JPH07220237A - Thin-film magnetic head and its production - Google Patents

Abstract

PURPOSE:To obtain a thin-film magnetic head which is simple in construction and is improved in reliability. CONSTITUTION:This thin-film magnetic head consists of a thin-film magnetic head element 30 and a protective substrate 40 adhered and fixed to this thin-film magnetic head element 30 so as to cover a magnetic circuit part 32. A drawing out terminal part 43 joined opposite to a connecting terminal part 33 drawn out of the magnetic circuit part 32 in the state of joining and fixing the terminal part to the thin-film magnetic head element 30 is formed on this protective substrate 40. The thin-film magnetic head consists of the thin-film magnetic head element 35 and a dummy substrate 55 holding the contact quantity of the protective substrate 65 joined and fixed to the thin-film magnetic head element 35 so as to cover the magnetic circuit part 37 and a magnetic recording medium. The drawing out terminal part 56 connected opposite to the connecting terminal part 38 drawn out of the magnetic circuit part 36 is formed on this dummy substrate 55.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film magnetic head provided in a magnetic recording / reproducing apparatus such as a tape recorder or a video tape recorder or a data backup apparatus connected to a personal computer, an office computer or the like, and a method of manufacturing the thin film magnetic head.

[0002]

2. Description of the Related Art Generally, a thin film magnetic head has a lower core portion formed on a substrate made of a ceramic material or a ferrite material by a vacuum thin film forming technique or a lithographic technique, and an insulating layer is formed on the upper portion of the lower core portion. Forming a spiral lower conductive coil portion and further forming an upper layer core portion with an insulating layer interposed therebetween, and the upper layer core portion and the lower layer core portion or the conductive coil portion constitute a magnetic circuit portion. . The thin film magnetic head element is constructed by cutting the substrate on which the magnetic circuit portion is formed in this manner into a predetermined shape. As described above, the thin-film magnetic head formed by using the vacuum thin-film forming technology and the lithography technology is capable of highly precise fine dimensioning such as narrow track and narrow gap, and high resolution recording. It has features such as

A conventional thin film magnetic head 1 is shown in FIG.
As shown in FIG. 30, it is composed of a thin film magnetic head element 2, a protective substrate 3, and a flexible wiring substrate 4. As shown in FIG. 26, the thin film magnetic head element 2 forms a magnetic circuit portion 6 on the substrate 5 by utilizing a vacuum thin film forming technique and a lithographic technique, and connects the magnetic circuit portion 6 to an external connection via a lead. The connection terminal portion 7 is formed. Further, as shown in FIG. 27, the protective substrate 3 has a shape sufficient to cover the magnetic circuit portion 6 of the thin film magnetic head element 2 and has the same ceramic material as the substrate 5 constituting the thin film magnetic head element 2 or It is formed of a ferrite material or the like.

As shown in FIG. 28, this protective substrate 3 is
Bonding is performed on the substrate 5 forming the thin film magnetic head element 2 so as to cover the magnetic circuit portion 6 and expose the connection terminal portion 7 by using an adhesive resin, for example, an epoxy resin which is a thermosetting adhesive resin. Fixed. By bonding and fixing the protective substrate 3 to the thin film magnetic head element 2 in this manner, the thin film magnetic head 1 has a large overall thickness dimension, that is, the contact area of the magnetic tape as the magnetic recording medium in the running direction, that is, The hit amount is secured. As shown in FIG. 28, the flexible wiring board 4 is formed in a substantially convex shape in which one end side is configured as a narrow element side connecting portion 4A and the other end side is configured as a wide external connecting portion 4B. ing. Then, on the element-side connection portion 4A of the flexible wiring board 4, connection terminal portions 8A corresponding to the respective connection terminal portions 7 of the thin film magnetic head element 2 are formed. Further, the external connection portion 4B is formed with a connection terminal portion 8B which is connected to the connection terminal portion 8A through a lead and has a large mutual distance for facilitating the connection with the outside. .

In the flexible wiring board 4 thus constructed, as shown in FIG. 29, the connection terminal portions 8A of the element side connection portion 4A are superposed on the connection terminal portions 7 of the corresponding thin film magnetic head element 2. Thus, the thin film magnetic head element 2 is assembled. In this case, the connection terminal portion 7 and the connection terminal portion 8A are electrically connected to each other using a soldering method or an anisotropic conductive film. After that, the thin film magnetic head element 2 and the protective substrate 3 which are joined are shown in FIG. 30 with one side surface 9 in contact with a magnetic tape which is a magnetic recording medium running when the thin film magnetic head element 2 and the protective substrate 3 are incorporated into a magnetic recording and reproducing apparatus. Thus, it is formed in an arc shape. That is, the side surface 9 constitutes a so-called contact surface with the magnetic tape, and is formed in an arc shape with respect to the traveling direction of the traveling magnetic tape, thereby enabling smooth traveling of the magnetic tape.

By the way, a data backup device connected to a recording / reproducing device or a personal computer, an office computer or the like is loaded, for example, a data signal stored in a memory or the like of the computer main body is sucked and recorded, and the recorded data signal is recorded. A data cartridge used to supply a computer to a computer is known. The magnetic tape contained in this data cartridge has a recording area for 40 tracks, for example. On the other hand, the magnetic recording head provided in the data backup device is provided with four pairs of upper and lower gaps, and the magnetic tape loaded in the data backup device scans the upper and lower four tracks of the magnetic tape run bidirectionally.

In such a data cartridge, it is necessary to move the magnetic head with respect to the magnetic tape in the width direction in order to record and reproduce data signals by operating a large number of tracks with a magnetic head having a small number of gaps.
For this reason, the magnetic head is provided with a dummy portion for holding the entire magnetic tape in the width direction in addition to the magnetic gap portion, and has a long length as a whole.

That is, in a magnetic recording / reproducing apparatus in which a magnetic tape having a wide width and a plurality of recording areas formed in the width direction is used and a part of the plurality of recording areas is scanned by the thin film magnetic head 10. For example, the long thin film magnetic head 10 shown in FIGS. 31 to 34 is used. The thin film magnetic head 10 includes a thin film magnetic head element 2 described above, a protective substrate 11, and a pair of dummy substrates 1.
2A, 12B and the flexible wiring board 4 described above. The dummy substrates 12A and 12B are
As shown in FIG. 31, the thin film magnetic head element 2 is made of the same ceramic material or ferrite material as the substrate 5 and has the same width and thickness as the substrate 5. Then, these dummy substrates 12A and 12B are bonded and fixed to both side surfaces of the thin film magnetic head element 2 by using an adhesive so that the dummy substrate 12A and 12B have the same length dimension as the protective substrate 11 as a whole as shown in FIG. To do.

In the thin film magnetic head element 2 to which the dummy substrates 12A and 12B are bonded and fixed, as shown in FIG. 32, the protective substrate 11 covers the magnetic circuit portion 6 of the thin film magnetic head element 2 and the connection terminal portion 7 is formed. It is bonded and fixed using an adhesive so as to be exposed. By bonding and fixing the protective substrate 11 to the thin film magnetic head element 2 as described above, the thin film magnetic head 10 has a large overall thickness dimension as shown in FIG. It is configured as a long thin film magnetic head in which the contact area in the running direction, that is, the contact amount is sufficiently secured, and which contacts the entire area of the magnetic tape in the width direction. Thereafter, in the thin film magnetic head element 2, as shown in FIG. 33, the flexible wiring board 4 superimposes each connection terminal portion 8A of the element side connection portion 4A on each connection terminal portion 7 of the corresponding thin film magnetic head element 2. The thin film magnetic head element 2 is combined so as to be electrically connected together. Further, the bonded thin film magnetic head element 2, the dummy substrates 12A and 12B, and the protective substrate 11 are joined together.
The contact surface 13 with the magnetic tape is formed in an arc shape as shown in FIG.

In the long thin-film magnetic head 10 described above, the thin-film magnetic head element 2 is disposed at the substantially central portion in the length direction, but the recording area on one side in the width direction of the magnetic tape is scanned. In a magnetic recording / reproducing apparatus according to the present invention, for example, a long thin film magnetic head 15 shown in FIGS. 35 to 38 is used.
The thin film magnetic head 15 is composed of a protective substrate 11 having a sufficient length for the thin film magnetic head element 2 and the magnetic tape described above, a dummy substrate 16 and a flexible wiring substrate 17. This dummy substrate 16
Like the dummy substrate 12 described above, it is made of the same ceramic material or ferrite material as the substrate 5 of the thin film magnetic head element 2, and is the same as the substrate 5 of the thin film magnetic head element 2 as shown in FIG. It is formed as a rectangular member having a width dimension and a thickness dimension. Then, the dummy substrate 16 is bonded and fixed to one side surface of the thin film magnetic head element 2 by using an adhesive, so that the dummy substrate 16 has the same length dimension as the protective substrate 11 as a whole as shown in FIG.

As described above, in the thin film magnetic head element 2 to which the dummy substrate 16 is bonded and fixed, as shown in FIG. 36, the protective substrate 11 covers the magnetic circuit portion 6 of the thin film magnetic head element 2 and the connection terminal. The portion 7 is exposed and bonded and fixed using an adhesive. By thus bonding and fixing the protective substrate 11 to the thin-film magnetic head element 2, the thin-film magnetic head 15 has a large overall thickness dimension, and thus the contact area of the magnetic tape as the magnetic recording medium in the running direction, that is, It is configured as a long thin-film magnetic head which has a sufficient contact amount and is in contact with the entire width direction of the magnetic tape. Then, the thin film magnetic head element 2
As shown in FIG. 37, the flexible wiring board 17
Is combined with the thin film magnetic head element 2 so that each connection terminal portion 8A of the element side connection portion 4A is superposed on each corresponding connection terminal portion 7 of the thin film magnetic head element 2 and electrically connected.

As shown in FIG. 36, the flexible wiring board 17 has a connection terminal portion 18A corresponding to each connection terminal portion 7 of the thin film magnetic head element 2 and formed in a narrow element side connection portion 17A. The connection terminal portion 18B is connected to the connection terminal portion 18A via a lead and has a large mutual distance for facilitating the connection with the outside.
A wide external connection portion 17B formed with is formed integrally and continuously in a substantially L-shape. In the thin film magnetic head 15 configured as described above, the contact surface 13 between the joined thin film magnetic head element 2 and the magnetic tape of the dummy substrate 16 and the protective substrate 11 is formed in an arc shape as shown in FIG. To be done.

[0013]

In each of the conventional thin film magnetic heads 1, 10, 15 constructed as described above,
Since the epoxy resin, which is a thermosetting adhesive resin, is used for joining the thin film magnetic head element 2 and the protective substrates 3 and 11 or joining the thin film magnetic head element 2 and the dummy substrates 12 and 16, the first heating Processing is performed. Further, the second heat treatment is performed by electrically connecting the connection terminal portions 7 of the thin-film magnetic head element 2 and the connection terminal portions 8A and 18A of the flexible wiring boards 4 and 17 by soldering or the like. become. As described above, since the conventional thin film magnetic heads 1, 10 and 15 are subjected to the heat treatment twice,
During the second heat treatment, the joint portion between the thin film magnetic head element 2 and the protective substrates 3 and 11 or the joint portion between the thin film magnetic head element 2 and the dummy substrates 12 and 16 which are jointed in advance by the first heat treatment is affected and the machine is affected. There was a problem that the dynamic strength deteriorates.

The conventional thin film magnetic heads 1, 10, 1
5 is configured so that the thin film magnetic head element 2 and the information signal processing unit and the like are electrically connected through the flexible substrates 4 and 17, so that the connection terminal unit 7 and the connection terminal units 8A and 18A are particularly connected. It becomes difficult to sufficiently maintain the mechanical strength of the connection portion of, and there is a problem that the wire is disconnected when a strong pulling force is applied. Further, since the connection terminal portion 7 and the connection terminal portions 8A and 18A are electrically connected by soldering or the like, it is necessary to maintain the distance between the respective terminal portions, which leads to an increase in the size of the thin film magnetic head element 2. There was a problem.

Further, the conventional thin film magnetic heads 1, 10,
In the case of 15, the connection terminal portion 7 and the connection terminal portions 8A and 18A must be accurately aligned and electrically connected, and workability is poor. In particular, the pair of dummy substrates 12A and 12B is connected to the thin film magnetic head element 2 In the thin-film magnetic head 10 bonded and fixed to both side surfaces of the above, it is necessary to support each member in an accurately aligned state, which causes a problem that workability is further deteriorated and it is difficult to maintain accuracy of parts. It was

Therefore, the present invention has been proposed for the purpose of providing a thin film magnetic head which has a simple structure and solves the above-mentioned problems of the conventional thin film magnetic head and has improved reliability. .

[0017]

A thin film magnetic head according to the present invention, which achieves this object, comprises a thin film magnetic head element comprising a substrate on which a magnetic film, a conductive coil portion and the like constituting a magnetic circuit portion are formed. The thin film magnetic head element is provided with a protective substrate that protects the magnetic circuit portion by being bonded and fixed so as to cover the magnetic circuit portion and holds the contact amount of the magnetic recording medium in the traveling direction. The protective substrate is integrally formed with a lead-out terminal portion that is pulled out from the magnetic circuit portion and is joined to the connection terminal portion formed on the substrate in a state of being joined and fixed to the thin-film magnetic head element.

Further, the thin-film magnetic head according to the present invention is constructed by adjoining the thin-film magnetic head element and combining a dummy substrate for holding the contact amount in the direction orthogonal to the running direction of the wide magnetic recording medium. To be done.

Further, the thin film magnetic head according to the present invention is
A dummy portion that holds a contact amount in a direction orthogonal to the traveling direction of a wide magnetic recording medium is integrally formed on one side of a long protective substrate.

Furthermore, in the thin film magnetic head according to the present invention, a part of the dummy portion integrally formed on the protective substrate has:
A thin film magnetic head element mounting portion in which the thin film magnetic head element is mounted is formed by forming a notch.

In the method of manufacturing a thin film magnetic head according to the present invention, a thin film magnetic head element having a magnetic film forming a magnetic circuit portion, a conductive coil portion and the like formed on a substrate is connected to a connection terminal portion of the magnetic circuit portion. The protective substrate is bonded and fixed so as to cover. Next, the contact surface between the thin film magnetic head element and the magnetic recording medium constituted by the protective substrate is cut into an arc shape.

Further, in the method of manufacturing a thin film magnetic head according to the present invention, a dummy substrate which adjoins the thin film magnetic head element and holds a contact amount in a direction orthogonal to the running direction of a wide magnetic recording medium is combined. After bonding and fixing by means of bonding, the contact surface between the substrate of the thin-film magnetic head element and the magnetic recording medium formed by cooperation of the protective substrate and the dummy substrate is cut into an arc shape.

Further, in the method for manufacturing a thin film magnetic head according to the present invention, the contact amount in the direction orthogonal to the running direction of the wide magnetic recording medium is held on one side portion of the protective substrate formed to be long. After forming a dummy part integrally and bonding and fixing this protective substrate to the thin film magnetic head element, the contact surface between the thin film magnetic head element substrate and the magnetic recording medium formed by cooperation of the protective substrate is circular. Cut into an arc.

A thin film magnetic head according to the present invention, which has achieved the above-mentioned object, is a thin film magnetic head element formed by forming a magnetic film forming a magnetic circuit portion, a conductive coil portion and the like on a substrate, and this thin film magnetic head. A long protective substrate that protects the magnetic circuit unit by being bonded and fixed to the element so as to cover the magnetic circuit unit and holds the amount of contact in the traveling direction with the magnetic recording medium; A dummy substrate that holds the contact amount in a direction orthogonal to the traveling direction of the magnetic recording medium wider than the thin film magnetic head element by being joined and fixed together with the thin film magnetic head element. The dummy substrate is formed with a lead-out terminal portion that is drawn out from the magnetic circuit portion of the thin film magnetic head element and is connected to a connection terminal portion formed on the substrate.

Also, in the thin film magnetic head according to the present invention, the connection terminal portion drawn out from the magnetic circuit portion of the thin film magnetic head element and formed on the substrate and the lead terminal portion formed on the dummy substrate are wire-bonded. Connected.

Further, the thin film magnetic head according to the present invention is provided with a plurality of dummy substrates which are attached to the thin film magnetic head element to hold the contact amount in the direction orthogonal to the running direction of the wide magnetic recording medium. ing. At least one dummy substrate disposed adjacent to the thin film magnetic head element of these dummy substrates is formed with a lead terminal portion connected to the connection terminal portion from the magnetic circuit portion of the thin film magnetic head element. Has been done.

Furthermore, in the thin film magnetic head according to the present invention, a part of a dummy substrate formed long so as to hold the contact amount in the direction orthogonal to the running direction of the wide magnetic recording medium, A thin film magnetic head element mounting portion for mounting and joining and fixing the thin film magnetic head element is formed by notching, and a connection terminal portion from the magnetic circuit portion of the thin film magnetic head element is located near the thin film magnetic head element mounting portion. It is configured by forming a lead-out terminal portion connected to.

In the method of manufacturing a thin film magnetic head according to the present invention, a thin film magnetic head element having a magnetic film forming a magnetic circuit portion, a conductive coil portion and the like formed on a substrate is connected to a connection terminal portion of the magnetic circuit portion. A dummy substrate, which has a terminal portion that is joined to the magnetic recording medium and holds a contact amount in a direction orthogonal to the traveling direction of the magnetic recording medium, is fixed together. Next, a protective substrate that holds the contact amount of the magnetic recording medium in the traveling direction is joined to the thin film magnetic head element and the dummy substrate so as to cover the connection terminal portion of the magnetic circuit portion. The contact surface with the magnetic recording medium constituted by the thin film magnetic head element, the dummy substrate and the protective substrate is cut into an arc shape.

[0029]

According to the thin film magnetic head of the present invention having the above construction, the lead-out terminal portion of the protective substrate bonded and fixed to the thin film magnetic head element so as to cover the magnetic circuit portion is connected to the magnetic circuit portion. By being directly joined to the terminal portion, a lead-out portion is formed which is electrically connected to the control portion without a flexible wiring board for connection.
Further, the thin film magnetic head element and the protective substrate have a large thickness dimension in the traveling direction with respect to the magnetic recording medium, so that the contact amount with the magnetic recording medium is secured, and the magnetic recording medium smoothly runs.

The dummy substrate bonded and fixed adjacent to the thin-film magnetic head element is the thin-film magnetic head element,
With the protective substrate bonded and fixed so as to cover the magnetic circuit portion of the thin film magnetic head element, it is possible to make sufficient contact with the wide magnetic recording medium over the entire area in the direction orthogonal to its running direction. The contact surface is secured, the magnetic recording medium runs smoothly, and damage is prevented.

Further, the dummy portion integrally formed in the longitudinal direction on one side of the long protective substrate bonded and fixed to the thin film magnetic head element so as to cover the magnetic circuit portion is a thin film magnetic head element. On the other hand, a sufficient contact surface that contacts the entire area of the wide magnetic recording medium in the direction orthogonal to the traveling direction is ensured to smoothly travel the magnetic recording medium and prevent damage from occurring. Further, by mounting the thin film magnetic head element in the thin film magnetic head element mounting portion formed by cutting out a part of the dummy portion and bonding and fixing the thin film magnetic head element, a specific recording area formed in the width direction of the wide magnetic recording medium. A thin film magnetic head in which the thin film magnetic head element is positioned correspondingly to is formed.

According to the thin film magnetic head manufacturing method of the present invention, the thin film magnetic head element and the protective substrate are formed after the protective substrate is bonded and fixed to the thin film magnetic head element so as to cover the magnetic circuit portion. Since the contact surface with the magnetic recording medium is formed in an arc shape, it is easy to electrically connect with the control unit, and the contact amount with the magnetic recording medium is sufficiently secured to allow the magnetic recording medium to run smoothly. A magnetic head is obtained.

According to the thin-film magnetic head of the present invention having the above-mentioned structure, the protective substrate covers the magnetic circuit portion to protect it, and cooperates with the thin-film magnetic head element in the traveling direction of the magnetic recording medium. The thickness of the magnetic recording medium is made large so that the contact amount with the magnetic recording medium is secured and the magnetic recording medium runs smoothly. The dummy substrate, which is bonded and fixed to a long protective substrate adjacent to the thin-film magnetic head element, collaborates with the protective substrate to increase the thickness dimension of the magnetic recording medium in the running direction, thereby hitting the magnetic recording medium. The amount of the magnetic recording medium is ensured to smoothly travel, and the amount of contact in the width direction orthogonal to the traveling direction of the magnetic recording medium is secured to prevent damage to the magnetic recording medium. Further, the dummy substrate is directly connected to the connection terminal portion of the magnetic circuit portion of the thin-film magnetic head element by electrically connecting the lead-out terminal portion to the electrical connection with the control portion without a flexible wiring board for connection. Constitutes a drawer part for performing.

By providing the lead-out terminal portion connected to the connection terminal portion of the magnetic circuit portion of the thin-film magnetic head element on at least one dummy substrate of the plurality of dummy substrates arranged adjacent to the thin-film magnetic head element. A thin-film magnetic head element having common specifications is arranged corresponding to a specific recording area formed in the width direction of the magnetic recording medium, and a thin-film magnetic head having different specifications of the lead-out terminal portion is easily configured. In addition, a thin film magnetic head element of common specifications is configured by mounting the thin film magnetic head element in a thin film magnetic head loading portion formed by cutting out a part of a long dummy substrate and bonding and fixing it. A thin-film magnetic head arranged corresponding to a specific recording area formed in the width direction of is obtained.

According to the thin-film magnetic head manufacturing method of the present invention, the thin-film magnetic head element and the dummy substrate are combined to connect the connection terminal portion and the lead-out terminal portion from the magnetic circuit portion formed in the thin-film magnetic head element. After that, a long protective substrate is bonded and fixed to the thin film magnetic head element and the dummy substrate so as to cover the magnetic circuit portion, and then the substrate of the thin film magnetic head element, the dummy substrate and the protective substrate are used together. Since the contact surface with the magnetic recording medium configured by working is cut into an arc shape, a thin film magnetic head element of common specifications is arranged corresponding to a specific recording area formed in the width direction of the magnetic recording medium. In addition, a thin film magnetic head can be obtained which is easy to electrically connect with the control unit and has a sufficient contact amount with the magnetic recording medium to smoothly travel the magnetic recording medium.

[0036]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described below in detail with reference to the drawings. As a first embodiment of the thin film magnetic head according to the present invention, the thin film magnetic head 20 shown in FIGS. 1 to 3 is composed of a thin film magnetic head element 30 and a protective substrate 40. As shown in FIG. 1, the thin film magnetic head element 30 includes a lower layer core portion formed on a substrate 31 made of a ceramic material, a ferrite material, or the like by a vacuum thin film forming technique or a lithographic technique, as in the conventional thin film magnetic head element 2 described above. A lower conductive coil portion having a spiral shape is formed on an upper surface portion of the lower core through an insulating layer, and an upper core portion is formed through an insulating layer, and the upper core portion and the lower core portion are formed. Alternatively, the magnetic circuit section 32 is configured along one side of the substrate 31 with the conductive coil section. In addition, the substrate 31 is located on the other side opposite to the one side where the magnetic circuit section 32 is formed and has a plurality of connections for connecting to the control section from the magnetic circuit section 32 through the lead section. The terminal portion 33 is integrally formed so as to be drawn out in a state of being juxtaposed in the width direction. In this way, after the magnetic circuit portion 32 and the connection terminal portion 33 are formed on the substrate 31, the substrate 31
The thin-film magnetic head element 30 is constructed by cutting.

As shown in FIG. 1, the protective substrate 40 is made of the same ceramic material or ferrite material as the substrate 31 constituting the thin film magnetic head element 30, and is formed in the width direction of the thin film magnetic head element 30. It is formed as a horizontally elongated rectangular flat block body with large dimensions.
A thin film magnetic head element mounting portion 41 to which the thin film magnetic head element 30 is bonded and fixed is integrally formed on one side of the protective substrate 40 so as to be described later. The thin film magnetic head element mounting portion 41 has a width dimension substantially the same as the width dimension of the substrate 31 of the thin film magnetic head element 30, and is located at the base end side thereof, as shown in FIG.
A plurality of element-side connection terminal portions 42 are formed. These element-side connection terminal portions 42 correspond to the thin-film magnetic head element 3 described above.
The number and the width interval are set so as to correspond to the connection terminal portions 33 formed on the substrate 31 of 0 on a one-to-one basis, and the connection terminals 33 are formed on the protective substrate 40.

Further, on the protective substrate 40, a plurality of external connection terminal portions 4 are provided along the other side portion which is enlarged in the width direction.
3 is formed. The external connection terminal portion 43 and the element-side connection terminal portion 42 serve as the thin-film magnetic head element 3.
It is configured as a lead-out terminal portion for pulling out the connection terminal portion 33 of 0 to the outside. And these external connection terminal parts 4
3, the respective intervals are sufficiently maintained in the width direction to facilitate the connection to the outside such as the control section, and the element side connection terminal section 42 via the lead section.
And 1: 1 respectively.

As shown in FIG. 2, the thin film magnetic head element 30 is bonded to the protective substrate 40 having the above-described structure so that the magnetic circuit section 32 side faces the thin film magnetic head element mounting section 41. After that, it is fixed using an adhesive resin, for example, an epoxy resin which is a thermosetting adhesive resin. By bonding and fixing the thin film magnetic head element 30 and the thin film magnetic head element mounting portion 41 of the protective substrate 40 in this manner, the thin film magnetic head 20 has a large thickness in the thin film magnetic head element 30 portion. Also,
In the thin film magnetic head element 30, the magnetic circuit section 32 of the thin film magnetic head element 30 is bonded and fixed to the protective substrate 40.
The connection terminal portion 33 on the thin-film magnetic head element 30 side and the element-side connection terminal portion 42 on the protective substrate 40 side are joined one-to-one and electrically connected to each other. To be done.

As described above, in the thin film magnetic head 20, the thin film magnetic head element 30 and the protective substrate 40 are bonded and fixed to each other so that the thickness of the thin film magnetic head element 30 portion is increased. One side surface, that is, the contact surface 2 with which a magnetic tape, which is a magnetic recording medium, that runs when 20 is incorporated into a magnetic recording / reproducing apparatus is in contact.
A contact area of 1 in the traveling direction is secured. Further, the thin film magnetic head 20 includes the thin film magnetic head element 30 and the thin film magnetic head element mounting portion 4 of the protective substrate 40 which are fixedly bonded to each other.
Contact surface 2 with the magnetic tape, which is constructed in cooperation with 1
1 is cut into an arc shape as shown in FIG. As described above, the thin-film magnetic head 20 enables the magnetic tape to smoothly run by forming the contact surface 21 with the magnetic tape in an arc shape.

As described above, the thin-film magnetic head 20 shown as the first embodiment does not require a flexible wiring board for electrically connecting to a control unit or the like, unlike the conventional thin-film magnetic head. As a result, the number of parts and the number of assembling steps can be reduced. Further, the connection state of the connection terminal portion 33 of the thin film magnetic head element 30 and the element side connection terminal portion 42 of the protective substrate 40 is such that the thin film magnetic head element 30 and the thin film magnetic head element mounting portion 41 are made of a thermosetting adhesive resin. Since it is held by being firmly joined and fixed, it does not break even when a tensile force is applied. Furthermore, since the heating step is also a single step of bonding and fixing the thin film magnetic head element 30 and the protective substrate 40 using the thermosetting adhesive resin, the thermal influence on the thin film magnetic head element 30 is reduced.

As a second embodiment of the thin film magnetic head according to the present invention, the thin film magnetic head 22 shown in FIGS.
Is a magnetic tape that is provided in a recording / reproducing apparatus or a data backup apparatus connected to a personal computer, an office computer, or the like, is accommodated in a data cartridge to be loaded, and has a plurality of recording areas formed in the width direction. After scanning a part of the plurality of recording areas, specifically, a recording area of 4 tracks in the width direction of the magnetic tape, the recording area is moved to the recording area of the next 4 tracks, and the moving operation is sequentially repeated. Is a thin-film magnetic head configured to scan all tracks of a wide magnetic tape to record / reproduce data signals. The thin-film magnetic head 22 includes a thin-film magnetic head element 30 used in the thin-film magnetic head 20 of the first embodiment described above,
The protective substrate 40 and the pair of dummy substrates 51 and 52 are included. Of course, this embodiment thin film magnetic head 2
When the magnetic tape 2 is provided in the data backup device and the magnetic tape is run, the thin film magnetic head element 30 is positioned corresponding to the specific recording area of the magnetic tape, and the dummy substrates 51 and 52 are the other areas of the magnetic tape. Rub against.

As shown in FIG. 4, the dummy substrates 51 and 52 are made of the same ceramic material or ferrite material as the substrate 31 of the thin film magnetic head element 30, and have a thickness dimension in which the substrate 31 and the protective substrate 40 are joined. They are formed with the same thickness dimension. In addition, these dummy substrates 51,
52 has a width dimension substantially equal to the protrusion dimension of the thin film magnetic head element mounting portion 41 formed on the protective substrate 40,
Further, the length dimension is formed to be almost equal to the distance from one side portion of the thin film magnetic head element mounting portion 41 to the side end portion of the protective substrate 40.

The dummy substrate 51 having the above structure,
As shown in FIG. 5, 52 is provided on one side of the protective substrate 40.
After the thin-film magnetic head element mounting portion 41 is arranged so as to sandwich the thin-film magnetic head element mounting portion 41, it is joined and fixed using an adhesive resin, for example, an epoxy resin which is a thermosetting adhesive resin. After that, as shown in FIG. 5, the thin film magnetic head element 30 is joined to the thin film magnetic head element mounting portion 41 of the protective substrate 40 so that the magnetic circuit portion 32 side thereof faces each other.
It is fixed using an adhesive resin, for example, an epoxy resin which is a thermosetting adhesive resin. The thin film magnetic head 22 according to the second embodiment constructed by joining and fixing the thin film magnetic head element 30 and the thin film magnetic head element mounting portion 41 of the protective substrate 40 in this way is the magnetic circuit portion 32 of the thin film magnetic head element 30.
Are protected by being covered with the protective substrate 40, and the connection terminal portions 33 on the thin film magnetic head element 30 side and the element side connection terminal portions 42 on the protective substrate 40 side are bonded to each other in a one-to-one relationship. It is electrically connected.

The above-mentioned thin film magnetic head element 30,
The bonding process of the protective substrate 40 and the dummy substrates 51 and 52 is
For convenience of explanation, it is explained that it is performed in a separate process,
Actually, the same joining process is performed. In this case, the thin-film magnetic head element 30 and the dummy substrate 51 are bonded together with the bonding surface of the protective substrate 40 acting as a bonding reference surface, so that highly accurate assembly is performed. It is needless to say that the same applies to each of the following embodiments.

As described above, the thin film magnetic head 22 includes the thin film magnetic head element 30, the protective substrate 30, and the dummy substrate 5.
When the thin film magnetic head 22 is incorporated in a magnetic recording / reproducing apparatus, one side surface, that is, a contact surface, with which a wide magnetic tape, which is a magnetic recording medium running, comes into contact with each other by combining and fixing each The thickness dimension of 23 is increased to secure the contact area in the traveling direction. Further, the thin film magnetic head 22 comes into contact with the magnetic tape formed by the thin film magnetic head element 30 bonded and fixed to each other, the thin film magnetic head element mounting portion 41 of the protective substrate 40, and the dummy substrates 51 and 52 working together. Face 23
However, as shown in FIG. 6, it is cut into an arc shape. As described above, the thin-film magnetic head 22 enables the magnetic tape to smoothly run by forming the contact surface 23 in an arc shape.

As described above, in the thin film magnetic head 22 which is constructed as a whole length so as to accommodate the wide magnetic tape shown in the second embodiment and which scans a specific recording area of the magnetic tape, By eliminating the need for a flexible wiring board for electrically connecting to a control unit or the like as in the conventional thin film magnetic head, the number of parts and the number of assembling steps can be reduced. Further, the connection state of the connection terminal portion 33 of the thin film magnetic head element 30 and the element side connection terminal portion 42 of the protective substrate 40 is such that the thin film magnetic head element 30 and the thin film magnetic head element mounting portion 41 are made of a thermosetting adhesive resin. Since it is held by being firmly joined and fixed, it does not break even when a tensile force is applied. Further, since the dummy substrates 51 and 52 ensure a contact surface with a sufficient contact amount even in the direction orthogonal to the running direction of the magnetic tape, it can be used for a wide magnetic tape and a narrow magnetic tape. Therefore, the thin film magnetic head element 30 having the common specifications can be used.

As a third embodiment of the thin film magnetic head according to the present invention, the thin film magnetic head 24 shown in FIGS.
Like the thin film magnetic head 22 of the second embodiment described above, is provided in a data backup device connected to a recording / reproducing device, a personal computer, an office computer, etc. A part of the plurality of recording areas of the magnetic tape in which the plurality of recording areas are formed in the width direction, specifically, the recording area of four tracks in the width direction of the magnetic tape is scanned, and then the next four tracks are recorded. The thin-film magnetic head is moved to a recording area and is sequentially repeated to scan all tracks of a wide magnetic tape to record / reproduce data signals. The thin-film magnetic head 24 is composed of the above-mentioned thin-film magnetic head element 30 and the above-mentioned protective substrate 45. In the configuration in which the dummy parts 49A and 49B are integrally formed on the protective substrate 45, the second thin-film magnetic head 24 is provided. There is a difference from the thin film magnetic head 22 of the embodiment.

That is, the protective substrate 45 is formed of the same ceramic material or ferrite material as that of the substrate 31 of the thin film magnetic head element 30, and as shown in FIG. 7, a pair of dummy portions 49A are formed along one side edge portion. , 49B are erected integrally. The dummy portions 49A and 49B are formed such that the height dimension of protrusion from the protective substrate 45 is substantially equal to the thickness dimension of the thin film magnetic head element 30. Further, in the protective substrate 45, a space portion formed between the opposing side surfaces of the dummy portions 49A and 49B and substantially in the center in the longitudinal direction is formed as a thin film magnetic head element mounting portion 46. That is, this thin film magnetic head element mounting portion 46
7 has a width dimension substantially the same as the width dimension of the substrate 31 of the thin film magnetic head element 30, and is located at the base end side thereof.
As shown in, a plurality of element-side connection terminal portions 47 are formed. These element-side connection terminal portions 47 are connection terminal portions 33 formed on the substrate 31 of the thin film magnetic head element 30.
Are formed on the protective substrate 45 with the number and width interval set so as to correspond to each other one by one. These element-side connection terminal portions 47 are sufficiently spaced from each other along the other side of the protective substrate 45 that is enlarged in the width direction so as to facilitate connection with the outside such as a control unit. The plurality of formed external connection terminal portions 48 and the lead portions are connected one-to-one.

The thin film magnetic head element 30 is loaded on the thin film magnetic head element mounting portion 46 and bonded and fixed to the protective substrate 45 constructed as described above. That is, the thin-film magnetic head element 30 is bonded to the thin-film magnetic head element mounting portion 46 so that the magnetic circuit portion 32 sides thereof face each other, and then an adhesive resin, for example, an epoxy resin which is a thermosetting adhesive resin is used. Fixed using. In this way, the thin film magnetic head element 30 is mounted on the thin film magnetic head element mounting portion 46 formed between the dummy portions 49A and 49B and bonded and fixed to the protective substrate 45 in the third embodiment. The magnetic head 24 is protected by covering the magnetic circuit portion 32 of the thin film magnetic head element 30 with the protective substrate 45, and the connection terminal portion 33 on the thin film magnetic head element 30 side and the element side connection on the protective substrate 45 side are connected. The terminal portions 47 are joined to each other in a one-to-one manner and electrically connected to each other.

As described above, the thin-film magnetic head 24 is magnetically coupled to the thin-film magnetic head element 30 by bonding and fixing the thin-film magnetic head element 30 and the protective substrate 45 integrally formed with the dummy portions 49A and 49B. When the recording medium is installed in a recording / reproducing apparatus, the thickness of one side surface, that is, the contact surface 25, with which a wide magnetic tape, which is a magnetic recording medium that travels, comes into contact with the contact surface in the traveling direction is secured. The thin-film magnetic head 24 includes a thin-film magnetic head element 30 and a thin-film magnetic head element mounting portion 46 of the protective substrate 45 and a dummy portion 49A, which are fixedly bonded to each other.
The contact surface 25 with the magnetic tape formed in cooperation with 49B is cut into an arc shape as shown in FIG. In this way, the thin-film magnetic head 24 allows the magnetic tape to smoothly run by forming the contact surface 25 in an arc shape.

As described above, in the thin film magnetic head 24 which is constructed as a whole length so as to accommodate the wide magnetic tape shown in the third embodiment and which scans a specific recording area of the magnetic tape, By eliminating the need for a flexible wiring board for electrically connecting to a control unit or the like as in the conventional thin film magnetic head, the number of parts and the number of assembling steps can be reduced. Further, the connection state between the connection terminal portion 33 of the thin film magnetic head element 30 and the element side connection terminal portion 47 of the protective substrate 45 is such that the thin film magnetic head element 30 and the thin film magnetic head element mounting portion 46 are made of a thermosetting adhesive resin. Since it is held by being firmly joined and fixed, it does not break even when a tensile force is applied. Further, the dummy portions 49A and 49B ensure a contact surface with a sufficient contact amount even in the direction orthogonal to the running direction of the magnetic tape, so that it can be used for a wide magnetic tape and a narrow magnetic tape. Therefore, the thin film magnetic head element 30 having the common specifications can be used. Furthermore, as compared with the thin film magnetic head 22 of the second embodiment described above, the heating process also includes the thin film magnetic head element 30 and the protective substrate 4.
This is a one-time process of joining and fixing 5 and 5 using a thermosetting adhesive resin, so that the thermal effect on the thin film magnetic head element 30 is reduced.

As a fourth embodiment of the thin film magnetic head according to the present invention, the thin film magnetic head 2 shown in FIGS.
6 is the thin film magnetic head 2 of the second and third embodiments described above.
Similar to Nos. 2 and 24, the plurality of magnetic tapes provided in a recording / reproducing apparatus or a video tape recorder and housed in a video tape cartridge to be loaded and having a plurality of recording areas in the width direction are formed. The thin film magnetic head is configured to have an entire length for scanning a part of the recording area, specifically, a recording area formed on a lateral side portion of the magnetic tape.

The thin-film magnetic head 26 comprises the above-mentioned thin-film magnetic head element 30 and the above-mentioned protective substrate 60 having a length dimension almost equal to the width dimension of a wide magnetic tape. The configuration in which the dummy portion 64 is integrally formed is similar to that of the thin film magnetic head 24 of the third embodiment, but the number of the dummy portion 64 is one, and the thin film magnetic head element mounting portion 61 is the protective substrate 60. There is a difference in the configuration formed on one side in the longitudinal direction.

That is, the protective substrate 60 is made of the same ceramic material or ferrite material as that of the substrate 31 of the thin film magnetic head element 30, and as shown in FIG. A block-shaped dummy portion 64 is formed so as to be integrally formed so that its protruding height is substantially equal to the thickness of the thin film magnetic head element 30. The dummy portion 64 is formed to be shorter than the length dimension of the protective substrate 60 in the longitudinal direction by the width dimension of the thin film magnetic head element 30, and the protruding height dimension from the protective substrate 60 is set to the thin film magnetic head element 30. Is formed to have a thickness substantially equal to that of the. Therefore, the protective substrate 60 is provided with a notched space portion located between one side end portion thereof and the side surface portion of the dummy portion 64 and having a width substantially equal to the width dimension of the thin film magnetic head element 30, and this space portion is formed. The thin film magnetic head element mounting portion 61 is configured.

A thin film magnetic head element mounting portion 61 having a width dimension substantially the same as the width dimension of the substrate 31 of the thin film magnetic head element 30 is located at the base end side thereof and, as shown in FIG. The element-side connection terminal portion 62 is formed.
These element-side connection terminal portions 62 are formed on the protective substrate 60 with the number and width interval set so as to correspond to the connection terminal portions 33 formed on the substrate 31 of the thin film magnetic head element 30 in a one-to-one manner. Has been done. These element-side connection terminal portions 62 can be easily connected to the outside such as a control portion along the other side portion of the protective substrate 60 that is enlarged in the width direction by integrally forming the dummy portion 64. 1 through each of the plurality of external connection terminal portions 63 and the lead portion which are formed so that their respective intervals are sufficiently held so as to fit.
They are connected in pairs.

The thin film magnetic head element 30 is loaded on the thin film magnetic head element mounting portion 61 and bonded and fixed to the protective substrate 60 constructed as described above. That is, the thin-film magnetic head element 30 is bonded to the thin-film magnetic head element mounting portion 61 so that the magnetic circuit portion 32 sides thereof face each other, and then an adhesive resin, for example, an epoxy resin which is a thermosetting adhesive resin is used. Fixed using. In this way, the thin film magnetic head element 30 is mounted on the thin film magnetic head element mounting portion 61.
The thin film magnetic head 26 according to the fourth embodiment, which is configured by being bonded to and fixed to the protective substrate 60, is mounted on the thin film magnetic head element 30.
Is protected by being covered by the thin film magnetic head element mounting portion 61 of the protective substrate 60, and the connection terminal portion 33 on the thin film magnetic head element 30 side and the element side connection terminal portion on the protective substrate 60 side are protected. 62 and 1
They are joined by pair 1 and are electrically connected to each other.

As described above, in the thin film magnetic head 26, the thin film magnetic head element 30 and the protective substrate 60 integrally formed with the dummy portion 64 are combined and fixed to each other, whereby the thin film magnetic head 26 is magnetically recorded and reproduced. The thickness dimension of one side surface, that is, the contact surface 27, with which a wide magnetic tape, which is a magnetic recording medium that travels when incorporated in the apparatus, comes into contact with the contact surface in the traveling direction is ensured. Further, the thin-film magnetic head 26 has the contact surface 27 with the magnetic tape formed by the thin-film magnetic head element 30 bonded and fixed to each other and the thin-film magnetic head element mounting portion 61 and the dummy portion 64 of the protective substrate 60 working together. Is cut into an arc shape as shown in FIG. In this way, the thin-film magnetic head 26 enables the magnetic tape to smoothly run by forming the contact surface 27 in an arc shape.

As described above, in the thin film magnetic head 26 which is constructed as a whole length so as to accommodate the wide magnetic tape shown in the fourth embodiment and which scans a specific recording area of the magnetic tape, By eliminating the need for a flexible wiring board for electrically connecting to a control unit or the like as in the conventional thin film magnetic head, the number of parts and the number of assembling steps can be reduced. Further, the connection state between the connection terminal portion 33 of the thin film magnetic head element 30 and the element side connection terminal portion 62 of the protective substrate 60 is such that the thin film magnetic head element 30 and the thin film magnetic head element mounting portion 61 are made of a thermosetting adhesive resin. Since it is held by being firmly joined and fixed, it does not break even when a tensile force is applied. Further, since the dummy portion 64 secures a contact surface with a sufficient contact amount also in the direction orthogonal to the running direction of the magnetic tape, the magnetic tape having a wide width and the magnetic tape having a narrow width are Thin film magnetic head element 3 with common specifications
Correspondence by 0 becomes possible. Furthermore, since the heating step is also a single step of joining and fixing the thin film magnetic head element 30 and the protective substrate 60 using the thermosetting adhesive resin, the thermal influence on the thin film magnetic head element 30 is reduced.

As a fifth embodiment of the thin film magnetic head according to the present invention, the thin film magnetic head 7 shown in FIGS.
0 is the thin film magnetic head 2 of the second to fourth embodiments described above.
Similar to 2, 24 and 26, a wide range of a plurality of recordings are made in a data cartridge which is provided in a recording / reproducing apparatus or a data backup apparatus connected to a personal computer, an office computer or the like and is loaded in a data cartridge. A part of the plurality of recording areas of the magnetic tape in which the area is formed, specifically, a recording area of 4 tracks in the width direction of the magnetic tape is scanned, and then moved to the recording area of the next 4 tracks, and so on. By repeating this moving operation, the thin film magnetic head is configured to be long in length so that all tracks of a wide magnetic tape are scanned to record and reproduce data signals. Further, the thin film magnetic head 70 of the fifth embodiment is characterized in that the connection with the terminal portion of the thin film magnetic head element is made by wire bonding.

The thin-film magnetic head 70 is composed of the thin-film magnetic head element 35, the above-mentioned protective substrate 65, and a pair of dummy substrates 55A and 55B bonded to both side surfaces of the thin-film magnetic head element 35, respectively. . As shown in FIG. 13, the thin film magnetic head element 35 has a lower core portion formed on a substrate 36 made of a ceramic material, a ferrite material or the like by a vacuum thin film forming technique or a lithographic technique, like the thin film magnetic head element 30 described above. Then, a spiral lower conductive coil portion is formed on an upper surface portion of the lower layer core via an insulating layer and an upper layer core portion is formed via an insulating layer, and the upper layer core portion and the lower layer core portion or the conductive layer are formed. A magnetic circuit part 37 is configured along one side of the substrate 36 by the coil part. In addition, the substrate 36 is positioned on both side surfaces orthogonal to the one side portion on which the magnetic circuit portion 37 is formed, and is provided with a plurality of connecting portions from the magnetic circuit portion 37 via the lead portion to the control portion. The connection terminal portions 38 are integrally formed in a state of being juxtaposed in the width direction.
In this way, the thin film magnetic head element 35 is formed by forming the magnetic circuit portion 37 and the connection terminal portion 38 on the substrate 36 and then cutting the substrate 36.

The protective substrate 65 is the thin film magnetic head element 35.
Formed of the same ceramic material or ferrite material as that of the substrate 36 of FIG.
Is formed in a block shape having a width dimension sufficient to cover the magnetic circuit section 36. In addition, the dummy substrates 55A, 5
5B is also made of the same ceramic material or ferrite material as the substrate 36 of the thin film magnetic head element 35, and has the same length as the protective substrate 65 in a state of being bonded to both side surface portions of the thin film magnetic head element 35 as described later. In addition to having the constituent length dimension, it has substantially the same width dimension as the substrate 36 of the thin film magnetic head element 35. As shown in FIG. 14, element side connection terminal portions 56 are formed on these dummy substrates 55A and 55B at the side end portions facing the thin film magnetic head element 35. These element-side connection terminal portions 56 are formed with sufficient spacing therebetween so as to facilitate connection with the outside such as a control portion along one end side of the dummy substrates 55A and 55B in the longitudinal direction. The external connection terminal portions 57 and the lead portions are connected to each other in a one-to-one relationship.

In the thin film magnetic head element 35 and the dummy substrates 55A and 55B configured as described above, the dummy substrates 55A and 55B are arranged on both side surfaces of the thin film magnetic head element 35, respectively, as shown in FIG. After that, the opposing side surfaces are joined and fixed using a thermosetting adhesive resin. Thereafter, the protective substrate 65 is bonded onto the thin film magnetic head element 35 and the dummy substrates 55A and 55B so as to cover the magnetic circuit portion 37 of the thin film magnetic head element 35, and the opposing bonding surfaces are thermosetting. It is fixed using an adhesive resin. In the thin-film magnetic head element 35 thus protected by covering the magnetic circuit section 36 with the protective substrate 65, the connection terminal portion 38 and the element-side connection terminal portions 56 of the dummy substrates 55A and 55B are so-called. The wires 58 are bonded to each other one by one using a wire bonding method and electrically connected to each other. Since heating is not required when attaching the wire 58 that connects the connection terminal portion 38 and the element-side connection terminal portion 56,
The heating step is also a single step of joining and fixing the thin film magnetic head element 35 and the protective substrate 65 using the thermosetting adhesive resin, and the thermal influence on the thin film magnetic head element 35 is reduced.

As described above, the thin film magnetic head 70 includes the thin film magnetic head element 35, the protective substrate 65 and the dummy substrate 5.
By combining and fixing 5A and 55B, respectively, one side surface, that is, a contact surface, with which a wide magnetic tape, which is a magnetic recording medium running when the thin film magnetic head 70 is incorporated in a magnetic recording / reproducing device, comes into contact. 7
The thickness dimension of 1 is made large, and the contact area in the traveling direction is secured. Further, in the thin film magnetic head 70, the contact surface 71 of the thin film magnetic head element 35 bonded and fixed to each other and the magnetic tape configured by the protection substrate 65 and the dummy substrates 55A and 55B working together is shown in FIG. So that it is cut into an arc shape. Thus, the thin film magnetic head 70
The contact surface 71 is formed in an arc shape,
Enables smooth running of magnetic tape.

As described above, in the thin film magnetic head 70 which is constructed as a whole length so as to accommodate the wide magnetic tape shown in the fifth embodiment and which scans a specific recording area of the magnetic tape, Unlike the conventional thin film magnetic head, a flexible wiring substrate for electrically connecting to a control unit or the like is unnecessary, and the thin film magnetic head element 35, the protective substrate 65, and the dummy substrates 55A, 5A, 5 which are constituent members are eliminated.
Since 5B is held by being firmly joined and fixed by a thermosetting adhesive resin, it does not break even when a tensile force is applied. Further, in contrast to the wiring method using the flexible wiring board, the wires 58 are used to connect the connection terminal portion 38 of the thin film magnetic head element 35 and the element side connection terminal portion 56 of the dummy substrates 55A and 55B to each terminal. It is possible to reduce the interval between the parts, and the overall size can be reduced. Further, since the dummy substrates 55A and 55B ensure a contact surface with a sufficient contact amount even in the direction orthogonal to the running direction of the magnetic tape, it can be used for a wide magnetic tape and a narrow magnetic tape. Therefore, the thin film magnetic head element 30 having the common specifications can be used. In addition, these dummy substrates 55
By properly selecting A and 55B, it is possible to obtain a thin film magnetic head in which the thin film magnetic head element 35 of the common specification is positioned corresponding to the specific recording area of the magnetic tape.

As a sixth embodiment of the thin film magnetic head according to the present invention, the thin film magnetic head 7 shown in FIGS.
Like the thin film magnetic heads of the above-described respective embodiments, 2 is provided in a data reproducing device connected to a recording / reproducing device, a personal computer, an office computer or the like, and is wide accommodated in a data cartridge to be loaded, and After scanning a part of the plurality of recording areas of the magnetic tape in which a plurality of recording areas are formed in the width direction, specifically, a recording area of four tracks in the width direction of the magnetic tape, a recording area for the next four tracks The thin film magnetic head is configured as a whole length, which is moved to, and is sequentially repeated to scan all tracks of a wide magnetic tape to record and reproduce data signals.

The thin-film magnetic head 72 is composed of the above-mentioned thin-film magnetic head element 30, the above-mentioned protective substrate 65 and dummy substrate 80, and the dummy substrate 80.
The thin film magnetic head element 30 is integrally formed with the lead-out terminal portion and the connection between the terminal portions is made by wire bonding, which is the same as that of the thin film magnetic head 70 of the fifth embodiment.

The dummy substrate 80, as shown in FIG.
A thin-film magnetic head element mounting portion 81 is formed in a notch at a position substantially at the center of one end in the length direction. The thin film magnetic head element mounting portion 81 is formed on the dummy substrate 80 with a notch size that is substantially the same as the outer dimension of the substrate 31 of the thin film magnetic head element 30. Further, on the dummy substrate 80, a plurality of element-side connection terminal portions 82 are formed corresponding to the thin film magnetic head element attachment portion 81.
These element-side connection terminal portions 82 are formed on the dummy substrate 80 with the number and width interval set so as to correspond one-to-one to the connection terminal portions 33 formed on the substrate 31 of the thin film magnetic head element 30. Has been done. These element-side connection terminal portions 82 are easily connected to the outside such as a control portion along the side end portion of the dummy substrate 80 opposite to the side end portion on which the thin film magnetic head element attachment portion 81 is formed. They are connected one-to-one with a plurality of external connection terminal portions 83, which are formed with a sufficient space therebetween so as to fit them, through lead portions.

The thin film magnetic head element 30 is mounted on the thin film magnetic head element mounting portion 81 and bonded and fixed to the dummy substrate 80 having the above-described structure. That is, the thin-film magnetic head element 30 is loaded into the thin-film magnetic head element mounting portion 81 so that the connection terminal portion 33 faces the element-side connection terminal portion 82, and then the adhesive resin, for example, a thermosetting adhesive. It is fixed using epoxy resin which is a resin. Thereafter, as shown in FIG. 19, the protective substrate 65 covers the magnetic circuit portion 32 of the thin film magnetic head element 30 so that the thin film magnetic head element 30 and the dummy substrate 8 are covered.
0, and the opposing joint surfaces are fixed using a thermosetting adhesive resin. As shown in FIG. 20, the thin film magnetic head element 30 protected by covering the magnetic circuit section 32 with the protective substrate 65 in this way has its connection terminal portion 33 and the element side connection terminal portion of the dummy substrate 80. 82 and 82 are joined by wires 84 in a one-to-one manner by the so-called wire bonding method, and are electrically connected to each other. As described above, the connection terminal portion 3
No heating is required when attaching the wire 84 that connects the element 3 and the element-side connection terminal portion 82. Therefore, the thin-film magnetic head element 30 and the dummy substrate 80 are also used in the heating step when manufacturing the thin-film magnetic head 72. This is a one-step process of joining and fixing using a thermosetting adhesive resin.
The thermal effect on 0 is reduced.

As described above, the thin film magnetic head 72 includes the thin film magnetic head element 30, the protective substrate 65 and the dummy substrate 8.
By combining and fixing 0 and 0, one side surface of the thin film magnetic head 72, which is a magnetic recording medium running when the thin film magnetic head 72 is incorporated in a magnetic recording / reproducing apparatus, that is, the contact surface 73 The thickness dimension is large and the contact area in the traveling direction is secured. Further, in the thin-film magnetic head 72, the contact surface 73 between the thin-film magnetic head element 30 and the protective substrate 65 and the dummy substrate 80, which are bonded and fixed to each other, cooperate with each other as shown in FIG. , Is cut into an arc shape.
In this way, the thin film magnetic head 72 enables the magnetic tape to smoothly run by forming the contact surface 73 in an arc shape.

As described above, in the thin film magnetic head 72 which is constructed as a whole length so as to be adapted to the wide magnetic tape shown in the sixth embodiment and which scans a specific recording area of the magnetic tape, Unlike the conventional thin film magnetic head, a flexible wiring substrate for electrically connecting to a control unit or the like is unnecessary, and the thin film magnetic head element 30, the protective substrate 65, and the dummy substrate 80, which are the constituent members, are thermosetting bonded to each other. Since it is held by being firmly joined and fixed by the resin, it does not break even when a tensile force is applied. Further, as compared with the wiring method using the flexible wiring board, the connection terminal portion 33 of the thin film magnetic head element 30 and the dummy substrate 80 are connected using the wire 84.
Since it is connected to the element-side connection terminal portion 83, it is possible to reduce the distance between the respective terminal portions, and the overall size can be reduced. Furthermore, the dummy substrate 80 ensures a contact surface with a sufficient contact amount even in the direction orthogonal to the running direction of the magnetic tape, and has a common specification for a wide magnetic tape and a narrow magnetic tape. The thin film magnetic head element 30 of FIG. Also,
A thin-film magnetic head in which the thin-film magnetic head element 30 of common specifications is positioned corresponding to a specific recording area of a magnetic tape can be obtained by appropriately selecting the position of the thin-film magnetic head element mounting portion 81 formed in the notch on the dummy substrate 80. You can

That is, as a seventh embodiment of the thin film magnetic head according to the present invention, the thin film magnetic head 74 shown in FIGS. 22 to 25 is the same as the thin film magnetic head 72 of the sixth embodiment described above. Part of the plurality of recording areas of the magnetic tape, which is provided in the reproducing apparatus or the video tape recorder and is accommodated in the loaded video tape cartridge and has a plurality of recording areas formed in the width direction, Is a thin-film magnetic head having a long overall length for scanning a recording area formed on a lateral side portion of the magnetic tape.

This thin-film magnetic head 74 is composed of the above-mentioned thin-film magnetic head element 30, and the above-mentioned protective substrate 65 and dummy substrate 85 having a length dimension almost equal to the width dimension of a wide magnetic tape, Dummy substrate 8
The structure for integrally forming the lead-out terminal portion of the thin-film magnetic head element 30 in FIG. 5 and the structure for connecting the terminal portions by wire bonding are the same as those of the thin-film magnetic head 72 of the sixth embodiment described above. The thin film magnetic head element 30 is characterized in that the thin film magnetic head element 30 is arranged on one side of the dummy substrate 85 in the longitudinal direction in order to accommodate a magnetic tape having a recording area formed on the lateral side. .

That is, as shown in FIG. 22, the dummy substrate 85 has a thin film magnetic head element mounting portion 86 formed in a notch at one end portion on one side in the length direction. The thin film magnetic head element mounting portion 86 is formed on the dummy substrate 85 with a notch size that is substantially the same as the outer dimension of the substrate 31 of the thin film magnetic head element 30. Also,
The dummy substrate 85 has a thin film magnetic head element mounting portion 86.
A plurality of element-side connection terminal portions 87 are formed corresponding to the above. These element-side connection terminal portions 87 are formed on the dummy substrate 85 with the number and width interval set so as to correspond to the connection terminal portions 33 formed on the substrate 31 of the thin film magnetic head element 30 in a one-to-one correspondence. Has been done. These element-side connection terminal portions 87 can be easily connected to the outside such as a control portion along the side edge portion of the dummy substrate 85 opposite to the side edge portion on which the thin film magnetic head element attachment portion 86 is formed. It is connected via a lead portion to a plurality of external connection terminal portions 88 which are formed so that their respective intervals are sufficiently held so that they can be flattened.

The thin film magnetic head element 30 is mounted on the thin film magnetic head element mounting portion 86 and bonded and fixed to the dummy substrate 85 having the above-described structure. That is, the thin-film magnetic head element 30 is loaded in the thin-film magnetic head element mounting portion 86 so that the connection terminal portion 33 faces the element-side connection terminal portion 87, and then the adhesive resin, for example, a thermosetting adhesive. It is fixed using epoxy resin which is a resin. After that, as shown in FIG. 23, the protective substrate 65 covers the magnetic circuit portion 32 of the thin film magnetic head element 30 and the thin film magnetic head element 30 and the dummy substrate 8 are covered with the protective substrate 65.
5 and the opposing joint surfaces are fixed using a thermosetting adhesive resin. As shown in FIG. 24, the thin film magnetic head element 30 protected by covering the magnetic circuit section 32 with the protective substrate 65 in this way has its connection terminal portion 33 and the element side connection terminal portion of the dummy substrate 85, as shown in FIG. 87 and 87 are joined one by one by wires 89 by a so-called wire bonding method and electrically connected to each other. As described above, the connection terminal portion 3
Since heating is not required when attaching the wire 89 that connects the thin film magnetic head element 30 and the dummy substrate 85 to each other, the thin film magnetic head element 30 and the dummy substrate 85 are attached to each other. This is a one-step process of joining and fixing using a thermosetting adhesive resin.
The thermal effect on 0 is reduced.

As described above, the thin film magnetic head 74 includes the thin film magnetic head element 30, the protective substrate 65 and the dummy substrate 8.
By combining and fixing 5 and 5, the thin film magnetic head 74 is mounted on a magnetic recording / reproducing apparatus. The thickness dimension is large and the contact area in the traveling direction is secured. Further, in the thin-film magnetic head 74, the contact surface 75 of the thin-film magnetic head element 30 bonded and fixed to each other and the magnetic tape configured by the protection substrate 65 and the dummy substrate 85 working together is as shown in FIG. , Is cut into an arc shape.
In this way, the thin-film magnetic head 74 allows the magnetic tape to smoothly run by forming the contact surface 75 in an arc shape.

As described above, a specific recording area formed on the lateral side portion of the magnetic tape is constructed as a whole length so as to accommodate the wide magnetic tape shown in the seventh embodiment. In the thin-film magnetic head 74 for scanning, the flexible wiring board for electrically connecting to the control unit or the like, unlike the conventional thin-film magnetic head, is unnecessary, and the thin-film magnetic head element 30, which is a component, and the protective substrate 65. Since the dummy substrate 85 and the dummy substrate 85 are held by being firmly bonded and fixed to each other by the thermosetting adhesive resin, the dummy substrate 85 is not broken even when a tensile force is applied. Further, in contrast to the wiring method using the flexible wiring board, the connection terminal portion 33 of the thin film magnetic head element 30 and the element side connection terminal portion 87 of the dummy substrate 85 are used by using the wire 89.
Since the terminals are connected to each other, it is possible to reduce the distance between the respective terminal portions, and the overall size can be reduced. Further, the dummy substrate 85 ensures a contact surface with a sufficient contact amount even in the direction orthogonal to the running direction of the magnetic tape, and has a common specification for a wide magnetic tape and a narrow magnetic tape. The thin film magnetic head element 30 of FIG.

[0078]

As described in detail above, according to the thin film magnetic head of the present invention, the thin film magnetic head element and the magnetic circuit portion formed on the substrate of the thin film magnetic head element are covered. By being bonded and fixed by a protective substrate that protects the magnetic circuit section,
By integrally forming the lead-out terminal portion joined to the connection terminal portion of the magnetic circuit portion on the protective substrate, the contact amount with the magnetic recording medium is sufficiently retained, which causes the disadvantage of damaging the magnetic recording medium. Since the occurrence is surely prevented and the flexible wiring board which is a component for connection is not required, the number of components and the number of processing steps are reduced, and the cost is reduced. Further, since the thin film magnetic head and the protective substrate are firmly bonded and held to each other, even if a tensile force is applied, there is no disconnection at the bonded portion of both terminal portions, and the number of heating steps is also small. ,
The thermal effect on the thin film magnetic head element is reduced, and high precision and reliability are improved.

According to the method of manufacturing the thin film magnetic head of the present invention, the lead-out terminal portion is integrally formed on the substrate of the thin film magnetic head element in correspondence with the connection terminal portion of the magnetic circuit portion of the thin film magnetic head element. Wiring between the connection parts is manufactured by fixing and bonding the protective substrate formed on the magnetic circuit part so as to cover the magnetic circuit part, and then cutting the contact surface of the magnetic recording medium into an arc shape. The process is greatly shortened and precise wiring is performed, so that a highly accurate and highly reliable thin film magnetic head can be obtained. Further, a thin film magnetic head in which a thin film magnetic head element of common specifications is arranged corresponding to a specific recording area of a wide magnetic tape can be obtained very easily.

According to the thin film magnetic head of the present invention, the thin film magnetic head element and the magnetic circuit formed on the substrate of the thin film magnetic head element are bonded and fixed so as to cover the magnetic circuit. And a dummy substrate that is bonded and fixed adjacent to the thin film magnetic head element. The dummy substrate is integrally formed with a lead-out terminal portion that is joined to the connection terminal portion of the magnetic circuit portion. As a result, the amount of contact with the magnetic recording medium is sufficiently retained, so that the inconvenience of damaging the magnetic recording medium is reliably prevented, and the flexible wiring board that is a component for connection is not required. As a result, the number of parts and the number of processing steps are reduced, and the cost is reduced.
Further, since the thin film magnetic head and the protective substrate are firmly bonded and held to each other, even if a tensile force is applied, there is no disconnection at the bonded portion of both terminal portions, and the number of heating steps is also small. The thermal effect on the thin-film magnetic head element is reduced, and high precision and reliability are improved.

Further, according to the method of manufacturing the thin film magnetic head of the present invention, the lead-out terminal portion is integrally formed adjacent to the thin film magnetic head element and corresponding to the wiring terminal portion of the magnetic circuit portion of the thin film magnetic head element. The formed dummy substrate is bonded and fixed, and further bonded and fixed on the substrate of the thin film magnetic head element so as to cover the magnetic circuit portion, and then the contact surface of the magnetic recording medium is cut into an arc shape. By manufacturing the thin film magnetic head, the wiring process between the connecting portions can be significantly shortened and precise wiring can be performed, so that a highly accurate and highly reliable thin film magnetic head can be obtained. Further, a thin film magnetic head in which a thin film magnetic head element of common specifications is arranged corresponding to a specific recording area of a wide magnetic tape can be obtained very easily.

[Brief description of drawings]

FIG. 1 is a perspective view showing a constituent member of a thin film magnetic head according to a first embodiment of the present invention in an exploded state for explaining the constituent members.

FIG. 2 is a perspective view showing a state in which constituent members of the thin film magnetic head are combined.

FIG. 3 is a perspective view showing a state in which the contact surface of the thin film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 4 is a perspective view showing an elongated type thin film magnetic head according to the present invention in a disassembled state for explaining constituent members of a second embodiment.

FIG. 5 is a perspective view of a state in which constituent members of the thin film magnetic head are combined.

FIG. 6 is a perspective view showing a state in which the contact surface of the thin film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 7 is a perspective view showing a constituent member of a third embodiment of the thin-film magnetic head according to the present invention in an exploded state for explaining the constituent members.

FIG. 8 is a perspective view showing a state in which constituent members of the thin film magnetic head are combined.

FIG. 9 is a perspective view showing a state in which the contact surface of the thin film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 10 is a perspective view showing a constituent member of a third embodiment of the thin-film magnetic head according to the present invention in an exploded state for explaining the constituent members.

FIG. 11 is a perspective view showing a state in which constituent members of the thin film magnetic head are combined.

FIG. 12 is a perspective view showing a state in which the contact surface of the thin film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 13 is a plan view of a thin film magnetic head element provided in a thin film magnetic head of a fourth embodiment of the thin film magnetic head according to the present invention.

FIG. 14 is a perspective view showing a constituent member of the thin film magnetic head in a disassembled state for explaining the constituent members.

FIG. 15 is a perspective view showing a state in which constituent members of the thin film magnetic head are combined.

FIG. 16 is a perspective view showing a state in which the connection terminal portion of the thin film magnetic head element of the same thin film magnetic head and the lead terminal portion of the dummy substrate are connected by a wire.

FIG. 17 is a perspective view showing a state in which the contact surface of the thin-film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 18 is a perspective view of the thin-film magnetic head in a disassembled state for explaining the constituent members of the fifth embodiment.

FIG. 19 is a perspective view showing a state in which constituent members of the thin film magnetic head are combined.

FIG. 20 is a perspective view showing a state in which a connection terminal portion of a thin film magnetic head element of the same thin film magnetic head and a lead terminal portion of a dummy substrate are connected by a wire.

FIG. 21 is a perspective view showing a state where the contact surface of the thin film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 22 is a perspective view showing the constituent members of the thin-film magnetic head in a sixth embodiment in an exploded state for explaining the constituent members.

FIG. 23 is a perspective view showing a state in which constituent members of the thin film magnetic head are combined.

FIG. 24 is a perspective view showing a state in which the connection terminal portion of the thin film magnetic head element of the same thin film magnetic head and the lead terminal portion of the dummy substrate are connected by a wire.

FIG. 25 is a perspective view showing a state in which the contact surface of the thin film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 26 is a plan view of a thin film magnetic head element included in a conventional thin film magnetic head.

FIG. 27 is a perspective view shown in an exploded state for explaining the constituent members of the thin film magnetic head unit.

FIG. 28 is a perspective view showing the thin-film magnetic head portion and a flexible wiring board for electrically connecting the thin-film magnetic head portion in a disassembled state for explaining.

FIG. 29 is a perspective view showing a state in which the thin-film magnetic head unit and a flexible wiring board are combined.

FIG. 30 is a perspective view showing a state in which the contact surface of the same thin-film magnetic head with a magnetic recording medium is cut into an arc shape.

FIG. 31 is a perspective view shown in a disassembled state for explaining constituent members of a thin-film magnetic head portion in a conventional long thin-film magnetic head.

FIG. 32 is a perspective view showing the thin-film magnetic head portion and a flexible wiring board for electrically connecting the thin-film magnetic head portion in a disassembled state for explaining the same.

FIG. 33 is a perspective view showing a state in which the thin-film magnetic head unit and a flexible wiring board are combined.

FIG. 34 is a perspective view showing a state in which the contact surface of the same thin-film magnetic head with the magnetic recording medium is cut into an arc shape.

FIG. 35 is a perspective view shown in a disassembled state for explaining constituent members of a thin film magnetic head portion in still another conventional thin film magnetic head.

FIG. 36 is a perspective view showing the thin-film magnetic head portion and a flexible wiring board for electrically connecting the thin-film magnetic head portion in a disassembled state for explaining.

FIG. 37 is a perspective view showing a state in which the thin-film magnetic head unit and a flexible wiring board are combined.

FIG. 38 is a perspective view showing a state in which the contact surface of the same thin-film magnetic head with the magnetic recording medium is cut into an arc shape.

[Explanation of symbols]

 30 Thin Film Magnetic Head Element 31 Substrate 32 Magnetic Circuit Section 33 Connection Terminal Section 40 Protective Substrate 41 Thin Film Magnetic Head Element Attachment Section 42 Element Side Connection Terminal Section (Drawout Terminal Section) 43 External Connection Terminal Section (Drawout Terminal Section) 49 Dummy Section 55 Dummy substrate 56 Element-side connection terminal section (draw-out terminal section) 57 External connection terminal section (draw-out terminal section)

Claims (12)

[Claims] 1. A thin film magnetic head element comprising a magnetic film forming a magnetic circuit section, a conductive coil section and the like formed on a substrate, and the thin film magnetic head element is bonded so as to cover the magnetic circuit section. A protective substrate that protects the magnetic circuit portion by being fixed and holds the contact amount in the traveling direction of the magnetic recording medium, and from the magnetic circuit portion in a state where the thin film magnetic head element is bonded and fixed to the protective substrate. A thin-film magnetic head, characterized in that a lead-out terminal portion is formed integrally with a connection terminal portion that is drawn out and formed on a substrate. 2. A thin film according to claim 1, further comprising a dummy substrate which is adjacent to the thin film magnetic head element and holds a contact amount in a direction orthogonal to a running direction of a wide magnetic recording medium. Magnetic head. 3. A dummy portion for integrally holding a contact amount of a wide magnetic recording medium in a direction orthogonal to a traveling direction is integrally formed on one side portion of the long protective substrate. 1. The thin film magnetic head described in 1. 4. A thin film magnetic head element mounting portion for mounting a thin film magnetic head element is formed by cutting out a part of a dummy portion integrally formed on a protective substrate. Thin film magnetic head. 5. A lead-out terminal portion for joining a thin-film magnetic head element having a magnetic film forming a magnetic circuit portion, a conductive coil portion, etc. on a substrate, to a connection terminal portion drawn out from the magnetic circuit portion. And a protective substrate that holds the contact amount in the traveling direction of the magnetic recording medium is bonded and fixed so as to cover the magnetic circuit portion, and then the substrate of the thin-film magnetic head element and the protective substrate work together. 5. A method of manufacturing a thin film magnetic head, characterized in that the thin film magnetic head according to any one of claims 1 to 4 is manufactured by cutting an abutting surface of the magnetic recording medium into an arc shape. 6. A thin-film magnetic head element substrate after combining and fixing a dummy substrate adjacent to the thin-film magnetic head element, which holds a contact amount in a direction orthogonal to the running direction of a wide magnetic recording medium. 6. The method of manufacturing a thin-film magnetic head according to claim 5, wherein the contact surface with the magnetic recording medium formed by cooperation of the protective substrate and the dummy substrate is cut into an arc shape. 7. A dummy portion for holding a contact amount in a direction orthogonal to a running direction of a wide magnetic recording medium is integrally formed on one side portion of a long protective substrate, and the protective substrate is used for thin film magnetic recording. A structure in which the contact surface of the magnetic recording medium, which is formed by the substrate of the thin-film magnetic head element and the protective substrate cooperating with each other, is cut into an arc shape after being bonded and fixed in combination with the head element. Item 6. A method of manufacturing a thin film magnetic head according to Item 5. 8. A thin film magnetic head element having a magnetic film forming a magnetic circuit section, a conductive coil section and the like formed on a substrate, and bonding the thin film magnetic head element so as to cover the magnetic circuit section. A long protective substrate that protects the magnetic circuit portion by being fixed and holds the amount of contact with the magnetic recording medium in the traveling direction, and is joined and fixed to the protective substrate in parallel with the thin film magnetic head element. The thin film magnetic head element has a wider width than the magnetic recording medium, and a dummy substrate for holding the contact amount in the direction orthogonal to the traveling direction is provided. A thin-film magnetic head, characterized in that a lead-out terminal portion is formed that is drawn out and is connected to a connection terminal portion formed on the substrate. 9. A thin film magnetic head element, wherein the connection terminal portion drawn out from the magnetic circuit portion and formed on the substrate and the lead terminal portion formed on the dummy substrate are connected by wire bonding. Item 9. A thin film magnetic head according to item 8. 10. A thin film magnetic head comprising a plurality of dummy substrates, which are provided together with a thin film magnetic head element to hold a contact amount of a wide magnetic recording medium in a direction orthogonal to a traveling direction. 9. A lead-out terminal portion connected to a connection terminal portion from the magnetic circuit portion of the thin-film magnetic head element is formed on at least one dummy substrate arranged adjacent to the element. Thin film magnetic head. 11. A thin-film magnetic head element is mounted and bonded and fixed on a part of a dummy substrate formed long so as to hold the contact amount of a wide magnetic recording medium in a direction orthogonal to the running direction. The thin-film magnetic head element mounting portion is formed by notching, and the lead-out terminal portion is formed near the thin-film magnetic head element mounting portion and connected to the connection terminal portion from the magnetic circuit portion of the thin-film magnetic head element. 9. The thin film magnetic head according to claim 8, wherein. 12. A dummy for holding a contact amount in a direction orthogonal to a running direction of a magnetic recording medium on a thin-film magnetic head element having a magnetic film forming a magnetic circuit section, a conductive coil section and the like formed on a substrate. A board is provided side by side, and a connection terminal portion of the magnetic circuit portion of the thin film magnetic head element is connected to a lead terminal portion formed on a dummy substrate facing the connection terminal portion, and the thin film magnetic head element and the dummy substrate are provided with a magnetic recording medium After bonding a protective substrate that holds the contact amount in the traveling direction so as to cover the magnetic circuit portion, a thin film magnetic head element substrate, a dummy substrate, and a magnetic recording medium formed by cooperation with the protective substrate A method of manufacturing a thin film magnetic head, characterized in that the thin film magnetic head according to claim 8 is manufactured by cutting an abutting surface into an arc shape.