JP2003246834A - One-part composition for insulating polyurethane resin - Google Patents
One-part composition for insulating polyurethane resinInfo
- Publication number
- JP2003246834A JP2003246834A JP2002048442A JP2002048442A JP2003246834A JP 2003246834 A JP2003246834 A JP 2003246834A JP 2002048442 A JP2002048442 A JP 2002048442A JP 2002048442 A JP2002048442 A JP 2002048442A JP 2003246834 A JP2003246834 A JP 2003246834A
- Authority
- JP
- Japan
- Prior art keywords
- polyurethane resin
- insulating
- polyol
- hardness
- polyisocyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005749 polyurethane resin Polymers 0.000 title claims abstract description 36
- 239000000203 mixture Substances 0.000 title claims abstract description 21
- 229920005862 polyol Polymers 0.000 claims abstract description 43
- 150000003077 polyols Chemical class 0.000 claims abstract description 39
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 22
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 22
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 11
- 239000001301 oxygen Substances 0.000 claims abstract description 11
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 10
- 239000011630 iodine Substances 0.000 claims description 10
- 229910052740 iodine Inorganic materials 0.000 claims description 10
- 238000009413 insulation Methods 0.000 abstract description 5
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 abstract 1
- 239000000047 product Substances 0.000 description 24
- -1 oxyundecanoic acid Chemical class 0.000 description 21
- 239000011342 resin composition Substances 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 239000002981 blocking agent Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 229920005906 polyester polyol Polymers 0.000 description 4
- 229960003656 ricinoleic acid Drugs 0.000 description 4
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 2
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- IKWQWOFXRCUIFT-UHFFFAOYSA-N benzene-1,2-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC=C1C(=O)NN IKWQWOFXRCUIFT-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 150000001718 carbodiimides Chemical class 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 2
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 description 2
- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2s)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 description 1
- ZKALVNREMFLWAN-VOTSOKGWSA-N (ne)-n-(4-methylpentan-2-ylidene)hydroxylamine Chemical compound CC(C)C\C(C)=N\O ZKALVNREMFLWAN-VOTSOKGWSA-N 0.000 description 1
- SNVRDQORMVVQBI-UPHRSURJSA-N (z)-but-2-enedihydrazide Chemical compound NNC(=O)\C=C/C(=O)NN SNVRDQORMVVQBI-UPHRSURJSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 101100325793 Arabidopsis thaliana BCA2 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- 102100025989 Glyoxalase domain-containing protein 4 Human genes 0.000 description 1
- 101000857136 Homo sapiens Glyoxalase domain-containing protein 4 Proteins 0.000 description 1
- 101000835998 Homo sapiens SRA stem-loop-interacting RNA-binding protein, mitochondrial Proteins 0.000 description 1
- OJGMBLNIHDZDGS-UHFFFAOYSA-N N-Ethylaniline Chemical compound CCNC1=CC=CC=C1 OJGMBLNIHDZDGS-UHFFFAOYSA-N 0.000 description 1
- JCKYMEVQNKNLIB-UHFFFAOYSA-N O[N+]([O-])=O.CCCCCCCCCCCC Chemical compound O[N+]([O-])=O.CCCCCCCCCCCC JCKYMEVQNKNLIB-UHFFFAOYSA-N 0.000 description 1
- 101100193637 Oryza sativa subsp. japonica RAG2 gene Proteins 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 102100025491 SRA stem-loop-interacting RNA-binding protein, mitochondrial Human genes 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- LAWOZCWGWDVVSG-UHFFFAOYSA-N dioctylamine Chemical compound CCCCCCCCNCCCCCCCC LAWOZCWGWDVVSG-UHFFFAOYSA-N 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- QQVHEQUEHCEAKS-UHFFFAOYSA-N diundecyl benzene-1,2-dicarboxylate Chemical compound CCCCCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCCCCC QQVHEQUEHCEAKS-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000005456 glyceride group Chemical group 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- UFAPLAOEQMMKJA-UHFFFAOYSA-N hexane-1,2,5-triol Chemical compound CC(O)CCC(O)CO UFAPLAOEQMMKJA-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- VLHZUYUOEGBBJB-UHFFFAOYSA-N hydroxy stearic acid Natural products OCCCCCCCCCCCCCCCCCC(O)=O VLHZUYUOEGBBJB-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000000077 insect repellent Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000004658 ketimines Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- QHCCDDQKNUYGNC-UHFFFAOYSA-N n-ethylbutan-1-amine Chemical compound CCCCNCC QHCCDDQKNUYGNC-UHFFFAOYSA-N 0.000 description 1
- AGVKXDPPPSLISR-UHFFFAOYSA-N n-ethylcyclohexanamine Chemical compound CCNC1CCCCC1 AGVKXDPPPSLISR-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229940066675 ricinoleate Drugs 0.000 description 1
- WBHHMMIMDMUBKC-QJWNTBNXSA-M ricinoleate Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC([O-])=O WBHHMMIMDMUBKC-QJWNTBNXSA-M 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- FJFYFBRNDHRTHL-UHFFFAOYSA-N tris(8-methylnonyl) benzene-1,2,4-tricarboxylate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC(C)C)C(C(=O)OCCCCCCCC(C)C)=C1 FJFYFBRNDHRTHL-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、一液型絶縁性ポリ
ウレタン樹脂用組成物に関する。TECHNICAL FIELD The present invention relates to a composition for one-pack type insulating polyurethane resin.
【0002】[0002]
【従来の技術】耐熱性(高温下に曝されても硬度等の物
性が変化し難いこと)及び耐湿熱性(高温多湿下に曝さ
れても硬度等の物性が変化し難いこと)に優れる硬化物
を提供しうるポリウレタン樹脂として、ヨウ素価が11
0mgKOH/g以下で酸素原子の含有率が20重量%
以下のポリオールと、ポリイソシアネートとを反応させ
て得られるポリウレタン樹脂があり、該ポリウレタン樹
脂は、食料品工場や精密部品工場のクリーンルーム、原
子力発電所等でフィルタシール材として用いられている
(特開2001−270927号公報)。耐熱性及び耐
湿熱性に優れたポリウレタン樹脂を電気絶縁材料、例え
ば、電気回路を衝撃や埃等から保護する封止剤として用
いると、電気が流れることによって発生する熱が該ポリ
ウレタン樹脂の硬化物中に閉じ込められても、あるいは
水まわりで使用することによって該硬化物が高温多湿下
に曝されても、電気回路を衝撃から有効に保護するため
に調整されている硬化物の硬度が殆ど変化せず、電気回
路を衝撃から有効に保護することができる。Curing with excellent heat resistance (hardness and other physical properties do not change even when exposed to high temperature) and wet heat resistance (hardness and other physical properties that do not change even when exposed to high temperature and high humidity) As a polyurethane resin that can provide products, iodine value is 11
Oxygen atom content is 20 wt% at 0 mgKOH / g or less
There is a polyurethane resin obtained by reacting the following polyol and polyisocyanate, and the polyurethane resin is used as a filter seal material in a clean room of a food factory, a precision parts factory, a nuclear power plant, etc. 2001-270927). When a polyurethane resin having excellent heat resistance and moist heat resistance is used as an electrically insulating material, for example, as a sealant that protects an electric circuit from impact, dust, etc., heat generated by electricity flows in a cured product of the polyurethane resin. Even if it is trapped in a sheet or exposed to high temperature and high humidity by using it around water, the hardness of the cured product, which is adjusted to effectively protect the electric circuit from impact, hardly changes. Therefore, the electric circuit can be effectively protected from a shock.
【0003】[0003]
【発明が解決しようとする課題】しかしポリウレタン樹
脂を絶縁材料として用いるためには、使用するポリウレ
タン樹脂の硬化物が、高温下あるいは高温多湿下に曝さ
れても硬度が殆ど変化しないというだけでは不充分で、
該硬化物が絶縁性をもち、かつ該絶縁性硬化物が高温下
あるいは高温多湿下に曝されても硬度及び絶縁性が共に
殆ど低下しないことが要求される。また、近年、絶縁性
ポリウレタン樹脂の需要の拡大に伴い、種々の場所ある
いは条件下で絶縁作業を行うことが求められるようにな
り、絶縁材料の取り扱いが容易であることも要望される
ようになってきている。However, in order to use a polyurethane resin as an insulating material, it is not enough that the hardness of the cured product of the polyurethane resin used hardly changes even when exposed to high temperature or high temperature and high humidity. Enough
It is required that the cured product has an insulating property and that the hardness and the insulating property hardly decrease even when the insulating cured product is exposed to high temperature or high temperature and high humidity. In addition, in recent years, with the increasing demand for insulating polyurethane resins, it has become necessary to perform insulating work in various places or under conditions, and it has also been demanded that insulating materials be easily handled. Is coming.
【0004】本発明は、高温下あるいは高温多湿下に曝
されても硬度は殆ど変化せずかつ絶縁性も殆ど低下しな
い絶縁性硬化物を与えることができ、しかも取り扱いが
容易な一液型絶縁性ポリウレタン樹脂用組成物を提供す
ることを課題とする。The present invention can provide an insulative cured product whose hardness hardly changes even when exposed to high temperature or high temperature and high humidity, and its insulating property hardly deteriorates, and the one-component type insulation which is easy to handle. An object is to provide a composition for a hydrophilic polyurethane resin.
【0005】[0005]
【課題を解決するための手段】本発明者は、前記課題に
鑑み、鋭意研究した結果、絶縁性ポリウレタン樹脂を構
成するポリオールとしてヨウ素価及び酸素含有率をある
一定の値以下に調整したものを用いると、得られる絶縁
性ポリウレタン樹脂の硬化物は、高温下あるいは高温多
湿下に曝されても硬度が殆ど変化しないばかりでなく、
絶縁性も殆ど低下しないことを発見し、本発明を完成し
た。Means for Solving the Problems In view of the above problems, the present inventor has conducted diligent research, and as a result, as a polyol constituting an insulating polyurethane resin, a polyol having an iodine value and an oxygen content rate adjusted to be equal to or lower than a certain value was selected. When used, the obtained cured product of the insulating polyurethane resin not only has little change in hardness even when exposed to high temperature or high temperature and high humidity,
The present invention has been completed by discovering that the insulating property also hardly deteriorates.
【0006】即ち本発明によれば、酸素含有率が22重
量%以下及びヨウ素価が155mgKOH/g以下のポ
リオールとポリイソシアネートとを反応させて得られる
ウレタンプレポリマーを含有し、前記ウレタンプレポリ
マーの末端イソシアネート基がブロックされてなること
を特徴とする一液型絶縁性ポリウレタン樹脂用組成物が
提供される。このような一液型絶縁性ポリウレタン樹脂
用組成物を電気回路の絶縁材料として使用すると、電気
回路を封止している絶縁性硬化物が高温下あるいは高温
多湿下に曝されても、硬度及び絶縁性が共に殆ど低下し
ない。しかも、イソシアネート基がブロック化剤でブロ
ックされているので一液型であり、一液型であるから、
絶縁性硬化物を形成する際に、2液型組成物のように、
2液を混合する設備や手間を必要とせず、得られる絶縁
性硬化物の硬さ等の物性を絶縁性ポリウレタン樹脂用組
成物として得た段階で決定することができ、所望の硬化
物物性を簡単に得ることができる等、取り扱いが容易で
ある。従って、例えば、複雑な電気回路のある定められ
た個所を絶縁することが要求される場合等、困難な要求
に対しても組成物がそのまま使用できるので、作業が比
較的簡単に済む。That is, according to the present invention, a urethane prepolymer obtained by reacting a polyol having an oxygen content of 22% by weight or less and an iodine value of 155 mgKOH / g or less with a polyisocyanate is contained. There is provided a composition for a one-pack type insulating polyurethane resin, characterized in that the terminal isocyanate group is blocked. When such a one-pack type insulating polyurethane resin composition is used as an insulating material for an electric circuit, the hardness and the hardness of the insulating cured material encapsulating the electric circuit can be improved even when exposed to high temperature or high temperature and high humidity. Insulation properties are hardly deteriorated together. Moreover, since the isocyanate group is blocked by the blocking agent, it is a one-pack type, and therefore one-pack type.
When forming an insulating cured product, like a two-part composition,
Physical properties such as hardness of the obtained insulating cured product can be determined at the stage of obtaining the composition for an insulating polyurethane resin without requiring equipment and labor for mixing the two liquids, and desired physical properties of the cured product can be obtained. Easy to handle, such as easy to obtain. Therefore, the composition can be used as it is even for difficult requirements, for example, when it is required to insulate a predetermined portion of a complicated electric circuit. Therefore, the work is relatively easy.
【0007】更に本発明によれば、電気又は電子部品の
絶縁用である前記一液型絶縁性ポリウレタン樹脂用組成
物が提供される。Further, according to the present invention, there is provided the above-mentioned composition for one-component insulating polyurethane resin for insulating electric or electronic parts.
【0008】[0008]
【発明の実施の形態】本発明で使用されるポリオールの
酸素含有率は22重量%以下で、ヨウ素価は155mg
KOH/g以下である。ポリオールの酸素含有率が22
重量%を超えると、得られる絶縁性硬化物の耐湿熱性が
劣り、高温多湿状態で硬度が大きく減少し、絶縁性も低
下してしまう。又、ヨウ素価が155mgKOH/gを
超えると、絶縁性硬化物の耐熱性が劣り、高温下で硬く
もろくなる。ポリオールの酸素含有率は、好ましくは1
〜15重量%である。酸素含有率がこの範囲であると、
絶縁性硬化物の耐湿熱性が特によくなる。又、ヨウ素価
は、好ましくは1〜120mgKOH/gである。ヨウ
素価がこの範囲であると、絶縁性硬化物の耐熱性が特に
よくなる。ここで、酸素含有率(重量%)は、BEST MODE FOR CARRYING OUT THE INVENTION The polyol used in the present invention has an oxygen content of 22% by weight or less and an iodine value of 155 mg.
KOH / g or less. Oxygen content of polyol is 22
When the content is more than 5% by weight, the obtained insulating cured product is inferior in wet heat resistance, the hardness is greatly reduced in a high temperature and high humidity state, and the insulation property is also deteriorated. On the other hand, when the iodine value exceeds 155 mgKOH / g, the heat resistance of the insulating cured product is poor and it becomes hard and brittle at high temperature. The oxygen content of the polyol is preferably 1
~ 15% by weight. When the oxygen content is in this range,
The wet heat resistance of the insulating cured product is particularly improved. The iodine value is preferably 1 to 120 mgKOH / g. When the iodine value is in this range, the heat resistance of the insulating cured product is particularly improved. Here, the oxygen content (% by weight) is
【0009】[0009]
【式1】 [Formula 1]
【0010】で計算される。又ヨウ素価(mgKOH/
g)は JIS K 3331-1995に従って測定され
る。It is calculated by Iodine value (mgKOH /
g) is measured according to JIS K 3331 -1995.
【0011】本発明において使用されるポリオールとし
ては、得られる硬化物が絶縁性を示す限り、ポリエステ
ルポリオールを用いたポリエステル系樹脂、ポリエーテ
ルポリオールを用いたポリエーテル系樹脂、その他のポ
リオールを用いた樹脂、これらの混合物のいずれも使用
できる。As the polyol to be used in the present invention, a polyester resin using a polyester polyol, a polyether resin using a polyether polyol, and other polyols are used as long as the obtained cured product exhibits insulating properties. Any resin or mixture of these can be used.
【0012】ポリエステルポリオールは、脂肪酸とポリ
オールとの反応物であり、該脂肪酸としては、例えば、
リシノール酸、オキシカプロン酸、オキシカプリン酸、
オキシウンデカン酸、オキシリノール酸、オキシステア
リン酸、オキシヘキサンデセン酸のヒドロキシ含有長鎖
脂肪酸等が挙げられる。脂肪酸と反応するポリオールと
しては、エチレングリコール、プロピレングリコール、
ブチレングリコール、ヘキサメチレングリコール及びジ
エチレングリコール等のグリコール、グリセリン、トリ
メチロールプロパン及びトリエタノールアミン等の3官
能ポリオール、ジグリセリン及びペンタエリスリトール
等の4官能ポリオール、ソルビトール等の6官能ポリオ
ール、シュガー等の8官能ポリオール、これらのポリオ
ールに相当するアルキレンオキサイドと脂肪族、脂環
族、芳香族アミンとの付加重合物や該アルキレンオキサ
イドとポリアミドポリアミンとの付加重合物、例えば、
フタル酸ジヒドラジド、エチレンジアミン、アジピン酸
ジヒドラジド、水素添加メチレンジフェニルジアミン又
はアニリンとのポリプロピレンオキサイド付加物等が挙
げられる。Polyester polyol is a reaction product of a fatty acid and a polyol, and examples of the fatty acid include:
Ricinoleic acid, oxycaproic acid, oxycapric acid,
Examples thereof include hydroxy-containing long-chain fatty acids such as oxyundecanoic acid, oxylinoleic acid, oxystearic acid, and oxyhexanedecenoic acid. Examples of polyols that react with fatty acids include ethylene glycol, propylene glycol,
Butylene glycol, glycols such as hexamethylene glycol and diethylene glycol, trifunctional polyols such as glycerin, trimethylolpropane and triethanolamine, tetrafunctional polyols such as diglycerin and pentaerythritol, 6 functional polyols such as sorbitol, and 8 functionalities such as sugar. Polyols, addition polymers of alkylene oxides and aliphatics, alicyclics, aromatic amines corresponding to these polyols and addition polymers of the alkylene oxides and polyamide polyamines, for example,
Examples thereof include phthalic acid dihydrazide, ethylenediamine, adipic acid dihydrazide, hydrogenated methylenediphenyldiamine, or a polypropylene oxide adduct with aniline.
【0013】なかでも、リシノール酸グリセライド、リ
シノール酸と1,1,1−トリメチロールプロパンとの
ポリエステルポリオール等が好ましい。Of these, glyceride ricinoleate, polyester polyol of ricinoleic acid and 1,1,1-trimethylolpropane, and the like are preferable.
【0014】ポリエーテルポリオールとしては、エチレ
ングリコール、ジエチレングリコール、プロピレングリ
コール、ジプロピレングリコール、1,3−ブタンジオ
ール、1,4−ブタンジオール、4,4’−ジヒドロキ
シフェニルプロパン、4,4’−ジヒドロキシフェニル
メタン等の2価アルコールやグリセリン、1,1,1−
トリメチロールプロパン、1,2,5−ヘキサントリオ
ール、ペンタエリスリトール等の3価以上の多価アルコ
ールとエチレンオキサイド、プロピレンオキサイド、ブ
チレンオキサイド、α−オレフィンオキサイド等のアル
キレンオキサイドとの付加重合物等が挙げられる。Examples of the polyether polyol include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, 4,4'-dihydroxyphenylpropane, 4,4'-dihydroxy. Dihydric alcohols such as phenylmethane and glycerin, 1,1,1-
Trimethylolpropane, 1,2,5-hexanetriol, pentaerythritol and other trihydric or higher polyhydric alcohols and addition polymers of ethylene oxide, propylene oxide, butylene oxide, and alkylene oxides such as α-olefin oxide. To be
【0015】その他のポリオールとして、主鎖が炭素−
炭素よりなるポリオール、例えば、アクリルポリオー
ル、ポリブタジエンポリオール、ポリイソプレンポリオ
ール、水素添加ポリブタジエンポリオール、AN(アク
リロニトリル)やSM(スチレンモノマー)を前記した
ポリオールにグラフト重合したポリオール、ポリカーボ
ネートポリオール、PTMG(ポリテトラメチレングリ
コール)、ダイマー酸・ポリオールのポリエステルポリ
オール等が挙げられる。As other polyols, the main chain is carbon-
Carbon polyols such as acrylic polyols, polybutadiene polyols, polyisoprene polyols, hydrogenated polybutadiene polyols, polyols obtained by graft polymerizing AN (acrylonitrile) or SM (styrene monomer) with the above-mentioned polyols, polycarbonate polyols, PTMG (polytetramethylene). Glycol), dimer acid / polyol polyester polyol, and the like.
【0016】本発明において使用されるポリイソシアネ
ートとしては、芳香族ポリイソシアネート、脂肪族ポリ
イソシアネート、脂環式ポリイソシアネート等が使用で
きる。芳香族ポリイソシアネートとしては、例えば、ジ
フェニルメタンジイソシアネート(4,4−MDI、
2,4−MDI/4,4−MDI混合物等)、ポリメチ
レンポリフェニレンポリイソシアネート(粗MDI)、
トリレンジイソシアネート(TDI)、ポリトリレンポ
リイソシアネート(粗TDI)、キシレンジイソシアネ
ート(XDI)、ナフタレンジイソシアネート(ND
I)等が挙げられる。脂肪族ポリイソシアネートとして
は、ヘキサメチレンジイソシアネート(HDI)等が挙
げられる。脂環式ポリイソシアネートとしては、イソホ
ロンジイソシアネート(IPDI)等が挙げられる。こ
の他に、上記ポリイソシアネートをカルボジイミドで変
性したポリイソシアネート(カルボジイミド変性ポリイ
ソシアネート)、イソシアヌレート変性ポリイソシアネ
ート、ウレタンプレポリマー(例えばポリオールと過剰
のポリイソシアネートとの反応生成物であってイソシア
ネート基を分子末端にもつもの)等も使用できる。これ
らは単独あるいは混合物として使用される。これらの中
でも、ジフェニルメタンジイソシアネート、ポリメチレ
ンポリフェニレンポリイソシアネート、カルボジイミド
変性ポリイソシアネートが好ましい。As the polyisocyanate used in the present invention, aromatic polyisocyanate, aliphatic polyisocyanate, alicyclic polyisocyanate and the like can be used. Examples of aromatic polyisocyanates include diphenylmethane diisocyanate (4,4-MDI,
2,4-MDI / 4,4-MDI mixture, etc.), polymethylene polyphenylene polyisocyanate (crude MDI),
Tolylene diisocyanate (TDI), polytolylene polyisocyanate (crude TDI), xylene diisocyanate (XDI), naphthalene diisocyanate (ND)
I) and the like. Hexamethylene diisocyanate (HDI) etc. are mentioned as an aliphatic polyisocyanate. Examples of the alicyclic polyisocyanate include isophorone diisocyanate (IPDI) and the like. In addition to the above, polyisocyanate obtained by modifying the above polyisocyanate with carbodiimide (carbodiimide modified polyisocyanate), isocyanurate modified polyisocyanate, urethane prepolymer (for example, a reaction product of polyol and excess polyisocyanate and having an isocyanate group as a molecule) It can also be used. These are used alone or as a mixture. Among these, diphenylmethane diisocyanate, polymethylene polyphenylene polyisocyanate, and carbodiimide-modified polyisocyanate are preferable.
【0017】本発明において絶縁性ポリウレタン樹脂と
は、25±5℃、65±5%RHで測定した体積固有抵
抗値(Ω・cm)が、1010Ω・cm以上の硬化物を得
ることができるものをいう。さらに誘電率が6以下(1
MHz)、絶縁破壊電圧が15KV/mm以上が好まし
い。絶縁性ポリウレタン樹脂は、ポリオールの酸素含有
率、溶出イオン濃度あるいは溶出イオンの種類の数等を
調整することによって、得られる絶縁性硬化物の体積固
有抵抗値を、1010Ω・cm以上、好ましくは1011Ω
・cm以上に調整して得ることができる。特に体積固有
抵抗値が1011Ω・cm以上であると、硬化物の絶縁性
が保持され、例えばトランス、電線、コイル、セラミッ
クプリント基板、エポキシ・アクリレートプリント基
板、光ケーブルジョイント、電線ケーブルジョイント、
コンデンサ、紙フェノールプリント基板、ポリイミドプ
リント基板等で用いられる絶縁材料、電子部品の封止剤
等として好適に使用できる。体積固有抵抗値の測定は、
JIS C 2105に従って行う。具体的には、東亜
電波工業社製SE−10Eを用い、25±5℃、65±
5%RHで、サンプル(厚さ:3mm)に500Vの測
定電圧を印加し、60秒後の数値を測定する。The insulating polyurethane resin in the present invention means a cured product having a volume resistivity value (Ω · cm) of 10 10 Ω · cm or more measured at 25 ± 5 ° C. and 65 ± 5% RH. What can be done. Furthermore, the dielectric constant is 6 or less (1
MHz), and the dielectric breakdown voltage is preferably 15 KV / mm or more. The insulating polyurethane resin has a volume resistivity value of 10 10 Ω · cm or more, preferably 10 10 Ω · cm or more, which is obtained by adjusting the oxygen content of the polyol, the concentration of eluted ions or the number of types of eluted ions. Is 10 11 Ω
・ It can be obtained by adjusting to cm or more. In particular, when the volume resistivity is 10 11 Ω · cm or more, the insulating property of the cured product is maintained, and for example, a transformer, an electric wire, a coil, a ceramic printed circuit board, an epoxy / acrylate printed circuit board, an optical cable joint, an electric wire cable joint,
It can be suitably used as an insulating material used for capacitors, paper phenol printed boards, polyimide printed boards, etc., and a sealant for electronic parts. To measure the volume resistivity,
It is performed according to JIS C 2105. Specifically, using SE-10E manufactured by Toa Denpa Kogyo KK, 25 ± 5 ° C., 65 ±
A measurement voltage of 500 V is applied to the sample (thickness: 3 mm) at 5% RH, and the value after 60 seconds is measured.
【0018】本発明の一液型絶縁性ポリウレタン樹脂用
組成物は、前記ポリオールに前記ポリイソシアネートを
過剰に、好ましくはNCO/OHの当量比が1.4〜
2.5で反応させて得られるウレタンプレポリマーであ
って、その末端イソシアネート基がブロック化剤でブロ
ックされているものを含有する。前記ウレタンプレポリ
マーは通常の製造方法により製造することができる。The one-pack type insulating polyurethane resin composition of the present invention has an excess of the polyisocyanate in the polyol, preferably an NCO / OH equivalent ratio of 1.4 to.
A urethane prepolymer obtained by reacting at 2.5, in which the terminal isocyanate group is blocked with a blocking agent, is contained. The urethane prepolymer can be manufactured by an ordinary manufacturing method.
【0019】ウレタンプレポリマーの末端イソシアネー
ト基含有率は、1〜10重量%であることが好ましく、
さらに好ましくは1〜5重量%である。該末端イソシア
ネート基含有率が1〜10重量%であると、柔軟で低い
ガラス転移温度をもつ絶縁硬化物となる傾向がある。The content of terminal isocyanate groups in the urethane prepolymer is preferably 1 to 10% by weight,
More preferably, it is 1 to 5% by weight. When the terminal isocyanate group content is 1 to 10% by weight, the insulating cured product tends to be flexible and have a low glass transition temperature.
【0020】ブロック化剤として、例えば、メチルエチ
ルケトオキシム、メチルイソブチルケトオキシムなどの
オキシム化合物、ε−カプロラクタム等のラクタム類、
活性メチレン化合物、フェノール類、イミダゾール類、
ジシクロヘキシルアミン、ジメチルアミン、ジエチルア
ミン、エチルブチルアミン、ジブチルアミン、ジフェニ
ルアミン、ジプロピルアミン、ジイソプロピルアミン、
ジオクチルアミン、エチルフェニルアミン、エチルシク
ロヘキシルアミン等を挙げることができる。これらは単
独あるいは混合物として使用される。これらの中でもオ
キシム化合物及びラクタム類が好ましく、メチルエチル
ケトオキシムが特に好ましい。Examples of the blocking agent include oxime compounds such as methyl ethyl ketoxime and methyl isobutyl ketoxime, lactams such as ε-caprolactam, and the like.
Active methylene compounds, phenols, imidazoles,
Dicyclohexylamine, dimethylamine, diethylamine, ethylbutylamine, dibutylamine, diphenylamine, dipropylamine, diisopropylamine,
Dioctylamine, ethylphenylamine, ethylcyclohexylamine and the like can be mentioned. These are used alone or as a mixture. Among these, oxime compounds and lactams are preferable, and methyl ethyl ketoxime is particularly preferable.
【0021】ブロック化剤の添加量は、ウレタンプレポ
リマーの末端イソシアネート基に対して通常1当量以
上、2当量未満が好ましく、さらに好ましくは1.05
〜1.5当量である。ウレタンプレポリマーとブロック
化剤との反応は、25〜100℃で、NCO基がなくな
るまで反応させる。反応溶媒として、ソルベントナフ
サ、パラフィン化合物、メチルエチルケトン、トルエ
ン、エチルベンゼン及びこれらの混合物等が使用でき
る。得られた組成物の粘度が高い場合は、希釈剤で希釈
してもよい。The addition amount of the blocking agent is usually preferably 1 equivalent or more and less than 2 equivalents, more preferably 1.05 equivalent to the terminal isocyanate group of the urethane prepolymer.
~ 1.5 equivalents. The reaction between the urethane prepolymer and the blocking agent is performed at 25 to 100 ° C. until the NCO group disappears. As the reaction solvent, solvent naphtha, paraffin compounds, methyl ethyl ketone, toluene, ethyl benzene and mixtures thereof can be used. If the composition obtained has a high viscosity, it may be diluted with a diluent.
【0022】本発明の一液型絶縁性ポリウレタン樹脂用
組成物の溶媒としては、例えば、ポリオール、モノオー
ル、炭化水素等が使用でき、また可塑剤として、フタル
酸ジイソノニル(DINP)、フタル酸ジウンデシル
(DUP)、トリメリット酸トリイソデシル(TIT
M)、トリメリット酸トリオクチル(TOTM)、大豆
油エポキシ化合物等を加えてもよい。As the solvent for the one-pack type insulating polyurethane resin composition of the present invention, for example, polyol, monool, hydrocarbon, etc. can be used, and as the plasticizer, diisononyl phthalate (DINP), diundecyl phthalate, etc. (DUP), Triisodecyl trimellitate (TIT
M), trioctyl trimellitate (TOTM), soybean oil epoxy compound and the like may be added.
【0023】本発明の一液型絶縁性ポリウレタン樹脂用
組成物から絶縁性ポリウレタン樹脂の硬化物を得る時、
得られる硬化物が所望の硬度を持つように硬化剤を使用
するのが好ましい。該硬化剤は、硬化時に一液型絶縁性
ポリウレタン樹脂用組成物に加えられるか、あるいは予
め一液型絶縁性ポリウレタン樹脂用組成物に加えられて
もよい。When a cured product of an insulating polyurethane resin is obtained from the one-pack type insulating polyurethane resin composition of the present invention,
It is preferable to use a curing agent so that the obtained cured product has a desired hardness. The curing agent may be added to the one-component type insulating polyurethane resin composition during curing, or may be added in advance to the one-component type insulating polyurethane resin composition.
【0024】硬化剤として、例えば、リシノール酸グリ
セライド、アジピン酸ジヒドラジド(ADH)、ポリブ
タジエンポリオール、ポリイソプレンポリオール、芳香
族、脂環族ポリオール等のポリオール化合物、ポリエチ
レンポリアミン、メタキシレンジアミン(MXDA)、
キシレンジアミン(XDA)、イソホロンジアン(IP
DA)、ヘキサメチレンジアミン(HDA)、エチレン
ジアミン(EDA)、ジエチレントリアミン(DET
A)、トリエチレンテトラアミン(TETA)、テトラ
エチレンペンタアミン(TEPA)、ポリアミドポリア
ミン、ケチミン、ジエタノールアミン等のアミン化合
物、他にEDAと1〜3倍当量のエチレンオキサイドあ
るいはプロピレンオキサイド付加物、脂肪族、脂環族、
芳香族アミンとエチレンオキサイド、プロピレンオキサ
イド等とのアルキレンオキサイドの付加物、フタル酸ジ
ヒドラジド、マレイン酸ジヒドラジド、カーボンジヒド
ラジド、セバシン酸ジヒドラジド、ドデカンニ酸ジヒド
ラジド、イソフタル酸ジヒドラジド、フタル酸ジエチレ
ンジアミン、アジピン酸ジエチレンジアミン、フタル酸
ジメタキシレンジアミン、アジピン酸ジメタキシレンジ
アミン等のポリアミドポリアミンが挙げられる。これら
の硬化剤は混合物として使用してもよい。As the curing agent, for example, ricinoleic acid glyceride, adipic acid dihydrazide (ADH), polyol compounds such as polybutadiene polyol, polyisoprene polyol, aromatic and alicyclic polyol, polyethylene polyamine, metaxylene diamine (MXDA),
Xylene diamine (XDA), isophorone dian (IP
DA), hexamethylenediamine (HDA), ethylenediamine (EDA), diethylenetriamine (DET)
A), triethylenetetraamine (TETA), tetraethylenepentamine (TEPA), polyamide polyamine, ketimine, diethanolamine, and other amine compounds, and 1 to 3 times equivalent of EDA with ethylene oxide or propylene oxide adduct, aliphatic , Alicyclic,
Addition products of alkylene oxides with aromatic amines and ethylene oxide, propylene oxide, phthalic acid dihydrazide, maleic acid dihydrazide, carbon dihydrazide, sebacic acid dihydrazide, dodecane nitric acid dihydrazide, isophthalic acid dihydrazide, phthalic acid diethylenediamine, adipic acid diethylenediamine Polyamide polyamines such as dimethaxylenediamine phthalate and dimetaxylenediamine adipate. These curing agents may be used as a mixture.
【0025】該硬化剤は、ウレタンプレポリマーのブロ
ックイソシアネート基に対して、0.5〜2当量混合す
るのが好ましい。さらに、必要に応じて、ブロックイソ
シアネート基の解離促進及び遊離イソシアネート基とポ
リオールの水酸基との反応を促進するために、活性化触
媒として、有機金属(Sn、Zn)化合物、第3級アミ
ン化合物等のアミン系化合物(併用も可能)を含有して
いてもよい。The curing agent is preferably mixed in an amount of 0.5 to 2 equivalents based on the blocked isocyanate group of the urethane prepolymer. Further, if necessary, in order to promote the dissociation of the blocked isocyanate group and the reaction between the free isocyanate group and the hydroxyl group of the polyol, an organometallic (Sn, Zn) compound, a tertiary amine compound or the like is used as an activation catalyst. The above-mentioned amine compound (can be used in combination).
【0026】本発明の一液型絶縁性ポリウレタン樹脂用
組成物は、さらに必要に応じて、難燃剤、充填剤、着色
剤、プラスチック粉末、脂肪族、脂環族、芳香族炭化水
素、防虫剤、防カビ剤、防菌剤、紫外線吸収剤、酸化防
止剤、デンプン類、セルロース類等の添加剤を含んでい
てもよい。The one-component insulating polyurethane resin composition of the present invention further comprises, if necessary, a flame retardant, a filler, a colorant, a plastic powder, an aliphatic, an alicyclic, an aromatic hydrocarbon, an insect repellent. , An antifungal agent, an antibacterial agent, an ultraviolet absorber, an antioxidant, starches, and celluloses may be added.
【0027】本発明の一液型絶縁性ポリウレタン樹脂用
組成物から、好ましくは120〜170℃で10〜60
分加熱することによって絶縁性硬化物が得られる。From the one-pack type insulating polyurethane resin composition of the present invention, preferably 10 to 60 at 120 to 170 ° C.
An insulating cured material is obtained by heating for a minute.
【0028】本発明の一液型絶縁性ポリウレタン樹脂組
成物は、電気洗濯機、便座、湯沸し器、浄水器、風呂、
食器洗浄機等のスイッチ部や電動工具等に使用されてい
る電子、電気部品に含まれる電気・電子回路を水分、湿
気から保護するために該回路を封止する封止剤、電気、
電子機器のシーリング剤やコーティング剤、及びコンデ
ンサー、コンバーター、トランス、電線、コイル、電装
品(自動車の電子部品)の絶縁材料等として好適に使用
される。The one-component insulating polyurethane resin composition of the present invention is used in an electric washing machine, a toilet seat, a water heater, a water purifier, a bath,
Electronic used in switch parts and electric tools of dishwashers, etc., sealant for sealing electric / electronic circuits contained in electric parts from moisture and humidity, electricity,
It is preferably used as a sealing agent or coating agent for electronic devices, and as an insulating material for capacitors, converters, transformers, electric wires, coils, and electrical components (electronic components of automobiles).
【0029】[0029]
【実施例】以下、本発明を実施例に基づいてさらに詳し
く説明する。ただし本発明はこれらの実施例に限定され
るものではない。まず、以下に実施例、比較例で行った
試験方法を記載する。EXAMPLES The present invention will be described in more detail based on the following examples. However, the present invention is not limited to these examples. First, the test methods used in Examples and Comparative Examples will be described below.
【0030】体積固有抵抗値(Ω・cm)の測定
東亜電波工業社製SE−10Eを用い、25±5℃、6
5±5%RHで、サンプル(50mm×50mm、厚
さ:3mm)に500Vの測定電圧を印加し、60秒後
の数値を測定する。Measurement of volume resistivity (Ω · cm) Using SE-10E manufactured by Toa Denpa Kogyo KK, 25 ± 5 ° C., 6
A measurement voltage of 500 V is applied to the sample (50 mm × 50 mm, thickness: 3 mm) at 5 ± 5% RH, and the numerical value after 60 seconds is measured.
【0031】硬度の測定
サンプル(50mm×50mm、厚さ:3mm)を2枚
重ねて(厚さ:6mm)、硬度をJIS K 6253
に従って測定する。硬度計は高分子計器株式会社アスカ
ーA型を用いる。Hardness measurement Two samples (50 mm × 50 mm, thickness: 3 mm) were stacked (thickness: 6 mm), and the hardness was measured according to JIS K 6253.
Measure according to. As a hardness tester, Asker A type manufactured by Kobunshi Keiki Co., Ltd. is used.
【0032】実施例1
表1に示すポリオールとトリレンジイソシアネート(T
DI−100、2,4−TDI100重量%)とをO
H:NCO=1:1.6の割合で反応させ、得られたウ
レタンプレポリマーの末端イソシアネート基をメチルエ
チルケトオキシム(MEKO)(R(アルキル基)−
H:NCO=1.05:1(当量比))でブロックし
て、ブロックイソシアネート基含有ウレタンプレポリマ
ーを含む一液型絶縁性ポリウレタン樹脂用組成物を得
た。得られた組成物を硬化剤として、アジピン酸ジヒド
ラジド(ADH)とリシノール酸グリセライド(0.5
/0.5当量)を、ブロックNCOに対してブロックN
CO/R−H=1/1当量使用し、120〜170℃、
10〜30分で硬化させ、サンプルを得た。Example 1 The polyols and tolylene diisocyanates (T
DI-100, 2,4-TDI 100% by weight)
The reaction was carried out at a ratio of H: NCO = 1: 1.6 and the terminal isocyanate group of the obtained urethane prepolymer was methylethylketoxime (MEKO) (R (alkyl group)-
H: NCO = 1.05: 1 (equivalent ratio)) to obtain a one-component insulating polyurethane resin composition containing a blocked isocyanate group-containing urethane prepolymer. Using the obtained composition as a curing agent, adipic acid dihydrazide (ADH) and ricinoleic acid glyceride (0.5
/0.5 equivalent) to block NCO against block N
CO / R-H = 1/1 equivalent, 120-170 ° C,
It was cured in 10 to 30 minutes to obtain a sample.
【0033】得られたサンプルについて、下記する耐熱
処理及び耐湿熱処理を行い、これらの処理前後の体積固
有抵抗値、硬度及び重量を測定した。結果を表2に示
す。硬度および重量については処理前の値(初期値)に
対する低下率として示す。又表2中、VRは体積固有抵
抗値を、WTは初期値に対する重量の減少率を、HAは
初期値に対する硬さの減少率を示す。なお、使用したポ
リオールの物性を表3に示す。The samples thus obtained were subjected to the heat treatment and moisture heat treatment described below, and the volume resistivity, hardness and weight before and after these treatments were measured. The results are shown in Table 2. The hardness and weight are shown as the rate of decrease relative to the value (initial value) before treatment. Further, in Table 2, VR indicates the volume resistivity value, WT indicates the weight reduction rate with respect to the initial value, and HA indicates the hardness reduction rate with respect to the initial value. The physical properties of the polyol used are shown in Table 3.
【0034】耐熱性処理
ヤマト科学(株)製のDN−62恒温槽中でサンプルを
150℃、4時間放置する。Heat resistance treatment The sample is left at 150 ° C. for 4 hours in a DN-62 thermostat manufactured by Yamato Scientific Co., Ltd.
【0035】耐湿熱処理
株式会社平山製作所製プレッシャークッカー PC−2
42HS−A中でサンプルを121℃、100%RH、
2気圧の条件下で24時間放置する。Moisture-resistant heat treatment Co., Ltd. Hirayama Seisakusho Pressure Cooker PC-2
Samples in 42HS-A at 121 ° C, 100% RH,
Leave for 24 hours under the condition of 2 atm.
【0036】実施例2〜8及び比較例1〜3
表1に示すポリオールを使用して実施例1に準じてブロ
ックイソシアネート基含有ウレタンプレポリマーを含む
一液型絶縁性ポリウレタン樹脂用組成物を得、得られた
組成物から、実施例1に準じてサンプルを得た。得られ
たサンプルの耐熱処理及び耐湿熱処理前後の体積固有抵
抗値、硬度及び重量を測定した。結果を表2に示す。Examples 2 to 8 and Comparative Examples 1 to 3 Using the polyols shown in Table 1, a one-pack type insulating polyurethane resin composition containing a blocked isocyanate group-containing urethane prepolymer was obtained according to Example 1. A sample was obtained from the obtained composition according to Example 1. The volume resistivity, hardness and weight of the obtained sample were measured before and after heat treatment and moisture resistance heat treatment. The results are shown in Table 2.
【0037】[0037]
【表1】 [Table 1]
【0038】[0038]
【表2】 [Table 2]
【0039】[0039]
【表3】 [Table 3]
【0040】表2から明らかなように、酸素含有率が2
2重量%以下及びヨウ素価が155mgKOH/g以下
のポリオールとポリイソシアネートとを反応させて得ら
れた絶縁性ポリウレタン樹脂の硬化物は、121℃、1
00%RH2気圧の条件下24時間放置した後でも、1
50℃恒温槽中で24時間放置した後でも、硬度及び重
量の減少率を10%以下に抑えることができ、且つ絶縁
性の低下も殆どなかった。As is clear from Table 2, the oxygen content is 2
A cured product of an insulating polyurethane resin obtained by reacting a polyol having a weight ratio of 2% by weight or less and an iodine value of 155 mgKOH / g or less with polyisocyanate is 121 ° C., 1
Even after standing for 24 hours under the condition of 00% RH and 2 atm,
Even after being left for 24 hours in a constant temperature bath of 50 ° C., the rate of decrease in hardness and weight could be suppressed to 10% or less, and there was almost no deterioration in insulation.
【0041】[0041]
【発明の効果】本発明一液型絶縁性ポリウレタン樹脂
は、高温下あるいは高温多湿下に曝されても硬度は殆ど
変化せず、絶縁性も殆ど低下しない絶縁性硬化物を与え
ることができ、しかも取り扱いが容易である。INDUSTRIAL APPLICABILITY The one-pack type insulating polyurethane resin of the present invention can give an insulating cured product whose hardness hardly changes even when exposed to high temperature or high temperature and high humidity, and whose insulating property does not decrease. Moreover, it is easy to handle.
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4J034 BA01 CA03 CA04 CA05 DC50 DF01 DF02 DG03 DG04 DG05 DG06 DL01 DQ08 GA05 GA06 HA01 HA07 HC12 HC13 HC61 HC64 HC67 HC71 HD02 HD03 HD04 HD07 HD12 QB06 QB19 RA14 5G305 AA11 AB26 BA09 BA26 CA18 CA55 CA56 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 4J034 BA01 CA03 CA04 CA05 DC50 DF01 DF02 DG03 DG04 DG05 DG06 DL01 DQ08 GA05 GA06 HA01 HA07 HC12 HC13 HC61 HC64 HC67 HC71 HD02 HD03 HD04 HD07 HD12 QB06 QB19 RA14 5G305 AA11 AB26 BA09 BA26 CA18 CA55 CA56
Claims (2)
価が155mgKOH/g以下のポリオールとポリイソ
シアネートとを反応させて得られるウレタンプレポリマ
ーを含有し、前記ウレタンプレポリマーの末端イソシア
ネート基がブロックされてなることを特徴とする一液型
絶縁性ポリウレタン樹脂用組成物。1. A urethane prepolymer obtained by reacting a polyol having an oxygen content of 22% by weight or less and an iodine value of 155 mgKOH / g or less with a polyisocyanate, wherein a terminal isocyanate group of the urethane prepolymer is blocked. A composition for a one-component insulating polyurethane resin, characterized by comprising:
1記載の一液型絶縁性ポリウレタン樹脂用組成物。2. The composition for one-component insulating polyurethane resin according to claim 1, which is for insulating electrical or electronic parts.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009181802A (en) * | 2008-01-30 | 2009-08-13 | Sony Corp | Battery pack and method for producing the same |
JPWO2016072145A1 (en) * | 2014-11-04 | 2017-04-27 | 第一工業製薬株式会社 | Water-based polyurethane resin composition |
-
2002
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009181802A (en) * | 2008-01-30 | 2009-08-13 | Sony Corp | Battery pack and method for producing the same |
US8465861B2 (en) | 2008-01-30 | 2013-06-18 | Sony Corporation | Battery pack and method for producing the same |
JPWO2016072145A1 (en) * | 2014-11-04 | 2017-04-27 | 第一工業製薬株式会社 | Water-based polyurethane resin composition |
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