JP2003253371A5 - - Google Patents

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Publication number
JP2003253371A5
JP2003253371A5 JP2002369198A JP2002369198A JP2003253371A5 JP 2003253371 A5 JP2003253371 A5 JP 2003253371A5 JP 2002369198 A JP2002369198 A JP 2002369198A JP 2002369198 A JP2002369198 A JP 2002369198A JP 2003253371 A5 JP2003253371 A5 JP 2003253371A5
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JP
Japan
Prior art keywords
aluminum
alloy
ceramic particles
aluminum alloy
composite material
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Pending
Application number
JP2002369198A
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Japanese (ja)
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JP2003253371A (en
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Publication date
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Priority to JP2002369198A priority Critical patent/JP2003253371A/en
Priority claimed from JP2002369198A external-priority patent/JP2003253371A/en
Publication of JP2003253371A publication Critical patent/JP2003253371A/en
Publication of JP2003253371A5 publication Critical patent/JP2003253371A5/ja
Pending legal-status Critical Current

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Claims (3)

セラミック粒子が４０〜８５容積％、アルミニウムまたはアルミニウム合金が１５〜６０容積％からなるとともに、前記セラミック粒子間の間隙に前記アルミニウムまたはアルミニウム合金が連続相を形成し、かつ、前記セラミック粒子とアルミニウムまたはアルミニウム合金との界面に隙間がないようにした複合材本体と、この複合材本体の表裏面の少なくとも一面に当該複合材本体と一体的に設けられた被覆部材とを含み構成され、この被覆部材は、前記アルミニウム、アルミニウム合金、およびアルミニウムと亜鉛との合金のいずれかで形成されていることを特徴とする高熱伝導性複合材。The ceramic particles comprise 40 to 85% by volume, aluminum or aluminum alloy comprises 15 to 60% by volume, the aluminum or aluminum alloy forms a continuous phase in the gap between the ceramic particles, and the ceramic particles and aluminum or a composite body so there is no gap at the interface between the aluminum alloy, the said composite material comprises a body and a cover member provided integrally configured on at least one surface of front and back surfaces of the composite body, the covering member Is formed of any one of the above-mentioned aluminum, aluminum alloy, and aluminum / zinc alloy . 請求項１に記載の高熱伝導性複合材において、前記被覆部材が、前記複合材本体の表面にまぶした前記アルミニウム、アルミニウム合金、およびアルミニウムと亜鉛との合金のいずれかの紛体をホットプレスによって熱を加えながら徐々に加圧して形成されていることを特徴とする高熱伝導性複合材。  2. The high thermal conductivity composite material according to claim 1, wherein the covering member heats the powder of any one of the aluminum, the aluminum alloy, and the alloy of aluminum and zinc coated on the surface of the composite material body by hot pressing. A highly heat-conductive composite material characterized by being formed by gradually applying pressure while adding. 請求項１または請求項２に記載の高熱伝導性複合材を製造する方法であって、前記セラミック粒子とアルミニウムまたはアルミニウム合金とを複合する際に金型を使用して行い、前記金型のキャビティに前記セラミック粒子を充填した後、前記キャビティ内を真空で吸引しながら前記セラミック粒子間の間隙に前記アルミニウムまたはアルミニウム合金の溶湯を含浸させるとともに凝固を行って前記複合材本体を製造した後、この複合材本体の表裏面の少なくとも一面に前記アルミニウム、アルミニウム合金、およびアルミニウムと亜鉛との合金のいずれかの紛体をまぶした後、この紛体をホットプレスにより熱を加えながら徐々に加圧して前記被覆部材を形成することを特徴とする高熱伝導性複合材の製造方法。  A method for producing a high thermal conductivity composite material according to claim 1 or 2, wherein the ceramic particles and aluminum or an aluminum alloy are combined using a mold when the ceramic particles are combined with aluminum or an aluminum alloy. After the ceramic particles are filled in, the composite body is produced by impregnating the gap between the ceramic particles with the molten aluminum or the aluminum alloy while solidifying the cavity while vacuuming the cavity. After coating the powder of any one of the aluminum, aluminum alloy, and alloy of aluminum and zinc on at least one of the front and back surfaces of the composite body, the powder is gradually pressed while applying heat with a hot press to form the coating. A method for producing a high thermal conductivity composite material, comprising forming a member.
JP2002369198A 2001-12-21 2002-12-20 Composite material with high thermal conductivity and manufacturing method therefor Pending JP2003253371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002369198A JP2003253371A (en) 2001-12-21 2002-12-20 Composite material with high thermal conductivity and manufacturing method therefor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-388670 2001-12-21
JP2001388670 2001-12-21
JP2002369198A JP2003253371A (en) 2001-12-21 2002-12-20 Composite material with high thermal conductivity and manufacturing method therefor

Publications (2)

Publication Number Publication Date
JP2003253371A JP2003253371A (en) 2003-09-10
JP2003253371A5 true JP2003253371A5 (en) 2005-08-11

Family

ID=28676965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002369198A Pending JP2003253371A (en) 2001-12-21 2002-12-20 Composite material with high thermal conductivity and manufacturing method therefor

Country Status (1)

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JP (1) JP2003253371A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI276123B (en) 2003-11-05 2007-03-11 Tdk Corp Coil device
CN100590856C (en) * 2005-01-20 2010-02-17 联合材料公司 Member for semiconductor device and method for manufacture thereof
JP6497616B2 (en) * 2015-03-26 2019-04-10 株式会社アライドマテリアル Heat spreader
CN115138842B (en) * 2022-06-23 2023-10-20 洛阳科威钨钼有限公司 Preparation method of high-temperature air direct ignition flame stabilizer shell resistant to high-temperature oxidation

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