JP2003223626A5 - - Google Patents

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JP2003223626A5
JP2003223626A5 JP2002024295A JP2002024295A JP2003223626A5 JP 2003223626 A5 JP2003223626 A5 JP 2003223626A5 JP 2002024295 A JP2002024295 A JP 2002024295A JP 2002024295 A JP2002024295 A JP 2002024295A JP 2003223626 A5 JP2003223626 A5 JP 2003223626A5
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chip
antenna pattern
rfid tag
manufacturing
recesses
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JP2003223626A (en
JP3908549B2 (en
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Publication of JP2003223626A5 publication Critical patent/JP2003223626A5/ja
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ＩＣチップとそれに接続したアンテナパターンからなるＲＦＩＤタグの製造方法であって、（ａ）基材の一方の面に、ＩＣチップを嵌合する複数の凹部をザグリ機で形成する工程、（ｂ）該それぞれの凹部内に各１個のＩＣチップを嵌合させる工程、
（ｃ）前記ＩＣチップが嵌合した基材を導電性インキを用いて印刷し、ＩＣチップ及び基材面にアンテナパターンを形成すると同時に、ＩＣチップとアンテナパターンとを電気的に接続する工程、を有することを特徴とするＲＦＩＤタグの製造方法。A method for manufacturing an RFID tag comprising an IC chip and an antenna pattern connected to the IC chip, wherein (a) a step of forming a plurality of recesses for fitting the IC chip on one surface of a substrate with a counterbore machine, (b) A step of fitting each one IC chip in each of the recesses;
(C) printing the base material fitted with the IC chip using a conductive ink to form an antenna pattern on the IC chip and the base material surface, and at the same time electrically connecting the IC chip and the antenna pattern; The manufacturing method of the RFID tag characterized by having. ＩＣチップとそれに接続したアンテナパターンからなるＲＦＩＤタグの製造方法であって、（ａ）基材の一方の面に、ＩＣチップを嵌合する複数の凹部をザグリ機で形成する工程、（ｂ）それぞれの凹部の底面に接着層を塗布する工程、（ｃ）該それぞれの凹部内に各１個のＩＣチップを嵌合させ、固定する工程、（ｄ）前記ＩＣチップが嵌合した基材を導電性インキを用いて印刷し、ＩＣチップ及び基材面にアンテナパターンを形成すると同時に、ＩＣチップとアンテナパターンとを電気的に接続する工程、を有することを特徴とするＲＦＩＤタグの製造方法。  A method for manufacturing an RFID tag comprising an IC chip and an antenna pattern connected to the IC chip, wherein (a) a step of forming a plurality of recesses for fitting the IC chip on one surface of a substrate with a counterbore machine; (b) A step of applying an adhesive layer to the bottom surface of each recess, (c) a step of fitting and fixing one IC chip in each of the recesses, and (d) a base material on which the IC chip is fitted. A method of manufacturing an RFID tag, comprising: printing using a conductive ink to form an antenna pattern on an IC chip and a substrate surface, and at the same time electrically connecting the IC chip and the antenna pattern. ＩＣチップとそれに接続したアンテナパターンからなるＲＦＩＤタグの製造方法であって、（ａ）基材の一方の面に、ＩＣチップを嵌合する複数の凹部を加圧塑性加工法で形成する工程、（ｂ）該それぞれの凹部内に各１個のＩＣチップを嵌合させる工程、（ｃ）前記ＩＣチップが嵌合した基材を導電性インキを用いて印刷し、ＩＣチップ及び基材面にアンテナパターンを形成すると同時に、ＩＣチップとアンテナパターンとを電気的に接続する工程、を有することを特徴とするＲＦＩＤタグの製造方法。  A method for producing an RFID tag comprising an IC chip and an antenna pattern connected to the IC chip, wherein (a) a step of forming a plurality of recesses for fitting the IC chip on one surface of the substrate by a pressure plastic working method; (B) a step of fitting one IC chip into each of the recesses, (c) printing the base material on which the IC chip is fitted using conductive ink, A method of manufacturing an RFID tag, comprising: forming an antenna pattern and simultaneously connecting the IC chip and the antenna pattern. ＩＣチップとそれに接続したアンテナパターンからなるＲＦＩＤタグの製造方法であって、（ａ）基材の一方の面に接着層を塗布する工程、（ｂ）前記接着層を塗布した基材面に、ＩＣチップを嵌合する複数の凹部を加圧塑性加工法で形成する工程、
（ｃ）該それぞれの凹部内に各１個のＩＣチップを嵌合させ、固定する工程、（ｄ）前記ＩＣチップが嵌合した基材を導電性インキを用いて印刷し、ＩＣチップ及び基材面にアンテナパターンを形成すると同時に、ＩＣチップとアンテナパターンとを電気的に接続する工程、を有することを特徴とするＲＦＩＤタグの製造方法。An RFID tag manufacturing method comprising an IC chip and an antenna pattern connected to the IC chip, wherein (a) a step of applying an adhesive layer to one surface of the substrate, (b) a substrate surface coated with the adhesive layer, Forming a plurality of recesses for fitting the IC chip by a pressure plastic working method;
(C) a step of fitting and fixing one IC chip in each of the recesses, and (d) printing the substrate on which the IC chip is fitted using conductive ink, A method for manufacturing an RFID tag, comprising: forming an antenna pattern on a material surface, and simultaneously connecting an IC chip and an antenna pattern. 印刷がスクリーン印刷であることを特徴とする請求項１乃至請求項４のいずれか１の請求項に記載のＲＦＩＤタグの製造方法。  The RFID tag manufacturing method according to claim 1, wherein the printing is screen printing. 導電性インキが銀ペーストであることを特徴とする請求項１乃至請求項４のいずれか１の請求項に記載のＲＦＩＤタグの製造方法。  The method for manufacturing an RFID tag according to any one of claims 1 to 4, wherein the conductive ink is a silver paste. 導電性インキにＴＣＮＱ錯体を含むことを特徴とする請求項１乃至請求項４のいずれか１の請求項に記載のＲＦＩＤタグの製造方法。  The RFID tag manufacturing method according to any one of claims 1 to 4, wherein the conductive ink contains a TCNQ complex.
JP2002024295A 2002-01-31 2002-01-31 RFID tag manufacturing method Expired - Fee Related JP3908549B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (en) 2002-01-31 2002-01-31 RFID tag manufacturing method

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Application Number Priority Date Filing Date Title
JP2002024295A JP3908549B2 (en) 2002-01-31 2002-01-31 RFID tag manufacturing method

Publications (3)

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JP2003223626A JP2003223626A (en) 2003-08-08
JP2003223626A5 true JP2003223626A5 (en) 2005-08-11
JP3908549B2 JP3908549B2 (en) 2007-04-25

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JP2002024295A Expired - Fee Related JP3908549B2 (en) 2002-01-31 2002-01-31 RFID tag manufacturing method

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Families Citing this family (26)

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Publication number Priority date Publication date Assignee Title
US6867983B2 (en) 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
WO2004055887A2 (en) * 2002-12-18 2004-07-01 Koninklijke Philips Electronics N.V. Manipulation of micrometer-sized electronic objects with liquid droplets
US6940408B2 (en) 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7224280B2 (en) 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US20040200061A1 (en) 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
JP4504694B2 (en) * 2004-01-30 2010-07-14 トッパン・フォームズ株式会社 Thread manufacturing method, IC chip-containing sheet manufacturing method, and thread and IC chip-containing sheet manufactured thereby
JP2006031336A (en) 2004-07-15 2006-02-02 Fujitsu Ltd Method for manufacturing rfid tag
JP4653440B2 (en) * 2004-08-13 2011-03-16 富士通株式会社 RFID tag and manufacturing method thereof
US7202790B2 (en) * 2004-08-13 2007-04-10 Sensormatic Electronics Corporation Techniques for tuning an antenna to different operating frequencies
JP4845461B2 (en) * 2004-09-14 2011-12-28 株式会社半導体エネルギー研究所 Semiconductor device and manufacturing method thereof
US8698262B2 (en) 2004-09-14 2014-04-15 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and manufacturing method of the same
JP5057767B2 (en) * 2006-01-10 2012-10-24 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US20070158804A1 (en) 2006-01-10 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and RFID tag
JP2007274379A (en) * 2006-03-31 2007-10-18 Sumitomo Chemical Co Ltd Wireless tag and manufacturing method therefor
JP2008041005A (en) * 2006-08-10 2008-02-21 Hitachi Ltd Rfid tag and manufacturing method of the same
EP2100907B1 (en) 2006-12-26 2013-02-20 Asahi Kasei E-materials Corporation Resin composition for printing plate
TWI423519B (en) 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
JP5466381B2 (en) * 2008-07-23 2014-04-09 株式会社沖データ Medium conveying apparatus, printing medium, image forming apparatus, and image forming method
JP5114357B2 (en) * 2008-10-09 2013-01-09 株式会社日立製作所 Wireless IC tag
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JP2014157180A (en) * 2013-02-14 2014-08-28 Ricoh Co Ltd Rfid adhesive thermosensitive label
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