JP2003246359A - Carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To protect electrodes even if an amount of electrodes in an electronic parts in increased, and in the case of a carrier tape with a plastic sheet being applied as a mother material in the prior art in which the electrodes are supported at the circumference of the electronic parts, to safely and surely store the electronic parts because the strength of the bottom surface is weak and applying of load under a reel wound state, the bottom surface is flexed and each of the electrodes is directly protected against its contact. <P>SOLUTION: In a carrier tape 2 in which several substantial rectangular- shaped storing notches 1 opened at its surface are formed in a predetermined space in a longitudinal direction and electronic parts A having electrodes B at the bottom surfaces of the storing notches 1 is housed in the notches 1, many small pockets 4 in compliance with each of the electrodes B are formed and at the same time a clearance portion between each of the electrodes B, B is held by a protrusion 6 of each of the pockets 4. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used for accommodating electronic parts, and particularly BGA (Ball Grid).
The present invention relates to a carrier tape suitable for accommodating small semiconductor packages such as Array) and μBGA.

[0002]

2. Description of the Related Art In a conventional carrier tape, a large number of substantially rectangular accommodating recesses which are open on the surface are formed at predetermined intervals in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. In the carrier tape, the four corners of the accommodating recess are provided with shelves whose height from the accommodating recess bottom surface is greater than the electrode protrusion height of the electronic component bottom surface and on which the bottom edge of the electronic component can be placed. The shelves are formed so as to be spaced apart in the circumferential direction of the accommodating recesses, and the outer peripheral edge side of the shelves is formed to be wider outward in the plane direction than the outer peripheral edge of the accommodating recesses, and the inner peripheral edge of the accommodating recess is defined between the shelves. There is a carrier tape (see Japanese Patent No. 2933130) that serves as a positioning part that contacts the side part of the electronic component and positions it in the planar direction.

[0003]

However, in the carrier tape described in Japanese Patent No. 2933130 in the above-mentioned prior art, the four corners of the recess for accommodating the electronic component are prevented so that the electrodes of the semiconductor package such as μBGA do not come into contact with each other. A shelf having a height from the bottom surface of the housing recess that is larger than the electrode protrusion height of the bottom surface of the electronic component and on which the peripheral edge of the bottom surface of the electronic component can be placed, and the shelf is spaced apart in the circumferential direction of the housing recess. The outer peripheral edge side of the shelf portion is formed to be wider outward in the plane direction than the outer peripheral edge of the accommodating concave portion, and the inner peripheral surface of the outer peripheral edge of the accommodating concave portion is in contact with the side portion of the electronic component between the shelf portions to form a flat surface. A positioning part for positioning in the direction
The space around the electrodes (solder balls) on the back surface of the GA (some of which have only four corners) was placed on the shelf to float the whole and protect the electrodes, but the number of electrodes increased several times. It will increase and it will not be possible to secure the surrounding space. In addition, the carrier tape having a plastic sheet as a base material has a weak bottom surface, and there is a possibility that the bottom surface may bend and come into contact with an electrode when a load is applied while being wound on a reel. there were.

In view of such circumstances, the present invention makes a large number of small pockets for each electrode (solder ball),
It is an object of the present invention to provide a carrier tape that holds an electrode or a plurality of electrodes and a gap between the electrodes so that the electrodes individually or together protect a plurality of electrodes.

[0005]

The present invention is intended to solve the above-mentioned problems, and employs the following technical means. In the invention according to claim 1, a large number of substantially rectangular accommodating recesses opened on the surface are formed at predetermined intervals in the longitudinal direction,
In a carrier tape for accommodating an electronic component having an electrode on the bottom surface in the accommodating recess, a large number of small pockets are formed at the bottom of the accommodating recess to match each electrode,
The technical means of holding the gaps between the individual electrodes with the convex portions of the pockets was adopted.

According to the second aspect of the present invention, a large number of substantially rectangular accommodating recesses that are open in the surface are formed at predetermined intervals in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. In the carrier tape, a plurality of pockets each having a size capable of protecting a plurality of electrodes together are formed at the bottom of the accommodating recess, and the gap between the plurality of electrodes and the plurality of electrodes is held by the convex portion of the pocket. We adopted the technical means.

According to the third aspect of the present invention, a large number of substantially rectangular accommodating recesses that are open in the surface are formed at predetermined intervals in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. In the carrier tape, a plurality of strip-shaped ribs are erected on the bottom of the accommodating recess so as to protect a plurality of each row of each electrode together, and the gap between the plurality of aggregated electrodes and the plurality of aggregated electrodes is striped. The technical means of holding with ribs was adopted.

In a fourth aspect of the present invention, a large number of substantially rectangular accommodating recesses that are open in the surface are formed at predetermined intervals in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. In the carrier tape, a technical means is adopted in which a convex portion that is located between the electrodes is formed at the bottom of the accommodating concave portion, and the convex portion holds the gap between each electrode.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. A first embodiment will be described with reference to FIGS. The carrier tape according to the first embodiment of the present invention is a thermoplastic resin sheet such as polystyrene, acrylonitrile-butadiene-styrene resin, polyvinyl chloride resin, polyethylene terephthalate, or polypropylene, which is vacuum-formed, pressure-formed, or press-formed. And the like, and a plurality of feed holes are formed on one side or both sides in parallel with the accommodating recess 1 at regular intervals. This carrier tape 2 is used after accommodating the electronic component A in the accommodating recess 1. A cover tape for closing the accommodation recess opening is attached to the opening side surface of the.

The electronic component A is a BGA (Bal) having electrode terminals such as electrodes B (solder balls, solder bumps) on the bottom surface 5.
1 Grid Array), etc.
Are opened on one surface (front surface) of the carrier tape 2 and are formed at predetermined intervals in the longitudinal direction thereof. The housing recess 1 has a plan view shape corresponding to the plan view shape of the electronic component A housed therein, has a substantially rectangular shape such as a square or a rectangular parallelepiped, and is a carrier tape 2 for housing the electronic component A. is there.

Next, as shown in FIGS. 1 and 2, a large number of substantially rectangular accommodating recesses 1 having openings on the surface are formed at predetermined intervals in the longitudinal direction, and the electronic component A having electrodes on the bottom is accommodated therein. In the carrier tape 2 accommodated in the recessed portion 1, a small number of pockets 4 are formed in the bottom portion 3 of the accommodation recessed portion 1 in accordance with the number of the electrodes B of the electronic component A. The electrodes accommodated in the pockets 4 are formed. It is designed to protect each individual.

As shown in FIG. 3, the pocket 4 is such that the protrusions hold the gaps between the individual electrodes B and the electrodes B. As shown in FIG. Therefore, it is conceivable that the side surface of the electrode is held to avoid contact with the bottom portion C of the electrode B.

Next, a second embodiment will be described with reference to FIG. In the second embodiment, a plurality of electrodes B (in the figure, an example in which five electrodes in each row are housed together) can be housed in one pocket. Others are the first embodiment. Since it is the same as, the detailed description will be omitted. Also, the holding method is the same as the electrode B and the electrode B of FIG. 3 described in the first embodiment.
The method of holding the gap portion of FIG. 4 and the method of holding the side surface of the electrode B by the inclined surface of the pocket 4 in FIG. 4 and avoiding the contact of the bottom surface portion are adopted.

A third embodiment will be described with reference to FIG. The pocket 4 of the second embodiment is replaced with a band-shaped rib 5 for supporting a plurality of electrodes B, and the rest is the same as that of the second embodiment, and the description thereof is omitted.

Further, a fourth embodiment will be described with reference to FIG. Instead of the pockets 4 according to the number of the electrodes of the first embodiment, a convex portion 6 is formed in the accommodating concave portion 1 so as to be supported at a point between the electrodes B, and other configurations are the same as those of the first embodiment. The detailed description is omitted because it is the same as the embodiment.

[0016]

As a result of adopting the above configuration, the present invention provides
The following effects can be obtained. (1) The electrodes can be protected even if the number of electrodes of the electronic component increases. (2) In the conventional example of supporting around electronic components, a carrier tape having a plastic sheet as a base material has a weak bottom surface, and particularly when loaded on a reel,
Since each electrode is directly protected from being bent and coming into contact with the electrodes, the electrodes can be safely and reliably accommodated.

[Brief description of drawings]

FIG. 1 is a sectional front view showing a related state of an electronic component and a carrier tape according to a first embodiment of the present invention.

FIG. 2 is a plan view showing the shapes of the electrodes of the electronic component and the accommodating recesses of the carrier tape in the first embodiment of the present invention.

FIG. 3 is a front view showing a supported state of the electronic component of the present invention.

FIG. 4 is a front view showing another example of a supported state of the electronic component of the present invention.

FIG. 5 is a plan view showing the shape of an electrode of an electronic component and a housing recess of a carrier tape according to a second embodiment of the present invention.

FIG. 6 is a plan view showing the shapes of an electrode of an electronic component and an accommodating recess of a carrier tape according to a third embodiment of the present invention.

FIG. 7 is a plan view showing the shapes of an electrode of an electronic component and a housing recess of a carrier tape according to a fourth embodiment of the present invention.

[Explanation of symbols]

1 ... Receiving recess 2 ... Carrier tape 3 ... Bottom 4 ... Pocket 5 ... Strip rib 6 ... Projection A ... Electronic component B ... Electrode C ... Bottom part

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 3E067 AA12 AB45 AC04 AC11 BA26A                       BB14A BC04A BC07A EA29                       EB27 EC09 FA01 FC01 GD10                 3E096 AA06 BA13 BB03 CA14 CC01                       DA04 DA05 DA23 DB06 DC01                       EA02X FA09 FA31 GA05

Claims (4)

[Claims] 1. A carrier tape in which a large number of substantially rectangular accommodating recesses that are open on the surface are formed at predetermined intervals in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. A carrier tape, characterized in that a large number of small pockets are formed at the bottom of each of the electrodes in accordance with each electrode, and that the gap between each electrode can be held by the convex portion of the pocket. 2. A carrier tape in which a large number of substantially rectangular accommodating recesses opened on the surface are formed at predetermined intervals in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. In addition to forming a plurality of pockets of a size that can protect each of the electrodes together, the gap between the multiple electrodes and the multiple electrodes can be held by the convex portion of the pocket. Carrier tape to do. 3. A carrier tape in which a large number of substantially rectangular accommodating recesses opened on the surface are formed at predetermined intervals in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. A plurality of strip-shaped ribs were erected on the bottom of the so as to protect a plurality of each row of each electrode together, and the gap between the multiple aggregated electrodes and the multiple aggregated electrodes could be held by the strip-shaped ribs. Carrier tape characterized by that. 4. A carrier tape in which a large number of substantially rectangular accommodating recesses opened on the surface are formed at a predetermined interval in the longitudinal direction, and an electronic component having an electrode on the bottom surface is accommodated in the accommodating recess. A carrier tape characterized in that a convex portion is formed on the bottom of each of the electrodes so as to be located between the electrodes, and the gap between each electrode can be held by the convex portion.