JP2003243299A - Method and apparatus for liquid treatment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for liquid treatment enabling uniform development for a substrate to be processed, such as a reticle by preventing a loading effect in which the etching rate, etc., changes due to local variations in amounts of dissolution product or concentration of developer liquid. <P>SOLUTION: There are provided a mask stage 4 on which a planar glass substrate G is placed, a nozzle stage 5 which cooperates with the mask stage 4 to hold the glass substrate G, a holding point adjusting means 110 capable of adjusting holding point of the glass substrate G held by the nozzle stage 5, a liquid supply means 6 which supplies a developer liquid in band form on the surface of the glass substrate G held by the nozzle stage 5, and a scan mechanism 7 capable of translating the glass substrate G and the liquid supply means 6 relative to each other, for even development with the glass substrate. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid processing method and a liquid processing apparatus for supplying a processing liquid to a glass substrate for a photomask such as a reticle for processing.

[0002]

2. Description of the Related Art Generally, in a semiconductor device manufacturing process, for example, a resist solution is applied to the surface of a semiconductor wafer, a glass substrate for LCD or the like (hereinafter referred to as a wafer),
A photolithography technique is used in which a circuit pattern is reduced using an exposure device such as a stepper to expose a resist film, and a developing solution is applied to the exposed wafer surface to perform a development process.

In the above exposure process, an exposure device such as a stepper (reduction projection exposure device) is used, for example, a photomask such as a reticle is irradiated with light, and an original drawing of a circuit pattern drawn on the photomask is used. Are reduced and transferred onto the wafer.

By the way, in the photomask manufacturing process as well, the photolithography technique is used similarly to the wafer and the like, and a series of process steps such as a resist coating step, an exposure processing step and a development processing step are performed. Since the photomask is an original drawing for projecting a circuit pattern on a wafer or the like, the pattern dimensions such as the line width are required to have higher accuracy.

Here, in the photomask developing method, a glass substrate for a photomask is adsorbed and held on a spin chuck and rotated at a low speed, and a developing solution is sprayed onto the glass substrate using a spray nozzle. There is a method called spray development in which development processing is performed.

There is also a method called paddle development in which the developing solution supplied from the scan nozzle is poured onto the glass substrate while the glass substrate and the scan nozzle are moved relative to each other, and the developing process is performed in a stationary state.

[0007]

However, in the spray development, the dissolution product generated by reacting with the developing solution flows to the sides and corners of the glass substrate due to the centrifugal force due to the rotation, so that the development is performed in this part. The reaction with the liquid is suppressed,
There is a problem in that the pattern dimensions such as line width are not uniform.

Further, in the paddle development, the dissolved product does not flow to a specific place, and the problem such as spray development does not occur, but the dissolved product is caused by the difference in the geometric structure of the pattern and the pattern density. There is a problem in that the circuit pattern becomes non-uniform due to a phenomenon called a loading effect in which the generation amount and the concentration of the developer are locally different and the etching rate and the like change.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a liquid processing method and a liquid processing apparatus capable of performing uniform development processing on a photomask (substrate to be processed) such as a reticle without defects. It is what

[0010]

In order to achieve the above object, a liquid processing method of the present invention comprises a step of holding a plate-shaped substrate to be processed at a predetermined position, a liquid supply means for supplying a processing liquid, and the above A step of detecting displacement information with respect to the surface of the substrate to be processed; based on the displacement information, the position of the liquid supply means is adjusted, and the substrate to be processed and the liquid supply means are relatively moved in parallel. And a step of supplying the treatment liquid in a strip shape on the surface of the substrate to be treated (claim 1).
In this case, it is preferable that the step of detecting the displacement information is performed by moving the liquid supply means having a gap detection means in parallel with the substrate to be processed (claim 2). Further, it is preferable that the step of detecting the displacement information is performed with pure water supplied to the surface of the substrate to be processed (claim 3). In addition, before the step of detecting the displacement information, the thickness of the substrate to be processed is detected, and the liquid supply means and the substrate to be processed are relatively moved in parallel based on the data to obtain the displacement information. Is preferably detected (Claim 4). The position of the liquid supply means may be adjusted while detecting the displacement information (claim 5).

The first liquid processing apparatus of the present invention further comprises a mounting means for mounting the plate-shaped substrate to be processed, and a holding means for holding the substrate to be processed in cooperation with the mounting means. Holding position adjusting means capable of adjusting the holding position of the substrate to be processed held by the holding means, liquid supply means for supplying the processing liquid in a band shape to the surface of the substrate to be processed held by the holding means, It comprises a moving means capable of moving the substrate to be processed and the liquid supply means in parallel relative to each other (claim 6).

The second liquid processing apparatus of the present invention includes a delivery section for loading and unloading a plate-shaped substrate to be processed, a processing section for processing the substrate to be processed, and a substrate to be processed to be placed. And a holding means that is disposed in the processing unit and holds the substrate to be processed in cooperation with the placing unit, and conveys the placing unit between the transfer unit and the processing unit. And a holding position adjusting means capable of adjusting the holding position of the substrate to be processed held by the holding means, and a liquid for supplying the processing liquid in a band shape to the surface of the substrate to be processed held by the holding means. It is characterized by comprising: a supply unit; and a moving unit capable of moving the substrate to be processed and the liquid supply unit in parallel relative to each other (claim 7).

In the present invention, it is preferable that the delivery section is provided with a thickness detecting means for detecting the thickness of the substrate to be processed.

The holding position adjusting means may have any structure as long as it can adjust the holding position of the substrate to be processed held by the holding means, but preferably the holding position adjusting means is An abutting portion provided on the holding means for abutting the upper edge of the substrate to be processed to adjust the distance to the liquid supply means, and a lower portion of the placing means, the abutting portion being provided with the substrate to be processed. A holding force adjusting mechanism capable of adjusting the abutting force by an elastic force, or the holding position adjusting means detects a distance between the surface of the substrate to be processed and the liquid supplying means. And a plurality of supporting means capable of mounting the substrate to be processed and capable of expanding and contracting on the basis of the detection signal of the interval detecting means (claims 9 and 10). .

Further, in the present invention, it is preferable that a cleaning liquid supply means capable of supplying a cleaning liquid to the surface of the substrate to be processed is further provided (Claim 11).

Further, in the present invention, an exhaust pipe line capable of exhausting the atmosphere in the liquid processing apparatus, a drain pipe line for collecting the waste liquid, and at least a waste liquid overflowing from the holding means are supplied to the drain pipe line. And a drain part having a bottom surface that is inclined so as to be recoverable (claim 12).

Further, in the present invention, the liquid supply means is provided in parallel with the substrate to be processed and has a nozzle head having a liquid processing surface forming a constant gap, and the liquid processing surface is provided with the nozzle head. A processing liquid supply unit that supplies the processing liquid in a belt shape to the substrate surface, and a processing liquid supply unit that is provided in parallel to the processing liquid supply unit on the liquid processing surface, sucks the processing liquid supplied from the processing liquid supply unit, and simultaneously performs the processing It is preferable to provide a treatment liquid suction unit capable of forming a flow of the treatment liquid on the surface of the substrate (claim 13). In this case, it is preferable that the nozzle head is formed integrally with a liquid draining means capable of supplying a liquid draining gas to the surface of the substrate to be processed (claim 14). Further, the liquid draining means has a discharge port capable of supplying a liquid draining gas in a strip shape inclined to one side with respect to the direction in which the liquid is relatively moved in parallel with the substrate to be processed, or It is preferable to have a discharge port capable of supplying the liquid-cutting gas in a convex shape that is inclined to both the left and right with respect to the direction of relative translation (claims 15 and 16).

Further, in the present invention, it is preferable to provide a drying means which moves in parallel with the substrate to be processed and supplies a drying gas to the surface of the substrate to be processed.

Further, in the present invention, the liquid supply means is capable of detecting the distance to the surface of the substrate to be processed, and the liquid supply means based on the detection signal of the distance detection means. It is preferable to provide an elevating means capable of ascending and descending (claim 18).

Further, in the present invention, a plurality of the distance detecting means are provided on the front side in the traveling direction of the liquid supplying means, including at least both sides with a constant distance, and the elevating means is arranged in the longitudinal direction of the liquid supplying means. It is preferable to provide a plurality of them at regular intervals (claim 19).

Further, it is preferable to include a control means capable of controlling at least the processing liquid supply amount and the processing liquid suction amount of the liquid supply means and the driving of the moving means (claim 20).

Claims 1, 2, 3, 4, 5, 8, 18, 1
According to the invention described in 9, the displacement information of the surface of the substrate to be processed is detected while the plate-shaped substrate to be processed is held at a predetermined position,
The height position of the liquid supply means for supplying the processing liquid is adjusted based on the displacement information, and the substrate to be processed and the liquid supply means are relatively moved in parallel so that the surface of the substrate to be processed is treated with a strip of the processing liquid. By supplying the processing liquid, the processing liquid can be surely supplied with a constant gap between the surface of the substrate to be processed and the liquid supply means.

According to the sixth, seventh, ninth and tenth aspects of the present invention, since the holding position adjusting means for adjusting the holding position of the substrate to be processed held by the holding means is provided, the holding means holds the substrate. It is possible to reliably supply the processing liquid while keeping the gap between the surface of the substrate to be processed and the liquid supply means constant.

According to the eleventh aspect of the invention, since the cleaning liquid supply means capable of supplying the cleaning liquid to the surface of the substrate to be processed is provided, the substrate to be processed can be surely cleaned after the liquid processing, It is possible to prevent uneven processing of the substrate.

According to the twelfth aspect of the present invention, the drain portion is inclined so that the exhaust pipe for exhausting the atmosphere in the liquid processing apparatus and at least the waste liquid overflowing from the holding means can be collected in the drain pipe. Since it has a bottom surface, waste liquid does not remain on the bottom surface of the drain portion, and exhaustion and drainage can be performed quickly, and generation of particles and the like can be suppressed.

According to the thirteenth aspect of the present invention, the liquid supply means is provided in parallel with the substrate to be processed and has a nozzle head having a liquid processing surface forming a constant gap, and the liquid processing surface is provided with a nozzle head. A processing liquid supply unit that supplies the processing liquid in a strip shape to the surface of the processing substrate, and a processing liquid supply unit that is provided on the liquid processing surface in parallel with the processing liquid supply unit,
While sucking the processing liquid supplied from the processing liquid supply unit,
Since the processing liquid suction unit capable of forming a flow of the processing liquid on the surface of the substrate to be processed is provided, it is possible to suppress the loading effect and the like and perform uniform liquid processing.

According to the fourteenth, fifteenth and sixteenth aspects of the present invention, a liquid for removing liquid can be supplied to the substrate to be processed to drain a large amount of the cleaning liquid remaining on the surface of the substrate to be processed. Therefore, it is possible to suppress the generation of mist in the subsequent drying step.

According to the seventeenth aspect of the present invention, since the drying gas can be supplied to the substrate to be processed and the substrate can be dried quickly, the liquid treatment of the substrate to be processed can be made more uniform and the treatment can be performed. Can be accelerated.

According to the twentieth aspect of the present invention, since at least the control liquid capable of controlling the liquid supply amount and the liquid suction amount of the liquid supply unit and the drive of the moving unit is provided, it is optimal for the substrate to be processed. Liquid treatment can be performed.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In this embodiment, a case will be described in which the liquid processing method and the liquid processing apparatus of the present invention are applied to a development processing apparatus that performs development processing on a substrate to be processed for a photomask, for example, a glass substrate G for a reticle.

As shown in FIG. 1, the development processing apparatus carries in the glass substrate G on which the resist solution has been applied and the circuit pattern has been exposed to the inside of the apparatus, or the glass substrate G on which the development processing has been completed to the outside of the apparatus. A delivery section 1 to be carried out, a processing section 3 to develop the glass substrate G carried in from the delivery section 1,
The transfer unit 1 and the processing unit 3 mainly include a transfer unit 2 that transfers the glass substrate G.

A plurality of, for example, three support pins (not shown) capable of vertically moving up and down while supporting the edge portion of the glass substrate G are provided inside the mask stage 4 in the delivery section 1 and inserted from the outside. Transfer means such as a transfer arm (not shown)
The glass substrate G can be transferred between the glass substrate G and the mask stage 4 described later.

Further, the delivery section 1 is provided with a thickness detecting means, for example, a laser displacement meter 101 for measuring a distance by utilizing reflection of laser light. In this case, as shown in FIG. 14A, Cr applied from above the glass substrate G
The distance to the layer 102 and the distance from the lower side of the glass substrate G to the back surface of the glass substrate G are measured and compared or calculated.
As shown in FIG. 14B, the thickness of the glass substrate G is detected by measuring the distance from the lower side of the glass substrate G to the back surface of the glass substrate G and the distance to the Cr layer 102 and performing a comparison calculation. , Can be stored in the CPU 100.
As a result, the glass substrate G having an error of about 100 μm
Of the liquid supply means 6 described later can be detected more accurately, and the displacement information between the liquid processing surface 62 of the liquid supply means 6 and the surface of the glass substrate G can be detected more accurately.

The mask stage 4 is, as shown in FIG.
The glass substrate G is provided in a substantially square shape larger than the glass substrate G, and a slight gap is provided between the glass substrate G and the mask stage 4 so that the exposed portion of the glass substrate G placed (held) does not touch the mask stage 4. A pair of mounting portions 41 capable of mounting (holding) two sides of the substrate G are provided. In addition, each mounting portion 41 is formed with a locking portion 42 that locks the end portion of the glass substrate G in order to prevent the glass substrate G from shifting in the horizontal direction.

As shown in FIG. 3, the transfer means 2 transfers the mask stage 4 between the delivery section 1 and the processing section 3 by X.
It is provided with a transfer mechanism 121 that can move horizontally in the horizontal direction, and an elevating mechanism 126 (see FIG. 4) that can move the mask stage 4 transferred below the processing unit 3 in the vertical direction.

The transport mechanism 121 includes, for example, a ball screw mechanism 122 provided so as to extend in the X direction from the transfer unit 1 to a lower portion of the processing unit 3, and mask stage guide rails provided on both sides of the ball screw mechanism 122 in parallel. 12
3 and a transfer mounting table 124 (see FIG. 4) provided with an elevating mechanism 126 (described later) on the upper portion thereof. Can be moved in any direction.
In this case, if the nozzle (not shown) that moves with the mask stage 4 and downflows clean air to the ball screw mechanism 122 and allows it to flow to the exhaust port is attached, particles adhere to the glass substrate G. This is preferable because it can be prevented.

Further, as shown in FIG. 4, the elevating mechanism 126 is provided above the carrying table 124, and the mask stage 4 is moved in the vertical direction in the figure by driving an air cylinder or the like to move the mask. The stage 4 is formed to be movable up and down on a nozzle stage 5 (holding means) described later.

As shown in FIG. 5, the processing section 3 includes a nozzle stage 5 for holding the glass substrate G in cooperation with the mask stage 4, and a glass substrate G held by the nozzle stage 5.
Holding position adjusting means 110 (FIG.
(See) and supply the developing solution to the glass substrate G (discharging and coating)
A liquid supply means 6 for controlling the liquid supply means 6, a scan mechanism 7 capable of moving the liquid supply means 6 in parallel with the glass substrate G on the nozzle stage 5, and a rinse nozzle 8 for cleaning the glass substrate G after the development processing. It mainly includes a drain pan 9 for discharging the processing liquid used for the development processing, and an air blow nozzle 10, which is a drying means for drying the rinsed glass substrate G, for example.

The nozzle stage 5 is, as shown in FIG.
A fitting portion 51 capable of holding the glass substrate G in cooperation with the mask stage 4 is provided in the center, and the developing solution can be supplied on the nozzle stage 5 while moving the liquid supply means 6 in parallel. There is.

As shown in FIGS. 5 to 7, the holding position adjusting means 110 is provided on the upper side of the two sides of the fitting portion 51 of the nozzle stage 5 extending in the X direction, and the upper surface edges of the glass substrate G facing each other. And a contact portion for adjusting the distance to the liquid supply means 6, for example, a pair of pressing plates 52, and the pressing plate that is contracted between the lower surface of the mask stage 4 and the elevating part 126a of the elevating mechanism 126. A pressing force adjusting mechanism capable of adjusting the force with which the glass substrate G abuts 52 by elastic force, for example, the spring 1
And 27. By thus providing the holding position adjusting means 110, the glass 127
By pressing against the holding plate 52, a constant gap can be formed between the liquid supply means 6 and the glass substrate G. In this case, in order to form the gap more accurately, the liquid supply means 6 described later
This is done by adjusting the height of.

Instead of the spring 127, for example, a pressure adjusting air cylinder or the like utilizing the elastic force of gas may be used.

Further, as shown in FIG. 8, instead of forming the holding position adjusting means by the holding plate 52 and the spring 127,
The glass substrate G is provided above the elevating part 126a of the elevating mechanism 126.
It is also possible to provide a plurality of expandable and contractible support means for supporting the lower part of the peripheral edge, for example, three support pins 111. In this case, each support pin 111 is provided with a height adjusting drive device such as a ball screw mechanism or the like, and a gap detecting means (to be described later) such as a laser displacement meter 78 capable of detecting the gap between the liquid supply means 6 and the glass substrate G. The support pins 111 can be expanded and contracted based on the obtained data to form the glass substrate G so that the height and the inclination thereof can be finely adjusted.

As shown in FIG. 9, the liquid supply means 6 is formed to have a length equal to or longer than the width of the pattern forming region of the glass substrate G, and to be relatively spaced from the glass substrate with a certain gap. A substantially rectangular parallelepiped nozzle head 61 having a liquid processing surface 62 that can move in parallel with the liquid processing surface 62;
A developing solution supply nozzle 63 (processing solution supply section) for supplying (discharging and coating) the developing solution in a strip shape onto the glass substrate G, and the solution processing surface 6
2 is provided in parallel with the developing solution supply nozzle 63, sucks the developing solution supplied by the developing solution supply nozzle 63, and
Developer suction nozzle 64 that forms a flow of developer on the surface of
(Hereinafter referred to as suction nozzle 64) {treatment liquid suction unit},
A side rinse nozzle 65 is provided at a position facing the developing solution supply nozzle 63 with the suction nozzle 64 interposed therebetween, and supplies (discharges and applies) a rinse solution (cleaning solution) such as pure water to the surface of the glass substrate G. is doing.

Further, as shown in FIG. 15, the liquid supply means 6 may be integrally provided with a liquid cutting nozzle 165 (liquid cutting means) on the nozzle head 61 via a connecting fitting 169. The liquid draining nozzle 165 supplies a liquid draining gas, for example, air to the glass substrate G in a strip shape, and a liquid draining nozzle head 166 formed on the substantially rectangular parallelepiped and having a length equal to or longer than the width of the glass substrate G. ) Possible slit-shaped outlet 16
4 and. Further, as shown in FIG. 16, the liquid draining nozzle 165 is connected to an air supply source 161 that supplies air via an air supply pipe 163, and a pumping means such as a pump 162 that pumps air, and an air supply. Pipeline 1
An opening / closing valve V5 for opening / closing 63 is provided. By configuring the liquid draining nozzle 165 in this way, the discharge port 1
By blowing air from 64 onto the surface of the glass substrate G after the rinse treatment, a large amount of the rinse liquid remaining on the glass substrate G can be drained. By performing the liquid draining first, Generation of mist can be suppressed in the drying step described below. At this time, the generated mist is prevented from rising by downflow by a fan or the like (not shown) provided in the upper part of the apparatus, and a duct (not shown) for local exhaust is provided on the side surface of the developer processing apparatus, and It is preferable to have a structure capable of suction.

The liquid draining nozzle 165 is shown in FIG.
As shown in (a), if the discharge port 164 is provided so as to be able to supply air in a strip shape that is inclined in one direction with respect to the direction in which it moves in parallel with the glass substrate G, it remains on the glass substrate G. The liquid that does not stay in the center of the glass substrate G can be reliably drained on the surface of the glass substrate G.

The liquid draining nozzle 165 is shown in FIG.
As shown in (b), the nozzle head 166B for draining has a dogleg-shaped ejection port 164b, or as shown in FIG. 17 (c), an arc-shaped ejection port 16b.
The nozzle head 166C for liquid draining having 4c is provided, and the direction parallel to the glass substrate G moves in parallel.
Even if the air is formed so as to be able to supply air in a convex shape that inclines to both the left and right, the liquid remaining on the glass substrate G does not stagnant in the center of the glass substrate G, and the glass substrate G is reliably formed.
The surface of can be drained.

The liquid draining nozzle 165 is not limited to the slit shape, but may be, for example, a plurality of discharge ports capable of discharging air provided in the longitudinal direction.

As shown in FIG. 9, the developing solution supply nozzle 63 has a container 1 for temporarily containing the developing solution for removing bubbles.
1 inside the nozzle head 61, a developer supply line 13 for supplying the developer from a developer tank 12 (developer supply source) in which the developer is stored, and a bubble of the developer in the accommodating portion 11. It is connected to the bubble removing pipe line 14 (see FIG. 10) for removing bubbles.

Further, in the developing solution supply line 13, a temperature adjusting mechanism 15 for adjusting the temperature of the developing solution, a pressure feeding means (not shown) for pumping the developing solution, such as a pump, and a developing solution in the developing solution supply line are provided. A developer flow meter 130 for detecting the flow rate is provided, and the flow rate of the developer can be adjusted by an opening / closing valve V1 such as an air operation valve whose opening and closing is controlled by compressed air.

The temperature adjusting mechanism 15 is, as shown in FIG.
The double tube structure is provided at the connecting portion between the developing solution supply pipe 13 and the nozzle head 61, and the developing solution supply pipe 13 is formed so as to pass through the temperature control conduit 16. The temperature adjusting pipe 16 is a temperature adjusting pipe for circulating a liquid, for example, pure water, whose temperature is regulated by a heater 17 or the like with respect to the developing liquid flowing from the upper side to the lower side in the developing liquid supply pipe 13 by means of a circulation means such as a circulation pump 18. It is configured to circulate in the passage 16 from below to above. With this configuration, the temperature of the developing solution can be adjusted, so that the viscosity of the developing solution and the etching rate (processing rate, reaction rate) can be made constant, and a more uniform developing process can be performed. be able to.

As shown in FIG. 10, the bubble removing conduit 14 is
The upper portion of the nozzle head 61 is connected to the housing portion 11, and is configured so that bubbles can be removed by an exhaust unit (not shown) so that bubbles are not mixed into the developing solution.

As shown in FIGS. 11 and 12, the developing solution supply nozzle 63 has a plurality of supplying holes 20 provided at equal intervals, for example, at a pitch of 1 mm in the longitudinal direction of the developing solution supply nozzle 63, and these supplying holes. For example, a slit 21 having a width of 1 mm, which is communicated with the lower portion of the nozzle 20 and is provided in the longitudinal direction of the developing solution supply nozzle 63, and a spread taper which is communicated with the lower portion of the slit 21 and supplies (discharges and coats) the developing solution to the glass substrate G The developing solution supply port 22 and a cylindrical quartz rod 23 that is provided in the developing solution supply port 22 in the longitudinal direction and uniformly discharges the developing solution.

By constructing the developing solution supply nozzle 63 in this way, the developing solution flowing out from the supply hole 20 merges at the slit 21 and then flows along the wall surface of the developing solution supply port 22, while the quartz rod It can be diffused on the surface of 23. Therefore, the slit 21 can prevent uneven discharge of the developing solution due to the supply hole, and the quartz rod 23 can uniformly supply (discharge or apply) the developing solution to the glass substrate G. The developing solution supply nozzle and a suction nozzle described later can be used. It is possible to form a uniform flow of the developing solution with respect to 64 and perform a uniform developing process.

The suction nozzle 64, as shown in FIG.
Slit-shaped suction ports 35 for sucking the processing liquid (waste liquid) used for the development processing such as the developing solution and the rinsing solution are provided in parallel on both sides in the moving direction of the liquid processing surface 62 of the developing solution supply nozzle 63. . Here, the length of the suction port 35 in the longitudinal direction is
In order to prevent the developing solution from seeping out from both ends of the developing solution supply nozzle 63, it is preferable that the developing solution supply port 22 is formed longer than the length of the developing solution supply port 22 in the longitudinal direction. If the width of the slit of the suction port 35 is too wide, the developing state deteriorates near the suction port 35. Therefore, the slit of the suction port 35 can be sucked as much as possible without leaking the supplied developing solution to the side rinse nozzle 65 side. It is preferable that the width is narrow. Further, the suction nozzle 64 smoothly sucks the developing solution supplied from the developing solution supply nozzle 63 and used for the developing process to form a uniform developing solution flow. Therefore, as shown in FIG. 35 is the developer supply port 22
It is preferable to form so as to face the side.

The suction nozzle 64 is, as shown in FIG. 9, a pressure reducing mechanism such as an ejector capable of adjusting the amount of waste liquid such as developer and rinse liquid sucked by the suction port 35 via the suction pipe line 30. 31, a suction flow meter 150 capable of detecting the suction amount of each of the suction ports 35 on the front side and the rear side in the moving direction of the liquid supply means 6, and the suction pipe line 30 is opened and closed to adjust the suction amount, for example, compression. Open / close valves V2 and V3 such as air operation valves whose opening and closing are controlled by air;
A trap tank 32 that separates and collects the sucked waste liquid into gas and liquid, a pressure sensor 33 that can detect the pressure of the trap tank 32, and a waste liquid tank 34 that collects the waste liquid collected in the trap tank 32. It is connected to the configured suction unit 200. In this case, if the suction pipe line 30 is sucked from the upper end of the suction nozzle 64, the flow of the developing solution becomes peculiar in the vicinity of the suction port 35 immediately below that portion, and the developing process may become uneven. The passage 30 is preferably provided at the upper end of the position away from the pattern formation region of the glass substrate G, or at both ends of the suction nozzle 64.

The suction unit 200 is provided with the ejector 3
1. Instead of using the trap tank 32 and the pressure sensor 33, it is also possible to use a suction means, such as a suction pump, that can adjust the suction amount of the waste liquid sucked by the suction port.

As shown in FIG. 12, the side rinse nozzles 65 sandwich the suction nozzle 64 and the developing solution supply nozzle 63.
The rinse liquid is provided in parallel to the position opposite to the slit-shaped rinse liquid supply port 36 and can supply a rinse liquid such as pure water between the liquid processing surface 62 and the glass substrate G.

As shown in FIG. 9, the side rinse nozzle 65 is connected to a rinse liquid supply source, for example, a rinse liquid supply tank 38 via a rinse liquid supply pipe 37.
Like the developing solution supply pipeline 13, the rinse solution supply pipeline 37 includes a temperature adjusting mechanism 39 for adjusting the temperature of the rinse solution, a pressure feeding means such as a pump (not shown) for feeding the rinse fluid, and a rinse solution supply pipeline. A rinse liquid flow meter 140 that detects the flow rate of the rinse liquid in the passage 37, and an opening / closing valve V4 such as an air operation valve that is opened / closed by compressed air or the like are provided.

With this structure, the suction nozzle 64 sucks a part of the rinse liquid supplied by the side rinse nozzle 65 and prevents the developer from spreading from the suction nozzle 64 to the side rinse nozzle 65 side. Therefore, the width of the developing solution on the glass substrate G can be made constant, and the development time can be made constant to perform uniform development processing. Of course, particles and the like on the glass substrate G can be removed.

The side rinse nozzle 65 can be provided separately from the nozzle head 61.

As shown in FIG. 5, the scanning mechanism 7 fits the liquid supply means guide rails 71 provided in parallel to the X direction in the drawing with the liquid supply means 6, and the liquid supply means guide rails. A scan base portion 76, which is movable in the X direction between a nozzle standby position 72 (the position where the liquid supply means 6 is located in the figure) and the glass substrate G, is formed on 71, and can be driven by a drive means such as a motor 75. Ball screw mechanism 73,
A scan arm 74 is connected to one end of the scan base portion 76 and transmits the driving force of the ball screw mechanism 73.

Further, the scan base section 76 includes a gap detecting means, for example, a laser displacement meter 78 capable of detecting the gap between the liquid supplying means 6 and the glass substrate G, and a liquid supplying means based on a detection signal of the laser displacement meter 78. 6 is provided with an elevating mechanism 77 (elevating means) composed of, for example, a motor M and a ball screw mechanism 177 (see FIG. 20). Therefore, it is possible to accurately form a constant gap between the liquid supply means 6 and the glass substrate G, for example, a gap of 1 mm to 50 μm.

In this case, the laser displacement meter 78 and the lifting mechanism 7
7 may be independently provided in the central portion of the scan base portion 76, but as shown in FIG. 5, two laser displacement gauges 78a and 78b are provided at a predetermined interval on the front side in the traveling direction of the liquid supply means 6. And the two lifting mechanisms 77
It is preferable that a and 77b are provided at regular intervals in the longitudinal direction of the liquid supply means. By doing so, not only the distance between the liquid supply means 6 and the glass substrate G but also the inclination of the glass substrate G can be detected by comparing the detection signals of the laser displacement meters 78a and 78b. Lifting mechanism 77
The height and inclination of the liquid supply means 6 can be controlled by a and 77b, and a gap can be formed between the liquid supply means 6 and the glass substrate G with higher accuracy. The number of laser displacement meters 78 may be three or more, provided that at least two laser displacement meters 78 are provided on the left and right sides.

As shown in FIG. 18A, at the nozzle standby position 72, the rinsing liquid is supplied from the rinsing liquid supply port 79a to cause the rinsing liquid to overflow and the liquid processing surface 62 and the side surface of the liquid supplying means 6 can be cleaned. A nozzle cleaning mechanism, for example, a container-shaped nozzle cleaning bath 79 is provided. Further, the nozzle cleaning bath 79 is formed so that it can be moved up and down by a not-shown elevating means, for example, a ball screw mechanism, an air cylinder, etc. When the liquid supply means 6 comes above the nozzle standby position 72, the nozzle cleaning bath 79 is moved. Nozzle cleaning bath 79
The gap between the bottom surface 79b and the liquid processing surface 62 is kept narrow, for example, 1 mm, and the liquid supply means 6 can be cleaned in the nozzle cleaning bath 79. Further, as shown in FIG. 18B, the two side rinse nozzles 65 of the liquid supply means 6 are provided.
The rinse liquid is supplied from either one of them to overflow from the nozzle cleaning bath 79, and a part of the rinse liquid is sucked into the suction nozzle 6 on the side sandwiching the developer supply nozzle 63.
4 is configured to suck, the developer supply nozzle 63
Since a flow of rinse liquid can be formed at the bottom of
Further, the developing solution supply nozzle 63 can be surely cleaned.

As shown in FIG. 5, the rinse nozzle 8 is suspended from the upper end of a base portion 81 provided outside the drain pan 9 at the tip of an arm portion 82 extending in the horizontal Y direction to near the center of the nozzle stage 5. The rinse liquid such as pure water can be supplied (discharged / dropped) near the center of the nozzle stage 5. Also, the base portion 81
Has an elevating means such as an air cylinder (not shown), and during the rinsing process, the rinsing liquid is supplied (discharged / dropped) by descending to a height at which the glass substrate G on the nozzle stage 5 is not impacted and developed. During processing, the nozzle stage 5
It is constructed so that it can stand by rising to a height at which it does not interfere with the liquid supply means 6 moving above.

The rinse nozzle 8 is formed so as to be movable by a driving force from a power source such as a motor by providing a rinse nozzle guide rail (not shown) and a ball screw mechanism at the bottom of the base portion 81. Alternatively, the glass substrate G may be scanned to perform the rinsing process.

As shown in FIG. 13A, the drain pan 9 is formed in a box shape surrounding the delivery section 1 and the processing section 3, and processes the developing solution and rinse solution overflowing from the nozzle stage 5. A drainage line 92 having a drainage port 91 for collecting a liquid (waste liquid), and a guide rail 71 for liquid supply means and a ball screw mechanism 73 provided at least in the development processing apparatus, and exhausts generated particles and the like. And an exhaust pipe line 94 having an exhaust port 93. Further, as shown in FIG. 13B, the bottom surface 95 of the drain pan 9 is provided so as to be inclined so that the drainage port 91 is the lowest, so that the processing liquid (waste liquid) can be smoothly fed to the drainage port 91. It is formed to flow to. The waste liquid that has flowed to the drainage port 91 is recovered via a drainage conduit 92 in a recovery tank (not shown) provided below the drain pan 9.

The air blow nozzle 10 (drying means) is provided between the delivery section 1 and the processing section 3, as shown in FIG. Further, as shown in FIG. 19, the air blow nozzle 10 is connected to an air supply source 171 for supplying air via an air supply pipe line 173, and a pressure feeding means such as a pump 172 for pressure feeding the air and an air supply pipe. An on-off valve V6 for opening and closing the passage 173 is provided, and the liquid draining nozzle 16 described above is provided.
The air blow can be performed at a pressure equal to or higher than that of No. 5.

By configuring the air blow nozzle 10 in this way, the mask stage 4 on which the glass substrate G is placed is moved by the transport mechanism 121, and the glass substrate G after the rinsing process is performed from the slit-shaped ejection port 10a.
Air can be blown to the surface of the glass substrate in a band shape to blow away the liquid remaining on the glass substrate G and dry it. At this time, since the liquid is drained by the liquid draining nozzle 165 first, even if high-pressure air is applied to the surface of the glass substrate G by the air blow nozzle 10, the mist does not rise so much and there is no defect due to re-adhesion. Development processing can be performed.

The generated mist is prevented from rising by downflow by a fan or the like (not shown) provided in the upper part of the apparatus, and a duct (not shown) for local exhaust is provided on the side surface of the developer processing apparatus. It is preferable to have a structure capable of sucking there.

Further, the air blow nozzle is not limited to the slit shape, and for example, a plurality of discharge holes capable of discharging air may be provided in the longitudinal direction.

Further, an air blow nozzle scan arm capable of horizontally moving the air blow nozzle 10 above the glass substrate G is provided, and instead of moving the mask stage 4, the air blow nozzle 10 is moved horizontally to move the glass substrate G.
It is also possible to spray air on the substrate to dry it.

Further, the liquid supply means 6 and the scanning mechanism 7
Is electrically connected to a control unit such as the CPU 100, and has detection signals from the developer flow meter 130, the rinse liquid flow meter 140, the suction flow meter 150, the pressure sensor 33, the laser displacement meter (interval detection unit), and the like. Based on the information stored in advance, the valves V1, V2, V3, V4, the liquid treatment surface 62
The distance (interval) and the inclination between the glass substrate G and the glass substrate G, the scanning speed of the liquid supply means 6, and the like can be controlled.

The development processing method using the development processing apparatus configured as described above will be described below.

First, the glass substrate G carried in from the delivery section 1 by a carrier arm or the like (not shown) has a thickness detecting means 10
The thickness of the glass substrate G is detected by 1 and the information is C
After storing in the PU 100, the mounting portion 4 of the mask stage 4
1 and is transported to below the nozzle stage 5 by the transport mechanism 121. Then, it is conveyed to the fitting portion 51 of the nozzle stage 5 by the elevating mechanism 126.

In the nozzle stage 5, the pressing plate 52 contacts the upper surfaces of the two sides of the end portion of the glass substrate G, so that the gap between the glass substrate G and the liquid processing surface 62 of the liquid supply means 6 is accurately fixed. And the glass substrate G is fixed. At this time, the force with which the glass substrate G contacts the pressing plate 52 is
It is adjusted by the elastic force of 27.

When the glass substrate G is fixed to the nozzle stage 5, the scanning mechanism 7 is controlled by the control signal from the CPU 100.
Moves the liquid supply means 6 from the nozzle standby position 72 to the scan start position. When reaching the scan start position, the glass substrate G is scanned while being supplied (discharged and applied) with a rinse liquid whose temperature has been adjusted in advance to a predetermined temperature, and the rinse liquid is applied to the entire surface of the glass substrate G (pre-wet). Process). Accordingly, it is possible to prevent air from entering between the liquid processing device 6 and the glass substrate G.

When the pre-wet process is completed, the liquid supply means 6 scans based on the thickness data of the glass substrate G detected by the laser displacement meter 101, and the distance between the glass substrate G and the liquid processing surface 62 is measured by the laser. It returns to the scan start position while being detected by the displacement gauges 78a and 78b. The detected displacement information is stored in the CPU 100.

In the above description, the displacement information is detected after the completion of the pre-wet process, but the method of detecting the displacement information is not limited to this, and the laser displacement meter 78 may be provided on the rear side in the traveling direction of the liquid supply means 6. It is also possible to provide the same and perform it at the same time as the pre-wetting step.

When the liquid supply means 6 returns to the scan start position, the CPU 100 controls the scan speed of the liquid supply means 6 to a speed at which the developing time can be secured, and the opening degrees of the open / close valves V1, V2, V3, V4. By controlling, supply (ejection, coating) and suction of the developing solution and the rinsing solution (pure water) are performed so that a developing solution flow having a constant width can be formed between the solution processing surface 62 and the glass substrate G. Start. The CPU 10
0 means that the developer is prevented from spreading over a predetermined width,
The supply (discharge, coating) of the rinse liquid may be controlled to start slightly later than the supply (discharge, coating) of the developer.

The supply (ejection, application) and suction of the developing solution and the rinse solution by the solution supplying means 6 are intermittently executed from the start to the end of the scan. At this time, displacement information such as the distance between the glass substrate G and the liquid processing surface 62, the inclination, etc., is compared and calculated based on the detection information stored in the CPU 100 and the information stored in advance, and the lifting mechanism 77a, 77b causes The height and the inclination of the liquid supply means 6 are such that the developer does not seep out from the position of the suction nozzle 64 to the side rinse nozzle 65 side and the flow velocity of the developer can be maintained at a high speed, for example, 1 m.
It is adjusted to be about m to 50 μm.

The height and tilt position of the liquid supply means 6 can be adjusted while the development process is being performed. In this case, displacement information such as the distance and inclination between the liquid supply means 6 and the surface of the glass substrate G is detected by the laser displacement meters 78a and 78b, and is compared with the information stored in advance in the CPU 100 to successively calculate the position. May be adjusted for development processing.

When the developing process is completed, the rinse nozzle 8 descends to a position where the glass substrate G is not impacted when the rinse liquid is supplied, and a rinse liquid such as pure water is supplied (discharged) onto the glass substrate G. Perform rinse treatment. In this case, the rinse solution can be discharged (supplied) from the side rinse nozzle 65 to perform the rinse process without using the rinse nozzle while moving the developer supply nozzle 63 to the nozzle standby position 72 in the opposite direction.

After completion of the rinsing process, the liquid draining nozzle 1
65 is operated to return the liquid supply means 6 to the nozzle standby position 72, and while supplying the air to the surface of the glass substrate G at a pressure for cutting the liquid without blowing the rinse liquid, the surface of the glass substrate G is drained. I do.

Further, the liquid supply means 6 is set at the nozzle standby position 72.
When returning to the upper side of the nozzle, the nozzle cleaning bath 79 rises, the rinse liquid overflows, and the liquid processing surface 6 of the liquid supply means 6 is discharged.
2 and side cleaning.

When the rinsing process is completed, the mask stage 4 is moved down from the fitting part 51 of the nozzle stage 5 by the elevating mechanism 126, and then is transferred to the delivery part by the transfer mechanism 121. At this time, the air blow nozzle 10 is operated to move the mask stage 4 while blowing air on both surfaces of the glass substrate G, and the rinse liquid on the glass substrate G is blown off and dried. Note that the mist generated at this time is discharged by the downflow of the apparatus, and a duct for local exhaust (not shown) is provided on the side surface of the drain pan 9 to suck the mist.

When the mask stage 4 is transported to the delivery section 1, the glass substrate G is unloaded by the transport means inserted from the outside of the apparatus, for example, the transport arm, and the processing is completed.

During the development processing, the developer flow rate meter 13
0, the rinse liquid flow meter 140 and the suction flow meter 150, and the CPU 10 based on the information stored in advance.
It is also possible that 0 controls the on-off valves V1, V2, V3 and V4.

In this case, if the suction nozzle 64 is controlled so that the suction amount on the front side in the moving direction is larger than the suction amount on the rear side in the moving direction, a larger amount of fresh product is generated in the front side in which the amount of dissolved products is large. Since the developer can be supplied and the dissolved product can be removed by speeding up the flow of the developer, a more uniform developing process can be performed.

In the above description, the case where the liquid processing apparatus of the present invention is applied to the developing processing apparatus for the glass substrate G for the reticle has been described, but the present invention is not limited to this, and the developing processing apparatus for wafers, LCDs, etc. is also applicable. Of course, it is also possible to apply.

[0091]

As described above, according to the present invention, since it is configured as described above, the following effects can be obtained.

1) Claims 1, 2, 3, 4, 5, 8, 1
According to the invention described in Nos. 8 and 19, liquid supply means for detecting displacement information on the surface of the substrate to be processed while holding the plate-shaped substrate to be processed at a predetermined position and supplying the processing liquid based on the displacement information. The height position of the substrate is adjusted and the substrate to be processed and the liquid supply means are relatively moved in parallel to supply the processing liquid in a strip shape to the surface of the substrate to be processed. The treatment liquid can be supplied with the gap kept constant and more uniform liquid treatment can be performed.

2) According to the sixth, seventh, ninth and tenth aspects of the invention, since the holding position adjusting means capable of adjusting the holding position of the substrate to be held held by the holding means is provided, the holding means holds the substrate. The processing liquid can be supplied with a constant gap between the surface of the substrate to be processed and the liquid supply means, and the liquid processing of the substrate to be processed can be made uniform.

3) According to the invention described in claim 11, since the cleaning liquid supply means capable of supplying the cleaning liquid to the surface of the substrate to be processed is provided, the substrate to be processed is reliably cleaned after the liquid processing in addition to the above 2). Therefore, it is possible to prevent processing unevenness of the substrate to be processed and perform more uniform liquid processing.

4) According to the twelfth aspect of the invention, the drain portion can collect the waste liquid overflowing from at least the holding means into the drain pipe through the exhaust pipe line capable of exhausting the atmosphere in the liquid processing apparatus. 2), which has a bottom surface inclined to
In addition to 3), no waste liquid remains on the bottom of the drain part,
Exhaust and drainage can be performed promptly, and generation of particles and the like can be suppressed.

5) According to the thirteenth aspect of the present invention, the liquid supply means is provided in parallel with the substrate to be processed, and is provided on the liquid processing surface and a nozzle head having a liquid processing surface forming a constant gap. , A processing liquid supply unit that supplies the processing liquid in a belt shape to the surface of the substrate to be processed, and a processing liquid supply unit that is provided in parallel to the processing liquid supply unit on the liquid processing surface, sucks the processing liquid supplied from the processing liquid supply unit, and Since the treatment liquid suction part capable of forming a flow of the treatment liquid on the surface of the substrate is provided, in addition to the above 2) to 4), the loading effect and the like can be suppressed to perform uniform liquid treatment.

6) According to the invention as set forth in claims 14, 15 and 16, a liquid for removing liquid is supplied to the substrate to be processed to drain a large amount of cleaning liquid remaining on the surface of the substrate to be processed. Therefore, generation of mist can be suppressed in the drying step performed later, and more uniform liquid treatment can be performed in addition to the above 2) to 5).

7) According to the seventeenth aspect of the present invention, a drying gas can be supplied to the substrate to be dried so that the substrate can be quickly dried. Therefore, in addition to the above 2) to 6), the liquid treatment of the substrate to be processed is performed. Can be made more uniform and the processing can be speeded up.

8) According to the twentieth aspect of the invention, at least the processing liquid supply amount and the processing liquid suction amount of the liquid supply means,
Since the control means capable of controlling the driving of the moving means is provided, it is possible to perform an optimum liquid treatment in addition to the above 5) and perform a more uniform liquid treatment.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a development processing apparatus of the present invention.

FIG. 2 is a schematic perspective view showing a mask stage.

FIG. 3 is a schematic plan view showing a conveying unit.

FIG. 4 is a schematic front view showing a lifting mechanism.

FIG. 5 is a schematic plan view showing a processing section of the development processing apparatus of the present invention.

FIG. 6 is a schematic front view showing the development processing apparatus of the present invention.

FIG. 7 is a schematic perspective view showing the structure of a holding position adjusting means in the present invention.

FIG. 8 is a schematic perspective view showing another configuration of the holding position adjusting means in the present invention.

FIG. 9 is a schematic cross-sectional view showing the configuration of the liquid supply means in the present invention.

FIG. 10 is a schematic perspective view showing a liquid supply means in the present invention.

FIG. 11 is a schematic cross-sectional view (a) showing a main part of a treatment liquid supply section according to the present invention and a schematic cross-sectional view (b) taken along line I-I thereof.

FIG. 12 is a schematic cross-sectional view (a) showing a configuration of a processing liquid supply section in the present invention and a schematic plan view (b) showing a liquid processing surface according to the present invention.

FIG. 13 is a schematic plan view (a) showing a configuration of a drain pan of the development processing apparatus and a schematic sectional view (b) taken along line II-II thereof.

FIG. 14 is a schematic sectional view showing a thickness detecting means in the present invention.

FIG. 15 is a schematic plan view showing the configuration of the liquid draining means in the present invention.

FIG. 16 is a schematic cross-sectional view showing the structure of the liquid draining means in the present invention.

FIG. 17 is a schematic plan view showing another configuration of the liquid draining means in the present invention.

FIG. 18 is a schematic sectional view showing a different configuration of the nozzle cleaning bath.

FIG. 19 is a schematic front view showing a drying means in the present invention.

FIG. 20 is a schematic front view showing the structure of the elevating means in the present invention.

[Explanation of symbols]

G glass substrate (substrate to be processed) 1 Delivery Department 2 transportation means 3 processing units 4 Mask stage (placement means) 5 Nozzle stage (holding means) 6 liquid supply means 7 Scan mechanism (moving means) 8 Rinse nozzle (cleaning liquid supply means) 9 Drain pan (drain section) 10 Air blow nozzle (drying means) 52 Presser plate (contact part) {holding position adjusting means} 61 nozzle head 62 Liquid processing surface 63 developing solution supply nozzle (processing solution supply section) 64 developer suction nozzle (treatment liquid suction part) 77, 77a, 77b Lifting mechanism (lifting means) 78, 78a, 78b Laser displacement meter (interval detection means) 92 Drainage line 94 Exhaust pipe 95 bottom 100 CPU (control means) 101 Laser displacement meter (thickness detection means) 110 Holding position adjusting means 111 Support pin (support means) {holding position adjusting means} 127 spring (holding force adjusting mechanism) {holding position adjusting means} 164, 164b, 164c Discharge port 165 Liquid draining nozzle (liquid draining means)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Kotaro Oishi             TBS broadcasting, 5-3-6 Akasaka, Minato-ku, Tokyo             Inside Center Tokyo Electron Ltd. (72) Inventor Ken Nishiya             TBS broadcasting, 5-3-6 Akasaka, Minato-ku, Tokyo             Inside Center Tokyo Electron Ltd. F-term (reference) 2H095 BA02 BB15 BB19                 2H096 AA24 GA08 GA26                 5F046 LA18

Claims (20)

[Claims] 1. A step of holding a plate-shaped substrate to be processed in a predetermined position, a step of detecting displacement information between a liquid supply means for supplying a processing liquid and the surface of the substrate to be processed, and the displacement information. Based on the above, while adjusting the position of the liquid supply means, the substrate to be processed and the liquid supply means are relatively moved in parallel, and the processing liquid is supplied to the surface of the substrate to be processed in a strip shape. And a liquid treatment method. 2. The liquid processing apparatus according to claim 1, wherein the step of detecting the displacement information is performed by moving the liquid supply means having an interval detection means in parallel with the substrate to be processed. And the liquid treatment method. 3. The liquid processing method according to claim 1, wherein the step of detecting the displacement information is performed with pure water supplied to the surface of the substrate to be processed. 4. The liquid processing method according to claim 1, wherein the thickness of the substrate to be processed is detected before the step of detecting the displacement information, and the liquid is supplied based on the data. A liquid processing method, wherein the means and the substrate to be processed are relatively moved in parallel to detect the displacement information. 5. The liquid processing method according to claim 1, wherein the position adjustment of the liquid supply means is performed while detecting the displacement information. 6. A mounting means for mounting a plate-shaped target substrate, a holding means for holding the target substrate in cooperation with the mounting means, and a target substrate held by the holding means. Holding position adjusting means capable of adjusting the holding position of the substrate, liquid supply means for supplying the processing liquid in a belt shape to the surface of the substrate to be processed held by the holding means, and the substrate to be processed and the liquid supply means relative to each other. And a moving means capable of moving in parallel with the liquid processing apparatus. 7. A delivery unit for loading and unloading a plate-shaped substrate to be processed, a processing unit for processing the substrate to be processed, a mounting means for mounting the substrate to be processed, and a processing unit arranged on the processing unit. Holding means for holding the substrate to be processed in cooperation with the placing means, conveying means for conveying the placing means between the transfer section and the processing section, and holding means for holding the holding means on the holding means. Holding position adjusting means for adjusting the holding position of the substrate to be processed, liquid supply means for supplying the processing liquid in a band shape to the surface of the substrate to be processed held by the holding means, and the substrate to be processed and liquid supply to the substrate to be processed. And a moving means capable of moving the means in parallel relative to each other. 8. The liquid processing apparatus according to claim 7, wherein the delivery section is provided with a thickness detecting means for detecting the thickness of the substrate to be processed. 9. The liquid processing apparatus according to claim 6, wherein the holding position adjusting means is provided in the holding means, and the holding position adjusting means is brought into contact with the upper surface edge portion of the substrate to be processed to form the liquid supply means. And a pressing force adjusting mechanism that is provided below the mounting means and that adjusts the force with which the substrate to be processed abuts on the abutting part by elastic force. Characteristic liquid treatment device. 10. The liquid processing apparatus according to claim 6, wherein the holding position adjusting means is a distance detecting means capable of detecting a distance between the surface of the substrate to be processed and the liquid supplying means. A liquid processing apparatus, wherein the substrate to be processed can be placed, and is composed of a plurality of supporting means which are respectively expandable and contractible based on a detection signal of the interval detecting means. 11. The liquid processing apparatus according to claim 6, further comprising a cleaning liquid supply unit capable of supplying a cleaning liquid to the surface of the substrate to be processed. 12. The liquid processing apparatus according to claim 6, wherein an exhaust pipe line capable of exhausting an atmosphere in the liquid processing device, a drain pipe line for collecting waste liquid, and at least a holding means. A liquid processing apparatus, comprising: a drain portion having a bottom surface that is inclined so that waste liquid overflowing can be collected in the drain pipe. 13. The liquid processing apparatus according to claim 6, wherein the liquid supply means is provided in parallel with the substrate to be processed, and has a nozzle head having a liquid processing surface forming a constant gap. A processing liquid supply unit that is provided on the liquid processing surface and supplies the processing liquid in a strip shape to the surface of the substrate to be processed; and a processing liquid supply unit that is provided on the liquid processing surface in parallel with the processing liquid supply unit and supplied from the processing liquid supply unit. A liquid processing apparatus, comprising: a processing liquid suction unit capable of sucking the processed processing liquid and forming a flow of the processing liquid on the surface of the substrate to be processed. 14. The liquid processing apparatus according to claim 13, wherein the nozzle head is formed integrally with a liquid cutting means capable of supplying a liquid cutting gas to the surface of the substrate to be processed. apparatus. 15. The liquid processing apparatus according to claim 14, wherein the liquid draining means is capable of supplying the liquid draining gas in a strip shape that is inclined in one direction with respect to the direction in which the liquid is relatively moved in parallel with the substrate to be processed. A liquid processing apparatus having a discharge port. 16. The liquid processing apparatus according to claim 14, wherein the liquid draining means supplies the liquid draining gas in a convex shape that is inclined to both the left and right with respect to the direction in which the liquid is relatively moved in parallel with the substrate to be processed. A liquid processing apparatus having a possible discharge port. 17. The liquid processing apparatus according to claim 6, further comprising a drying unit that moves in parallel with the substrate to be processed and supplies a drying gas to the surface of the substrate to be processed. A liquid processing apparatus characterized by: 18. The liquid processing apparatus according to claim 6, wherein the liquid supply unit detects a space between the liquid supply unit and the surface of the substrate to be processed, and the space detection unit detects the space. A liquid processing apparatus comprising: an elevating means capable of elevating the liquid supply means based on a signal. 19. The liquid processing apparatus according to any one of claims 6 to 18, wherein a plurality of the interval detecting means are provided on the front side in the traveling direction of the liquid supply means with a constant interval including at least both sides, A liquid processing apparatus, wherein a plurality of the elevating means are provided at regular intervals in the longitudinal direction of the liquid supply means. 20. The liquid processing apparatus according to claim 6, further comprising a control unit capable of controlling at least the processing liquid supply amount and the processing liquid suction amount of the liquid supply unit and the driving of the moving unit. Characteristic liquid treatment device.