JP2003252959A - Epoxy resin composition and semiconductor device using the composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high flame retardancy and reliability of reflowing resistance and a semiconductor device sealed with it. <P>SOLUTION: The composition contains (A) an epoxy resin, (B) a hardening agent, (C) a filler and (D) a flame retardant, and (B) contains a phenol compound having repeated structural units of formula (I) (wherein R<SP>1</SP>-R<SP>4</SP>are each a hydrogen atom or a methyl group) and those of formula (II) (wherein R<SP>5</SP>-R<SP>8</SP>are each a hydrogen atom or a methyl group). Preferably, (D) consists of one or more of (d1) organic phosphorus compounds, (d2) red phosphorus and (d3) metal hydroxides. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition which is excellent in flame retardancy, reflow reliability and moldability and is particularly suitable for semiconductor encapsulation.

[0002]

2. Description of the Related Art As a sealing method for electronic circuit parts such as semiconductor devices, resin sealing with an epoxy resin is most widely used from the viewpoint of the balance of economy, productivity and physical properties.
As a sealing method using an epoxy resin, a method of using a composition obtained by adding a curing agent, a filler, etc. to an epoxy resin, setting a semiconductor element in a mold, and sealing by a transfer molding method is generally performed. It is being appreciated.

Recently, the mounting of a semiconductor device package on a printed circuit board has been increased in density and automation. Instead of the conventional "insertion mounting method" in which lead pins are inserted into holes in the board, the semiconductor device package is mounted on the surface of the substrate. "Surface mounting method" for soldering solder has become popular. Along with this, the semiconductor device package has changed from the conventional DIP (dual in-line package) to a thin FPP (flat plastic package) suitable for high-density mounting and surface mounting.
Package). Among them, recently
Due to advances in fine processing technology, TSO with a thickness of 2 mm or less
P, TQFP and LQFP are becoming mainstream. Therefore, it becomes more susceptible to external influences such as humidity and temperature, and reliability such as reflow reliability, high temperature reliability, and moisture resistance reliability will become more important in the future. In particular, recently, it has been demanded to improve the reflow reliability in a package having a thickness of 1 mm or less such as TSOP and TQFP.

In surface mounting, solder reflow is usually used for mounting. In this method, a semiconductor device package is placed on a substrate, exposed to a high temperature of 200 ° C. or higher, and the solder previously attached to the substrate is melted to adhere the semiconductor device package to the substrate surface. In such a mounting method, since the entire semiconductor device package is exposed to high temperature, if the hygroscopicity of the sealing resin is high, peeling may occur between the sealing resin and the semiconductor chip, or between the sealing resin and the lead frame, There is a problem that the absorbed moisture expands explosively at the time of solder reflow to generate cracks. Furthermore, in recent years, lead-free solders that do not contain lead have been used from the viewpoint of environmental protection, but lead-free solders have a high melting point, which increases the reflow temperature, resulting in higher reflow reliability. It has been demanded.

On the other hand, in electronic parts such as semiconductor devices, it is now indispensable to comply with UL94 V-0, which is a flame retardant standard. Hitherto, it has been general to use halogenated compounds such as brominated epoxy resin and antimony oxide for flame retarding epoxy resin for semiconductor encapsulation.

[0006] However, regarding the above-mentioned technology for imparting flame retardancy, there is a danger that the generation of harmful gases such as hydrogen bromide, bromine gas and antimony bromide at the time of combustion may be harmful to the human body and corrosive to equipment, and the semiconductor element may be sealed. Environmental safety has become a problem, such as industrial waste produced during the stoppage process and disposal of semiconductor devices after use. Furthermore, if a semiconductor device adopting the above flame retardant technology is left at high temperature for a long time, aluminum wiring on the semiconductor element will be corroded by the effect of liberated bromine, causing failure of the semiconductor device. The decrease in sex is a problem.

In order to solve the above problems, there has been proposed a method of adding a large amount of a non-halogen-nonantimony type metal hydroxide as an inorganic flame retardant as a flame retardant. However, in this method, a large amount of metal hydroxide (for example, 20% by weight or more based on the total resin composition) must be used, and reflow resistance, fluidity, and high temperature reliability are significantly deteriorated. It was

In addition to the method of using a metal hydroxide as an inorganic flame retardant, a method of adding a phosphorus flame retardant has also been proposed (Japanese Patent Laid-Open Nos. 9-235449 and 11).
-269345). When these phosphorus-based flame retardants are compounded in the semiconductor encapsulating resin composition, there is a problem in that the adhesion of the resin to various members decreases under moisture absorption and the peeling and cracks during the solder reflow increase. It was

As described above, the conventional flame-retardant technology causes the above-mentioned problems. Therefore, the material is a safe and non-polluting material that does not generate harmful gas during combustion, and is flame-retardant and does not reflow during solder reflow. There is a strong demand for a resin composition having excellent reliability in total.

[0010]

The object of the present invention has been made in view of the above circumstances, and is an epoxy resin composition having excellent flame retardancy and solder reflow reliability, and the epoxy resin. An object is to provide a semiconductor device sealed with a composition.

[0011]

In order to solve the above problems, the present invention mainly has the following configuration. That is,
An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), a filler (C) and a flame retardant (D),
An epoxy resin composition, wherein the curing agent (B) contains a phenol compound having a repeating unit structure represented by the following chemical formulas (I) and (II).

[0012]

[Chemical 7] (R ^{1 to} R ⁴ represent a hydrogen atom or a methyl group.)

[0013]

[Chemical 8] (R ^{5 to} R ⁸ represent a hydrogen atom or a methyl group.) ”.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The constitution of the present invention will be described in detail below.

The epoxy resin composition of the present invention contains an epoxy resin (A), a curing agent (B) and a filler (C).

The epoxy resin (A) in the present invention is not particularly limited as long as it has two or more epoxy groups in one molecule, and specific examples thereof include, for example, cresol novolac type epoxy resin and bishydroxybiphenyl type. Epoxy resin, bisphenol A type epoxy resin,
Bisphenol F type epoxy resin, linear aliphatic type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin,
Examples thereof include halogenated epoxy resins and spiro ring-containing epoxy resins.

Among them, the biphenyl type epoxy represented by the chemical formula (VII) and the bisphenol type epoxy represented by the chemical formula (VIII) having good adhesion to the lead frame member are preferable.

[0018]

[Chemical 9] (In the formula, R ^{9 to} R ¹² represent a hydrogen atom or a methyl group.)

[0019]

[Chemical 10] (In the formula, R ^{13 to} R ^{18 each} represent a hydrogen atom or a methyl group.) Two or more kinds of epoxy resins may be used in combination depending on the use, but as a semiconductor device encapsulating material, biphenyl is used from the viewpoint of adhesion. Type epoxy or bisphenol type epoxy alone or in combination is preferably contained in the total epoxy resin (A) in an amount of 50% by weight or more.

The amount of the epoxy resin (A) added is usually 5.0 to 10.0% by weight based on the whole composition.

The curing agent (B) in the present invention contains a phenol compound (b) having a repeating unit structure represented by the chemical formulas (I) and (II) as an essential component.

[0022]

[Chemical 11] (R ^{1 to} R ⁴ represent a hydrogen atom or a methyl group.)

[0023]

[Chemical 12] (R ^{5 to} R ⁸ represent a hydrogen atom or a methyl group.) By using the phenol compound having the repeating unit structure represented by the chemical formulas (I) and (II), the adhesiveness of the sealing resin is improved, The crack resistance performance is significantly improved.

The phenol compound having the repeating unit structure represented by the chemical formulas (I) and (II) has the formula (I)
Is a polymer in which the repeating unit of the biphenyl derivative represented by and the repeating unit of the xylene derivative represented by the chemical formula (II) are bonded. Of these, a random copolymer in which these units are randomly bonded is preferable. The method for producing the random copolymer is not particularly limited, and the random copolymer is produced in the same manner as a known phenol resin. However, the number of moles of repeating units of the biphenyl derivative represented by the chemical formula (I) in the polymer and the chemical formula ( The ratio of the number of moles of the repeating unit of the xylene derivative represented by II) is preferably 30:70 to 70:30, and particularly, the ratio of the starting materials at the time of polymerization is about equal to 45:55 to 55:45. It is preferable to make the number of moles the same. Further, the hydroxyl equivalent of this random copolymer is preferably about 180 to 200.
The end of the polymer may be end-capped with any compound, but is preferably end-capped with phenol.

Each homopolymer, that is, only the polymer having only the repeating unit represented by the chemical formula (I) (biphenyl-containing phenol aralkyl resin) or the polymer having only the repeating unit represented by (II) (phenol aralkyl resin) was used. In this case, the adhesiveness is insufficient when the phenol aralkyl resin alone is used, and the crack resistance is insufficient when the biphenyl-containing phenol aralkyl resin alone is used. Further, when these homopolymers are mixed and used, although the adhesion and crack resistance are slightly improved, they are not always sufficient. There is also the problem of reduced fluidity.

On the other hand, by using the phenolic compound having the repeating unit structure represented by the chemical formulas (I) and (II), the adhesion and the crack resistance are greatly improved and the fluidity is not lowered.

The viscosity of the phenolic compound having the repeating unit structure represented by the chemical formulas (I) and (II) is 15
From the viewpoint of fluidity, it is preferable that the ICI viscosity at 0 ° C is 2 Poise or less.

The curing agent (B) may be 2 depending on the use.
Although more than one type of curing agent may be used in combination, the type is not particularly limited as long as it reacts with the epoxy resin (A) and is cured, and specific examples of the curing agent that can be used in combination include, for example, phenol. Novolak resins such as novolac and cresol novolac, bisphenol compounds such as bisphenol A, acid anhydrides such as maleic anhydride, phthalic anhydride and pyromellitic anhydride, and aromatic amines such as metaphenylenediamine, diaminodiphenylmethane and diaminodiphenylsulfone. Can be given. Among them, a curing agent having a phenolic hydroxyl group is preferable for sealing a semiconductor device because of its excellent heat resistance, moisture resistance and storage stability. Specific examples of the curing agent having a phenolic hydroxyl group include novolac resins such as phenol novolac resin, cresol novolac resin and naphthol novolac resin, tris (hydroxyphenyl) methane, 1,1,2-tris (hydroxyphenyl) ethane, 1 , 1,3-tris (hydroxyphenyl) propane, a condensation compound of terpene and phenol, a dicyclopentadiene skeleton-containing phenol resin, a phenol aralkyl resin, and a naphthol aralkyl resin.

The content of the curing agent (B) in the total epoxy resin composition is usually 2.5 to 10% by weight, and the mixing ratio of the epoxy resin (A) and the curing agent (B) is usually 1. It is 5 to 0.5.

Further, in the present invention, the epoxy resin (A)
A curing catalyst may be used to accelerate the curing reaction of the curing agent (B). The curing catalyst is not particularly limited as long as it accelerates the curing reaction, and for example, 2-methylimidazole,
Imidazole compounds such as 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, triethylamine, benzyldimethylamine, α-methylbenzyl Methylamine, 2- (dimethylaminomethyl) phenol,
Tertiary amine compounds such as 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo (5,4,0) undecene-7 and salts thereof, zirconium tetramethoxide, zirconium tetrapropoxide, Organometallic compounds such as tetrakis (acetylacetonato) zirconium and tri (acetylacetonato) aluminum, and triphenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, Organic phosphine such as tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrabenzoic acid borate, tetraphenylphosphonium tetranaphthoic acid borate Emissions compounds and such salts thereof.

Two or more kinds of these curing catalysts may be used in combination depending on the use, and the addition amount thereof is preferably in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the epoxy resin (A).

The type of the filler (C) in the present invention is preferably spherical silica (c), and the proportion thereof is the filler (C).
It is preferably 80% by weight or more based on the whole. Generally, as the proportion of the filler (C) increases, the moldability such as fluidity deteriorates, but by using the spherical silica (c), the deterioration of fluidity can be further suppressed.
Regarding the particle size of the spherical silica (c), the average particle size (median size) is preferably 20 μm or less.

Two or more kinds of fillers can be used in combination depending on the intended use. As the filler used in combination, an inorganic filler is preferable, and specifically, fused silica, crystalline silica,
Examples thereof include calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, titanium oxide, asbestos and glass fiber. The shape and average particle size of the fillers used in combination are not particularly limited, but spherical is preferable from the viewpoint of fluidity and moldability, and the average particle size is preferably 20 μm or less.

In the present invention, it is preferable to add a silane coupling agent for the purpose of improving reliability. As the silane coupling agent, a known silane coupling agent can be used. Specific examples thereof include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-
β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N
-Phenyl-γ-aminopropyltrimethoxysilane,
Examples include γ-mercaptopropyltrimethoxysilane and γ-ureidopropyltriethoxysilane, and two or more types may be added depending on the application.

From the viewpoint of moldability and reliability, the amount of the silane coupling agent added is usually 0.1 to 5 parts by weight, preferably 0.2 to 3 parts by weight, and particularly preferably 100 parts by weight of the filler. Is 0.3 to 1.5 parts by weight. The silane coupling agent can be added by mixing with other components, but in the present invention, the surface treatment of the filler (C) with the silane coupling agent in advance can be performed.
It is preferable in terms of improving reliability, adhesiveness and fluidity.

The epoxy resin composition of the present invention includes a coloring agent such as carbon black and iron oxide, silicone rubber,
Styrene block copolymers, olefin polymers, elastomers such as modified nitrile rubber and modified polybutadiene rubber, thermoplastic resins such as polystyrene, coupling agents such as titanate coupling agents, long chain fatty acids, metal salts of long chain fatty acids. A long-chain fatty acid ester, a long-chain fatty acid amide, a release agent such as paraffin wax, and a cross-linking agent such as an organic peroxide can be optionally added.

In the present invention, as the flame retardant (D),
It contains at least one of an organic adjacent compound (d1), red phosphorus (d2) and a metal hydroxide (d3). (D1) ~
(D3) may be used alone or in combination. When used in combination, the compounding ratio can be arbitrary.

Examples of the organophosphorus compound (d1) of the present invention include compounds represented by the general formulas (III) to (VI), and specific examples thereof will be given below.

As a specific example of the general formula (III), the following formula (IX)
The compound shown by is mentioned.

[0040]

[Chemical 13] (In the formula, X ¹ represents an aryl group or an alkyl group. X ² represents a hydroxyl group, an aryl group or an alkyl group, and may be the same or different.)

[0041]

[Chemical 14] Specific examples of the general formula (IV) include compounds represented by the following formula (X).

[0042]

[Chemical 15] (In the formula, X ² represents a hydroxyl group, an aryl group or an alkyl group, which may be the same or different. Z ¹ represents a hydrogen atom, an amino group, a hydroxyl group, a phosphoric acid group, an aryl group or an alkyl group.)

[0043]

[Chemical 16] Specific examples of the general formula (V) include compounds represented by the following formula (XI) and the following formula (XII).

[0044]

[Chemical 17] (In the formula, X ³ represents a monovalent or higher valent aromatic group and may be the same or different.)

[0045]

[Chemical 18]

[0046]

[Chemical 19] Specific examples of the general formula (VI) include compounds represented by the following formula (XIII), the following formula (XIV) and the following formula (XV).

[0047]

[Chemical 20] (In the formula, Z ² represents hydrogen, an alkyl group, an alkoxyl group, a carboxy group, a phenoxy group or an amino group, which may be the same or different.)

[0048]

[Chemical 21]

[0049]

[Chemical formula 22]

[0050]

[Chemical formula 23] These compounds can be used in combination of two or more kinds.

The organic phosphorus compound (d1) can be used as a solid (powder) or a liquid, but is solid (powder) from the viewpoint of workability.
Is preferred. In the case of powder, a maximum particle size of 80 μm or less is preferable because there is less possibility of clogging of the mold gate during molding. The average particle size is 2 to 50 μm in terms of the effect on fluidity and the effect on flame retardancy.

The addition amount of the organophosphorus compound (d1) is preferably the minimum amount necessary for exhibiting flame retardancy, and usually 5% by weight or less based on the whole composition. When the content is 5% by weight or less, it is possible to minimize the deterioration of moisture resistance and adhesion, and more preferably 0.2% by weight to 3% by weight.

The red phosphorus (d2) in the present invention may be added as it is, but it is safe to use it as an inorganic-organic composite (d2 ') in which the core portion is red phosphorus and the shell portion is an organic layer. It is preferable from the aspect. In this inorganic-organic composite, red phosphorus in the core part is obtained by converting all yellow phosphorus into red phosphorus and then pulverizing it, or by converting only part of yellow phosphorus into red phosphorus. "Non-crushed red phosphorus" (Japanese Patent Publication No. 4-37862) and the like can be mentioned, but "non-crushed red phosphorus" is preferably used in order to ensure the safety and moisture resistance of red phosphorus.

As the organic layer of the shell portion, phenol resin, melamine resin, urea resin, formalin resin,
Thermosetting resins such as epoxy resins are preferable, and these can be used in combination. Of these thermosetting resins, a phenol resin is particularly preferably used from the viewpoint of adhesion.

The content of red phosphorus in the inorganic / organic composite (d2 ') is usually 80 to 95% by weight. If it is less than 80% by weight, it is easily affected by water absorption, and if it exceeds 95% by weight, it is easy to handle. There are safety issues. Further, the particle size of the inorganic / organic composite is preferably 80 μm or less in maximum from the viewpoint of preventing blockage of the gate portion of the mold during molding when sealing the semiconductor. The average particle size is preferably 2 to 50 μm in order to sufficiently exhibit resin characteristics and flame retardancy.

The inorganic-organic composite (d2 ') can be produced, for example, by the method described in JP-B-54-39200, that is, when the shell portion is phenol, red phosphorus is suspended in water. It can be prepared by making it turbid, adding phenol and formalin thereto, and further adding phosphoric acid under heating.

Specific examples of the inorganic-organic composite (d2 ') include Nova Red 120 and Nova Excel 140 manufactured by Rin Kagaku Kogyo Co., Ltd.

The amount of the inorganic / organic composite (d2 ') added to the resin composition is preferably the minimum amount necessary for exhibiting flame retardancy, and usually 5% by weight or less. When it is 5% by weight or less, it is possible to minimize deterioration of moisture resistance and adhesiveness,
More preferably, it is 0.2% by weight to 3% by weight.

The metal hydroxide (d3) used in the present invention is a compound in which a metal atom is bonded to a hydroxyl group, or a compound in which a metal oxide is bonded to water, and is a hydroxide such as barium or lithium which is soluble in water. It means a hydroxide having metal atoms to be excluded. At least one selected from the group consisting of aluminum, magnesium, calcium, manganese, iron, cobalt, nickel, tin, zinc, copper, zirconium, and boron among the metal atoms constituting the metal hydroxide.
And aluminum hydroxide, magnesium hydroxide, calcium hydroxide, cobalt hydroxide and the like. Among them, magnesium hydroxide is particularly preferably used from the viewpoint of reflow resistance.
These may be used alone or in combination of two or more.

The metal hydroxide (d3) is preferably used in the form of particles, preferably having a particle size of 0.1 to 30 μm.

The content of the metal hydroxide (d3) used in the present invention is 1 to 15% by weight based on the total epoxy resin composition.
It is preferable that if it is 1% or more, a sufficient flame retardant effect is obtained, and if it is less than 15%, the high temperature reliability does not deteriorate.

In the production of the resin composition, the flame retardant (D) may be melt-mixed with the epoxy resin (A) and the curing agent (B) in advance in order to improve the dispersibility.

Further, in the present invention, other flame retardants may be added to the extent that the characteristics of the present invention are not impaired.

The epoxy resin composition of the present invention is preferably produced by melt kneading. Specifically, the raw materials are mixed to some extent with a mixer or the like, and the mixed raw materials are mixed at a temperature of 60 to 140 ° C. using a known kneading method such as Banbury mixer, kneader, roll, single-screw or twin-screw extruder, and cokneader. It is manufactured by melt-kneading in the temperature range of. This epoxy resin composition is usually used in the form of powder or tablet for molding a semiconductor by molding. As a method for sealing the semiconductor element, a low-pressure transfer molding method is generally used, but an injection molding method or a compression molding method is also possible. The molding conditions include, for example, an epoxy resin composition at a molding temperature of 1
A semiconductor device is manufactured by molding at 50 ° C. to 200 ° C., a molding pressure of 5 to 15 MPa, and a molding time of 30 to 300 seconds to obtain a cured product of an epoxy resin composition. Further, if necessary, the above-mentioned molded product is subjected to additional heat treatment at 100 to 200 ° C for 2 to 15 hours.

[0065]

EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to the examples given here. [Examples 1 to 13 and Comparative Examples 1 to 7] Table 1 shows the raw materials used in the present invention. The components in Table 1 were dry blended with a mixer at the composition ratios (weight ratios) shown in Tables 2 and 3. This was heated and kneaded for 5 minutes using a mixing roll having a roll surface temperature of 90 ° C., cooled and pulverized to produce an epoxy resin composition for semiconductor encapsulation. The numbers in the table represent% by weight.

[0066]

[Table 1]

[0067]

[Chemical formula 24]

[0068]

[Chemical 25]

[0069]

[Chemical formula 26]

[0070]

[Chemical 27]

[0071]

[Chemical 28]

[0072]

[Chemical 29]

[0073]

[Chemical 30]

[0074]

[Chemical 31] Flame retardance: 5 "x 1/2" x 1 using this resin composition
/ 16 "combustion test piece at 175 ° C, cure time 90
It was molded under the condition of seconds, post-cured under the condition of 175 ° C. for 4 hours, and flame retardancy was evaluated according to UL94 standard.

Next, using this resin composition, a low pressure transfer molding method was performed at 175 ° C. and a cure time of 90.
176pin LQ with a chip size of 10 x 10 mm, equipped with a simulated device with a nitride film on the surface under the condition of seconds
FP (outer shape: 24 × 24 × 1.4 mm, frame material:
Molded copper, inner lead part: silver plating), 175
Post-curing was carried out under the conditions of 4 ° C. for 4 hours, and the physical properties of each resin composition were evaluated by the following physical property measuring methods. The post cure was 175 ° C. for 4 hours. Crack resistance: 1
Twenty-six pieces of 76pinLQFP were molded, post-cured, humidified at 85 ° C / 60% RH for 168 hours, and then heat-treated for 2 minutes in an IR reflow furnace having a maximum temperature of 260 ° C, and the number of packages with external cracks was visually examined. . Adhesion: 20 pieces of 176pin LQFP were molded, post-cured, humidified at 85 ° C / 60% RH for 168 hours, and then heat-treated for 2 minutes in an IR reflow furnace with a maximum temperature of 260 ° C, and then the lead frame chip surface and silver plating. Ultrasonic flaw detector (manufactured by Hitachi Construction Machinery Co., Ltd., “mi-sc”)
ope10 "), and the number of packages in which peeling occurred was checked for each.

Tables 2 and 3 show the evaluation results.

[0077]

[Table 2]

[0078]

[Table 3] As seen in Tables 2 and 3, the epoxy resin composition of the present invention is excellent in flame retardancy, crack resistance and adhesion (Examples 1 to 13). In contrast to these Examples 1 to 13, when the phenol compound having the repeating unit structure represented by the chemical formulas (I) and (II) was not contained, flame retardancy / adhesiveness /
The crack resistance is inferior (Comparative Examples 1, 3, 5). Even if the phenol compound having the repeating unit structure represented by the chemical formulas (I) and (II) is not contained, flame retardancy can be obtained by using a large amount of a phosphorus compound or a metal hydroxide as a flame retardant. The adhesion and crack resistance are inferior to those of Examples 1 to 13 (Comparative Examples 2, 4, 6). Further, if no flame retardant is used, flame retardancy cannot be obtained. Chemical formulas (I) and (I
Even if the phenol compound having the repeating unit structure represented by I) is contained, the comparative example which does not contain the phosphorus compound or the metal hydroxide as the flame retardant has insufficient flame retardancy (Comparative Example 7).

As described above, it can be seen that sufficient performance is exhibited by adding a specific phenol type curing agent and further adding a phosphorus type flame retardant or a metal hydroxide.

[0080]

EFFECT OF THE INVENTION An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), a filler (C) and a flame retardant (D), wherein the curing agent (B) has the chemical formula (I) and (II)
By containing the phenol compound having a repeating unit structure represented by, an epoxy encapsulant having excellent flame retardancy, crack resistance, and adhesion can be obtained.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/29 H01L 23/30 R 23/31 F term (reference) 4J002 CD05W CE00X DA057 DE076 DE077 DE087 DE097 DE107 DE117 DE136 DE146 DE147 DE236 DJ006 DJ016 DJ026 DJ036 DJ046 DK007 DL006 EW047 EW117 EW127 EW137 EW147 FA046 FB267 FD016 FD060 FD137 FD14X FD140 FD150 FD200 GJ02 GQ02 4J036 A12 01

Claims (6)

[Claims] 1. An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), a filler (C) and a flame retardant (D), wherein the curing agent (B) is represented by the following chemical formula (I) and (II)
An epoxy resin composition comprising a phenol compound having a repeating unit structure represented by: [Chemical 1] (R ^{1 to} R ⁴ represent a hydrogen atom or a methyl group.) (R ^{5 to} R ⁸ represent a hydrogen atom or a methyl group.) 2. The flame retardant (D) is at least one selected from the group consisting of compounds having a structure represented by the following general formula (III), general formula (IV), general formula (V) and general formula (VI). The epoxy resin composition according to claim 1, comprising an organic phosphorus compound (d1) containing a seed. [Chemical 3] (In the formula, X ¹ represents an aryl group or an alkyl group. X ² represents a hydroxyl group, an aryl group or an alkyl group, and may be the same or different.) (In the formula, X ² represents a hydroxyl group, an aryl group or an alkyl group, which may be the same or different. Z ¹ represents a hydrogen atom, an amino group, a hydroxyl group, a phosphoric acid group, an aryl group or an alkyl group.) [Chemical 5] (In the formula, X ³ represents a monovalent or higher valent aromatic group and may be the same or different.) (In the formula, Z ² represents hydrogen, an alkyl group, an alkoxyl group, a carboxy group, a phenoxy group or an amino group, which may be the same or different.) 3. The epoxy resin composition according to claim 1, wherein the flame retardant (D) contains red phosphorus (d2). 4. The flame retardant (D) contains a metal hydroxide (d3), and the metal atoms constituting the metal hydroxide are aluminum, magnesium, calcium, manganese,
The epoxy resin composition according to any one of claims 1 to 3, which is at least one selected from the group consisting of iron, cobalt, nickel, tin, zinc, copper, zirconium, and boron. 5. The epoxy resin composition according to claim 4, wherein the metal atom constituting the metal hydroxide (d3) is magnesium. 6. A semiconductor device, which is encapsulated with a cured product of the epoxy resin composition according to claim 1.