JP2003228697A - Non-contact communicating medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for connecting conductive terminals for obtaining much higher reliability than a conventional manner by securely, stably and easily connecting the conductive terminals, and for sharply reducing costs by improving yield. <P>SOLUTION: The antenna connecting terminal of an IC module and an antenna terminal for transmitting/receiving data are configured so as to be faced to each other, and both terminals are connected to each other by using a solder (layer) in this non-contact communicating medium. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for joining conductive terminals facing each other, and more particularly to a hybrid type (also referred to as a combination type) IC card or IC having both contact and non-contact reader / writer interface functions.
The present invention relates to a structure and method relating to joining of an antenna terminal of an IC module and a terminal terminal of a transmitting / receiving antenna coil in a card and sheet-shaped information communication medium represented by a tag.

[0002]

2. Description of the Related Art Conventionally, as one of the techniques of this type, for example, in a hybrid IC card, a technique using an anisotropic conductive film, that is, conductive fine particles of about 5 to 50 μm are thermosetting films. There was a method in which the upper and lower ends of the fine particles dispersed in each other were brought into contact with the facing conductive terminals by pressurizing and heating to obtain an electrical connection between the conductive terminals.

FIG. 7 is a plan view of a conventional IC card. FIG. 7 is a plan view of an IC card in which the antenna coil 2 is embedded in the card base material 1, a recess 3 for fitting the IC module 5 is formed by counterboring, and the antenna coil terminal terminal 4 is exposed. .

FIG. 8 is a sectional view of a conventional IC card. FIG. 11 is a cross-sectional view of a conventional hybrid IC card in which a basic structure is completed by fitting an IC module 5 in a recess 3 formed in a card base material by a face-down method. Here, a conductive adhesive 7 such as a silver paste or an anisotropic conductive film is used to bond the antenna coil termination terminal 4 and the antenna joint terminal 53 on the IC module 5 side.

[0005]

However, in the above method, there is a large variation in the particle size of the fine particles, and only a small portion of the fine particles dispersed in the film are in contact, and the fine particles themselves are small. The elasticity is also extremely small.
Therefore, reliability problems such as frequent contact problems due to repeated thermal expansion and contraction due to physical stress application or temperature change cannot be ignored.

[0006] As a second conventional technique, in a hybrid IC card, a technique using a conductive paste, that is, an uncured conductive paste is applied to one or both surfaces of the facing conductive terminals and applied. There has been a method of obtaining an electrical connection between both conductive terminals by leaving the material in a pressure state at room temperature or by heating and curing.

However, in this method, the precision of the coating amount of the conductive paste is strictly required, but the variation of the paste viscosity due to environmental conditions such as time, temperature and humidity is large, so that the precision of the coating amount is extremely guaranteed. As a result, there are problems such as poor contact due to insufficient coating amount and conversely short circuit between other terminals due to excess paste due to excessive coating amount or defective appearance due to leakage to the surface layer.

Further, the conductive paste, which is the bonding material used in the above-mentioned conventional method, does not have such a strong bonding strength after curing and adhesion, and the bonding layer (conductive paste) itself after curing has almost no flexibility. Since it does not have it, under the usage conditions of this IC card with continuous bending and contact,
The stress inside the card cannot be ignored, and it was extremely inadequate from the viewpoint of reliability of electrode bonding.

Therefore, the problem to be solved by the present invention is to overcome the various problems that the above-mentioned conventional methods have, and to reliably and stably bond the conductive terminals to each other. As a result, it is an object of the present invention to provide a method of joining conductive terminals, which has much higher reliability than conventional ones, and which enables a significant reduction in cost due to an improvement in yield.

A further problem to be solved by the present invention is to use the improved method for joining conductive terminals to each other,
An object of the present invention is to provide a contactless communication medium having an external terminal, which is inexpensive while maintaining high reliability.

[0011]

According to the present invention, when joining conductive terminals facing each other, by using solder, which is a material having extremely high joining reliability, for one or both of the conductive terminals, It is something to solve.

That is, according to the present invention, in a non-contact communication medium in which an antenna joint terminal of an IC module and an antenna terminal for data transmission / reception are formed so as to face each other, the joint between both terminals is performed by using a solder layer. It is a contact communication medium.

The present invention also provides a non-contact communication medium,
It is a non-contact communication medium in which a solder layer which has been hardened and dried in advance is formed on at least one of the terminals to bond the two terminals.

The present invention also provides a non-contact communication medium,
An antenna coil is a wire antenna embedded in a base material, and is a non-contact communication medium in which a terminal layer of the wire antenna is formed with a solder layer which is hardened and dried in advance.

The present invention also provides a non-contact communication medium,
This is a non-contact communication medium in which an antenna terminal portion is exposed in parallel with the base material surface, cream solder is applied to the base material surface, and then pre-cured by a soft laser.

Further, the present invention is a non-contact communication medium which is manufactured based on the above-mentioned contents, and which is composed of an IC module, an antenna coil and a base material of amorphous PET (polyethylene terephthalate).

Further, the present invention is a non-contact communication medium produced based on the above description of the non-contact communication medium, the constitution of which is composed of an IC module, an antenna coil, and a PVC (polyvinyl chloride) base material. is there.

Further, the present invention is the above non-contact communication medium, wherein the melting temperature of the solder material is 170 ° C. or lower.

Further, the present invention is a non-contact communication medium in which a solder material is a lead-free solder in which tin contains bismuth 56 to 58% and silver 0.5 to 1.5%.

Further, the present invention is a non-contact communication medium in which the solder material is lead-free solder containing tin and bismuth of 57 to 59%.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings when the present invention is applied to a hybrid type IC card which is a non-contact communication medium having an external terminal.

FIG. 1 is a sectional view of an IC card according to an embodiment of the present invention. In FIG. 1, a solder layer 8 is formed in a convex shape on a conductive terminal (antenna joint terminal 53 and antenna termination terminal 4), and then an IC module 5 is fitted and integrated in a card base material 1 to complete a basic structure. It is sectional drawing of the made IC card. In the figure, 6 is the base material 5 of the IC module 5.
2 (glass epoxy material, etc.) and card substrate 1 (PET-G
Or an adhesive or a thermosetting adhesive film for bonding with a PVC material or the like).

FIG. 2 is a sectional view of the vicinity of the recess of the IC card according to the embodiment of the present invention. FIG. 2 shows a state in the vicinity of the concave portion 3 and shows a state in which the terminal terminal 4 of the antenna coil (wire antenna) 2 embedded in the card base material 1 is exposed.

FIG. 3 is a sectional view showing a convex solder layer formed in the vicinity of the concave portion according to the embodiment of the present invention. FIG. 3 shows that a cream solder layer 81 is formed on the antenna coil termination terminal of FIG.
FIG. 4 is a diagram showing an example in which a cream solder layer 81 having a convex shape is formed so as to be quantitatively discharged by a dispenser or the like and to cover the entire antenna coil termination terminal folded back in multiple layers.

FIG. 4 is a sectional view of another example in which a convex solder layer is formed in the vicinity of the concave portion according to the embodiment of the present invention. FIG. 4 shows a cream solder 8 having a convex shape separated into individual terminals of the above-mentioned antenna coil terminal terminal folded in multiple layers.
It is a figure which shows another example which formed 2. This is preferable from the viewpoint of saving the amount of cream solder used.

FIG. 5 is a sectional view of the IC module of the IC card according to the embodiment of the present invention. FIG. 5 shows an IC module in which I is sealed with a mold resin.
The state where the cream solder layer 83 is formed in a convex shape by the same means on the module-side antenna joint terminal that is drawn out from the C chip onto the base substrate is shown.

It is also possible to use low melting point solder instead of cream solder in FIGS. 1 to 5. As a specific example in that case, SN43 / Bi14 / Pb43 (% by weight) has a melting temperature of 135.degree. , Sn42 / Bi58 at 139 ℃, S
n46 / Bi8 / Pb46 is 170 ° C. It suffices to quantitatively supply the molten solder having the above composition from the nozzle to form a convex shape at each joint.

FIG. 6 is a sectional view showing a state in which the base material of the IC card and the IC module according to the embodiment of the present invention have been completely joined. FIG. 6 shows the card substrate side shown in FIG. 4 and FIG.
This is a state in which the basic structure of the IC card according to the present invention is completed by aligning the IC module side and the IC module side, which are shown in FIG.

Here, the upper and lower convex solder layers 83 and 82
They fuse tightly together, resulting in a very reliable joint. As a matter of course, the same process is performed when the card base material side shown in FIG. 5 and the IC module side shown in FIG. 7 are joined. Further, the cream solder may be in a liquid state, a solid state after being pre-cured by a means such as soft laser irradiation, or an intermediate state during the heating and pressure bonding process. No problem.

Further, even if the solder is the above-mentioned low melting point solder, it is possible to form the joint between the conductive terminals at the same time during the heating and pressure bonding process because of the low melting temperature (170 ° C. or less). You can

[0031]

As described above, in the IC card to which the present invention is applied, since the convex solder layer having excellent joint reliability is disposed between the facing conductive terminals to form the terminal joint,
A highly reliable hybrid IC card can be obtained.

Therefore, according to the present invention, under various use conditions and environmental conditions, the contact trouble between the conductive terminals, which has been a problem in the past, can be greatly improved, and the high reliability and the high yield result. It is possible to provide a low-cost non-contact communication medium.

In the above-mentioned embodiment, only the hybrid IC card has been described. However, the present invention is not limited to this, and IC card, optical, magnetic, dielectric and a composite card of these types. It goes without saying that the electrode joining technique of the present invention can be applied to any information communication medium such as a sheet, a sheet, and a label.

Furthermore, the electrode joining technique of the present invention is not limited to only the information communication medium, and in any situation where a plurality of electrode terminals facing each other must be joined with high reliability. Can be applied.

[Brief description of drawings]

FIG. 1 is a sectional view of an IC card according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the vicinity of the recess of the IC card according to the embodiment of the present invention.

FIG. 3 is a sectional view of an example in which a convex solder layer is formed in the vicinity of the concave portion of the IC card according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view of another example in which a convex solder layer is formed in the vicinity of the concave portion of the IC card according to the embodiment of the present invention.

FIG. 5 is a sectional view of the IC module of the IC card according to the embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a state in which the base material of the IC card and the IC module according to the embodiment of the present invention are completely joined.

FIG. 7 is a plan view of a conventional IC card.

FIG. 8 is a sectional view of a conventional IC card.

[Explanation of symbols]

1 Card Base Material (PET-G, PVC, etc.) 2 Antenna Coil (Metal Wire Antenna) 3 Recess (for IC Module Fitting) 4 Antenna Coil Termination Terminal (Card Base Material Side) 5 IC Module 6 Adhesive (or Thermosetting Type) Adhesive film) 7 Conductive adhesive 8, 81, 82, 83 Solder layer (cream solder or low melting point solder) 51 IC module external terminal 52 IC module base substrate (glass epoxy material, etc.) 53 IC module antenna bonding Terminal

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C005 MA19 MA31 NA08 NA36 PA04                       RA04                 5B035 AA08 BA03 BA04 BA05 BB09                       CA01 CA03 CA08 CA23                 5J047 AA02 AA06 AA09 AA10 AA13                       AB11 EF04 EF05

Claims (9)

[Claims] 1. A non-contact communication medium in which an antenna joining terminal of an IC module and an antenna terminal for data transmission / reception face each other, wherein joining between both terminals is performed by using a solder layer. A non-contact communication medium having an external terminal. 2. The non-contact communication medium according to claim 1, wherein in the non-contact communication medium, a solder layer which has been hardened and dried in advance is formed on at least one terminal to bond the two terminals. . 3. The non-contact communication medium according to claim 1, wherein the antenna coil is a wire antenna embedded in a base material, and a terminal layer of the wire antenna is formed with a solder layer which is hardened and dried in advance. Item 1. The contactless communication medium according to Item 1. 4. In the non-contact communication medium, the antenna terminal terminal portion is exposed in parallel with the base material surface, cream solder is applied to the base material surface, and then pre-cured by soft laser. The non-contact communication medium according to claim 3. 5. The non-contact communication medium according to claim 1, wherein the non-contact communication medium has an IC module, an antenna coil, and a base material of amorphous PET. Medium. 6. The non-contact communication medium according to claim 1, wherein the non-contact communication medium comprises an IC module, an antenna coil, and a PVC (polyvinyl chloride) base material. Contact communication medium. 7. The non-contact communication medium according to claim 1, wherein in the non-contact communication medium, a melting temperature of a solder material is 170 ° C. or lower. 8. The non-contact communication medium according to claim 1, wherein the solder material is lead-free solder in which tin contains bismuth 56 to 58% and silver 0.5 to 1.5%.
8. The contactless communication medium according to any one of 1 to 7. 9. The non-contact communication medium according to claim 1, wherein in the non-contact communication medium, a solder material is lead-free solder containing tin and bismuth of 57 to 59%. Medium.