JP2003243583A5 - - Google Patents
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- Publication number
- JP2003243583A5 JP2003243583A5 JP2003009415A JP2003009415A JP2003243583A5 JP 2003243583 A5 JP2003243583 A5 JP 2003243583A5 JP 2003009415 A JP2003009415 A JP 2003009415A JP 2003009415 A JP2003009415 A JP 2003009415A JP 2003243583 A5 JP2003243583 A5 JP 2003243583A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/074,642 US20030150605A1 (en) | 2002-02-12 | 2002-02-12 | Thermal transfer interface system and methods |
| US10/074642 | 2002-02-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003243583A JP2003243583A (ja) | 2003-08-29 |
| JP2003243583A5 true JP2003243583A5 (bs) | 2006-03-02 |
| JP4414655B2 JP4414655B2 (ja) | 2010-02-10 |
Family
ID=27659925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003009415A Expired - Fee Related JP4414655B2 (ja) | 2002-02-12 | 2003-01-17 | 伝熱インターフェース |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US20030150605A1 (bs) |
| JP (1) | JP4414655B2 (bs) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7475175B2 (en) | 2003-03-17 | 2009-01-06 | Hewlett-Packard Development Company, L.P. | Multi-processor module |
| US7082034B2 (en) * | 2004-04-01 | 2006-07-25 | Bose Corporation | Circuit cooling |
| US7242593B2 (en) * | 2005-07-08 | 2007-07-10 | Ims Inc. | Thermally efficient motor housing assembly |
| US7646608B2 (en) * | 2005-09-01 | 2010-01-12 | Gm Global Technology Operations, Inc. | Heat transfer plate |
| US7212409B1 (en) | 2005-12-05 | 2007-05-01 | Hewlett-Packard Development Company, L.P. | Cam actuated cold plate |
| US7397664B2 (en) * | 2006-05-22 | 2008-07-08 | Sun Microsystems, Inc. | Heatspreader for single-device and multi-device modules |
| US7449775B1 (en) | 2006-05-22 | 2008-11-11 | Sun Microsystems, Inc. | Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
| US8666235B2 (en) * | 2007-02-14 | 2014-03-04 | Battelle Memorial Institute | Liquid fuel vaporizer and combustion chamber having an adjustable thermal conductor |
| MX2010004409A (es) * | 2007-10-25 | 2010-05-03 | Nexxus Lighting Inc | Aparato y metodos para administracion termica de dispositivos electronicos. |
| EP2247172B1 (de) * | 2009-04-27 | 2013-01-30 | Siemens Aktiengesellschaft | Kühlsystem, Kühlplatte und Baugruppe mit Kühlsystem |
| US8776868B2 (en) * | 2009-08-28 | 2014-07-15 | International Business Machines Corporation | Thermal ground plane for cooling a computer |
| US9049811B2 (en) | 2012-11-29 | 2015-06-02 | Bose Corporation | Circuit cooling |
| JP6152893B2 (ja) * | 2013-09-30 | 2017-06-28 | 富士電機株式会社 | 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール |
| KR102409471B1 (ko) * | 2014-12-22 | 2022-06-16 | 가부시키가이샤 호리바 에스텍 | 유체 가열기 |
| US11997812B2 (en) | 2022-10-12 | 2024-05-28 | Lunar Energy, Inc. | Cover for sealing a power module |
| US11849536B1 (en) | 2022-10-12 | 2023-12-19 | Lunar Energy, Inc. | Gantry for thermal management |
| WO2024081005A1 (en) * | 2022-10-12 | 2024-04-18 | Lunar Energy, Inc. | Gantry for thermal management |
| US11889662B1 (en) | 2022-10-12 | 2024-01-30 | Lunar Energy, Inc. | Thermal interface sandwich |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
| US4153107A (en) * | 1977-06-30 | 1979-05-08 | International Business Machines Corporation | Temperature equalizing element for a conduction cooling module |
| US4226281A (en) * | 1979-06-11 | 1980-10-07 | International Business Machines Corporation | Thermal conduction module |
| US4449580A (en) * | 1981-06-30 | 1984-05-22 | International Business Machines Corporation | Vertical wall elevated pressure heat dissipation system |
| US4649990A (en) * | 1985-05-06 | 1987-03-17 | Hitachi, Ltd. | Heat-conducting cooling module |
| US4748495A (en) * | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
| US5097385A (en) * | 1990-04-18 | 1992-03-17 | International Business Machines Corporation | Super-position cooling |
| US5228502A (en) * | 1991-09-04 | 1993-07-20 | International Business Machines Corporation | Cooling by use of multiple parallel convective surfaces |
| JPH06349989A (ja) * | 1992-12-21 | 1994-12-22 | Internatl Business Mach Corp <Ibm> | 熱伝達冷却装置 |
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2002
- 2002-02-12 US US10/074,642 patent/US20030150605A1/en not_active Abandoned
-
2003
- 2003-01-17 JP JP2003009415A patent/JP4414655B2/ja not_active Expired - Fee Related
- 2003-10-01 US US10/676,982 patent/US20040173345A1/en not_active Abandoned