JP2003253410A - Method of producing magnesium thin sheet and electronic equipment case made of magnesium - Google Patents

Method of producing magnesium thin sheet and electronic equipment case made of magnesium

Info

Publication number
JP2003253410A
JP2003253410A JP2002056873A JP2002056873A JP2003253410A JP 2003253410 A JP2003253410 A JP 2003253410A JP 2002056873 A JP2002056873 A JP 2002056873A JP 2002056873 A JP2002056873 A JP 2002056873A JP 2003253410 A JP2003253410 A JP 2003253410A
Authority
JP
Japan
Prior art keywords
magnesium
magnesium material
plate
flat plate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002056873A
Other languages
Japanese (ja)
Inventor
Kinya Niizeki
欽也 新関
Masayuki Kobayashi
正幸 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PROJECT ONE KK
Itochu Corp
Original Assignee
PROJECT ONE KK
Itochu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PROJECT ONE KK, Itochu Corp filed Critical PROJECT ONE KK
Priority to JP2002056873A priority Critical patent/JP2003253410A/en
Priority to CN 03105170 priority patent/CN1442247A/en
Publication of JP2003253410A publication Critical patent/JP2003253410A/en
Pending legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnesium thin sheet which is useful as various electronic equipment cases. <P>SOLUTION: A magnesium billet of is subjected to hot extrusion molding into a planar sheet having a sheet thickness of 0.4 to 1.5 mm. After that, at least one side of the planar sheet is subjected to facing so as to be finished into a product sheet thickness. The magnesium planar sheet obtained by the extrusion molding is faced, preferably, by a facing quantity of ≥0.09 mm per side. By this method, a magnesium thin sheet having a sheet thickness of 0.3 to 1.2 mm can be produced. The obtained magnesium thin sheet exhibits and excellent surface condition freed of die marks and oxide films produced on the extrusion molding by the facing, and is used as the casing material of various electronic equipments. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、板厚0.3〜1.2mm
のマグネシウム材料薄板を製造する方法及びマグネシウ
ム材料薄板を使用した電子機器ケースに関する。
BACKGROUND OF THE INVENTION The present invention has a plate thickness of 0.3 to 1.2 mm.
And a method for manufacturing a magnesium material thin plate, and an electronic device case using the magnesium material thin plate.

【0002】[0002]

【従来の技術】マグネシウム材料は、優れた電磁シール
ド機能,軽量性,振動減衰能,放熱性等を活用し携帯用
電子機器のケーシング材料に使用されている。結晶構造
が最密六方晶型のマグネシウムでは、室温で比較的容易
に起こりやすい底面辷り系の他に、高温にならないと滑
動しにくい柱面辷り系や錐面辷り系等がある。しかも、
加工硬化率の大きな材料でもある。そのため、マグネシ
ウム材料は、冷間加工性に劣り、実用的には10〜20
%程度の冷間加工が限度である。
2. Description of the Related Art Magnesium materials have been used as casing materials for portable electronic devices by taking advantage of their excellent electromagnetic shielding function, light weight, vibration damping ability and heat radiation ability. In the close-packed hexagonal crystal structure of magnesium, in addition to the bottom-bottomed system, which tends to occur relatively easily at room temperature, there are column-shaped and conical-sided systems that are hard to slide at high temperatures. Moreover,
It is also a material with a high work hardening rate. Therefore, the magnesium material is inferior in cold workability and is practically 10 to 20.
There is a limit to cold working of about%.

【0003】マグネシウム材料薄板を用いた電子機器ケ
ースの製造には、圧延→プレス又は鍛造の製造法も一部
で採用されているものの、マグネシウム材料の材質を考
慮してダイカスト法による製造が大半である。ダイカス
ト法ではマグネシウム材料溶湯を金型に圧入して製品形
状に成形するが、ダイカスト鋳物の表面に湯皺が発生し
やすく、鋳物内面部に設けた補強用リム,ネジ止め用ボ
ス等にヒケ巣が発生しやすい。湯皺,ヒケ巣等の欠陥が
あるとダイカスト製品の外観が著しく損なわれるので、
欠陥部を埋めるパテ処理工程が必要になる。パテ処理
は、ダイカスト鋳物表面を目視観察し、検出された個々
の欠陥部を手作業で補修する非常に能率の悪い工程であ
り、結果としてダイカスト製品のコストを上昇させる要
因になっている。
Although a manufacturing method of rolling → pressing or forging is partially adopted for manufacturing an electronic device case using a magnesium material thin plate, most of the manufacturing method is a die casting method in consideration of the material of the magnesium material. is there. In the die casting method, molten magnesium material is pressed into a mold to form the product shape, but wrinkles are likely to occur on the surface of the die casting, and the reinforcement rim provided on the inner surface of the casting, the boss for screwing, etc. Is likely to occur. If there are defects such as wrinkles or burrs, the appearance of die cast products will be significantly impaired.
A putty processing step for filling the defective portion is required. The putty treatment is a very inefficient process of visually observing the surface of the die cast casting and manually repairing the detected individual defective portions, and as a result, it is a factor of increasing the cost of the die casting product.

【0004】[0004]

【発明が解決しようとする課題】ダイカスト法に代わる
方法で薄板状のマグネシウム材料を製造できると、コス
ト上昇の原因となるパテ処理を省略でき、比較的安価な
マグネシウム材料薄板が提供される。このような方法と
して、鋳造した平板状マグネシウム材料を圧延,プレ
ス,鍛造等で薄板状に成形する方法が特開2001−294966
号公報で紹介されている。しかし、平板状マグネシウム
材料は、鋳造法で製造されることから鋳造可能な板厚に
限界があり、複雑な設備構成を要するチクソモールド法
に依る場合も1mmを若干下回る板厚が限界である。鋳
造可能な板厚に加わる制約のため後続する圧延,プレ
ス,鍛造等の加工工程で圧下率を大きく設定する必要が
あり、加工欠陥に起因する不良品の発生率が高くなる。
製造可能なマグネシウム材料薄板も、Al:4〜20質
量%を含むAl−Mg合金に限られており、汎用性に乏
しい。
If a thin plate-shaped magnesium material can be manufactured by a method that replaces the die-casting method, the putty treatment that causes a cost increase can be omitted, and a relatively inexpensive magnesium material thin plate can be provided. As such a method, there is a method of forming a cast tabular magnesium material into a thin plate shape by rolling, pressing, forging, or the like.
It is introduced in the Gazette. However, since the plate-shaped magnesium material is manufactured by the casting method, there is a limit to the plate thickness that can be cast, and even when the thixomold method, which requires a complicated equipment configuration, is used, the plate thickness is slightly less than 1 mm. Due to the restriction on the plate thickness that can be cast, it is necessary to set a large reduction rate in the subsequent processing steps such as rolling, pressing, forging, etc., which increases the rate of defective products due to processing defects.
Manufacturable magnesium material thin plates are also limited to Al-Mg alloys containing Al: 4 to 20% by mass, and thus lack versatility.

【0005】[0005]

【課題を解決するための手段】本発明は、このような問
題を解消すべく案出されたものであり、平板状に押出成
形したマグネシウム材料平板を面削することによって、
従来のマグネシウム材料板に比較して薄く、しかも良好
な表面性状を呈するマグネシウム材料薄板を少ない工程
で安価に製造することを目的とする。
The present invention has been devised to solve such a problem, and a magnesium material flat plate extruded into a flat plate shape is chamfered,
It is an object of the present invention to manufacture a magnesium material thin plate which is thinner than a conventional magnesium material plate and has a good surface property at low cost in a small number of steps.

【0006】本発明の製造方法は、その目的を達成する
ため、マグネシウム材料のビレットを熱間で板厚0.4
〜1.5mmの平板に押出成形した後、平板の少なくと
も片面を面削して製品板厚に仕上げることを特徴とす
る。押出成形で得られたマグネシウム材料平板は、好ま
しくは片面当り0.09mm以上の面削量で面削され
る。
In the manufacturing method of the present invention, in order to achieve the object, a billet of a magnesium material is hot-rolled to a plate thickness of 0.4.
After being extruded into a flat plate of up to 1.5 mm, at least one surface of the flat plate is chamfered to finish to a product plate thickness. The magnesium material flat plate obtained by extrusion molding is preferably chamfered with a chamfering amount of 0.09 mm or more per one surface.

【0007】この方法によるとき、板厚0.3〜1.2m
mのマグネシウム材料薄板を製造可能である。得られた
マグネシウム材料薄板は,押出成形時に生じたダイスマ
ークや酸化皮膜が面削で除去された美麗な表面状態を呈
し、必要に応じて化成処理,陽極酸化,塗装等の表面仕
上げを施して各種電子機器のケーシング材に使用され
る。なお、本件明細書では、純マグネシウム及びマグネ
シウム合金を「マグネシウム材料」で総称している。
According to this method, the plate thickness is 0.3 to 1.2 m.
It is possible to manufacture a sheet of magnesium material of m. The obtained magnesium material thin plate has a beautiful surface condition in which die marks and oxide film generated during extrusion molding are removed by chamfering, and if necessary surface treatment such as chemical conversion treatment, anodization and painting is performed. It is used as a casing material for various electronic devices. In this specification, pure magnesium and magnesium alloys are collectively referred to as “magnesium material”.

【0008】[0008]

【作用】マグネシウム材料は、材料温度が高くなるほど
柱面辷り系,錐面辷り系の臨界剪断応力が低下し、24
0〜400℃で種々の方法による加工が可能になる点で
熱間加工に適した材料といえる。また、押出成形法の技
術進歩に伴い板厚0.4mm程度の薄板にマグネシウム
材料を押出加工することも可能になっている。しかし、
押出成形で得られるマグネシウム材料平板の表面に酸化
皮膜が生成しており、無数のダイスマークが平板長手方
向に延びている。ダイスマークや酸化皮膜は、押出製品
に塗装を施した後でも塗膜表面に反映され、製品の表面
性状を劣化させる。また、押出成形されたマグネシウム
材料平板の板厚にバラツキが生じることが避けられな
い。他方、マグネシウム材料は、アルミニウム合金に比
較すると切削性が非常に優れており、連続切削の支障と
なる長い切り粉の発生もない。
[Function] With magnesium materials, the higher the material temperature, the lower the critical shear stress in the column-shaped conical system and conical conical system.
It can be said that the material is suitable for hot working because it can be worked by various methods at 0 to 400 ° C. Further, with the technical progress of the extrusion molding method, it has become possible to extrude a magnesium material into a thin plate having a plate thickness of about 0.4 mm. But,
An oxide film is formed on the surface of the magnesium material flat plate obtained by extrusion molding, and innumerable die marks extend in the longitudinal direction of the flat plate. The die mark and oxide film are reflected on the coating film surface even after coating the extruded product, and deteriorate the surface property of the product. In addition, variations in the thickness of the extruded magnesium material flat plate are unavoidable. On the other hand, the magnesium material has extremely excellent machinability as compared with the aluminum alloy, and does not generate long chips that hinder continuous cutting.

【0009】本発明は、マグネシウム材料が熱間加工性
及び切削性に優れていることに着目し、マグネシウム材
料平板を製造する押出成形と製品板厚にする面削とを組
み合わせることにより、板厚0.3〜1.2mmのマグネ
シウム材料薄板を製造可能にしたものである。押出成形
では、マグネシウム材料平板を板厚0.4〜1.5mmに
するが、現在の押出成形法によるとき十分に達成可能な
板厚である。面削にはフライス盤,フラップホイール,
スカーファー等が使用され、マグネシウム材料平板の押
出材表面にある酸化皮膜やダイスマークが除去されると
共に、板厚のバラツキも解消される。
The present invention focuses on the fact that the magnesium material is excellent in hot workability and machinability, and by combining extrusion molding for producing a magnesium material flat plate and chamfering for making a product plate thickness, It is possible to manufacture a magnesium material thin plate of 0.3 to 1.2 mm. In extrusion molding, the flat plate of magnesium material is made to have a plate thickness of 0.4 to 1.5 mm, which is a plate thickness that can be sufficiently achieved by the current extrusion molding method. Milling machine, flap wheel,
A scarfer or the like is used to remove the oxide film and die marks on the surface of the extruded material of the magnesium material flat plate, and to eliminate the variation in the plate thickness.

【0010】[0010]

【実施の形態】本発明で使用可能なマグネシウム材料に
は、押出加工性に優れた純MgやAZ31,AZ21,
ZK30,ZK10,ZK60,M1,M4,M5等が
ある。マグネシウム材料を常法に従ってビレットに鋳造
し、必要に応じ皮剥きした後、ビレットを130〜45
0℃に予熱して押出加工機にセットし、2〜30m/分
の押出速度で板厚0.4〜1.5mmのマグネシウム材料
平板に押し出す。一般に、予熱温度,押出速度を低く設
定するほど押出成形品の形状精度は向上するが、押出成
形後の面削で製品板厚に仕上げる本発明法では、押出成
形品の形状精度はそれほど要求されない。そのため、予
熱温度,押出速度を上げることができ、押出成形の生産
性が向上する。ただし、押出成形で得られたマグネシウ
ム材料平板の板厚に過度のバラツキがあると、次工程で
面削量を大きく設定する必要があり、歩留の低下を来た
す。この点、予熱温度130〜450℃,押出速度2〜
30m/分は、目標板厚±0.04mmの範囲に板厚の
バラツキを抑える上で有効な押出条件である。
BEST MODE FOR CARRYING OUT THE INVENTION Magnesium materials usable in the present invention include pure Mg and AZ31, AZ21,
There are ZK30, ZK10, ZK60, M1, M4, M5 and the like. A magnesium material is cast into a billet according to a conventional method, and if necessary, the skin is peeled off, and then the billet is heated to 130-45.
It is preheated to 0 ° C., set in an extruder, and extruded on a magnesium material flat plate having a plate thickness of 0.4 to 1.5 mm at an extrusion speed of 2 to 30 m / min. Generally, the lower the preheating temperature and the extrusion speed are set, the more the shape accuracy of the extruded product is improved, but the shape accuracy of the extruded product is not so required in the method of the present invention in which the product sheet thickness is finished by the chamfering after the extrusion molding. . Therefore, the preheating temperature and the extrusion speed can be increased, and the productivity of extrusion molding is improved. However, if there is an excessive variation in the thickness of the magnesium material flat plate obtained by extrusion molding, it is necessary to set a large amount of chamfering in the next step, resulting in a decrease in yield. In this respect, the preheating temperature is 130 to 450 ° C, the extrusion speed is 2 to
30 m / min is an extrusion condition effective for suppressing the variation of the plate thickness within the range of the target plate thickness ± 0.04 mm.

【0011】押出成形で得られるマグネシウム材料平板
の目標板厚は、板厚0.4〜1.5mmの範囲で選定され
る。目標板厚が下限0.4mmに近くなるほど、予熱温
度,押出速度を低めに設定する。他方、電子機器ケース
用途を対象としているので、電子機器の携帯性を考慮し
て1.5mmを目標板厚の上限に設定している。マグネ
シウム材料平板は、押出加工機のダイス出口から押し出
された時点で雰囲気との接触で表面酸化し、膜厚が数μ
m程度の酸化変色層が形成される。また、押出ダイスの
ベアリングとの摩擦によって、平板長手方向に延びる無
数のダイスマークがマグネシウム材料平板についてい
る。板厚も、目標板厚±0.04mmの範囲でばらつい
ている。
The target thickness of the magnesium material flat plate obtained by extrusion molding is selected in the range of 0.4 to 1.5 mm. As the target plate thickness approaches the lower limit of 0.4 mm, the preheating temperature and extrusion speed are set lower. On the other hand, since it is intended for electronic device cases, the upper limit of the target plate thickness is set to 1.5 mm in consideration of portability of electronic devices. The magnesium material flat plate is surface-oxidized by contact with the atmosphere when it is extruded from the die exit of the extruder, and the film thickness is several μm.
An oxidative discoloration layer of about m is formed. Further, due to friction with the bearing of the extrusion die, countless die marks extending in the longitudinal direction of the flat plate are attached to the flat plate of magnesium material. The plate thickness also varies within the target plate thickness ± 0.04 mm.

【0012】酸化変色層,ダイスマーク,板厚のバラツ
キ等の欠陥は、押出成形に続く面削によって除去でき
る。すなわち、板厚0.4〜1.5mmのマグネシウム材
料平板を面削するとき、平板表面から酸化変色層やダイ
スマークが除去され、板厚のバラツキも解消される。面
削量を0.09mm以上に設定することにより、酸化変
色層,ダイスマーク,板厚のバラツキ等の欠陥が効率よ
く除去され、マグネシウム材料平板が製品板厚に仕上げ
られる。面削されたマグネシウム材料平板は、美麗な金
属光沢をもち、色ムラや凹凸のない良質の表面状態にな
っている。そのため、面削されたままでも製品として使
用できるが、化成処理,陽極酸化,塗装等で意匠性を向
上させることも可能である。化成処理又は陽極酸化で生
成した皮膜や塗膜は、マグネシウム材料が酸化性雰囲気
に直接接触することを防止し、耐酸化性を向上させるこ
とにもなる。
Defects such as an oxidative discoloration layer, die marks, and variations in plate thickness can be removed by chamfering following extrusion molding. That is, when a flat plate of a magnesium material having a plate thickness of 0.4 to 1.5 mm is chamfered, the oxidative discoloration layer and the die mark are removed from the plate surface, and the plate thickness variation is also eliminated. By setting the amount of chamfering to 0.09 mm or more, defects such as an oxidation discoloration layer, die marks, and variations in plate thickness are efficiently removed, and a flat plate of magnesium material is finished to a product plate thickness. The chamfered magnesium material flat plate has a beautiful metallic luster and has a good surface condition without uneven color or unevenness. Therefore, it can be used as a product even after being face-polished, but the designability can be improved by chemical conversion treatment, anodic oxidation, painting, etc. The coating film or coating film formed by the chemical conversion treatment or anodization prevents the magnesium material from directly contacting the oxidizing atmosphere and improves the oxidation resistance.

【0013】製品板厚に仕上げられたマグネシウム材料
薄板は、プレス,鍛造等によって製品形状に加工され
る。電子機器ケースの用途では、面削したマグネシウム
材料平板の表面が外側となるようにプレス又は鍛造す
る。製品形状に加工された後、必要に応じて化成処理,
陽極酸化,塗装等の表面仕上げが施される。このように
して作製されたケーシング材は、マグネシウム材料の優
れた電磁シールド性,軽量性,振動減衰能,放熱性を活
用し、携帯電話,ポータブルプレーヤ,ノート型パソコ
ン等、各種電子機器に使用される。
The magnesium material thin plate finished to the product plate thickness is processed into a product shape by pressing, forging or the like. For use as an electronic device case, pressing or forging is performed so that the surface of the chamfered magnesium material flat plate faces the outside. After processed into product shape, chemical conversion treatment, if necessary,
Surface finish such as anodic oxidation and painting is applied. The casing material produced in this way is used in various electronic devices such as mobile phones, portable players, and notebook computers by utilizing the excellent electromagnetic shielding properties, light weight properties, vibration damping properties, and heat dissipation properties of magnesium materials. It

【0014】[0014]

【実施例】溶製した各種マグネシウム材料から得られた
ビレットを皮剥きすることにより、押出成形に供される
径204mmのビレットを用意した。ビレットを予熱し
た後、幅100mmで板厚相当のスリットが穿設された
押出ダイスを装着した押出加工機のコンテナに装填し、
押出速度5m/分でマグネシウム材料平板を表1の各板
厚に押出成形した。得られたマグネシウム材料平板の表
面を観察すると、無数のダイスマークや酸化皮膜が検出
された。マグネシウム材料平板が常温まで冷却された
後、面削によって酸化皮膜やダイスマークを除去すると
共に、目標製品板厚のマグネシウム材料薄板に仕上げ
た。
Example A billet having a diameter of 204 mm to be subjected to extrusion molding was prepared by peeling a billet obtained from various molten magnesium materials. After preheating the billet, the billet is loaded into a container of an extruder equipped with an extrusion die having a width of 100 mm and a slit corresponding to the plate thickness,
A magnesium material flat plate was extruded into each plate thickness shown in Table 1 at an extrusion speed of 5 m / min. When the surface of the obtained magnesium material flat plate was observed, numerous die marks and oxide films were detected. After the magnesium material flat plate was cooled to room temperature, the oxide film and the die mark were removed by chamfering, and the magnesium product thin plate of the target product thickness was finished.

【0015】 [0015]

【0016】面削後のマグネシウム材料薄板を観察する
と、何れの薄板でも酸化皮膜やダイスマークが完全に除
去され、凹凸や色ムラがなく金属光沢のある外観を呈し
ていた。板厚変動も極く僅かであり、形状精度の高い製
品であった。各マグネシウム材料薄板にクリア塗料及び
着色顔料を配合した塗料を塗布し、乾燥・焼付けによっ
てクリア塗膜,着色塗膜を形成した。塗装後の表面を目
視観察したところ、凹凸や塗膜欠陥が検出されず、クリ
ア塗膜,着色塗膜の何れも高い平面度をもっていた。し
たがって、本発明に従って製造されたマグネシウム材料
薄板は、美麗な表面性状を呈するケーシング材として使
用可能なことが判る。
When observing the magnesium material thin plate after the surface cutting, the oxide film and the die mark were completely removed from any of the thin plates, and the appearance had a metallic luster without unevenness or color unevenness. The plate thickness variation was extremely small, and the product had high shape accuracy. A clear paint and a paint containing a coloring pigment were applied to each magnesium material thin plate, and a clear paint film and a colored paint film were formed by drying and baking. When the surface after coating was visually observed, no irregularities or coating film defects were detected, and both the clear coating film and the colored coating film had high flatness. Therefore, it is understood that the magnesium material thin plate manufactured according to the present invention can be used as a casing material having a beautiful surface texture.

【0017】比較のため、マグネシウム合金AZ91を
溶解し、溶湯温度620〜660℃でダイカスト金型に
鋳込み、平均板厚1mmの箱型鋳物を鋳造した。箱型鋳
物を観察したところ、合金溶湯の金型内合流部に湯皺が
発生しており、リム部やボス部にヒケ巣が検出された。
湯皺,ヒケ巣等の欠陥があるマグネシウム材料鋳物を塗
装すると欠陥が塗膜に反映されて塗膜面に凹凸が生じる
ので、パテ処理で欠陥部を補修する必要があった。
For comparison, magnesium alloy AZ91 was melted and cast into a die casting mold at a molten metal temperature of 620 to 660 ° C. to cast a box-shaped casting having an average plate thickness of 1 mm. As a result of observing the box-shaped casting, wrinkles were found at the confluence of the molten alloy in the mold, and sink marks were detected at the rim and boss.
When a cast magnesium material having defects such as wrinkles and burrs is coated, the defects are reflected in the coating film and unevenness occurs on the coating film surface, so it was necessary to repair the defective portion with putty treatment.

【0018】[0018]

【発明の効果】以上に説明したように、本発明は、マグ
ネシウム材料が熱間加工性及び切削性に優れていること
に着目し、中間板厚のマグネシウム材料平板を押出成形
し、面削によって製品板厚に仕上げている。押出成形で
マグネシウム材料平板の表面に生じた酸化皮膜やダイス
マークは面削で除去され、マグネシウム材料平板の板厚
変動も面削で解消されるため、表面性状,形状精度に優
れたマグネシウム材料薄板が得られる。得られたマグネ
シウム材料薄板は、マグネシウム材料本来の優れた電磁
シールド性,軽量性,防振性能,放熱性を活用し、携帯
電話,ポータブルプレーヤ,ノート型パソコン等、各種
電子機器のケーシング材として使用される。
As described above, the present invention focuses on the fact that the magnesium material is excellent in hot workability and machinability, and extrudes a magnesium material flat plate having an intermediate plate thickness and Finished to product thickness. The oxide film and die marks generated on the surface of the magnesium material flat plate by extrusion are removed by chamfering, and the fluctuation of the thickness of the magnesium material flat plate is also eliminated by the chamfering, so the magnesium material thin plate with excellent surface properties and shape accuracy Is obtained. The obtained magnesium material thin plate is used as a casing material for various electronic devices such as mobile phones, portable players, laptop computers, etc. by utilizing the excellent electromagnetic shielding property, lightweight property, vibration damping property, and heat dissipation property of magnesium material. To be done.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) B21K 23/00 B21K 23/00 // C22F 1/00 612 C22F 1/00 612 623 623 631 631Z 673 673 (72)発明者 小林 正幸 茨城県取手市西二丁目1番F−202号 有 限会社 プロジェクト・ワン内 Fターム(参考) 4E029 AA07 4E087 CA21 DB04 DB24 HA91 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) B21K 23/00 B21K 23/00 // C22F 1/00 612 C22F 1/00 612 623 623 631 631Z 673 673 ( 72) Inventor Masayuki Kobayashi F-202, 1-2-1, Nishi 2-chome, Toride-shi, Ibaraki Limited F-term in Project One (reference) 4E029 AA07 4E087 CA21 DB04 DB24 HA91

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 マグネシウム材料のビレットを熱間で板
厚0.4〜1.5mmの平板に押出成形した後、平板の少
なくとも片面を面削して製品板厚に仕上げることを特徴
とするマグネシウム材料薄板の製造方法。
1. A magnesium material characterized by hot-extruding a billet of a magnesium material into a flat plate having a plate thickness of 0.4 to 1.5 mm, and then at least one surface of the flat plate is chamfered to obtain a product plate thickness. A method for manufacturing a thin plate of material.
【請求項2】 片面当りの面削量0.09mm以上で平
板を面削する請求項1記載の製造方法。
2. The method according to claim 1, wherein the flat plate is chamfered with a chamfering amount of 0.09 mm or more per one surface.
【請求項3】 面削した表面がケース外側となるようプ
レス成形又は鍛造加工で製品形状に加工されたマグネシ
ウム材料薄板を基材とするマグネシウム材料製電子機器
ケース。
3. An electronic equipment case made of a magnesium material, which comprises a magnesium material thin plate as a base material, which is machined into a product shape by press molding or forging so that the chamfered surface faces the outside of the case.
JP2002056873A 2002-03-04 2002-03-04 Method of producing magnesium thin sheet and electronic equipment case made of magnesium Pending JP2003253410A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002056873A JP2003253410A (en) 2002-03-04 2002-03-04 Method of producing magnesium thin sheet and electronic equipment case made of magnesium
CN 03105170 CN1442247A (en) 2002-03-04 2003-03-03 Manufacturing method of magnesium material thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002056873A JP2003253410A (en) 2002-03-04 2002-03-04 Method of producing magnesium thin sheet and electronic equipment case made of magnesium

Publications (1)

Publication Number Publication Date
JP2003253410A true JP2003253410A (en) 2003-09-10

Family

ID=27800102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002056873A Pending JP2003253410A (en) 2002-03-04 2002-03-04 Method of producing magnesium thin sheet and electronic equipment case made of magnesium

Country Status (2)

Country Link
JP (1) JP2003253410A (en)
CN (1) CN1442247A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011115856A (en) * 2011-01-20 2011-06-16 Sumitomo Electric Ind Ltd Method for producing magnesium long-length material
CN103042060A (en) * 2012-10-15 2013-04-17 孙逸成 Production line for preparing magnesium alloy sheets by semi-melt extrusion method and technology of production line
JP2014018959A (en) * 2012-07-20 2014-02-03 Advanced Power Electronics Corp Work with non-rotation curve
CN107159712A (en) * 2017-03-27 2017-09-15 清华大学深圳研究生院 A kind of magnesium alloy foil preparation method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011115856A (en) * 2011-01-20 2011-06-16 Sumitomo Electric Ind Ltd Method for producing magnesium long-length material
JP2014018959A (en) * 2012-07-20 2014-02-03 Advanced Power Electronics Corp Work with non-rotation curve
CN103042060A (en) * 2012-10-15 2013-04-17 孙逸成 Production line for preparing magnesium alloy sheets by semi-melt extrusion method and technology of production line
CN107159712A (en) * 2017-03-27 2017-09-15 清华大学深圳研究生院 A kind of magnesium alloy foil preparation method

Also Published As

Publication number Publication date
CN1442247A (en) 2003-09-17

Similar Documents

Publication Publication Date Title
KR100903249B1 (en) Malleable, high mechanical strength aluminum alloy which can be anodized in a decorative manner, method for producing the same and aluminum product based on said alloy
EP2382334B1 (en) Aluminum alloy, aluminum alloy product and method for making the same
EP2476770B1 (en) Magnesium-lithium alloy, rolled material, molded article, and process for producing same
US8501301B2 (en) Magnesium alloy member and method of manufacturing the same
JP2011036913A (en) Metallic mold for high-temperature molding and method for manufacturing the same
CN110293145B (en) Magnesium-aluminum composite board and preparation method thereof
WO2010079534A1 (en) Magnesium alloy member
JP2003253410A (en) Method of producing magnesium thin sheet and electronic equipment case made of magnesium
CN104975214A (en) High-plasticity magnesium alloy and preparation method thereof
JP2018520268A5 (en)
JP2002254132A (en) Hot forging and forming method for magnesium alloy member
US4806211A (en) Aluminum alloy product with uniformly grey, light-fast surface and process for its manufacture
JP2004337935A (en) Magnesium alloy part, method for manufacturing the same and die
JP4666659B2 (en) Magnesium alloy forged thin casing and method for manufacturing the same
JP3982780B2 (en) Method for manufacturing forged thin-walled casing made of magnesium alloy
JP2007007693A (en) Working process for aluminum alloy
CN109328239B (en) Magnesium alloy material and preparation method thereof
US20170246673A1 (en) Rapid prototype stamping tool for hot forming of ultra high strength steel made of aluminum
CN109719280A (en) Bimetallic forming method and products thereof
JP4451546B2 (en) Mold for casting and manufacturing method thereof
TW200824832A (en) Metal-metal composite formation process and application
JP2001300643A (en) Manufacturing method of magnesium product
JP2002102986A5 (en)
JP2004332002A (en) Anodized plate with transparent lubricating resin coating
JP2004351485A (en) Method for working metal and work formed product

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050127

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060206

A131 Notification of reasons for refusal

Effective date: 20060214

Free format text: JAPANESE INTERMEDIATE CODE: A131

A02 Decision of refusal

Effective date: 20060704

Free format text: JAPANESE INTERMEDIATE CODE: A02