JP2003272108A - Magnetic head device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the necessity of an earth structure for earthing static electricity. <P>SOLUTION: When both side faces 13a of a head chip 13 and the side face 15a of a side chip, the side face 13b of the head chip 13 and the side face 15b of the side chip, and the bottom surfaces 13c and 15c of the head chip 13 and the side chip 15 and the top surface 16a of a pedestal 16 are abutted on each other to be joined, the head chip 13, the side chip 15 and the pedestal 16 constituting the magnetic head assembly 10 of a magnetic head device 1, they are joined together by using a conductive resin 18. Thus, by joining the head chip, the side chip and the pedestal of the pair of magnetic head assemblies through the conductive resin, a magnetic head main body becomes conductive. Thus, even when an earth wire for earthing static electricity which causes problems on the magnetic head main body is made unnecessary, resistance to the static electricity is maintained. Additionally, the work efficiency of manufacturing the magnetic head device is increased, and manufacturing costs are reduced. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head device and a method of manufacturing the same, and more particularly to a magnetic head device in which constituent members are joined together by a conductive resin and a method of manufacturing the magnetic head device.

[0002]

2. Description of the Related Art Conventionally, as a magnetic head device for recording / reproducing a magnetic recording tape, a so-called multi-channel type magnetic in which a plurality of magnetic head elements as shown in FIGS. 4 (a) and 4 (b) are arranged. Head devices are known. The magnetic head device 50 has a structure in which the magnetic head assembly 100 shown in FIG. 4B is bonded with an adhesive resin. The magnetic head assembly 100 includes a plurality of magnetic head elements 10 on a sliding surface 101 on which a magnetic recording tape slides.
The two magnetic gaps 102a are exposed in parallel,
A signal is recorded / reproduced on / from the magnetic recording tape by the plurality of magnetic gaps 102a. Further, the magnetic head device 100 includes a head chip 103 having a plurality of magnetic head elements 102, a protection chip 104 arranged to face one side surface of the head chip 103,
A pair of side chips 105 arranged so as to sandwich the head chip 103 and the protection chip 104, a pedestal 106 to which these head chips 103 and side chips 105 are attached, and a terminal portion 1 of the plurality of magnetic head elements 102.
Flexible printed wiring board 10 connected to 02b
7 and 7.

Here, the head chip 103, the side chip 105, and the pedestal 106 include side surfaces 103a of the head chip 103 and side surfaces 105a of the side chip, side surfaces 103b of the head chip 103 and side surfaces 105a of the side chips, respectively.
The lower surface 13a of the head chip 103 and the side chip 10
The lower surface 105c of the base plate 5 and the upper surface 106a of the pedestal 106 are brought into contact with each other, and are bonded to each other by an adhesive resin.

Next, the pair of magnetic head assemblies 10 described above.
0 is bonded to each other by an adhesive resin at a bonding surface 51 composed of the head chip 103, the side chip 105 and the pedestal 106. Then, the magnetic head device 50 is completed by forming the central groove 52 and the pair of side grooves 53 formed by the sliding surface processing.

[0005]

However, the conventional magnetic head device 50 is composed of the magnetic head assembly 100 formed of a large number of parts.
Head chip 103 and side chip 10 that make up 00
Since an adhesive resin is used when joining 5 and the pedestal 106, the head chip 103, the side chip 105, and the pedestal 106 are insulated from each other. Therefore, the magnetic head device 50 has a drawback that the magnetic head element 102 is destroyed by static electricity generated during processing of the sliding surface. In order to prevent this, the head chip 10
3, it was necessary to separately provide a grounding structure for grounding static electricity between the side chip 105 and the pedestal 106. However, in the manufacturing process of the magnetic head device, the process of providing the ground structure is complicated and has been a factor of reducing the manufacturing efficiency.

Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to eliminate the need for a grounding structure for grounding static electricity, which causes troubles in the magnetic head main body and grounds it. .

[0007]

In order to achieve the above-mentioned object, a magnetic head device according to the present invention comprises a head chip having a main surface facing a magnetic gap, and a head chip facing one side surface of the head chip. A protection chip arranged to
A magnetic head device comprising: a pair of side chips that sandwich the head chip and the protection chip; and a pair of magnetic head assemblies that include a pedestal that holds the head chip and the side chips. The three-dimensional head chip, side chip, and pedestal are characterized by being joined to each other by a conductive resin.

In order to achieve the above-mentioned object, the method of manufacturing a magnetic head device according to the present invention comprises a step of forming a head chip having a magnetic gap facing one main surface,
A step of forming a pair of side chips that sandwich the head chip; a step of forming a pedestal that holds the head chip and the side chips; and a step of joining the head chip, the side chips and the pedestal to each other with a conductive resin. And a step of joining the pair of magnetic head assemblies to each other with a conductive resin.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A specific example of the present invention is shown in FIG.
This will be described in detail with reference to FIGS. 2 and 3. FIG. 1 shows the structure of a magnetic head assembly of the magnetic head device of the present invention, FIG. 2 shows the appearance of the magnetic head assembly, and FIG. 3 shows an overview of the magnetic head device of the present invention. As shown in FIGS. 1 and 2, a magnetic head assembly 10 of a magnetic head device 1 shown as a specific example of the present invention has a sliding surface 1 on which a magnetic recording tape slides.
On top of the magnetic gaps 12 of the plurality of magnetic head elements 12.
a is arranged in parallel, and signals are recorded / reproduced on / from the magnetic recording tape by the plurality of magnetic head elements 12. Further, the magnetic head assembly 10 includes a head chip 13 having a plurality of magnetic head elements 12.
A pair of protection chips 14 arranged so as to face one side surface of the head chip 13, a pair of side chips 15 arranged so as to sandwich the head chip 13 and the protection chip 14, and these head chips 13 and Side tip 1
A pedestal 16 for mounting the magnetic head 5 and a plurality of magnetic head elements 12
And a flexible printed wiring board 17 connected to the terminal portion 12b.

Here, the head chip 13, the side chip 15, and the pedestal 16 are the side surfaces 13a of the head chip 13, the side surface 15a of the side chip, and the side surface 1 of the head chip 13.
3b and the side surface 15b of the side chip, the lower surface 13c of the head chip 13, the lower surface 15c of the side chip 15 and the pedestal 1
The upper surface 16 a of the metal plate 6 is joined to the upper surface 16 a of the resin 6 by a conductive resin 18. The conductive resin 18 is a polymer material having a high dielectric constant, and for example, polythiazyl or the like can be used for the inorganic polymer, and halogen-containing polyacetylene or the like for the organic polymer.

In the magnetic head device 1, the plurality of magnetic head elements 12 are, for example, a reproducing portion formed by a magnetoresistive effect element or the like (not shown), or an electromagnetic wave formed by a method such as a sputtering method or a photoetching method. Each of them is provided with an induction type recording section and is formed on a ceramic substrate. The head chip 13 is made of, for example, a ceramic material such as alumina-titanium carbide (Al2O3-TiC), and includes a plurality of magnetic head elements 12 arranged in parallel on one side surface.

The protective chip 14 is formed of a ceramic material such as alumina-titanium carbide (Al2O3-TiC), and the magnetic head element 1 of the head chip 13 is formed.
The shape is sufficient to cover the region of 2 except the terminal portion 12b.

The side chips 15 constituting the sliding surface 11 with the magnetic recording tape are made of a ceramic material such as alumina-titanium carbide (Al 2 O 3 -TiC), like the head chips, and the pair of side chips 15 are formed. Has a notch 19 on the surface sandwiching the head chip 13.
Are formed. The notch 19 is formed in the side chip 1
5 is formed on a surface that abuts on the pedestal 16 except for one main surface which is a sliding surface in 5. In other words, the terminal portion 1 of the magnetic head element 12 is attached to the pair of side chips 15.
A notch 19 is formed in a portion sandwiching 2b.

The pedestal 16 is made of a ceramic material such as alumina-titanium carbide (Al2O3-TiC), for example, and has a groove 20 having a width corresponding to the width of the flexible printed wiring board. Therefore, the flexible printed wiring board 17 can be accurately positioned in the groove 20 of the pedestal 16.

The magnetic head device 1 constructed as described above.
To form the head chip 13, the protection chip 14,
The side chip 15 and the pedestal 16 are combined and bonded with the conductive resin 18 as described above to form the magnetic head assembly 10. The pair of magnetic head assemblies 10 are combined into the head chip 13, the side chip 15 and the pedestal 16. The joint surface 2 constituted by (1) and (2) are joined to each other with the conductive resin 18, and the sliding surface 11 is cylindrically processed, and then the central groove 3 and the pair of side grooves 4 formed by the sliding surface processing are formed. Then, the flexible printed wiring board 17 is attached. At this time, since the flexible printed wiring board 17 is arranged along the groove 20 formed in the pedestal 16, it is positioned very accurately. Then, with the flexible printed wiring board 17 positioned, the flexible printed wiring board 17 and the terminal portion 12b of the magnetic head element 12 are connected by wire bonding.

As a result, the magnetic head device 1 maintains the resistance to static electricity without providing a ground structure for removing static electricity that deteriorates the head characteristics. Further, the work efficiency in manufacturing the magnetic head device 1 is improved and the manufacturing cost can be reduced.

It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[0018]

As described above, in the magnetic head device according to the present invention, the head chip having one main surface facing the magnetic gap and the protection provided so as to face one side surface of the head chip. A chip, a pair of side chips that sandwich the head chip and the protection chip, and a pair of magnetic head assemblies that include a pedestal that holds the head chips and the side chips, and a head chip of the pair of magnetic head assemblies, By joining the side chip and the pedestal with a conductive resin, the magnetic head body becomes conductive. Therefore, the resistance to static electricity is maintained even if the ground wire for grounding the static electricity that causes a trouble in the magnetic head body is unnecessary. Further, the work efficiency in manufacturing the magnetic head device 1 is improved and the manufacturing cost can be reduced.

In the method of manufacturing a magnetic head device according to the present invention, a step of preparing a head chip having a magnetic gap facing one main surface and a step of forming a pair of side chips sandwiching the head chip. A step of forming a pedestal for holding the head chip and the side chip, a step of joining the head chip, the side chip and the pedestal to each other with a conductive resin to form the pair of magnetic head assemblies, and a pair of magnetic head assemblies Are joined to each other by a conductive resin.

Therefore, in the magnetic head device manufactured by this manufacturing method, the resistance to static electricity is maintained even if the ground wire for grounding the static electricity, which causes troubles in the magnetic head body, is not required. Further, the work efficiency in manufacturing the magnetic head device is improved and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a magnetic head assembly of a magnetic head device shown as a specific example of the present invention.

FIG. 2 is a perspective view showing an external appearance of a magnetic head assembly of a magnetic head device shown as a specific example of the present invention.

FIG. 3 is a perspective view showing an external appearance of a magnetic head device shown as a specific example of the present invention.

FIG. 4A is a perspective view showing an appearance of a conventional magnetic head device. (B) It is a perspective view showing the appearance of the conventional magnetic head assembly.

[Explanation of symbols]

1 Magnetic head device 2 joining surface 3 central groove 4 gutters 10 Magnetic head assembly 11 Sliding surface 12 Magnetic head element 12a magnetic gap 12b terminal part 13 head chips 14 Protective chip 15 side tip 16 pedestal 17 Flexible printed wiring board 18 Conductive resin 19 Notch 20 groove 21 Magnetic head body 21a Bonding surface 22 Magnetic head body 22a Bonding surface

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kiyohide Sakihama             2 Mitsu, 8-8, Kokuryo-cho, Chofu-shi, Tokyo             Mi Electric Co., Ltd. F term (reference) 5D054 AA01 BB17 BB29 BB33 BB52                       BB54 CA09                 5D093 AA01 AC07 AD16 FA21 HB13                       HB17 HC20

Claims (2)

[Claims] 1. A head chip having a main surface facing a magnetic gap, a protection chip disposed so as to face one side surface of the head chip, and a pair for sandwiching the head chip and the protection chip. A side chip, and a magnetic head device comprising a pair of magnetic head assemblies provided with the head chip and a pedestal holding the side chip, wherein the head chip, the side chip and the pedestal of the pair of magnetic head assemblies are: A magnetic head device, wherein the magnetic head devices are bonded to each other by a conductive resin. 2. A step of forming a head chip having a magnetic gap facing one main surface, a step of forming a pair of side chips sandwiching the head chip, and a pedestal holding the head chip and the side chip. And a step of forming the pair of magnetic head assemblies by joining the head chip, the side chip and the pedestal together with a conductive resin, and a step of joining the pair of magnetic head assemblies together with a conductive resin. A method of manufacturing a magnetic head device, comprising: