JP2003261769A - Thermocompression bonding silicone rubber sheet with heat resistance and thermal conductivity - Google Patents
Thermocompression bonding silicone rubber sheet with heat resistance and thermal conductivityInfo
- Publication number
- JP2003261769A JP2003261769A JP2002066422A JP2002066422A JP2003261769A JP 2003261769 A JP2003261769 A JP 2003261769A JP 2002066422 A JP2002066422 A JP 2002066422A JP 2002066422 A JP2002066422 A JP 2002066422A JP 2003261769 A JP2003261769 A JP 2003261769A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- silicone rubber
- thermocompression bonding
- sheet
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、熱を伝えると共に
均一に圧力をかける目的で使用される耐熱熱伝導性熱圧
着用シリコーンゴムシートに関し、特に、熱時の強度低
下が小さく300℃以上の高温でも繰り返し使用するこ
との出来る、積層板やフレキシブルプリント基板の成形
に用いるシート、或は液晶ディスプレイ等の電極の接続
に用いる異方性導電膜用熱圧着シートに好適な、耐久性
に優れた耐熱熱伝導性熱圧着用シリコーンゴムシートに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding, which is used for the purpose of transmitting heat and applying a uniform pressure. Suitable for sheets that can be used repeatedly at high temperatures for forming laminated plates and flexible printed boards, or thermocompression-bonding sheets for anisotropic conductive films that are used for connecting electrodes such as liquid crystal displays. The present invention relates to a heat resistant and heat conductive silicone rubber sheet for thermocompression bonding.
【0002】[0002]
【従来の技術】熱伝導性電気絶縁材として、シリコーン
ゴムに酸化ベリリウム、酸化アルミニウム、水酸化アル
ミニウム、酸化マグネシウム、又は酸化亜鉛等粉末を配
合したシート(特開昭47−32400号参照)や、シ
リコーンゴムに窒化ホウ素を配合し網目状の絶縁材で補
強したシート(実開昭54−184074号参照)等が
従来から知られており、既に、パワートランジスタ、サ
イリスタ、整流器、トランス、或はパワーMOS FE
T等の発熱性部品の放熱絶縁用に使用されている。しか
しながら、このような材料を200℃以上の高温条件下
で使用すると、熱伝導性付与剤中の不純物やpHの影響
により、シリコーンゴムが劣化するという欠点がある。2. Description of the Related Art A sheet (see Japanese Patent Laid-Open No. 47-32400) in which powder of beryllium oxide, aluminum oxide, aluminum hydroxide, magnesium oxide, zinc oxide or the like is mixed with silicone rubber as a heat conductive electric insulating material, Sheets of silicone rubber compounded with boron nitride and reinforced with a mesh-like insulating material (see Japanese Utility Model Publication No. 54-184074) have been conventionally known, and have already been known as power transistors, thyristors, rectifiers, transformers, or power sources. MOS FE
Used for heat insulation of heat-generating components such as T. However, when such a material is used under a high temperature condition of 200 ° C. or higher, there is a drawback that the silicone rubber deteriorates due to the influence of impurities in the thermal conductivity imparting agent and the pH.
【0003】一方、プレス成形機で積層板、フレキシブ
ルプリント基板等を成形する際のシートや、液晶ディス
プレイの電極端子部と駆動回路が搭載されたフレキシブ
ルプリント基板の接続に用いる異方性導電膜を圧着機で
熱圧着する際の緩衝用シートとして、上記の熱伝導性電
気絶縁シートが用いられている。例えば、特開平5−1
98344号公報には、シリコーンゴムに窒化ホウ素を
配合しガラスクロスで補強したものが、特開平6−36
853号公報には、シリコーンゴムに窒化ホウ素と導電
性物質を配合しガラスクロスで補強して帯電防止性を付
与したシートが開示されている。しかしながら、これら
の場合には、何れも高温条件下でシリコーンゴムが劣化
するという欠点があった。それにもかかわらず、特に最
近、フレキシブルプリント基板や異方性導電膜の材質が
高温成形タイプに変わりつつある上、さらに圧着サイク
ルを短縮し生産性を向上させるために成形温度が上昇し
てきたこともあり、耐熱性と熱伝導性がより改善された
熱伝導性ゴムシートの開発が望まれるに至った。On the other hand, a sheet for forming a laminated plate, a flexible printed circuit board, etc. by a press molding machine, and an anisotropic conductive film used for connecting the electrode terminal part of the liquid crystal display and the flexible printed circuit board on which the drive circuit is mounted. The above-mentioned thermally conductive electrically insulating sheet is used as a cushioning sheet for thermocompression bonding with a pressure bonding machine. For example, Japanese Patent Laid-Open No. 5-1
In Japanese Patent No. 98344, a silicone rubber compounded with boron nitride and reinforced with glass cloth is disclosed in Japanese Patent Laid-Open No. 6-36.
Japanese Patent Publication No. 853 discloses a sheet in which boron nitride and a conductive substance are mixed in silicone rubber and reinforced with glass cloth to impart antistatic properties. However, in each of these cases, there is a drawback that the silicone rubber deteriorates under high temperature conditions. Nevertheless, especially recently, the materials for flexible printed circuit boards and anisotropic conductive films are changing to high-temperature molding types, and the molding temperature has risen in order to further shorten the pressure bonding cycle and improve productivity. Therefore, it has been desired to develop a heat conductive rubber sheet having improved heat resistance and heat conductivity.
【0004】これに対し、特開平7−11010号公報
には、熱伝導性付与剤として水分を除いた揮発分が0.
5重量%以下であるカーボンブラックを20〜150重
量部用いることにより、300℃以上の温度で使用可能
な耐熱性と良好な熱伝導性を有する耐熱熱伝導性シリコ
ーンゴムシートが提案された。しかしながら、この場合
には高温下での強度が不足する為に、連続使用により破
壊する恐れがあるという欠点があった。On the other hand, in Japanese Patent Application Laid-Open No. 7-11010, the volatile component excluding water as a thermal conductivity imparting agent is 0.
By using 20 to 150 parts by weight of carbon black in an amount of 5% by weight or less, a heat-resistant and heat-conductive silicone rubber sheet having heat resistance usable at a temperature of 300 ° C. or higher and good thermal conductivity has been proposed. However, in this case, since the strength at high temperature is insufficient, there is a drawback that it may be broken by continuous use.
【0005】また、特開平8−174765号公報に
は、上記カーボンブラック配合シリコーンゴム組成物と
耐熱性樹脂フィルムを積層した耐熱熱伝導性シリコーン
ゴム複合シートが開示されている。この場合には、強度
および離型性の点で改善されているものの、耐熱性樹脂
フィルムを使用している為にシートの柔軟性が抑制さ
れ、圧着時の圧力が不均一になる恐れがある上、300
℃以上の高温では、上記耐熱性樹脂フィルムと言えども
熱により変形しやすいので、繰り返し使用ができなくな
る可能性があるという欠点があった。Further, Japanese Patent Application Laid-Open No. 8-174765 discloses a heat and heat conductive silicone rubber composite sheet in which the above carbon black-blended silicone rubber composition and a heat resistant resin film are laminated. In this case, although the strength and the releasability are improved, the flexibility of the sheet is suppressed because the heat-resistant resin film is used, and the pressure at the time of pressure bonding may be non-uniform. Top, 300
At a high temperature of ℃ or more, even the above-mentioned heat-resistant resin film is easily deformed by heat, so there is a drawback that it may not be able to be used repeatedly.
【0006】[0006]
【発明が解決しようとする課題】そこで本発明者等は、
300℃以上という高温下で使用でき、良好な熱伝導性
を有すると共に耐久性に優れる耐熱熱伝導性熱圧着用シ
リコーンゴムシートを得る為に鋭意検討した結果、熱伝
導性付与剤として水分を除いた揮発分が0.5重量%以
下でありかつBET比表面積が100m2/g以上のカ
ーボンブラックを10〜100重量部配合したシリコー
ンゴム組成物をシート状に硬化させた場合には、良好な
結果を得ることが出来ることを見出し、本発明に到達し
た。従って本発明の目的は、300℃以上という高温下
で使用することが出来る上、良好な熱伝導性を有すると
共に耐久性にも優れた、耐熱熱伝導性熱圧着用シリコー
ンゴムシートを提供することにある。Therefore, the present inventors
As a result of diligent study to obtain a heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding, which can be used at a high temperature of 300 ° C. or more and has excellent heat conductivity and excellent durability, water was removed as a heat conductivity imparting agent. Further, when a silicone rubber composition containing 10 to 100 parts by weight of carbon black having a volatile content of 0.5% by weight or less and a BET specific surface area of 100 m 2 / g or more is cured into a sheet, good results are obtained. They have found that the results can be obtained and have reached the present invention. Accordingly, an object of the present invention is to provide a heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding, which can be used at a high temperature of 300 ° C. or higher and has good thermal conductivity and excellent durability. It is in.
【0007】[0007]
【課題を解決するための手段】本発明の上記の目的は、
シリコーンゴム組成物をシート状に成形し硬化させてな
る耐熱熱伝導性熱圧着用シリコーンゴムシートであっ
て、前記シリコーンゴム組成物が、(A)平均重合度が
200以上であるオルガノポリシロキサン:100重量
部、(B)水分を除いた揮発分が0.5重量%以下であ
りかつBET比表面積が100m2/g以上であるカー
ボンブラック:10〜100重量部、及び、(C)硬化
剤からなることを特徴とする耐熱熱伝導性熱圧着用シリ
コーンゴムシートによって達成された。The above objects of the present invention are as follows.
A heat- and heat-conductive silicone rubber sheet for thermocompression bonding, obtained by molding and curing a silicone rubber composition into a sheet, wherein the silicone rubber composition is (A) an organopolysiloxane having an average degree of polymerization of 200 or more: 100 parts by weight, (B) volatile matter excluding water content of 0.5% by weight or less and BET specific surface area of 100 m 2 / g or more: 10 to 100 parts by weight, and (C) curing agent It is achieved by a heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding.
【0008】[0008]
【発明の実施の形態】一般に、シリコーンゴムの耐熱性
は配合組成により異なり、ベースポリマーの種類、ビニ
ル基含有量、耐熱添加剤の種類、充填剤の種類などによ
って影響される。また組成物中のpH、水分あるいは不
純物の影響を受けるために、添加剤の選定には充分注意
する必要がある。また、耐熱性を向上させる充填剤とし
てカーボンブラックを用いることができるが、カーボン
ブラック中の不純物および揮発分を考慮する必要があ
る。特に、熱伝導性を良好にするためにカーボンブラッ
クを大量に添加する場合には、その揮発分が重要なポイ
ントとなる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Generally, the heat resistance of silicone rubber differs depending on the compounding composition and is influenced by the type of base polymer, vinyl group content, type of heat resistant additive, type of filler and the like. Further, since it is affected by pH, water content or impurities in the composition, it is necessary to pay sufficient attention to selection of additives. Although carbon black can be used as a filler for improving heat resistance, it is necessary to consider impurities and volatile components in carbon black. In particular, when a large amount of carbon black is added to improve the thermal conductivity, the volatile content thereof is an important point.
【0009】カーボンブラックの揮発分は表面に化学的
に吸着している酸素化合物(カルボキシル、キノン、ラ
クトン、ヒドロキシル等の酸性成分)の重量に該当する
が、加熱することによりこの酸素化合物が表面から気化
するため、シリコーンゴムの耐熱性に悪影響を与える。
従って、揮発分が0.5重量%以下のカーボンブラック
を用いることにより、300℃以上の高温下でも使用可
能な耐熱性を実現することができる。The volatile content of carbon black corresponds to the weight of oxygen compounds (acidic components such as carboxyl, quinone, lactone and hydroxyl) that are chemically adsorbed on the surface. Since it vaporizes, it adversely affects the heat resistance of the silicone rubber.
Therefore, by using carbon black having a volatile content of 0.5% by weight or less, it is possible to realize heat resistance that can be used even at a high temperature of 300 ° C. or higher.
【0010】また、シリコーンゴムの強度は補強性シリ
カを配合することにより大幅に向上するが、高温時にな
ると強度が大きく低下する。これはシリカ表面の水酸基
とシロキサンポリマーの結合が熱に弱いからであると考
えられる。そこで、本発明では、BET比表面積が10
0m2/g以上のカーボンブラックを用いることにより
高温時の強度低下を小さく抑え、熱圧着シリコーンゴム
シートとしての耐久性を向上させる。さらに、シリコー
ンゴムにカーボンブラックを配合することによりシリコ
ーンゴムシートが導電化されるので、圧着工程中に発生
する静電気が除去できるようになり、これによってゴ
ミ、ホコリ等の付着及び回路に搭載されている電子部品
の破壊を防止することができる。Further, the strength of the silicone rubber is significantly improved by blending the reinforcing silica, but the strength is greatly reduced at high temperature. It is considered that this is because the bond between the hydroxyl group on the silica surface and the siloxane polymer is weak to heat. Therefore, in the present invention, the BET specific surface area is 10
By using 0 m 2 / g or more of carbon black, the decrease in strength at high temperature is suppressed to a small extent, and the durability as a thermocompression-bonded silicone rubber sheet is improved. Furthermore, by blending the silicone rubber with carbon black, the silicone rubber sheet becomes electrically conductive, which makes it possible to eliminate static electricity generated during the crimping process. It is possible to prevent the destruction of existing electronic components.
【0011】本発明で使用する(A)成分である、平均
重合度200以上のオルガノポリシロキサンは次の平均
組成式(1)で表される。
RnSiO(4−n)/2・・・・(1) (nは1.
95〜2.05の正数)
但し、式中のRは置換または非置換の一価炭化水素基を
表し、具体的にはメチル基、エチル基、プロピル基等の
アルキル基、シクロペンチル基、シクロヘキシル基等の
シクロアルキル基、ビニル基、アリル基等のアルケニル
基、フェニル基、トリル基等のアリール基あるいはこれ
らの水素原子が部分的に塩素原子、フッ素原子などで置
換されたハロゲン化炭化水素基等が例示される。本発明
においては、一般的にはオルガノポロシロキサンの主鎖
がジメチルシロキサン単位からなるもの、あるいはこの
オルガノポリシロキサンの主鎖にビニル基、フェニル
基、トリフルオロプロピル基などを導入したものが好ま
しい。また分子鎖末端がトリオルガノシリル基または水
酸基で封鎖されたものであれば良いが、このトリオルガ
ノシリル基としては、トリメチルシリル基、ジメチルビ
ニルシリル基、トリビニルシリル基などが例示される。
なお、この成分の重合度は200以上、25℃における
粘度は300cs以上であることが好ましい。重合度が
200以下では硬化後の機械的強度が劣り、脆くなる。The organopolysiloxane having an average degree of polymerization of 200 or more, which is the component (A) used in the present invention, is represented by the following average composition formula (1). R n SiO (4-n) / 2 ···· (1) (n is 1.
However, R in the formula represents a substituted or unsubstituted monovalent hydrocarbon group, specifically, an alkyl group such as a methyl group, an ethyl group and a propyl group, a cyclopentyl group, a cyclohexyl group. Group such as cycloalkyl group, vinyl group, alkenyl group such as allyl group, aryl group such as phenyl group and tolyl group, or halogenated hydrocarbon group in which hydrogen atom thereof is partially substituted with chlorine atom, fluorine atom, etc. Etc. are illustrated. In the present invention, it is generally preferable that the main chain of the organopolysiloxane is composed of dimethylsiloxane units, or that the main chain of this organopolysiloxane has a vinyl group, a phenyl group, a trifluoropropyl group or the like introduced therein. The end of the molecular chain may be blocked with a triorganosilyl group or a hydroxyl group, and examples of the triorganosilyl group include a trimethylsilyl group, a dimethylvinylsilyl group and a trivinylsilyl group.
The degree of polymerization of this component is preferably 200 or more, and the viscosity at 25 ° C. is preferably 300 cs or more. When the degree of polymerization is 200 or less, the mechanical strength after curing is poor and the composition becomes brittle.
【0012】次に(B)成分である、水分を除いた揮発
分が0.5重量%以下であると共にBET比表面積が1
00m2/g以上のカーボンブラックは、シリコーンゴ
ムシートの耐熱性を向上させるとともに機械的強度、特
に熱時の強度を向上させ、さらに導電化による帯電防止
性を付与するものである。カーボンブラックはその製造
方法により、ファーネスブラック、チャンネルブラッ
ク、サーマルブラック、アセチレンブラック等に分類さ
れる。揮発分が0.5重量%以下のカーボンブラックと
しては、比表面積の発達したアセチレンブラックが好適
である。揮発分の測定方法はJIS K 6221の
“ゴム用カーボンブラック試験方法”に記載されてい
る。具体的にはるつぼの中にカーボンブラックを規定量
入れ、950℃で7分間加熱した後の揮発減量を測定す
る。この(B)成分の配合量は、(A)成分100重量
部に対して10〜100重量部、特に20〜80重量部
の範囲で使用することが好ましい。10重量部以下では
熱伝導性および機械的強度が不充分となり、また100
重量部以上になると配合が困難になる上、成形加工性が
極めて悪くなる。Next, the volatile component excluding water, which is the component (B), is 0.5% by weight or less, and the BET specific surface area is 1
The carbon black of 00 m 2 / g or more improves the heat resistance of the silicone rubber sheet, improves the mechanical strength, especially the strength when heated, and further imparts the antistatic property due to the conductivity. Carbon black is classified into furnace black, channel black, thermal black, acetylene black and the like depending on the manufacturing method. As the carbon black having a volatile content of 0.5% by weight or less, acetylene black having a developed specific surface area is suitable. The method for measuring volatile components is described in JIS K 6221 "Testing method for carbon black for rubber". Specifically, a specified amount of carbon black is put in a crucible, and after heating at 950 ° C. for 7 minutes, the volatilization loss is measured. The blending amount of the component (B) is preferably 10 to 100 parts by weight, more preferably 20 to 80 parts by weight based on 100 parts by weight of the component (A). If it is less than 10 parts by weight, thermal conductivity and mechanical strength will be insufficient, and 100
If the amount is more than parts by weight, the compounding becomes difficult and the moldability becomes extremely poor.
【0013】(C)成分である硬化剤は、通常シリコー
ンゴムの硬化に使用されている従来から公知のものの中
から適宜選択して使用することが出来る。このような硬
化剤としては、例えば、ラジカル反応に使用されるジ−
t−ブチルパーオキサイド、2,5−ジメチル−2,5
−ジ(t−ブチルパーオキシ)ヘキサン、ジクミルパー
オキサイドなどの有機過酸化物;付加反応硬化剤として
(A)成分のオルガノポリシロキサンがアルケニル基を
有する場合には、ケイ素原子に結合した水素原子を1分
子中に2個以上含有するオルガノハイドロジェンポリシ
ロキサンと白金族金属系触媒とからなるもの;縮合反応
硬化剤として(A)成分のオルガノポリシロキサンがシ
ラノール基を含有する場合には、アルコキシ基、アセト
キシ基、ケトオキシム基、プロペノキシ基などの加水分
解性の基を2個以上有する有機ケイ素化合物等が例示さ
れる。これらの硬化剤の添加量は、通常のシリコーンゴ
ムの場合と同様にすればよい。The curing agent which is the component (C) can be appropriately selected and used from conventionally known ones which are usually used for curing silicone rubber. As such a curing agent, for example, di-
t-Butyl peroxide, 2,5-dimethyl-2,5
-Organic peroxides such as di (t-butylperoxy) hexane and dicumyl peroxide; hydrogen bonded to a silicon atom when the organopolysiloxane of component (A) as an addition reaction curing agent has an alkenyl group A compound comprising an organohydrogenpolysiloxane having two or more atoms in one molecule and a platinum group metal-based catalyst; when the organopolysiloxane of the component (A) as a condensation reaction curing agent contains a silanol group, Examples thereof include organosilicon compounds having two or more hydrolyzable groups such as alkoxy groups, acetoxy groups, ketoxime groups and propenoxy groups. The addition amount of these curing agents may be the same as in the case of ordinary silicone rubber.
【0014】本発明においては、このシリコーンゴム組
成物に酸化セリウム粉末を添加することにより、耐熱性
を向上させることができる。上記酸化セリウムの添加量
は、(A)成分100重量部に対して0.1〜5重量部
の範囲であり、5重量部を越えると反対に耐熱性が低下
してくる。また、この酸化セリウム粉末としては、BE
T比表面積が50m2/g以上という比較的大きな比表
面積を有するものを用いることが好ましい。In the present invention, heat resistance can be improved by adding cerium oxide powder to this silicone rubber composition. The addition amount of the cerium oxide is in the range of 0.1 to 5 parts by weight with respect to 100 parts by weight of the component (A), and when it exceeds 5 parts by weight, the heat resistance is decreased. Further, as the cerium oxide powder, BE
It is preferable to use one having a relatively large specific surface area of T specific surface area of 50 m 2 / g or more.
【0015】本発明においては、熱伝導性を良好なもの
とする為に、前記した(B)成分のカーボンブラックに
加え、他の熱伝導性充填剤を添加することが好ましい。
このような熱伝導性充填剤としては、酸化アルミニウ
ム、窒化ホウ素、窒化アルミニウム、水酸化アルミニウ
ム、酸化マグネシウム、酸化亜鉛、石英等の無機粉末、
あるいは銀、ニッケル、銅、鉄等の金属粉末等が好適で
ある。これらの熱伝送性充填剤の配合量はオルガノポリ
シロキサン100重量部に対して50〜2,000重量
部であることが好ましく、特に100〜1,600重量
部の範囲で使用することが好ましい。50重量部以下で
は熱伝導性が不充分となり、また2,000重量部を越
えると成形加工性が悪くなって、硬化後の機械的強度が
低くなると共にゴムの柔軟性がなくなる。また、シリコ
ーンゴム組成物の熱伝導率は、伝熱媒体として効率よく
熱を伝えるという観点から、0.5W/mK以上である
ことが好ましい。In the present invention, in order to improve the thermal conductivity, it is preferable to add other thermally conductive fillers in addition to the carbon black as the component (B).
Such heat conductive fillers include inorganic powders such as aluminum oxide, boron nitride, aluminum nitride, aluminum hydroxide, magnesium oxide, zinc oxide, and quartz.
Alternatively, a metal powder of silver, nickel, copper, iron or the like is suitable. The blending amount of these heat-transmitting fillers is preferably 50 to 2,000 parts by weight, and particularly preferably 100 to 1,600 parts by weight, based on 100 parts by weight of the organopolysiloxane. If it is less than 50 parts by weight, the thermal conductivity will be insufficient, and if it exceeds 2,000 parts by weight, the moldability will be poor and the mechanical strength after curing will be low and the flexibility of the rubber will be lost. Further, the thermal conductivity of the silicone rubber composition is preferably 0.5 W / mK or more from the viewpoint of efficiently transmitting heat as a heat transfer medium.
【0016】本発明においては、その他、シリコーンゴ
ム組成物中に、必要に応じて親水性シリカ、疎水性シリ
カ等の補強性シリカ充填剤、クレイ、炭酸カルシウム、
けいそう土、二酸化チタン等の充填剤、低分子シロキサ
ンエステル、シラノール等の分散剤、シランカップリン
グ剤、チタンカップリング剤等の接着付与剤、難燃性を
付与させる白金族金属系触媒、ゴムコンパウンドのグリ
ーン強度を上げるテトラフルオロポリエチレン粒子など
を添加してもよい。In the present invention, in addition, a reinforcing silica filler such as hydrophilic silica or hydrophobic silica, clay, calcium carbonate, and
Diatomaceous earth, fillers such as titanium dioxide, low molecular weight siloxane esters, dispersants such as silanol, silane coupling agents, adhesion promoters such as titanium coupling agents, platinum group metal catalysts that impart flame retardancy, rubber Tetrafluoropolyethylene particles which increase the green strength of the compound may be added.
【0017】本発明のシリコーンゴム組成物の配合は、
上記成分を二本ロール、ニーダー、バンバリーミキサ
ー、プラネタリーミキサー等の混合機を用いて混練りす
ればよいが、一般的には硬化剤だけを使用する直前に添
加することが好ましい。また、本発明のシリコーンゴム
シートの成形方法としては、硬化剤までを配合したシリ
コーンゴム組成物をカレンダーあるいは押出し機で所定
の厚さに分出してから硬化させる方法、液状のシリコー
ンゴム組成物あるいはトルエン等の溶剤に溶解して液状
化したシリコーンゴム組成物をフィルム上にコーティン
グしてから硬化させる方法等があげられる。このように
して成形したシリコーンゴムシートの厚さは0.1〜1
0mmの範囲であることが好ましい。厚さ0.1mm以
下では被圧着体に充分追従できないので圧力のかかり方
が不均一となり易く、10mm以上の厚さになると熱の
伝わり方が悪くなる。The composition of the silicone rubber composition of the present invention is
The above components may be kneaded using a mixer such as a two-roll mill, a kneader, a Banbury mixer, a planetary mixer or the like, but it is generally preferable to add the curing agent just before using it. Further, as a method for molding the silicone rubber sheet of the present invention, a silicone rubber composition containing a curing agent is dispensed to a predetermined thickness with a calendar or an extruder and then cured, a liquid silicone rubber composition or Examples include a method in which a film is coated with a liquefied silicone rubber composition dissolved in a solvent such as toluene and then cured. The silicone rubber sheet molded in this way has a thickness of 0.1 to 1
It is preferably in the range of 0 mm. If the thickness is 0.1 mm or less, the pressure-bonded body cannot be sufficiently followed, so that the pressure is apt to be unevenly distributed, and if the thickness is 10 mm or more, the heat transfer is deteriorated.
【0018】本発明のシリコーンゴムシートは、耐熱
性、熱伝導性、強度、作業性に優れ、またシリコーンゴ
ムとしての弾性を有するので、プレス成形機で積層板、
フレキシブルプリント基板を成形する際に熱を伝えると
ともに均一に圧力をかける目的で使用されるシートや、
液晶パネルあるいはPDPパネルの電極端子部と駆動用
LSIの搭載されたFPC基板の電極端子部とを接続す
る際に用いる異方性導電膜(ACF)を加熱圧着機で熱
圧着する際のシートとして有効である。The silicone rubber sheet of the present invention is excellent in heat resistance, thermal conductivity, strength and workability, and has elasticity as a silicone rubber.
A sheet used for the purpose of transmitting heat and evenly applying pressure when molding a flexible printed circuit board,
As a sheet for thermocompression bonding of an anisotropic conductive film (ACF) used for connecting an electrode terminal of a liquid crystal panel or a PDP panel and an electrode terminal of an FPC board on which a driving LSI is mounted with a thermocompression bonding machine It is valid.
【0019】[0019]
【実施例】以下、本発明を実施例によって更に詳述する
が、本発明はこれらによって何ら限定されるものではな
い。
実施例1.(A)成分としてジメチルシロキサン単位9
9.85モル%、メチルビニルシロキサン単位0.15
モル%からなる平均重合度8,000のメチルビニルポ
リシロキサン100重量部に、(B)成分として平均粒
子径が23nm、揮発分0.10重量%、BET比表面
積130m2/gのアセチレンブラック50重量部を二
本ロールで配合し、混練りして均一化した。このシリコ
ーンゴム組成物100重量部に対して塩化白金酸のビニ
ルシロキサン錯体(白金含有量1重量%)0.1重量
部、白金触媒の制御剤であるエチニルシクロヘキサノー
ル0.05重量部および下記(2)式
で表されるメチルハイドロジェンポリシロキサン1.5
重量部を添加し、二本ロールでよく混練りして硬化性シ
リコーンゴム組成物を調整した。得られたシリコーンゴ
ム組成物を、カレンダー成形機を用いて厚さ0.25m
mに分出ししてから厚さ100μmポリエチレンテレフ
タレート(PET)フィルム上に転写し、160℃の加
熱炉の中を5分間通してシリコーンゴム組成物を硬化さ
せた。次にPETフィルムを剥離し、乾燥機中で200
℃で4時間熱処理して厚さ0.25mmの耐熱熱伝導性
シリコーンゴムシートを作製した。EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Example 1. Dimethylsiloxane unit 9 as component (A)
9.85 mol%, methyl vinyl siloxane unit 0.15
100 parts by weight of methylvinylpolysiloxane having an average degree of polymerization of 8,000 consisting of mol%, acetylene black 50 having an average particle size of 23 nm as the component (B), a volatile content of 0.10% by weight, and a BET specific surface area of 130 m 2 / g. Parts by weight were blended with a two-roll mill and kneaded to homogenize. With respect to 100 parts by weight of this silicone rubber composition, 0.1 part by weight of a vinylsiloxane complex of chloroplatinic acid (platinum content 1% by weight), 0.05 part by weight of ethynylcyclohexanol which is a platinum catalyst control agent and the following ( 2) Expression Methyl hydrogen polysiloxane represented by 1.5
A part by weight was added and kneaded well with a two-roll to prepare a curable silicone rubber composition. The thickness of the obtained silicone rubber composition is 0.25 m using a calender molding machine.
Then, it was transferred to a polyethylene terephthalate (PET) film having a thickness of 100 μm and passed through a heating furnace at 160 ° C. for 5 minutes to cure the silicone rubber composition. Next, the PET film is peeled off and dried in a dryer for 200
It heat-processed at 4 degreeC for 4 hours, and produced the heat resistant heat conductive silicone rubber sheet of thickness 0.25mm.
【0020】実施例2.実施例1のシリコーンゴム組成
物に、BET比表面積が140m2/gの酸化セリウム
粉末0.5重量部を添加したこと以外は、実施例1と同
様にして厚さ0.25mmの耐熱熱伝導性シリコーンゴ
ムシートを作製した。Example 2. Heat-resistant heat conduction of 0.25 mm thickness in the same manner as in Example 1 except that 0.5 part by weight of cerium oxide powder having a BET specific surface area of 140 m 2 / g was added to the silicone rubber composition of Example 1. A silicone rubber sheet was prepared.
【0021】実施例3.(A)成分としてジメチルシロ
キサン単位99.85モル%、メチルビニルシロキサン
単位0.15モル%からなる平均重合度8,000のメ
チルビニルポリシロキサン80重量部と、ジメチルシロ
キサン単位99.5モル%、メチルビニルシロキサン単
位0.5モル%からなる平均重合度8,000のメチル
ビニルポリシロキサン20重量部からなるベースに、
(B)成分として平均粒子径23nm、揮発分0.10
重量%、BET比表面積130m2/gのアセチレンブ
ラック20重量部、熱伝導性充填剤として平均粒径2.
5μmの酸化アルミニウム粉末250重量部およびBE
T比表面積140m2/gの酸化セリウム粉末0.5重
量部を加圧ニーダーで配合し、混練りして均一化した。
このシリコーンゴム組成物100重量部に対して塩化白
金酸のビニルシロキサン錯体(白金含有量1重量%)
0.05重量部、白金触媒の制御剤であるエチニルシク
ロヘキサノール0.025重量部および前記(2)式で
表されるメチルハイドロジェンポリシロキサン0.7重
量部を添加し、混合してから実施例1と同様にして、厚
さ0.25mmの耐熱熱伝導性シリコーンゴムシートを
作製した。Example 3. As the component (A), 80 parts by weight of methylvinylpolysiloxane having an average degree of polymerization of 8,000, which is composed of 99.85 mol% of dimethylsiloxane units and 0.15 mol% of methylvinylsiloxane units, and 99.5 mol% of dimethylsiloxane units, Based on 20 parts by weight of methyl vinyl polysiloxane having an average degree of polymerization of 8,000 and containing 0.5 mol% of methyl vinyl siloxane unit,
As the component (B), the average particle diameter is 23 nm and the volatile content is 0.10.
% By weight, 20 parts by weight of acetylene black having a BET specific surface area of 130 m 2 / g, and an average particle size of 2.
250 parts by weight of 5 μm aluminum oxide powder and BE
0.5 part by weight of a cerium oxide powder having a T specific surface area of 140 m 2 / g was blended with a pressure kneader and kneaded to homogenize.
Vinylsiloxane complex of chloroplatinic acid (platinum content 1% by weight) per 100 parts by weight of this silicone rubber composition
0.05 parts by weight, 0.025 parts by weight of ethynylcyclohexanol, which is a platinum catalyst control agent, and 0.7 parts by weight of methylhydrogenpolysiloxane represented by the above formula (2) are added and mixed. In the same manner as in Example 1, a heat-resistant and heat-conductive silicone rubber sheet having a thickness of 0.25 mm was produced.
【0022】実施例4.熱伝導性充填剤として、酸化ア
ルミニウム粉末の替わりに平均粒径15μmのアルミニ
ウム粉末150重量部を使用したこと以外は、実施例3
と同様にして厚さ0.25mmの耐熱熱伝導性シリコー
ンゴムシートを作製した。Example 4. Example 3 except that 150 parts by weight of aluminum powder having an average particle size of 15 μm was used instead of the aluminum oxide powder as the heat conductive filler.
A heat resistant and heat conductive silicone rubber sheet having a thickness of 0.25 mm was prepared in the same manner as in.
【0023】比較例1.(B)成分として、平均粒径が
35nm、揮発分0.10重量%、BET比表面積69
m2/gのアセチレンブラック50重量部を使用したこ
と以外は、実施例1と同様にして厚さ0.25mmのシ
リコーンゴムシートを作製した。Comparative Example 1. As the component (B), the average particle size is 35 nm, the volatile content is 0.10% by weight, and the BET specific surface area is 69.
A 0.25 mm-thick silicone rubber sheet was produced in the same manner as in Example 1 except that 50 parts by weight of m 2 / g acetylene black was used.
【0024】比較例2.(B)成分として、平均粒径が
50nm、揮発分0.6重量%、BET比表面積50m
2/gのファーネスブラック50重量部を使用したこと
以外は実施例1と同様にして厚さ0.25mmのシリコ
ーンゴムシートを作製した。Comparative Example 2. As the component (B), the average particle diameter is 50 nm, the volatile content is 0.6% by weight, and the BET specific surface area is 50 m.
A 0.25 mm thick silicone rubber sheet was prepared in the same manner as in Example 1 except that 50 parts by weight of 2 / g of furnace black was used.
【0025】比較例3.ジメチルシロキサン単位99.
85モル%とメチルビニルシロキサン単位0.15モル
%とからなる平均重合度が約8,000であるメチルビ
ニルポリシロキサン100重量部に、補強性シリカAe
rosil 200(日本アエロジル株式会社製の商品
名)42重量部と、分散剤として下記(3)式で示され
るα,ω−ジヒドロキシジメチルポリシロキサン4重量
部をニーダーで混練りし、170℃で1時間熱処理した
シリコーンゴム組成物を用い、実施例1と同様にして厚
さ0.25mmのシリコーンゴムシートを作製した。
Comparative Example 3. Dimethylsiloxane unit 99.
100 parts by weight of methylvinylpolysiloxane having an average degree of polymerization of about 8,000 consisting of 85 mol% and methylvinylsiloxane unit 0.15 mol% was added to the reinforcing silica Ae.
42 parts by weight of Rosil 200 (trade name of Nippon Aerosil Co., Ltd.) and 4 parts by weight of α, ω-dihydroxydimethylpolysiloxane represented by the following formula (3) as a dispersant were kneaded with a kneader, and the mixture was kneaded at 170 ° C. for 1 hour. A silicone rubber sheet having a thickness of 0.25 mm was produced in the same manner as in Example 1 using the silicone rubber composition that had been heat treated for a period of time.
【0026】実施例1〜4及び比較例1〜3で作製した
シートの初期特性、及び200℃における特性を測定し
た。その結果を表1に示す。The initial characteristics and the characteristics at 200 ° C. of the sheets prepared in Examples 1 to 4 and Comparative Examples 1 to 3 were measured. The results are shown in Table 1.
【表1】 [Table 1]
【0027】25μmピッチの銅電極を設けた2枚のフ
レキシブルプリント基板で厚さ22μmの異方性導電膜
をはさんだもの(上下の銅電極の位置を合わせる)の上
に、厚さ30μmのテフロン(デュポン株式会社の登録
商標)フィルムを置き、その上に実施例1〜4、比較例
1〜3で作製したシートを置いてから圧着機内に設置
し、シート側から400℃に加熱した加圧ツールを40
kgf/cm2の圧力で6秒間圧着した。この圧着を繰
り返し、均一な圧力で異方性導電膜を加熱硬化できなく
なるまでの回数を測定した。この回数は上下のフレキシ
ブルプリント基板の銅電極の導通により確認した。その
結果を表2に示す。A Teflon film having a thickness of 30 μm is placed on an anisotropic conductive film having a thickness of 22 μm sandwiched between two flexible printed boards provided with copper electrodes having a pitch of 25 μm (the upper and lower copper electrodes are aligned). A film (registered trademark of DuPont Co., Ltd.) is placed, and the sheets prepared in Examples 1 to 4 and Comparative Examples 1 to 3 are placed on the film, then placed in a pressure bonding machine, and heated to 400 ° C. from the sheet side. 40 tools
It was pressure-bonded for 6 seconds at a pressure of kgf / cm 2 . This pressure bonding was repeated, and the number of times until the anisotropic conductive film could not be heat-cured with a uniform pressure was measured. This number was confirmed by the conduction of copper electrodes on the upper and lower flexible printed boards. The results are shown in Table 2.
【0028】[0028]
【表2】 [Table 2]
フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08K 5/541 C08K 5/541 Fターム(参考) 4F071 AA67 AB03 AB07 AB08 AB09 AB18 AB26 AB27 AC08 AC16 AE02 AE17 AF44 AH12 BB04 BB06 BC01 4J002 CP031 CP042 CP081 CP141 DA036 DA079 DA089 DA117 DE079 DE098 DE109 DE149 DF019 DJ019 DK009 EK037 EX037 FD018 FD019 FD147Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C08K 5/541 C08K 5/541 F term (reference) 4F071 AA67 AB03 AB07 AB08 AB09 AB18 AB26 AB27 AC08 AC16 AE02 AE17 AF44 AH12 BB04 BB06 BC01 4J002 CP031 CP042 CP081 CP141 DA036 DA079 DA089 DA117 DE079 DE098 DE109 DE149 DF019 DJ019 DK009 EK037 EX037 FD018 FD019 FD147
Claims (8)
し硬化させてなる耐熱熱伝導性熱圧着用シリコーンゴム
シートであって、前記シリコーンゴム組成物が、(A)
平均重合度が200以上であるオルガノポリシロキサ
ン:100重量部、(B)水分を除いた揮発分が0.5
重量%以下でありかつBET比表面積が100m2/g
以上であるカーボンブラック:10〜100重量部、及
び、(C)硬化剤からなることを特徴とする耐熱熱伝導
性熱圧着用シリコーンゴムシート。1. A heat- and heat-conductive silicone rubber sheet for thermocompression bonding, which is obtained by molding and curing a silicone rubber composition into a sheet, wherein the silicone rubber composition comprises (A).
Organopolysiloxane having an average degree of polymerization of 200 or more: 100 parts by weight, (B) volatile matter excluding water is 0.5
% Or less and BET specific surface area of 100 m 2 / g
The above-mentioned carbon black: 10 to 100 parts by weight, and (C) a curing agent, a silicone rubber sheet for heat and heat conductive thermocompression bonding.
ム粉末を0.1〜5重量部含有する、請求項1に記載さ
れた耐熱熱伝導性熱圧着用シリコーンゴムシート。2. The heat resistant and heat conductive silicone rubber sheet for thermocompression bonding according to claim 1, wherein the silicone rubber composition contains 0.1 to 5 parts by weight of cerium oxide powder.
導性充填剤を50〜2,000重量部含有する請求項1
又は2に記載された耐熱熱伝導性熱圧着用シリコーンゴ
ムシート。3. The silicone rubber composition further contains 50 to 2,000 parts by weight of a thermally conductive filler.
Alternatively, the heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding described in 2.
粉末又は金属粉末から選択された少なくとも1種の粉末
である、請求項3に記載された耐熱熱伝導性熱圧着用シ
リコーンゴムシート。4. The heat-resistant and heat-conductive silicone rubber for thermocompression bonding according to claim 3, wherein the heat-conductive filler is at least one kind of powder selected from heat-conductive inorganic powder or metal powder. Sheet.
酸化アルミニウム、酸化亜鉛、結晶性シリカ、及び窒化
ホウ素の中から選択された少なくとも1種の無機粉末で
ある、請求項4に記載された耐熱熱伝導性熱圧着用シリ
コーンゴムシート。5. The heat resistance according to claim 4, wherein the inorganic powder is at least one inorganic powder selected from aluminum oxide, aluminum hydroxide, zinc oxide, crystalline silica, and boron nitride. Silicone rubber sheet for thermal conductive thermocompression bonding.
銅、及びニッケルの中から選択された少なくとも1種の
金属粉末である、請求項4又は5に記載された耐熱熱伝
導性熱圧着用シリコーンゴムシート。6. The metal powder is aluminum, silver,
The heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding according to claim 4 or 5, which is at least one metal powder selected from copper and nickel.
0.5W/mK以上である、請求項1〜6の何れかに記
載された耐熱熱伝導性熱圧着用シリコーンゴムシート。7. The heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding according to claim 1, wherein the silicone rubber composition has a thermal conductivity of 0.5 W / mK or more.
である請求項1〜7の何れかに記載された耐熱熱伝導性
熱圧着用シリコーンゴムシート。8. The heat-resistant and heat-conductive silicone rubber sheet for thermocompression bonding according to claim 1, wherein the thickness of the sheet is in the range of 0.1 to 10 mm.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002066422A JP4086222B2 (en) | 2002-03-12 | 2002-03-12 | Heat resistant and heat conductive silicone rubber sheet for thermocompression bonding |
KR1020030014988A KR100570249B1 (en) | 2002-03-12 | 2003-03-11 | Silicone Rubber Sheet for Heat-Resistant, Thermal-Conductive Thermocompression |
TW092105373A TW200303898A (en) | 2002-03-12 | 2003-03-12 | Heat-resistant silicone rubber sheet having thermal conductivity and thermocompression bonding |
CNB031205569A CN1233747C (en) | 2002-03-12 | 2003-03-12 | Silicon rebber sheet material with heat-resistance heat-conductivity for thermocopression seal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002066422A JP4086222B2 (en) | 2002-03-12 | 2002-03-12 | Heat resistant and heat conductive silicone rubber sheet for thermocompression bonding |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003261769A true JP2003261769A (en) | 2003-09-19 |
JP4086222B2 JP4086222B2 (en) | 2008-05-14 |
Family
ID=28034897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002066422A Expired - Fee Related JP4086222B2 (en) | 2002-03-12 | 2002-03-12 | Heat resistant and heat conductive silicone rubber sheet for thermocompression bonding |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4086222B2 (en) |
KR (1) | KR100570249B1 (en) |
CN (1) | CN1233747C (en) |
TW (1) | TW200303898A (en) |
Cited By (7)
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JP2007169332A (en) * | 2005-12-19 | 2007-07-05 | Shin Etsu Chem Co Ltd | Silicone rubber sheet for heat resistant, thermoconductive hot press-bonding |
US7703657B2 (en) * | 2003-07-11 | 2010-04-27 | Sony Corporation | Device for mounting electric component |
KR20100044710A (en) * | 2008-10-22 | 2010-04-30 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone rubber sheet for thermocompression bonding |
WO2010103998A1 (en) | 2009-03-11 | 2010-09-16 | 信越化学工業株式会社 | Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module |
WO2014185296A1 (en) * | 2013-05-16 | 2014-11-20 | 信越化学工業株式会社 | Thermally conductive silicone adhesive composition for reactor and reactor |
CN104890330A (en) * | 2014-03-06 | 2015-09-09 | 信越化学工业株式会社 | Heat conductivity composite sheet material for crimping of LED chip |
WO2016017495A1 (en) * | 2014-07-28 | 2016-02-04 | 信越化学工業株式会社 | Thermally conductive silicone composition, and thermally conductive silicone moudled article |
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JP2007186544A (en) * | 2006-01-11 | 2007-07-26 | Shin Etsu Chem Co Ltd | Electroconductive silicone rubber composition |
JP4514058B2 (en) * | 2006-08-30 | 2010-07-28 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
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JPH01272667A (en) * | 1988-04-25 | 1989-10-31 | Tokai Carbon Co Ltd | Electrically conductive carbon black |
JPH0711010A (en) * | 1993-06-28 | 1995-01-13 | Shin Etsu Chem Co Ltd | Heat-resistant and heat-conductive silicone rubber molded article |
JPH08174765A (en) * | 1994-12-26 | 1996-07-09 | Shin Etsu Chem Co Ltd | Heat-resistant, heat-conductive silicone rubber composite sheet |
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US9424977B2 (en) | 2013-05-16 | 2016-08-23 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone adhesive composition for reactor and reactor |
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WO2016017495A1 (en) * | 2014-07-28 | 2016-02-04 | 信越化学工業株式会社 | Thermally conductive silicone composition, and thermally conductive silicone moudled article |
JP2016030774A (en) * | 2014-07-28 | 2016-03-07 | 信越化学工業株式会社 | Thermal conductive silicone composition and thermal conductive silicone molded product |
Also Published As
Publication number | Publication date |
---|---|
KR20030074349A (en) | 2003-09-19 |
KR100570249B1 (en) | 2006-04-12 |
TW200303898A (en) | 2003-09-16 |
JP4086222B2 (en) | 2008-05-14 |
CN1233747C (en) | 2005-12-28 |
TWI302928B (en) | 2008-11-11 |
CN1443806A (en) | 2003-09-24 |
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