JP2003258170A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003258170A5 JP2003258170A5 JP2002101927A JP2002101927A JP2003258170A5 JP 2003258170 A5 JP2003258170 A5 JP 2003258170A5 JP 2002101927 A JP2002101927 A JP 2002101927A JP 2002101927 A JP2002101927 A JP 2002101927A JP 2003258170 A5 JP2003258170 A5 JP 2003258170A5
- Authority
- JP
- Japan
- Prior art keywords
- fin
- heat sink
- base
- sink according
- integrally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002101927A JP2003258170A (ja) | 2002-02-26 | 2002-02-26 | ヒートシンク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002101927A JP2003258170A (ja) | 2002-02-26 | 2002-02-26 | ヒートシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003258170A JP2003258170A (ja) | 2003-09-12 |
| JP2003258170A5 true JP2003258170A5 (cg-RX-API-DMAC7.html) | 2005-08-25 |
Family
ID=28672163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002101927A Pending JP2003258170A (ja) | 2002-02-26 | 2002-02-26 | ヒートシンク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003258170A (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7306027B2 (en) * | 2004-07-01 | 2007-12-11 | Aavid Thermalloy, Llc | Fluid-containing cooling plate for an electronic component |
| US7772036B2 (en) | 2006-04-06 | 2010-08-10 | Freescale Semiconductor, Inc. | Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing |
| JP2010167454A (ja) * | 2009-01-22 | 2010-08-05 | Welcon:Kk | 熱交換器及びその製造方法 |
| TWI589382B (zh) | 2012-09-21 | 2017-07-01 | 三菱綜合材料股份有限公司 | 鋁構件與銅構件之接合構造 |
| JP5614485B2 (ja) * | 2012-10-16 | 2014-10-29 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール、及びヒートシンク付パワーモジュール用基板の製造方法 |
| JP7334214B2 (ja) * | 2021-07-14 | 2023-08-28 | プライムプラネットエナジー＆ソリューションズ株式会社 | 端子部品、該端子部品の製造方法、および二次電池 |
-
2002
- 2002-02-26 JP JP2002101927A patent/JP2003258170A/ja active Pending