JP2003242472A5 - - Google Patents

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Publication number
JP2003242472A5
JP2003242472A5 JP2002036190A JP2002036190A JP2003242472A5 JP 2003242472 A5 JP2003242472 A5 JP 2003242472A5 JP 2002036190 A JP2002036190 A JP 2002036190A JP 2002036190 A JP2002036190 A JP 2002036190A JP 2003242472 A5 JP2003242472 A5 JP 2003242472A5
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Japan
Prior art keywords
chip
concave hole
web material
antenna pattern
forming
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JP2002036190A
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Japanese (ja)
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JP2003242472A (en
JP3998993B2 (en
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Priority to JP2002036190A priority Critical patent/JP3998993B2/en
Priority claimed from JP2002036190A external-priority patent/JP3998993B2/en
Publication of JP2003242472A publication Critical patent/JP2003242472A/en
Publication of JP2003242472A5 publication Critical patent/JP2003242472A5/ja
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Publication of JP3998993B2 publication Critical patent/JP3998993B2/en
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Claims (9)

ウェブ材料に対してＩＣタグ用ＩＣチップを実装し、アンテナパターンを形成する方法であって、（１）走行するウェブ材料に間隔を置いてＩＣチップの外形、深さに相当する凹孔を形成する工程と、（２）当該ウェブ材料の凹孔内に、前記外形、深さに相応する形状を有するＩＣチップを嵌合した状態で各１個残す工程と、（３）前記凹孔内に嵌合したＩＣチップのパッドに接続するようにアンテナパターンをインクジェット法で印刷する工程と、からなることを特徴とするウェブに実装されたＩＣチップへのアンテナパターン形成方法。  An IC tag IC chip is mounted on a web material to form an antenna pattern. (1) A concave hole corresponding to the outer shape and depth of the IC chip is formed at intervals in the running web material. And (2) a step of leaving one IC chip having a shape corresponding to the outer shape and depth in the concave hole of the web material, and (3) in the concave hole. A method of forming an antenna pattern on an IC chip mounted on a web, comprising: printing an antenna pattern by an ink jet method so as to connect to a pad of a fitted IC chip. ウェブ材料に対してＩＣタグ用ＩＣチップを実装し、アンテナパターンを形成する方法であって、（１）走行するウェブ材料に間隔を置いてＩＣチップの外形、深さに相当する凹孔を形成する工程と、（２）当該ウェブ材料の凹孔内に、前記外形、深さに相応する形状を有するＩＣチップを嵌合した状態で各１個残す工程と、（３）前記凹孔内に嵌合したＩＣチップのパッドに接続するようにアンテナパターンをインクジェット法で印刷する工程と、（４）ＩＣチップが嵌合し、アンテナパターンを印刷したウェブ材料の凹孔部を含む全面にフィルムを被覆する工程と、からなることを特徴とするウェブに実装されたＩＣチップへのアンテナパターン形成方法。  An IC tag IC chip is mounted on a web material to form an antenna pattern. (1) A concave hole corresponding to the outer shape and depth of the IC chip is formed at intervals in the running web material. And (2) a step of leaving one IC chip having a shape corresponding to the outer shape and depth in the concave hole of the web material, and (3) in the concave hole. A step of printing an antenna pattern by an inkjet method so as to connect to the pad of the fitted IC chip; and (4) a film is formed on the entire surface including the concave portion of the web material on which the IC chip is fitted and printed with the antenna pattern. A method of forming an antenna pattern on an IC chip mounted on a web. アンテナパターンが、パッチアンテナ、平面コイル状アンテナ、ダイポール型アンテナのいずれかのパターンであることを特徴とする請求項１または請求項２記載のウェブに実装されたＩＣチップへのアンテナパターン形成方法。  3. The method of forming an antenna pattern on an IC chip mounted on a web according to claim 1, wherein the antenna pattern is any one of a patch antenna, a planar coil antenna, and a dipole antenna. インクジェット法による印刷が、キャピラリと対向電極間に電界を印加してインクを吐出する方式であることを特徴とする請求項１または請求項２記載のウェブに実装されたＩＣチップへのアンテナパターン形成方法。  3. The method of forming an antenna pattern on an IC chip mounted on a web according to claim 1 or 2, wherein printing by an ink jet method is a method of discharging an ink by applying an electric field between a capillary and a counter electrode. Method. ウェブ材料に対してＩＣタグ用ＩＣチップを実装し印刷回路を形成する方法であって、（１）走行するウェブ材料に間隔を置いてＩＣチップの外形、深さに相当する凹孔を形成する工程と、（２）当該ウェブ材料の凹孔内に、前記外形、深さに相応する形状を有するＩＣチップを嵌合した状態で各１個残す工程と、（３）前記凹孔内に嵌合したＩＣチップのパッドに接続するように回路をインクジェット法で印刷する工程と、からなることを特徴とするウェブに実装されたＩＣチップへの印刷回路形成方法。  A method of forming a printed circuit by mounting an IC chip for an IC tag on a web material, and (1) forming a concave hole corresponding to the outer shape and depth of the IC chip with a gap in the traveling web material. And (2) a step of leaving one IC chip having a shape corresponding to the outer shape and depth in the concave hole of the web material, and (3) fitting in the concave hole. A method of forming a printed circuit on an IC chip mounted on a web, comprising: a step of printing a circuit by an ink jet method so as to connect to a pad of a combined IC chip. ウェブ材料に対してＩＣタグ用ＩＣチップを実装し印刷回路を形成する方法であって、（１）走行するウェブ材料に間隔を置いてＩＣチップの外形、深さに相当する凹孔を形成する工程と、（２）当該ウェブ材料の凹孔内に、前記外形、深さに相応する形状を有するＩＣチップを嵌合した状態で各１個残す工程と、（３）前記凹孔内に嵌合したＩＣチップのパッドに接続するように回路をインクジェット法で印刷する工程と、（４）ＩＣチップが嵌合し、回路を印刷したウェブ材料の凹孔部を含む全面にフィルムを被覆する工程と、からなることを特徴とするウェブに実装されたＩＣチップへの印刷回路形成方法。  A method of forming a printed circuit by mounting an IC chip for an IC tag on a web material, and (1) forming a concave hole corresponding to the outer shape and depth of the IC chip with a gap in the traveling web material. And (2) a step of leaving one IC chip having a shape corresponding to the outer shape and depth in the concave hole of the web material, and (3) fitting in the concave hole. A step of printing a circuit by an inkjet method so as to connect to the pad of the combined IC chip, and (4) a step of covering the entire surface including the concave hole portion of the web material on which the IC chip is fitted and printed with the circuit. And a printed circuit forming method on an IC chip mounted on a web. インクジェット法による印刷が、キャピラリと対向電極間に電界を印加してインクを吐出する方式であることを特徴とする請求項５または請求項６記載のウェブに実装されたＩＣチップへの印刷回路形成方法。  7. The printed circuit formation on an IC chip mounted on a web according to claim 5 or 6, wherein printing by an ink jet method is a method of discharging an ink by applying an electric field between a capillary and a counter electrode. Method. 非接触ＩＣタグ機能を有するＩＣタグ付き包装体であって、ウェブ材料にＩＣチップの外形、深さに相当する凹孔が形成され、当該凹孔内にＩＣチップが嵌合した状態で、当該ＩＣチップのパッドに接続するように、アンテナパターンがインクジェット法で印刷され、さらに当該ＩＣチップ、アンテナパターン上にシーラントフィルムが被覆されていることを特徴とするＩＣタグ付き包装体。  A package with an IC tag having a non-contact IC tag function, wherein a concave hole corresponding to the outer shape and depth of the IC chip is formed in the web material, and the IC chip is fitted in the concave hole, A package with an IC tag, wherein an antenna pattern is printed by an inkjet method so as to be connected to a pad of an IC chip, and further, a sealant film is coated on the IC chip and the antenna pattern. アンテナパターンが、パッチアンテナ、平面コイル状アンテナ、ダイポール型アンテナのいずれかのパターンであることを特徴とする請求項８記載のＩＣタグ付き包装体。  9. The package with an IC tag according to claim 8, wherein the antenna pattern is any one of a patch antenna, a planar coil antenna, and a dipole antenna.
JP2002036190A 2002-02-14 2002-02-14 Antenna pattern forming method and printed circuit forming method on IC chip mounted on web, and package with IC tag Expired - Fee Related JP3998993B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002036190A JP3998993B2 (en) 2002-02-14 2002-02-14 Antenna pattern forming method and printed circuit forming method on IC chip mounted on web, and package with IC tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002036190A JP3998993B2 (en) 2002-02-14 2002-02-14 Antenna pattern forming method and printed circuit forming method on IC chip mounted on web, and package with IC tag

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JP2003242472A JP2003242472A (en) 2003-08-29
JP2003242472A5 true JP2003242472A5 (en) 2005-08-25
JP3998993B2 JP3998993B2 (en) 2007-10-31

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Families Citing this family (19)

* Cited by examiner, † Cited by third party
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WO2004055887A2 (en) * 2002-12-18 2004-07-01 Koninklijke Philips Electronics N.V. Manipulation of micrometer-sized electronic objects with liquid droplets
JP2005097345A (en) * 2003-09-22 2005-04-14 Konica Minolta Medical & Graphic Inc Inkjet ink and ic base made by using the same and having noncontact communication function
JP2005157661A (en) * 2003-11-25 2005-06-16 Brother Ind Ltd Radio tag preparing device and cartridge
JP4593195B2 (en) * 2004-01-30 2010-12-08 トッパン・フォームズ株式会社 Thread manufacturing method and IC chip-containing sheet manufacturing method
JP4588381B2 (en) * 2004-06-18 2010-12-01 トッパン・フォームズ株式会社 Sheet base material and manufacturing method thereof
JP2006031336A (en) 2004-07-15 2006-02-02 Fujitsu Ltd Method for manufacturing rfid tag
JP4750492B2 (en) * 2005-07-20 2011-08-17 富士通株式会社 IC chip mounting method
JP4616719B2 (en) 2005-07-20 2011-01-19 富士通株式会社 IC chip mounting method
JP4484834B2 (en) * 2006-03-13 2010-06-16 トッパン・フォームズ株式会社 Adhesive tape printer
JP2008135446A (en) 2006-11-27 2008-06-12 Philtech Inc Method of producing rf powder
JP2008134695A (en) 2006-11-27 2008-06-12 Philtech Inc Base data management system
JP2008134694A (en) 2006-11-27 2008-06-12 Philtech Inc Rf powder adding method and rf powder added base sheet
JP2008134815A (en) 2006-11-28 2008-06-12 Philtech Inc Rf powder providing method, and liquid containing rf powder
JP2008135951A (en) 2006-11-28 2008-06-12 Philtech Inc Rf powder particle, rf powder, and substrate containing rf powder
JP2008134816A (en) 2006-11-28 2008-06-12 Philtech Inc Rf powder particle, rf powder, and rf powder exciting method
US8237622B2 (en) 2006-12-28 2012-08-07 Philtech Inc. Base sheet
JP2008161837A (en) 2006-12-28 2008-07-17 Ricoh Co Ltd Conveyance system
TWI592079B (en) * 2012-04-27 2017-07-11 Ｄｓｍ智慧財產有限公司 Electrically conductive polyamide substrate
TWI539877B (en) * 2014-09-09 2016-06-21 Max Echo Technology Corp The process of screen printing antenna coil

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