When the preparation is completed in this way, in the actual droplet discharge work, first, the X-axis table 17 is driven to reciprocate the substrate W in the main scanning direction and at the same time drive a plurality of functional droplet discharge heads 4. Then, the selective discharge operation of the functional liquid droplets to the substrate W is performed. After the substrate W has returned, the Y-axis table 18 is driven, the head unit 20 is moved by one pitch in the sub-scanning direction, and the substrate W is reciprocated in the main-scanning direction and the functional liquid droplet ejection head. 4 is driven. Then, by repeating this several times, the liquid droplets are ejected from the edge of the substrate W (the entire area). This allows
The light emitting layer of the organic EL device is formed.

On the other hand, in parallel with the above operation, the head unit (functional liquid droplet ejection head 4) 20 of the liquid droplet ejecting device 6 uses the air supply device 33 as a pressure source to supply the functional liquid from the functional liquid supplying and collecting device 35. Are continuously supplied, and in the suction table 25, the vacuum suction device 34 sucks air in order to suck the substrate W. Immediately before the droplet discharge work, the head unit 20 faces the cleaning unit 42 and the wiping unit 43 to suck the functional liquid from all the discharge nozzles of the functional droplet discharge head 4 and the subsequent nozzle formation surface. Wiping is done. During the droplet discharge operation, the head unit 20 appropriately faces the flushing unit 41, and the functional droplet discharge head 4 is flushed.

In this embodiment, the head unit 2
In contrast to 0, the substrate W which is the ejection target is moved in the main scanning direction (X-axis direction), but the head unit 20 may be moved in the main scanning direction. Further, the head unit 20 may be fixed and the substrate W may be moved in the main scanning direction and the sub scanning direction.

Next, the chamber apparatus 3 according to the first embodiment of the present invention will be described with reference to the system diagram of FIG. 7 and the structural diagrams of FIGS. In the description of the chamber device, the lower side of the paper surface in FIG. 8 is described as “front”, the upper side is “rear”, the left side is “left”, and the right side is “right”.

The chamber device 3 comprises a chamber room 11 for accommodating the drawing device 2, an electric room 12 provided in front of the chamber room 11 on the right front side, and a machine room 13 installed in the right rear portion of the chamber room 11. ing. In addition, as the inert gas with which the chamber room 11 is filled, nitrogen,
It is preferable to use any one of carbon dioxide, helium, neon, argon, krypton, xenon, and radon, but in this embodiment, nitrogen (nitrogen gas) is used in consideration of cost and safety.

The inert gas (nitrogen gas) is supplied from the gas producing apparatus (not shown) through the gas introduction unit 101 to the machine room 13
Is introduced into the chamber room 11 and is conditioned here.
Will be introduced to. Further, the inert gas in the chamber room 11 is appropriately exhausted from an exhaust duct (exhaust flow path) 102 attached to the left front part of the chamber room 11 and sent to a gas treatment device (not shown). In actual operation, chamber room 1
On the other hand, the supply of the inert gas and the exhaust of the same are continuously performed, and the atmosphere in the chamber room 11 is constituted by the slightly flowing inert gas.

The chamber room 11 includes a left side wall 111, a right side wall 112, a front removable panel unit 113, a rear removable panel unit 114, a floor wall 115 and a ceiling wall 116.
Is a prefabricated type that is assembled by mutually sealing with an airtight material. On the other hand, the droplet discharge device 6 housed inside the chamber room 11 is housed in a posture in which the front-rear direction is the Y-axis direction and the left-right direction is the X-axis direction (see FIG. 1). That is, considering maintenance etc.,
The accessory device 7 of the drawing device 2 is a front detachable panel unit 11
3, the home position side of the head unit 20 faces the rear removable panel unit 114 in consideration of carrying in the head unit 20 and the like. In addition, a delivery opening 117 with a shutter for loading and unloading the substrate W is formed on the left side wall 111 (see FIG. 11).

The front detachable panel unit 113 and the rear detachable panel unit 114 each have a double structure of an inner panel unit 121 and an outer panel unit 122. The inner panel unit 121 includes a frame 123 having a vertical frame 123a in the middle between the left and right, and a pair of inner panels 124 with windows detachably attached to the left and right openings (maintenance openings) formed by the vertical frame 123a. 1
24 and 24 (see FIG. 13). Each inner panel 1
The left and right handles 24 are provided with a plurality of lock levers (all are not shown), and the inner panel 124
Is applied to the frame body 123 in the form of a kendo and is hermetically attached to the frame body 123 by the plurality of lock levers.

Similarly, the outer panel unit 122 includes a frame body 125 having a vertical frame 125a in the middle between the left and right, and a vertical frame 12a.
Left and right openings composed of 5a (maintenance openings)
And a pair of outer panels 126 and 126 each having a window detachably attached thereto (see FIG. 13). Each outer panel 126 is provided with a plurality of lock levers 128 in addition to the left and right handles 127 and 127, and in this case also, the outer panel 126 is applied to the frame body in a kendon style and the plurality of locks are provided. Frame 12 by lever 128
It is attached airtightly to 5. The outer panel unit 122 is formed to be slightly wider and slightly longer than the inner panel unit 121, so that both the inner and outer panels 121, 1 are formed.
It does not interfere with the work of attaching and detaching 22 (see FIG. 13).

In addition, the inner and outer panels 124 and 126 include
A plurality of electromagnetic lock devices 129 are incorporated on the upper side of the chambers so that the inner and outer panels 124 and 126 can be locked / unlocked according to the oxygen concentration in the chamber room 11. In addition, a plurality of panel sensors (proximity sensors) 211 that detect whether or not both the panels 124 and 126 are mounted are provided near the inner and outer panels 124 and 126 (see FIG. 27). Each panel sensor 211
The detection result by is displayed on the display 251.
It can be confirmed by the operator. Further, when the inside of the chamber room 11 has a predetermined oxygen concentration (usually, an oxygen concentration of about 20% is set) or less during the normal operation of introducing an inert gas and during the atmosphere replacement, the panel sensor 211 causes each panel 124 to operate. , 126 is not mounted, an error is displayed on the display 251 and a warning is given by the indicator lamp 252. At this time, at the same time, a warning sound is emitted and the gas opening / closing damper 144 is controlled to be closed, so that the gas supply is stopped.

In this way, the display display and the indicator lamp 2 are
By issuing an error notification at 52 or the like, the operator can confirm that the inner and outer panels 124, 126 are not mounted, and thus gas can be prevented from leaking to the atmosphere. Further, this prevents the worker from accidentally entering the chamber room 11 in a state where the chamber room 11 is filled with the inert gas, so that the worker can be surely prevented from being deficient in oxygen.
That is, as described above, the front removable panel unit 113
The rear removable panel unit 114 is doubly interlocked by the electromagnetic lock device 129 and the panel sensor 211.

An air supply port 131 connected to the machine chamber 13 is formed in the upper rear part of the right side wall 112, and an exhaust port 132 connected to the exhaust duct 102 is formed in the front lower part of the left side wall 111 correspondingly. ing. Further, a filter chamber 133 connected to the air supply port 131 is formed in the ceiling portion of the chamber room 11. The filter chamber 133 is
The ceiling portion is horizontally divided by a lattice-shaped filter mounting frame 134, and a plurality of (4
One filter (HEPA filter) 135 is attached (see FIG. 8).

The inert gas flowing in from the air supply port 131 flows into the filter chamber 133 and a plurality of filters 135
And flows into the upper portion of the droplet discharge device 6. In this case, although the inert gas flowing from the air supply port 131 passes through the filter (filter chamber 133) 135,
The main body of the airflow flows in the chamber room 11 in a substantially diagonal direction to reach the exhaust port 132. The main flow path of the airflow in the diagonal direction faces the area where the droplet discharge operation of the droplet discharge device 6 is performed, that is, the discharge area.

That is, in the chamber room 11, the main flow of the inert gas flows so as to surround the discharge area,
And after downflowing from the filter as the whole air flow,
It flows toward the exhaust port 132. As a result, the discharge area is always exposed to the atmosphere of fresh inert gas. Needless to say, the flow velocity of the airflow in this case is adjusted to such an extent that the functional liquid droplets ejected from the functional liquid droplet ejection head 4 do not cause flight bending.

At the upper part of the machine room 13, there is provided a gas introduction unit 101 connected to a gas production apparatus (not shown).
Further, the inside of the machine room 11 is appropriately partitioned by a partition wall 137,
A gas flow path 138 is formed from the gas introduction unit 101 to the air supply port 131. That is, machine room 1
A duct serving as the gas flow path 138 is integrally formed inside the unit 3.

The gas introduction unit 101 is composed of a gas opening / closing valve (electromagnetic valve) 142, a gas adjusting damper (electric valve: high airtight motor damper) 143, and a gas opening / closing damper (high airtight motor damper) 144 in this order from the upstream side. The gas damper unit 141 is incorporated (see FIG. 7). As described above, the chamber device 3 of the embodiment
In the operation mode in which the supply and exhaust of the inert gas are continuously performed, the supply of the inert gas is performed by the gas adjustment damper 143 with the gas opening / closing valve 142 and the gas opening / closing damper 144 being “open”. The flow rate is adjusted. In the atmosphere replacement operation described later, the gas opening / closing valve 14
2. Gas adjustment damper 143 and gas opening / closing damper 1
All of 44 are controlled to be “closed”.

Gas channel 13 formed inside machine room 13
Numeral 8 extends from the gas introduction unit 101 to the lower part of the machine room 13, where it makes a U-turn to reach the upper air supply port 131. Then, in the gas flow path 138, a flow path portion directed upward is provided with a gas conditioner 1 described later.
55 is installed.

As shown in FIG. 7, the gas flow path 138 is branched on the downstream side of the gas introduction unit 101,
It is composed of one main gas passage 147 passing from the gas introduction unit 101 through the gas conditioning apparatus 155 to the air supply port 131, and the other bypass flow passage 148 leading from the gas introduction unit 101 directly to the air supply port 131. ing. The main gas flow passage 147 and the bypass flow passage 148 are respectively provided with manual dampers 149 and 150 for switching the flow passages. These both manual dampers 149 and 150 are adjusted only at the initial adjustment when the chamber device 3 is installed. To be done.

As shown only in FIG. 7, a return passage (return port) 151 is formed in the chamber room 11, and the return gas of the chamber room 11 passes through the return passage 151 and the machine room 13 is returned. And is joined to the main gas flow path 147 on the upstream side of the gas conditioner 155. However, this return is preliminary and the return operation is not performed during normal operation.

The main gas passage 147 is provided with a gas conditioner 155 including a cooler (cheering unit) 156, a heater (electric heater) 157, and two fans (sirocco fans) 158 and 158. Cooler 15
The heater 6 and the heater 157 are arranged adjacent to each other in the upper and lower intermediate positions of the machine room and constitute a temperature adjusting device. As a result, the atmosphere of the inert gas in the chamber room 11 is kept at a predetermined temperature, for example, 20 ° C. ±
It is designed to be maintained at 0.5 ° C.

The fan 158 is provided in the upper part of the machine room 13 and is provided close to the air supply port 131. The inert gas introduced from the gas introduction unit 101 is supplied to the chamber room 1 via the air supply port 131 by the fan 158.
It is forcibly insufflated into 1. And this fan 158
Thus, the supply amount of the inert gas to the chamber room 11 and the flow velocity of the airflow in the chamber room 11 are controlled.

The exhaust duct 102 constituting the exhaust flow path is
An exhaust chamber 161 is provided in the vicinity of the exhaust port 132, stands up from the exhaust chamber 161, and further extends horizontally along the upper surface of the chamber room 11.
An exhaust damper unit 162 including an exhaust adjusting damper 163 and an exhaust opening / closing damper 164 is provided downstream of the exhaust duct 102 (a portion located on the upper surface of the chamber room 11) (see FIG. 7). The exhaust flow rate is adjusted by.

Further, two exhaust pipes (panel exhaust passages) 166 and 166 extending from the front detachable panel unit 113 and the rear detachable panel unit 114 are connected to the exhaust chamber 161 (Fig. 8, FIG. 9 and FIG. 11). The upstream end of each exhaust pipe has an inner panel unit 121 and an outer panel unit 122.
And an exhaust valve (panel exhaust damper) 167 in each exhaust pipe 166.
Is installed. As a result, the inert gas leaked into the gaps 130 of the inner and outer panel units 113 and 114 can be exhausted (details will be described later).

On the other hand, in the main gas flow passage 147 on the upstream side of the gas conditioner 155, a partition wall 137 is provided between the machine room 1 and the main gas passage 147.
The outside air flow paths 171 configured in No. 3 join (see FIG. 7). The outside air intake port 172 of the outside air passage 171 is open to the lower side surface of the machine room 13, and the downstream end of the outside air passage 171 joins the main gas passage 147 on the upstream side of the cooler 156. In addition, the outside air flow path 171 includes the outside air intake port 1
An outside air damper unit 173 including an outside air opening / closing damper 174, an outside air adjusting damper 175, and an outside air opening / closing valve 176 is provided in order from the 72 side.

In this case, the outside air opening / closing damper 174 and the outside air adjusting damper 175 are high airtight dampers,
The outside air opening / closing valve 176 is composed of a solenoid valve (motorized two-way valve). Although the details will be described later, when the outside air replacement operation is performed, the outside air opening / closing damper 174 and the outside air adjusting damper 17 are used.
5 and the outside air opening / closing valve 176 are both controlled to be “open”, and the outside air adjusting damper 175 adjusts the flow rate of the outside air. Also, during normal power transmission, these dampers 17
4, 175 and the valve 176 are all controlled to be "closed", and the high airtightness and the number of these elements reliably block the entry of outside air.

Next, the control configuration of the chamber device 3 will be briefly described. As shown in the block diagram of FIG. 27, the chamber device 3 includes a temperature controller 189 and an oxygen concentration meter 18
2, 191, a pressure gauge 187, a moisture gauge 183, wind speed monitors 188a and 188b, and a panel sensor 211, and a detection unit 210 for performing various detections, and an electromagnetic lock device 12.
A panel unit 220 having 9 to lock / unlock the detachable panel units 113 and 114, and a damper unit having a gas damper unit 141, an outside air damper unit 173, and an exhaust damper unit 162 to open / close and adjust each damper. A gas conditioning unit 240 (gas conditioning device 155) that has a unit 230, a cooler 156, a heater 157, and a fan 158 to control temperature and air flow.
And a display unit 250 having a display 251 and an indicator lamp 252 for displaying detection results of various detectors and error display
And relay 1 connected to various drivers and heaters 157
A driving unit 260 having 90 to drive each circuit, a control unit 270 that controls each unit of the chamber apparatus 3, and a power supply unit 280 that supplies power to each unit of the chamber apparatus 3.

The control section 270 includes a CPU 271 and a ROM.
272, RAM 273, IOC (input / output control circuit)
274 and are connected to each other by an internal bus 275. The ROM 272 stores a control program processed by the CPU 271, as well as control data for controlling each unit. The RAM 273 has a register group used as various flags and the like, and a data area for storing measurement values detected and measured by each detector, and is used as a work area for control processing.

The IOC 274 has a built-in logic circuit for complementing the function of the CPU 271 and for handling interface signals with various peripheral circuits.
The detection signal or the like from 10 is directly or processed and taken into the internal bus 275, and in cooperation with the CPU 271, the data or control signal output from the CPU 271 or the like to the internal bus 275 is directly or processed and is driven 26.
Output to 0. Then, the CPU 271 has the above-described configuration according to the control program stored in the ROM 272.
By inputting various signals and data from each part of the chamber apparatus 3 via the IOC 274 and outputting various signals and data to each part of the chamber apparatus 3 via the IOC 274, lock / unlock of the removable panel units 113 and 114 is performed. The chamber device 3 as a whole is controlled by locking and opening / closing each damper.

Next, a method of operating the chamber device 3 will be briefly described. During normal operation in which the inert gas is introduced into the chamber room 11, the outside air damper unit 173 is “closed”, the gas damper unit 141 and the exhaust damper unit 162 are “open”, and the fan 1
58, the inert gas is replenished and exhausted into the chamber room 11 to form the atmosphere.

An oxygen concentration meter (low concentration) 182 and a moisture meter 183 provided in the chamber room 11 are connected to the gas adjustment damper 143 via the controller 181, and based on these measurement results, the The supply flow rate of the active gas is adjusted. More specifically, the gas adjustment damper 143 controls so that both the oxygen concentration and the water concentration in the chamber room 11 are maintained at 10 ppm or less. Reference numeral 184 in the drawing is a scaling meter that displays the oxygen concentration.

On the other hand, a pressure gauge 187 is connected to the exhaust adjustment damper 163 via a controller 186, and the exhaust flow rate of the inert gas is adjusted based on the detection result of the pressure gauge 187. That is, the exhaust adjustment damper 1
By 63, control is performed so that the inside of the chamber room 11 becomes a somewhat positive pressure with respect to the atmospheric pressure. As a result, invasion of outside air is prevented even though the inert gas may leak from the chamber room 11. Also, the gas damper unit 1
41 near the downstream side and the exhaust damper unit 162
Near the upstream side of the wind speed monitors 188a, 1
88b is provided, and this wind speed monitor 188a,
Due to the change in the wind force difference of 188b, the failure of the fan 158 and the leak of the inert gas can be confirmed.

Further, a temperature controller (thermometer) 189 is provided in the chamber room 11, and the temperature controller 189 is connected to the heater 157 via a relay 190. In this case, the cooler 156 of the temperature control device is always in rated operation, and the heater 157 controls the inside of the chamber room 11 to be 20 ° C. ± 0.5 ° C.

On the other hand, in the atmosphere replacement operation for expelling the inert gas in the chamber room 11 to introduce the outside air, the gas damper unit 141 is closed and the outside air damper unit 173 and the exhaust damper unit 162 are opened.
As a result, the outside air is forcibly introduced into the chamber room 11 by the fan 158. That is, chamber room 1
The outside air is forcibly sent into the chamber 1 to push out the inert gas in the chamber room 11. Also, both exhaust valves 16
7 and 167 are set to “open”, and both inner and outer panel units 12
The inert gas leaked into the voids 130 of 1,122 is also exhausted.

In the atmosphere replacement operation premised on the maintenance of the drawing apparatus 2 (opening of the detachable panel units 113 and 114), the heater 157 is turned off, and the outside air adjustment damper 175 and the exhaust adjustment damper 163 are set to "fully open". The flow rate is not adjusted. As a result, the atmosphere replacement is performed in the shortest time. And chamber room 11
Based on the measurement result of the oxygen concentration meter (high concentration) 191 provided inside, the completion of the atmosphere replacement is confirmed, and the locked state of the electromagnetic lock device 129 is released. As a result, both the front and rear detachable panel units 113 and 114 can be opened.

Further, in the atmosphere replacement operation premised on the test operation for checking the accuracy of the drawing device (droplet ejection device 6) 2, the heater 157 is turned on and the outside air adjusting damper 175 and the exhaust adjusting damper 163 adjust the flow rate. Then, the inside of the chamber room 11 has a desired temperature (20 ° C. ± 0.
The atmosphere (atmosphere) of 5 ° C.) is replaced.

When an abnormality such as a temperature abnormality or a pressure abnormality occurs in the chamber device 3, the gas opening / closing valve 14
2. Gas adjustment damper 143 and gas opening / closing damper 1
All of 44 are controlled to be “closed”, and an exhaust adjustment damper 163, an exhaust opening / closing damper 164, and an outside air opening / closing damper 1 are provided.
74, outside air adjustment damper 175 and outside air open / close valve 1
Both 76 are controlled to be “open”. Then, after that, the power of the chamber device 3 is turned off.

As described above, in the chamber apparatus 3, since the drawing apparatus 2 is housed in the chamber room 11 and the droplet discharge operation by the droplet discharge apparatus 6 is performed in a fresh inert gas atmosphere, The functional liquid droplets (light emitting material) landed on the substrate W are not altered or damaged, and the organic E
The L device can be manufactured stably. Further, when performing the atmosphere replacement, the outside air is forcibly sent into the chamber room 11 by using the fan 158, so that the outside air can be replaced in a short time and the residual inert gas is minimized. Can be prevented.

Further, in the chamber device 3, when the atmosphere in the chamber room 11 exceeds a predetermined oxygen concentration during the atmosphere replacement, the electromagnetic lock device 129 is unlocked and the detachable panel bodies 124 and 126 are removed. Is possible. That is, when the chamber room 11 is filled with the inert gas, the detachable panel bodies 124 and 126 are locked and controlled when the chamber room 11 is filled with the inert gas due to exhaust failure or the like when the atmosphere is replaced. Therefore, it is possible to reliably prevent the detachable panel bodies 124 and 126 from being accidentally opened, and thus prevent the worker from being deficient in oxygen.

Next, the chamber device 3 according to the second embodiment of the present invention will be described. The chamber device 3 according to the present embodiment constitutes a fresh atmosphere of the inert gas in the chamber room 11 by circulating the inert gas between the chamber room 11 and the gas purification device 310. As shown in the system diagram of FIG. 28, the chamber device 3 is
A gas part 320 for introducing and circulating an inert gas, an air supply part 330 for supplying compressed air, an exhaust part 340 for exhausting the atmosphere in the chamber room 11, and an oxygen measurement for measuring the oxygen concentration in the chamber room 11. Part 350,
The chamber room 11 is provided with a pressure detection unit 360.

The gas section 320 includes a gas producing device 321 and
As a result, an inert gas is supplied and a gas purifying device 310 for purifying the inert gas, and a gas purifying device 310.
A gas outward path 323 that connects the chamber room 11 to the chamber room 11, and a gas outgoing path valve 322, and a gas return path 325 that communicates the chamber room 11 and the gas purification device 310 and a gas return path valve 324. A bypass passage 327 that connects the upstream side of the gas outward valve 322 and the downstream side of the gas return valve 324 and has an opening / closing valve 326 interposed between the bypass passage 327 and the exhaust gas from the gas purification device 310 when the inert gas is introduced. Exhaust gas exhaust passage 328
And a gas treatment device 32 for treating the exhausted inert gas
9 and 9.

Gas production apparatus 321 and gas purification apparatus 310
A gas regulator 311 is provided between the pressure regulator and the pressure regulator, and the pressure of the inert gas supplied is constant (usually 6 kg /
cm ² ). In addition, the gas outward valve 322
The gas return valve 324 is opened and closed manually by an operator, and is opened when the gas refining apparatus 310 starts operating and closed when it is stopped. On the other hand, the open / close valve 326
Also, the operator manually opens and closes the gas purifier 310, which is closed when the gas refining apparatus 310 starts to operate and opened when the gas purifier 310 is stopped.
Further, in the gas purifying device 310, a gas supply valve 312 that opens the gas outward path 323 and a gas exhaust flow path 328.
A gas exhaust valve 313 for opening the valve is attached to the end of each flow path.

The air supply unit 330 is used in the air manufacturing apparatus 3
31 and an air supply flow path 333 which supplies compressed air produced thereby to the chamber room 11 and is provided with an air supply valve 332.
An air regulator 334 is provided between the air manufacturing device 331 and the air supply valve 332, and the pressure of the compressed air supplied is constant (usually 1 to 2 kg / c).
m ² ). Also, the air supply valve 332
Is constituted by a solenoid valve and is controlled so as to be closed during normal operation and opened during air supply (atmosphere replacement).

The exhaust unit 340 exhausts the atmosphere from the chamber room 11 and an exhaust passage 342 having an exhaust valve 341, and an exhaust treatment device 343 for treating the exhaust.
It is composed of and. The exhaust valve 341 is constituted by an electromagnetic valve and is controlled so as to be closed during normal operation and open during air supply.

The oxygen measuring section 350 is provided in the chamber room 11
The oxygen concentration meter 351 for measuring the oxygen concentration in the chamber, the chamber room 11 and the oxygen concentration meter 351 are communicated with each other, and the circulation outward path 353 having the outward valve 352 is communicated with the oxygen concentration meter 351 and the chamber room 11. And a circulation return passage 355 provided with a return passage valve 354. The oxygen concentration meter 351 is configured to measure an oxygen concentration of 0 to 25%. The outward valve 352 and the return valve 354 are electromagnetic valves, and are controlled to open when air is supplied.

The pressure detecting section 360 is provided in the chamber room 11 with a first pressure sensor 361 for detecting the chamber room internal pressure during normal operation, a second pressure sensor 362 for detecting the chamber room internal pressure during air supply, It is constituted by an oil bubbler 363 that constantly detects the internal pressure of the chamber room. The first pressure sensor 361 is provided in the sub gas flow path 364 that directly connects the chamber room 11 and the gas purifying device 310, makes a contact within a range of ± 20 mbar, and detects a pressure value exceeding this. In this case, the gas exhaust valve 313 in the gas purifier 310 is opened and the chamber room 11 is opened via the sub gas passage 364.
The atmosphere inside (inert gas) is controlled to be exhausted to the gas processing device 329. On the other hand, when the second pressure sensor 362 detects a pressure value exceeding the range of ± 20 mbar, the air supply valve 332 is controlled to be closed. Further, the oil bubbler 363 discharges the atmosphere in the chamber room 11 to the outside when the chamber room internal pressure becomes equal to or higher than a certain pressure by the liquid level management.

Here, a method of operating the chamber device 3 will be briefly described. During the normal operation of introducing the inert gas into the chamber room 11, when the power of the gas purification device 310 is turned on, the gas supply valve 312 and the gas exhaust valve 313 in the gas purification device 310 become “open”. An instruction to switch the valves is issued on the display 251 (the gas outward valve 322 and the gas return valve 324 are “open”, and the open / close valve 326 is “closed”). Based on this, the operator manually switches each valve. As a result, the inert gas supplied from the gas production device 321 via the gas regulator 311 is purified by the gas purification device 310, and the chamber room 11
Is supplied to. At this time, the air supply valve 332 and the exhaust valve 341 are controlled to be “closed”, and the forward valve 3
52 and return valve 354 are controlled to "open".

After that, an oxygen concentration meter (which is provided at the end of the gas return passage 325) in the gas purifying device 310 (not shown).
When it is measured that the oxygen concentration has dropped to 200 ppm, the gas supply valve 3 in the gas purification device 310
12 and the gas exhaust valve 313 are controlled to be “closed”,
An inert gas is circulated between the gas purifier 310 and the chamber room 11 to reduce the oxygen concentration in the chamber room 11 to 10 ppm.

On the other hand, when air is supplied (atmosphere replacement), the power of the gas purification device 310 is turned off on the display 251.
It is instructed to set to F, and the worker turns off the power of the gas purifier 310 based on the instruction. Then, an instruction to switch the valves is further issued on the display 251 (the gas outward path valve 322 and the gas return path valve 324 are “closed”, and the opening / closing valve 326 is “open”).
Manually switch each valve. At this time, the outward valve 352 and the return valve 354 remain “open”, and the air supply valve 332 and the exhaust valve 341 are controlled to “open”. As a result, the compressed air supplied from the air manufacturing apparatus 331 is transferred to the chamber room 1
1, and the inert gas in the chamber room 11 is pushed out to the exhaust flow path 342, whereby the atmosphere is replaced. Then, the atmosphere replacement is continued until the oxygen concentration becomes 20% by the oxygen concentration meter 351, and when the oxygen concentration becomes 20%, the air supply valve 332 and the exhaust valve 341 are controlled to be “closed”.

Next, the interlock of each valve will be briefly described. First, when the air supply valve 332 is opened, the forward passage valve 352 and the return passage valve 354 are controlled to be opened, the gas is not supplied from the gas purification device 310, and the detection value of the second pressure sensor 362 is The conditions are that the maximum value set in advance is not exceeded and the exhaust valve 341 is controlled to be opened. In addition, when the exhaust valve 341 is opened, the forward passage valve 352 and the return passage valve 354 are controlled to be opened, the gas is not supplied from the gas purification device 310, and the detection value of the second pressure sensor 362 is set in advance. The condition is that it is not less than the set minimum value.

Further, as a measure for preventing oxygen deficiency of the worker, the oxygen concentration meter 351 is not supplied from the gas refining device 310 when compressed air is supplied.
When the measured value of 1 has decreased, an error notification is given on the display 251 or the indicator lamp 252 and a warning sound is emitted.

Further, the air supply valve 3 when replacing the atmosphere
The time during which the valve 32 and the exhaust valve 341 are controlled to be opened is measured by a timer (not shown), and the oxygen concentration meter 35
Regardless of the measurement result of 1, the opening control is always performed for a certain period of time. As a result, the oxygen concentration meter 35
Even when 1 does not operate normally, the air is supplied and the inert gas is exhausted during the time when the oxygen concentration is expected to rise to a sufficient concentration, so that the atmosphere can be reliably replaced.

As described above, in the chamber device 3 according to the second embodiment of the present invention, since the inert gas is circulated between the chamber room 11 and the gas purifying device 310, continuous replenishment and exhaust are performed. In comparison with the above, a fresh atmosphere can be formed in the chamber room 11 with a small amount of inert gas. Further, when the supply of the inert gas to the chamber room 11 is stopped, the gas outward valve 322 and the gas return valve 324 are closed, and the opening / closing valve 326 is opened.
Is opened, the inert gas purified by the gas purifier 310 can be circulated. As a result, it is possible to prevent the inside of the gas purification device 310 from becoming a positive pressure due to the storage of the purified inert gas. That is, the supply of the inert gas to the chamber room 11 can be stopped without imposing a burden on the gas purifier 310. Further, by supplying compressed air to replace the atmosphere, the inert gas in the chamber room 11 acts to be pushed out to the exhaust passage 342, so that the atmosphere can be replaced quickly and efficiently.

Next, a method of manufacturing an organic EL device using the electro-optical device 1 of the above embodiment will be described.

14 to 26 show the manufacturing process of the organic EL device and its structure. This manufacturing process includes a bank portion forming step, a plasma processing step, a light emitting element forming step including a hole injecting / transporting layer forming step and a light emitting layer forming step, a counter electrode forming step, and a sealing step. Is configured.

In the bank portion forming step, the inorganic bank layer 512a is formed on the circuit element portion 502 previously formed on the substrate 501 and on the electrode 511 (also referred to as a pixel electrode) at predetermined positions.
By stacking the organic material bank layer 512b with the organic material bank layer 512b, a bank portion 512 having an opening 512g is formed. As described above, the bank portion forming step includes a step of forming the inorganic bank layer 512a on a part of the electrode 511 and a step of forming the organic bank layer 512b on the inorganic bank layer.

First, in the step of forming the inorganic bank layer 512a, as shown in FIG.
An inorganic bank layer 512a is formed on the interlayer insulating film 544b and the pixel electrode 511. Inorganic bank layer 512a
An inorganic film such as SiO ₂ or TiO ₂ is formed on the entire surfaces of the interlayer insulating layer 514 and the pixel electrode 511 by, for example, the CVD method, the coating method, the sputtering method, the vapor deposition method, or the like.

Next, this inorganic film is patterned by etching or the like to form a lower opening portion 512c corresponding to the formation position of the electrode surface 511a of the electrode 511. At this time,
It is necessary to form the inorganic bank layer 512a so as to overlap the peripheral portion of the electrode 511. Thus, the electrode 51
The light emitting region of the light emitting layer 510 can be controlled by forming the inorganic bank layer 512a so that the peripheral portion (a part) of No. 1 and the inorganic bank layer 512a overlap.

Next, in the step of forming the organic bank layer 512b, as shown in FIG. 15, the inorganic bank layer 512a is formed.
An organic bank layer 512b is formed on top. The organic bank layer 512b is etched by a photolithography technique or the like to form an upper opening 512d of the organic bank layer 512b.
To form. The upper opening 512d is provided at a position corresponding to the electrode surface 511a and the lower opening 512c.

As shown in FIG. 15, the upper opening 512d is preferably formed wider than the lower opening 512c and narrower than the electrode surface 511a. Accordingly, the first stacked unit 5 surrounding the lower opening 512c of the inorganic bank layer 512a.
12e is extended to the center side of the electrode 511 with respect to the organic bank layer 512b. By connecting the upper opening 512d and the lower opening 512c in this manner, the inorganic bank layer 512a and the organic bank layer 51 are formed.
An opening 512g penetrating 2b is formed.

Next, in the plasma processing step, the bank portion 51
A region showing ink affinity and a region showing ink repellency are formed on the second surface and the surface 511a of the pixel electrode. This plasma treatment step includes a preliminary heating step, an ink-philic step of processing the upper surface (512f) of the bank portion 512 and the wall surface of the opening 512g, and the electrode surface 511a of the pixel electrode 511 to have an ink-philic property, and an organic substance. The upper surface 512f of the bank layer 512b and the wall surface of the upper opening 512d are roughly classified into an ink repellent step of processing to have ink repellency and a cooling step.

First, in the preheating step, the bank portion 512
Substrate 501 containing is heated to a predetermined temperature. Heating
For example, a heater is attached to a stage on which the substrate 501 is placed, and the heater is used to heat the substrate 501 together with the stage. Specifically, it is preferable to set the preheating temperature of the substrate 501 in the range of 70 to 80 ° C., for example.

Next, in the ink-philic step, plasma treatment (O ₂ plasma treatment) using oxygen as a treatment gas is performed in the atmosphere. By this O ₂ plasma treatment, as shown in FIG. 16, the wall surface of the electrode surface 511a of the pixel electrode 511, the first stacked portion 512e of the inorganic bank layer 512a, and the upper opening 512d of the organic bank layer 512b and the upper surface 512f are ink-philic. It is processed. By this lyophilic treatment, hydroxyl groups are introduced into each of these surfaces to impart lyophilicity. In FIG. 16, the portion subjected to the ink-affinity process is indicated by a dashed line.

Next, in the ink repellent process, a plasma treatment (C) using methane tetrafluoride as a treatment gas in the air atmosphere (C
F ₄ plasma treatment). CF ₄ plasma treatment
As shown in FIG. 17, the wall surface of the upper opening 512d and the upper surface 512f of the organic bank layer are subjected to ink repellent treatment. By this ink repellent treatment, a fluorine group is introduced into each of these surfaces to impart ink repellency. In FIG. 17, the area showing the ink repellency is indicated by a dashed line.

Next, in the cooling step, the substrate 501 heated for the plasma processing is cooled to room temperature or the control temperature of the inkjet step (droplet discharging step). By cooling the substrate 501 after the plasma treatment to room temperature or a predetermined temperature (for example, a control temperature at which the inkjet process is performed), the next hole injection / transport layer forming process can be performed at a constant temperature.

Next, in the light emitting element forming step, the pixel electrode 51 is formed.
A light emitting element is formed by forming a hole injecting / transporting layer and a light emitting layer on 1. The light emitting element forming step includes four steps. That is, a first droplet discharging step of discharging a first composition for forming a hole injecting / transporting layer onto each of the pixel electrodes, and drying the discharged first composition onto the pixel electrodes. Hole injection / hole injection to form a transport layer /
A transport layer forming step, a second droplet discharging step of discharging a second composition for forming a light emitting layer onto the hole injecting / transporting layer, and drying the discharged second composition. And a light emitting layer forming step of forming a light emitting layer on the hole injecting / transporting layer.

First, in the first droplet discharge step, the first composition containing the hole injection / transport layer forming material is discharged onto the electrode surface 511a by the ink jet method (droplet discharge method). It should be noted that, after the first droplet discharge step, it is preferable to carry out in an inert gas atmosphere such as water, a nitrogen atmosphere without oxygen, or an argon atmosphere. (Note that when the hole injection / transport layer is formed only on the pixel electrode, the hole injection / transport layer formed adjacent to the organic bank layer is not formed.)

As shown in FIG. 18, the ink jet head (functional liquid droplet ejection head) H was filled with the first composition containing the hole injecting / transporting layer forming material, and the ink jet head H was obtained.
The discharge nozzle of the ink jet head H and the substrate 5 by facing the electrode surface 511a located in the lower opening 512c.
01 is relatively moved, the first composition droplet 510c whose liquid amount per droplet is controlled is discharged from the discharge nozzle to the electrode surface 5
It discharges on 11a.

As the first composition used here, for example, a composition obtained by dissolving a mixture of a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid (PSS) in a polar solvent is used. it can. Examples of the polar solvent include isopropyl alcohol (IPA), normal butanol, γ-butyrolactone, N-methylpyrrolidone (NMP), 1,3-dimethyl-
Examples thereof include 2-imidazolidinone (DMI) and its derivatives, glycol ethers such as carbitol acetate and butyl carbitol acetate. The material for forming the hole injecting / transporting layer is the light emitting layer 51 of each of R, G, and B.
The same material may be used for 0b and may be changed for each light emitting layer.

As shown in FIG. 18, the ejected first composition droplet 510c spreads over the ink-philic treated electrode surface 511a and the first laminated portion 512e, and the lower and upper openings 5 are formed.
12c and 512d are filled. The amount of the first composition discharged onto the electrode surface 511a is as follows.
It is determined by the size of 512d, the thickness of the hole injection / transport layer to be formed, the concentration of the hole injection / transport layer forming material in the first composition, and the like. Further, the first composition droplets 510c may be discharged not only once but also several times onto the same electrode surface 511a.

Next, in the hole injecting / transporting layer forming step, as shown in FIG.
As shown in FIG. 9, the hole injecting / transporting layer 510 is formed on the electrode surface 511 a by drying and heat treating the discharged first composition to evaporate the polar solvent contained in the first composition.
a is formed. The first composition drops 510 when dried.
The evaporation of the polar solvent contained in c is mainly caused by the inorganic bank layer 5
It occurs near 12a and the organic bank layer 512b, and the hole injection / transport layer forming material is concentrated and deposited along with the evaporation of the polar solvent.

As a result, as shown in FIG. 19, the polar solvent evaporates on the electrode surface 511a due to the drying treatment.
As a result, the flat portion 510a made of the hole injection / transport layer forming material is formed on the electrode surface 511a. Electrode surface 511
Since the evaporation rate of the polar solvent is substantially uniform on a, the material for forming the hole injecting / transporting layer is uniformly concentrated on the electrode surface 511a, thereby forming the flat portion 510a having a uniform thickness.

Next, in the second droplet discharging step, the second layer containing the light emitting layer forming material is formed by the ink jet method (droplet discharging method).
The composition is discharged onto the hole injection / transport layer 510a. In the second droplet discharging step, in order to prevent the redissolving of the hole injecting / transporting layer 510a, the hole injecting / transporting layer 510a is used as a solvent of the second composition used in forming the light emitting layer. An insoluble non-polar solvent is used.

However, on the other hand, the hole injection / transport layer 510
Since a has a low affinity for the nonpolar solvent, even if the second composition containing the nonpolar solvent is ejected onto the hole injecting / transporting layer 510a, the hole injecting / transporting layer 510a and the light emitting layer 510b.
May not be able to be adhered to each other, or the light emitting layer 510b may not be uniformly applied. Therefore,
Hole injection into non-polar solvent and light emitting layer forming material /
In order to increase the affinity of the surface of the transport layer 510a, it is preferable to perform a surface modification step before forming the light emitting layer.

Therefore, first, the surface modification step will be described. In the surface modification step, a surface modification solvent, which is the same solvent as the nonpolar solvent of the first composition used for forming the light emitting layer or a solvent similar thereto, is subjected to an inkjet method (droplet discharging method) or a spin coating method. Alternatively, it is applied by coating on the hole injecting / transporting layer 510a by a dipping method and then drying.

For example, coating by the ink jet method
As shown in FIG. 20, the inkjet head H is filled with the surface-modifying solvent, the ejection nozzle of the inkjet head H is made to face the substrate (that is, the substrate on which the hole injection / transport layer 510a is formed), and the inkjet is performed. This is performed by ejecting the surface modification solvent 510d from the ejection nozzle H onto the hole injection / transport layer 510a while moving the head H and the substrate 501 relative to each other. Then, as shown in FIG. 21, the surface modification solvent 510d is dried.

Next, in the second droplet discharge step, the second layer containing the light emitting layer forming material is formed by the ink jet method (droplet discharge method).
The composition is discharged onto the hole injection / transport layer 510a. Figure 2
2, the inkjet head H is filled with the second composition containing the blue (B) light emitting layer forming material,
The hole injection / transport layer 5 in which the ejection nozzles of the inkjet head H are located in the lower and upper openings 512c and 512d.
10a, and the inkjet head H and the substrate 50.
1 is ejected from the ejection nozzle as a second composition drop 510e in which the amount of liquid per droplet is controlled, and this second composition drop 510e is ejected from the ejection nozzle.
Discharge above 0a.

As the material for forming the light emitting layer, a polyfluorene polymer derivative, a (poly) paraphenylene vinylene derivative, a polyphenylene derivative, polyvinylcarbazole, a polythiophene derivative, a perylene dye, a coumarin dye, a rhodamine dye, or the above It is possible to use by doping the molecule with an organic EL material. For example, rubrene, perylene, 9,10-diphenylanthracene,
It can be used by doping with tetraphenyl butadiene, Nile red, coumarin 6, quinacridone and the like.

As the non-polar solvent, the hole injecting / transporting layer 5 is used.
Those which are insoluble in 10a are preferable, and for example, cyclohexylbenzene, dihydrobenzofuran, trimethylbenzene, tetramethylbenzene and the like can be used. By using such a non-polar solvent for the second composition of the light emitting layer 510b, the second composition can be applied without redissolving the hole injection / transport layer 510a.

As shown in FIG. 22, the ejected second composition 510e spreads over the hole injecting / transporting layer 510a and is filled in the lower and upper openings 512c, 512d.
The second composition 510e may be discharged onto the same hole injecting / transporting layer 510a not only once but also several times. In this case, the amount of the second composition in each time may be the same,
The amount of the second composition may be changed each time.

Next, in the light emitting layer forming step, after the second composition is discharged, a drying process and a heat treatment are performed to form a light emitting layer 510b on the hole injecting / transporting layer 510a. The drying treatment is performed by subjecting the second composition after being discharged to the second treatment.
The non-polar solvent contained in the composition is evaporated to form a blue (B) light emitting layer 510b as shown in FIG.

Continuing, as shown in FIG. 24, blue (B)
Similar to the case of the light emitting layer 510b, the red (R) light emitting layer 510b is formed, and finally the green (G) light emitting layer 510b is formed. The order of forming the light emitting layer 510b is not limited to the order described above, and may be formed in any order. For example, it is possible to determine the order of formation according to the light emitting layer forming material.

Next, in the counter electrode forming step, as shown in FIG. 25, a cathode 503 (counter electrode) is formed on the entire surface of the light emitting layer 510b and the organic bank layer 512b. Note that the cathode 503 may be formed by stacking a plurality of materials. For example, it is preferable to form a material having a small work function on the side close to the light emitting layer, and for example, Ca, Ba or the like can be used, and depending on the material, it is better to form LiF or the like thinly in the lower layer. There is also. Also, the upper side (sealing side)
Is preferable to have a higher work function than the lower side. The cathode (cathode layer) 503 is preferably formed by, for example, a vapor deposition method, a sputtering method, a CVD method, or the like, and particularly preferably formed by a vapor deposition method in terms of preventing damage to the light emitting layer 510b due to heat.

Also, lithium fluoride is used as the light emitting layer 510b.
The blue (B) light emitting layer 510 may be formed only on the top.
It may be formed only on b. In this case, the other red (R)
The light emitting layers and the green (G) light emitting layers 510b and 510b include
The upper cathode layer 503b made of LiF is in contact with it. In addition, a vapor deposition method, a sputtering method, a C
It is preferable to use an Al film, an Ag film, or the like formed by the VD method or the like. Further, a protective layer such as SiO ₂ or SiN may be provided on the cathode 503 to prevent oxidation.

Finally, in the sealing step shown in FIG. 26, a sealing substrate 505 is laminated on the organic EL element 504 in an atmosphere of an inert gas such as nitrogen, argon or helium. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon or helium. When performed in air, the cathode 50
When a defect such as a pinhole is generated in No. 3, water, oxygen or the like may enter the cathode 503 from this defective portion and the cathode 503 may be oxidized, which is not preferable. Finally, by connecting the cathode 503 to the wiring of the flexible substrate and connecting the wiring of the circuit element section 502 to the drive IC, the organic EL device 500 of this embodiment is obtained.

[0157]

As described above, according to the chamber device of the present invention, when the chamber room is filled with the inert gas, the inert gas remains due to exhaust failure or the like when the atmosphere is replaced. When the detachable panel body is locked, the detachable panel body is locked, so that the detachable panel body can be surely prevented from being accidentally opened, and eventually the worker can be prevented from lacking oxygen.

In addition, the electro-optical device and the organic E of the present invention
According to the L apparatus, the work processing can be performed in a good inert gas atmosphere, and the work processing apparatus can be maintained in a safe atmosphere atmosphere. Further, the atmosphere replacement can be performed in a short time. Furthermore, a high-quality and highly reliable organic EL device can be provided at low cost.

[Brief description of drawings]

FIG. 1 is an external perspective view of an electro-optical device according to an embodiment of the invention.

FIG. 2 is an external perspective view of the drawing apparatus according to the embodiment.

FIG. 3 is an external front view of the drawing apparatus according to the embodiment.

FIG. 4 is a side view of the appearance of the drawing apparatus according to the embodiment.

FIG. 5 is an external plan view of the drawing apparatus according to the embodiment.

FIG. 6 is a schematic view of a droplet discharge device of the drawing device according to the embodiment.

FIG. 7 is a system diagram of a chamber device according to an embodiment.

FIG. 8 is a plan view of the chamber device according to the embodiment.

FIG. 9 is a front view of the chamber apparatus according to the embodiment.

FIG. 10 is a right side view of the chamber device according to the embodiment.

FIG. 11 is a left side view of the chamber device according to the embodiment.

FIG. 12 is a rear view of the chamber apparatus according to the embodiment.

13A and 13B are a cross-sectional view (a) and a cross-sectional view (b) of a removable panel unit of the chamber apparatus according to the embodiment.

FIG. 14 is a cross-sectional view of a bank portion forming step (inorganic bank) in the method for manufacturing an organic EL device according to the embodiment.

FIG. 15 is a cross-sectional view of a bank portion forming step (organic bank) in the method of manufacturing an organic EL device according to the embodiment.

FIG. 16 is a cross-sectional view of a plasma treatment step (hydrophilization treatment) in the method for manufacturing an organic EL device according to the embodiment.

FIG. 17 is a cross-sectional view of a plasma treatment step (water repellent treatment) in the method for manufacturing an organic EL device according to the embodiment.

FIG. 18 is a cross-sectional view of the hole injection layer forming step (droplet ejection) in the method for manufacturing an organic EL device according to the embodiment.

FIG. 19 is a cross-sectional view of the hole injection layer forming step (drying) in the method of manufacturing an organic EL device according to the embodiment.

FIG. 20 is a cross-sectional view of a surface modification step (droplet ejection) in the method for manufacturing an organic EL device according to the embodiment.

FIG. 21 is a cross-sectional view of the surface modification step (drying) in the method of manufacturing the organic EL device according to the embodiment.

FIG. 22 is a cross-sectional view of a B light emitting layer forming step (droplet ejection) in the method for manufacturing an organic EL device according to the embodiment.

FIG. 23 is a sectional view of a B light emitting layer forming step (drying) in the method for manufacturing an organic EL device according to the embodiment.

FIG. 24 is a cross-sectional view of an R / G / B light emitting layer forming step in the method for manufacturing an organic EL device according to the embodiment.

FIG. 25 is a cross-sectional view of a counter electrode forming step in the method of manufacturing an organic EL device according to the embodiment.

FIG. 26 is a cross-sectional view of a sealing step in the method of manufacturing an organic EL device according to the embodiment.

FIG. 27 is a block diagram of a control system of the chamber apparatus according to the embodiment.

FIG. 28 is a system diagram of the chamber device according to the second embodiment.

[Explanation of symbols]

1 Electro-Optical Device 2 Drawing Device 3 Chamber Device 4 Functional Droplet Ejecting Head 6 Droplet Ejecting Device 11 Chamber Room 12 Electrical Room 13 Machine Room 17 X-Axis Table 18 Y-Axis Table 20 Head Unit 101 Gas Introducing Unit 102 Exhaust Duct 113 Front Part detachable panel unit 114 Rear detachable panel unit 121 Inner panel unit 122 Outer panel unit 124 Inner panel 126 Outer panel 129 Electromagnetic locking device 130 Gap 131 Air supply port 132 Exhaust port 133 Filter chamber 135 Filter 137 Partition wall 138 Gas flow path 141 Gas damper Unit 142 Gas open / close valve 143 Gas adjustment damper 144 Gas open / close damper 147 Main gas flow path 155 Gas conditioner 156 Cooler 157 Heater 158 Fan 161 Exhaust chamber 162 Exhaust Damper unit 163 exhaust adjustment damper 164 exhaust opening / closing damper 166 exhaust pipe 167 exhaust valve 171 outside air flow passage 172 outside air intake 173 outside air damper unit 174 outside air opening / closing damper 175 outside air adjusting damper 176 outside air opening / closing valve 310 gas purification device 320 gas part 322 gas forward path Valve 324 Gas return valve 330 Air supply part 340 Exhaust part 350 Oxygen measurement part 351 Oxygen concentration meter 360 Pressure detection part 361 First pressure sensor 362 Second pressure sensor 363 Oil bubbler 500 Organic EL device 501 Substrate 504 Organic EL element 510a Positive Hole injection / transport layer 510b Light emitting layer W Substrate

Claims (27)

[Claims] 1. A fresh atmosphere of the inert gas is formed in the chamber room by continuously supplying and exhausting the inert gas introduced from a gas supply source to the chamber room, and the inert gas is also provided. A chamber device capable of introducing outside air into the chamber room in a state in which replenishment of gas is stopped, and a gas supply flow path in which an inert gas is replenished in the chamber room and a gas damper is interposed, An exhaust flow path through which an atmosphere inside is exhausted and an exhaust damper is interposed; an oxygen concentration measuring unit that measures an oxygen concentration in the chamber room; a detachable panel body attached to an opening of the chamber room; An electromagnetic lock mechanism for closing and locking the detachable panel body, and a lock control means for controlling lock / unlock of the electromagnetic lock mechanism. The chamber apparatus, wherein the lock control means unlocks the electromagnetic lock mechanism when the measurement result of the oxygen concentration measuring means exceeds a predetermined value during introduction of outside air. 2. A damper control means for controlling the gas damper, and a panel sensor for detecting attachment / detachment of the removable panel body, wherein the damper control means uses the panel sensor for the removable panel body. The chamber apparatus according to claim 1, wherein the gas damper is controlled to be closed when it is detected that the gas damper has not been mounted. 3. An error occurs when the measurement result of the oxygen concentration measuring means is equal to or less than a predetermined value when the outside air is introduced, or when the panel sensor detects that the detachable panel body is not attached when an inert gas is supplied. The chamber apparatus according to claim 2, further comprising an error notifying unit for notifying. 4. The chamber apparatus according to claim 2, wherein the panel sensor is a proximity sensor. 5. The chamber apparatus according to claim 1, wherein the detachable panel body is composed of an outer panel and an inner panel that face each other with a gap. 6. A panel exhaust passage, one end of which communicates with the air gap of both the inner and outer panels, and the other end of which communicates with the exhaust passage on the upstream side of the exhaust damper; The chamber apparatus according to claim 5, further comprising a panel body exhaust damper provided in the body exhaust passage. 7. A chamber apparatus for forming a fresh atmosphere of inert gas in the chamber room by continuously supplying and exhausting the inert gas introduced from a gas supply source to the chamber room, A gas supply channel for supplying an inert gas to the chamber room and having a gas damper interposed; an exhaust channel for exhausting the atmosphere in the chamber room and having an exhaust damper; and the gas supply channel And wind speed measuring means respectively arranged in the exhaust flow path, and error notifying means for notifying an error when the difference between the measurement results of the two wind speed measuring means exceeds a predetermined value. A characteristic chamber device. 8. A damper control means for controlling the gas damper and the exhaust damper, and a pressure detection means for detecting a pressure in the chamber room are further provided, and the damper control means controls the exhaust damper. ,
8. The chamber apparatus according to claim 7, wherein the exhaust gas flow rate is controlled so that the detection result of the pressure detection unit becomes a predetermined value. 9. An oxygen concentration measuring unit for measuring an oxygen concentration in the chamber room is further provided, wherein the damper control unit controls the gas damper,
9. The chamber apparatus according to claim 8, wherein the replenishment flow rate is controlled so that the detection result of the oxygen concentration measuring means becomes a predetermined value. 10. A chamber apparatus for forming a fresh atmosphere of an inert gas in the chamber room by circulating an inert gas between the chamber room and the gas purifying apparatus, A gas outward path and a gas return path communicating with the chamber room, a gas outward path valve and a gas return path valve respectively provided in the gas outward path and the gas return path, and an upstream side of the gas outward path valve and the gas return path A bypass device that communicates with a downstream side of the valve and has a bypass flow path provided with an opening / closing valve. 11. An air supply passage for supplying compressed air to the chamber room and having an air supply valve interposed therebetween, and an exhaust passage for exhausting an atmosphere from the chamber room and having an exhaust valve interposed therebetween. The chamber apparatus according to claim 10, further comprising: 12. A valve control means for controlling the air supply valve and the exhaust valve is further provided, wherein the valve control means controls the both valves to be closed when an inert gas is introduced, and to supply the compressed air to the both valves. The chamber device according to claim 11, wherein the valve is controlled to be opened. 13. The air supply valve further comprising oxygen concentration measuring means for measuring the oxygen concentration in the chamber room, wherein the valve control means controls the air supply valve when the measurement result of the oxygen concentration measuring means exceeds a predetermined value. 13. The chamber apparatus according to claim 12, wherein the chamber is closed. 14. The chamber apparatus according to claim 13, wherein the oxygen concentration measuring means is provided in a circulation flow path that communicates with the chamber room. 15. A forward valve and a return valve respectively provided in a circulation forward path and a circulation return path of the circulation flow path, and oxygen measuring valve control means for controlling the forward path valve and the return path valve. The oxygen measuring valve control means, when supplying compressed air,
The chamber apparatus according to claim 14, wherein the outward valve and the return valve are controlled to be opened. 16. When introducing an inert gas, the exhaust gas from the gas purification device is exhausted, and a gas exhaust passage having a gas exhaust valve is further provided, wherein the gas exhaust valve is controlled by the valve control means. The chamber device according to any one of claims 12 to 15, wherein the chamber device is controlled. 17. A sub-gas flow path, which directly connects the chamber room and the gas purification device, and further includes a sub-gas flow path provided with a first pressure detecting means for detecting the pressure in the chamber room, wherein the valve control means is provided. 17. The chamber apparatus according to claim 16, wherein the gas exhaust valve is controlled to be opened when the detection result of the first pressure detecting means is equal to or more than a predetermined value when the inert gas is introduced. 18. A second pressure detecting means for detecting the pressure in the chamber room is further provided, and the valve control means, when the compressed air is supplied, the detection result of the second pressure detecting means is equal to or more than a predetermined value. The chamber apparatus according to any one of claims 12 to 17, wherein the air supply valve is controlled to be closed. 19. The oil bubbler according to claim 10, further comprising an oil bubbler for releasing the atmosphere in the chamber room to the outside when the pressure in the chamber room exceeds a predetermined pressure value. Chamber apparatus in any one. 20. The method according to claim 13, further comprising error notifying means for notifying an error when the measured value by the oxygen concentration measuring means is lowered during the supply of compressed air. Chamber apparatus as described. 21. A timer for counting the opening control time of the air supply valve and the exhaust valve is further provided, and the valve control means, when compressed air is supplied, after the predetermined time is counted by the timer, 21. The chamber apparatus according to claim 12, wherein the air supply valve and the exhaust valve are controlled to be closed. 22. The chamber apparatus according to claim 1, further comprising a work processing apparatus that requires the work processing in an atmosphere of an inert gas, which is accommodated in a maintainable manner. 23. An electro-optical device comprising: the chamber device according to claim 1; and the work processing device housed in the chamber device. 24. The electro-optical device according to claim 23, wherein the work processing device is a device for manufacturing an organic EL device. 25. The organic EL device manufacturing apparatus relatively scans a functional liquid droplet ejection head, into which a light emitting functional material is introduced, with respect to a substrate which is a work, and selectively ejects the light emitting functional material. The electro-optical device according to claim 24, further comprising a droplet discharge device that forms an organic EL functional layer in a large number of pixel regions on the substrate. 26. The electro-optical device according to claim 23, 24 or 25, wherein the inert gas is any one of nitrogen, carbon dioxide, helium, neon, argon, krypton, xenon and radon. . 27. An organic EL device manufactured by the electro-optical device according to claim 23.