JP2003245789A5 - - Google Patents

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Publication number
JP2003245789A5
JP2003245789A5 JP2002050111A JP2002050111A JP2003245789A5 JP 2003245789 A5 JP2003245789 A5 JP 2003245789A5 JP 2002050111 A JP2002050111 A JP 2002050111A JP 2002050111 A JP2002050111 A JP 2002050111A JP 2003245789 A5 JP2003245789 A5 JP 2003245789A5
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JP
Japan
Prior art keywords
light
dichroic mirror
lens
receiving lens
optical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002050111A
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Japanese (ja)
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JP4220707B2 (en
JP2003245789A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002050111A priority Critical patent/JP4220707B2/en
Priority claimed from JP2002050111A external-priority patent/JP4220707B2/en
Publication of JP2003245789A publication Critical patent/JP2003245789A/en
Publication of JP2003245789A5 publication Critical patent/JP2003245789A5/ja
Application granted granted Critical
Publication of JP4220707B2 publication Critical patent/JP4220707B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (5)

レーザ光を集光するための投光レンズと、
前記投光レンズによって集光されたレーザ光を反射して被加工物に照射するダイクロイックミラーと、
前記被加工物のレーザ光照射箇所から発する輻射光を集光する受光レンズと、
前記投光レンズ、ダイクロイックミラーおよび受光レンズを収容する筐体と、
を備えるレーザ加工ヘッドであって、
前記ダイクロイックミラーは、前記受光レンズの光軸に沿って前記レーザ光を前記被加工物に照射し、
前記ダイクロイックミラーは、前記輻射光を透過させ、
前記受光レンズは、前記ダイクロイックミラーを透過した前記輻射光を集光する、
レーザ加工ヘッド。
A light projection lens for condensing the laser beam;
A dichroic mirror that reflects the laser light collected by the light projecting lens and irradiates the workpiece;
A light-receiving lens that collects radiation emitted from the laser beam irradiated portion of the workpiece;
A housing for housing the light projecting lens, the dichroic mirror, and the light receiving lens;
A laser processing head comprising:
The dichroic mirror irradiates the workpiece with the laser beam along the optical axis of the light receiving lens,
The dichroic mirror transmits the radiation light,
The light receiving lens condenses the radiation light transmitted through the dichroic mirror;
Laser processing head.
レーザ光を集光するための投光レンズと、
前記投光レンズによって集光されたレーザ光を透過させて被加工物に照射するダイクロイックミラーと、
前記被加工物のレーザ光照射箇所から発する輻射光を集光する受光レンズと、
前記投光レンズ、ダイクロイックミラーおよび受光レンズを収容する筐体と、
を備えるレーザ加工ヘッドであって、
前記ダイクロイックミラーは、前記被加工物に照射される前記レーザ光と同軸に放射された前記輻射光を前記受光レンズの光軸上に反射し、
前記受光レンズは、前記ダイクロイックミラーで反射された前記輻射光を集光する、
レーザ加工ヘッド。
A light projection lens for condensing the laser beam;
A dichroic mirror that transmits the laser beam condensed by the light projecting lens and irradiates the workpiece;
A light-receiving lens that collects radiation emitted from the laser beam irradiated portion of the workpiece;
A housing for housing the light projecting lens, the dichroic mirror, and the light receiving lens;
A laser processing head comprising:
The dichroic mirror reflects the radiation light radiated coaxially with the laser light applied to the workpiece on the optical axis of the light receiving lens,
The light receiving lens condenses the radiation reflected by the dichroic mirror;
Laser processing head.
前記投光レンズの光軸と前記受光レンズの光軸とが直交し、
前記ダイクロイックミラーは、その鏡面が前記投光レンズの光軸と前記受光レンズの光軸との交点を含むように配置され、
前記ダイクロイックミラーの鏡面と前記投光レンズの光軸とがなす鋭角は45度であり、
前記ダイクロイックミラーの鏡面と前記受光レンズの光軸とがなす鋭角は45度である、
請求項1または2記載のレーザ加工ヘッド。
The optical axis of the light projecting lens and the optical axis of the light receiving lens are orthogonal,
The dichroic mirror is arranged such that its mirror surface includes the intersection of the optical axis of the light projecting lens and the optical axis of the light receiving lens,
The acute angle formed by the mirror surface of the dichroic mirror and the optical axis of the projection lens is 45 degrees,
The acute angle formed by the mirror surface of the dichroic mirror and the optical axis of the light receiving lens is 45 degrees.
The laser processing head according to claim 1 or 2.
前記筐体内には、前記ダイクロイックミラーを挟んで前記投光レンズと対向するレーザ光吸収体が配置されている、請求項1記載のレーザ加工ヘッド。  2. The laser processing head according to claim 1, wherein a laser beam absorber facing the projection lens is disposed in the casing with the dichroic mirror interposed therebetween. 前記受光レンズと前記ダイクロイックミラーの間に、前記レーザ光を遮断するフィルタを更に備える請求項1または2記載のレーザ加工ヘッド。  The laser processing head according to claim 1, further comprising a filter that blocks the laser light between the light receiving lens and the dichroic mirror.
JP2002050111A 2002-02-26 2002-02-26 Laser processing head Expired - Fee Related JP4220707B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002050111A JP4220707B2 (en) 2002-02-26 2002-02-26 Laser processing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002050111A JP4220707B2 (en) 2002-02-26 2002-02-26 Laser processing head

Publications (3)

Publication Number Publication Date
JP2003245789A JP2003245789A (en) 2003-09-02
JP2003245789A5 true JP2003245789A5 (en) 2005-10-27
JP4220707B2 JP4220707B2 (en) 2009-02-04

Family

ID=28662450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002050111A Expired - Fee Related JP4220707B2 (en) 2002-02-26 2002-02-26 Laser processing head

Country Status (1)

Country Link
JP (1) JP4220707B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382952B2 (en) 2018-10-16 2023-11-17 古河電気工業株式会社 Temperature measurement system, temperature measurement method and laser processing equipment

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4618531B2 (en) * 2004-03-15 2011-01-26 株式会社ニコン Laser processing optical system and laser processing apparatus using the same
US7438468B2 (en) * 2004-11-12 2008-10-21 Applied Materials, Inc. Multiple band pass filtering for pyrometry in laser based annealing systems
US7422988B2 (en) 2004-11-12 2008-09-09 Applied Materials, Inc. Rapid detection of imminent failure in laser thermal processing of a substrate
CN101107501B (en) * 2005-03-04 2011-07-27 松下电器产业株式会社 Laser heating device and laser heating method
JP2009093984A (en) * 2007-10-11 2009-04-30 Hitachi Displays Ltd Organic el display device and its manufacturing method
JP2011003558A (en) * 2010-10-07 2011-01-06 Hitachi Displays Ltd Manufacturing method for display device
WO2015145681A1 (en) * 2014-03-27 2015-10-01 三菱電機株式会社 Laser machining apparatus
CN104942431A (en) * 2015-06-17 2015-09-30 王金 Laser processing device and process for laser hot melt adhesive quick adhesion thereof
EP4123273A4 (en) * 2020-05-20 2024-03-27 Hamamatsu Photonics K.K. Thermal radiation light detection device and laser processing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382952B2 (en) 2018-10-16 2023-11-17 古河電気工業株式会社 Temperature measurement system, temperature measurement method and laser processing equipment

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