JP2003268036A - Molding material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a material for preparing an electrical insulator having little dielectric constant and dielectric loss tangent, excellent in impact resistance, metal plating adhesiveness and smoothness and provide electric parts using the same. <P>SOLUTION: The molding material is obtained by preparing an A-B-A type block copolymer consisting of a polymer block A comprising an aromatic vinyl monomer and a polymer block B comprising a conjugated diene monomer, hydrogenating ≥90 mole% aromatic rings originating from the aromatic vinyl monomer and unsaturated bonds originating from the conjugated diene monomer to obtain a polymer having 50,000-300,000 weight average molecular weight and the conjugated diene monomer unit hydrogenated in 10-60 wt.% throughout the copolymer, purifying the copolymer to obtain the molding material containing ≤5 ppm metal. A circuit board is obtained by molding the molding material in a predetermined shape and installing a conductor layer on the surface of the board by metal plating or the like. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding material and an electric part, and more particularly, to an electric part having a small relative permittivity and dielectric loss tangent, excellent impact strength, and excellent adhesion and smoothness of plating. Material and voltage standing wave ratio (VS
The present invention relates to electric components such as circuit boards, capacitors and connectors having a small WR) and excellent appearance.

[0002]

2. Description of the Related Art Mobile communication devices such as mobile phones and GPS
(Global Positioning System) device, computer,
Resin materials are used in electronic devices such as Bluetooth; electric devices such as home appliances. Materials used for devices such as mobile phones and Bluetooth are particularly required to have electric insulation in a high frequency range. As a molding material having excellent electric insulation in a high frequency range, a cycloolefin polymer resin, and a polymer block A mainly composed of a hydrogenated aromatic vinyl monomer and having a number average molecular weight of 10,000 to 200,000, Molding comprising a block copolymer containing an ABA type triblock chain consisting of a polymer block B mainly composed of a hydrogenated conjugated diene monomer and having a number average molecular weight of 5,000 to 5,000,000 Material (JP 2000-
No. 273265) or a vinylated cyclic hydrocarbon resin and a polymer block A mainly composed of a hydrogenated aromatic vinyl monomer and having a number average molecular weight of 10,000 to 200,000.
And a block copolymer containing an ABA type triblock chain consisting of a polymer block B mainly composed of a hydrogenated conjugated diene monomer and having a number average molecular weight of 5,000 to 5,000,000. Forming material (Japanese Patent Laid-Open No. 2000-2650)
No. 19) is proposed.

These molding materials have small relative permittivity and dielectric loss tangent and are excellent in electric insulation in a high frequency range, but those molded with this material are mechanically brittle and inferior in impact resistance. there were. In addition, the plated film is easily peeled off in the molded body made of the material. For this reason, in order to increase the adhesion of the plated film with these materials, the surface is roughened to form irregularities. However, the gloss of the plated surface of the obtained molded body becomes low.

[0004]

The object of the present invention is to provide a material and a voltage standing wave for obtaining an electric component having a small relative permittivity and dielectric loss tangent, excellent impact strength, and excellent plating adhesion and smoothness. An object is to provide electric components such as a circuit board, a capacitor, and a connector having a small ratio (VSWR) and an excellent appearance. The present inventors have conducted extensive studies to achieve the above object, and as a result, have at least two segments A mainly composed of a hydrogenated aromatic vinyl monomer unit and a main hydrogenated conjugated diene monomer unit. A block copolymer α having at least one segment B
And the weight average molecular weight of the entire block copolymer (M
t) is within a specific range, and the total amount of the block copolymer α is 10
˜60 wt% hydrogenated conjugated diene monomer units, relative to the sum of unhydrogenated aromatic vinyl monomer units and hydrogenated aromatic vinyl monomer units,
The amount of non-hydrogenated aromatic vinyl monomer units is 10
The amount of the non-hydrogenated conjugated diene monomer units is 10 mol% or less with respect to the total of the non-hydrogenated conjugated diene monomer units and the hydrogenated conjugated diene monomer units. It was found that the object of the present invention can be achieved by using a molding material having a mol% or less and a metal content of 5 ppm or less, and the present invention has been completed based on this finding.

[0005]

Thus, according to the present invention, there are at least two segments A based on hydrogenated aromatic vinyl monomer units and hydrogenated conjugated diene monomer units. It is a block copolymer α having at least one segment B as a main component, and the weight average molecular weight (Mt) of the whole block copolymer α is 50,000.
˜300,000 and 1 in the whole block copolymer α
0 to 60% by weight of hydrogenated conjugated diene monomer units, relative to the sum of unhydrogenated aromatic vinyl monomer units and hydrogenated aromatic vinyl monomer units , The amount of the non-hydrogenated aromatic vinyl monomer unit is 10 mol% or less, and the total amount of the non-hydrogenated conjugated diene monomer unit and the hydrogenated conjugated diene monomer unit is And the amount of the non-hydrogenated conjugated diene monomer unit is 10 mol% or less and the metal content is 5 ppm.
The following are provided molding materials. Further, according to the present invention, there is provided an electric component having as an article an article formed of the molding material, and a circuit board having a conductor layer provided on the surface of the board formed of the molding material.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The molding material of the present invention comprises at least two segments A consisting of hydrogenated aromatic vinyl monomer units and at least one segment consisting of hydrogenated conjugated diene monomer units. A block copolymer α having B, a weight average molecular weight (Mt) of the entire block copolymer α is 50,000 to 300,000, and 10 to 60% by weight of hydrogen in the entire block copolymer α. Having a conjugated conjugated diene monomer unit, and a non-hydrogenated aromatic with respect to the total of the non-hydrogenated aromatic vinyl monomer unit and the hydrogenated aromatic vinyl monomer unit. The amount of group vinyl monomer units is 10 mol% or less,
The amount of the non-hydrogenated conjugated diene monomer unit is 10 mol% or less based on the total of the non-hydrogenated conjugated diene monomer unit and the hydrogenated conjugated diene monomer unit, The metal content is 5 ppm or less.

The block copolymer α constituting the molding material of the present invention has at least two segments A and at least one segment B.

The segment A is mainly composed of a hydrogenated aromatic vinyl monomer unit. Each segment A
The amount of hydrogenated aromatic vinyl monomer units in the
It is usually 70 to 100% by weight, preferably 80 to 100% by weight, particularly preferably 90 to 100% by weight. Also,
The total amount of hydrogenated aromatic vinyl monomer units contained in the segment A is usually 4 or less based on the total amount of the block copolymer.
It is from 0 to 90% by weight, preferably from 50 to 88% by weight, particularly preferably from 60 to 85% by weight. The total amount of the segment A is usually 40 to 9 based on the whole block copolymer α.
It is 0% by weight, preferably 50 to 88% by weight, particularly preferably 60 to 85% by weight. When the total amount of the segment A is in this range, a molding material having excellent mechanical strength and heat resistance can be obtained.

Each segment A is their weight average molecule.
The amount may be the same or different. Maximum weight flat
Average molecular weight (Ma_max) Has a block
To the weight average molecular weight (Mt) of the copolymer α
_maxRatio of (Ma_max/ Mt) is preferably 0.2
˜0.85, particularly preferably 0.3 to 0.8. This
If it is within the range, a molding material with excellent mechanical strength can be obtained.
It In addition, the minimum weight average molecular weight (Ma_min) Has
The segment A has the maximum weight average molecular weight (M
a _max) To Ma_minRatio of (Ma_min/ Ma
_max) Is preferably 0.05 or more and less than 1, particularly preferably
Specifically, it is 0.1 or more and less than 0.99.

The weight average molecular weight of segment A is
When synthesizing the block copolymer by living polymerization as described below, the weight average molecular weight of the polymer before polymerizing the monomer for obtaining the segment A (if the polymer is not yet synthesized, the molecular weight is 0) and segment A
It is a value obtained from the difference from the weight average molecular weight of the polymer after the polymerization of the monomer for obtaining The weight average molecular weight of segment B is also a value determined in the same manner as the weight average molecular weight of segment A. Further, in the present invention, the weight average molecular weight is a polystyrene equivalent weight average molecular weight measured by gel permeation chromatography using tetrahydrofuran as a solvent.

The hydrogenated aromatic vinyl monomer unit constituting the segment A is usually formed by addition-polymerizing an aromatic vinyl monomer and then hydrogenating an aromatic ring. Aromatic vinyl monomers include styrene and α
-Methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2,4-diisopropylstyrene, 2,4-dimethylstyrene, 4-t-butylstyrene, 5-t-butyl-2-methylstyrene , 4-
Monochlorostyrene, dichlorostyrene, 4-monofluorostyrene, 4-phenylstyrene and the like can be mentioned.
The aromatic vinyl monomer may have a halogen, an alkoxy group, a hydroxyl group or the like as a substituent.

The hydrogenated aromatic vinyl monomer unit is
Since the structure is exactly the same as that obtained by addition-polymerizing a 6-membered alicyclic vinyl monomer, it also includes one formed by addition-polymerizing a 6-membered alicyclic vinyl monomer. Examples of the 6-membered alicyclic vinyl monomer include vinyl cyclohexane, isopropenyl cyclohexane, 3-methyl vinyl cyclohexane, 4-methyl vinyl cyclohexane,
3-methylisopropenylcyclohexane, 4-methylisopropenylvinylcyclohexane; 4-vinylcyclohexene, 4-isopropenylcyclohexene, 1-
Methyl-4-vinylcyclohexene, 2-methyl-4-
Vinylcyclohexene, 1-methyl-4-isopropenylcyclohexene, 2-methyl-4-isopropenylcyclohexene and the like can be mentioned. The 6-membered alicyclic vinyl monomer may have a halogen, an alkoxy group, a hydroxyl group or the like as a substituent.

Other monomer units constituting the segment A include hydrogenated conjugated diene monomer units, which will be described later; non-hydrogenated aromatic vinyl monomer units; acrylonitrile, methacrylonitrile, 1 -Cyano-1-
Monomer unit obtained by addition-polymerizing ethylenically unsaturated nitrile monomer such as chloroethylene; methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, methyl acrylate, ethyl acrylate, acrylic acid Monomer units obtained by addition-polymerizing (meth) acrylic acid ester monomers such as propyl, butyl acrylate, and 2-ethylhexyl acrylate; ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, and maleic anhydride. Monomer unit obtained by addition polymerization of acid; 1
-Hydrocarbonyl ethylene, 2-hydrocarbonyl-
Examples thereof include monomer units obtained by addition-polymerizing other vinyl monomers such as propene, 1-methylcarbonylethylene, 2-methylcarbonyl-propene and N-phenylmaleimide. Of these, hydrogenated conjugated diene monomer units are preferred.

The segment B is mainly composed of a hydrogenated conjugated diene monomer unit. The amount of the hydrogenated conjugated diene monomer unit in each segment B is usually 40 to
100% by weight, preferably 50 to 100% by weight, particularly preferably 60 to 100% by weight. The total amount of the hydrogenated conjugated diene monomer unit in each segment B is 10 to 60% by weight, preferably 12% by weight based on the whole block copolymer.
-50% by weight, particularly preferably 15-40% by weight.

The hydrogenated conjugated diene monomer unit constituting the segment B is usually formed by addition-polymerizing the conjugated diene monomer and then hydrogenating the unsaturated bond portion. Examples of the conjugated diene monomer include 1,3-butadiene, isoprene, chloroprene and 2,3-dimethyl-1,3-butadiene. Among them 1,3-
Butadiene and isoprene are preferred. Since the hydrogenated conjugated diene monomer unit has the same structure as that obtained by addition-polymerizing an alkene such as ethylene, propylene, butene, it also includes one formed by addition-polymerizing an alkene.

Other monomer units constituting the segment B include the above-mentioned hydrogenated aromatic vinyl monomer units; non-hydrogenated conjugated diene monomer units; ethylenically unsaturated nitrile units. Unit obtained by addition-polymerizing a polymer; a monomer unit obtained by addition-polymerizing a (meth) acrylic acid ester monomer; a monomer obtained by addition-polymerizing an ethylenically unsaturated carboxylic acid Unit: a monomer unit obtained by addition-polymerizing another vinyl monomer, and the like. Of these, hydrogenated aromatic vinyl monomer units are preferred.

In the block copolymer used in the present invention, the total amount of hydrogenated conjugated diene monomer units is 10 to 60% by weight, preferably 12 to 50% by weight based on the whole block copolymer.
%, Particularly preferably 15-40% by weight. If the total amount of hydrogenated conjugated diene monomer units is too small, the mechanical strength will decrease, and if it is too large, the heat resistance will decrease. As the bonding mode of the hydrogenated conjugated diene monomer unit,
Although there is a 1,4-bond, a 1,2-bond or a 3,4-bond, the 1,4-bond is usually 10 to 95 mol%, preferably 40, in the total hydrogenated conjugated diene monomer unit. To 90 mol%, particularly preferably 50 to 85 mol%.

Further, the block copolymer used in the present invention has a weight average molecular weight (Mt) of 5
30,000 to 300,000, preferably 55,000
To 200,000, particularly preferably 60,000 to 15
It is 10,000. If the Mt is too small, the mechanical strength will be insufficient, and if it is too large, the moldability will decrease.

As the block copolymer α used in the present invention, a combination of segment A and segment B
-(B-A) _n , B-A- (B-A) _n , (A-B) _m
Examples thereof include those having a structure such as -X and (BA) _m- X. Of these, A- (BA) _n , particularly A-
Those having a structure of B-A are preferable (provided that A represents the segment A, B represents the segment B, X represents the coupling agent, respectively, and n and m represent the number of repeating units and represent natural numbers). .). It is preferable that the segment A and the segment B are clearly divided into blocks, but it may have a tapered structure in which the composition of the segment A gradually changes to the composition of the segment B.

The block copolymer α of the present invention comprises a non-hydrogenated aromatic group based on the total of non-hydrogenated aromatic vinyl monomer units and hydrogenated aromatic vinyl monomer units. The amount of the group vinyl monomer unit is 10 mol% or less, preferably 5 mol% or less, and particularly preferably 2 mol% or less. In addition, the amount of the non-hydrogenated conjugated diene monomer unit is 1 relative to the total of the non-hydrogenated conjugated diene monomer unit and the hydrogenated conjugated diene monomer unit.
It is 0 mol% or less, preferably 5 mol% or less, and particularly preferably 2 mol% or less. A large amount of non-hydrogenated aromatic vinyl monomer units or non-hydrogenated conjugated diene monomer units reduces the thermal stability.

The block copolymer used in the present invention is not particularly limited by its production method, and can be obtained by a combination of a known block copolymerization method (for example, living polymerization method) and a hydrogenation method. For example, in the case of the ABA type block copolymer α, living polymerization of a monomer (for example, styrene) for obtaining the segment A is performed, and then a monomer for obtaining the segment B (for example, isoprene) is performed. ) Is added for living polymerization, and finally segment B
It is possible to obtain the block copolymer β by adding a monomer (for example, styrene) for obtaining the block copolymer to obtain the block copolymer β, and further hydrogenating the aromatic ring and the unsaturated bond. In the case of the (AB) ₂ -X type block copolymer α, a monomer for obtaining the segment A (for example, styrene) is polymerized, and then a monomer for obtaining the segment B (for example, Isoprene) is added for living polymerization, and finally a coupling agent is added for coupling to obtain a block copolymer β, which can be further obtained by hydrogenating an aromatic ring and an unsaturated bond.

A typical example of the polymerization initiator used in the polymerization for obtaining the block copolymer β is an organolithium compound, specifically, n-butyllithium, se.
Examples include monoorganolithium such as c-butyllithium, t-butyllithium, hexyllithium, and phenyllithium; dilithiomethane, 1,4-dilithiobutane, 1,4-dilithio-2-ethylcyclohexane, and the like. As the polymerization solvent, a hydrocarbon solvent such as hexane, pentane or cyclohexane is used. To further control the reaction, ethers such as diethyl ether and tetrahydrofuran; tertiary amines such as triethylamine and tetramethylethylenediamine can be added to the polymerization reaction system. Examples of the coupling agent include halogenated hydrocarbons, ester compounds, epoxy compounds, silicon tetrachloride, etc., which have been conventionally used to obtain the block copolymer β.

The hydrogenation reaction is usually carried out by adding hydrogen to the solution of the block copolymer β in the presence of a hydrogenation catalyst having the ability to hydrogenate aromatic rings. Examples of the hydrogenation catalyst include metals such as nickel, cobalt, ruthenium, rhodium, platinum, and palladium, or oxides, salts, and complexes thereof; and those having these supported on a carrier such as activated carbon, diatomaceous earth, alumina, or silica. To be The hydrogenation reaction is usually carried out at a pressure of normal pressure to 250 kgf / cm ² at 50
Perform at a temperature of ~ 200 ° C. Examples of the solvent used in the hydrogenation reaction include saturated hydrocarbons such as cyclohexane, methylcyclohexane, n-octane, decalin and tetralin. Further, in order to accelerate the hydrogenation reaction, 0.5% alcohol or ether is added to 100 parts by weight of the solvent.
It is preferable to add 5 to 5 parts by weight.

The block copolymer α used in the present invention is 90 mol% or more, preferably 95 mol% or more, and particularly preferably 98 mol% of the aromatic ring derived from the aromatic vinyl monomer in the block copolymer β. The above is hydrogenated. Further, 90 mol% or more, preferably 95 mol% or more of the unsaturated bond derived from the conjugated diene monomer in the block copolymer β,
Particularly preferably, 98 mol% or more is hydrogenated.

The molding material of the present invention may contain a soft polymer. The soft polymer has a glass transition temperature of 30 ° C. or lower, and preferably has rubber elasticity. In the case of one having a glass transition temperature of 2 or more, the lowest value among a plurality of glass transition temperatures is 30 ° C. or less. Specifically, natural rubber, polybutadiene, polyisoprene, polyisobutylene, neoprene, polysulfide rubber, thiochol rubber, acrylic rubber, urethane rubber, silicone rubber, epichlorohydrin rubber, styrene-butadiene block copolymer, styrene-butadiene block copolymer. Polymer main chain hydride (SEB), styrene-butadiene-styrene block copolymer (SB
S), a main chain hydride of a styrene-butadiene-styrene block copolymer (= styrene-ethylene-butylene-
Styrene block copolymer [SEBS]), styrene-
Main chain hydride (SEP) of isoprene block copolymer, styrene-isoprene block copolymer, styrene-
Isoprene-styrene block copolymer (SIS), main chain hydride of styrene-isoprene-styrene block copolymer (= styrene-ethylene-propylene-styrene block copolymer [SEPS]); ethylene propylene rubber (EPM), Ethylene propylene diene rubber (E
PDM), ethylene-butene copolymer, ethylene-octene copolymer, olefin rubber such as linear low-density polyethylene elastomer; butadiene-acrylonitrile-styrene-core shell rubber (ABS),

Methyl methacrylate-butadiene-styrene-core shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene-core shell rubber (MAS), octyl acrylate-butadiene-styrene-core shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile- Examples thereof include core-shell type particulate elastic bodies such as styrene-core-shell rubber (AABS), butadiene-styrene-core-shell rubber, and siloxane-containing core-shell rubber such as methyl methacrylate-butyl acrylate-siloxane, and rubbers obtained by modifying these. Among these soft polymers, SEBS and SEPS are preferable in the present invention in terms of heat resistance, dielectric properties, surface gloss and the like. The soft polymer usually has a metal content of preferably 50 ppm or less, and particularly preferably 30 ppm or less. The amount of the soft polymer Y is usually 1 to 70 parts by weight, preferably 5 to 60 parts by weight, based on 100 parts by weight of the block copolymer. When the content is in this range, the adhesion and smoothness of plating can be easily balanced.

In the molding material of the present invention, the block copolymer and the soft polymer are mixed to form a continuous phase and a dispersed phase, and the mixing conditions are adjusted to form a continuous phase of the block copolymer. It is preferable that the dispersed phase composed of a soft polymer is dispersed. The dispersed phase is dispersed in the form of particles, and the number average particle diameter d of the dispersed particles is usually 0.01 to 10 μm, preferably 0.02 to 7 μm, and particularly preferably 0.05 to 3 μm.
Is. When the molding material has such a structure, it is possible to obtain an electric component having high impact strength, excellent adhesion and smoothness of plating, and a small voltage standing wave ratio (VSWR). The average distance T between the dispersed particles of the molding material is usually 5 μm or less, preferably 2 μm or less. The number average particle diameter d and the average distance T are values obtained by the method described below.

In order to obtain the above-mentioned dispersed state, the block copolymer and the soft polymer are kneaded at a temperature of 210 ° C. or higher with a twin-screw extruder or the like. Further, it is preferable to remove oxygen dissolved in the block copolymer before mixing the block copolymer and the soft polymer. As one of the methods for removing dissolved oxygen, there is a method of performing heat treatment for about 6 minutes to 100 hours in a range from a temperature 60 ° C lower than the glass transition temperature of the block copolymer to a temperature 5 ° C higher than the glass transition temperature. Can be mentioned. It is preferable to reduce the surrounding oxygen concentration during the heat treatment. For example, by feeding an inert gas such as helium, or less than 15 torr, preferably less than 8 torr, more preferably 1 t.
By reducing the pressure below orr, the ambient oxygen concentration is reduced to 5
It is reduced to not more than 3% by volume, preferably not more than 1% by volume, more preferably not more than 1% by volume.

The molding material of the present invention has a total metal content of 5 p.
It is pm or less, preferably 4 ppm or less. As target metals, magnesium, calcium; lithium, potassium, sodium; ruthenium, rhodium, palladium,
Platinum, nickel, tungsten, chromium, cobalt, titanium, iron, cadmium, zirconium, aluminum,
Measure silicon. When the total metal content is in this range, an electric component having a small VSWR value can be obtained. The metal content is a value obtained by the method described below.

In order to obtain the molding material of the present invention, a hydrogenation catalyst for producing a block copolymer is used which is substantially free of particles having a particle size of 0.2 μm or less. If necessary, a solution of a block copolymer or the like is adsorbed and removed of a metal or the like through a column packed with an adsorbent such as diatomaceous earth, alumina or zeolite. The pore volume of the adsorbent is usually 0.5 cm ³ / g or more, preferably 0.75.
A material having a cm ³ / g or more is used.

The electrical component of the present invention has a component formed of the molding material. A compounding agent may be added to the molding material when the component is formed of the molding material. In a preferred embodiment of the present invention, the metal content is 5 ppm even after adding the compounding agent to the molding material of the present invention.
The following is preferable. As the compounding agent, an adhesion modifier, an inorganic or organic filler, a flame retardant, a heat resistance stabilizer (antioxidant), a leveling agent, a thixotropic agent, an antistatic agent, a slip agent, an antiblocking agent, an antifogging agent, Lubricants, natural oils, synthetic oils, waxes, emulsions, hydroquinone, hydroquinone monomethyl ether, thermal polymerization inhibitors such as t-butylcatechol, phenothiazine, thickeners such as organic bentonite and montmorillonite, silicone-based, fluorine-based, polymer-based Examples of the antifoaming agent, the dielectric constant adjusting agent, and the like, and the mixing ratio thereof are appropriately selected within the range not impairing the object of the present invention.

Examples of the adhesion modifier include 2-mercaptopropionic acid and trimethylpropane tris (2-
Thiopropionate), 2-mercaptoethanol, 2
-Aminothiophenol, 3-mercapto-1,2,4
Examples thereof include mercapto compounds such as triazole, 3-mercaptopropyltrimethoxysilane, and triazinethiol. These adhesion modifiers can be used alone or in combination of two or more. The blending amount of the block copolymer 100
Normally 0.1 to 50 parts by weight, preferably 1
The range is from 10 to 10 parts by weight.

Examples of the filler include fluorinated polyethylene resin, melamine resin, styrene / divinylbenzene copolymer, acrylic resin and crosslinked particles thereof; glass fiber, carbon fiber, barium sulfate, barium titanate. , Silicon oxide powder, finely divided silicon oxide, amorphous silica, crystalline silica, fused silica, spherical silica, carbon black, graphite, talc, clay, mica,
Examples thereof include magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, oxysulfate, tin oxide, alumina, kaolin, silicon carbide, metal powder, glass powder, glass flakes and glass beads. You may use what was surface-treated as these fillers. The coupling agent used for the surface treatment is used to improve the dispersibility of the filler, and is any of the conventionally known ones such as so-called silane coupling agents and titanium coupling agents. Can be selected and used.

A fibrous or particulate filler having a small dielectric loss tangent, specifically, barium titanate, strontium titanate, calcium titanate, barium strontium titanate, amorphous titanium oxide and an alkaline earth metal titanate. Complexes, lead zirconate titanate; calcium silicates such as wollastonite and xonotlite; magnesium borate, aluminum borate, zinc silicate, etc. can be finely adjusted in the dielectric constant of the molding material by blending these. . The blending amount of the filler is 100 block copolymer.
0.1 to 100 parts by weight, preferably 1
-80 parts by weight, more preferably 5-60 parts by weight.

Examples of the flame retardant include phosphorus flame retardants, nitrogen flame retardants, halogen flame retardants, and the like, and preferably phosphorus flame retardants. Examples of phosphorus-based flame retardants include triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate,
Octyl diphenyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, resorcinol bis (diphenyl) phosphate, 2-ethylhexyl diphenyl phosphate, dimethyl methyl phosphate, triallyl phosphate, diethyl bis (hydroxyethyl) aminomethyl phosphate, condensed phosphate ester, etc. A phosphoric acid ester compound such as;

Phosphoric acid, phosphonic acid, phosphinic acid, metaphosphoric acid, diphosphoric acid, sodium phosphinate monohydrate,
Sodium phosphonate pentahydrate, sodium hydrogen phosphonate 2.5 hydrate, sodium phosphate dodecahydrate, disodium hydrogen phosphate, disodium hydrogen phosphate dodecahydrate, sodium dihydrogen phosphate Monohydrate, sodium dihydrogen phosphate dihydrate, sodium hypophosphate decahydrate, sodium diphosphate decahydrate, sodium diphosphate decahydrate, disodium dihydrogen diphosphate, Disodium dihydrogen diphosphate hexahydrate, sodium triphosphate, cyclo-
Sodium tetraphosphate, potassium phosphinate, potassium phosphonate, potassium hydrogen phosphonate, potassium phosphate, dipotassium hydrogen phosphate, potassium dihydrogen phosphate, potassium diphosphate trihydrate, potassium metaphosphate, red phosphorus, etc. An inorganic phosphorus compound such as;

Phosphate compounds such as ammonium polyphosphate, melamine polyphosphate, polysulfate sulfate, guanidine phosphate and guanylurea phosphate; diphenyl phosphate ester-2-propenylamide, diphenyl phosphate ester-2-hydroxy Ethylamide, diphenylphosphoric acid ester-di (2-hydroxyethyl) amide, diphenylphosphoric acid ester-di-2-cyanoethylamide, diphenylphosphoric acid ester-p-hydroxyphenylamide, diphenylphosphoric acid ester-m-hydroxyphenylamide A phosphoric acid ester amide compound such as diphenyl phosphoric acid ester-cyclohexyl amide;

Phosphoric acid amide compounds such as phenylphosphoric acid ester-di-N, N-phenylmethylamide and phenylphosphoric acid ester-N-cyclohexylamide; and the like. Of these, phosphorus-based flame retardants containing no halogen element are preferable, and phosphoric acid ester amide compounds or phosphoric acid amide compounds containing no halogen element are particularly preferable. The amount of flame retardant used is the same as block copolymer 1
It is usually 1 to 100 parts by weight, preferably 5 to 60 parts by weight, relative to 00 parts by weight.

The colorant is not particularly limited, but examples thereof include azo pigments such as monoazo, diazo and polyazo, isoindolinone, Hansa yellow, slen yellow, permanent yellow, yellow lead, yellow iron oxide, cadmium yellow and titanium. Yellow colorants such as yellow, nickel titanium yellow, antimony yellow, etc .; quinacdrine red, crystal violet, permanent red, valve hull, vermilion,
Red colorants such as cadmium red and chrome permillion; phthalocyanine blue, phthalocyanine green,
Blue-based coloring agents such as iodin green, induslen blue, ultramarine blue, navy blue, cobalt blue; black-based coloring agents such as aniline black, carbon black, naphthalene black; white-based coloring such as titanium dioxide, zinc white, antimony trioxide, etc. Agents; and the like. These colorants may be used alone or in combination of two or more depending on the purpose of use. The blending amount is 0.01 to 100 parts by weight, preferably 0.1 to 80 parts by weight, and more preferably 1 to 50 parts by weight with respect to 100 parts by weight of the block copolymer.
The range is parts by weight.

Other resins may be blended with the molding material of the present invention. Typical other resins include linear high-density polyethylene, high-pressure low-density polyethylene, isotactic polypropylene, syndiotactic polypropylene, block polypropylene, random polypropylene, polybutene, 1,2-polybutadiene, and poly-4-methylpentene. Polyolefin resins used: atactic polystyrene, isotactic polystyrene, syndiotactic polystyrene, HIPS, A
S, styrene-methacrylic acid copolymer, styrene-methacrylic acid alkyl ester copolymer, styrene-methacrylic acid glycidyl ester copolymer, styrene-acrylic acid copolymer, styrene-acrylic acid alkyl ester copolymer, styrene- Maleic acid copolymer, styrene-
Polystyrene resin represented by fumaric acid copolymer;

Polyester resins represented by polycarbonate, polyethylene terephthalate and polybutylene terephthalate; polyamide resins represented by nylon 6, nylon 6,6; polyphenylene ether, polyarylene sulfide; poly-4-fluoroethylene (P
Fluorinated polyethylene resins such as TFE), addition polymers of norbornene monomers and olefins, addition polymers of norbornene monomers, ring-opening polymers of norbornene monomers and hydrides thereof; Can be mentioned. Among these, polyolefins such as polyethylene and polypropylene or polyphenylene ethers are preferable. The norbornene-based monomer is a polycyclic unsaturated hydrocarbon such as norbornene, dicyclopentadiene or tetracyclododecene obtained by an addition reaction of cyclopentadiene and an olefin, and an alkyl-substituted product thereof; It refers to a polycyclic unsaturated hydrocarbon derivative such as a polar group-substituted product such as a group, an acid anhydride group, an epoxy group, an amide group, and an ester group.

The molding material may be pelletized or powdered by mixing the above-mentioned compounding agents as necessary. The mixing method is not particularly limited, and for example, a molding material and a compounding agent that is compounded as necessary may be mixed, melt-kneaded, and pelletized or powdered by an extruder such as a pelletizer.

Examples of constituent articles formed of the molding material include substrates for antennas and electric circuit boards, electric insulating films for capacitors, electric insulating parts for connectors, and electric insulating films for batteries. The molding method performed to form the components of the electric component with the molding material is not particularly limited, and includes injection molding method, press molding method, extrusion molding method, cast molding method,
Examples thereof include insert molding method and blow molding method.

A circuit board as one of the electric parts of the present invention is provided on the surface of the board, which is a board in which the molding material is formed into a sheet shape, a plate shape, a box shape, a round bar shape, a square bar shape, or the like. And a conductive layer. The conductor layer is formed of a conductive material such as metal. Specific examples of the conductive material include conductive metals such as copper, aluminum, silver and gold, and conductive oxides such as ITO (indium tin oxide). Of these, gold,
Silver and copper are preferable. As a method of forming a conductor layer or the like, a method of plating a substrate obtained by molding the molding material or a method of attaching a substance that can be a conductor layer to the substrate using an inkjet device (for example, Japanese Patent Laid-Open No. 9- 2015
No. 66, JP-A No. 11-96326, etc.),
A so-called insert molding method in which a metal plate or the like is arranged and molded when molding the molding material can be mentioned. By using the molding material of the present invention, the surface glossiness Gs of the conductor layer formed by plating becomes extremely high.

The method of manufacturing the circuit board is not particularly limited. For example, a step of forming the molding material on a board having a predetermined shape, and exposing a surface portion of the surface of the board on which a conductor layer is to be formed, A step of forming a mask on the substrate so as to cover other surface portions, a step of etching the surface of the mask and the surface of the substrate exposed from the mask, a catalyst for electroless plating on the etched surface And a step of removing the mask from the substrate, and a step of forming a conductor layer having a predetermined pattern on the surface of the substrate from which the mask has been removed by electroless plating. By this manufacturing method, it is possible to form the conductor layer having the high surface gloss as described above.

The method of manufacturing the circuit board will be described in more detail. First, in the first step, the molding material is charged into an injection molding machine, and the molding material is injected into the cavity with the mold closed to perform molding. A cubic substrate having a predetermined shape is formed by injection molding. Next, in the second step, of the surface of the substrate, a mask is formed on the substrate so as to expose a surface portion on which a conductor layer having a predetermined pattern is to be formed and to cover the other surface portion. . The material of the mask is preferably an elastomer that exhibits elasticity at room temperature and can be easily bent, and particularly preferably an adhesive strength that shows weak compatibility at the contact interface between the substrate and the mask and does not allow liquid to enter. Is maintained.

Specifically, a thermoplastic polyester elastomer such as "Hytrel # SB704" (trade name) manufactured by Toray-Dupont, styrene-isoprene-styrene block copolymer, styrene-butadiene-styrene block copolymer are used. Examples thereof include thermoplastic polystyrene elastomers such as coalesced products and styrene-ethylene-butylene-styrene block copolymers. The mask is obtained, for example, by injection molding so as to cover the surface of the substrate, or by dissolving the mask material in a solvent, applying the solution, and drying. In the third step, the mask and the surface of the substrate exposed from this mask are etched. As an example of this etching process, caustic soda or caustic potash is used at a predetermined concentration (for example, 45 wt%).
Alkaline aqueous solution dissolved in a predetermined temperature (for example 50 ~
90 ° C.) and immersing the substrate covered with the mask in the mask for a predetermined time (for example, 30 minutes), or a mask containing a mixed solution of chromic anhydride and concentrated sulfuric acid (50 to 90 ° C.). A method of immersing the exposed substrate for about 3 to 20 minutes can be mentioned.

In the fourth step, an electroless plating catalyst is attached to the etched surface to form a catalyst application surface. For example, the substrate obtained in the third step is dipped in a catalyst solution containing tin and palladium, and then dipped in an acid such as hydrochloric acid and sulfuric acid to deposit palladium on the surface. Alternatively, a relatively strong reducing agent such as stannous chloride is adsorbed on the surface and then immersed in a catalyst solution containing a noble metal ion such as gold to deposit gold on the surface. The temperature of the catalyst solution is 15 to 23 ° C., and the immersion time is about 5 minutes. In this way, the catalyst is applied to the etched surface. The fifth step is a step of drying the substrate immersed in the catalyst solution and then removing the mask from the substrate. This can be done manually, but mask removal equipment may be used to facilitate this removal operation. It should be noted that the work of removing the mask is facilitated by selecting the material of the mask from those having weak adhesion to the material of the substrate. Finally, in the sixth step, the substrate is electroless plated. By this step, the plating layer is formed only on the catalyst application surface, and the circuit board is obtained. The order of the fifth step and the sixth step may be reversed. That is, after the substrate immersed in the catalyst solution is dried, electroless plating is performed to form a plating film (conductor layer) on the unmasked portion, and then the mask is removed.

The electric component of the present invention can be used for various purposes. For example, circuit wiring boards, antennas, antenna terminals, coaxial connectors, high-frequency components such as connectors,
It can be used for a heating device such as a microwave oven using a high frequency. Of these, application to an antenna, particularly application to a built-in antenna such as a mobile phone, PHS, and Bluetooth is suitable. Other antennas such as inverted F antennas for base stations, flat antennas, patch antennas, satellite parabola antennas, GPS antennas, satellites for sanitary communication, Cassegrain antennas, etc.
An antenna for C, an antenna for ITS, etc. are mentioned. Furthermore, it can be applied to a dielectric lens or the like that converts the wavefront of a radio wave from a spherical wave to a plane wave.

[0050]

EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples. In addition, "part" is "part by weight" unless otherwise specified. [Evaluation method] Metal content: Magnesium, calcium; lithium, potassium, sodium; ruthenium, rhodium, palladium, platinum, nickel, tungsten, chromium, cobalt, titanium by inductively coupled plasma emission spectrometry after wet ashing The contents of iron, cadmium, zirconium, aluminum and silicon were measured and the total amount was determined. Number average particle diameter d of dispersed particles: The shaped molding material is sliced to a thickness of about 0.05 μm, then stained with ruthenium tetroxide, and observed with a transmission electron microscope to randomly disperse particles to 100. Individual particles were selected, the major axis and the minor axis were measured, (major axis + minor axis) / 2 was taken as the particle diameter of the dispersed particles, and the number average particle diameter was calculated. Average distance T between dispersed particles: Calculated by the following formula based on the number average particle diameter d determined by the above method and the volume fraction φ of dispersed particles measured by the electron microscope observation. T = d × {(π / (6φ)) ^1/3 −1}}

Tensile elongation at break: Measured according to JIS K 7113. IZOD impact strength: measured according to JIS K 7110. Specific permittivity and loss tangent: Measured according to JIS K 6911. Plating adhesion: Using a cutter blade, make a rectangular cut with a width of 1 cm into the plating film to the depth of reaching the substrate,
A 180-degree peel test was performed from the edge of the strip. Surface gloss: The gloss at a ray angle of 60 degrees was measured. Voltage standing wave ratio: Measured according to JIS C 5402 5.6. The measurement frequency is 4 GHz.

Example 1 In a nitrogen-substituted polymerization vessel, 500 parts of cyclohexane dehydrated by molecular sieve, 0.66 part of n-dibutyl ether and n-butyllithium (15%) were used.
0.36 parts of a cyclohexane solution) was added, and the mixture was heated to 60 ° C. with stirring. Next, 60 parts of styrene treated with an alumina adsorbent was added at a rate of 50 kg / h, and the temperature was maintained at 60 ° C to carry out a polymerization reaction. Thirty minutes after the addition of styrene was completed, 15 parts of isoprene treated with an alumina adsorbent was added at a rate of 30 kg / h to continue the polymerization reaction. Thirty minutes after the completion of the addition of isoprene, 25 parts of styrene treated with an alumina adsorbent was added at a rate of 50 kg / h to continue the polymerization reaction. 30 minutes after the end of the second addition of styrene, isopropyl alcohol 0.3
Part was added to stop the reaction to obtain a copolymer. The weight average molecular weight (Mw) of this copolymer was 106000. In addition, the polymerization conversion rates of styrene and isoprene used in the polymerization reaction were both 100%,
The weight ratio of the total of the segment A derived from styrene to the segment B derived from isoprene was 85:15. The weight average molecular weight of the polymer just before the addition of isoprene is 6
3,600, the weight average molecular weight of the polymer just before the second addition of styrene was 79,500. Therefore, the Mw of the segment A formed by the first addition of styrene was 6360
The Mw of the segment A formed by the styrene addition for the second time is 26,500. Ma _max is 63600.

(Hydrogenation) Next, the above copolymer solution was transferred to a pressure resistant reactor equipped with a stirrer, and 8 parts of a silica-alumina-supported nickel catalyst (manufactured by JGC Chemical Co., Ltd .; E22U, nickel supported amount 60%). Was added and mixed. The inside of the reactor was replaced with hydrogen gas, hydrogen was supplied while stirring the solution, and a hydrogenation reaction was performed at a temperature of 170 ° C. and a pressure of 4.5 Mpa for 6 hours to obtain a block copolymer.

(Purification) 800 parts of cyclohexane solution containing 97 parts of this block copolymer was added to a pore volume of 0.8 cm.
Inner diameter 10c filled with 4.5 parts of ³ / g activated alumina
It was passed through a column having a length of m and a length of 100 cm for a residence time of 100 seconds and circulated for 24 hours. Then, it was poured into 2500 parts of isopropyl alcohol with stirring to coagulate the block copolymer. The solidified block copolymer was collected by filtration, washed twice with 430 parts of isopropyl alcohol, and then dried in a rotary vacuum dryer at 5 torr and 1
It was dried at 00 ° C. for 48 hours, and 78 parts of a purified block copolymer was recovered.

The purified block copolymer had a weight average molecular weight (Mt) of 93,000, a weight average molecular weight / number average molecular weight ratio of 1.21, and a ratio of unhydrogenated styrene units to hydrogenated styrene units. 0.8 mol% of the total of non-hydrogenated styrene units, the proportion of non-hydrogenated isoprene units was 0. 0% of the total of hydrogenated and non-hydrogenated isoprene units.
It was 5 mol%. Ma _max / Mt was 0.68. Nickel atomic weight is less than 0.1ppm (detection limit),
Aluminum atomic weight 0.21ppm, molecular weight 2000
The following resin component was 0.1%.

To 100 parts of the purified block copolymer, an antioxidant (Irganox 1010 manufactured by Ciba-Geigy) was added.
A twin-screw kneader (TEM-3 manufactured by Toshiba Machine Co., Ltd.) was added.
5B, screw diameter 37 mm, L / D = 32, screw rotation number 250 rpm, resin temperature 240 ° C., feed rate 10 kg / hour), and extruded to obtain a pelletized purified block copolymer (molding material). The pellets were put in a rotary vacuum dryer at 5 torr and 100 ° C. for 7 hours.
It was dried for 2 hours to remove dissolved oxygen. Metal content is 0.3
It was 1 ppm. The impact strength and tensile elongation at break of this molding material were measured. The results are shown in Table 1.

Injection molding (molding pressure 350 tons, resin temperature 280 ° C., mold temperature 1 using the pelletized molding material
Then, a 60 mm × 60 mm × 3 mm plate was obtained. The relative permittivity and dielectric loss tangent of this plate were measured. The results are shown in Table 1.

The plate was immersed in a neutral detergent aqueous solution at 50 ° C. for 5 minutes for degreasing, and then thoroughly washed with water. The degreased plate was chemically corroded (15 parts potassium dichromate, 100 parts sulfuric acid).
Part, 50 parts of water) at 75 ° C. for 15 minutes for etching, and then thoroughly washed. The etched plate was sensitized with 10 parts of stannous chloride, 40 parts of hydrochloric acid, 1000 parts of water.
Part) at room temperature for 3 minutes, sensitizing treatment, and then washing with water. The sensitized plate was immersed in an activator solution (1 part of palladium chloride, 10 parts of hydrochloric acid, 1000 parts of water) at room temperature for 1 minute for activation, and then washed with water.
Plating solution (15 parts of copper sulfate, 120 parts of Rossell salt, 30 parts of sodium hydroxide, 3 parts of formalin on the activated plate.
It was dipped in 0 part, 1000 parts of water) at room temperature for 10 minutes for copper plating, and finally washed sufficiently with water to obtain a plate (= circuit board) having a conductive layer formed on its surface. On this circuit board,
The surface glossiness, plating adhesion and VSWR were measured. The results are shown in Table 1. Low impact strength and weak adhesion to plating.

Comparative Example 1 The same as Example 1 except that the first addition amount of styrene was changed to 90 parts, the addition amount of isoprene was changed to 5 parts, and the styrene addition amount of 2 elucidation was changed to 5 parts. Similarly, a molding material, a board and a circuit board were obtained. The weight ratio of the total of the segment A derived from styrene to the segment B derived from isoprene in the copolymer was 95: 5. The Mw of the segment A formed by the first addition of styrene is 990.
00, segment A formed by the second addition of styrene
Has an Mw of 5,500. Ma _{m ax} was 99000. Weight average molecular weight (Mt) of purified block copolymer
Is 96,000, the ratio of the weight average molecular weight / the number average molecular weight is 1.2, and the ratio of the non-hydrogenated styrene units is 0.6 mol% of the total of the hydrogenated styrene units and the non-hydrogenated styrene units. The proportion of non-hydrogenated isoprene units was 0.2 mol% of the total of hydrogenated isoprene units and non-hydrogenated isoprene units. Ma _max / Mt was 1.03. The atomic weight of nickel was 0.1 ppm (detection limit) or less, the atomic weight of aluminum was 0.51 ppm, and the resin component having a molecular weight of 2000 or less was 0.1%. The metal content was 0.8 ppm. The evaluation results are shown in Table 1. Low impact strength, high relative permittivity and high loss tangent. Also, the surface gloss is low and VSWR
Is also high.

Comparative Example 2 In Example 1, the block copolymer solution was filtered through a filter to remove the hydrogenation catalyst instead of performing no purification after the hydrogenation reaction, and then the block copolymer 100 was used.
0.1 part of an antioxidant (Tominox TT: manufactured by Yoshitomi Fine Chemical Co., Ltd.) was added to and mixed with the parts.
The solution was stripped of solvent at 260 ° C. under reduced pressure, then extruded in an extruder and pelletized. The metal content was 12 ppm. The evaluation results are shown in Table 1.

Example 2 500 parts of cyclohexane dehydrated with a molecular sieve, 0.66 parts of n-dibutyl ether and n-butyllithium (15%) were placed in a nitrogen-substituted polymerization vessel.
0.34 parts of a cyclohexane solution) was added, and the mixture was heated to 60 ° C. with stirring. Next, 28 parts of styrene treated with an alumina adsorbent was added at a rate of 50 kg / h and the temperature was maintained at 60 ° C to carry out a polymerization reaction. Thirty minutes after the addition of styrene was completed, 7.5 parts of isoprene treated with an alumina adsorbent was added at a rate of 30 kg / h to continue the polymerization reaction. Thirty minutes after the completion of the addition of isoprene, 29 parts of styrene treated with an alumina adsorbent was added at a rate of 50 kg / h to continue the polymerization reaction. Thirty minutes after the completion of the second addition of styrene, 7.5 parts of isoprene treated with an alumina adsorbent was added at a rate of 30 kg / h to continue the polymerization reaction. Thirty minutes after the end of the second addition of isoprene, 5 parts of styrene treated with alumina adsorbent was added to 5 parts.
The polymerization reaction was continued by adding at a rate of 0 kg / h. Thirty minutes after the completion of the third addition of styrene, 0.3 part of isopropyl alcohol was added to stop the reaction and obtain a copolymer. The weight average molecular weight (Mw) of this copolymer is 12
It was 4000.

The polymerization conversion rates of styrene and isoprene used in the polymerization reaction were both 100%, and the ratio of the total of segment A derived from styrene to the segment B derived from isoprene in the copolymer was 85: 1 by weight
It was 5. The weight average molecular weight of the polymer immediately before the addition of isoprene is 34,700, the weight average molecular weight of the polymer immediately before the addition of styrene is 44,000, the weight average molecular weight of the polymer immediately before the addition of isoprene is 80,000, and the second addition of styrene. The weight average molecular weight of the polymer immediately before was 893.
It was 00. Therefore, the Mw of the segment A formed by the first addition of styrene is 34700, and the Mw of the segment A formed by the second addition of styrene is 36000.
Mw of segment A formed by the third addition of styrene
Is 34700. Ma _max is 36000.

Thereafter, hydrogenation and purification were carried out in the same manner as in Example 1 to obtain a block copolymer (molding material), a board and a circuit board. The weight average molecular weight (Mt) of the purified block copolymer was 102000, the weight average molecular weight / number average molecular weight ratio was 1.23, and the ratio of unhydrogenated styrene units was hydrogenated styrene units and hydrogenated styrene units. 0.5 mol% of the total of unhydrogenated styrene units, the proportion of non-hydrogenated isoprene units is 0,0% of the total of hydrogenated and non-hydrogenated isoprene units.
It was 1 mol%. Ma _max / Mt was 0.35. Nickel atomic weight is less than 0.1ppm (detection limit),
The atomic weight of aluminum was 0.4 ppm, and the resin component having a molecular weight of 2000 or less was 0.1%. Metal content is 0.7p
It was pm. The evaluation results are shown in Table 1.

Example 3 Purified block copolymer 1 in pellet form obtained in Example 1
20 parts of SEPS (metal content 15 ppm, number average molecular weight 60000, minimum value of glass transition temperature −58 ° C.) was added to 00 parts, and a twin-screw kneader (TEM-35B manufactured by Toshiba Machine Co., screw diameter 37 mm, L / D = 32, screw rotation speed 250 rpm, resin temperature 240 ° C., feed rate 10
(kg / hour), and the mixture was extruded to obtain a pellet-shaped molding material. The particle size of dispersed particles, the distance between dispersed particles, and the metal content of this molding material were determined. The results are shown in Table 1.

[0065]

[Table 1]

[0066]

EFFECT OF THE INVENTION The molding material of the present invention has a small relative permittivity and a small dielectric loss tangent, is excellent in impact strength, and is excellent in adhesion and smoothness of plating. Therefore, it can be used in circuit boards, connectors, capacitors, antennas, etc. It can be applied to electric parts. Generally, the voltage standing wave ratio becomes larger as the frequency becomes higher. However, the electric component formed of the molding material of the present invention has a voltage standing wave ratio (VS
WR) is small, it has an excellent appearance, and its shape does not change even when left at high temperature. Therefore, when it is applied to an antenna or the like, the peak gain is large and the resonance frequency does not change depending on the operating environment. Stable communication can be secured in mobile communication devices such as mobile phones.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C08L 101: 00) F term (reference) 4J002 AC012 AC022 AC032 AC062 AC072 AC082 AC092 AC142 BB152 BG042 BN152 BP011 BP012 BP031 CH032 CK022 CP032 CP172 GQ01 4J100 AA20P AB02P AB03P AB04P AB07P AB08P AB10P AC53P AR05P AS02Q AS03Q AS07Q BA03P BA04P BB01P BB07P BC43P CA04 DA01 DA50 DA52 DA55 DA64 HA04 HA05 HB17 HC90 HC91 HE05 HE14 HG02 HG02

Claims (6)

[Claims] 1. At least two segments A mainly composed of hydrogenated aromatic vinyl monomer units, and at least one mainly composed of hydrogenated conjugated diene monomer units.
The block copolymer α having one segment B has a weight average molecular weight (Mt) of 5 as a whole.
30,000 to 300,000, having 10 to 60% by weight of a hydrogenated conjugated diene monomer unit in the whole block copolymer α, and a non-hydrogenated aromatic vinyl monomer unit. The amount of the non-hydrogenated aromatic vinyl monomer unit is 10 mol% with respect to the total of the hydrogenated aromatic vinyl monomer unit.
The amount of the non-hydrogenated conjugated diene monomer unit is 10 mol% based on the total of the non-hydrogenated conjugated diene monomer unit and the hydrogenated conjugated diene monomer unit. A molding material having the following and a metal content of 5 ppm or less. 2. The segment A has the highest weight average molecular weight.
The value of the large one (Ma _max) And the entire block copolymer
Of the weight average molecular weight (Mt) of_{ma x}/ Mt)
Is 0.2 to 0.85, The molding material according to claim 1. 3. The molding material according to claim 1, which further comprises 1 to 70 parts by weight of a soft polymer having a glass transition temperature of 30 ° C. or lower with respect to 100 parts by weight of the block copolymer. 4. An average particle size of 0.01 to 10 μm in a dispersed phase made of a soft polymer in a continuous phase made of a block copolymer.
The molding material according to claim 3, wherein the molding material is dispersed as dispersed particles. 5. An electric component having as a component an article formed of the molding material according to claim 1. 6. A circuit board provided with a conductor layer on the surface of a board formed of the molding material according to claim 1.