JP2003236937A - Method for manufacturing rf-id media - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate a step on the surface of an IR-ID media even when the size of an inlet of an individual piece shape is smaller than that of a layer for constituting the RF-ID media by allowing the deviation of the inlet from the layer to be suppressed when the inlet is adhered to the layer by using a thermal activation type adhesive. <P>SOLUTION: A method for manufacturing the RF-ID media comprises the steps of sandwiching the inlet 10 of the individual piece shape to be sandwiched between surface sheets 130a and 130b via adhesive sheets 120a, 120b between the sheets 130a and 130b via the sheets 120a, 120b in a state in which an opening to be assembled with the inlet 10 is assembled in the opening of a frame sheet 140 formed with the opening, and fusing the sheets 120a, 120b in this state. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an RF-ID medium such as a non-contact type IC card capable of writing and reading information in a non-contact state.

[0002]

2. Description of the Related Art In recent years, with the development of an information-oriented society, information is recorded on a card, and information management and payment using the card are performed.

In information management using such a card, a contactless IC card equipped with an IC capable of writing and reading information in a contactless state with respect to the card is excellent in convenience. Due to sex, it is rapidly spreading.

In a non-contact type IC card capable of writing and reading information in a non-contact state, an electromagnetic coupling system utilizing mutual induction of coils by an alternating magnetic field and an induced power by dielectric flux of two coils are used. Communication by using a capacitor principle between the card side and the external information writing / reading side antenna, and the electromagnetic induction method using There is an electrostatic coupling method for performing the above, or an optical method using near-infrared light blinking at high speed to modulate energy of light.

8A and 8B are views showing an example of the structure of a conventional non-contact type IC card of the electromagnetic induction system. FIG. 8A is a view showing the internal structure and FIG. 8B is a sectional view.

In this conventional example, as shown in FIG. 8, an IC module 5 capable of writing and reading information from the outside is provided.
11 is mounted and connected to the IC module 511 via a contact 513, and supplies current to the IC module 511 by electromagnetic induction from an external information writing / reading device (not shown), A conductive antenna 512 for writing and reading information to and from 511 in a non-contact state is bonded to an inlet 510 formed in a coil shape so as to be sandwiched between surface layers 530a and 530b by adhesive layers 520a and 520b. It is configured.

In the non-contact type IC card 501 constructed as described above, when it approaches an information writing / reading device provided outside, a current is applied to the antenna 512 by electromagnetic induction from the information writing / reading device. Flow, this current is contact 5
13 to the IC module 511 so that the information writing / reading device I
Information is written in the C module 511, or the information written in the IC module 511 is read by the information writing / reading device.

As described above, the inlet 510 is formed by the adhesive layers 520a and 520b on the surface layers 530a and 530.
Non-contact type IC configured by being bonded so as to be sandwiched by b
In the method of manufacturing the card 501, in order to improve the production efficiency in the manufacturing process, first, an inlet sheet including a plurality of inlets 510 has a shape similar to that of the inlet sheet to form the surface layers 530a and 530b. The two surface sheets have the same shape as that of the inlet sheet and are superposed with two adhesive sheets constituting the adhesive layers 520a and 520b interposed therebetween, and then the superposed inlet sheet, adhesive sheet and surface sheet are sandwiched. The adhesive sheet is melted by applying heat to the surface sheet while applying pressure, whereby the inlet sheet is bonded so as to be sandwiched between the surface sheets by the adhesive sheet. After that, the inlet sheet and the surface sheet, which are adhered to each other by the adhesive sheet, are cut into the inlets 510 to complete the non-contact type IC card 501.

FIG. 9 is a diagram showing a structure of an inlet sheet including a plurality of inlets 510 shown in FIG.

The non-contact type IC card 501 as described above
As shown in FIG. 9, the inlet sheet used in the manufacturing method of FIG. 9 is configured by arranging a plurality of inlets 510 constituting the non-contact type IC card 501 shown in FIG. 8 and being superposed on the inlet sheet. The adhesive sheet and the surface sheet have a size enough to cover all of the inlets 510 included in the inlet sheet.

Using the inlet sheet, the adhesive sheet, and the surface sheet as described above, the inlet 510 and the surface layers 530a and 530b are laminated to form a plurality of non-contact type ICs.
The card 501 is performed at the same time, and then the stacked sheets are cut into each of the inlets 510, whereby the non-contact type IC card 501 is manufactured, thereby improving the production efficiency in the manufacturing process.

Here, depending on the supply form of the inlet 510, a plurality of inlets 510 as shown in FIG. 9 are used.
It is not possible to use the inlet sheet in which
The contactless IC card 501 may be manufactured by arranging the individual inlets 510.

FIG. 10 is a flow chart for explaining an example of a method of manufacturing the non-contact type IC card shown in FIG. 8, and FIG. 11 is an example of a method of manufacturing the non-contact type IC card shown in FIG. It is a schematic diagram for explaining.

First, the surface sheet 630b forming the surface layer 530b and the adhesive sheet 6 forming the adhesive layer 520b.
20b, and the plurality of individual inlets 510 are arranged in a predetermined array on the adhesive sheet 620b laminated on the surface sheet 630b, and the adhesive layer 520a is further formed thereon. Adhesive sheet 6
20a and a surface sheet 630 forming the surface layer 530a.
a is superimposed (step S101) (FIG. 11).
(A)).

FIG. 12 shows the adhesive sheet 63 shown in FIG.
It is a figure showing the state where a plurality of inlets 510 are arranged on 0b.

As shown in FIG. 12, an adhesive sheet 630b
A plurality of individual-piece-shaped inlets 510 are arranged on the upper side in a predetermined arrangement, and the inlets 510 are arranged apart from each other by a predetermined distance.

Next, heat is applied at a predetermined temperature while pressurizing so as to sandwich the surface sheets 630a and 630b and the adhesive sheets 620a and 620b that are superposed so as to sandwich the plurality of inlets 510 (step S102). Here, the adhesive sheet 6 forming the adhesive layers 520a and 520b
Since 20a and 620b are made of a heat-activatable adhesive like a hot melt adhesive, they melt when a predetermined heat is applied.

Next, while maintaining the pressurized state, the top sheets 6 are superposed so as to sandwich the plurality of inlets 510.
30a, 630b and the adhesive sheets 620a, 620b are cooled (step S103), and the adhesive sheet 62 is melted.
0a, 620b are cured, thereby allowing the inlet 5
10 and the top sheets 630a and 630b are bonded (FIG. 11B).

After that, the surface sheet 630 bonded to the inlet 510 by the adhesive sheets 620a and 620b.
A and 630b are cut for each inlet 510 to complete the non-contact type IC card 501 (step S104).
(FIG.11 (c)). The adhesive sheets 620a and 620
surface sheet 6 adhered to inlet 510 by b
The cutting of each of the inlets 510 of the 30a and 630b is performed according to the information printed on the surface sheets 630a and 630b, but the size thereof is larger than that of the individual inlet 510.

[0020]

However, in the case of manufacturing a non-contact type IC card by using the inlet in the individual state like the above-mentioned manufacturing method of the non-contact type IC card, the inlet and the surface are In the bonding process with the sheet, the individual inlet moves due to the heat shrinkage of the surface sheet or the adhesive sheet and the flow of the adhesive sheet when the adhesive sheet melts under pressure, causing a large deviation from the prescribed placement position. There is a risk of being lost.

Here, when the inlet is displaced from the predetermined position, the position of the inlet is displaced with respect to the surface layer constituting the non-contact type IC card, but the surface layer is printed on the surface sheet. Contactless IC according to information
Since each card is cut, if the position of the inlet deviates from the surface layer, the inlet may be cut.

Since the size of the surface layer to be cut is larger than the size of the inlet, the manufactured non-contact type I
In the C card, the thickness of the portion including the inlet becomes thicker than the thickness of the portion not including the inlet, which causes a problem that a step is generated between the two.

The present invention has been made in view of the problems of the above-mentioned conventional technique, and the individual inlet is used as a layer constituting an RF-ID medium such as a non-contact type IC card. When the heat-activatable adhesive is used for adhesion, the gap between the inlet and the layer can be suppressed, and even if the size of the inlet is smaller than the size of the layer, the surface of the RF-ID medium is It is an object of the present invention to provide a method for manufacturing an RF-ID medium that does not cause a step in the inside.

[0024]

In order to achieve the above object, the present invention provides an IC capable of writing and reading information.
The base member is mounted with the module and is connected to the IC module, and the base member is sandwiched between the base member and the base member on which an antenna for writing and reading information to and from the IC module is formed in a non-contact state. An RF-ID medium formed by adhering a surface layer formed by an adhesive layer made of a heat-activatable adhesive to each of a plurality of base substrates each having an individual shape, Two surfaces that have a size enough to cover the material and have a size that covers the plurality of base materials via the two adhesive sheets that form the adhesive layer, and that form the surface layer. RF-I manufactured by sandwiching between sheets
A method of manufacturing a D medium, the frame material sheet having a size large enough to include the plurality of base materials and having a plurality of openings into which the plurality of base materials are respectively incorporated. A step of superposing so that the inlet is incorporated into the opening so as to be sandwiched by the two surface sheets via the two adhesive sheets;
A step of melting and cooling the adhesive sheet while applying pressure so as to sandwich the base substrate, the frame sheet, the adhesive sheet and the surface sheet, and the frame sheet, the adhesive sheet and the surface sheet, And a step of cutting each base material.

Further, the frame material sheet is characterized in that a notch is formed so as to surround the opening so as to penetrate from the front surface to the back surface of the frame material sheet.

The frame material sheet is white in color.

(Operation) In the present invention configured as described above, the individual base material sandwiched between the surface sheets via the adhesive sheet is formed with the opening for incorporating the base material. The frame material sheet is assembled in the opening of the frame material sheet and sandwiched between the surface sheets via the adhesive sheet, and the adhesive sheet is melted in this state. Since it is fixed, the base substrate does not move significantly due to heat shrinkage of the surface sheet or the adhesive sheet or melting of the adhesive sheet in the step of adhering the surface sheet and the base substrate, and the manufactured RF -In the ID medium, the thickness of the portion containing the base material is almost equal to the thickness of the portion not containing the base material, and there is a step between the two. Ukoto is eliminated.

In addition, when the frame material sheet is formed with a notch penetrating from the front surface to the back surface of the frame material sheet so as to surround the opening, the melted adhesive sheet is used as the notch formed in the frame material sheet. Since the base material moves due to the flow of the melted adhesive sheet or the melted adhesive sheet is unevenly cured in one place, unevenness is generated on the surface of the RF-ID medium. It is possible to prevent the person from getting stuck. In addition, the so-called "pock" due to the escape of air generated in the melted adhesive sheet is induced in the cut, whereby
It is possible to avoid the occurrence of surface defects on the RF-ID medium.

Further, if the frame material sheet is white, it is possible to ensure the barrier property and the cross-sectional appearance of the RF-ID medium does not have a striped pattern.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing an embodiment of the structure of a non-contact type IC card by an electromagnetic induction method manufactured by the method for manufacturing an RF-ID medium according to the present invention.
(A) is a figure which shows an internal structure, (b) is sectional drawing.

In this embodiment, as shown in FIG. 1, an IC module 11 capable of writing and reading information from the outside is provided.
Is mounted and connected to the IC module 11 via the contact 13, and the IC module 11 is connected by electromagnetic induction from an external information writing / reading device (not shown).
To the IC module 11 to write and read information to and from the IC module 11 in a non-contact state. Adhesive layer 20
The surface layers 30a and 30b are bonded to each other by being sandwiched between a and 20b. Also, the inlet 10
A frame member 40 having the same outer shape as that of the surface layers 30a and 30b and having an opening portion into which the inlet 10 is incorporated is provided around the periphery of the adhesive layer 20a, in a state where the inlet 10 is incorporated into the opening portion. It is adhered to the surface layers 30a and 30b by 20b.

The thickness of the frame member 40 is equal to the thickness of the inlet 10 or is equal to the inlet 10.
Inlet 10 having a thickness of 50 to 100 μm
Is preferably 10 to 30 μm thinner than the thickness of
The size of the opening formed in the frame member 40 is 0.2 to 1.0 mm larger than the size of the inlet 10.
It is preferable to increase the degree. Further, with respect to the color of the frame member 40, white is preferable in consideration of the shielding property and the cross-sectional appearance, and since it is effective that the material has a low heat shrinkage rate, PET, PEN, PI or the like can be mentioned. Further, it is preferable that easy adhesion treatment or the like is performed in order to increase the adhesive force with the adhesive layers 20a and 20b.

The material of the inlet 10 is P
Examples of the surface layer 30 include ET, PEN, and PI.
The materials of a and 30b are PVC, PET-G, and AB.
Examples include S, PBT, PC, and PET.

In the non-contact type IC card 1 configured as described above, when it approaches an information writing / reading device provided outside, a current is applied to the antenna 12 by electromagnetic induction from the information writing / reading device. This current flows and is supplied to the IC module 11 via the contact 13, whereby information is written to the IC module 11 from the information writing / reading device or information written to the IC module 11 in the non-contact state. May be read by the information writing / reading device.

(First Embodiment) FIG. 2 is a flow chart for explaining the first embodiment of the method for manufacturing the non-contact type IC card 1 shown in FIG. 1, and FIG. 1
FIG. 6 is a schematic diagram for explaining the first embodiment of the method for manufacturing the non-contact type IC card 1 shown in FIG.

First, the surface sheet 130b forming the surface layer 30b and the adhesive sheet 120 forming the adhesive layer 20b.
b, and the frame material sheet 140 constituting the frame material 40 is superposed on the adhesive sheet 120b superposed on the surface sheet 130b.

FIG. 4 is a diagram showing the structure of the frame material sheet 140 shown in FIG.

As shown in FIG. 4, the frame sheet 140 in this embodiment is formed with a plurality of openings 141 into which the inlet 10 is incorporated, and the adhesive sheet 12 is formed.
0a, after the frame material sheet 140 is superposed, the adhesive sheet 1 is formed so that the inlet 10 is incorporated into the opening 141.
It is mounted on 20b and part of the inlet 10 is heated to temporarily bond the inlet 10 and the adhesive sheet 120b. As a result, positioning of the inlet 10 on the adhesive sheet 120b can be easily performed.

Thereafter, the adhesive sheet 12 constituting the adhesive layer 20a is formed on the frame material sheet 140 and the inlet 10.
0a and the surface sheet 130a constituting the surface layer 30a are overlapped, whereby the inlet 10 and the frame material sheet 140 are sandwiched by the surface sheets 130a and 130b via the adhesive sheets 120a and 120b (step S1) (FIG. 3 (a)).

Here, in the adhesive sheets 120a and 120b and the surface sheets 130a and 130b, at least a plurality of openings 141 formed in the frame material sheet 140.
It has a size enough to cover all.

Next, the topsheet 130 is laminated so as to sandwich the plurality of inlets 10 and the frame sheet 140.
Heat of a predetermined temperature is applied while applying pressure so as to sandwich the adhesive sheets a, 130b and the adhesive sheets 120a, 120b (step S2). Here, since the adhesive sheets 120a and 120b forming the adhesive layers 20a and 20b are made of a heat-activatable adhesive like a hot-melt adhesive, they are melted when a predetermined heat is applied. The degree of pressurization at this time is 1 to 150 k.
g / cm ² is required, and the degree of heating is 120
~ 200 ° C is required. At this time, the inlet 1
0 has its position fixed so as to be incorporated in the opening 141 formed in the frame material sheet 140, so that the surface sheets 130a, 130b and the adhesive sheets 120a, 1
It does not move significantly due to heat shrinkage of 20b and melting of the adhesive sheets 120a and 120b.

Next, the surface sheets 130a and 130b and the adhesive sheet 1 which are superposed so as to sandwich the plurality of inlets 10 and the frame material sheet 140 while maintaining the pressurized state.
20a and 120b are cooled (step S3), and the melted adhesive sheets 120a and 120b are hardened, whereby the inlet 10 and the frame material sheet 140 are adhered to the surface sheets 130a and 130b (FIG. 3B).

After that, the surface sheets 130a and 130b adhered to the inlet 10 and the frame material sheet 140 by the adhesive sheets 120a and 120b are cut into the size of the non-contact type IC card 1 for each inlet 10, and the non-contact type I
Complete C card 1 (step S4) (FIG. 3)
(C)). The cutting of each of the surface sheets 130a, 130b adhered to the inlet 10 and the frame material sheet 140 by the adhesive sheets 120a, 120b is performed according to the information printed on the surface sheets 130a, 130b, and the size thereof is the inlet. However, in the present embodiment, an opening 141 in which the inlet 10 is incorporated between the adhesive sheet 120a and the adhesive sheet 120b in which the inlet 10 is sandwiched.
Since the frame material sheet 140 in which the inlet 10 is formed is sandwiched in a state in which the inlet 10 is incorporated in the opening 141, a portion of the manufactured non-contact type IC card 1 including the inlet 10 Thickness and inlet 1
The thickness of the portion that does not include 0 becomes almost equal to each other, and no step is formed between the two.

(Second Embodiment) FIG. 5 is a flow chart for explaining a second embodiment of the method for manufacturing the non-contact type IC card 1 shown in FIG. 1, and FIG. 1
FIG. 7 is a schematic diagram for explaining a second embodiment of the method for manufacturing the non-contact type IC card 1 shown in FIG.

First, the surface sheet 130b constituting the surface layer 30b and the adhesive sheet 120 constituting the adhesive layer 20b.
b is superposed, and further, the frame material sheet 240 constituting the frame material 40 is superposed on the adhesive sheet 120b superposed on the surface sheet 130b.

FIG. 7 is a diagram showing the structure of the frame material sheet 240 shown in FIG.

As shown in FIG. 7, in the frame material sheet 240 in this embodiment, a plurality of openings 241 into which the inlet 10 is incorporated, and cuts 242 that penetrate the front and back sides around the openings 241 are formed. After stacking the frame material sheet 240 on the adhesive sheet 120a,
The inlet 10 is mounted on the adhesive sheet 120b so as to be incorporated in the opening 241, and a part of the inlet 10 is heated to temporarily bond the inlet 10 and the adhesive sheet 120b. Further, the notch 242 is formed in a region which is not included in the non-contact type IC card 1 when the frame material sheet 140 is cut into the shape of the non-contact type IC card 1 in the subsequent cutting step.

Then, the adhesive sheet 12 constituting the adhesive layer 20a is formed on the frame material sheet 240 and the inlet 10.
0a and the surface sheet 130a constituting the surface layer 30a are superposed, whereby the inlet 10 and the frame material sheet 240 are sandwiched by the surface sheets 130a and 130b via the adhesive sheets 120a and 120b (step S11) (FIG. 6 (a)).

Here, in the adhesive sheets 120a and 120b and the surface sheets 130a and 130b, at least a plurality of openings 241 formed in the frame material sheet 240.
It has a size enough to cover all.

Next, the surface sheet 130 laminated so as to sandwich the plurality of inlets 10 and the frame material sheet 240.
Heat of a predetermined temperature is applied while applying pressure so as to sandwich a and 130b and adhesive sheets 120a and 120b (step S12). Here, since the adhesive sheets 120a and 120b forming the adhesive layers 20a and 20b are made of a heat-activatable adhesive like a hot-melt adhesive, they are melted when a predetermined heat is applied. The degree of pressurization and heating at this time is the same as that described in the first embodiment. Also,
At this time, since the inlet 10 has its position fixed so as to be incorporated in the opening 241 formed in the frame material sheet 240, the surface sheet 130a is similar to that described in the first embodiment. , 130b and the adhesive sheets 120a, 120b, and the adhesive sheets 120a, 1
It does not move much with the melting of 20b. In addition, the melted adhesive sheets 120a and 120b are
It will flow into the notch 242 formed in the frame material sheet 240, whereby the molten adhesive sheet 120 is melted.
The inlet 10 moves along with the flow of the a, 120b, or the melted adhesive sheets 120a, 120b are unevenly cured in one place, and thus the surface layers 30a, 30b.
It is possible to prevent the surface of b from becoming uneven. Also, the melted adhesive sheets 120a, 1
A so-called "pock" due to the escape of air generated in 20b is induced in the cut 242, and thereby the surface failure of the non-contact type IC card 1 can be avoided. In addition, the area of the cut 242 is most preferably about 5 to 30% of the area of the inlet 10 in order to obtain the above-described effects.

Next, the surface sheets 130a and 130b and the adhesive sheet 1 which are superposed so as to sandwich the plurality of inlets 10 and the frame material sheet 240 while maintaining the pressurized state.
20a and 120b are cooled (step S13), and the melted adhesive sheets 120a and 120b are hardened, whereby the inlet 10 and the frame sheet 240 and the topsheets 130a and 130b are adhered (FIG. 6B).

Thereafter, the surface sheets 130a, 130b adhered to the inlet 10 and the frame material sheet 240 by the adhesive sheets 120a, 120b are cut into the size of the non-contact type IC card 1 for each of the inlets 10, and the non-contact type I
The C card 1 is completed (step S14) (FIG. 6).
(C)). The cutting of each of the surface sheets 130a and 130b adhered to the inlet 10 and the frame material sheet 240 by the adhesive sheets 120a and 120b is performed according to the information printed on the surface sheets 130a and 130b, and the size thereof is the inlet. However, in the present embodiment, an opening 241 that allows the inlet 10 to be incorporated between the adhesive sheet 120a and the adhesive sheet 120b in which the inlet 10 is sandwiched.
The frame material sheet 240 in which is formed is sandwiched in a state in which the inlet 10 is incorporated into the opening 241, so that in the manufactured non-contact type IC card 1, a portion including the inlet 10 is formed. Thickness and inlet 1
The thickness of the portion that does not include 0 becomes almost equal to each other, and no step is formed between the two.

In the above-described embodiment, the RF capable of writing and reading information in the non-contact state is used.
Although the non-contact type IC card has been described as an example of the ID medium, the present invention is not limited to the method for manufacturing the non-contact type IC card, and a non-contact type IC tag, a non-contact type IC label, etc.
Any inlet can be applied as long as it is formed by adhering the individual inlet to another layer with an adhesive layer made of a heat-activatable adhesive.

As the adhesive constituting the adhesive layers 20a and 20b, the heat-activatable adhesive which is melted by applying heat has been described as an example. However, the UV-curable adhesive or the thermosetting adhesive, The inlet 10, the frame member 40, and the surface layers 30a, 30 are formed by using hot melt or two-component curing type.
Bonding with b is also conceivable.

[0056]

As described above, in the present invention,
The individual base material that is sandwiched between the surface sheets via the adhesive sheet is incorporated into the opening of the frame material sheet in which the opening is formed so that the base material is incorporated. Since the adhesive sheet is sandwiched between the sheets and the adhesive sheet is melted in this state, the base material is fixed by the opening of the frame material sheet, and the individual base material forms the RF-ID medium. When the heat-activatable adhesive is used to adhere to the layer of (1), it is possible to suppress the deviation between the base material and other layers constituting the RF-ID medium, and the size of the base material is RF-.
Even if it is smaller than the size of the other layers forming the ID medium, a step is not generated on the surface of the RF-ID medium.

In the case where the frame material sheet is formed with a notch penetrating from the front surface to the back surface of the frame material sheet so as to surround the opening, the melted adhesive sheet flows into the notch formed in the frame material sheet. As a result, the base material moves along with the flow of the melted adhesive sheet, or the melted adhesive sheet is unevenly cured in one place, causing unevenness on the surface of the RF-ID medium. It is possible to prevent the accident. In addition, a so-called “pock” due to air escape remaining in the melted adhesive sheet can be induced in the cut, thereby avoiding the occurrence of surface defects on the RF-ID medium.

Further, if the frame material sheet is made white, it is possible to ensure the barrier property and to prevent the cross-sectional appearance of the RF-ID medium from becoming a striped pattern.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a structure of a non-contact type IC card by an electromagnetic induction method manufactured by a method of manufacturing an RF-ID medium according to the present invention, FIG. (B) is a sectional view.

FIG. 2 is a flowchart for explaining the first embodiment of the method for manufacturing the non-contact type IC card shown in FIG.

FIG. 3 is a schematic diagram for explaining the first embodiment of the method for manufacturing the non-contact type IC card shown in FIG.

FIG. 4 is a diagram showing a structure of the frame material sheet shown in FIG.

5 is a flow chart for explaining a second embodiment of the method for manufacturing the non-contact type IC card shown in FIG.

FIG. 6 is a schematic diagram for explaining the second embodiment of the method for manufacturing the non-contact type IC card shown in FIG.

7 is a diagram showing a structure of the frame material sheet shown in FIG.

8A and 8B are diagrams showing a structure example of a conventional non-contact type IC card by an electromagnetic induction system, FIG. 8A is a diagram showing an internal structure, and FIG. 8B is a sectional view.

9 is a diagram showing a configuration of an inlet sheet including a plurality of inlets shown in FIG.

10 is a flowchart for explaining an example of a method of manufacturing the non-contact type IC card shown in FIG.

11 is a schematic diagram for explaining an example of a method for manufacturing the non-contact type IC card shown in FIG.

12 is a diagram showing a state in which a plurality of inlets are arranged on the adhesive sheet shown in FIG.

[Explanation of symbols]

1 Non-contact type IC card 10 inlets 11 IC module 12 antennas 13 contacts 20a, 20b adhesive layer 30a, 30b surface layer 40 frame material 120a, 120b adhesive sheet 130a, 130b Top sheet 140,240 Frame sheet 141,241 openings 242 notch

─────────────────────────────────────────────────── ─── Continued Front Page (51) Int.Cl. ⁷ Identification Code FI Theme Coat (Reference) B29L 31:34 G06K 19/00 K F Term (Reference) 2C005 MA19 MA32 NA06 PA11 PA18 RA04 4F211 AA24 AA40 AG03 AH37 TA02 TA04 TC02 TC20 TD11 TH02 TH06 TJ30 TN07 TN43 TQ04 TW15 TW23 5B035 AA04 BA03 BA05 BB09 CA01 CA23

Claims (3)

[Claims] 1. An I capable of writing and reading information
The base module is mounted with the C module and is connected to the IC module, and the base material is sandwiched between a base material having an antenna for writing and reading information to and from the IC module in a non-contact state. The RF-ID medium formed by adhering the surface layer formed by the above-mentioned to each other through the adhesive layer made of a heat-activatable adhesive, 2 having a size sufficient to cover the base material and having a size sufficient to cover the plurality of base base materials via the two adhesive sheets forming the adhesive layer to form the surface layer 2
RF manufactured by sandwiching between two surface sheets
A method for manufacturing an ID medium, the frame material sheet having a size large enough to include the plurality of base materials and having a plurality of openings in which the plurality of base materials are incorporated. A step of superposing so that the inlet is incorporated in the opening so as to be sandwiched by the two surface sheets via the two adhesive sheets, the base substrate, the frame material sheet, the adhesive sheet, and It has a step of melting and cooling the adhesive sheet while applying pressure to sandwich the surface sheet, and a step of cutting the frame material sheet, the adhesive sheet and the surface sheet for each of the base materials. And a method for manufacturing an RF-ID medium. 2. The method for manufacturing an RF-ID medium according to claim 1, wherein the frame material sheet is formed with a notch penetrating from the front surface to the back surface of the frame material sheet so as to surround the opening. A method for manufacturing an RF-ID medium, characterized in that 3. The RF- according to claim 1 or 2.
In the method for manufacturing an ID medium, the frame material sheet is white in color.
ID media manufacturing method.