JP2003270644A - Liquid crystal device, production method thereof and adhesive material therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To attach and bond a counter substrate and an element substrate together while accurately controlling cell thickness and fabrication accuracy without causing the deterioration of pixels. <P>SOLUTION: In steps S<SB>21</SB>-S<SB>23</SB>, sealant, vertically conductive material and a fixing member are formed on a TFT substrate. The fixing member is formed outside the sealant. That is, the fixing member is adequately separated from a pixel region, the TFT substrate and the counter substrate are attached together (step S<SB>25</SB>) and aligned and, at the same time, the fixing member is photoset (step S<SB>26</SB>). Therein, the pixel is not irradiated with the leakage light. In step S<SB>27</SB>, the sealant is properly cured by heat. In such a manner, the pixel is not irradiated with the leakage light, the pixel is not deteriorated and the assembly with high alignment accuracy and adequate strength can be performed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device suitable for laminating small liquid crystal panels, a method for manufacturing the same, and an adhesive.

[0002]

2. Description of the Related Art A liquid crystal device such as a liquid crystal light valve is constructed by enclosing a liquid crystal between two substrates such as a glass substrate and a quartz substrate. In a liquid crystal light valve, for example, a thin film transistor (hereinafter, referred to as T
(Referred to as FT) are arranged in a matrix, the counter electrode is arranged on the other substrate, and the optical characteristics of the liquid crystal layer sealed between both substrates are changed according to the image signal, thereby enabling image display. To do.

The TFT substrate on which the TFTs are arranged and the counter substrate opposed to the TFT substrate are manufactured separately.
After both substrates are bonded with high precision in the panel assembly process, liquid crystal is sealed.

In the panel assembling process, first, an alignment film is formed on the facing surfaces of the TFT substrate and the counter substrate manufactured in each substrate process, that is, on the surfaces of the counter substrate and the liquid crystal layer of the TFT substrate in contact with each other. Then, a rubbing process is performed.

By forming an alignment film and performing rubbing treatment, the alignment of liquid crystal molecules when no voltage is applied is determined. The alignment film is formed, for example, by applying polyimide to a thickness of about several tens of nanometers. By forming the alignment films on the surfaces of both substrates facing the liquid crystal layer, the liquid crystal molecules can be aligned along the surfaces of the substrates. The rubbing process is
A fine groove is formed on the surface of the alignment film to form an alignment anisotropic film, and the alignment film can be rubbed in a certain direction to define the alignment of liquid crystal molecules.

Next, a sealing material as an adhesive is formed on the edge of one of the substrates. The TFT substrate and the counter substrate are attached to each other with a sealant, and pressure-bonded and cured while performing alignment. A notch is provided in a part of the sealing material, and the liquid crystal is sealed through this notch.

By the way, in the bonding process of the substrates, there are a method of curing the sealing material by utilizing heat curing and a method of curing the sealing material by utilizing light (ultraviolet) curing.

The method of thermosetting the sealing material has an advantage of high productivity. However, due to the difference between the coefficient of thermal expansion of the sealing material and the coefficient of thermal expansion of glass, the alignment may be misaligned.

Therefore, in general, a method of curing the adhesive portion with ultraviolet rays is often adopted. Adopting UV curing has the advantage of high alignment accuracy because it does not apply heat. However, it is 300 with UV curing.
A large amount of light such as 0 to 30,000 mJ is required, and it takes a long time for sufficient curing.

Further, there is a problem that the polyimide is irradiated with light when it is irradiated with ultraviolet rays and deteriorates, and the pretilt angle of the alignment of the liquid crystal is lowered.

Therefore, in recent years, a UV curable material which cures in a short time has been adopted for temporary curing, and in the main curing, there has been used a seal material in which UV curing by a large amount of UV light and auxiliary heat curing are adopted. Alignment accuracy is improved by temporary curing for a short time, and sufficient fixing strength is obtained by main curing using a large amount of ultraviolet light.

When the sealing material is irradiated with ultraviolet rays, a light-shielding mask for shielding the portion other than the sealing material from light is used in order to avoid the influence on the pixels.

[0013]

However, it is not possible to completely block the incidence of ultraviolet rays on a pixel only with a light-shielding mask. Moreover, the amount of light during UV exposure is 1000-
It is relatively high at 4000 mJ. Therefore, when an ultraviolet curable adhesive material is used as the seal material from the viewpoint of productivity and assembly accuracy, a relatively large amount of light is incident on pixels near the seal material when the seal material is cured by ultraviolet light. Then, there is a problem that the alignment film and the like are easily deteriorated and the screen quality is deteriorated.

The present invention has been made in view of the above problems, and in addition to the sealing material for fixing the counter substrate and the element substrate, a fixing member for temporary curing is provided outside the sealing material,
By making the fixing member a UV curing type and the sealing material a thermosetting type, the cell thickness and the assembly accuracy can be controlled with high accuracy, and the adverse effect of ultraviolet rays on the pixels can be avoided, and the liquid crystal device. It is an object to provide a manufacturing method and an adhesive.

[0015]

A liquid crystal device according to the present invention is formed between first and second liquid crystal substrates which are arranged so as to face each other and in which a liquid crystal is sealed, and are thermally cured to form the first liquid crystal device. A sealing material for fixing the first and second liquid crystal substrates to each other, and a position between the first and second liquid crystal substrates, which is separated from a pixel region formed by the first and second liquid crystal substrates, By photo-curing, the first
And a fixing member for temporarily fixing the second liquid crystal substrates to each other.

According to this structure, the sealing material is formed between the first and second liquid crystal substrates. Also, the first
The fixing member is formed between the second liquid crystal substrate and the second liquid crystal substrate at a position separated from the pixel region formed by the first and second liquid crystal substrates. The fixing member is photo-cured to temporarily fix the first and second liquid crystal substrates to each other. By curing with light, temporary fixing is performed while controlling the cell thickness and the assembly accuracy with high accuracy. During the photo-curing of the fixing member, the leak light is not applied to the pixel area. The sealing material is heat-cured to fix the first and second liquid crystal substrates to each other with sufficient strength. In this way, high-accuracy pasting is performed without causing deterioration of pixels.

The fixing member is formed outside the sealing material between the first and second liquid crystal substrates.

According to this structure, since the fixing member is formed outside the sealing material, the fixing member is separated from the pixel region by at least the width of the sealing material. This prevents light from being applied to the pixel area during light exposure.

Further, the fixing member is formed at a position where the leaked light is not irradiated to the pixel region formed by the first and second liquid crystal substrates during mask exposure.

According to such a configuration, the leaked light at the time of mask exposure is not applied to the pixel, so that the pixel can be prevented from being deteriorated.

Further, the fixing member includes the first and second fixing members.
It is also used as an up-and-down conducting material for electrically connecting the liquid crystal substrates to each other.

According to this structure, since the fixing member is also used as the upper and lower conducting members, it is not necessary to newly provide a space for forming the fixing member, and the degree of freedom in design is not reduced.

Further, the fixing member is formed along the entire outer periphery of the sealing material.

According to this structure, the fixing member can be formed by the same forming process as the sealing material.

Further, the fixing member includes the first and second fixing members.
The liquid crystal substrate is formed at four corners of one of the liquid crystal substrates.

According to this structure, the four corners of one of the first and second liquid crystal substrates have relatively large empty spaces at positions relatively separated from the pixel region, It is the most suitable position for forming the fixing member.

In the method for manufacturing a liquid crystal device according to the present invention, a thermosetting sealing material is formed on one of the first and second liquid crystal substrates which are arranged so as to face each other and in which liquid crystal is sealed, and the first and second liquid crystal substrates are formed. A step of forming a photo-curing type fixing member at a position separated from a pixel region constituted by the second liquid crystal substrate, and bonding the first and second liquid crystal substrates to irradiate the fixing member with light. Accordingly, a temporary curing step of temporarily fixing the first and second liquid crystal substrates while aligning, and a step of permanently curing the sealing material by heat to fix the first and second liquid crystal substrates are provided. It is characterized by having done.

According to this structure, the sealing material and the fixing member are formed on one of the first and second liquid crystal substrates. The fixing member is formed at a position separated from the pixel region formed by the first and second liquid crystal substrates. The first and second liquid crystal substrates are attached to each other, and the fixing member is irradiated with light so that the fixing member is cured while being aligned. As a result, the first and second liquid crystal substrates are temporarily fixed. Next, the sealing material is fully cured by heat to fix the first and second liquid crystal substrates. In this way, high-accuracy pasting is performed without causing deterioration of pixels.

The fixing member includes the first and second fixing members.
Is formed outside the sealing material between the liquid crystal substrates.

The fixing member includes the first and second fixing members.
It is also used as a vertical conductive material for electrically connecting the liquid crystal substrates to each other.

According to this structure, the first and second liquid crystal substrates can be electrically connected to each other by the temporary curing fixing member. Further, the step of forming the upper and lower conducting members and the step of forming the fixing member are combined, and an increase in the number of steps is prevented.

The adhesive used in the manufacture of the liquid crystal device according to the present invention is characterized by comprising a photocurable base resin, a photoinitiator, and a filler having a conduction function.

According to this structure, the base resin is photocured by the photoinitiator. By means of the filler having a conduction function, it is possible to electrically connect the members in contact with both ends of the base resin.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows the first of the present invention.
5 is a flowchart showing a manufacturing method according to the embodiment of the present invention. FIG. 2 is an equivalent circuit diagram of various elements, wirings, etc. in a plurality of pixels forming the pixel region of the liquid crystal device in which the substrate is assembled by the manufacturing method of FIG. Figure 3
2 is a plan view of the liquid crystal device of FIG. 2 as viewed from the counter substrate side together with the constituent elements such as a TFT substrate formed on the element substrate, and FIG. The liquid crystal device after the assembly process for enclosing the
FIG. 6 is a cross-sectional view taken along the line HH ′ of FIG. Further, FIG. 5 is a cross-sectional view showing in detail the configuration of the pixel of the liquid crystal device. FIG. 6 is a flowchart showing the panel assembling process.

In this embodiment, the counter substrate and the element substrate are temporarily fixed while being aligned by a photo-curing temporary fixing member at a position sufficiently separated from the effective pixel region, and at the same time, a thermosetting type member is used. The sealing material is fully cured so that the counter substrate and the element substrate are securely bonded and fixed.

First, the structure of the liquid crystal device will be described with reference to FIGS.

The liquid crystal device, as shown in FIG. 3 and FIG.
A liquid crystal 50 is sealed between the element substrate 10 such as a TFT substrate and the counter substrate 20. Pixel electrodes that form pixels are arranged in a matrix on the element substrate 10. FIG. 2 shows an equivalent circuit of the elements on the element substrate 10 which form the pixels.

As shown in FIG. 2, in the pixel area,
The plurality of scanning lines 3a and the plurality of data lines 6a are arranged so as to intersect with each other, and the pixel electrodes 9a are arranged in a matrix in a region partitioned by the scanning lines 3a and the data lines 6a. A TFT 30 is provided corresponding to each intersection of the scanning line 3a and the data line 6a, and the pixel electrode 9a is connected to this TFT 30.

The TFT 30 is turned on by the ON signal of the scanning line 3a, whereby the image signal supplied to the data line 6a is supplied to the pixel electrode 9a. This pixel electrode 9
A voltage between a and the counter electrode 21 provided on the counter substrate 20 is applied to the liquid crystal 50. Further, a storage capacitor 70 is provided in parallel with the pixel electrode 9a, and the storage capacitor 70 enables the voltage of the pixel electrode 9a to be retained for a time that is, for example, three digits longer than the time when the source voltage is applied. The storage capacitor 70 improves the voltage holding characteristic and enables image display with a high contrast ratio.

FIG. 5 is a schematic sectional view of a liquid crystal device focusing on one pixel.

The groove 1 is formed in the element substrate 10 such as glass or quartz.
1 is formed. A TFT 30 having an LDD structure is formed on the groove 11 via a light shielding film 12 and a first interlayer insulating film 13.
Are formed. The groove 11 flattens the boundary surface of the TFT substrate with the liquid crystal 50.

The TFT 30 comprises a scanning line 3a forming a gate electrode via an insulating film 2 in a semiconductor layer in which a channel region 1a, a source region 1d and a drain region 1e are formed. The light shielding film 12 is formed in a region corresponding to the formation region of the TFT 30, a formation region of the data lines 6a and the scanning lines 3a described later, that is, a region corresponding to the non-display region of each pixel. Due to the light-shielding film 12, the reflected light is T
Incident on the channel region 1a, the source region 1d, and the drain region 1e of the FT 30 is prevented.

A second interlayer insulating film 14 is laminated on the TFT 30, and an intermediate conductive layer 15 is formed on the second interlayer insulating film 14. Capacitor lines 18 are arranged on the intermediate conductive layer 15 with a dielectric film 17 interposed therebetween. The capacitance line 18 is
It is composed of a capacitance layer and a light-shielding layer, constitutes a storage capacitor with the intermediate conductive layer 15, and has a light-shielding function of preventing internal reflection of light. Since the intermediate conductive layer 15 is formed at a position relatively close to the semiconductor layer, diffused reflection of light can be efficiently prevented.

A third interlayer insulating film 19 is arranged on the capacitance line 18, and a data line 6a is laminated on the third interlayer insulating film 19. The data line 6a is connected to the third and second interlayer insulating films 1
It is electrically connected to the source region 1d through the contact holes 24a and 24b penetrating the electrodes 9 and 14. A pixel electrode 9a is stacked on the data line 6a with a fourth interlayer insulating film 25 interposed therebetween. The pixel electrode 9a has a contact hole 26 penetrating the fourth to second interlayer insulating films 25, 19, and 14.
a, 26b through the capacitance line 18 to the drain region 1e
Electrically connected to. An alignment film 16 made of a polyimide-based polymer resin is laminated on the pixel electrode 9a, and is rubbed in a predetermined direction.

When the ON signal is supplied to the scanning line 3a (gate electrode), the channel region 1a becomes conductive,
The source region 1d and the drain region 1e are connected to each other, and the image signal supplied to the data line 6a is applied to the pixel electrode 9a.

On the other hand, the counter substrate 20 is provided with a first light-shielding film 23 in a region facing the data line 6a, the scanning line 3a and the TFT 30 forming region of the TFT array substrate, that is, in the non-display region of each pixel. . Due to the first light-shielding film 23, incident light from the counter substrate 20 side allows the channel region 1a, the source region 1d and the drain region 1e of the TFT 30 to be incident.
Is prevented from entering. A counter electrode (common electrode) 21 is formed on the first light-shielding film 23 over the entire surface of the substrate 20. An alignment film 22 made of a polyimide-based polymer resin is laminated on the counter electrode 21 and rubbed in a predetermined direction.

Liquid crystal 50 is sealed between the element substrate 10 and the counter substrate 20. As a result, the TFT3
0 writes the image signal supplied from the data line 6a to the pixel electrode 9a at a predetermined timing. Depending on the written potential difference between the pixel electrode 9a and the counter electrode 21, the orientation or order of the molecular assembly of the liquid crystal 50 is changed to modulate light and enable gradation display.

As shown in FIGS. 3 and 4, the counter substrate 20
Is provided with a light shielding film 42 as a frame that divides the display area. The light shielding film 42 is made of, for example, the same or different light shielding material as the light shielding film 23.

A sealing material 41 for enclosing the liquid crystal is formed between the element substrate 10 and the counter substrate 20 in a region outside the light shielding film 42. The sealing material 41 is arranged so as to substantially match the contour shape of the counter substrate 20, and fixes the element substrate 10 and the counter substrate 20 to each other. In this embodiment, a thermosetting adhesive material is used as the sealing material 41.

Further, in this embodiment, a fixing member 43 for temporary fixing is formed in the area outside the sealing material 41. The fixing member 43 is formed between the element substrate 10 and the counter substrate 20, and fixes the element substrate 10 and the counter substrate 20 to each other. As the fixing member 43, a UV curable adhesive material is used.

The sealing material 41 and the fixing member 43 are missing on a part of one side of the element substrate 10, and the liquid crystal 50 is injected into the gap between the element substrate 10 and the counter substrate 20 which are bonded together. A liquid crystal injection port 78 is formed.
After the liquid crystal is injected through the liquid crystal injection port 78, the liquid crystal injection port 7
8 is sealed with a sealing material 79.

A data line drive circuit 61 and mounting terminals 62 are provided along one side of the element substrate 10 in a region outside the fixing member 43 of the element substrate 10, and along two sides adjacent to the one side. , A scanning line drive circuit 63 is provided. A plurality of wirings 64 for connecting the scanning line drive circuits 63 provided on both sides of the screen display area are provided on the remaining side of the element substrate 10. The element substrate 1 is provided at least at one corner of the counter substrate 20.
A vertical conduction member 65 is provided to electrically connect 0 and the counter substrate 20.

Next, a specific example of the fixing member 43 will be described.

In this embodiment, as the fixing member 43, a photo-curable base resin is adopted. For example, acrylic acid ester, methacrylic acid ester monomer or oligomer, bisphenol-modified acrylate, bisphenol-modified methacrylate, silicon-modified acrylate, urethane-modified acrylate, fluorine acrylate, allyl monomer, allyl oligomer, etc. I wish I had it.

As the photoinitiator for the fixing member 43, a photoradical generator such as benzophenone, 2,2-diethoxyacetophenone, benzoylisopropyl ether, benzyldimethylketal, 1-hydroxycyclohexylphenylketone, thioxanthone and the like can be considered.

On the other hand, as the sealing material 41, a heat sealing agent is used. The basic composition of the sealing material 41 includes an epoxy-based base resin, a curing agent or a curing catalyst and a filler agent that forms a cell gap. If necessary, an adhesion-imparting agent and a flattening agent are added.

As the base resin of the sealing material 41, bisphenol A type epoxy resin, bisphenol F type epoxy resin, cycloaliphatic epoxy resin, various modified epoxy resins and the like can be considered.

The curing agent for the sealing material 41 is not limited as long as it can be cured with the base resin, such as an amine-based curing agent, a urethane-based curing agent or a melamine-based curing agent.

Various metal catalysts, acid catalysts and the like can be considered as the curing catalyst for the sealing material 41 (when it is cured with an epoxy alone).

As the filler of the sealing material 41,
Various ceramic beads such as glass beads, glass fillers or fibers or whiskers are conceivable.

Such a liquid crystal device is assembled by, for example, the panel assembling process shown in FIG. The element substrate 10 (TFT substrate) and the counter substrate 20 are manufactured separately. For the TFT substrate and the counter substrate 20 respectively prepared in steps S1 and S6, the following steps S2 and S7 are performed.
Then, polyimide (PI) that becomes the alignment films 16 and 22 is applied. Next, in steps S3 and S8, the alignment film 16 on the surface of the element substrate 10 and the alignment film 2 on the surface of the counter substrate 20 are formed.
A rubbing process is applied to 2.

Next, in steps S4 and S9, a cleaning process is performed. This cleaning step is for removing dust generated by the rubbing process. When the cleaning process is completed, the seal material 41 and the fixing member 43 (see FIG. 2) are formed in step S5. Next, step S10
Then, the element substrate 10 and the counter substrate 20 are bonded to each other, and they are pressure-bonded while performing alignment in step S11 to cure the fixing member 43 and further cure the sealing material 41. Finally, in step S12, the liquid crystal is sealed from the notch provided in a part of the sealing material 41, and the notch is closed to seal the liquid crystal.

FIG. 1 specifically shows the adhesive forming step, the laminating step, and the alignment / pressure-bonding hardening step of FIG.

In steps S20 and S24 of FIG. 1, the TFT substrate and the counter substrate after the rubbing treatment are put in, respectively. In steps S21 to S23, the sealing material 41, the vertical conducting material 65, and the fixing member 43 are formed on the surface of the TFT substrate by, for example, a dispensing method. The sealing material 41 is formed on the edge of the pixel area, the vertical conducting materials 65 are formed on the four corners of the counter substrate 20, and the fixing member 43 is the sealing material 41.
Formed on the outside of. The sealing material 41 is, for example, about 500 μ.
It has a width of m.

In the next step S25, the TFT substrate and the counter substrate are bonded together. Next, in step S26, the fixing member 43 is temporarily cured while performing the alignment. In this case, parts other than the fixing member 43 are masked with a light-shielding mask, and mask exposure is performed with ultraviolet rays. As the fixing member 43, a photo-radical curable resin having high sensitivity is adopted, and the UV light amount can be cured with a relatively low light amount of about 2000 mJ or less.

In the next step S27, the sealing material 4
1 is heat-cured. For example, by applying heat of about 180 degrees Celsius to the seal material 41, the seal material 41 is firmly and fully cured.

In the embodiment configured as described above, in the curing step, temporary curing using UV and main curing by heat are performed. In the temporary curing, the fixing member 43 is cured in a short time with a relatively low light amount while performing the alignment. Thereby, the cell thickness and the assembly accuracy can be controlled with high accuracy. The seal material 41 is formed inside the fixing member 43, and therefore the inner edge of the fixing member 43 is separated from the pixel edge by at least 500 μm or more.

During mask exposure, ultraviolet rays are irradiated to the outside of the mask by about 200 μm. But,
Even in this case, the distance from the fixing member 43 to the pixel edge is about 50.
Since they are separated by 0 μm or more, the ultraviolet rays used for the exposure are not applied to the pixel area. That is, the leak light is not applied to the pixel area during the temporary curing.

The main curing of the sealing material 41 is performed by heat curing. Due to heat curing, the sealing material 41 becomes TF
The T substrate and the counter substrate are firmly fixed to each other. In addition, since UV curing is not adopted, UV light is not applied to the pixel area even during main curing.

As described above, in the present embodiment, the UV curing is performed on the fixing member at the position sufficiently separated from the pixel area in the temporary curing, which enables the curing for a short time with high alignment accuracy. In the main curing, the thermosetting with respect to the sealing material enables fixation with sufficient adhesive strength. As a result, it is possible to obtain a liquid crystal device in which the cell thickness and the assembly accuracy are controlled with high accuracy while avoiding the adverse effect of ultraviolet rays on the pixels.

In the above embodiment, the fixing member is formed in a band shape so as to surround the sealing material, outside all the edges of the sealing material. However, the fixing member only needs to have a strength for temporarily fixing the TFT substrate and the counter substrate, and may be formed on a part of the outer side of the sealing material. For example, it may be formed in a linear shape (wall shape) or a dot shape (columnar shape) at two locations outside the opposing sides of the sealing material. Further, for example, the fixing members may be provided at the four corners of the counter substrate if they are outside the sealing material.

7 and 8 relate to the second embodiment of the present invention, and FIG. 7 is a plan view of an element substrate such as a TFT substrate as viewed from the counter substrate side together with the respective components formed thereon. FIG. 8 shows the liquid crystal device after the assembly process of bonding the element substrate and the counter substrate and enclosing the liquid crystal, and
It is sectional drawing cut and shown in the position of A'line.

The present embodiment is an example in which the UV curing type fixing member is also used as the vertical conducting material, and the vertical conducting material is provided at the four corners of the counter substrate.

This embodiment is different from the first embodiment in that a vertical conducting material 82 is adopted instead of the fixing member 41 and the vertical conducting material 65 shown in FIGS. The sealing material 81 has the same structure as the sealing material 41 of FIGS. 3 and 4. When the sealing material is formed by the dispensing method, the four corners of the sealing material actually have a planar shape curved in an arc shape as shown in FIG. 7. At the positions of these four corners, the upper and lower conducting members 8
Place 2.

In the present embodiment, the upper and lower conducting members 82
Is also used as a UV curing type temporary fixing member. That is, as the vertical conducting material 82, a material that can be photo-cured with a low light amount and has a required vertical conducting function is adopted. As the basic composition, a photocurable base resin, a photoinitiator, and a filler having a vertical conduction function are required. A dispersant for improving the storage property of the vertical conduction agent, and a thermosetting resin for improving durability.
/ A hardening agent, a flattening agent, an adhesion imparting agent, etc. may be added.

As the upper and lower conducting members 82, the first
It can be realized by mixing the fixing member 43 in the embodiment with a filler having a conduction function.

As the filler having the vertical conduction function,
Metal plating glass beads such as gold plating, copper plating, or chrome nickel plating, glass fibers, or whiskers may be mixed with a metal component such as gold powder or silver powder, if necessary.

The upper and lower conducting members 82 are electrically connected at their upper ends to electrodes (not shown) of the counter substrate 20 via terminals 83, and at their lower ends are electrically connected to electrodes (not shown) of the element substrate 10 via terminals 84. .

The liquid crystal device according to the present embodiment includes the counter substrate 20 and the element substrate 1 by the bonding process shown in FIG.
0 is pasted together. That is, since the vertical conducting member 82 is used not only as the vertical conducting member but also as the fixing member, the step of forming the fixing member is unnecessary. Step S21,
In S31, the sealing material 81 and the vertical conducting material 82 are formed by, for example, a dispensing method.

After the element substrate 10 and the counter substrate 20 are bonded to each other in step S25, in step S32.
While performing the alignment, the upper and lower conductive materials 82 are UV-cured. In this case, a portion other than the upper and lower conducting members 82 is masked with a light-shielding mask, and mask exposure is performed with ultraviolet rays. In this temporary curing, it is possible to cure with a relatively low light amount of about 2000 mJ or less.

The upper and lower conducting members 82 electrically connect the electrodes on the element substrate 10 and the electrodes on the counter substrate 20 via the terminals 83 and 84. The upper and lower conducting members 82 are hardened in a relatively short time to temporarily fix the element substrate 10 and the counter substrate 20. This makes it possible to control the cell thickness and the assembly accuracy with high accuracy. The main curing of the sealing material 81 by heat in step S27 is the same as in the first embodiment.

As described above, in the present embodiment, the counter substrate and the element substrate are temporarily fixed by UV exposure by the vertical conducting materials provided at the four corners of the counter substrate, and the thermosetting sealing material is fully cured. The counter substrate and the element substrate are firmly fixed to each other, and the same effect as that of the first embodiment can be obtained. Furthermore, it is not necessary to newly form a fixing member on the outer side of the sealing material, which can reduce the number of steps and prevent the fixing member from restricting the degree of freedom in design.

In each of the above-described embodiments, the fixing member is arranged outside the sealing material.
However, it suffices to dispose the fixing member at a position where the pixel region is not irradiated with ultraviolet light during mask exposure. For example, when the sealing member has a relatively wide width, the fixing member may be arranged inside the sealing member. That is clear.

[0084]

As described above, according to the present invention, in addition to the sealing material for fixing the counter substrate and the element substrate, a fixing member for temporary curing is provided outside the sealing material, and the fixing member is UV.
By using the curable type and the thermosetting type sealing material, it is possible to control the cell thickness and the assembly accuracy with high accuracy, and it is possible to avoid the adverse effect of ultraviolet rays on the pixels.

[Brief description of drawings]

FIG. 1 is a flowchart showing a manufacturing method according to a first embodiment of the present invention.

2 is an equivalent circuit diagram of various elements, wirings, etc. in a plurality of pixels forming a pixel region of a liquid crystal device in which a substrate is assembled by the manufacturing method of FIG.

FIG. 3 is a plan view of the liquid crystal device of FIG. 2 with an element substrate such as a TFT substrate and the respective components formed thereon viewed from the counter substrate side.

FIG. 4 shows a liquid crystal device after completion of an assembly process in which an element substrate and a counter substrate are bonded to each other and a liquid crystal is sealed.
Sectional drawing which cuts and shows in the position of H'line.

FIG. 5 is a cross-sectional view showing in detail a pixel configuration of a liquid crystal device.

FIG. 6 is a flowchart showing a panel assembly process.

FIG. 7 is a plan view of an element substrate such as a TFT substrate as viewed from the counter substrate side together with the constituent elements formed thereon.

FIG. 8 shows a liquid crystal device after the completion of an assembly process in which an element substrate and a counter substrate are bonded to each other and a liquid crystal is sealed.
Sectional drawing cut and shown in the position of A'line.

FIG. 9 is a flowchart showing a bonding step in the second embodiment.

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2H088 FA01 FA03 FA04 FA21 HA01                       HA02 HA03 HA04 HA08 HA14                       HA21 MA02 MA20                 2H089 LA24 NA39 NA42 NA43 NA44                       NA45 NA51 PA13 PA15 QA12                       QA16 TA01 TA02 TA04 TA07                       TA09 TA13 TA17                 2H092 GA28 GA29 JA24 JA37 JA41                       JA46 JB11 JB22 JB51 JB56                       MA10 NA25 PA01 PA02 PA04                       PA06 PA09

Claims (10)

[Claims] 1. A seal which is formed between first and second liquid crystal substrates which are arranged so as to face each other and in which a liquid crystal is sealed, and which is fixed by heat so as to fix the first and second liquid crystal substrates to each other. A material and the first and second liquid crystal substrates between the first and second liquid crystal substrates.
And a fixing member for temporarily fixing the first and second liquid crystal substrates to each other by being photo-cured, the liquid crystal device being formed at a position separated from a pixel region formed by the liquid crystal substrate. . 2. The liquid crystal device according to claim 1, wherein the fixing member is formed outside the sealing material between the first and second liquid crystal substrates. 3. The fixing member, during mask exposure,
The liquid crystal device according to claim 1, wherein leak light is formed at a position where the pixel region formed by the first and second liquid crystal substrates is not irradiated with the leak light. 4. The liquid crystal device according to claim 1, wherein the fixing member is also used as a vertical conduction member that electrically connects the first and second liquid crystal substrates to each other. 5. The liquid crystal device according to claim 1, wherein the fixing member is formed along the entire outer edge of the sealing material. 6. The liquid crystal device according to claim 1, wherein the fixing member is formed at four corners of one of the first and second liquid crystal substrates. 7. A thermosetting sealant is formed on one of the first and second liquid crystal substrates which are arranged so as to face each other and in which liquid crystal is sealed, and are constituted by the first and second liquid crystal substrates. A step of forming a photo-curing type fixing member at a position separated from the pixel region; and a step of adhering the first and second liquid crystal substrates and irradiating the fixing member with light to align the first And a temporary curing step of temporarily fixing the second liquid crystal substrate, and a step of permanently curing the sealing material with heat to fix the first and second liquid crystal substrates. Production method. 8. The method of manufacturing a liquid crystal device according to claim 7, wherein the fixing member is formed outside the sealing material between the first and second liquid crystal substrates. 9. The method of manufacturing a liquid crystal device according to claim 7, wherein the fixing member is also used as a vertical conductive material that electrically connects the first and second liquid crystal substrates to each other. . 10. An adhesive used in the manufacture of a liquid crystal device, comprising a photocurable base resin, a photoinitiator, and a filler having a conduction function.