JP2003260756A - Method for manufacturing laminate sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminate sheet in order to provide the laminate sheet which is excellent in moldability and little in dispersion of thickness precision, warpage and the like. <P>SOLUTION: A prepreg 2 supplied from a prepreg supply part 1 is transferred in a vertical direction while it is preheated with a preheating part 7 by using a feed roll. Further, a metallic foil 4 having a sticky resin layer is supplied by using the feed roll from a metallic foil supply part 3. The prepreg 2 is bonded to the metallic foil 4 having the sticky resin layer by being passed through rolls 5 of which the surfaces are constituted of elastic materials. The bonded laminate sheet is postheated with a postheating part 8 and transferred to a winding part 6 with the feed roll. Then, the laminate sheet is continuously manufactured by continuously winding with the winding part 6. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for manufacturing a laminated board.

[0002]

2. Description of the Related Art As for printed circuit boards, demands for miniaturization and higher functionality are increasing, but price competition is fierce, and in particular, multilayer laminates used for printed circuit boards, glass cloth base epoxy resin laminates, or glass. The cost reduction is a major issue for any laminated plate using a nonwoven fabric as an intermediate layer base material and a glass woven fabric as a surface layer base material. In recent years, in electrical equipment, electronic equipment, communication equipment, etc., digitization has progressed, and stable impedance in printed circuit boards has been required. With this, copper-clad laminates, which are raw materials for printed circuit boards, Plate thickness accuracy has come to be required.

When laminating a multilayer laminate used for a printed circuit board, a glass cloth base epoxy resin laminate, or a laminate using a glass nonwoven fabric as an intermediate layer base material and a glass woven cloth as a surface layer base material, A multi-stage batch press is generally used in which a number of copper foils, prepregs, printed circuit boards for inner layers, mirror-finished boards, etc. are stacked between hot plates to perform heat-press molding.
However, in such a multi-stage batch press, the heat history applied to each laminate during laminating is different depending on the position of each laminate in the hot platen, so there is a difference in quality such as formability, warpage, and dimensional change rate. It has been difficult to supply a product with little variation in quality. Furthermore, 20-100 kg /
Since the laminated plate is formed by the high pressure of cm ² , there is a problem that the plate thickness cannot be obtained due to the resin flow. In addition, the multi-stage batch press requires a huge amount of heat for heating and cooling the jigs required for forming laminated plates such as hot plates, contact plates, and cushioning materials, so that in recent years global warming, etc. It was difficult to save energy for the global environment.

A horizontal continuous belt press or the like has been developed as a laminated plate having a small variation in quality and a facility capable of saving energy. However, even with the horizontal continuous belt press method, pressure unevenness and temperature unevenness when sandwiched between belts are likely to occur, adhesion due to gravity and the difference in the approach angle of the material may result in moldability (especially the occurrence of voids) and copper. There is a problem that the front and back sides may vary due to the adhesive force of the foil or the like, and the warpage and the dimensional change due to the difference in the tension of the copper foil or the base material may become large.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a laminated plate, which is excellent in formability and has a small variation in plate thickness accuracy and warpage.

[0006]

These objects are achieved by the present invention described in (1) to (6) below. (1) A method of vertically transferring a prepreg in which a resin composition is adhered to a sheet-shaped fiber base material to continuously produce a laminated plate, wherein one or more prepregs are preheated. A step, a step of bonding a metal foil or a carrier film having an adhesive resin layer after the heating, a step of bonding the prepreg and the metal foil or the carrier film with a roll whose surface is made of an elastic material, And a step of post-heating the laminated board obtained in the step. (2) The method for producing a laminated board according to claim 1, wherein the step of preheating uses a heater having a heat transfer area of 1 m ² or more. (3) The heating device is a panel-shaped heating device.
The method for manufacturing a laminated board as described in. (4) The method for producing a laminated plate according to any one of claims 1 to 3, wherein the post-heating step uses a heater having a heat transfer area of 1 m ² or more. (5) The method for manufacturing a laminated plate according to claim 4, wherein the post-heater is a panel-shaped heater. (6) The method for manufacturing a laminated board according to any one of claims 1 to 5, wherein the prepreg has a plurality of thermosetting resin layers.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a method for manufacturing a laminated board of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings. FIG. 1 is a schematic view for explaining the method for manufacturing a laminated board of the present invention. As shown in FIG. 1, the prepreg 2 supplied from the prepreg supply unit 1 is transferred in the vertical direction while being preheated by the preheating heating unit 7 using a feed roll. Further, the metal foil 4 having the adhesive resin layer is supplied from the metal foil supply unit 3 by using a feed roll. Prepreg 2
And the metal foil 4 having the adhesive resin layer are joined by passing between the rolls 5 whose surfaces are made of an elastic material. The joined laminated plates are post-heated by the post-heating unit 8 and transferred to the winding unit 6 by a feed roll. Then, the laminated plate is continuously manufactured by continuously winding it by the winding unit 6.

The prepreg used in the present invention is a sheet-shaped substrate having a resin composition attached thereto. Examples of the sheet-like base material include glass fiber base materials such as glass woven cloth, glass non-woven cloth, and glass paper, as well as woven cloth and non-woven cloth made of paper, synthetic fibers, metal fibers, carbon fibers, mineral fibers, and the like. The following materials may be used alone or in combination. Of these, a glass fiber base material is preferable. This allows
The rigidity and dimensional stability of the laminated plate are improved.

As the resin constituting the resin composition,
Examples thereof include thermosetting resins such as epoxy resins, polyimide resins, phenol resins, melamine resins, and phenoxy resins, or modified resins thereof, thermoplastic resins such as polyester resins and polyamide resins, and resins such as natural resins. Of these, epoxy resins are preferable, and bisphenol A type epoxy resins are particularly preferable. This allows
It is possible to improve electric insulation and adhesiveness. Further, it is preferable to use the bisphenol A type epoxy resin and the novolac type epoxy resin together in a weight ratio of 95: 5 to 60:40, and particularly 80:20 to 70:30.
It is preferable to use in combination. Thereby, in addition to the above effects, heat resistance can be improved.

A curing agent, a curing accelerator, a filler and the like may be added to the resin composition, if necessary. Examples of the curing agent include amine compounds such as dicyandiamide, metaphenylenediamine, diaminodiphenylsulfone, novolac resins, trimellitic anhydride, acid anhydrides such as benzophenonetetracarboxylic anhydride, and boron trifluoride / monoethylamine. Amine complex compounds and 2-
Imidazoles such as phenyl-imidazole can be used. Examples of the curing accelerator include 2-phenyl-4-methylimidazole and 2-methyl-
Imidazoles such as 4-ethyl-imidazole can be used.

Examples of the filler include inorganic fillers,
Organic fillers can be mentioned, but inorganic fillers are preferred. This can impart properties such as tracking resistance, heat resistance, and reduction in coefficient of thermal expansion of the laminated plate.
Examples of the inorganic filler include aluminum hydroxide,
There are hydroxides such as magnesium hydroxide, calcium carbonate, talc, wollastonite, alumina, silica, uncalcined clay, calcined clay, barium sulfate and the like. Among these, aluminum hydroxide is particularly preferable. This allows
Further, tracking resistance can be imparted. The inorganic filler is preferably contained in an amount of 50 to 300 parts by weight, and more preferably 60 to 280 parts by weight, based on 100 parts by weight of the thermosetting resin. If the content is less than the lower limit, the effect of improving tracking resistance may be reduced, and if the content exceeds the upper limit, solderability may be reduced.

The prepreg used in the present invention is not particularly limited, but preferably has a plurality of thermosetting resin layers. This allows each layer to be designed so as to exert different functions. For example, as shown in FIG. 2, the prepreg 2 having three thermosetting resin layers can be used. That is, the prepreg 2 includes the sheet-shaped base material 20.
A first layer 21 impregnated with a thermosetting resin, and a second layer formed by applying thermosetting resin to both surfaces of the first layer 21.
And a layer 22. Thereby, different functions can be given to the first layer and the second layer. The interface between the first layer and the second layer may have a continuous structure in which both are mixed.

The thermosetting resins used for the first layer and the second layer may be the same, but different conditions are preferable. The reaction rate of the thermosetting resin of the first layer is
It is preferably higher than the reaction rate of the thermosetting resin of the second layer. This improves the plate thickness accuracy of the laminated plate in the first layer. Further, the second layer has improved adhesiveness with the metal foil.

The reaction rate of the thermosetting resin in the first layer is not particularly limited, but is preferably 85% or more. Thereby, the plate thickness accuracy of the laminated plate is further improved. The reaction rate of the thermosetting resin in the second layer is not particularly limited, but is preferably 65% or less. This further improves the adhesiveness with the metal foil. Furthermore, the reaction rate of the thermosetting resin in the first layer is 8
It is preferable that the reaction rate of the thermosetting resin in the second layer is 5% or more and 65% or less. Thereby, in addition to the above two effects, the resin powder is not easily generated even when the prepreg is bent.

The preferred reaction rate is the first
The reaction rate of the thermosetting resin in the layer is 90 to 95%. The reaction rate of the thermosetting resin in the second layer is 20% or less, preferably 0.1 to 20%. Most preferably,
The reaction rate of the thermosetting resin in the first layer is 90 to 95%, and the reaction rate of the thermosetting resin in the second layer is 20.
% Or less. As a result, in addition to improving the adhesiveness, improving the plate thickness accuracy of the laminated plate, and preventing the generation of resin powder, resin flow-out can be prevented and moldability is improved.

The reaction rate is determined by the differential scanning calorimetry (DS
It can be determined by C). That is, by comparing the areas of the exothermic peaks due to the reaction of DSC for both the unreacted resin and the resin of each layer, it can be determined by the following formula (I). In addition, the temperature rise rate is 10 ° C / measurement
Minutes, under a nitrogen atmosphere. Reaction rate (%) = (1-reaction peak area of resin / reaction peak area of unreacted resin) × 100 (I) Note that the reaction rate of the prepreg is controlled by heating temperature, heating time and light or electron. Although it can be controlled by various methods such as irradiation with rays, it is preferable to control by heating temperature and heating time because it can be performed easily and accurately.

As the method for adhering the resin composition to the sheet-shaped base material, for example, a method in which the sheet-shaped base material is immersed in a resin varnish, a coating method with various coaters, a spraying method with a spray, and a powder of the resin composition are dispersed. And the like. Among these, the method of immersing the resin varnish in the sheet-shaped substrate is preferable. Thereby, the resin composition can be uniformly attached to the sheet-shaped substrate. The amount of the resin composition attached depends on the fiber material, properties, and weight (per unit area) of the sheet-shaped fiber base material, and is not particularly limited. Moreover, when the prepreg has a plurality of thermosetting resin layers, the resin weight ratio of the second layer / the first layer is not particularly limited, but is preferably 0.05 to 2.5, and particularly preferably 0.
1 to 2.0 is preferable. This improves the plate thickness accuracy and the embeddability in the unevenness. If the weight ratio exceeds the above upper limit, the effect of improving the plate thickness accuracy after molding may decrease. If the amount is less than the lower limit, the effect of preventing the occurrence of residual voids after molding and the occurrence of swelling and blistering in the moisture absorbing solder test may be reduced.

The manufacturing method of the present invention has a step of preheating the prepreg. Thereby, a laminated board can be manufactured continuously for a long time stably. The preheating temperature is not particularly limited, but is preferably 150 to 250 ° C., and particularly 1
70-240 degreeC is preferable. Thereby, the adhesiveness at the time of laminating the prepreg and the metal foil can be improved. Moreover, the voids of the prepreg can be further reduced. If the heating temperature is lower than the lower limit, the adhesion may decrease, and if the heating temperature exceeds the upper limit, the resin component of the prepreg may be thermally decomposed. The transfer speed of the prepreg is not particularly limited, but is preferably 0.5 to 20 m / min, and particularly preferably 1 to 10 m / min. Thereby, a laminated board can be uniformly produced, without reducing productivity.

The heat transfer area of the heater used in the preheating step is not particularly limited, but is preferably 1 m ² and particularly preferably 1.2 to 1.5 m ² . If the heat transfer area is less than the lower limit value, the effect of improving the continuous stable formability of the laminated plate may be reduced, and if the heat transfer area exceeds the upper limit value, there is an increase in ambient temperature due to excess energy release, and the prepreg is increased. It may be difficult to control the degree of cure. The shape of the heater is not particularly limited, but a flat panel shape is preferable. Thereby, an effective amount of heat can be given to the prepreg that moves in the vertical direction. Also,
The heater is not particularly limited, but is preferably a panel heater for far infrared rays or the like capable of heating up to 250 ° C. As a result, the melt viscosity of the resin adhering to the prepreg is reduced, so that the insufficient heat quantity at the time of molding by the heating roll can be compensated for and defective molding (in particular, voids) can be prevented.

The manufacturing method of the present invention includes a step of laminating a metal foil or a carrier film having an adhesive resin layer after the preliminary heating. Since the metal foil has the adhesive resin layer, the adhesion between the metal foil and the prepreg can be improved. Furthermore, since the flow of the metal foil having the adhesive resin can be adjusted to be short, it is possible to suppress the formation of banks when laminating the prepreg and the metal foil. As a result, it is possible to prevent voids and wrinkles generated in the laminated plate. (Since it is not easy to distinguish between a metal foil with an adhesive and a metal foil having an adhesive resin), the metal constituting the metal foil is, for example, copper or a copper-based alloy, aluminum or an aluminum-based alloy, etc. Can be mentioned. The thickness of the metal foil is not particularly limited, but is 9 to 70 μm.
m is preferable, and 12 to 35 μm is particularly preferable. Examples of the carrier film include PET film and PB
Examples thereof include a T film, a stretched nylon film, a polycarbonate film, a stretched polypropylene film and a polyimide film. The thickness of the carrier film is not particularly limited, but is preferably 9 to 50 μm,
Particularly, 12 to 35 μm is preferable.

The resin constituting the adhesive resin layer is not particularly limited, but examples thereof include epoxy resin and phenoxy resin. The resin forming the adhesive resin layer is preferably a thermoplastic resin having a weight average molecular weight of 10,000 or more. Weight average molecular weight is 10,000
If it is less than the range, the continuous moldability may be deteriorated due to the formation of a resin bank when the prepreg and the metal foil are joined.

Further, the resin constituting the adhesive resin layer is
It is preferable to contain two or more kinds of epoxy resins, and it is particularly preferable to contain epoxy resins having different molecular weights. Further, a resin containing a bisphenol type epoxy resin having a weight average molecular weight of 10,000 or more, a bisphenol type epoxy resin having an epoxy equivalent of 500 or less and a curing agent is most preferable. This makes it possible to suppress the fluidity when laminated with a heating roll to a low level, maintain the interlayer thickness, and impart high tackiness to the composition. Weight average molecular weight 10,000
If the bisphenol type epoxy resin of 0 or more is used alone, the flexibility may be too high due to the low crosslink density after curing, and the viscosity is high when used as a varnish of a predetermined concentration and the workability during coating is reduced. There are cases. When the bisphenol type epoxy resin having an epoxy equivalent of 500 or less is used alone, resin retention (resin bank) may occur at the time of joining the metal foil and the prepreg, and continuous moldability may be deteriorated. Examples of the curing agent include amine compounds such as dicyandiamide.

The resin constituting the adhesive resin layer is a bisphenol type epoxy resin having a weight average molecular weight of 10,000 or more and a bisphenol type epoxy resin having an epoxy equivalent of 500 or less, 50 to 70% by weight: 50 to 30% by weight. It is preferable to blend in. Weight average molecular weight 10,
If the bisphenol type epoxy resin of 000 or more is less than the lower limit, continuous moldability may be deteriorated due to generation of a resin bank at the time of joining the prepreg and the metal foil. Adhesion may decrease. The weight average molecular weight is, for example, G
It can be measured with a PC. The epoxy equivalent can be measured by, for example, perchloric acid titration. The thickness of the adhesive resin layer on the metal foil is not particularly limited, but is preferably 5 to 50 μm, and particularly preferably 10 to 30 μm.

The manufacturing method of the present invention includes a step of joining the prepreg and the metal foil or the like with a roll whose surface is made of an elastic material. This makes it possible to more evenly bond the prepreg and the metal foil or the like. In the roll 5 whose surface is made of an elastic material, the surface layer 53 is made of an elastic material as shown in FIG. 3, for example. That is, the surface layer 53 made of an elastic material is provided on the peripheral surface of the roll base material 51. The elastic material is not particularly limited, and various rubbers such as silicone rubber, isoprene rubber, ethylene-propylene rubber, and polyamide-based thermoplastic elastomers, polyester-based thermoplastic elastomers, polyolefin-based thermoplastic elastomers, and the like. To be Among these,
Silicone rubber is preferred. When joining the prepreg and the metal foil with the roll, the surface pressure between the rolls is not particularly limited, but is preferably 5 to 30 kg / cm ² , and particularly 1
0 to 15 kg / cm ² is preferable. The temperature of the roll is not particularly limited, but is preferably 100 to 200 ° C, and particularly preferably 120 to 180 ° C.

The rubber Shore hardness of the surface layer is not particularly limited, but is preferably 50 degrees or more, and particularly 70 to 90.
Degree is preferred. If the rubber shore hardness is less than the lower limit value, the durability of the elastic material may decrease. The thickness of the surface layer is preferably 0.5 mm or more, and particularly 0.5 to
3.5 mm is preferable. If the thickness of the surface layer is less than the lower limit value described above, it may be difficult to uniformly bond the prepreg and the metal foil, and as a result, the appearance of the surface of the laminate may be deteriorated.

The manufacturing method of the present invention further includes a step of further heating the laminated plate obtained in the above step. This allows
It is possible to prevent characteristic deterioration such as poor appearance due to wrinkles on the copper foil surface and poor formability due to voids. The post-heating temperature is not particularly limited, but is 120 to 250.
C. is preferable, and 140 to 230 ° C. is particularly preferable. This can accelerate the curing of the resin forming the laminated plate. Further, it is possible to suppress the heat shrinkage of the copper foil and the prepreg due to the heat radiation before winding the laminated plate, and thereby the appearance at the time of molding (particularly the wrinkles of the metal foil portion) can be improved. If the heating temperature is less than the lower limit value, the adhesion may be deteriorated due to insufficient curing degree, and if it exceeds the upper limit value, the resin strength of the prepreg may be thermally decomposed to lower the peel strength. .

The heat transfer area of the heater used in the post-heating step is not particularly limited, but is preferably 1 m ² , particularly 1.
It is preferably ² to 1.5 m ² . When the heat transfer area is less than the lower limit value, the effect of improving the continuous stable formability of the laminated plate may be reduced, and when the heat transfer area exceeds the upper limit value, an increase in energy cost due to extra energy release and equipment cost. Will increase. The shape of the post-heater is not particularly limited, but a flat panel shape is preferable. Thereby, an effective amount of heat can be given to the laminated board obtained by the above process. The post-heater is not particularly limited, but it is preferably a far-infrared panel heater capable of heating up to 250 ° C.

After the post-heating step, the laminated plate is continuously wound by a winding machine. Further, it can be cut into a predetermined length with a cutting machine. In the manufacturing method of the present invention, the prepreg is transferred in the vertical direction to continuously manufacture the laminated plate. As a result, quality variations such as warpage and dimensional change can be reduced.

[0029]

EXAMPLES The present invention will be described in detail below with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

(Example 1) <Preparation of prepreg> Preparation of varnish 70 parts by weight of a bisphenol A type epoxy resin having an epoxy equivalent of about 450 and 30 parts by weight of a phenol novolac type epoxy resin having an epoxy equivalent of about 190 are added to methyl ethyl ketone 1
It was dissolved in 100 parts by weight. To this solution was added 3 parts by weight of dicyandiamide and 2-phenyl-4-methylimidazole.
A solution prepared by dissolving 15 parts by weight in 20 parts by weight of dimethylformamide was added and mixed with stirring. Thus, an epoxy resin varnish for coating glass cloth was prepared.

Impregnation and application of thermosetting resin to sheet-like fiber base material The varnish prepared as described above is a sheet-like base material and has a thickness of 0.08 mm glass cloth (WEA 1 manufactured by Nitto Boseki Co., Ltd.).
16E) so that the resin solid content is 35 parts by weight with respect to 100 parts by weight of the glass cloth, and is dried in a drying oven at 170 ° C. for 3 minutes to form a first layer of the thermosetting resin-impregnated glass cloth. Created. Next, the above-mentioned thermosetting epoxy resin varnish was applied to both sides of the first layer so that the resin solid content was 45 parts by weight with respect to 100 parts by weight of glass cloth, and the coating was carried out in a drying oven at 170 ° C. After drying for 5 minutes, a second layer was prepared. In this way, a prepreg consisting of the first layer and the second layers formed on both surfaces thereof was obtained.

Confirmation of reaction rate As the first layer, a sample was prepared by impregnating glass cloth with epoxy resin varnish as described above and drying in a drying oven at 170 ° C. for 3 minutes. The sample of the second layer was obtained by cutting the surface of the prepreg composed of the first layer and the second layer prepared by the above method. The exothermic peak of each layer sample was measured by a DSC device (TA Instruments). Regarding the area of the exothermic peak due to the curing reaction near 160 ° C., the resin before the reaction was compared with the resin in each layer, and the reaction rate was calculated according to the above formula (I). As a result, the reaction rate of the first layer was 92%, and the reaction rate of the second layer was 40%.

<Preparation of Metal Foil> 100 parts by weight of brominated phenoxy resin (bromination rate 25%, average molecular weight 30,000) and 40 parts by weight of bisphenol F type epoxy resin (Epiclone 830 manufactured by Dainippon Ink and Chemicals, Inc.). 3 parts by weight of 2-phenyl-4-methyl 5-methoxyimidazole was stirred and dissolved in a mixed solvent of xylene, propylene glycol monomethyl ether and methyl ethyl ketone to obtain a varnish of adhesive resin. The thickness of the obtained varnish is 18μ
m copper foil (FGP manufactured by Nippon Denshoku Co., Ltd.) was applied to obtain a metal foil having an adhesive resin. The thickness of the adhesive resin layer was 15 μm.

<Molding of Laminated Plate> The above-mentioned prepreg is attached to the prepreg supply section, and the prepreg is transferred vertically from the upper side to the lower side as shown in FIG. It preheated with the panel-shaped preheater (heat-transfer area 1.2 m < ² >) at 0 degreeC.
Moreover, the above-mentioned copper foil was supplied from the horizontal direction with respect to the transfer direction of the prepreg. And 1 piece of prepreg and copper foil
Between a pair of rolls heated to 40 ° C (roll surface pressure: 10
kg / cm ² ) was passed. Next, it was post-heated to 150 ° C. with a panel-shaped post-heater (heat transfer area: 1.5 m ² ) to finally obtain a double-sided copper-clad laminate having a thickness of 0.15 mm. The surface layer of the roll was made of silicon rubber having a thickness of 2 mm and a rubber Shore hardness of 80 degrees (manufactured by Meiwa Rubber Industry Co., Ltd .: Silicup Super H80).

(Example 2) The procedure of Example 1 was repeated, except that the reaction rate of the first layer of the prepreg was changed to 85%.

(Example 3) The procedure of Example 1 was repeated, except that the reaction rate of the first layer of the prepreg was 70%.

Example 4 Example 4 was repeated except that the reaction rate of the second layer of the prepreg was 70%.

(Example 5) The same procedure as in Example 1 was carried out except that a post-heater having a heat transfer area of 0.8 m ² was used.

Example 6 The varnish obtained in Example 1 was applied to a 0.08 mm-thick glass cloth (WEA 116E manufactured by Nitto Boseki Co., Ltd.), which is a sheet-like base material, to obtain 100 parts by weight of the resin solid content. On the other hand, the glass cloth was impregnated with 45 parts by weight and dried in a drying oven at 170 ° C. for 5 minutes to prepare a thermosetting resin-impregnated glass cloth. The same procedure as in Example 1 was carried out except that the prepreg was used in the step of forming the laminated plate.

Example 7 The same procedure as in Example 1 was carried out except that a 25 μm PET film (Diafoil S100 manufactured by DIAFOIL Hoechst) was used as the carrier film instead of the metal foil.

(Comparative Example 1) The same procedure as in Example 1 was carried out except that post-heating was not performed.

(Comparative Example 2) The prepreg obtained in Example 1 was assembled into a paper, and a copper foil having a thickness of 18 μm was laminated on the upper and lower sides of one prepreg to make one set, and 200 sets were prepared. They were heated and pressed at a pressure of 40 kgf / cm ² and a temperature of 170 ° C. for 60 minutes. After thermoforming, the insulating layer thickness of 0.1
A double-sided copper clad laminate of mm was obtained.

The following evaluations were carried out on the laminated plates obtained by the above-mentioned Examples and Comparative Examples, and the obtained results are shown in Table 1.
Shown in. Each evaluation was performed by the following method. The plate thickness accuracy and formability were measured by using a double-sided copper clad laminate having a size of 500 mm × 500 mm as a sample in which the copper foil was removed by etching and only the insulating layer was formed. <Evaluation of Laminated Plate> 1 Thickness Accuracy The thickness accuracy was measured by setting 36 measurement points in a grid pattern and measuring the thickness. The average value and the range were obtained and used as the plate thickness accuracy.

2 Moldability The moldability was checked visually and by an optical microscope for the presence of voids and other abnormalities. Each code is
It is as follows. ⊚: No void ○: There is a void of less than 10 μm, but it is practical Δ: There is a void of more than 10 μm, not practical ×: Many voids

3 The presence or absence of wrinkles, dents, pits, etc. was visually confirmed on the substrate having an outer size of 500 mm × 500 mm. ⊚: No wrinkles, etc. ○: Wrinkles of less than 100 μm, but practicable △: Wrinkles of more than 100 μm, not practical ×: Many wrinkles, etc.

4 Copper Foil Peel Strength 18 μm Copper foil peel strength was measured according to JIS C 6481.

5 Solder heat resistance For solder heat resistance, 50 mm × 5 is obtained by etching only one surface.
After cutting into a size of 0 mm, a moisture absorption treatment was performed under pressure cooker conditions of 121 ° C. and 2.0 atm for 1 hour and boiling for 2 hours. Then, after immersing in a solder bath at 260 ° C. for 30 seconds, the evaluation of blistering and squeeze ring was confirmed visually and by an optical microscope.

6 The productivity of Comparative Example 1 (laminated plate obtained by batch press) was set to 1.0 per hour, and the production amounts of the laminated plates obtained by the methods of Examples 1 to 8 were compared. .

[0049]

[Table 1]

Results of Evaluation of Laminated Plate Characteristics in the Present Invention As is clear from Table 1, Examples 1 to 7 were excellent in plate thickness accuracy, moldability and productivity. Moreover, especially Examples 1-3, 5 and 7 were also excellent in the external appearance.

[0051]

According to the method of the present invention, it is possible to provide a method for producing a laminated board having high quality and high productivity. Further, since the surface layer of the roll is made of an elastic material, the prepreg and the metal foil or the like can be joined more firmly and uniformly. Further, when a metal foil having an adhesive resin is used, it is possible to prevent the generation of resin banks, and it is possible to stably manufacture a laminated board. Further, when the reaction rate of the thermosetting resin forming the first layer and the second layer of the prepreg is set to a predetermined value, it is possible to obtain a laminated plate which is particularly excellent in plate thickness accuracy and formability.

[Brief description of drawings]

FIG. 1 is a schematic view showing a manufacturing process of a laminated plate in the present invention.

FIG. 2 is a sectional view schematically showing an example of a prepreg according to the present invention.

FIG. 3 is a side view showing an example of a roll used in the present invention.

[Explanation of symbols]

1 prepreg supply section 2 prepreg 3 Metal foil supply section 4 metal foil 5 rolls 6 winding section 7 Preheating section 8 After heating section 20 Sheet-shaped substrate 21 First Layer 22 Second layer 51 roll base material 52 roll axis 53 surface layer

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Claims (6)

[Claims] 1. A method for continuously manufacturing a laminated board by transferring a prepreg in which a resin composition is adhered to a sheet-shaped fiber base material in a vertical direction, and preliminarily preparing one or a plurality of the prepregs. A step of heating, a step of laminating a metal foil or a carrier film having an adhesive resin layer after the heating, a step of joining the prepreg and the metal foil or the carrier film with a roll whose surface is made of an elastic material, And a step of post-heating the laminate obtained in the above step. 2. The heat transfer area is set to 1 in the preheating step.
The method for producing a laminated plate according to claim 1, wherein a heater having m ² or more is used. 3. The method for manufacturing a laminated plate according to claim 2, wherein the heater is a panel-shaped heater. 4. The heat transfer area is 1 m in the post-heating step.
^The method for producing a laminated plate according to any one of claims 1 to 3, wherein a heater having ^two or more is used. 5. The method for manufacturing a laminated board according to claim 4, wherein the post-heating machine is a panel-shaped heating machine. 6. The method for manufacturing a laminated board according to claim 1, wherein the prepreg has a plurality of thermosetting resin layers.