JP2003244508A - Solid-state image pickup device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a joint portion from peeling and a circuit pattern on a flexible print board from separating in spite of sharp bending of the flexible print board at the joint portion between a circuit board for a camera and the flexible print board. <P>SOLUTION: A camera unit, including a solid-state image pickup device, is connected to one surface side of the circuit board 1 for a camera. The joint portion 4a, provided on the surface side of the flexible print board 4, is connected to the back surface side of the circuit board 1 for the camera. A reinforcement member 6 is provided on the back surface side of the flexible print board 4, in combination with the joint portion 4a of the circuit board 1 for the camera. An end portion 6a of the reinforcement member 6 is located at the portion more projected than a line (a), indicating an end portion of the circuit board 1 for the camera. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device for picking up an image using a solid-state image pickup device.

[0002]

2. Description of the Related Art In a conventional apparatus of this type, as shown in FIG. 6, a solid-state image sensor is connected to the surface of a camera circuit board 1 and a camera unit 2 is mounted at a position where an image can be captured by the solid-state image sensor. There is. I for driving a solid-state image sensor
C3 is connected to the back surface of the camera circuit board 1 via bump electrodes (not shown). Circuit patterns for driving the solid-state imaging device are provided on the front surface or both front and back surfaces of the camera circuit board 1, and circuit elements (not shown) are connected to predetermined positions. A flexible printed circuit board (FPC) 4 is used to connect the circuit pattern to the board on the main body side, and a connection pattern for connection with the FPC 4 is provided on the back surface of the end portion of the camera circuit board 1. Since the FPC 4 is used by being bent, the connecting portion between the camera circuit board 1 and the FPC 4 may be separated during this bending, so that the connecting portion may extend over the camera circuit board 1 and the FPC 4. Reinforcement tape 5 was attached.

[0003]

As described above, conventionally, the reinforcing tape 5 is attached to prevent peeling, but this structure is also insufficient, and the connecting portion peels,
At this connection, the FPC4 bends at an acute angle and the FPC4
There is a problem that the upper circuit pattern is broken.

Therefore, the present invention is intended to stabilize the quality by preventing the connection portion from being peeled off and the circuit pattern of the FPC 4 from being broken due to an acute bend of the FPC 4.

[0005]

According to the solid-state image pickup device of the present invention, one surface of a flexible printed board is joined to either one surface of a circuit board for a camera on which a solid-state image pickup element is mounted. On the other surface of the printed circuit board, a circuit board side reinforcing member is provided corresponding to a joint portion with the camera circuit board, and the circuit board side reinforcing member has one end portion thereof and the camera circuit board. It is characterized in that the flexible printed circuit board is disposed between the two. With this configuration, even if the flexible printed board tries to bend at an acute angle from the end of the camera circuit board, the flexible printed board is positioned between the one end of the circuit board side reinforcing member and the camera circuit board. The flexible printed board is not bent at an acute angle from its end, and peeling or disconnection at the joint of the flexible printed board with the camera circuit board can be prevented.

Further, in the solid-state image pickup device of the present invention, the flexible printed board is a double-sided board, a connection pattern with the camera circuit board is formed on one surface of one end of the flexible printed board, and the other end thereof is formed. External terminals to be joined to the main body side substrate are formed on the other surface of the part, and the circuit board side reinforcing member is formed at the same time when the cover lay covering the circuit pattern conducting to the external terminals is formed. It is characterized by being. Further, an external terminal side reinforcing member is provided on one surface of the flexible printed circuit board so as to correspond to the external terminal, and the external terminal side reinforcing member is a coverlay covering a circuit pattern conducting to the connection pattern. The feature is that they are formed at the same time when they are formed. With this configuration, a special process for forming the reinforcing member on the circuit board side and the reinforcing member on the external terminal side is not necessary, and the manufacturing is facilitated, and, similarly to the above, the flexible printed circuit board for the camera circuit board and the main body side board are Peeling and disconnection at the joint are prevented and the quality is stabilized.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Regarding one embodiment of the present invention,
A description will be given with reference to the drawings.

As shown in FIGS. 1 and 2, a circuit board 1 for a camera has circuit patterns (not shown) formed on the front and back surfaces of the board, and the circuit patterns on both the front and back sides are conducted through through holes (not shown). I am allowed. A solid-state image pickup device (not shown) is connected to the front side of the camera circuit board 1, and the camera unit 2 is mounted at a position where an image can be picked up on the image pickup surface of the solid-state image pickup device. In the camera unit 2, the first lens barrel 21 and the second lens barrel 22 are screwed together, an optical member such as a lens 24 is inserted into the first lens barrel 21, and the lens 24 is removed by the lens retainer 23. It is held incapable.

As shown in FIGS. 1 and 3, an IC for driving a solid-state image pickup device is provided on the back side of the camera circuit board 1.
3 are connected via bump electrodes (not shown). Also,
On the back side of the camera circuit board 1, there is provided a connection pattern with a flexible printed circuit board (hereinafter referred to as FPC) 4 for connecting to the board on the main body side, and the connection portion 4a of the FPC 4 is provided in this connection pattern. It is joined. The place where the IC 3 is provided is not limited to the rear side of the camera circuit board 1 and may be the front side of the camera circuit board 1, for example.

As shown in FIGS. 1 and 2, a reinforcing tape 5 is attached to the front side of the camera circuit board 1 and the FPC 4 on the side of the connecting portion 4a so as to extend over the camera circuit board 1 and the FPC 4. . Further, as shown in FIGS. 1 and 3, a reinforcing member 6 as a circuit board side reinforcing member is provided on the back surface side of the FPC 4 corresponding to the connecting portion 4a. The reinforcing member 6 is located at a position where one end (left end) 6a of the reinforcing member 6 projects more than the left end of the camera circuit board 1. Since the reinforcing member 6 reinforces the FPC 4, it is desirable that the reinforcing member 6 be formed of the same material as the FPC 4, such as a polyimide film.

FIG. 4 shows an enlarged cross section of the connecting portion between the camera circuit board 1 and the FPC 4, which will be described in detail below. In the FPC 4, a circuit pattern 42 is formed on a base substrate 41 made of polyimide, for example, using a polyester-based, acrylic-based, epoxy-based, or other adhesive having excellent heat resistance and bending characteristics. Circuit pattern 4
A connection pattern is formed on the front surface side of the tip end portion 2 of the camera circuit board 1 for connecting to the camera circuit board 1. The surface of the circuit pattern 42 excluding the connection portion 4a is formed of the same adhesive as described above. To form the cover lay 43 and form the circuit pattern 4
Protecting 2. The coverlay 43 is made of the same material as the base material 41 (polyimide in this example).

A reinforcing tape 5 is attached to the front surface side of the coverlay 43 so as to extend over the front surface side of the camera circuit board 1. On the back surface side of the base material 41, as described above, the reinforcing member 6 is provided corresponding to the connecting portion 4a. The reinforcing member 6 is preferably made of the same material as the base material 41 (polyimide in this example). One end (left end) 6a of the reinforcing member 6 is set at a position projecting from the line a at the left end of the camera circuit board 1. Reinforcement member 6
The other end portion (right end portion) 6b is located at a position sufficiently retracted from the line a toward the right end portion (not shown) of the camera circuit board 1, and the auxiliary member 6 is set to have a sufficient width. . That is, the one end portion 6a of the reinforcing member 6 and the camera circuit board 1
FPC4 is located between and.

As described above, by the reinforcing member 6, the FPC
When the FPC 4 is bent, the FPC 4 cannot be bent at an acute angle in the vicinity of the end portion of the camera circuit board 1 and is in a gently curved state, so that peeling does not occur at the connection portion 4a. Further, since sharp bending is prevented, disconnection of the circuit pattern of the FPC 4 can be prevented.

FIG. 5 shows an enlarged cross section of another embodiment. In this example, the double-sided board 7 is used as the flexible printed board. That is, a circuit pattern 72 on the front surface side is formed in the same manner as described above on the front surface side of the base base material 71 similar to the above, offset to one end (right end portion). At the right end of the circuit pattern 72, a connection pattern 7a that serves as a connection portion with the camera circuit board 1 is formed.
On the back surface side of the base substrate 71, a circuit pattern 73 on the back surface side is formed in the same manner as the above, being offset to the other end portion (left end portion). The left end of the circuit pattern 73 is formed with an external terminal 7b which serves as a connection portion with the substrate 8 on the main body side.

Circuit pattern 72 excluding connection pattern 7a
Are covered with the coverlay 74 as described above. At the time of forming the cover lay 74, a reinforcing member 75 as an external terminal side reinforcing member is simultaneously formed corresponding to the external terminal 7b connected to the main body side substrate 8 at the same time.
The circuit pattern 73 excluding the external terminals 7b is covered with the cover lay 76 as described above. This coverlay 7
At the time of forming 6, the reinforcing member 77 as a circuit board side reinforcing member is simultaneously formed corresponding to the connection pattern 7a connected to the camera circuit board 1 at the same time. The circuit patterns 72 and 73 are electrically connected to each other through a through hole (not shown). In addition, the reinforcing member 75 projects from the end portion (line b) of the substrate 8 on the main body side, and the reinforcing member 77 projects from the end portion (line a) of the camera circuit board 1 as described above. Is. That is, the FPC 7 is located between one end of the reinforcing member 75 and the substrate 8 on the main body side, and between one end of the reinforcing member 77 and the camera circuit board 1. The reinforcing tape 5 is attached in the same manner as above.

As described above, when the FPC 7 is bent by the reinforcing members 75 and 77, the FPC 7 is not bent at an acute angle in the vicinity of the ends of the camera circuit board 1 and the substrate 8 on the main body side, and is in a gently curved state. Therefore, connection pattern 7
No peeling occurs at a and the external terminal 7b. In addition, since the sharp bend is prevented, the circuit pattern 7 of the FPC 7
The disconnection of 2, 73 can be prevented. Furthermore, since the reinforcing members 75 and 77 are formed at the same time when the coverlays 74 and 76 formed on the circuit patterns 72 and 73 are formed, a special manufacturing process for the reinforcing members 75 and 77 is not necessary, and the manufacturing process is not required. The process does not become complicated.

[0017]

As described above, according to the present invention, a reinforcing member is provided corresponding to the joint portion between the camera circuit board and the flexible printed circuit board, and the reinforcing member is flexible between the one end and the camera circuit board. Since the printed circuit board is disposed so as to be positioned, it is possible to prevent the joint portion from being peeled off and the circuit pattern on the flexible printed circuit board from being broken due to bending of the flexible printed circuit board. In addition, when the flexible printed circuit board is a double-sided board, the reinforcing member is formed at the same time when the coverlay formed on the circuit pattern is formed. In addition to the above effect, there is a remarkable effect that the manufacturing process is not complicated.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is a rear view of the same.

FIG. 4 is an enlarged cross-sectional view of a main part of the same.

FIG. 5 is an enlarged cross-sectional view showing another embodiment corresponding to FIG.

FIG. 6 is a front view showing a conventional example.

[Explanation of symbols]

1 Camera circuit board 2 camera unit 4 Flexible printed circuit board 4a connection part 6 Reinforcement member (Circuit board side reinforcement member) 7 Flexible printed circuit board (double-sided circuit board) 7a connection pattern 7b External terminal 72,73 circuit pattern 74,76 Coverlay 75 Reinforcement member (external terminal side reinforcement member) 77 Reinforcement member (Circuit board side reinforcement member)

Continued front page    F term (reference) 2H100 BB11 CC07                 5C022 AA00 AC42 AC70 AC78 CA00                 5C024 BX01 CY47 EX21

Claims (3)

[Claims] 1. A camera circuit board on which a solid-state image sensor is mounted is joined to one surface of a flexible printed circuit board, and the other surface of the flexible printed circuit board is connected to the camera circuit. A circuit board side reinforcing member is provided corresponding to the joint with the board, and the circuit board side reinforcing member is arranged such that the flexible printed circuit board is located between one end of the circuit board side reinforcing member and the camera circuit board. A solid-state imaging device, which is provided. 2. The flexible printed circuit board according to claim 1, wherein the flexible printed circuit board is a double-sided circuit board, a connection pattern with the camera circuit board is formed on one surface of one end of the flexible printed circuit board, and the other end of the flexible printed circuit board is the other. External terminals to be joined to the main body side board are formed on the surface of the main body side, and the circuit board side reinforcing member is formed at the same time when the cover lay covering the circuit pattern conducting to the external terminals is formed. A solid-state image pickup device comprising: 3. The external terminal side reinforcing member corresponding to the external terminal is provided on one surface of the flexible printed board according to claim 2, wherein the external terminal side reinforcing member is electrically connected to the connection pattern. The solid-state imaging device is formed simultaneously with the formation of the coverlay that covers the circuit pattern.