WO2015145681A1 - Laser machining apparatus - Google Patents

Laser machining apparatus Download PDF

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Publication number
WO2015145681A1
WO2015145681A1 PCT/JP2014/058945 JP2014058945W WO2015145681A1 WO 2015145681 A1 WO2015145681 A1 WO 2015145681A1 JP 2014058945 W JP2014058945 W JP 2014058945W WO 2015145681 A1 WO2015145681 A1 WO 2015145681A1
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WO
WIPO (PCT)
Prior art keywords
light
laser
galvano scanner
galvanometer mirror
galvano
Prior art date
Application number
PCT/JP2014/058945
Other languages
French (fr)
Japanese (ja)
Inventor
俊之 鉾館
健太郎 坂
純也 加藤
尚弘 高橋
研吾 内山
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2014/058945 priority Critical patent/WO2015145681A1/en
Publication of WO2015145681A1 publication Critical patent/WO2015145681A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses

Definitions

  • the present invention relates to a laser processing apparatus.
  • Laser processing devices equipped with galvano scanners are used for, for example, drilling printed circuit boards and precision electronic components. As the electronic circuits and electronic parts that are products are being refined, the laser processing apparatus is required to control the processing position with high accuracy.
  • the galvanometer mirror that deflects the laser beam may be deformed when a part of the energy of the incident laser beam is absorbed and the temperature rises. As the deformation of the galvanometer mirror becomes significant, the laser processing apparatus may deteriorate the accuracy of the processing position.
  • the relationship between the temperature of the galvanometer mirror and the amount of deviation of the processing position has been obtained in advance, and the relationship between the temperature of the galvanometer mirror during laser processing and A technique for correcting the machining position based on the measurement result has been proposed (see, for example, Patent Document 1).
  • the processing object may radiate reflected light of the laser beam from the processing position and radiation light derived from the processing phenomenon from the processing position.
  • a part of such secondary light beam radiated from the object to be processed in laser processing may travel in the opposite direction to the laser light for processing and reach a temperature detector that detects the temperature of the galvanometer mirror. is there.
  • the secondary light beam reaches the temperature detector, it may be difficult for the temperature detector to accurately detect the temperature. In this case, the laser processing apparatus does not correct the processing position accurately, and it is difficult to control the processing position with high accuracy.
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus that enables highly accurate control of a processing position.
  • the present invention includes a laser light source, a first galvanometer mirror that reflects the laser light from the laser light source, and the laser light from the first galvanometer mirror.
  • the second galvanometer mirror, the first galvanometer scanner that drives the first galvanometer mirror, the second galvanometer scanner that drives the second galvanometer mirror, and the temperature detection that is the first galvanometer mirror or the second galvanometer mirror A temperature detector for detecting the temperature of the object, and a control unit for adjusting the incident position of the laser beam on the object to be processed by controlling the drive of the temperature detection object according to the detection result of the temperature detector;
  • a light absorber that absorbs light at a position other than the optical path of the laser light from the laser light source to the workpiece, and the light absorber Characterized in that provided on at least one surface of the first optical scanner and the second galvano scanner.
  • the laser processing apparatus absorbs a secondary light beam incident on the first galvano scanner or the second galvano scanner following the direction opposite to the laser beam for processing by the light absorber. By suppressing the reflection and scattering of light at the position where the light absorber is provided, the light component traveling toward the temperature detector is reduced. By reducing the light component that travels to the temperature detector and enabling accurate temperature measurement with the temperature detector, the laser processing apparatus can accurately correct the processing position. Thereby, the laser processing apparatus has an effect that the processing position can be controlled with high accuracy.
  • FIG. 1 is a diagram showing a laser processing apparatus according to Embodiment 1 of the present invention.
  • FIG. 2 is a diagram for explaining the progress of secondary light from the processing position.
  • FIG. 3 is a diagram showing a laser processing apparatus according to the second embodiment of the present invention.
  • FIG. FIG. 1 is a diagram showing a laser processing apparatus according to Embodiment 1 of the present invention.
  • the laser processing apparatus is an apparatus that forms a fine hole in a processing object by irradiation with laser light (pulse laser light). For example, the laser processing apparatus sequentially scans a plurality of processing positions set on a processing object, and performs processing (cycle pulse mode) in which laser irradiation is performed on each processing position in a plurality of cycles.
  • the laser processing apparatus includes a laser oscillator 1, a bend mirror 2, a Y-axis galvano scanner 3, an X-axis galvano scanner 4, a galvano mirror 5, 6, an f ⁇ lens 7, a temperature detector 10, a light absorber 11, a galvano driver 12, and a control. It has a device 13.
  • the workpiece 8 that is the object to be processed is, for example, a printed board.
  • the workpiece 8 is placed on an XY table (not shown).
  • the XY table moves the workpiece 8 in a two-dimensional direction including the X-axis direction and the Y-axis direction.
  • the laser oscillator 1 which is a laser light source emits a laser beam 14.
  • the laser beam 14 is a laser beam output in a pulse shape.
  • any one of infrared light having a wavelength of 9 to 10 ⁇ m, ultraviolet light having a wavelength of 0.5 ⁇ m, and the like is used as a laser beam.
  • the bend mirror 2 reflects the laser beam 14 from the laser oscillator 1 and advances it to the galvanometer mirror 5.
  • the galvanometer mirror 5 as the first galvanometer mirror reflects the laser beam 14 from the laser oscillator 1.
  • a Y-axis galvano scanner 3 as a first galvano scanner drives a galvanometer mirror 5.
  • the galvanometer mirror 6 that is the second galvanometer mirror reflects the laser beam 14 from the galvanometer mirror 5.
  • the X-axis galvano scanner 4 as the second galvano scanner drives the galvano mirror 6.
  • the Y-axis galvano scanner 3 reciprocates the rotation shaft that supports the galvanometer mirror 5.
  • the Y-axis galvano scanner 3 scans the irradiation position of the laser beam 14 on the workpiece 8 in the Y-axis direction.
  • the X-axis galvano scanner 4 reciprocally rotates a rotation shaft that supports the galvanometer mirror 6.
  • the X-axis galvano scanner 4 scans the irradiation position of the laser beam 14 on the workpiece 8 in the X-axis direction.
  • the f ⁇ lens 7 changes the laser light 14 from the galvanometer mirror 6 into a laser light 15 perpendicular to the processed surface of the workpiece 8.
  • the f ⁇ lens 7 condenses the laser light 15 at the processing position 9 in the work 8.
  • the galvano driver 12 drives the Y-axis galvano scanner 3 and the X-axis galvano scanner 4.
  • the control device 13 as a control unit controls the overall operation of the laser processing apparatus.
  • the control device 13 controls the oscillation of the laser beam 14 of the laser oscillator 1 and the driving of the Y-axis galvano scanner 3 and the X-axis galvano scanner 4 by the galvano driver 12.
  • the control device 13 controls a motor (not shown) that drives the XY table.
  • the temperature detector 10 detects the temperature of the galvanometer mirror 6 that is a temperature detection target.
  • the temperature detector 10 is a non-contact temperature detector that detects the temperature of the galvanometer mirror 6 in a non-contact state with the galvanometer mirror 6.
  • the temperature detector 10 is, for example, a radiation thermometer.
  • the temperature detector 10 is disposed at a position facing the back surface of the galvanometer mirror 6.
  • the back surface is the surface of the galvanometer mirror 6 opposite to the reflecting surface that reflects the laser beam 14.
  • the control device 13 controls the driving of the galvanometer mirror 6 that is a temperature detection target according to the detection result of the temperature detector 10.
  • the control device 13 adjusts the machining position 9 that is the incident position of the laser beam 15 on the workpiece 8 by controlling the driving of the galvanometer mirror 6.
  • the control device 13 holds in advance the relationship between the temperature of the galvano mirror 6 and the amount of processing position deviation.
  • the control device 13 corrects the machining position 9 based on the relationship and the detection result of the temperature detector 10.
  • the laser processing apparatus includes a light absorber 11 that absorbs light at a position other than the optical path of the laser light 14 from the laser oscillator 1 to the workpiece 8.
  • the light absorber 11 is provided on at least one surface of the Y-axis galvano scanner 3 and the X-axis galvano scanner 4.
  • the light absorber 11 is a black body seal.
  • the black body seal which is the light absorber 11 is affixed to a part of the end surface of the Y-axis galvano scanner 3 facing the galvanometer mirror 5 side.
  • the end surface is the end surface of the frame case of the Y-axis galvano scanner 3.
  • FIG. 2 is a diagram for explaining the progress of the secondary light beam from the processing position.
  • the processing object of the laser processing apparatus may generate reflected light of the laser beam 15 from the processing position 9 depending on the state of the processing position 9 or processing conditions. For example, when the laser beam 15 is irradiated on the surface of the copper layer of the printed board, the reflected light of the laser beam 15 is easily generated. Further, the workpiece may radiate radiation light derived from the machining phenomenon from the machining position 9. The reflected light and radiant light from these processing positions 9 are referred to as secondary light 16.
  • the secondary light beam 16 radiated from the workpiece 8 in the laser machining is radiated from the machining position 9 in various directions depending on the surface state and the machining state of the machining position 9.
  • a part of the secondary light beam 16 generated at the processing position 9 traces in the direction opposite to the laser beam 15 and may reach the galvanometer mirror 6 through the f ⁇ lens 7.
  • the secondary light beam 16 reflected from the surface of the galvanometer mirror 6 may further travel to the back side of the galvanometer mirror 6 and reach the temperature detector 10.
  • the temperature detector 10 may detect a temperature significantly higher than the temperature detected from the galvanometer mirror 6. It becomes difficult for the temperature detector 10 to detect the accurate temperature of the galvanometer mirror 6 by the incidence of the secondary light beam 16.
  • the laser processing apparatus makes it difficult to accurately detect the temperature with the temperature detector 10, thereby causing an error in the correction of the processing position 9.
  • the temperature detector 10 which is a radiation thermometer using Stefan-Boltzmann's law, may cause an error in temperature measurement when infrared light or visible light other than the radiation light from the temperature detection target is mixed.
  • the temperature detector 10 incorporates a sensor unit in the tube in order to avoid mixing light rays from other than the temperature detection target.
  • the temperature detector 10 has a space of about several millimeters between the tip of the tube and the back surface of the galvanometer mirror 6 in order to prevent interference with the galvanometer mirror 6 that is rotationally driven with respect to the galvanometer mirror 6 that is a temperature detection target. Is arranged. When the scattered light or reflected light of the secondary light beam 16 is mixed from the space, the temperature detector 10 may cause an error in temperature measurement.
  • the light absorber 11 is provided in a portion of the end face of the galvano scanner 3 that reflects the secondary light beam 16 from the processing position 9 toward the temperature detector 10.
  • the light absorber 11 cuts the secondary light beam 16 from the end face of the galvano scanner 3 toward the temperature detector 10. Since the secondary light beam 16 traveling to the temperature detector 10 is reduced, the temperature detector 10 can accurately detect the temperature.
  • the laser machining apparatus can accurately correct the machining position 9 by enabling accurate temperature detection by the temperature detector 10. Thereby, the laser processing apparatus has an effect that the processing position 9 can be controlled with high accuracy.
  • the laser processing apparatus can easily realize a configuration capable of reducing the secondary light beam 16 by adding the light absorber 11 to the conventional configuration.
  • the light absorber 11 may be retrofitted to the laser processing apparatus.
  • the light absorber 11 is not limited to being provided on a part of the end face of the Y-axis galvano scanner 3.
  • the light absorber 11 may be provided on the entire end surface of the Y-axis galvano scanner 3.
  • the light absorber 11 may be provided on a part or the whole of the surface other than the end surface of the Y-axis galvano scanner 3.
  • the light absorber 11 may be attached to the surface of the other X-axis galvano scanner 4.
  • the light absorber 11 may be provided at any position on the surface of the galvano scanners 3 and 4 according to the arrangement of the temperature detector 10 and the galvanometer mirrors 5 and 6.
  • the light absorber 11 may be provided in both the Y-axis galvano scanner 3 and the X-axis galvano scanner 4.
  • the range in which the light absorber 11 is provided on the surface of the galvano scanners 3 and 4 is arbitrary.
  • the temperature detection target of the temperature detector 10 may be the other galvanometer mirror 5.
  • the temperature detector 10 is disposed at a position facing the back surface of the galvanometer mirror 5.
  • the laser processing apparatus may appropriately change the position and range in which the light absorber 11 is provided depending on whether the temperature detection target is the galvano mirror 5 or the galvano mirror 6.
  • the galvano scanners 3 and 4 are required to have an increased torque constant and an increased driving current in response to a request for high-speed driving.
  • the coil wire diameter increases to ensure resistance to an increase in current
  • the area of the end faces of the galvano scanners 3 and 4 tends to increase as the frame case becomes larger.
  • the influence of the reflection and scattering of the secondary light beam 16 on the end faces becomes larger.
  • the light absorber 11 can effectively reduce the reflected light from the processing position 9 and the radiation light in a wavelength region different from the reflected light, the light absorber 11 has an absorption characteristic for light in a wider wavelength region than the wavelength region of the laser light 14. Shall be provided.
  • a black member as the light absorber 11
  • light in a wide wavelength range including infrared light, ultraviolet light, and visible light can be reduced.
  • the light absorber 11 may be any black member other than the black body seal.
  • the light absorber 11 may be a galvano scanner 3 or 4 having a black pigment coated on the surface thereof.
  • FIG. FIG. 3 is a diagram showing a laser processing apparatus according to the second embodiment of the present invention.
  • the same parts as those in the first embodiment are denoted by the same reference numerals, and repeated description will be omitted as appropriate.
  • the laser processing apparatus includes a light absorber 20 that absorbs light at a position other than the optical path of the laser light 14 from the laser oscillator 1 to the workpiece 8.
  • the light absorber 20 is, for example, a belt-like member with a black body sticker.
  • One end side portion of the light absorber 20 covers a part of the end surface of the Y-axis galvano scanner 3 directed toward the galvano mirror 5 side.
  • the light absorber 20 covers a portion of the end face of the Y-axis galvano scanner 3 that reflects the secondary light beam 16 from the processing position 9 toward the temperature detector 10.
  • the light absorber 20 is not in contact with the end surface of the Y-axis galvano scanner 3.
  • a gap is formed between the light absorber 20 and the end surface of the Y-axis galvano scanner 3.
  • the end of the light absorber 20 opposite to the Y-axis galvano scanner 3 side is fixed to the end surface of the X-axis galvano scanner 4.
  • the light absorber 20 has a shape that extends from a portion fixed to the X-axis galvano scanner 4 to the surface of the Y-axis galvano scanner 3.
  • the light absorber 20 is appropriately bent according to the arrangement of the galvano scanners 3 and 4.
  • the light absorber 20 absorbs the secondary light beam 16 to increase the temperature.
  • the light absorber 20 is arranged so as to float from the surface of the Y-axis galvano scanner 3, thereby suppressing heat transfer from the light absorber 20 to the Y-axis galvano scanner 3. Thereby, the laser processing apparatus can reduce the malfunction caused by the temperature rise of the Y-axis galvano scanner 3.
  • the light absorber 20 uses natural convection to dissipate heat to the surroundings, thereby suppressing heat propagation to the fixed part with the X-axis galvano scanner 4. Thereby, the laser processing apparatus can reduce problems caused by the temperature rise of the X-axis galvano scanner 4.
  • the laser processing apparatus can accurately detect the processing position 9 by enabling accurate temperature detection by the temperature detector 10. Thereby, the laser processing apparatus has an effect that the processing position 9 can be controlled with high accuracy.
  • the laser processing apparatus can easily realize a configuration capable of reducing the secondary light beam 16 by adding the light absorber 20 to the conventional configuration.
  • the light absorber 20 may be retrofitted to the laser processing apparatus.
  • the light absorber 20 may be fixed to any configuration other than the X-axis galvano scanner 4.
  • the light absorber 20 may be fixed to a configuration other than the Y-axis galvano scanner 3 and extended from the portion fixed to the configuration to the surface of the Y-axis galvano scanner 3. Thereby, the laser processing apparatus can reduce the malfunction caused by the temperature rise of the Y-axis galvano scanner 3.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

This laser machining apparatus has: a laser light source (1); a first galvano-mirror (5) that reflects laser light (14) transmitted from the laser light source; a second galvano-mirror (6) that reflects laser light transmitted from the first galvano-mirror; a first galvano-scanner (3) that drives the first galvano-mirror; a second galvano-scanner (4) that drives the second galvano-mirror; a temperature detector (10) that detects the temperature of a subject the temperature of which is to be detected, said subject being the first galvano-mirror or the second galvano-mirror; a control unit (13) that controls drive of the subject corresponding to detection results obtained from the temperature detector, thereby adjusting laser light input position of a subject to be machined; and a light-absorbing body (11) that absorbs light at positions outside of the optical path of the laser light, said optical path extending from the laser light source to the subject to be machined (8). The light-absorbing body is provided on a first galvano-scanner surface and/or a second galvano-scanner surface.

Description

レーザ加工装置Laser processing equipment
　本発明は、レーザ加工装置に関する。 The present invention relates to a laser processing apparatus.
　ガルバノスキャナを備えるレーザ加工装置は、例えば、プリント配線基板、精密電子部品の穴開け加工に利用されている。製品となる電子回路、電子部品の精細化が進められるにしたがい、レーザ加工装置は、加工位置の高精度な制御が要求されている。 Laser processing devices equipped with galvano scanners are used for, for example, drilling printed circuit boards and precision electronic components. As the electronic circuits and electronic parts that are products are being refined, the laser processing apparatus is required to control the processing position with high accuracy.
　レーザ光を偏向させるガルバノミラーは、入射するレーザ光のエネルギーの一部が吸収され温度が上昇することで、変形する場合がある。ガルバノミラーの変形が顕著となることで、レーザ加工装置は、加工位置の精度が劣化する場合がある。ガルバノミラーの温度変化による加工位置のずれを補正するために、従来、ガルバノミラーの温度と加工位置のずれ量との関係をあらかじめ求めておき、その関係と、レーザ加工時におけるガルバノミラーの温度の測定結果とを基に、加工位置を補正する技術が提案されている（例えば、特許文献１参照）。 The galvanometer mirror that deflects the laser beam may be deformed when a part of the energy of the incident laser beam is absorbed and the temperature rises. As the deformation of the galvanometer mirror becomes significant, the laser processing apparatus may deteriorate the accuracy of the processing position. Conventionally, in order to correct the deviation of the processing position due to the temperature change of the galvanometer mirror, the relationship between the temperature of the galvanometer mirror and the amount of deviation of the processing position has been obtained in advance, and the relationship between the temperature of the galvanometer mirror during laser processing and A technique for correcting the machining position based on the measurement result has been proposed (see, for example, Patent Document 1).
特許第４３２０５２４号公報Japanese Patent No. 4320524
　加工中において、加工対象物は、加工位置の状態、あるいは加工条件によっては、加工位置からのレーザ光の反射光、および加工現象に由来する輻射光を、加工位置から放射させることがある。レーザ加工において加工対象物から放射されるこのような２次光線の一部は、加工のためのレーザ光とは逆の向きへ辿り、ガルバノミラーの温度を検出する温度検出器に到達することがある。温度検出器に２次光線が到達することで、温度検出器は、正確な温度検出が困難となる場合がある。この場合、レーザ加工装置は、加工位置の正確な補正がなされず、加工位置の高精度な制御が困難となる。 During processing, depending on the state of the processing position or processing conditions, the processing object may radiate reflected light of the laser beam from the processing position and radiation light derived from the processing phenomenon from the processing position. A part of such secondary light beam radiated from the object to be processed in laser processing may travel in the opposite direction to the laser light for processing and reach a temperature detector that detects the temperature of the galvanometer mirror. is there. When the secondary light beam reaches the temperature detector, it may be difficult for the temperature detector to accurately detect the temperature. In this case, the laser processing apparatus does not correct the processing position accurately, and it is difficult to control the processing position with high accuracy.
　本発明は、上記に鑑みてなされたものであって、加工位置の高精度な制御を可能とするレーザ加工装置を得ることを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus that enables highly accurate control of a processing position.
　上述した課題を解決し、目的を達成するために、本発明は、レーザ光源と、前記レーザ光源からのレーザ光を反射する第１ガルバノミラーと、前記第１ガルバノミラーからの前記レーザ光を反射する第２ガルバノミラーと、前記第１ガルバノミラーを駆動する第１ガルバノスキャナと、前記第２ガルバノミラーを駆動する第２ガルバノスキャナと、前記第１ガルバノミラーまたは前記第２ガルバノミラーである温度検出対象の温度を検出する温度検出器と、前記温度検出器での検出結果に応じて前記温度検出対象の駆動を制御することで、加工対象物における前記レーザ光の入射位置を調整する制御部と、前記レーザ光源から前記加工対象物までの前記レーザ光の光路以外の位置にて光を吸収する光吸収体と、を有し、前記光吸収体は、前記第１ガルバノスキャナおよび前記第２ガルバノスキャナの少なくとも一方の表面に設けられていることを特徴とする。 In order to solve the above-described problems and achieve the object, the present invention includes a laser light source, a first galvanometer mirror that reflects the laser light from the laser light source, and the laser light from the first galvanometer mirror. The second galvanometer mirror, the first galvanometer scanner that drives the first galvanometer mirror, the second galvanometer scanner that drives the second galvanometer mirror, and the temperature detection that is the first galvanometer mirror or the second galvanometer mirror A temperature detector for detecting the temperature of the object, and a control unit for adjusting the incident position of the laser beam on the object to be processed by controlling the drive of the temperature detection object according to the detection result of the temperature detector; A light absorber that absorbs light at a position other than the optical path of the laser light from the laser light source to the workpiece, and the light absorber Characterized in that provided on at least one surface of the first optical scanner and the second galvano scanner.
　本発明にかかるレーザ加工装置は、加工のためのレーザ光とは逆の向きへ辿って第１ガルバノスキャナまたは第２ガルバノスキャナへ入射する２次光線を、光吸収体にて吸収する。光吸収体が設けられた位置にて光の反射および散乱を抑制させることで、温度検出器の方向へ進行する光成分を低減させる。温度検出器へ進行する光成分を低減させて、温度検出器での正確な温度測定が可能となることで、レーザ加工装置は、加工位置の正確な補正が可能となる。これにより、レーザ加工装置は、加工位置の高精度な制御ができるという効果を奏する。 The laser processing apparatus according to the present invention absorbs a secondary light beam incident on the first galvano scanner or the second galvano scanner following the direction opposite to the laser beam for processing by the light absorber. By suppressing the reflection and scattering of light at the position where the light absorber is provided, the light component traveling toward the temperature detector is reduced. By reducing the light component that travels to the temperature detector and enabling accurate temperature measurement with the temperature detector, the laser processing apparatus can accurately correct the processing position. Thereby, the laser processing apparatus has an effect that the processing position can be controlled with high accuracy.
図１は、本発明の実施の形態１にかかるレーザ加工装置を示す図である。FIG. 1 is a diagram showing a laser processing apparatus according to Embodiment 1 of the present invention. 図２は、加工位置からの２次光線の進行について説明する図である。FIG. 2 is a diagram for explaining the progress of secondary light from the processing position. 図３は、本発明の実施の形態２にかかるレーザ加工装置を示す図である。FIG. 3 is a diagram showing a laser processing apparatus according to the second embodiment of the present invention.
　以下に、本発明にかかるレーザ加工装置の実施の形態を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。 Hereinafter, an embodiment of a laser processing apparatus according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.
実施の形態１．
　図１は、本発明の実施の形態１にかかるレーザ加工装置を示す図である。レーザ加工装置は、レーザ光（パルスレーザ光）の照射によって加工対象物に微細穴を穴開け加工する装置である。レーザ加工装置は、例えば、加工対象物に設定された複数の加工位置を順次走査し、各加工位置に対するレーザ照射を複数サイクルで行なう加工処理（サイクルパルスモード）を実施する。 Embodiment 1 FIG.
FIG. 1 is a diagram showing a laser processing apparatus according to Embodiment 1 of the present invention. The laser processing apparatus is an apparatus that forms a fine hole in a processing object by irradiation with laser light (pulse laser light). For example, the laser processing apparatus sequentially scans a plurality of processing positions set on a processing object, and performs processing (cycle pulse mode) in which laser irradiation is performed on each processing position in a plurality of cycles.
　レーザ加工装置は、レーザ発振器１、ベンドミラー２、Ｙ軸ガルバノスキャナ３、Ｘ軸ガルバノスキャナ４、ガルバノミラー５，６、ｆθレンズ７、温度検出器１０、光吸収体１１、ガルバノドライバ１２および制御装置１３を有する。 The laser processing apparatus includes a laser oscillator 1, a bend mirror 2, a Y-axis galvano scanner 3, an X-axis galvano scanner 4, a galvano mirror 5, 6, an fθ lens 7, a temperature detector 10, a light absorber 11, a galvano driver 12, and a control. It has a device 13.
　加工対象物であるワーク８は、例えばプリント基板である。ワーク８は、ＸＹテーブル（図示省略）に載置されている。ＸＹテーブルは、Ｘ軸方向およびＹ軸方向を含む二次元方向へワーク８を移動させる。 The workpiece 8 that is the object to be processed is, for example, a printed board. The workpiece 8 is placed on an XY table (not shown). The XY table moves the workpiece 8 in a two-dimensional direction including the X-axis direction and the Y-axis direction.
　レーザ光源であるレーザ発振器１は、レーザ光１４を射出する。レーザ光１４は、パルス状に出力されるレーザビームである。プリント基板の加工には、レーザビームとして、例えば、９～１０μｍの波長の赤外光、０．５μｍの波長の紫外光などのいずれかが用いられる。ベンドミラー２は、レーザ発振器１からのレーザ光１４を反射して、ガルバノミラー５へ進行させる。 The laser oscillator 1 which is a laser light source emits a laser beam 14. The laser beam 14 is a laser beam output in a pulse shape. For processing the printed circuit board, for example, any one of infrared light having a wavelength of 9 to 10 μm, ultraviolet light having a wavelength of 0.5 μm, and the like is used as a laser beam. The bend mirror 2 reflects the laser beam 14 from the laser oscillator 1 and advances it to the galvanometer mirror 5.
　第１ガルバノミラーであるガルバノミラー５は、レーザ発振器１からのレーザ光１４を反射する。第１ガルバノスキャナであるＹ軸ガルバノスキャナ３は、ガルバノミラー５を駆動する。第２ガルバノミラーであるガルバノミラー６は、ガルバノミラー５からのレーザ光１４を反射する。第２ガルバノスキャナであるＸ軸ガルバノスキャナ４は、ガルバノミラー６を駆動する。 The galvanometer mirror 5 as the first galvanometer mirror reflects the laser beam 14 from the laser oscillator 1. A Y-axis galvano scanner 3 as a first galvano scanner drives a galvanometer mirror 5. The galvanometer mirror 6 that is the second galvanometer mirror reflects the laser beam 14 from the galvanometer mirror 5. The X-axis galvano scanner 4 as the second galvano scanner drives the galvano mirror 6.
　Ｙ軸ガルバノスキャナ３は、ガルバノミラー５を支持する回転軸を往復回転させる。Ｙ軸ガルバノスキャナ３は、ワーク８におけるレーザ光１４の照射位置をＹ軸方向において走査させる。Ｘ軸ガルバノスキャナ４は、ガルバノミラー６を支持する回転軸を往復回転させる。Ｘ軸ガルバノスキャナ４は、ワーク８におけるレーザ光１４の照射位置をＸ軸方向において走査させる。 The Y-axis galvano scanner 3 reciprocates the rotation shaft that supports the galvanometer mirror 5. The Y-axis galvano scanner 3 scans the irradiation position of the laser beam 14 on the workpiece 8 in the Y-axis direction. The X-axis galvano scanner 4 reciprocally rotates a rotation shaft that supports the galvanometer mirror 6. The X-axis galvano scanner 4 scans the irradiation position of the laser beam 14 on the workpiece 8 in the X-axis direction.
　ｆθレンズ７は、ガルバノミラー６からのレーザ光１４を、ワーク８の加工表面に対して垂直なレーザ光１５とする。ｆθレンズ７は、ワーク８内の加工位置９にレーザ光１５を集光させる。ガルバノドライバ１２は、Ｙ軸ガルバノスキャナ３およびＸ軸ガルバノスキャナ４を駆動する。 The fθ lens 7 changes the laser light 14 from the galvanometer mirror 6 into a laser light 15 perpendicular to the processed surface of the workpiece 8. The fθ lens 7 condenses the laser light 15 at the processing position 9 in the work 8. The galvano driver 12 drives the Y-axis galvano scanner 3 and the X-axis galvano scanner 4.
　制御部である制御装置１３は、レーザ加工装置の全体の動作を制御する。制御装置１３は、レーザ発振器１のレーザ光１４の発振、ガルバノドライバ１２によるＹ軸ガルバノスキャナ３およびＸ軸ガルバノスキャナ４の駆動を制御する。また、制御装置１３は、ＸＹテーブルを駆動するモータ（図示省略）を制御する。 The control device 13 as a control unit controls the overall operation of the laser processing apparatus. The control device 13 controls the oscillation of the laser beam 14 of the laser oscillator 1 and the driving of the Y-axis galvano scanner 3 and the X-axis galvano scanner 4 by the galvano driver 12. The control device 13 controls a motor (not shown) that drives the XY table.
　温度検出器１０は、温度検出対象であるガルバノミラー６の温度を検出する。温度検出器１０は、ガルバノミラー６とは非接触とされた状態で、ガルバノミラー６の温度を検出する非接触温度検出器である。温度検出器１０は、例えば、放射温度計である。温度検出器１０は、ガルバノミラー６の裏面に対向する位置に配置されている。裏面は、ガルバノミラー６のうちレーザ光１４を反射する反射面とは反対側の面とする。 The temperature detector 10 detects the temperature of the galvanometer mirror 6 that is a temperature detection target. The temperature detector 10 is a non-contact temperature detector that detects the temperature of the galvanometer mirror 6 in a non-contact state with the galvanometer mirror 6. The temperature detector 10 is, for example, a radiation thermometer. The temperature detector 10 is disposed at a position facing the back surface of the galvanometer mirror 6. The back surface is the surface of the galvanometer mirror 6 opposite to the reflecting surface that reflects the laser beam 14.
　制御装置１３は、温度検出器１０での検出結果に応じて、温度検出対象であるガルバノミラー６の駆動を制御する。制御装置１３は、ガルバノミラー６の駆動を制御することで、ワーク８におけるレーザ光１５の入射位置である加工位置９を調整する。制御装置１３は、ガルバノミラー６の温度と加工位置のずれ量との関係をあらかじめ保持する。制御装置１３は、その関係と、温度検出器１０での検出結果とを基に、加工位置９を補正する。 The control device 13 controls the driving of the galvanometer mirror 6 that is a temperature detection target according to the detection result of the temperature detector 10. The control device 13 adjusts the machining position 9 that is the incident position of the laser beam 15 on the workpiece 8 by controlling the driving of the galvanometer mirror 6. The control device 13 holds in advance the relationship between the temperature of the galvano mirror 6 and the amount of processing position deviation. The control device 13 corrects the machining position 9 based on the relationship and the detection result of the temperature detector 10.
　レーザ加工装置は、レーザ発振器１からワーク８までのレーザ光１４の光路以外の位置にて光を吸収する光吸収体１１を備える。光吸収体１１は、Ｙ軸ガルバノスキャナ３およびＸ軸ガルバノスキャナ４の少なくとも一方の表面に設けられている。実施の形態１では、光吸収体１１は、黒体シールとする。光吸収体１１である黒体シールは、Ｙ軸ガルバノスキャナ３のうち、ガルバノミラー５の側に向けられた端面の一部に貼り付けられている。端面は、Ｙ軸ガルバノスキャナ３のフレームケースの端面とする。 The laser processing apparatus includes a light absorber 11 that absorbs light at a position other than the optical path of the laser light 14 from the laser oscillator 1 to the workpiece 8. The light absorber 11 is provided on at least one surface of the Y-axis galvano scanner 3 and the X-axis galvano scanner 4. In the first embodiment, the light absorber 11 is a black body seal. The black body seal which is the light absorber 11 is affixed to a part of the end surface of the Y-axis galvano scanner 3 facing the galvanometer mirror 5 side. The end surface is the end surface of the frame case of the Y-axis galvano scanner 3.
　図２は、加工位置からの２次光線の進行について説明する図である。レーザ加工装置の加工対象物は、加工位置９の状態、あるいは加工条件によっては、加工位置９からのレーザ光１５の反射光を生じさせることがある。例えば、プリント基板の銅層表面にレーザ光１５が照射しているとき、レーザ光１５の反射光が生じ易くなる。また、加工対象物は、加工現象に由来する輻射光を加工位置９から放射させることがある。これらの加工位置９からの反射光および輻射光を、２次光線１６とする。 FIG. 2 is a diagram for explaining the progress of the secondary light beam from the processing position. The processing object of the laser processing apparatus may generate reflected light of the laser beam 15 from the processing position 9 depending on the state of the processing position 9 or processing conditions. For example, when the laser beam 15 is irradiated on the surface of the copper layer of the printed board, the reflected light of the laser beam 15 is easily generated. Further, the workpiece may radiate radiation light derived from the machining phenomenon from the machining position 9. The reflected light and radiant light from these processing positions 9 are referred to as secondary light 16.
　レーザ加工においてワーク８から放射する２次光線１６は、加工位置９の表面の状態および加工状態などにもよるが、加工位置９からさまざまな方角に放射する。加工位置９にて生じた２次光線１６の一部は、レーザ光１５とは逆の向きへ辿り、ｆθレンズ７を経てガルバノミラー６へ到達することがある。ガルバノミラー６の表面で反射した２次光線１６は、さらに、ガルバノミラー６の裏面側へ進行して、温度検出器１０に到達することがある。 The secondary light beam 16 radiated from the workpiece 8 in the laser machining is radiated from the machining position 9 in various directions depending on the surface state and the machining state of the machining position 9. A part of the secondary light beam 16 generated at the processing position 9 traces in the direction opposite to the laser beam 15 and may reach the galvanometer mirror 6 through the fθ lens 7. The secondary light beam 16 reflected from the surface of the galvanometer mirror 6 may further travel to the back side of the galvanometer mirror 6 and reach the temperature detector 10.
　２次光線１６が入射したときに、温度検出器１０は、ガルバノミラー６から検出される温度に比べて著しく高い温度を検出することがある。温度検出器１０は、２次光線１６が入射することで、ガルバノミラー６の正確な温度を検出することが困難となる。レーザ加工装置は、温度検出器１０での正確な温度検出が困難となることで、加工位置９の補正に誤りを生じさせることになる。 When the secondary light beam 16 is incident, the temperature detector 10 may detect a temperature significantly higher than the temperature detected from the galvanometer mirror 6. It becomes difficult for the temperature detector 10 to detect the accurate temperature of the galvanometer mirror 6 by the incidence of the secondary light beam 16. The laser processing apparatus makes it difficult to accurately detect the temperature with the temperature detector 10, thereby causing an error in the correction of the processing position 9.
　例えば、シュテファンボルツマンの法則を利用した放射温度計である温度検出器１０は、温度検出対象からの輻射光以外の赤外光あるいは可視光が混入することで、温度測定に誤差が生じることがある。温度検出器１０は、温度検出対象以外からの光線の混入を避けるために、管内にセンサ部を内蔵している。温度検出対象であるガルバノミラー６に対し、温度検出器１０は、回転駆動するガルバノミラー６との干渉を防止するために、管の先端とガルバノミラー６の裏面との間に数ｍｍ程度の空間を設けて配置されている。かかる空間から２次光線１６の散乱光あるいは反射光が混入することで、温度検出器１０は、温度測定に誤差が生じることがある。 For example, the temperature detector 10, which is a radiation thermometer using Stefan-Boltzmann's law, may cause an error in temperature measurement when infrared light or visible light other than the radiation light from the temperature detection target is mixed. . The temperature detector 10 incorporates a sensor unit in the tube in order to avoid mixing light rays from other than the temperature detection target. The temperature detector 10 has a space of about several millimeters between the tip of the tube and the back surface of the galvanometer mirror 6 in order to prevent interference with the galvanometer mirror 6 that is rotationally driven with respect to the galvanometer mirror 6 that is a temperature detection target. Is arranged. When the scattered light or reflected light of the secondary light beam 16 is mixed from the space, the temperature detector 10 may cause an error in temperature measurement.
　光吸収体１１は、ガルバノスキャナ３の端面のうち、加工位置９からの２次光線１６を温度検出器１０に向けて反射させるような部分に設けられている。光吸収体１１は、ガルバノスキャナ３の端面から温度検出器１０へ向かう２次光線１６をカットする。温度検出器１０へ進行する２次光線１６が低減することで、温度検出器１０は、正確な温度検出が可能となる。 The light absorber 11 is provided in a portion of the end face of the galvano scanner 3 that reflects the secondary light beam 16 from the processing position 9 toward the temperature detector 10. The light absorber 11 cuts the secondary light beam 16 from the end face of the galvano scanner 3 toward the temperature detector 10. Since the secondary light beam 16 traveling to the temperature detector 10 is reduced, the temperature detector 10 can accurately detect the temperature.
　レーザ加工装置は、温度検出器１０での正確な温度検出が可能となることで、加工位置９の正確な補正が可能となる。これにより、レーザ加工装置は、加工位置９の高精度な制御ができるという効果を奏する。 The laser machining apparatus can accurately correct the machining position 9 by enabling accurate temperature detection by the temperature detector 10. Thereby, the laser processing apparatus has an effect that the processing position 9 can be controlled with high accuracy.
　レーザ加工装置は、従来の構成に光吸収体１１を追加することで、２次光線１６を低減可能な構成を容易に実現できる。光吸収体１１は、レーザ加工装置に対し後付けされるものとしても良い。 The laser processing apparatus can easily realize a configuration capable of reducing the secondary light beam 16 by adding the light absorber 11 to the conventional configuration. The light absorber 11 may be retrofitted to the laser processing apparatus.
　光吸収体１１は、Ｙ軸ガルバノスキャナ３の端面の一部に設けられたものである場合に限られない。光吸収体１１は、Ｙ軸ガルバノスキャナ３の端面の全体に設けられていても良い。光吸収体１１は、Ｙ軸ガルバノスキャナ３の端面以外の面の一部あるいは全体に設けられていても良い。 The light absorber 11 is not limited to being provided on a part of the end face of the Y-axis galvano scanner 3. The light absorber 11 may be provided on the entire end surface of the Y-axis galvano scanner 3. The light absorber 11 may be provided on a part or the whole of the surface other than the end surface of the Y-axis galvano scanner 3.
　光吸収体１１は、他方のＸ軸ガルバノスキャナ４の表面に貼り付けられていても良い。レーザ加工装置は、温度検出器１０、ガルバノミラー５，６の配置の態様に応じて、ガルバノスキャナ３，４の表面のうちいずれの位置に光吸収体１１を設けることとしても良い。光吸収体１１は、Ｙ軸ガルバノスキャナ３およびＸ軸ガルバノスキャナ４の双方に設けられていても良い。ガルバノスキャナ３，４の表面のうち光吸収体１１が設けられる範囲は、任意であるものとする。 The light absorber 11 may be attached to the surface of the other X-axis galvano scanner 4. In the laser processing apparatus, the light absorber 11 may be provided at any position on the surface of the galvano scanners 3 and 4 according to the arrangement of the temperature detector 10 and the galvanometer mirrors 5 and 6. The light absorber 11 may be provided in both the Y-axis galvano scanner 3 and the X-axis galvano scanner 4. The range in which the light absorber 11 is provided on the surface of the galvano scanners 3 and 4 is arbitrary.
　温度検出器１０の温度検出対象は、他方のガルバノミラー５であっても良い。この場合、温度検出器１０は、ガルバノミラー５の裏面に対向する位置に配置される。レーザ加工装置は、温度検出対象がガルバノミラー５およびガルバノミラー６のいずれであるかに応じて、光吸収体１１を設ける位置および範囲を適宜変更しても良い。 The temperature detection target of the temperature detector 10 may be the other galvanometer mirror 5. In this case, the temperature detector 10 is disposed at a position facing the back surface of the galvanometer mirror 5. The laser processing apparatus may appropriately change the position and range in which the light absorber 11 is provided depending on whether the temperature detection target is the galvano mirror 5 or the galvano mirror 6.
　ガルバノスキャナ３，４は、高速駆動が要請されるにしたがい、トルク定数の上昇、駆動電流の増加が必要とされている。電流の増加に対する耐性の確保のためにコイル線径が増大するにしたがい、フレームケースが大型となることで、ガルバノスキャナ３，４の端面の面積は増大する傾向にある。ガルバノスキャナ３，４の端面が大きくなるほど、端面での２次光線１６の反射および散乱の影響も大きくなる。ガルバノスキャナ３，４の端面に光吸収体１１を設けることで、２次光線１６の反射および散乱による温度検出器１０への影響を効果的に抑制できる。 The galvano scanners 3 and 4 are required to have an increased torque constant and an increased driving current in response to a request for high-speed driving. As the coil wire diameter increases to ensure resistance to an increase in current, the area of the end faces of the galvano scanners 3 and 4 tends to increase as the frame case becomes larger. As the end faces of the galvano scanners 3 and 4 become larger, the influence of the reflection and scattering of the secondary light beam 16 on the end faces becomes larger. By providing the light absorber 11 on the end faces of the galvano scanners 3 and 4, the influence on the temperature detector 10 due to the reflection and scattering of the secondary light beam 16 can be effectively suppressed.
　光吸収体１１は、加工位置９からの反射光と、それとは異なる波長域の輻射光を効果的に低減可能とするため、レーザ光１４の波長域に対し広い波長域の光に対する吸収特性を備えるものとする。光吸収体１１として黒色部材を使用することで、赤外光、紫外光および可視光を含む広い波長域の光を低減できる。光吸収体１１は、黒体シール以外の、いずれの黒色部材としても良い。光吸収体１１は、例えば、ガルバノスキャナ３，４の表面に黒色顔料を塗装したものであっても良い。 Since the light absorber 11 can effectively reduce the reflected light from the processing position 9 and the radiation light in a wavelength region different from the reflected light, the light absorber 11 has an absorption characteristic for light in a wider wavelength region than the wavelength region of the laser light 14. Shall be provided. By using a black member as the light absorber 11, light in a wide wavelength range including infrared light, ultraviolet light, and visible light can be reduced. The light absorber 11 may be any black member other than the black body seal. For example, the light absorber 11 may be a galvano scanner 3 or 4 having a black pigment coated on the surface thereof.
実施の形態２．
　図３は、本発明の実施の形態２にかかるレーザ加工装置を示す図である。実施の形態１と同一の部分には同一の符号を付し、重複する説明を適宜省略する。 Embodiment 2. FIG.
FIG. 3 is a diagram showing a laser processing apparatus according to the second embodiment of the present invention. The same parts as those in the first embodiment are denoted by the same reference numerals, and repeated description will be omitted as appropriate.
　レーザ加工装置は、レーザ発振器１からワーク８までのレーザ光１４の光路以外の位置にて光を吸収する光吸収体２０を備える。光吸収体２０は、例えば、黒体シールが貼られた帯状部材とする。光吸収体２０の一方の端部側部分は、Ｙ軸ガルバノスキャナ３のうち、ガルバノミラー５の側に向けられた端面の一部を覆う。 The laser processing apparatus includes a light absorber 20 that absorbs light at a position other than the optical path of the laser light 14 from the laser oscillator 1 to the workpiece 8. The light absorber 20 is, for example, a belt-like member with a black body sticker. One end side portion of the light absorber 20 covers a part of the end surface of the Y-axis galvano scanner 3 directed toward the galvano mirror 5 side.
　光吸収体２０は、Ｙ軸ガルバノスキャナ３の端面のうち、加工位置９からの２次光線１６を温度検出器１０に向けて反射させるような部分を覆う。光吸収体２０は、Ｙ軸ガルバノスキャナ３の端面とは接触していない。光吸収体２０とＹ軸ガルバノスキャナ３の端面との間に、隙間が形成されている。 The light absorber 20 covers a portion of the end face of the Y-axis galvano scanner 3 that reflects the secondary light beam 16 from the processing position 9 toward the temperature detector 10. The light absorber 20 is not in contact with the end surface of the Y-axis galvano scanner 3. A gap is formed between the light absorber 20 and the end surface of the Y-axis galvano scanner 3.
　光吸収体２０のうちＹ軸ガルバノスキャナ３側とは反対の端部側部分は、Ｘ軸ガルバノスキャナ４の端面に固定されている。光吸収体２０は、Ｘ軸ガルバノスキャナ４に固定された部分から、Ｙ軸ガルバノスキャナ３の表面にまで延伸させた形状を備える。光吸収体２０は、ガルバノスキャナ３，４の配置の態様に応じて、適宜折り曲げられている。 The end of the light absorber 20 opposite to the Y-axis galvano scanner 3 side is fixed to the end surface of the X-axis galvano scanner 4. The light absorber 20 has a shape that extends from a portion fixed to the X-axis galvano scanner 4 to the surface of the Y-axis galvano scanner 3. The light absorber 20 is appropriately bent according to the arrangement of the galvano scanners 3 and 4.
　光吸収体２０は、２次光線１６を吸収することで、温度が上昇することとなる。光吸収体２０は、Ｙ軸ガルバノスキャナ３の表面から浮かせた配置とすることで、光吸収体２０からＹ軸ガルバノスキャナ３への伝熱を抑制させる。これにより、レーザ加工装置は、Ｙ軸ガルバノスキャナ３の温度上昇による不具合を低減できる。 The light absorber 20 absorbs the secondary light beam 16 to increase the temperature. The light absorber 20 is arranged so as to float from the surface of the Y-axis galvano scanner 3, thereby suppressing heat transfer from the light absorber 20 to the Y-axis galvano scanner 3. Thereby, the laser processing apparatus can reduce the malfunction caused by the temperature rise of the Y-axis galvano scanner 3.
　光吸収体２０は、自然対流を利用して熱を周囲へ放散させることで、Ｘ軸ガルバノスキャナ４との固定部分への熱の伝播を抑制させる。これにより、レーザ加工装置は、Ｘ軸ガルバノスキャナ４の温度上昇による不具合を低減できる。 The light absorber 20 uses natural convection to dissipate heat to the surroundings, thereby suppressing heat propagation to the fixed part with the X-axis galvano scanner 4. Thereby, the laser processing apparatus can reduce problems caused by the temperature rise of the X-axis galvano scanner 4.
　実施の形態２においても、レーザ加工装置は、温度検出器１０での正確な温度検出が可能となることで、加工位置９の正確な補正が可能となる。これにより、レーザ加工装置は、加工位置９の高精度な制御ができるという効果を奏する。 Also in the second embodiment, the laser processing apparatus can accurately detect the processing position 9 by enabling accurate temperature detection by the temperature detector 10. Thereby, the laser processing apparatus has an effect that the processing position 9 can be controlled with high accuracy.
　レーザ加工装置は、従来の構成に光吸収体２０を追加することで、２次光線１６を低減可能な構成を容易に実現できる。光吸収体２０は、レーザ加工装置に対し後付けされるものとしても良い。 The laser processing apparatus can easily realize a configuration capable of reducing the secondary light beam 16 by adding the light absorber 20 to the conventional configuration. The light absorber 20 may be retrofitted to the laser processing apparatus.
　光吸収体２０は、Ｘ軸ガルバノスキャナ４以外のいずれの構成に固定されたものであっても良い。光吸収体２０は、Ｙ軸ガルバノスキャナ３以外の構成に固定され、当該構成に固定された部分からＹ軸ガルバノスキャナ３の表面にまで延伸させたものであれば良い。これにより、レーザ加工装置は、Ｙ軸ガルバノスキャナ３の温度上昇による不具合を低減できる。 The light absorber 20 may be fixed to any configuration other than the X-axis galvano scanner 4. The light absorber 20 may be fixed to a configuration other than the Y-axis galvano scanner 3 and extended from the portion fixed to the configuration to the surface of the Y-axis galvano scanner 3. Thereby, the laser processing apparatus can reduce the malfunction caused by the temperature rise of the Y-axis galvano scanner 3.
　１　レーザ発振器、２　ベンドミラー、３　Ｙ軸ガルバノスキャナ、４　Ｘ軸ガルバノスキャナ、５　ガルバノミラー、６　ガルバノミラー、７　ｆθレンズ、８　ワーク、９　加工位置、１０　温度検出器、１１　光吸収体、１２　ガルバノドライバ、１３　制御装置、１４，１５　レーザ光、１６　２次光線、２０　光吸収体。 1 laser oscillator, 2 bend mirror, 3 Y-axis galvano scanner, 4 X-axis galvano scanner, 5 galvano mirror, 6 galvano mirror, 7 fθ lens, 8 work, 9 processing position, 10 temperature detector, 11 light absorber, 12 Galvano driver, 13 control device, 14, 15 laser light, 16 secondary light, 20 light absorber.

Claims (7)

  1. 　レーザ光源と、
    　前記レーザ光源からのレーザ光を反射する第１ガルバノミラーと、
    　前記第１ガルバノミラーからの前記レーザ光を反射する第２ガルバノミラーと、
    　前記第１ガルバノミラーを駆動する第１ガルバノスキャナと、
    　前記第２ガルバノミラーを駆動する第２ガルバノスキャナと、
    　前記第１ガルバノミラーまたは前記第２ガルバノミラーである温度検出対象の温度を検出する温度検出器と、
    　前記温度検出器での検出結果に応じて前記温度検出対象の駆動を制御することで、加工対象物における前記レーザ光の入射位置を調整する制御部と、
    　前記レーザ光源から前記加工対象物までの前記レーザ光の光路以外の位置にて光を吸収する光吸収体と、を有し、
    　前記光吸収体は、前記第１ガルバノスキャナおよび前記第２ガルバノスキャナの少なくとも一方の表面に設けられていることを特徴とするレーザ加工装置。     A laser light source;
    A first galvanometer mirror that reflects laser light from the laser light source;
    A second galvanometer mirror that reflects the laser light from the first galvanometer mirror;
    A first galvano scanner for driving the first galvanometer mirror;
    A second galvano scanner for driving the second galvanometer mirror;
    A temperature detector for detecting a temperature of a temperature detection target that is the first galvanometer mirror or the second galvanometer mirror;
    A control unit that adjusts the incident position of the laser beam on the workpiece by controlling the driving of the temperature detection target according to the detection result of the temperature detector;
    A light absorber that absorbs light at a position other than the optical path of the laser light from the laser light source to the workpiece,
    The laser processing apparatus, wherein the light absorber is provided on at least one surface of the first galvano scanner and the second galvano scanner.
  2. 　前記温度検出対象は前記第２ガルバノミラーであって、
    　前記温度検出器は、前記第２ガルバノミラーのうち前記レーザ光を反射する反射面とは反対側の面に対向する位置に配置され、
    　前記光吸収体は、前記第１ガルバノスキャナの表面に設けられていることを特徴とする請求項１に記載のレーザ加工装置。     The temperature detection target is the second galvanometer mirror,
    The temperature detector is disposed at a position facing a surface of the second galvanometer mirror opposite to a reflection surface that reflects the laser light,
    The laser processing apparatus according to claim 1, wherein the light absorber is provided on a surface of the first galvano scanner.
  3. 　前記光吸収体は、前記第１ガルバノスキャナのうち、前記第１ガルバノミラーの側に向けられた端面の少なくとも一部を覆うことを特徴とする請求項２に記載のレーザ加工装置。 3. The laser processing apparatus according to claim 2, wherein the light absorber covers at least a part of an end surface of the first galvano scanner facing the first galvanometer mirror.
  4. 　前記光吸収体は、前記第１ガルバノスキャナおよび前記第２ガルバノスキャナの少なくとも一方の表面に貼り付けられていることを特徴とする請求項１に記載のレーザ加工装置。 The laser processing apparatus according to claim 1, wherein the light absorber is affixed to at least one surface of the first galvano scanner and the second galvano scanner.
  5. 　前記光吸収体は、前記第１ガルバノスキャナ以外の構成に固定され、前記構成に固定された部分から前記第１ガルバノスキャナの表面にまで延伸させた形状を備えることを特徴とする請求項２または３に記載のレーザ加工装置。 The said light absorber is equipped with the shape extended to the surface of the said 1st galvano scanner from the part fixed to the structure other than the said 1st galvano scanner, and being fixed to the said structure. 3. The laser processing apparatus according to 3.
  6. 　前記光吸収体は、前記第２ガルバノスキャナに固定されていることを特徴とする請求項５に記載のレーザ加工装置。 The laser processing apparatus according to claim 5, wherein the light absorber is fixed to the second galvano scanner.
  7. 　前記光吸収体は、黒体シールであることを特徴とする請求項４に記載のレーザ加工装置。 The laser processing apparatus according to claim 4, wherein the light absorber is a black body seal.
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CN110487180A (en) * 2019-08-12 2019-11-22 上海理工大学 A kind of thermal drift measurement method for scanning galvanometer formula laser-processing system

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* Cited by examiner, † Cited by third party
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CN110487180A (en) * 2019-08-12 2019-11-22 上海理工大学 A kind of thermal drift measurement method for scanning galvanometer formula laser-processing system
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